USD985517S1 - Power module having pin fins - Google Patents
Power module having pin fins Download PDFInfo
- Publication number
- USD985517S1 USD985517S1 US29/821,330 US202129821330F USD985517S US D985517 S1 USD985517 S1 US D985517S1 US 202129821330 F US202129821330 F US 202129821330F US D985517 S USD985517 S US D985517S
- Authority
- US
- United States
- Prior art keywords
- power module
- pin fins
- view
- pin
- fins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Description
In the drawings, the claimed design is defined by the shaded surfaces; broken lines immediately adjacent shaded surfaces represent boundaries of the claim and form no part thereof; all other broken lines depict unclaimed environmental subject matter and form no part of the claim.
Claims (1)
- We claim the ornamental design for a power module having pin fins, as shown and described.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/821,330 USD985517S1 (en) | 2019-10-24 | 2021-12-29 | Power module having pin fins |
| US29/873,303 USD1041429S1 (en) | 2019-10-24 | 2023-03-29 | Power module having pin fins |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/710,592 USD942403S1 (en) | 2019-10-24 | 2019-10-24 | Power module having pin fins |
| US29/821,330 USD985517S1 (en) | 2019-10-24 | 2021-12-29 | Power module having pin fins |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/710,592 Division USD942403S1 (en) | 2019-10-24 | 2019-10-24 | Power module having pin fins |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/873,303 Division USD1041429S1 (en) | 2019-10-24 | 2023-03-29 | Power module having pin fins |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD985517S1 true USD985517S1 (en) | 2023-05-09 |
Family
ID=75158698
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/710,592 Active USD942403S1 (en) | 2019-10-24 | 2019-10-24 | Power module having pin fins |
| US29/821,330 Active USD985517S1 (en) | 2019-10-24 | 2021-12-29 | Power module having pin fins |
| US29/873,303 Active USD1041429S1 (en) | 2019-10-24 | 2023-03-29 | Power module having pin fins |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/710,592 Active USD942403S1 (en) | 2019-10-24 | 2019-10-24 | Power module having pin fins |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/873,303 Active USD1041429S1 (en) | 2019-10-24 | 2023-03-29 | Power module having pin fins |
Country Status (2)
| Country | Link |
|---|---|
| US (3) | USD942403S1 (en) |
| JP (3) | JP1683876S (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1034492S1 (en) * | 2021-10-04 | 2024-07-09 | Transportation Ip Holdings, Llc | Housing for a full phase module gate drive |
| USD1036395S1 (en) * | 2018-09-12 | 2024-07-23 | Wolfspeed, Inc. | Power module |
| USD1041429S1 (en) * | 2019-10-24 | 2024-09-10 | Wolfspeed, Inc. | Power module having pin fins |
Citations (57)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3421578A (en) | 1966-12-22 | 1969-01-14 | Louis L Marton | Heat dissipator |
| US3790859A (en) | 1970-02-19 | 1974-02-05 | Texas Instruments Inc | Electronic package header system having omni-directional heat dissipation characteristic |
| US4638858A (en) | 1985-10-16 | 1987-01-27 | International Business Machines Corp. | Composite heat transfer device with pins having wings alternately oriented for up-down flow |
| USD291845S (en) | 1983-11-23 | 1987-09-15 | Tonino Lamborghini | Textile fabric |
