WO1997023953A1 - Dispositif haute-frequence - Google Patents
Dispositif haute-frequence Download PDFInfo
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- WO1997023953A1 WO1997023953A1 PCT/JP1995/002668 JP9502668W WO9723953A1 WO 1997023953 A1 WO1997023953 A1 WO 1997023953A1 JP 9502668 W JP9502668 W JP 9502668W WO 9723953 A1 WO9723953 A1 WO 9723953A1
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- frequency
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Classifications
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- H—ELECTRICITY
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- H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
- H03L7/00—Automatic control of frequency or phase; Synchronisation
- H03L7/06—Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop
- H03L7/08—Details of the phase-locked loop
- H03L7/0805—Details of the phase-locked loop the loop being adapted to provide an additional control signal for use outside the loop
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F21/00—Variable inductances or transformers of the signal type
- H01F21/02—Variable inductances or transformers of the signal type continuously variable, e.g. variometers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F21/00—Variable inductances or transformers of the signal type
- H01F21/02—Variable inductances or transformers of the signal type continuously variable, e.g. variometers
- H01F21/04—Variable inductances or transformers of the signal type continuously variable, e.g. variometers by relative movement of turns or parts of windings
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- H—ELECTRICITY
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- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
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- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/045—Trimming
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/18—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising distributed inductance and capacitance
- H03B5/1841—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising distributed inductance and capacitance the frequency-determining element being a strip line resonator
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- H03—ELECTRONIC CIRCUITRY
- H03J—TUNING RESONANT CIRCUITS; SELECTING RESONANT CIRCUITS
- H03J1/00—Details of adjusting, driving, indicating, or mechanical control arrangements for resonant circuits in general
- H03J1/0008—Details of adjusting, driving, indicating, or mechanical control arrangements for resonant circuits in general using a central processing unit, e.g. a microprocessor
- H03J1/0041—Details of adjusting, driving, indicating, or mechanical control arrangements for resonant circuits in general using a central processing unit, e.g. a microprocessor for frequency synthesis with counters or frequency dividers
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03J—TUNING RESONANT CIRCUITS; SELECTING RESONANT CIRCUITS
- H03J1/00—Details of adjusting, driving, indicating, or mechanical control arrangements for resonant circuits in general
- H03J1/0008—Details of adjusting, driving, indicating, or mechanical control arrangements for resonant circuits in general using a central processing unit, e.g. a microprocessor
- H03J1/0041—Details of adjusting, driving, indicating, or mechanical control arrangements for resonant circuits in general using a central processing unit, e.g. a microprocessor for frequency synthesis with counters or frequency dividers
- H03J1/005—Details of adjusting, driving, indicating, or mechanical control arrangements for resonant circuits in general using a central processing unit, e.g. a microprocessor for frequency synthesis with counters or frequency dividers in a loop
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- H03J1/00—Details of adjusting, driving, indicating, or mechanical control arrangements for resonant circuits in general
- H03J1/06—Driving or adjusting arrangements; combined with other driving or adjusting arrangements, e.g. of gain control
- H03J1/14—Special arrangements for fine and coarse tuning
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- H03J—TUNING RESONANT CIRCUITS; SELECTING RESONANT CIRCUITS
- H03J7/00—Automatic frequency control; Automatic scanning over a band of frequencies
- H03J7/02—Automatic frequency control
- H03J7/04—Automatic frequency control where the frequency control is accomplished by varying the electrical characteristics of a non-mechanically adjustable element or where the nature of the frequency controlling element is not significant
- H03J7/06—Automatic frequency control where the frequency control is accomplished by varying the electrical characteristics of a non-mechanically adjustable element or where the nature of the frequency controlling element is not significant using counters or frequency dividers
- H03J7/065—Automatic frequency control where the frequency control is accomplished by varying the electrical characteristics of a non-mechanically adjustable element or where the nature of the frequency controlling element is not significant using counters or frequency dividers the counter or frequency divider being used in a phase locked loop
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- H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
- H03L7/00—Automatic control of frequency or phase; Synchronisation
- H03L7/06—Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop
- H03L7/08—Details of the phase-locked loop
- H03L7/099—Details of the phase-locked loop concerning mainly the controlled oscillator of the loop
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- H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
- H03L7/00—Automatic control of frequency or phase; Synchronisation
- H03L7/06—Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop
- H03L7/16—Indirect frequency synthesis, i.e. generating a desired one of a number of predetermined frequencies using a frequency- or phase-locked loop
- H03L7/18—Indirect frequency synthesis, i.e. generating a desired one of a number of predetermined frequencies using a frequency- or phase-locked loop using a frequency divider or counter in the loop
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- H04L27/00—Modulated-carrier systems
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- H04L27/14—Demodulator circuits; Receiver circuits
- H04L27/144—Demodulator circuits; Receiver circuits with demodulation using spectral properties of the received signal, e.g. by using frequency selective- or frequency sensitive elements
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- H—ELECTRICITY
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- H04L27/22—Demodulator circuits; Receiver circuits
- H04L27/233—Demodulator circuits; Receiver circuits using non-coherent demodulation
Definitions
- the present invention relates to a high-frequency device that receives a digitally modulated high-frequency signal.
- the inductance of the tuning part of the voltage-controlled oscillator is only a strip line in order to improve the seismic resistance. Was composed.
- the inductance is made up of coil parts, for example, the coil parts will vibrate due to vibration, and this will cause the inductance to rise. Since the inductance value fluctuates and the tuning frequency shifts as a result, the inductance should be stripped to avoid this. It consisted only of.
- the present invention not only secures the stability of the oscillation frequency over a long period of time, including vibration resistance, but also makes it easy to perform tuning adjustment, while still allowing the local oscillator to change from the local oscillator to the mixer.
- the purpose is to be able to provide a clear output signal with low phase noise.
- the present invention provides an input terminal to which a digitally modulated high-frequency signal is input, and an input terminal to which the input terminal is input.
- a mixer is provided in which a signal is supplied to one input and an output signal of a local oscillator is supplied to the other input, and an output terminal to which an output signal of the mixer is supplied.
- the local oscillator includes a voltage-controlled oscillator, a frequency divider, a phase comparator, and a loop filter interposed in a control loop of the voltage-controlled oscillator.
- the oscillator has an oscillating unit and a tuning unit.
- the tuning unit has a frequency adjusting unit and a maintaining unit for maintaining the adjustment state of the frequency adjusting unit.
- the noise of the local oscillator is controlled by the voltage control.
- the high loop-band width is large enough to be independent of the noise of the control oscillator, and thus the vibration resistance starts. In addition to ensuring stable oscillation frequency over a long period of time, tuning can be easily performed, and a clear output signal with little phase noise from the local oscillator to the mixer can be obtained. Can help achieve its intended purpose of supplying
- the invention described in claim 1 of the present invention is characterized in that one of an input terminal to which a digitally modulated high frequency signal is input and a signal input to the input terminal are one.
- the local oscillator includes a power-controlled oscillator, a frequency divider, a phase comparator, and a loop filter interposed in a control loop of the voltage-controlled oscillator.
- the tuning unit includes a frequency adjusting unit and a maintenance unit that maintains the adjustment state of the frequency adjusting unit.
- the control loop has a sufficiently large high loop width such that the noise of the local oscillator is not affected by the noise of the voltage controlled oscillator. It is a high-frequency device with a width. Therefore, in the above configuration, the frequency adjustment unit is provided as the tuning unit of the voltage controlled oscillator, so that tuning can be easily performed, and this frequency adjustment is also possible. Since the adjustment state of the wave number adjusting section is maintained by the maintenance means, the vibration resistance and the like are sufficiently ensured. If the maintenance means is used to ensure the stability of the oscillation frequency over a long period of time, including vibration resistance, the dielectric constant is higher than that of air.
- a stray capacitance is formed from the stray capacitance, which causes the dielectric loss of the stray capacitance, thereby deteriorating the oscillation characteristics.
- the control loop of the voltage controlled oscillator Since the local loop noise has a large loop band width that is so large that the noise of the local oscillator does not depend on the noise of the voltage-controlled oscillator, it has a wide frequency range. The width can be corrected by the width, and as a result, the output signal output from the local oscillator to the mixer can be a clear signal with little phase maintenance. You can.
- the frequency adjusting section according to claim 1 is constituted by a conductive member movably provided on a substrate and used as a maintenance means. It is fixed by the fixed member used, and the conductive member that is set in a movable state is fixed by the fixed member, so the adjustment value is adjusted by vibration and aging. Will not change
- the invention described in claim 3 is the invention according to claim 1, wherein the inductance element constituting the tuning section is a pattern-inductance element. Use the power line, and close to this turn-inductance line. A movable conductor is implanted beside it, this movable conductor is moved and adjusted, and it is fixed with a fixing member used as a maintenance means. By partially patterning the rectification, the number of parts and the number of assembly steps can be rationalized, while the tuning part of the local oscillator can be adjusted with a movable conductor. Even if the values of the components that make up the voltage-controlled oscillator vary or the mounting positions vary, it is possible to receive all the input signals. it can .
- the movable conductor is substantially above the center of the width of the patterning inductance line, and It is installed almost in parallel with the pattern inductance line of, but the coupling range is small due to the low degree of coupling, making finer adjustment easier. Can be used.
- the invention described in claim 5 is the invention according to claim 3, wherein the movable conductor is implanted in the vicinity of the open end of the pattern-inching distance line.
- the degree of coupling changes greatly, a relatively large range of adjustment of the oscillation frequency can be obtained.
- the invention described in claim 6 is the invention according to claim 1, wherein an air core coil or a flat plate is used as an inductance element constituting the tuning section.
- a line was implanted, the air-core coil or the flat line was adjusted, and the line was fixed with the fixing member used as the maintenance means.
- an inductance element an air-core coil or Since a flat line is used, a large voltage-controlled oscillator with a relatively low frequency can be obtained because of the large inductance. it can .
- the invention described in claim 7 is the invention described in claim 1, wherein the invention is constituted by a conductor wound around the outer periphery of a core used as a maintenance means. Because the coil, which is a conductive member, is wound around the core, the coil is deformed even if an external force is applied to the coil. As a result, the inductance value does not change.
- the invention described in claim 8 is the invention according to claim 1, wherein the inductance element forming the tuning section is a tubular insulator.
- a conductor wound around the outer periphery of the insulator, a concave screw provided in the insulator, and a convex screw fitted to the concave screw are provided on the outer periphery. Since the movable core is rotated, the inductance value can be changed by rotating the movable core. It is easy to automate the adjustment. Also, since the conductor is wound around the insulator, even if an external force is applied, the conductor will not be deformed and the inductance value will not change. Absent . Furthermore, the movable core is also fixed to the insulator by the frictional force of the screw, and the adjusted position of the movable core does not change. The inductance value is maintained over the period.
- the invention set forth in claim 9 is the invention according to claim 1, wherein the inductance element constituting the tuning section is a pattern inductor.