| US5241453A (en) | 1991-11-18 | 1993-08-31 | The Whitaker Corporation | EMI shielding device |
| USD341944S (en) | 1990-09-11 | 1993-12-07 | Merfin Hygienic Products Ltd. | Embossed tissue or similar article |
| USD364385S (en) | 1994-05-11 | 1995-11-21 | Fuji Electric Co., Ltd. | Semi-conductor element with terminal casing |
| US5725051A (en) | 1992-11-05 | 1998-03-10 | Level Energietechniek B.V. | Heat exchanger |
| USD398295S (en) | 1996-10-08 | 1998-09-15 | Chih Pin Chang | Heat dissipating plate for computer parts |
| US6601299B2 (en) | 2000-10-19 | 2003-08-05 | Ibc Corporation | Tapered fin and method of forming the same |
| US20040150956A1 (en) | 2003-01-24 | 2004-08-05 | Robert Conte | Pin fin heat sink for power electronic applications |
| US6952347B2 (en) | 2001-01-20 | 2005-10-04 | Conti Temic Microelectronic Gmbh | Power module |
| USD511251S1 (en) | 2003-02-19 | 2005-11-08 | The Procter & Gamble Company | Cleaning sheet |
| US20070119568A1 (en) | 2005-11-30 | 2007-05-31 | Raytheon Company | System and method of enhanced boiling heat transfer using pin fins |
| US20080066888A1 (en) | 2006-09-08 | 2008-03-20 | Danaher Motion Stockholm Ab | Heat sink |
| US20090145581A1 (en) | 2007-12-11 | 2009-06-11 | Paul Hoffman | Non-linear fin heat sink |
| US20090309524A1 (en) | 2008-06-13 | 2009-12-17 | Rider Jerald R | System and Method for Adding Voltages of Power Modules in Variable Frequency Drives |
| USD611255S1 (en) | 2006-11-29 | 2010-03-09 | The Procter & Gamble Company | Substrate with printed pattern |
| US7751192B2 (en) | 2005-05-05 | 2010-07-06 | Sensys Medical, Inc. | Heatsink method and apparatus |
| USD622228S1 (en) | 2009-09-11 | 2010-08-24 | Foxsemicon Integrated Technology, Inc. | Heat dissipation apparatus |
| USD622230S1 (en) | 2009-11-02 | 2010-08-24 | Foxsemicon Integrated Technology, Inc. | Heat dissipation apparatus |
| USD627746S1 (en) | 2009-12-25 | 2010-11-23 | Foxsemicon Integrated Technology, Inc. | Heat dissipation apparatus |
| US20120001227A1 (en) | 2010-06-18 | 2012-01-05 | Fuji Electric Co., Ltd. | Power semiconductor module |
| US20120207591A1 (en) | 2011-02-15 | 2012-08-16 | Ching-Pang Lee | Cooling system having reduced mass pin fins for components in a gas turbine engine |
| USD672154S1 (en) | 2012-03-01 | 2012-12-11 | Rockline Industries, Inc. | Wipe with pattern |
| USD672729S1 (en) | 2011-12-30 | 2012-12-18 | Foxsemicon Integrated Technology, Inc. | Heat sink |
| USD673124S1 (en) | 2011-12-28 | 2012-12-25 | Foxsemicon Integrated Technology, Inc. | Heat sink |
| US20130105961A1 (en) | 2011-10-31 | 2013-05-02 | Infineon Technologies Ag | Low inductance power module |
| US8441275B1 (en) | 2010-01-14 | 2013-05-14 | Tapt Interconnect, LLC | Electronic device test fixture |
| US20140029199A1 (en) | 2012-07-30 | 2014-01-30 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling apparatuses and electronics modules having branching microchannels |
| USD699908S1 (en) | 2012-08-04 | 2014-02-18 | Hangzhou Jeenor Cleaning Supplies Co., Ltd. | Big dot pattern wiper |
| US20140091453A1 (en) | 2012-10-02 | 2014-04-03 | Kabushiki Kaisha Toyota Jidoshokki | Cooling device and semiconductor device |
| US20140198475A1 (en) | 2013-01-17 | 2014-07-17 | Lear Corporation | Electrical busbar, electrical connector assembly and power converter |
| USD719537S1 (en) | 2013-05-08 | 2014-12-16 | Mitsubishi Electric Corporation | Semiconductor device |