- the fixed conductor and the movable conductor are connected in series, and this movable conductor is adjusted and fixed by the fixing member used as the maintenance means.
- Turn inductance track and straight line ij Since the inductance of the movable conductor is shared, the area occupied by the substrate can be reduced, and the size can be reduced.
- the invention set forth in claim 10 is the invention according to claim 1, wherein the pattern element is used as an inductance element constituting a tuning section.
- the trim line is used to adjust the trimming of the adjustment section provided on this pattern inductance line, and the trim line is adjusted.
- the trimming of the pattern inductance line is a two-dimensional adjustment, not a mold adjustment. It is easy to automate.
- the trimmed part is covered with a covering material to prevent chemical change due to water absorption, oxidation, etc., so that the adjusted value can be maintained for a long time. it can .
- the invention described in claim 11 is the invention according to claim 10, wherein a movable conductor is connected in series with the pattern inductance line, and the movable conductor is connected to the movable conductor. Is adjusted by the fixing member used as the maintenance means, and the trimming of the pattern-inductance line is adjusted. Since it has the movable conductor adjustment and the two frequency adjustment sections, it is possible to easily and accurately adjust the power.
- the invention described in claim 12 is the invention according to claim 1, wherein the local oscillator and the mixer are housed in a metal case, and the local oscillator is provided in the metal case.
- the pattern inductance line laid on the circuit board that forms part of the tuning part of the oscillator is installed near a metal case or partition plate. Therefore, a metal case or a partition plate with a stable electric potential is installed near the pattern inductance line. Since it is not affected by external signals, a stable oscillation frequency can be obtained.
- the invention set forth in claim 13 is the invention of claim 1, wherein the loop filter is a cano, and the financing is as follows. This capacitor uses a capacitor, and this finolem capacitor is added to the pressure film capacitor generated by vibration. The generated piezoelectric effect is small, stable performance against vibration can be obtained, and a high-performance voltage controlled oscillator can be obtained.
- the film capacitor is mounted on the front surface side of the substrate, and the lead wire is connected to the film capacitor. It is inserted into a through hole provided in the substrate, and a conductor pattern and a solder are provided on the back side of the substrate. The inside of the through hole serves as a non-electrode formation portion. Even if the solder wire is applied to the lead wire on the back side of the board, the lead wire is penetrated. Since no electrode is formed in the through hole, a non-heating distance greater than the substrate thickness is always obtained. Because of this non-heating distance, a molten solder film capacitor is used. It is difficult to reach the lead wire connection, and the film capacitor may be destroyed by the heat of fusion of the solder.
- the invention described in claim 15 of the present invention is characterized in that, in claim 13, the loop filter and the voltage-controlled oscillator are separated by a partition plate.
- the partition plate has an opening through which a conductor pattern that connects the loop filter and the voltage-controlled oscillator passes, and is provided near the opening.
- the film capacitor was mounted so as to cover this opening, and one electrode of the film capacitor was stable. Since it is at the earth potential, it will be shielded by the film capacitor when opening it, and the loop filter and voltage control Departure It is electrically separated from the vibrator.
- the invention set forth in claim 16 is the invention according to claim 1, wherein the transistor is constituted by approximately two-stage transistors. Therefore, with the two-stage transistor, an inexpensive and appropriate gain can be obtained, and the loop filter can have a wider band.
- the invention described in claim 17 is the invention according to claim 1, wherein the movable conductor constituting the tuning section, the varactor diode, and the pattern diode are provided.
- the pattern inductance line is connected to the oscillation unit side. Since a pattern inductance line with a fixed inductance is provided on the side of the unit, it is unstable due to harmonic mode. No adjustments are made and no significant coupling occurs. Also, since the parameter diode is provided between the movable conductor and the pattern inductance line, the parameter diode is Since the appropriate oscillation frequency range can be obtained by the antenna and the movable conductor, the tuning sensitivity value will not be increased more than necessary. Phase noise can be suppressed even if there is noise
- the invention set forth in claim 18 is the invention according to claim 1, wherein the tuned section and the pattern inductor are included in a tuning section.
- a small-capacity chip capacitor is mounted between the series connection with the power line and close to the pattern inductance line. By installing a small-capacity chip capacitor, the impedance of the track is increased. This is due to the fact that the length of the lead wire in the lacto-diode has substantially changed due to the soldering. .
- the high impedance of the chip capacitor reduces the effect. That is, the varactor diode is heavier than the chip capacitor, and the cell relay is attached to the reflow solder. The ment effect cannot be expected, the actual length including the lead line varies, and the impedance is not constant. On the other hand, since the tip capacitor is light in weight, the self-alignment effect works in soldering the reflex opening, and the mounting position of the tip capacitor is low. It will be constant. Therefore, the inductance value of the north inductance line is constant. Note that the inductance between the chip capacitor and the varactor diode is a force that may vary. Since the impedance is high depending on the power supply, the oscillation frequency of the voltage-controlled oscillator varies little.
- the invention set forth in claim 19 is the invention as set forth in claim 18 wherein the parameter and the inductance that constitute the tuning section are different from each other.
- a first small-capacitance chip capacitor is inserted between the capacitor and the second capacitor between the varactor diode and the oscillating unit. And the first capacitor and the second capacitor use a temperature compensation capacitor, and the first capacitor is used for the first capacitor and the second capacitor.
- a reference frequency divider to which a reference frequency signal is inputted is provided in claim 1, and the frequency divider of the reference frequency divider is provided.
- the frequency ratio can be varied, a reference frequency divider that can be varied at the input to which the reference frequency signal is input is provided. Because of this, the divider ratio of the control loop divider can be made smaller while maintaining a high loop band width, and the response speed can be increased. In addition, it is possible to obtain the intended tuning frequency range.
- the division ratio of the reference frequency divider is set such that the output frequency of the voltage-controlled oscillator increases as the output frequency of the voltage-controlled oscillator increases.
- the frequency division ratio of the reference frequency divider and the frequency division ratio of the frequency divider of the control loop are shared according to the output frequency of the voltage controlled oscillator. Control, the frequency division ratio of the frequency divider can be reduced without being influenced by the output frequency, and the response is improved.
- the invention described in claim 22 is different from the claim 1 in that the invention has a roll-off characteristic between the mixer and the output terminal.
- a plurality of intermediate frequency tuning filters having a bandwidth are arranged in parallel, and the intermediate frequency tuning filter is based on a transmission rate of a signal input from an input terminal.
- the frequency of the high frequency signal input from the input terminal differs depending on the difference in the bandwidth of the high frequency signal. Filters can be selectively switched, so that signals with different transmission rates can be optimally received and circuits before the mixer can be used. Can be shared.
- variable attenuator is provided between the input terminal and the mixer to control the variable attenuator in claim 1. Since the control terminal is provided, the amount of attenuation can be controlled by the signal from this control terminal, so that cross-modulation of the mixer does not occur. In this way, optimal control can be performed.
- An IZQ detector is connected to an output terminal via an intermediate frequency tuning surface wave filter, and a first output terminal from which an I signal of the I / Q detector is output, and the IZQ detector.
- a second output terminal for outputting a Q signal of the detector and a second oscillator for supplying an oscillation frequency signal to the I / Q detector are provided, and a resonance section of the second oscillator is provided.
- the substrate of the surface wave resonator and the substrate of the intermediate frequency-tuned surface acoustic wave filter to be constituted are made of the same material, and the first output terminal and the second A frequency error detector for the signal output from the output terminal is installed, and the data of the frequency divider is incremented based on the output of the error detector.
- the center of the intermediate frequency and the oscillation frequency of the second oscillator are made substantially the same. Since the substrate material used for the surface acoustic wave resonator of the second oscillator and the substrate material for the intermediate frequency-tuned surface acoustic wave fin are the same, the same material is used.
- the frequency error data is detected by the frequency error detector so that the center frequency of the intermediate frequency, which is the output from the mixer, becomes equal to the oscillation frequency of the second oscillator.
- the center frequency of the center frequency of the intermediate frequency and the center frequency of the intermediate frequency are tuned by controlling the center frequency of the intermediate frequency by controlling the become .
- the bandwidth of the 3 dB cut-off frequency of the intermediate frequency tuned surface wave filter is 0% of the bandwidth equal to the symbol rate of the received signal. Since it is within + 5%, by realizing this characteristic, it also has the function of restoring the characteristic emphasized on the transmitting side. It becomes. Therefore, it is not necessary to add a special filter that restores the characteristics emphasized on the transmitting side.
- the invention described in claim 26 is the invention according to claim 1, wherein an input filter is inserted between the input terminal and the mixer, and the local oscillator is A frequency at which an intermediate frequency is obtained whose intermediate frequency is greater than one half of the difference between the maximum frequency and the minimum frequency of the signal input to the input terminal.
- the input filter is a fixed filter that allows the frequencies from the minimum frequency to the maximum frequency to pass, and the local oscillator generates its own oscillation.
- the oscillator oscillates a frequency that provides an intermediate frequency that is greater than one-half the difference between the maximum frequency and the minimum frequency of the input signal. Therefore, the image interference frequency must be higher than the maximum reception frequency. The number and that Do not.
- the invention set forth in claim 27 is the receiving apparatus according to claim 26, wherein the output signal frequency of the mixer is set to approximately 612 MHz. Since the intermediate frequency is set for the empty channel frequency of the signal, it does not receive interference from the input terminal. Ma It is also possible to insert a trap of approximately 612 MHz following the input terminal.
- the invention described in claim 28 is the invention according to claim 1, wherein the IZQ extraction means connected to the output terminal and the I signal output of the IZQ extraction means are connected. Connecting a demodulator to the first output terminal, the second output terminal to which the Q signal output of the I / Q extraction means is connected, and the first and second output terminals.
- This demodulator was mounted outside the metal cover, and the integrated circuit part of the demodulator was not surrounded by the cover. Very good heat dissipation. Therefore, there is no malfunction such as runaway due to heat of the integrated circuit. Further, since sufficient heat dissipation is possible, the degree of integration of the integrated circuit can be increased, and the size of the integrated circuit can be reduced. As a result, the size of the high-frequency device can be reduced.
- An invention according to claim 29 is the invention according to claim 28, wherein a substrate having a demodulator constituted by an integrated circuit mounted on a surface thereof, and a demodulator lower surface being provided on the demodulator lower surface.
- the copper foil laid and the copper foil provided on the back side of the board are connected by a through hole, and the copper foil on the bottom face of the integrated circuit and the copper foil on the back face of the board are connected. Since the and are connected by a through-hole, the heat of the integrated circuit is transferred to the lower copper foil via the through-hole and dissipated.
- the invention according to claim 30 is the invention according to claim 28, wherein the demodulator constituted by the integrated circuit is provided below the integrated circuit on a substrate on which the demodulator is mounted.
- air is directly in contact with both the upper and lower surfaces, enabling efficient heat dissipation.
- the invention set forth in claim 31 is the invention according to claim 29, wherein a plurality of strip-shaped resists are not formed on the copper foil provided on the back surface of the substrate.