| US20140376184A1 (en) | 2012-04-16 | 2014-12-25 | Fuji Electric Co. Ltd. | Semiconductor device and cooler thereof |
| US20150137871A1 (en) | 2013-06-04 | 2015-05-21 | Panasonic Intellectual Property Management Co., Ltd. | Gate driver and power module equipped with same |
| US20150146377A1 (en) | 2013-11-26 | 2015-05-28 | Delta Electronics (Shanghai) Co., Ltd. | Power conversion device and method for assembling the same |
| JP1530509S (en) | 2014-12-24 | 2015-08-10 | ||
| US20150327394A1 (en) | 2014-05-07 | 2015-11-12 | International Business Machines Corporation | Multi-component heatsink with self-adjusting pin fins |
| US9255745B2 (en) | 2009-01-05 | 2016-02-09 | Hamilton Sundstrand Corporation | Heat exchanger |
| US9291404B2 (en) | 2012-02-24 | 2016-03-22 | Mitsubishi Electric Corporation | Cooler and cooling device |
| USD757450S1 (en) | 2014-08-15 | 2016-05-31 | Kimberly-Clark Worldwide, Inc. | Tissue paper with embossing pattern |
| USD772184S1 (en) | 2014-12-24 | 2016-11-22 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD775091S1 (en) | 2014-08-19 | 2016-12-27 | Infineon Technologies Ag | Power semiconductor module |
| USD822626S1 (en) | 2016-11-21 | 2018-07-10 | Abl Ip Holding Llc | Heatsink |
| US10020237B2 (en) | 2014-10-30 | 2018-07-10 | Infineon Technologies Ag | Power semiconductor module and method for producing a power semiconductor module |
| US10297525B2 (en) | 2015-10-30 | 2019-05-21 | Byd Company Limited | Base plate for heat sink as well as heat sink and IGBT module having the same |
| US10302371B2 (en) | 2014-10-20 | 2019-05-28 | Signify Holding B.V. | Low weight tube fin heat sink |
| US20200102839A1 (en) | 2018-09-28 | 2020-04-02 | United Technologies Corporation | Ribbed pin fins |
| US20200144140A1 (en) | 2017-07-12 | 2020-05-07 | Abb Schweiz Ag | Power semiconductor module |
| JP1660547S (en) | 2018-09-12 | 2020-06-01 | ||
| US20200388556A1 (en) | 2017-11-30 | 2020-12-10 | Hitachi Automotive Systems, Ltd. | Power semiconductor device and manufacturing method of the same |
| US10957621B2 (en) | 2014-05-30 | 2021-03-23 | Avid Controls, Inc. | Heat sink for a power semiconductor module |
| US11071234B2 (en) | 2018-10-30 | 2021-07-20 | Board Of Trastees Of The University Of Arkansas | Helical fin design by additive manufacturing of metal for enhanced heat sink for electronics cooling |
| US11078847B2 (en) | 2017-08-25 | 2021-08-03 | Raytheon Technologies Corporation | Backside features with intermitted pin fins |
| US20210285727A1 (en) | 2020-03-10 | 2021-09-16 | University Of Maryland, College Park | Cross-flow heat exchanger systems and methods for fabrication thereof |
| USD942403S1 (en) * | 2019-10-24 | 2022-02-01 | Wolfspeed, Inc. | Power module having pin fins |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ITUB20153344A1 (en) * | 2015-09-02 | 2017-03-02 | St Microelectronics Srl | ELECTRONIC POWER MODULE WITH IMPROVED THERMAL DISSIPATION AND ITS MANUFACTURING METHOD |
| DE102015115271B4 (en) * | 2015-09-10 | 2021-07-15 | Infineon Technologies Ag | ELECTRONICS ASSEMBLY WITH SUPPRESSION CAPACITORS AND METHOD FOR OPERATING THE ELECTRONICS ASSEMBLY |
| USD954667S1 (en) * | 2017-01-13 | 2022-06-14 | Wolfspeed, Inc. | Power module |
| US10749443B2 (en) * | 2017-01-13 | 2020-08-18 | Cree Fayetteville, Inc. | High power multilayer module having low inductance and fast switching for paralleling power devices |
| US10212838B2 (en) * | 2017-01-13 | 2019-02-19 | Cree Fayetteville, Inc. | High power multilayer module having low inductance and fast switching for paralleling power devices |
-
2019
- 2019-10-24 US US29/710,592 patent/USD942403S1/en active Active
-
2020
- 2020-04-22 JP JPD2020-16753F patent/JP1683876S/ja active Active
- 2020-04-22 JP JPD2020-8293F patent/JP1682056S/ja active Active
- 2020-04-22 JP JPD2020-16754F patent/JP1683675S/ja active Active
-
2021
- 2021-12-29 US US29/821,330 patent/USD985517S1/en active Active
-
2023
- 2023-03-29 US US29/873,303 patent/USD1041429S1/en active Active
Patent Citations (61)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3421578A (en) | 1966-12-22 | 1969-01-14 | Louis L Marton | Heat dissipator |
| US3790859A (en) | 1970-02-19 | 1974-02-05 | Texas Instruments Inc | Electronic package header system having omni-directional heat dissipation characteristic |
| USD291845S (en) | 1983-11-23 | 1987-09-15 | Tonino Lamborghini | Textile fabric |
| US4638858A (en) | 1985-10-16 | 1987-01-27 | International Business Machines Corp. | Composite heat transfer device with pins having wings alternately oriented for up-down flow |
| USD341944S (en) | 1990-09-11 | 1993-12-07 | Merfin Hygienic Products Ltd. | Embossed tissue or similar article |
| US5241453A (en) | 1991-11-18 | 1993-08-31 | The Whitaker Corporation | EMI shielding device |
| US5725051A (en) | 1992-11-05 | 1998-03-10 | Level Energietechniek B.V. | Heat exchanger |
| USD364385S (en) | 1994-05-11 | 1995-11-21 | Fuji Electric Co., Ltd. | Semi-conductor element with terminal casing |
| USD398295S (en) | 1996-10-08 | 1998-09-15 | Chih Pin Chang | Heat dissipating plate for computer parts |
| US6601299B2 (en) | 2000-10-19 | 2003-08-05 | Ibc Corporation | Tapered fin and method of forming the same |
| US6952347B2 (en) | 2001-01-20 | 2005-10-04 | Conti Temic Microelectronic Gmbh | Power module |
| US20040150956A1 (en) | 2003-01-24 | 2004-08-05 | Robert Conte | Pin fin heat sink for power electronic applications |
| USD511251S1 (en) | 2003-02-19 | 2005-11-08 | The Procter & Gamble Company | Cleaning sheet |
| US7751192B2 (en) | 2005-05-05 | 2010-07-06 | Sensys Medical, Inc. | Heatsink method and apparatus |
| US20070119568A1 (en) | 2005-11-30 | 2007-05-31 | Raytheon Company | System and method of enhanced boiling heat transfer using pin fins |
| US20080066888A1 (en) | 2006-09-08 | 2008-03-20 | Danaher Motion Stockholm Ab | Heat sink |
| USD611255S1 (en) | 2006-11-29 | 2010-03-09 | The Procter & Gamble Company | Substrate with printed pattern |
| US20090145581A1 (en) | 2007-12-11 | 2009-06-11 | Paul Hoffman | Non-linear fin heat sink |
| US20090309524A1 (en) | 2008-06-13 | 2009-12-17 | Rider Jerald R | System and Method for Adding Voltages of Power Modules in Variable Frequency Drives |
| US9255745B2 (en) | 2009-01-05 | 2016-02-09 | Hamilton Sundstrand Corporation | Heat exchanger |
| USD622228S1 (en) | 2009-09-11 | 2010-08-24 | Foxsemicon Integrated Technology, Inc. | Heat dissipation apparatus |
| USD622230S1 (en) | 2009-11-02 | 2010-08-24 | Foxsemicon Integrated Technology, Inc. | Heat dissipation apparatus |
| USD627746S1 (en) | 2009-12-25 | 2010-11-23 | Foxsemicon Integrated Technology, Inc. | Heat dissipation apparatus |
| US8441275B1 (en) | 2010-01-14 | 2013-05-14 | Tapt Interconnect, LLC | Electronic device test fixture |