- a solder part is fused to this non-resist forming part in a convex shape, and the copper foil on the lower surface is convex by the solder. As a result, the contact area with the air is increased, and the heat dissipation is further improved.
- the invention described in claim 32 of the present invention is the invention according to claim 1, wherein an input filter is provided between the input terminal and the mixer, and an output terminal is provided.
- An intermediate frequency tuning filter connected to the filter, an IZQ extracting means to which the output of the intermediate frequency tuning filter is connected, and an I signal output of the I extracting means And a second output terminal to which the Q signal output of the IZQ extracting means is connected, and these are connected in the same shield case.
- external interference such as a digital aperture inside the high-frequency device is not possible. Will be shielded by the source.
- the invention described in claim 33 is characterized in that, in claim 32, at least a part between the mixer and the oscillator used for the IZQ extraction means is provided. Since one or more shield plates are arranged, it is possible to reduce the spurious due to the interference of the oscillator with the mixer.
- the invention described in claim 34 is claimed in claim 32.
- the mixer and the oscillator used for the IZQ extraction means are arranged on a diagonal line in the same shield case, and similarly, the mixer is used. It is possible to reduce the spurious due to the interference of the oscillator to the semiconductor device.
- the input terminal is provided on one longitudinal side surface of the substantially rectangular shield case according to claim 32.
- the input filter and the mixer are arranged following the input terminals of the first and second terminals, and the partition plate is sandwiched substantially in parallel with the input filter and the mixer.
- a local oscillator for supplying an oscillation frequency to the mixer is provided, and the input of the digital signal for channel selection is performed on the input terminal side of a shield case.
- the digital signal for channel selection does not adversely affect the other compartments because it is arranged and partitioned near the vertical side plate of the unit.
- the invention described in claim 36 is the invention according to claim 33, wherein the intermediate frequency tuning is performed between a local oscillator that supplies an oscillation frequency to the mixer and the IZQ extraction means. Because a compartment for mounting a filter is provided, the mixer and I / Q detectors are separated, so that good IQ detection without mutual interference can be achieved. .
- the invention described in claim 37 is the invention according to claim 35, wherein a control terminal of a local oscillator is provided near the first side plate of the shield case, and Since the output terminal of the extraction means is provided, each signal is arranged in the same direction on the board side, which is convenient for wiring.
- the invention described in claim 38 provides an input terminal to which a digitally modulated high frequency signal is input, and a signal input to the input terminal to one input.
- Local input and the other input A mixer to which an output signal of the oscillator is supplied; and an output terminal to which an output signal of the mixer is supplied.
- the local oscillator includes a voltage-controlled oscillator, and a voltage-controlled oscillator.
- the voltage-controlled oscillator includes a frequency divider, a phase comparator, and a loop filter interposed in the control loop of the present invention.
- the voltage-controlled oscillator has an oscillation unit and a tuning unit.
- the tuning unit has a frequency adjusting unit and a maintaining unit for maintaining the adjustment state of the frequency adjusting unit.
- the control loop is configured such that the noise of the local oscillator is controlled by the voltage control.
- the reference frequency signal supplied to the phase comparator has a sufficiently large high reverberation band width that is not influenced by the noise of the oscillator, and the reference frequency signal supplied to the phase comparator.
- the comparison signal supplied from the frequency divider to the comparator supplied from the frequency divider to the comparator.
- the high-frequency device has its signal level reduced at the same frequency except for its substantial center frequency portion. Therefore, according to the above configuration, since the frequency adjustment unit is provided as the tuning unit of the voltage controlled oscillator, the tuning adjustment can be easily performed, and the frequency adjustment is also possible. Since the adjustment state of the adjustment unit is maintained by the maintenance means, the vibration resistance is sufficiently ensured.
- the control loop of the voltage controlled oscillator is affected by the noise of the local oscillator depending on the noise of the voltage controlled oscillator.
- the reference frequency signal supplied to the phase comparator excludes its substantial center frequency portion. Since the comparison signal supplied from the frequency divider to the comparator has a small signal level at the same frequency, the comparison signal has a wide frequency range. It can be corrected by the wave number width, and the result As a result, the output signal output from the local oscillator to the mixer can be a clear signal having less phase noise.
- a mixer for supplying the output signal of the local oscillator to the other input while being supplied, and an output terminal for supplying the output signal of the mixer Includes a voltage-controlled oscillator, a frequency divider, a phase comparator, and a loop filter interposed in a control loop of the voltage-controlled oscillator, wherein the voltage-controlled oscillator includes: An oscillation section and a tuning section, the tuning section having a frequency adjustment section and a maintaining means for maintaining the state of adjustment of the frequency adjustment section; The noise of the local oscillator is equal to the voltage of the voltage-controlled oscillator.
- the high loop band width is sufficiently large so as not to be influenced by noise, and the center frequency of the reference frequency signal supplied to the phase comparator is also increased.
- the signal level near the wave number is compared with the frequency distribution characteristic of the signal level near the center frequency output from the local oscillator to the mixer. Except for the substantial center frequency portion of the characteristic, the signal level at the same offset frequency from the center frequency is higher than the higher loop band width.
- This is a high-frequency device whose signal level is lower than the signal level to be reduced. Therefore, according to the above configuration, since the frequency control section is provided as the tuning section of the voltage controlled oscillator, tuning can be easily performed, and the frequency control section can be used. Since the adjustment state of the adjustment section is maintained by the maintenance means, sufficient vibration resistance is ensured.
- the dielectric constant is larger than that of air.
- a stray capacitance is formed, thereby deteriorating the oscillation characteristics.
- the control loop of the voltage controlled oscillator and the noise of the local oscillator are controlled by the noise of the voltage controlled oscillator.
- the reference frequency signal supplied to the phase comparator is output from the local oscillator to the mixer, so that the reference frequency signal supplied to the phase comparator is large enough not to be affected by the size. In comparison with the frequency distribution characteristics of the signal level, the same offset frequency from the center frequency is excluded except for the substantial center frequency part of the frequency distribution characteristics.
- the signal level at the wave number is lower than the signal level to be reduced by the noise due to the high loop width, so that the reference frequency signal Noise reduction effect of local oscillator due to high loop band width
- the local oscillator MX 3 ⁇ 4 & can be realized economically, and the output signal to be output can be a clear one with little phase noise.
- FIG. 1 is a hook diagram of a high-frequency device according to Embodiment 1 of the present invention.
- FIG. 2 (a) is a perspective view of the local oscillator of the high-frequency device.
- Fig. 2 is a side view of the main part.
- FIG. 3 (a) is a perspective view of a local oscillator according to another example of the high-frequency device.
- Figure 3 is a side view of the relevant part.
- FIG. 4 is a block diagram of a high-frequency device according to Embodiment 2 of the present invention.
- FIG. 4 is a front view of the inductance according to the first example.
- FIG. 5 (b) is an assembled perspective view of an inductance according to a second example used for a tuning section of a local oscillator of the high-frequency device.
- FIG. 5 (c) is a perspective view of the third embodiment of the invention.
- FIG. 6 is a block diagram of a high-frequency device according to Embodiment 3 of the present invention.
- FIG. 7 (a) is a perspective view of the local oscillator of the high-frequency device.
- FIG. 7 (b) is a side view of the main part of the adjustment unit of the local oscillator.
- Fig. 7 (c) is a side view of the main part of the adjustment unit according to the second example.
- FIG. 8 (a) is a perspective view of a local oscillator according to Embodiment 4 of the present invention.
- FIG. 8 (b) is a side view of the main part of the adjustment unit of the local oscillator.
- FIG. 8 (c) is a perspective view of the main part of the adjustment unit of the local oscillator.
- Fig. 8 (d) is a perspective view of the main part of the adjustment unit according to the second example.
- FIG. 9 is a perspective view of a local oscillator according to Embodiment 5 of the present invention.
- FIG. 9 is a side view of the main part of the movable conductor of the local oscillator.
- Fig. 9 (c) is a plan view of the main part of the adjustment section formed on the pattern-inductance line of the local oscillator.
- FIG. 10 is a block diagram of a high-frequency device according to Embodiment 6 of the present invention.
- FIG. 11 illustrates the characteristics of the local oscillator of the high-frequency device.
- FIG. 6 is a first frequency characteristic diagram for the present invention.
- FIG. 12 is a second frequency characteristic diagram for explaining the characteristics of the local oscillator of the high-frequency device.
- FIG. 12 () is a third frequency characteristic diagram for explaining the characteristics of the local oscillator of the high-frequency device.
- FIG. 13 is a detailed block diagram of the high-frequency device.
- FIG. 14 (a) is a circuit diagram showing a first example of the voltage-controlled oscillator of the high-frequency device.
- FIG. 14 (b) is a circuit diagram showing a second example of the voltage-controlled oscillator of the high-frequency device.
- FIG. 15 is a circuit diagram of a loop filter of a local oscillator of the high-frequency device.
- FIG. 16 (a) is a plan view of a main part of the voltage controlled oscillator of the high frequency device.
- FIG. 16 (b) is a side view of a main part of the voltage-controlled oscillator of the high-frequency device.
- FIG. 17 is a block diagram of a high-frequency device according to Embodiment 7 of the present invention.
- FIG. 18 is a block diagram of a high-frequency device according to Embodiment 8 of the present invention.
- FIGS. 19) to (d) are waveform diagrams of the main parts of the high-frequency device.
- FIG. 20 is a block diagram of a high-frequency device according to Embodiment 9 of the present invention.
- FIG. 21 is a perspective view of a first example of a high-frequency device according to Embodiment 10 of the present invention.
- FIG. 22 is a perspective view of a second example of the same high-frequency device.
- FIG. 23 is a perspective view of a high-frequency device according to a third example.
- FIG. 24 (a) is a cross-sectional view of a main part of the demodulator of the high-frequency device.
- FIG. 24 (b) is a plan view of a main part of the demodulator viewed from the back surface of the substrate.
- FIG. 25 is a perspective view of the demodulator of the high-frequency device according to a second example.
- FIG. 26 is a partially fragmented side view of the same high-frequency device according to a fourth example.
- FIG. 27 is a block diagram of the high-frequency device according to Embodiment 11 of the present invention.
- a high-frequency device includes an input terminal 101 to which a high-frequency digital signal is input, and an input terminal connected to the input terminal 101.
- the circuit 102 and the output of the input circuit 102 are supplied to one input and the other input receives the output of the first oscillator 103 which is a local oscillator.
- the connected mixer 104, the finolator 105 to which the output of the mixer 104 is connected, and the output of the finolator 105 are connected.
- An I / Q detector 106 a first output terminal 107 from which the I signal of the I / Q detector 106 is output, and A second output terminal 108 for outputting a Q signal of the IZQ detector, a second oscillator 109 for supplying an oscillation frequency signal to the IZQ detector 106, An AFC control terminal 110 for controlling the oscillation frequency of the second oscillator 109, and a PLL unit (frequency divider and phase comparator) 1 to which the output of the first oscillator 103 is connected. 1 and a NOR filter connected between the PLL section 111 and the input of the first oscillator 103 (hereinafter referred to as a low-pass filter) 1 1 and 2.