| US20120001227A1 (en) | 2010-06-18 | 2012-01-05 | Fuji Electric Co., Ltd. | Power semiconductor module |
| US20120207591A1 (en) | 2011-02-15 | 2012-08-16 | Ching-Pang Lee | Cooling system having reduced mass pin fins for components in a gas turbine engine |
| US20130105961A1 (en) | 2011-10-31 | 2013-05-02 | Infineon Technologies Ag | Low inductance power module |
| USD673124S1 (en) | 2011-12-28 | 2012-12-25 | Foxsemicon Integrated Technology, Inc. | Heat sink |
| USD672729S1 (en) | 2011-12-30 | 2012-12-18 | Foxsemicon Integrated Technology, Inc. | Heat sink |
| US9291404B2 (en) | 2012-02-24 | 2016-03-22 | Mitsubishi Electric Corporation | Cooler and cooling device |
| USD672154S1 (en) | 2012-03-01 | 2012-12-11 | Rockline Industries, Inc. | Wipe with pattern |
| US20140376184A1 (en) | 2012-04-16 | 2014-12-25 | Fuji Electric Co. Ltd. | Semiconductor device and cooler thereof |
| US20140029199A1 (en) | 2012-07-30 | 2014-01-30 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling apparatuses and electronics modules having branching microchannels |
| USD699908S1 (en) | 2012-08-04 | 2014-02-18 | Hangzhou Jeenor Cleaning Supplies Co., Ltd. | Big dot pattern wiper |
| US20140091453A1 (en) | 2012-10-02 | 2014-04-03 | Kabushiki Kaisha Toyota Jidoshokki | Cooling device and semiconductor device |
| US20140198475A1 (en) | 2013-01-17 | 2014-07-17 | Lear Corporation | Electrical busbar, electrical connector assembly and power converter |
| USD719537S1 (en) | 2013-05-08 | 2014-12-16 | Mitsubishi Electric Corporation | Semiconductor device |
| US20150137871A1 (en) | 2013-06-04 | 2015-05-21 | Panasonic Intellectual Property Management Co., Ltd. | Gate driver and power module equipped with same |
| US20150146377A1 (en) | 2013-11-26 | 2015-05-28 | Delta Electronics (Shanghai) Co., Ltd. | Power conversion device and method for assembling the same |
| US20150327394A1 (en) | 2014-05-07 | 2015-11-12 | International Business Machines Corporation | Multi-component heatsink with self-adjusting pin fins |
| US10957621B2 (en) | 2014-05-30 | 2021-03-23 | Avid Controls, Inc. | Heat sink for a power semiconductor module |
| USD757450S1 (en) | 2014-08-15 | 2016-05-31 | Kimberly-Clark Worldwide, Inc. | Tissue paper with embossing pattern |
| USD775091S1 (en) | 2014-08-19 | 2016-12-27 | Infineon Technologies Ag | Power semiconductor module |
| US10302371B2 (en) | 2014-10-20 | 2019-05-28 | Signify Holding B.V. | Low weight tube fin heat sink |
| US10020237B2 (en) | 2014-10-30 | 2018-07-10 | Infineon Technologies Ag | Power semiconductor module and method for producing a power semiconductor module |
| USD810706S1 (en) | 2014-12-24 | 2018-02-20 | Fuji Electric Co., Ltd | Semiconductor module |
| USD772184S1 (en) | 2014-12-24 | 2016-11-22 | Fuji Electric Co., Ltd. | Semiconductor module |
| JP1530509S (en) | 2014-12-24 | 2015-08-10 | ||
| US10297525B2 (en) | 2015-10-30 | 2019-05-21 | Byd Company Limited | Base plate for heat sink as well as heat sink and IGBT module having the same |
| USD822626S1 (en) | 2016-11-21 | 2018-07-10 | Abl Ip Holding Llc | Heatsink |
| US20200144140A1 (en) | 2017-07-12 | 2020-05-07 | Abb Schweiz Ag | Power semiconductor module |
| US11078847B2 (en) | 2017-08-25 | 2021-08-03 | Raytheon Technologies Corporation | Backside features with intermitted pin fins |
| US20200388556A1 (en) | 2017-11-30 | 2020-12-10 | Hitachi Automotive Systems, Ltd. | Power semiconductor device and manufacturing method of the same |