- the first oscillator 103 outputs the output from the low-pass filter 112 to a strip line (pattern) laid on the substrate 115A.
- a strip line pattern
- the configuration is such that it is connected to the input of an amplifier 128 that forms an oscillation section via 115.
- the connection point between the low-pass filter] 12 and the strip line 115 is connected to the ground via a variable capacitance diode 126.
- the output of the amplifier 128 is the output of the first oscillator 103.
- the entire back surface of the substrate 115A is an earth pattern 115B.
- a movable conductor 119 constituting a frequency adjuster is implanted near the strip line 115, and the movable conductor 119 is movable-adjusted.
- the adhesive (used as an example of the maintenance means) is fixed with 120.
- the output of the first oscillator 103 is connected to the frequency divider 118.
- the output of the frequency divider 111 is connected to one input of a phase comparator 113, and the output of the phase comparator 113 is connected to the low-pass filter. It is connected to 1 1 2.
- the reference oscillator 1 16 is connected to a reference frequency divider 1 17, and the output of the reference frequency divider 1 17 is connected to the other input of the phase comparator 1 13. They are closely related.
- the frequency divider 1 18 and the reference frequency divider 1 17 are both connected to a control input terminal 114, and are connected to the control input terminal 114.
- the frequency division ratio can be varied by the signal.
- the divider 118 uses a two-modulus type divider with a switchable division ratio. .
- the high frequency digital signal is input to the input terminal 101, and this signal is input to the mixer 104 via the input circuit 102.
- an intermediate frequency signal is obtained by being mixed with the oscillation frequency output from the first oscillator 103.
- the intermediate frequency signal passes through a filter 105, passes through an IZQ detector 106, and is combined with a signal of a second oscillator 109 to produce an I signal.
- Q signal can be obtained.
- the oscillating frequency of the second oscillator 109 is controlled by the control terminal 110.
- the variable capacitance diode 126 forms the capacitance component of the variable tuning circuit, and is controlled by the control voltage from the low frequency filter 112.
- the oscillation frequency of the first oscillator 103 is controlled by changing the capacitance value of the variable capacitance diode 126.
- the oscillation frequency must oscillate in the oscillation frequency range of 14430-2530Hz. In order to achieve this, adjustments are made to absorb variations (hereinafter simply referred to as variations) depending on the component constants and mounting conditions of the electronic components that make up the tuning circuit.
- the input terminal Covering is possible over the entire range of the input signal input from 101.
- the inductance uses the striped line 115 which is a non-turned pattern, the inductance is not used for that part. No parts are required, and rationalization including assembly man-hours is possible.
- the tuning frequency of the tunable circuit of the first oscillator 103 can be adjusted by changing the inductance value. That is, the variation of the component constants constituting the first oscillator 103 and the variation of the stray capacitance generated due to the variation of the mounting position of the mounted component. By adjusting the inductance value to absorb vibrations, etc., it is adjusted to an optimum value.
- variable conductor 119 does not change due to vibration or a long-term temperature cycle, etc., and the inductance value does not change. I have to do it.
- adjustment is made to absorb variations, and an adhesive 120 is applied to the variable conductor 119 to fix it. In this way, we are stabilizing against long-term shape fluctuations.
- the adhesive 120 has a higher relative dielectric constant than air, which increases the stray capacitance and causes more dielectric loss.
- 03 Decrease the Q of the tuning circuit. This means that the phase noise of the first oscillator 103 increases. Adding phase noise is a major issue in high-frequency devices. There is no bit error rate in the digital signal reception. There is a need to reduce phase noise. In order to solve this problem, it is necessary to increase the loop band width and reduce the phase noise.
- the loop and the end width were approximately 60 Hz, but the digital-modulated high-frequency signal was In the present embodiment for receiving a wave signal, the loop band width is set to about 7 kHz, and the phase noise is improved by about 40 dB.
- the phase comparison frequency was about 3 kHz in the past, but was about 360 kHz in the present embodiment.
- the loop band width may be approximately 10 kHz, and in this case, the phase comparison frequency is approximately 500 kHz.
- Fig. 2 (aH is a perspective view showing details of the first oscillator 103 in Fig. 1.
- Fig. 2 (b) is a side view near the movable conductor 119 seen from the AA direction.
- the movable conductor 1 19 is composed of two inverted L-shaped legs 1 19a and a main body 1 1 9b connecting the legs.
- the main body 119b which is electromagnetically coupled to the strip line 115, has an open end 115a of the strip line 115.
- the main part 1 19b is placed almost in the center of the width of the strip line 115 and almost in parallel with the strip line 115.
- an oscillation frequency adjustment range of about 100 MHz can be obtained, that is, the open end 1 15 a or 1 Since the main body 1 19 b is located on the 15 b side, a relatively large The frequency adjustment range is obtained
- the adhesive 120 is applied so that the mutual position of the movable conductor 119 and the strip line 115 does not change. As a result, the adhesive is stabilized against long-term fluctuations of the temperature cycle, etc.
- the adhesive 120 is used as the adhesive.
- a solvent-type rubber-based adhesive was used.
- silicon-based, epoxy-based, phenol-based, etc. may be used. In that case, it is desirable to use a material that cures at room temperature to enhance workability.
- the movable conductor 111 can be implanted approximately at the center 115c of the stripline 115. No. In this case, the adjustment range is narrowed, but there is an effect that the adjustment is easy.
- FIG. 3 (a) is a perspective view of another example showing the details of the first oscillator 103 of FIG.
- FIG. 3 (b) is a side view of the vicinity of the movable conductor 149 viewed from the AA direction.
- the movable conductor 149 is composed of two inverted L-shaped legs 149 a and a main body 149 b connecting the legs.
- the main body 1449b which is electromagnetically coupled with the strip line 150 provided on the substrate 150A, is an open end 150a of the strip line 150.
- the main body part 149b is placed almost above the center of the width of the strip line 150 and almost in parallel with the strip line 150. are doing . With such an arrangement, an oscillation frequency adjustment range of about 80 MHz can be obtained.
- the strip line 150 is formed by connecting an L-shape. This makes it possible to reduce the mounting area on the board 15 OA. In addition, the same effect can be obtained even if the connection is S-shaped.
- a movable conductor 149 is implanted in the center 150 c of the strip line 150. do it. In this case, there is an effect that the adjustment force is easily increased because the adjustment range is narrow.
- the adhesive 120 is applied so that the relative position between the movable conductor 1449 and the strip line does not change, as in the above-described example. It is the same.
- the entire back surface of the substrate 15OA is formed as an earth pattern 150B.
- the strip line 115 or 150 As an inductance element when the oscillation frequency is low, it is necessary to increase the size of the strip line. If it is not suitable, for example, when oscillating the frequency in the VHF band, use an air-core coil or flat line as the inductance element. In some cases, a tuning section may be formed. For variations in the oscillation frequency, the inductance value is adjusted by changing the shape of the air core coil and the flat line. Then, in order to make these air-core coils or flat lines stable against fluctuations of the temperature cycle or the like for a long period of time, the adhesive was applied in the same manner as in the above-mentioned embodiment. And fix it.
- Embodiment 2 is shown in FIGS. 4 and 5.
- FIG. FIG. 4 shows the strip lines 115, 150, the movable conductors 119, 149 and the adhesive 1 shown in FIG. 1, FIG. 2 or FIG. This is an example in which 20 is replaced with an inking element 12 1.
- Fig. 5 (a) shows an example of the inductance element 121.
- the inductance element 121 has electrodes 124 at both ends. With the insulator 1 2 2 as the core, the coil 1 2 3 is wound around the insulator 1 2 2.
- the inductance element 1 2 The value of 1 forms a groove 122a on the opposite side of the electrode 124, and inserts a pin set or the like into this groove 122a to coil.
- the adjustment is made by changing the winding pitch of 123. Since the coil 123 of the inductance element 122 is wound around the insulator 122, it is bonded by the frictional force with the insulator 122. Even without the agent, it is stable against long-term fluctuations in temperature cycle and the like. In other words, in this example, the frictional force between the coil 123 and the insulator 122 serves as a means for maintaining. Even if an external force is applied to the coil 123, the shape does not change. However, because of the dielectric loss of the insulator 122, the phase generated by the oscillator 103a can be increased by increasing the loop band width, as in the previous embodiment. Noise is reduced. As a result, the phase comparison frequency of the phase comparator 113 also increases.
- the coarse adjustment of the reception frequency depends on the PLL unit 11 1 and the first oscillator 10. 3a, and fine tuning is performed by the AFC control terminal 110 of the second oscillator 1109 of the I / Q detector 106, so that a stable high-frequency device can be realized. is there .
- FIG. 5 (b) shows another example of the inductance element 122 shown in FIG.
- reference numeral 17 1 denotes a cylindrical insulator, and a through hole 17 1 in the center of the insulator 1 1 1 A M wall 17 1 2 is set up. In this case, the bottom surface of the through hole 17 1 A may be sealed to ensure strength.
- 173 is a conductor, which is wrapped around the outer periphery of the insulator 171. The outer periphery uses a cylindrical shape, but is not limited to this.
- Reference numeral 174 denotes a movable core formed of a magnetic material, which is provided with a convex screw 1775 around its outer periphery, and the convex screw 175 is provided with the through hole 17 1 A concave screw 17 2 It has been set up.
- Reference numeral 176 denotes a minus-shaped groove provided on the top surface of the movable core 1774. Insert a driver or the like into this groove 1776 and turn it. As a result, the movable core 174 can move a small distance up and down in the insulator 171 in the drawing.
- Reference numeral 177 denotes a metal shield case, which covers the outside of the insulator 171.
- Reference numeral 1778 denotes a hole provided on the top surface of the shield case 1777, through which the movable core 174 can be rotated from the outside. And can be done.
- a groove 1779 can be provided on the outer peripheral surface of the insulator 171a, and the conductor 1 ⁇ 3 can be wound around the groove 1719.
- the value of the inductance is adjusted.
- the conductor 173 is wound around the insulator 171, it is not deformed by an external force.
- the movable core 174 is screwed into the insulator 171, and is locked by the frictional force (the frictional force serves as a maintenance means). Therefore, even if they are not fixed with an adhesive, the position of the movable core 174 can be maintained for a long period of time.
- This configuration has a feature that it is easy to automate because the inductance value is adjusted by the rotating motion.
- a groove 179 is provided on the outer periphery of the insulator, and a conductor 173 is wound around this groove 179, In addition, the inductance can be stabilized against vibration.
- the coarse adjustment of the reception frequency depends on the PLL unit 11 1 and the first oscillator 10 0. 3a and fine-tuning with the AFC control terminal 110 of the second oscillator 109 of the IZQ detector 106 can realize a stable high-frequency device. .
- FIG. FIG. 7 is a diagram showing the first oscillator 103 b of FIG. Fig. 7 (aH shows the outline of the first oscillator 03b, and Fig. 7 (b) is a side view of the vicinity of the movable conductor 125 seen from the BB direction.
- the transmissive element is constituted by the movable conductors 125 and the strip line 151, and the components constituting the first oscillator 103b vary, etc.
- the movable conductors 125 By adjusting the movable conductors 125, the variation is absorbed, and similarly fixed with an adhesive 120, vibration, temperature cycles, etc.
- the movable conductor 1 25 is arranged in series with the strip line 15 1, so that the first Compared to the embodiment shown in the figure, there is no need to newly install a movable conductor near the strip line 151, reducing the area occupied by the substrate 151A. so , Ru Oh effective in miniaturization.
- the movable conductor 125 may be a movable conductor 125a shown in FIG. 7 (c). That is, the movable conductor 125a is not penetrated through the substrate 151a, but is attached to the upper surface of the substrate 151a for adjustment and the approximate center thereof is adjusted. It may be fixed with adhesive 120. (Embodiment 4)
- Embodiment 4 is shown in FIG.
- FIG. 8 (a) is a perspective view showing another example of the first oscillator, in which 103c is added.
- FIG. 8 (b) is a cross-sectional view of the relevant part.
- FIG. 8 (c> is a perspective view of a main part, and
- FIG. 8 (d) is a perspective view of another example.
- reference numeral 152 denotes a strip line that forms the inductance of the tuning section.
- a convex portion 1553 for adjustment is provided on the side surface of the strip line 152.
- the convex portion 1553 adjusts the inductance value of the strip line 152.
- the convex portion 153 adjusts the inductance value of the strip line 152.
- the cutting is performed by laser trimming and the inductance is adjusted to a predetermined value.
- the coating material 155 is applied to the cut surface 154. The application of the coating material 15.5 is for the following reasons.
- the adjustment section is a strip line. May be cut into the concave 1557 by laser trimming. The cut surface 154 by these laser trimmings forms a rough surface 158 as shown in FIG. 8 (b). The application of the coating material 155 is effective to protect the irregularities of 158.
- FIG. 9 is a perspective view thereof.
- reference numeral 1559 denotes a strip line which is provided on a substrate 1559A and which forms a tuning section of a local oscillator.
- Reference numeral 160 denotes a movable conductor connected in series to the strip line 159.
- reference numeral 161 denotes an adjusting portion projecting from the side surface of the strip line 159.
- 15 9 B is art no. It is a turn.
- the adjustment section 16 1 is roughly cut by the force laser trimming 16 2, and the roughness of the ink distance is reduced. Adjustments are made.
- fine adjustment of the inductance is performed by the movable conductor 160.
- the adjusting part 16 1 is coated with a coating material 155 so that the cut surface is not oxidized, and the carbide generated by the carbonization of the substrate and the resist does not absorb water. You.
- the movable conductor 160 is coated with an adhesive 120 so that the adjustment value does not change.
- the coarse adjustment by the adjusting section 161 and the fine adjustment by the movable conductor 160 are performed, so that the adjustment is easy. At the same time, accurate adjustments can be made.
- the trimming has been described with respect to a laser.
- the trimming may be performed by machining a drill or the like. So In this case, capital investment can be rationalized.
- reference numeral 201 denotes an input terminal, and a digitally modulated high-frequency signal is input to the input terminal 201.
- the input terminal 201 is connected to a high-pass filter 202, an amplifier 203A, a variable attenuator 204, an amplifier 203B, and a tuning filter 205.
- the output of the tuning filter 205 is fed to one input of a mixer 206.
- the other input of the mixer 206 is supplied with an output signal from the voltage-controlled oscillator 208 of the local oscillator 200, and the output of the mixer 206 is the output of the mixer 206. It is supplied to the amplifier 210 via the terminal 209.
- the output side of the voltage-controlled oscillator 207 of the local oscillator 207 is connected to a frequency divider 211, a phase comparator 211, and a NORP filter 211.
- the output of the filter 213 is supplied to the input of the voltage-controlled oscillator 208 and to the tuning filter 205.
- the signal from the crystal oscillator 2 14 is supplied to the phase comparator 2 12 as a reference signal after being divided by the frequency divider 2 15. ing . That is, the tuner section is constituted by the blocks A, B, C, D, and E divided by the hatched dividers 216, and the block E is formed. Is provided with an output terminal 217 as a tuner.
- Block F is an IZQ detector, an IZQ detector 222 is connected to the output terminal 211 of the tuner, and one signal is output from the I / Q detector 222. Output terminal 2 2 3 where Q is output, output terminal 2 2 4 where Q signal is output Has been bowed out.
- the IZQ detector 222 is connected to a voltage-controlled oscillator 225, to which a frequency control voltage (AFC) is supplied.
- AFC frequency control voltage
- the block G is provided with a gain control circuit (AGC) 226 for supplying a control voltage to the tuner portion, to which an AGC signal is supplied.
- AGC gain control circuit
- a voltage is supplied to an outdoor antenna portion via an input terminal 201 to a mouth noise converter (LNB) installed outdoors. In this way, for example, a signal in the 1-2 GHz band is input from the input terminal 201 shared with the voltage supply terminal.
- LNB mouth noise converter
- the frequency distribution characteristic of the output signal of the voltage-controlled oscillator 208 is represented by the desired center frequency I (for example, 1 . shows the 8 GH Z) paired to distribution characteristics of states diagram up and down rather come large.
- the frequency distribution characteristic of the J line is corrected by the frequency divider 2 11 1, the phase comparator 2 1 2, and the loop connected to the voltage controlled oscillator 2 08.
- a control loop composed of a filter 2 13, a frequency divider 2 15 connected to a phase comparator 2 12, and a crystal resonator 2 14 .
- the frequency division ratio of the frequency divider 211 is reduced (for example, about 400 to 700). are doing .
- the reference signal supplied from the frequency divider 2 15 to the phase ratio adjuster 2 12 is high (for example, 360 kHz).
- the noise component of the voltage-controlled oscillator 208 alone is removed by the control loop, so that the noise component in the J line in FIG. 11 is very small.
- the desired frequency distribution characteristics can be obtained.
- Fig. 12 (a) This will be explained using.
- L indicates a case where the loop band width of the control loop is small, for example, 5 kHz. Yes.
- M indicates the case where the loop width of the control loop is large.
- the loop band width of the control loop is made sufficiently large so as not to be influenced by the noise of the voltage controlled oscillator 208. Therefore, M in Fig. 11 and Fig. 12 (a> is assumed to be about 7 kHz, and as a result, it is extremely focused on the center frequency I of the J line. Thus, even if the noise of the voltage-controlled oscillator 208 is large, an ideal output signal which is not affected can be obtained, and this is the same as the mixer 206. Therefore, the tuning and the IZQ detection are performed properly, and the frequency division ratio of the frequency divider 211 is reduced. Because of this, the response, such as channel switching, is extremely high.
- Figure 12 (b) shows the effect of the reference frequency signal on the phase noise. This will be explained with reference to FIG.
- the signal level of the reference frequency signal supplied to the phase comparator 2 12 at the same frequency excluding its substantial center frequency is equal to the loop level.
- the level of the signal of the voltage controlled oscillator 208 ie, the comparison signal supplied from the frequency divider 211 to the phase comparator 211) before being corrected by the pulse width.
- the local oscillator 207 mixes the frequency distribution characteristics of the signal level near the center frequency of the reference frequency signal (Fig. 12 (b) N line) or the reference frequency signal. In comparison with the frequency distribution characteristics of the signal level around the center frequency output to the device 206, the frequency distribution characteristic excluding the substantial center frequency is used.
- the signal level at the same offset frequency from the center frequency is higher than the loop band. If the signal level is larger than the signal level to be corrected by the width (0 line in Fig. 12 (b)), even if the nore-band width is increased, Since the reference frequency signal to be compared has a lot of noise, it cannot be corrected beyond it (for example, in the case of the O line in Fig. 12 (b), the P line is the same as the O line). The straight line cannot be corrected for the former N-line at all.)
- the signal of the voltage controlled oscillator 208 before being corrected by the loop band width has a higher purity and a higher loop band width. If a reference frequency signal oscillation source that does not cause any loss is selected (for example, the Q line in Fig. 12 (b) Q), the effect of correcting the high loop band width can be improved. , It can be enjoyed more economically.
- Reference numeral 22 7 in Fig. 10 is a controller for switching channels, etc., and its signal is output from the micro computer 2. The signal is supplied to the frequency dividers 2 1 1 and 2 1 5 via 2 8.
- FIG. 13 shows the details of the blocks C and D.
- Voltage regulation The control oscillator 208 is composed of an oscillating section centered on a transistor 229, a strip line 230 provided on a substrate, and a varactor diode. It is composed of a tuning section made up of leads 231, 2311a.
- Fig. 14 (a) shows this clearly and easily.
- 2332, 2333, and 234 are resistors for applying voltage
- 2335, 2336, and 237 are resistors for bias
- 2 Numerals 38 and 23 are capacitors for temperature compensation
- 240 is a capacitor for feedback
- 241, 242 and 243 are capacitors for grounding.
- , 244 are output capacitors.
- Reference numeral 2445 denotes an impedance matching inductance, which is formed of a pattern on the substrate.
- Reference numeral 261 denotes a movable conductor for adjusting the inductance of the tuning section, which is described in detail in the third or fifth embodiment.
- reference numeral 262 denotes an adhesive, which fixes the movable conductor 261 and keeps the inductance value stable for a long period of time.
- the capacitor 2 13 includes capacitors 24 6 and 24 7, transistors 24 48 and 24 9 and so on.
- the details are shown in Fig. 15. That is, the signal from the phase comparator 211 is input from the input terminal 250, and the transistors 248 and 249 are connected in a parallel connection. After being amplified by the amplifier composed of the above, it goes to the output terminal 25 1. A part of it is fed back to the transistor 248 via the resistor 252 and the capacitor 247, and thereby the feedback is made. Filter operation is performed.
- reference numeral 253 denotes a capacitor
- reference numerals 255, 255, and 257 denote resistors.
- Film capacitors were used for the capacitors 2464 and 2447 in consideration of vibration resistance. That is, this When ceramic capacitors are used for these capacitors, unnecessary voltage is generated due to the piezoelectric effect due to vibration, which causes noise. To degrade the phase noise. Therefore, such a finolem capacitor with a lead, which has a small piezoelectric effect, is used. In addition, since the capacitor 2464 in FIG. 13 is a finolem capacitor, it is a great power. Therefore, using this as a resource, a block for passing the line 258 connecting the capacitor 246 and the strip line 230 is passed. The opening provided in the partition plate 21 between the blocks C and D should be on the block D side, and the area near the opening should be covered with the capacitor 24 6. It is what you do. This is a measure to reduce the movement of the noise of the blocks C and D through this opening.
- the capacitors 24 6 and 24 7, which are made of film capacitors, are vulnerable to high-temperature heating, and therefore, are not To mount the capacitors 2464 and 2447 on the board, insert the lead wires into the through holes of this board, and then place the conductor pattern on the back side of this board. It is important that no electrodes are provided in these through holes. This is to prevent the penetration of the solder into the through-hole and the conduction of the heat to the capacitors 246 and 247. .
- the strip line 230 was installed near the wall of the metal case 25 9 shown in Fig. 13 or the partition plate 21 6 as shown in Fig. 13. It is a device to reduce the noise from entering the strip line 230 of the present invention. In the following FIG. 13, the transistor 260 is for signal amplification.
- FIG. 14 (a) there is a small capacity (several picofaras) between the strip line 23 and the varactor diode 23a.
- a pico-flip chip capacitor 238 is installed to increase the track impedance. This is because, as shown in Fig. 16 (a) and Fig. 16 (), the length of the lead wire 23 Even if it is substantially changed due to damage, it is a way to reduce the effect by increasing the impedance with the chip capacitor 238. That is, the parameter diode 23 1 a is heavier than the chip capacitor 2 38, and is attached to the reflow solder. Therefore, it is impossible to expect the effect of self-alignment, so that the actual length of the lead line varies and the impedance is constant.
- the tip capacitor 2338 is light in weight, it can be used for reflow soldering, so that the effect of the senor fermentation can be reduced.
- the inductance of the strip line 23 is constant, and the tip capacitor 238
- the inductance between the diode diode 231a and the diode diode 23a may vary and be powerful, but the tip capacitor 2338 As a result, the impedance is high, so the variation of the oscillation frequency is reduced by this measure.
- the temperature compensation is performed by combining the chip capacitor 23 and the chip capacitor 23.
- a capacitor By using a capacitor, more detailed temperature compensation characteristics can be realized, and a voltage-controlled oscillator that is stable with respect to temperature can be obtained.
- Fig. 14 (b) shows the tip con- trol to reduce the variation around the strip line 230 in Fig. 14 (a). This is an embodiment in which the sensor 238 is not required and a good tuning section can be obtained.
- the oscillation frequency control voltage input pin 2 63 It is connected to the power source side of the parameter diode 23 1 via the resistor 2 32 and the ground side is connected to the ground.
- the movable conductor 26 1 is connected between the connection point of the resistor 23 2 and the parameter diode 23 1 and the transistor 22 9 of the oscillation section.
- the strip line 230 side is connected to the 9 side.
- the movable conductor 261 has an inductance of about 6 nH
- the strip line 230 has a length of about 4 to 6 mm and a width of about 1 mm. It is formed with a print pattern.
- both the movable conductor 26 1 and the strip line 23 are connected to both the cathode diodes 23 1 and 23 a. Let's consider the case where they are placed between the two sides. Since there is the floating capacitance of both the movable conductor 261 and the strip line 230 between the parameter diodes 231, 23a, The tuning frequency range is larger than the case where both cathode sides of the varactor diode 23 1 and 23 1a are connected to It grows in proportion to the size. In this case, it is necessary to widen to the desired range, but if the tuning frequency range is further increased, the tuning sensitivity (varactor dynamism) will increase.
- the movable conductor 26 1 and the strip line 23 should be used. It is clear that it is necessary to transfer any one of 0 between the parameter diode 23] a and the transistor 2229 of the oscillation section. Then, in this case, it is important to move the strip line 2 30 instead of the movable conductor 2 61. That is, according to this configuration, a strip line 23 3 having a fixed inductance is provided on the transistor 22 9 side of the oscillation section. Since 0 is set, unstable coupling due to the harmonic mode does not occur, and adjustment is easy.
- the movable conductor 26 1 is provided on the transistor 22 9 side, the movable conductor 26 1 and the transistor 2 29 are close to each other. Depending on the method of adjusting the movable conductor 261, unstable coupling due to the harmonic mode occurs, and stable oscillation cannot be obtained.
- a parameter diode 23 1 a having a variable capacitance of approximately 1 pF to 15 pF and a strip
- the movable conductor 261 is connected to the varactor diode 231 and the same. If it is placed between the two cathode sides of the 2311a, the range in which proper tuning can be ensured (the oscillation frequency of 1330MHz to 270000MHz) Within this range, the tuning sensitivity can be further reduced.
- the movable conductor 261 or the strip line 230 is separated by a minimum number of elements without separating the movable conductor 261 or the strip line 230. Since 31a is placed, the mounting efficiency is good, and the balance between securing the tuning of the input signal and reducing the phase noise is balanced.
- the comparison frequency is increased by reducing the frequency division ratio of the frequency divider 2 15 that divides the signal from the crystal oscillator 2 14. Combining the low frequency division enables a high loop band width.
- the step of channel selection becomes coarse, and the deviation of channel selection of the receiving channel becomes large. Therefore, by changing the frequency division ratio of the frequency divider 2 15 by about 10 to 20% by the channel, the deviation is corrected to be minimized. As a result, a high loop band width can be realized while securing a desired tuning.
- the local oscillation frequency is F vco
- the main module of the two- modulus type of 64 Z 65 frequency division is N
- the single counter is A. If the reference signal frequency is X tal and the division ratio of the reference frequency divider is R, then (Equation 1) is obtained.
- variable attenuators 204 and 220 will be described.
- the AGC 226 supplies a control voltage to both the variable attenuators 204 and 220, respectively.
- the variable attenuator 204 at the preceding stage varies the input level so as to control the cross modulation at the time of the strong electric field multi-signal generated by the mixer 206.
- the overall gain is adjusted by the variable attenuator 220, and the operating range is set to 50 dB or more. As a result, a wide input range is realized. .
- FIG. 17 shows another example of the part E in FIGS. 10 and 13.
- Reference numerals 303 and 304 denote switching switches, and 301 and 302 each have a roll-off characteristic and have an intermediate frequency tuned switch having different bandwidths. It is a filter.
- the switching switches 303 and 304 are interlocked and switched by an external switch signal 305, and the intermediate frequency signal is switched to the intermediate frequency frequency tuning file. Or through the filter 301 or 302. This enables optimum reception even when the bandwidth of the received high-frequency signal differs depending on the transmission rate.
- the high-frequency device of the present invention has an input terminal 401 to which a high-frequency digital signal is input, and an input terminal connected to the input terminal 401.
- the output of the filter 402 and the input filter 402 is supplied to one input, and the other input is supplied to the other input of the first oscillator 4003.
- the IZQ detector 406 to which the output of the wave filter 405 is connected, the control terminal 407 to which the frequency control data is input, and the control terminal 405 7, a PLL unit 409 connected via a calculation / calculation counter 408, and this PLL unit 409 is connected to the other output of the first oscillator 4003. Is connected To that and the even, A loop filter (hereinafter, referred to as a low-pass filter) 41 connected between the output of the PLL section 409 and the input of the first oscillator 403 It has 0 and. Further, the IZQ detector 406 includes a two-divider 411 connected to the output of the intermediate frequency tuned surface wave filter 405, and the two-divider 411.
- One output of the first detector 41 2 is connected to one input, and the other input of the first detector 41 2 is connected to the output of a second oscillator 41 3. While the power is connected, the I signal output, which is the output of the first detector 412, is connected to the first output terminal 414. Further, a second detector 415 having the other output of the two-way divider 411 connected to one input, and 90 ⁇ connected to the other input of the second detector 415 are connected to the other input. While the phase shifter 416 is connected, the input of the 90-degree phase shifter 416 is connected to the second oscillator 413. The Q signal output of the second detector 415 is connected to a second output terminal 417.
- the second oscillator 413 constitutes an oscillator with a resonator element using the surface wave resonator 418, and the substrate of the surface wave resonator 418, and the intermediate frequency
- the substrate of the tuned surface wave filter 405 is a substrate made of the same material.
- a frequency error detector 419 to which the I signal output and the Q signal output are connected is connected to the arithmetic Z subtraction power counter 408.
- the oscillation frequency of the first oscillator 403 is determined by the control data first input to the control terminal 407.
- the resulting intermediate frequency signal 456 is shown in FIG. 19.
- the intermediate frequency signal 4 5 6 Is centered on fo.
- the center frequency fo of the intermediate frequency tuned surface wave filter 405 and the second oscillation frequency f0 of the intermediate frequency tuned surface wave filter 405 due to external temperature change, etc., use the same substrate material. And both change by about f 0 + ⁇ . If the intermediate frequency signal remains at 456, the center frequency of the intermediate frequency tuned surface wave filter 405 becomes f0 + ⁇ due to external temperature changes. Because of this, the symmetry between the baseband signal 457 of the I signal output and the baseband signal 458 of the Q signal output is broken. In this case, particularly, the baseband signal band of the Q signal output becomes narrow, and a detection error occurs.
- the intermediate frequency signal is changed to 45 ⁇ by the above-described addition / subtraction power counter as in the case of 449.
- the first oscillator 403 is controlled so as to be + ⁇ .
- the 3d of the intermediate frequency tuning surface wave filter 405 ⁇ the bandwidth of the cutoff frequency is equal to the symbol rate of the received signal. If it is within the range of -0% or more and + 5% or less, the roll-off filter necessary for the next stage of the first output terminal 4 14 and the second output terminal 4 17 Data is not required.
- the intermediate frequency-tuned surface wave filter 405 can also have the function of a mouthpiece filter.
- the 3 dB down-bandwidth of the band characteristic of the intermediate frequency-tuned surface wave filter 405 is received. 10% or more of the bandwidth equivalent to the signal's symbol rate +5 Within%. Then, the 3 dB cutoff frequency of the baseband signal 460 of the I signal output and the baseband signal 460 of the Q signal output becomes In each case, the band width of 1 to 2 of the symbol rate should be between -0% and + 5%. In other words, the roll-free frequency function can be implemented with an intermediate frequency-tuned surface wave filter 405 with an accuracy within the range of -0% or more and + 5% or less.
- FIG. 20 is a block diagram of the high-frequency device according to the ninth embodiment.
- reference numeral 501 denotes an input terminal, and a fixed input filter 502 connected to the input terminal 501 and a fixed input filter
- a first gain control amplifier 504 connected to the output side of 502 and a gain control terminal connected to a gain control input of the first gain control amplifier 504 503, a mixer 505 having the output of the first gain control amplifier 504 connected to one input, and one output connected to the other input of the mixer.
- a loop filter hereinafter, referred to as a low-pass filter
- the IZQ detector 511 connected to the output of the filter 511, the first output terminal 517 connected to the Q signal output of the IZQ detector 519, and the IZQ It is composed of a second output terminal 518 to which the I signal output of the detector 519 is connected.
- the configuration of the IZQ detector 519 is as follows. That is, a two-way divider 51 2 to which the output of the intermediate frequency tuning filter 51 1 is connected, and one output of the two-way splitter 51 2 are connected to one input.
- the first detector 513 connected thereto, the 90-degree phaser 514 connected to the other input of the first detector 513, and the 90-degree phaser A second oscillator 515 connected to the input of the input circuit 5 14, and a second detector 5 16 connected to the other input of the other output of the splitter 5 12.
- the other input of the second detector 5 16 is connected to the second oscillator 5 15, and the output thereof is connected to the second output terminal 5 18. Yes.
- the output of the first detector 513 is connected to the first output terminal 517.
- the frequency of the first oscillator 506 is determined by the maximum frequency of the signal input to the input terminal 501, which corresponds to the intermediate frequency input to the intermediate frequency tuning filter 511. It is larger than one half of the difference between the frequency and the minimum frequency.
- the operation of the high-frequency device configured as described above is described below.
- the intermediate frequency is IF
- the maximum frequency input to the input terminal is RF max
- the minimum frequency is RF min.
- the image disturbance frequency of the terodyne method is Im and the relationship of Im> RF max is taken as Im, the image disturbance frequency will be higher. It will not be input to the input terminal 501 of the device.
- the first oscillator 506 has a oscillating frequency of two minutes of the difference between the maximum frequency RF max of the signal input to the input terminal 501 and the minimum frequency RF min. If an intermediate frequency IF larger than 1 is obtained, it is assumed that the image interference frequency Im is input to the input terminal 501. Is larger than RF max, so that the fixed input filter 502 cannot pass through the intermediate frequency tuning filter 511. become .
- the fixed input filter 502 allows the intermediate frequency to be set. No signal is output from the wave number tuning filter 5 11.
- the 612 MHz band is an unused channel that is not used for signal transmission. So
- the 612 MHz band is set to the intermediate frequency of the high frequency device.
- the fixed input filter 502 is provided in order to prevent this. 6 Add a trap for attenuation in the 12 MHz band * ⁇ o
- an intermediate frequency IF that is larger than one half of the difference between the maximum frequency RF max and the minimum frequency RF min of the signal input to the input terminal 501 is obtained.
- a filter for removing the image interference frequency Im becomes unnecessary.
- only a simple fixed input filter 502 that allows only the frequency (RF max to RF min) input to the input terminal 501 to pass is arranged. OK.
- the fixed input / output unit 502 does not pass a frequency equal to or lower than the minimum frequency R Fmin, it does not receive interference from a signal above CATV.
- a high-frequency device can be provided with a simple control method.
- the high-frequency device of the fifth embodiment is housed in the same shield case to prevent clock interference with the high-frequency device. Can be obtained.
- reference numeral 601 denotes a rectangular parallelepiped metal case, which constitutes a so-called tuner section.
- An input terminal 602 is provided on one side of the metal case 601, and an output terminal 603 is provided on the other side. ing . So In this case, the signal input to the input terminal 602 is supplied into the case 601, and the output of the local oscillator is supplied to the other input.
- an I / Q extracting means provided between the mixer and the output terminal 603.
- Reference numeral 604 denotes legs for attaching the case 601 to the parent board.
- Reference numeral 605 denotes an input / output terminal group provided in the longitudinal direction of the plane having the maximum area of the case 601 and includes a mixer, a local oscillator, and an I / Q extracting means. Etc. are connected.
- the I / Q extraction means is a concept that includes at least one of an IZQ detector and an AZD converter.
- Reference numeral 606 denotes a substrate. On the surface of the substrate 606, a demodulator 607 constituting a demodulation unit constituted by an integrated circuit is mounted. The input of the demodulator 607 is connected to the input terminal 608 of the substrate 606, and is connected to the output terminal 603 by a connector.
- Reference numeral 609 denotes an input / output terminal group provided on the board 606, which is connected to the demodulator 607 and is provided in the longitudinal direction of the board 606. It is.
- Reference numeral 610 denotes a connecting member provided on the input terminal 608 side of the substrate 606, and the connecting member 610 uses the connecting member 610 to output the terminal 603 of the case 601. Connected to the side of Here, the substrate 606 is not covered with the case. That is, the demodulator 607 mounted on the substrate 606 directly comes into contact with the outside air. This is because this demodulator 607 dissipates heat generated by consuming a large amount of power of about 2 W.
- the input / output terminal groups 605 and 609 are provided on the side of the largest area, the so-called vertical mounting is possible on the parent board. As a result, the thickness of the parent substrate can be reduced and a thinner substrate can be realized.
- I / O terminal groups 605 and 609 are provided on the long side surface adjacent to the above-mentioned maximum area side. It is possible to reduce the mounting area on the mother board by mounting it vertically.
- the substrate in the case 601 and the substrate 610 on which the demodulator 607 is mounted are formed on a single substrate. You can do that too.
- FIG. 24 (a) is a cross-sectional view of a main part of the substrate 606 on which the demodulator 607 is mounted.
- a copper foil 611 is laid below the demodulator 607 on the surface of the substrate 606, and is in contact with the lower surface of the demodulator 607.
- a copper foil 612 is also laid on the back surface of the substrate 606, and the copper foil 611 is connected to the copper foil 611 by a plurality of through holes 613. Yes.
- the heat generated in the demodulator 607 is transferred to the copper foil 611 and the substrate 605 via the snorkel hole 613. The heat is radiated from the copper foil 612 on the back side of 6.
- Fig. 24 (b> is a plan view of the main part as viewed from the back surface of the substrate 600.
- the printed resist is printed on the copper foil 6 12).
- a plurality of strip-shaped register printing portions 6 15 are provided with non-formed portions 6 15.
- the non-registered portion 6 15 is provided with: Due to the soldering, the solder 615 having a convex shape adheres, and the solder 616 enables more efficient heat radiation. Is mounted on the resist print 6 14.
- the solder nozzle 6 13 is mounted on the register print 6 14 using the solder 6. This is because 16 did not enter the demodulator 607 side and did not cause a shot, etc. .
- the width of the register print 614 between the first solder and the second solder of the plurality of solders 616 is made substantially equal.
- the width is set to 1 mm.
- the diameter of the snare hole 6 13 is 0.5 mm, and 15 pieces are concentratedly provided at the center of the lower surface of the demodulator 6 07.
- Fig. 25 shows that instead of installing a through-hole, a hole 618 is provided on the lower surface of the demodulator 607 on the substrate 617 on which the demodulator 607 is mounted. It is a sign.
- the hole 618 is larger than the chip size of the demodulator 607 and smaller than its outer shape. This hole 618 may be square or round, but it should be as large as possible within 0.5 mm smaller than the outer shape of the demodulator 607. Holes 6 18 are preferred for heat dissipation. The reason why the above value is set to 0.5 mm is to allow the demodulator 607 to be mounted even if the mounting position is slightly shifted.
- FIG. 26 shows a case in which a first substrate 62 1 and a second substrate 62 2 are disposed in parallel in a case 62 in which a high-frequency device is mounted. Then, a tuner section is mounted on the first substrate 621, and a demodulation section is mounted on the second substrate 622. By mounting in this way, the tuner section and the demodulation section can be connected at the optimum component mounting location and at the shortest distance, so that high frequency The size of the device can be reduced.
- FIG. 27 is a block diagram showing a layout of each block of the high-frequency device according to Embodiment 11 of the present invention.
- reference numeral 701 denotes an input terminal.
- a fixed input filter 702 connected to the fixed input filter 701, and a first gain control amplifier 7 connected to the output side of the fixed input filter 702. 0 4, a gain control terminal 703 connected to a gain control input of the first gain control amplifier 704, and one input connected to an output of the first gain control amplifier 704.
- a loop connected between the output of the PLL control unit 708 and the input of the first oscillator 706.
- the second gain control amplifier 710 to which the output of the mixer 705 is connected, and the gain control input of the second gain control amplifier 710 are connected to the gain control terminal 703.
- the intermediate frequency tuning filter 71 1 to which the output of the second gain control amplifier 71 0 is connected, and the intermediate frequency tuning filter 71 The I / Q detector 711 to which the output of the I / O 711 is connected and the first output terminal 171 to which the Q signal output of the IZQ detector 719 are connected And a second output terminal 718 to which the I signal output of the IZQ detector 711 is connected.
- the configuration of the IZQ detector 719 is as follows. That is, a two-divider 71 2 to which the output of the intermediate frequency tuning filter 71 1 is connected, and one output of the two-divider 71 2 are connected to the minus input. And a 90-degree phase shifter 7 1 4 connected to the other input of the first detector 7 13 connected to the first detector 7 13 A second oscillator 715 connected to the input of the 90-degree phase shifter 7 14, and a second oscillator 7 15 in which the other output of the 2-divider 7 12 is connected to one input. The second oscillator 715 is connected to the other input of the second detector 716 and the other input of the second detector 716, and the output of the second oscillator 716 is connected to the second input. Connected to output terminals 718. Further, the output of the first detector 713 is connected to a first output terminal 717. These parts are contained in the same shield case 740.
- the shield case 740 is connected to the first side plate 741, and the second side plate 742 set in parallel with the first side plate 741. It has a parallelogram composed of a first vertical side plate 743 and a second vertical side plate 744 which are provided vertically with the horizontal side plates 741 and 742. Then, in parallel with the vertical side plates 743, 744, the metal partition plates are arranged in order from the first vertical side plate 743 side, the first partition plate 745, and the second partition plate 744. 6, and a third partition plate 747 is provided.
- first partition plate 7 4 8 extends from the first vertical side plate 7 4 3 to the second partition plate 7 4 6 through the first partition plate 7 4 5 to the first horizontal plate 7 4 8. It is set up in parallel with 1 to form each compartment.
- the partition room 749 which is partitioned by the partition plate 7 4 5 and the partition plate 7 4 8 and the horizontal side plate 7 42, is fixed to the input terminal 70 1 provided on the vertical side plate 7 43.
- An input filter 702 and a first gain control amplifier 704 are provided in the compartment 750 which is partitioned by the partition plate 7 4 5 and the partition plate 7 4 6, the partition plate 7 4 8 and the side plate 7 4 2, a mixer 7 0 5 Is implemented.
- An oscillator 706 is mounted in a compartment 751 partitioned by a partition 745, a partition 746, and a side plate 741.
- a PLL control unit 708 and a low-pass filter 709 are mounted in the compartment 752, which is partitioned by the partition plate 748, the partition plate 745, and the side plate 741.
- a gain control terminal 703 and a control terminal 707 are mounted on the side plate 741.
- a second gain control amplifier 7 10 and a side plate 7 4 1 are provided on the side plate 7 4 2 side.
- an intermediate frequency tuning filter 711 is mounted on the side.
- an I-detector 7 19 is mounted in a compartment 7 5 4 that is partitioned by the partition 7 4 7, the horizontal side plates 7 4 1, 7 4 2, and the vertical side plate 7 4 4
- a first output terminal 717 and a second output terminal 718 are mounted on the vertical side plate 744. This is the length from the first detector 7 13 to the first output terminal 7 17 and the length from the second detector 7 16 to the second output terminal 7 18. This is to make the equality and maintain the symmetry of the IZQ detection output.
- the first output terminal 7 17 and the second output terminal 7 18 may be provided on the side plate 7 41 while maintaining the symmetry of the I / Q detection output.
- the shield case 740 is planted on the parent board with the side plate 741 facing down, the signals will be lined up in the same direction on the parent board side, so wiring Is convenient.
- the gain control terminal 703 connected to the second gain control amplifier 7110 may be provided on the side plate 741 side of the compartment 753. In this case, the number of gain control terminals 703 increases, but no noise is picked up in the compartment 749 or the compartment 7550.
- the shield case 740 is attached to the mother board as a face-down type. If the high frequency device needs to be stable against vibration, attach it to the parent board as a face-down type, especially if the high frequency device needs to be stable against vibration. Is preferred.
- the compartment 749 is a fixed input filter 702 for input signals of 50 MHz to 550 MHz and a first gain control amplifier 704, and an external disturbance signal. It is important that you do not receive these.
- the compartment 750 is a mixer that converts the input frequency to the intermediate frequency in the 612 MHz band, and it is important to prevent this signal from leaking to the outside. is there . The reason for setting the intermediate frequency in the 612 MHz band is described in detail in the ninth embodiment.
- the compartment 751 has a variable frequency of about 662 MHz to l162 MHz, and it is important to prevent leakage of signals to the outside.
- Compartment room 752 is a digital signal for channel selection, and care must be taken to ensure that this digital signal does not leak to the outside or to compartment room 749. And are important. Compartment room 753 is a place where the intermediate frequency, 612 MHz band, is amplified with high accuracy, and it is necessary to minimize the intrusion of interfering signals from the outside as much as possible. That is, it is necessary to more completely mount the partition 746 and the partition 747.
- the compartment 754 is an IZQ detector and handles the frequency band of detection and output signals from the 612 MHz band. In this case, it is necessary to prevent the signal from entering from outside and perform detection with little error. It is necessary. By arranging each of the compartments in this manner, the first oscillator 706 and the second oscillator 715 are provided with a partition plate 746 and a partition plate 744. 7 and are arranged diagonally.
- the 50 MHz to 55 MHz high frequency digital signal input to the input terminal 701 is fixed at the fixed input collector 702, and the frequency is 5 OMHz-55 Hz. Remove unnecessary signals other than. Then, after being amplified by the first gain control amplifier 704, the frequency given by the first oscillator 706 is mixed by the mixer 705 and mixed by the mixer 612. Obtain the intermediate frequency in the z band. This intermediate frequency is amplified by the second gain control amplifier 7110, and then, only at the intermediate frequency 612 MHz band, which is the intermediate frequency by the intermediate frequency tuning filter 711. can get . Then, the signal is detected by the I / Q detector 711 and the I signal output is outputted from the second output terminal 718, and the Q signal output is outputted to the first output terminal. It is output from 7 17. The I and Q signal outputs are then processed by a digital signal demodulator that has a digital clock.
- the shield is provided.
- the shielding effect provided by case 74 prevents digital interference with the high frequency equipment.
- Another effect is that spurious interference due to mutual interference between the first oscillator 706 and the second oscillator 715 is reduced.
- the first oscillator 706 and the second oscillator 715 are separated from each other by a partition plate 746 and a partition plate 747, and are separated on a diagonal line. This arrangement also has the effect of reducing spurious interference due to mutual interference between the first oscillator 706 and the second oscillator 715. .
- Another effect is that by separating the compartment 752, the digital signal for channel selection does not interfere with other compartments. There is also.
- the first oscillator 706 and the second oscillator 715 can be separated from each other. There is also an effect that spurious disturbance due to mutual interference between the first oscillator 706 and the second oscillator 715 can be reduced.
- the first output terminal 7 17 and the second output terminal 7 18 are provided on the side plate 7 41 while maintaining the symmetry of the I / Q detection output.
- the shield case 740 is planted on the mother board with the side plate 741 facing down, the signals are lined up in the same direction on the mother board, so It also has the effect of being convenient.
- an input terminal to which a digitally modulated high frequency signal is input, and a signal input to this input terminal are supplied to one input.
- the other input is provided with a mixer to which the output signal of the local oscillator is supplied, and an output terminal to which the output signal of the mixer is supplied, and the local oscillator includes: A voltage-controlled oscillator, and a frequency divider and a divider interposed in a control loop of the voltage-controlled oscillator.
- the tuning unit includes a frequency adjusting unit, and a frequency adjusting unit after adjustment of the frequency adjusting unit.
- a control means for maintaining the state of the control loop, and the noise of the local oscillator is not influenced by the noise of the voltage-controlled oscillator.
- This is a high frequency device with a sufficiently large high loop band width. Therefore, according to the above configuration, since the frequency adjustment unit is provided as a tuning unit of the voltage controlled oscillator, tuning adjustment can be easily performed, and this frequency adjustment can be achieved. Since the state of the adjusting section after the adjustment is maintained by the maintaining means, the stability of the oscillation frequency over a long period of time, starting with vibration resistance, is sufficiently ensured. If the maintenance means is used to ensure vibration resistance, etc., a stray capacitance is formed because its dielectric constant is higher than that of air.
- the control loop of the voltage-controlled oscillator and the noise of the local oscillator depend on the noise of the voltage-controlled oscillator.
- the large loop band width which is so large that it is not affected, allows it to be corrected with a wide frequency range, and as a result, the local oscillator
- the output signal output to the mixer can be a clear signal having little phase noise.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
- Superheterodyne Receivers (AREA)
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/894,762 US6072992A (en) | 1995-12-25 | 1995-12-25 | High-frequency device |
EP95941876A EP0812066A4 (en) | 1995-12-25 | 1995-12-25 | HIGH-FREQUENCY DEVICE |
PCT/JP1995/002668 WO1997023953A1 (fr) | 1995-12-25 | 1995-12-25 | Dispositif haute-frequence |
EP02078477A EP1271763B1 (en) | 1995-12-25 | 1995-12-25 | High frequency apparatus |
US08/969,253 US6052571A (en) | 1995-12-25 | 1997-11-13 | Tuner for PSK or PAM data applications |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP1995/002668 WO1997023953A1 (fr) | 1995-12-25 | 1995-12-25 | Dispositif haute-frequence |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1997023953A1 true WO1997023953A1 (fr) | 1997-07-03 |
Family
ID=14126566
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1995/002668 WO1997023953A1 (fr) | 1995-12-25 | 1995-12-25 | Dispositif haute-frequence |
Country Status (3)
Country | Link |
---|---|
US (2) | US6072992A (ja) |
EP (2) | EP1271763B1 (ja) |
WO (1) | WO1997023953A1 (ja) |
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US6243569B1 (en) * | 1998-08-12 | 2001-06-05 | Analog Devices, Inc. | Direct conversion circuit for radio frequency signals |
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FR2816776B1 (fr) * | 2000-11-10 | 2003-02-07 | Cit Alcatel | Procede de correction de l'erreur de frequence |
JP3755488B2 (ja) * | 2001-08-09 | 2006-03-15 | 株式会社村田製作所 | 巻線型チップコイルおよびその特性調整方法 |
US20030194046A1 (en) * | 2002-04-11 | 2003-10-16 | Shirar Jerry Lester | Method for period counting using a tunable oscillator |
JP2003318754A (ja) * | 2002-04-24 | 2003-11-07 | Alps Electric Co Ltd | テレビジョンチューナ |
JP4341554B2 (ja) * | 2002-07-25 | 2009-10-07 | ソニー株式会社 | 受信装置およびテレビジョン受像機 |
US6816021B2 (en) * | 2002-08-27 | 2004-11-09 | Koninklijke Philips Electronics N.V. | Multiple band local oscillator frequency generation circuit |
JP3754406B2 (ja) * | 2002-09-13 | 2006-03-15 | 富士通株式会社 | 可変インダクタおよびそのインダクタンス調整方法 |
DE10252099B4 (de) * | 2002-11-08 | 2021-08-05 | Rohde & Schwarz GmbH & Co. Kommanditgesellschaft | Messgerät und Verfahren zum Ermitteln einer Kennlinie einer Hochfrequenzeinheit |
AU2003285658A1 (en) * | 2003-01-07 | 2004-07-29 | Koninklijke Philips Electronics N.V. | High-frequency receiver circuit having a frequency-selective element |
US7158767B2 (en) * | 2003-10-24 | 2007-01-02 | Cts Corporation | Tuneable frequency translator |
EP1555864A1 (en) * | 2004-01-14 | 2005-07-20 | Thomson Licensing S.A. | RF circuit with stacked printed circuit boards |
CN101034906B (zh) * | 2006-03-07 | 2010-05-26 | 日立电线株式会社 | 附带频率自动修正功能的可调谐接收装置 |
WO2010043546A1 (en) * | 2008-10-13 | 2010-04-22 | Delphi Technologies, Inc. | High frequency ignition system |
JP4858733B1 (ja) * | 2010-10-06 | 2012-01-18 | 横浜ゴム株式会社 | 送信装置 |
CN104578439B (zh) * | 2013-10-21 | 2018-10-09 | 台达电子企业管理(上海)有限公司 | 用于无线充电线路的装置 |
CN109428747B (zh) * | 2017-08-25 | 2022-03-04 | 展讯通信(上海)有限公司 | 本地振荡器带宽调整方法、接收机、计算机介质及系统 |
US10757801B2 (en) | 2018-09-10 | 2020-08-25 | Hewlett Packard Enterprise Development Lp | Solder mask void regions for printed circuit boards |
WO2024058281A1 (ko) * | 2022-09-13 | 2024-03-21 | 엘지전자 주식회사 | 디스플레이 장치 및 그의 회로 보드 소음 제거 방법 |
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-
1995
- 1995-12-25 US US08/894,762 patent/US6072992A/en not_active Expired - Fee Related
- 1995-12-25 EP EP02078477A patent/EP1271763B1/en not_active Expired - Lifetime
- 1995-12-25 WO PCT/JP1995/002668 patent/WO1997023953A1/ja not_active Application Discontinuation
- 1995-12-25 EP EP95941876A patent/EP0812066A4/en not_active Withdrawn
-
1997
- 1997-11-13 US US08/969,253 patent/US6052571A/en not_active Expired - Fee Related
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JPS5816260Y2 (ja) * | 1977-08-31 | 1983-04-02 | 株式会社東芝 | Uhfチュ−ナの共振回路装置 |
JPS61120528A (ja) * | 1984-11-16 | 1986-06-07 | Nec Corp | 位相同期発振器 |
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Also Published As
Publication number | Publication date |
---|---|
EP0812066A1 (en) | 1997-12-10 |
EP1271763A2 (en) | 2003-01-02 |
EP1271763B1 (en) | 2006-04-19 |
EP1271763A3 (en) | 2004-05-06 |
US6072992A (en) | 2000-06-06 |
US6052571A (en) | 2000-04-18 |
EP0812066A4 (en) | 1999-03-24 |
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