| JP1660547S (en) | 2018-09-12 | 2020-06-01 | ||
| JP1660593S (en) | 2018-09-12 | 2020-06-01 | ||
| JP1660592S (en) | 2018-09-12 | 2020-06-01 | ||
| USD903590S1 (en) | 2018-09-12 | 2020-12-01 | Cree Fayetteville, Inc. | Power module |
| US20200102839A1 (en) | 2018-09-28 | 2020-04-02 | United Technologies Corporation | Ribbed pin fins |
| US11071234B2 (en) | 2018-10-30 | 2021-07-20 | Board Of Trastees Of The University Of Arkansas | Helical fin design by additive manufacturing of metal for enhanced heat sink for electronics cooling |
| USD942403S1 (en) * | 2019-10-24 | 2022-02-01 | Wolfspeed, Inc. | Power module having pin fins |
| US20210285727A1 (en) | 2020-03-10 | 2021-09-16 | University Of Maryland, College Park | Cross-flow heat exchanger systems and methods for fabrication thereof |
Non-Patent Citations (3)
| Title |
|---|
| "IGBT power semiconductor module" M & E, published by Kogyo Chosakai, vol. 33, No. 7, Jul. 1, 2006, p. 137, Product No. KAL100, Special License Office Design Division Publicly known document No. HA1800853600 [With machine-generated translation]. |
| "Semiconductor devices for electric power" 2003 CVCF constant voltage, constant frequency uninterruptible power supply (UPS) catalog, 2004, Domestic Catalog No. 262, p. 3, Public Document No. HC1605031600, Design Division, Japan Patent Office; retrieved from the Internet on Mar. 1, 2005 [With machine-generated translation]. |
| German Design Bulletin, vol. 3, Feb. 25, 1995, p. 979, Register No. M9407438, Design Nos. M9407438-0001, M9407438-0002 and M9407438-0003; Public Document No. HH08013675, Design Division, Japan Patent Office [With machine-generated translation]. |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1036395S1 (en) * | 2018-09-12 | 2024-07-23 | Wolfspeed, Inc. | Power module |
| USD1041429S1 (en) * | 2019-10-24 | 2024-09-10 | Wolfspeed, Inc. | Power module having pin fins |
| USD1034492S1 (en) * | 2021-10-04 | 2024-07-09 | Transportation Ip Holdings, Llc | Housing for a full phase module gate drive |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1682056S (en) | 2021-03-29 |
| USD1041429S1 (en) | 2024-09-10 |
| USD942403S1 (en) | 2022-02-01 |
| JP1683876S (en) | 2021-04-19 |
| JP1683675S (en) | 2021-04-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| USD1036395S1 (en) | Power module | |
| USD883259S1 (en) | Earphone | |
| USD940130S1 (en) | Building control module | |
| USD940109S1 (en) | Earphones and case | |
| USD878300S1 (en) | Power strip | |
| USD871344S1 (en) | Power strip | |
| USD934860S1 (en) | Smart watch | |
| USD851595S1 (en) | Power connector | |
| USD905690S1 (en) | Building control module | |
| USD873200S1 (en) | Aircraft | |
| USD883219S1 (en) | Power strip tower | |
| USD902925S1 (en) | Building controller | |
| USD889431S1 (en) | Headphone | |
| USD985517S1 (en) | Power module having pin fins | |
| USD873201S1 (en) | Aircraft | |
| USD956418S1 (en) | Case for earphones | |
| USD914017S1 (en) | Building controller | |
| USD823237S1 (en) | Solar panel | |
| USD954668S1 (en) | Housing for a power module assembly | |
| USD905689S1 (en) | Building controller | |
| USD885340S1 (en) | Power inverter | |
| USD912121S1 (en) | Smart camera | |
| USD925445S1 (en) | Charging case | |
| USD916023S1 (en) | Waterproof electrical connector | |
| USD870786S1 (en) | Oil catch can |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |