TWM620938U - Computing system, and cooling device and cooling assembly for the same - Google Patents

Abstract

A cooling device for a computing system is disclosed. The device includes a heat sink, a base, and a cover. The heat sink includes a plurality of fins extending from a first section of the heat sink. The base includes a plurality of grooves on a first side. The plurality of grooves is configured to mate with at least a portion of the plurality of fins of the heat sink. The cover is configured to be coupled to the base and encapsulate the heat sink. The cover further includes two apertures, each aperture configured to be connected to a tube. A width of the plurality of fins of the heat sink is less than a width of the plurality of grooves of the base. A height of the heat sink is less than a height of an interior portion of the cover.

Description

Computing system and cooling device and cooling components used for it

The present disclosure relates to a method for cooling computing system components, and more particularly to a liquid cooling method for cooling server system components using a radiator.

Computer housings and other types of electronic devices often contain many electronic components that generate heat. Normally, the heat in the system is confined in the enclosure. Therefore, additional methods must be implemented to reduce the temperature of specific components or the entire system. The heat generated by each element also increases according to the increase in processing capacity. Therefore, overheating is a common issue, which may have a negative impact on the performance of the components in the system. Overheating will reduce efficiency and may cause long-term damage to components.

A common method to reduce the temperature of a computing system is to include one or more fans in the system to increase the flow of air. Increasing the flow of air in the system generally reduces the overall temperature of the system. However, it may be difficult to target a specific electronic component, which may generate more heat than other components, and therefore requires more cooling measures. Therefore, liquid cooling systems are usually used for direct, local cooling, because such systems have a higher heat transfer rate than fans. The liquid cooling system can be used as an alternative or with a fan.

Liquid cooling systems generally include a cooling assembly with a radiator, a cooling plate made of metal, and connections for pipes that guide the cooling liquid into and out of the cooling assembly. Cooling components are usually placed above components, such as processing units, which generate relatively high heat compared to other components in the system. Therefore, it is very important not to let the liquid leak from the cooling components, because the leaked coolant may cause damage to other parts of the system, especially the electrical components.

In addition, the radiator in the cooling assembly is usually placed in an orientation in which the protruding fins of the radiator extend from the bottom of the radiator. The role of the radiator's fins is to provide additional surface area, thereby increasing contact with air or liquid coolant. Therefore, the fins of the heat sink will increase the rate of heat dissipation. However, the orientation of such fins may not provide the most surface area closest to the heat source. In addition, many heat sinks are made of copper or aluminum and may not have the best thermal conductivity. Better thermal conductivity can increase the speed of heat dissipation, thereby reducing the time to cool system components.

Therefore, there is a need for a cooling system with a high heat dissipation rate. More specifically, it is necessary to design a heat sink with more surface area closer to the heat source. In addition, it is necessary to design a heat sink with high thermal conductivity. There is also a need to reduce the time it takes to use cooling components to cool the components in the computing system.

The term "embodiment" and similar terms are intended to broadly refer to all technical subjects within the scope of this disclosure and the following patent applications. Statements containing these terms should be understood not as the meaning or scope of the technical subject described herein or the scope of the patent application below. The embodiments of the disclosure involved in this article are defined by the scope of the patent application below, rather than by the new content. The new content is a high-level overview of various aspects of this disclosure and introduces some concepts, which will be further described in the detailed description section below. The new content is not intended to determine the key or necessary features of the subject matter of the requested application. The new content is not intended to be used in isolation to determine the scope of the application subject for protection. The technical subject should be understood with reference to the appropriate part of the entire specification of this disclosure, any or all of the drawings, and each claim item.

According to an aspect of the present disclosure, a cooling device for a computing system is disclosed. This device includes a radiator, a base and a cover. The heat sink includes a plurality of fins extending from the first part of the heat sink. The base includes a plurality of grooves on the first side. The grooves are configured to match at least a part of the fins of the heat sink. The cover system is configured to be coupled with the base and encapsulate the heat sink.

Another aspect of the present disclosure includes a cooling component for a computing system. The cooling component includes an inlet pipe, an outlet pipe and a device. The inlet pipe system is configured to convey liquid to the cooling assembly. The outlet pipe system is configured to output the liquid to the cooling assembly. This device includes a radiator, a base and a cover. The heat sink includes a plurality of fins extending from the first part of the heat sink. The base includes a plurality of grooves on the first side. The grooves are configured to match at least a part of the fins of the heat sink. The cover system is configured to be coupled with the base and encapsulate the heat sink. The cover body includes a connector connected to the inlet pipe to receive the inflow of the liquid coolant, and includes a connector connected to the outlet pipe to take away the liquid coolant.

The above new content is not intended to represent every embodiment or every aspect of the present disclosure. On the contrary, the foregoing only provides examples of some of the novel aspects and features described herein. When combined with the accompanying drawings and the scope of the attached patent application, the above-mentioned features and advantages, as well as other features and advantages of the present disclosure, will easily emerge from the following detailed description of representative embodiments and modes for realizing the present disclosure. According to the detailed description of the various embodiments and with reference to the drawings, other aspects of the present disclosure are clear and easy to understand for those skilled in the art, and these parts will be briefly described below.

Various embodiments have been described with reference to the drawings, in which similar reference signs are used throughout the drawings to designate similar or equivalent elements. These figures are not drawn to scale, just to illustrate the content of this disclosure. Several aspects of the disclosure are described below with reference to application examples for illustration. It should be understood that in order to provide a full understanding of this disclosure, many specific details, relationships and methods are listed. However, a person with ordinary knowledge in the relevant technical field will easily understand that the present disclosure can be implemented without one or more specific details, or implemented by other methods. In other cases, well-known structures or operations are not shown in detail to avoid obscuring the disclosure. The various embodiments are not limited by the illustrated behavior or sequence of events, as some behaviors may occur in a different sequence and/or simultaneously with other behaviors or events. In addition, not all the actions or events depicted need to be implemented in accordance with the method disclosed in this disclosure.

For example, elements and limitations that are disclosed in the abstract, new content, and implementations, but not clearly indicated in the scope of the patent application, should not be individually or collectively included in the scope of the patent application through implication, reasoning or other means. In this embodiment, unless otherwise stated, the singular includes the plural, and vice versa. The term "including" means "including but not limited to". In addition, similar words such as "about", "almost", "substantially", "approximately" can be used here to mean: "in", "close" or "almost in", or "in 3~5 %" or "within acceptable manufacturing tolerance" or any logical combination thereof.

The present disclosure relates to a method for cooling computing system components, and more specifically to a liquid cooling method, which uses a radiator to cool the components of the server system.

FIG. 1 is a perspective view of a computing system, such as but not limited to a server system 100. The server system 100 includes a plurality of cooling components 102 in a chassis 104. The server system 100 shown in the figure includes a chassis 104, a motherboard 106, a power supply 108, a series of connection ports 110, a series of coolant inlet pipes 112, a series of coolant outlet pipes 114, and electronic components 116. In other embodiments, the server system 100 may include more or less than the listed elements. The chassis 104 includes a top plate 118, a bottom plate 120, a first side wall 122, a second side wall 124, a front wall 126, and a rear wall 128 to enclose the electronic components of the server system 100. The top plate 118 and the bottom plate 120 are substantially perpendicular to the first side wall 122 and the second side wall 124.

In some embodiments, the electronic component 116 is a chip, such as a processing unit and a memory unit, including a high-density power chip. The electronic component 116 includes a set of cooled electronic components 117, wherein the cooled electronic component 117 has been cooled by the cooling assembly 102. A group of electronic components 116 are approximately located around the chassis 104 and placed on the bottom plate 120 between the first side wall 122 and the second side wall 124. Another set of electronic components 116 is roughly located between the front wall 126 and the rear wall 128. In this example, there are multiple cooling components 102 located above the electronic components 116. More specifically, the group of cooled electronic components 117 is located below the cooling assembly 102. The cooling assembly 102 may be located in the case 104, between the electronic components 116, or above the electronic components 116 to transfer heat from the electronic components 116. This set of inlet pipes 112 may be connected to a part of the cooling assembly 102. This set of outlet pipes 114 can also be connected to a part of the cooling assembly 102. The power source 108 may be located near the front wall 126. A series of connection ports 110 can also be located on the front wall 126. The main board 106 may be located at the part of the chassis 104 closest to the bottom plate 120 and the rear wall 128.

Each component of the server system 100, such as a processing unit, can dissipate, generate, generate, or radiate heat. Therefore, if the cooling mechanism is not implemented, the heat in the server system 100 may accumulate. The inlet pipe 112, the outlet pipe 114, and the cooling assembly 102 can function as a cooling system to circulate the liquid coolant to reduce the overall temperature in the case 104. More specifically, each cooling component 102 of the server system 100 can cool an element to a lower temperature by transferring heat to the liquid coolant provided by the inlet pipe 112. Therefore, the relatively low temperature of the cooling component 102 absorbs the surrounding heat of the components near the cooling component 102, such as the cooled electronic component 117 directly below the cooling component 102, so as to reduce the heat. Thereafter, the outlet pipe 114 removes the absorbed heat from the heated liquid coolant out of the cooling assembly 102. The heated liquid coolant circulates to an external heat exchanger (not shown), which removes the heat and recirculates the cooled liquid coolant through the inlet pipe 112. This process continues while the inlet pipe 112 and the outlet pipe 114 are operating, circulating liquid coolant to cool the system.

Fig. 2 is a cross-sectional view of the radiator 200 through which the liquid coolant is allowed to flow. The heat sink 200 may be a component of the cooling assembly 102 shown in FIG. 1. The heat sink 200 includes a top part 206 and a bottom part 208. As shown in the figure, the heat sink 200 has a substantially rectangular cross-section and is similar to a rectangular prism. A plurality of fins 202 extend from the top portion 206 of the heat sink 200. The plurality of fins 202 can extend the entire length of the top portion 206 of the heat sink 200. The heat sink 200 also has a left end 212 and a right end 214. The shape of each of the plurality of fins 202 may be substantially rectangular, and may extend from the top portion 206 to the bottom portion 208 at approximately the same distance. Therefore, each of the plurality of fins 202 may generally have the same length. The plurality of fins 202 may have a shape other than a rectangle, such as a triangle. A gap 210 is formed between each of the plurality of fins 202. Each gap 210 may be approximately the same size and shape, or may be a different size and shape, and extend to the bottom portion 208. In this embodiment, the heat sink 200 is made of graphite. In other embodiments, the heat sink 200 may be made of other metals that can absorb heat, such as copper or aluminum.

Fig. 3 is a cross-sectional view of the base 300 mated with the heat sink 200 shown in Fig. 2. The base 300 includes a top side 306, a bottom side 308, a left side 310 and a right side 312. In the illustrated embodiment, the base 300 has a substantially rectangular cross-section and is similar to an octagonal prism. In other embodiments, the shape may be similar to a hollow rectangle, pentagon, hexagon, heptagon, nine-sided, decagonal prism, or a prism with more sides. A plurality of grooves 302 extend from the top side 306 to the bottom side 308. The groove 302 does not extend the entire height of the base 300. In addition, the plurality of grooves 302 may not extend the entire length of the top surface 306. Therefore, the left side 310 and the right side 312 give the ends of the groove 302. In the illustrated embodiment, the base 300 is made of copper. In other embodiments, the base 300 may be made of another thermally conductive metal, such as aluminum or graphite. In some embodiments, the base 300 may also be a cooling plate. The shape of each of the plurality of grooves 302 may be substantially rectangular. In other embodiments, the plurality of grooves 302 may exhibit a shape other than a rectangle, such as a triangle. Generally speaking, the shape of the grooves 302 matches the shape of the fins 202.

FIG. 4 is a cross-sectional view of the cover 400 that cooperates with the base 300 shown in FIG. 3. As shown in the figure, the cover 400 has a substantially rectangular cross-section with a substantially circular cutout, such as a first circular hole 426 in the middle. The three-dimensional shape of the cover 400 is similar to a hollow octagonal prism. In other embodiments, the shape of the cover 400 may be similar to a hollow rectangular, pentagonal, hexagonal, heptagonal, nine-sided, decagonal prism, or a prism with more than ten sides. The cover 400 includes an outer part 402 and an inner part 404. The cover 400 also includes a top wall 406, a first side wall 408, a second side wall 410, a third side wall 412 (as shown in Figure 5), a fourth side wall 414, and a fifth side wall 416 (as shown in Figure 5), The sixth side wall 418 (as shown in FIG. 5 ), the seventh side wall 420, the eighth side wall 422, and the bottom opening 424. Each side wall 408-422 is substantially flat. In some embodiments, the cover 400 may include less than eight side walls, for example, four side walls. The first side wall 408 and the second side wall 410 may be parallel to each other. The third side wall 412 (as shown in FIG. 5) and the fourth side wall 414 may be parallel to each other. The fifth side wall 416 (as shown in FIG. 5) and the eighth side wall 422 may be parallel to each other. The sixth side wall 418 (as shown in FIG. 5) and the seventh side wall 420 may be parallel to each other. The cover 400 further includes a first circular hole 426 and a second circular hole 428 (shown in Figure 5). In this embodiment, the cover 400 is made of copper. In other embodiments, the cover 400 may be made of other metals, such as aluminum or graphite.

FIG. 5 is a perspective view of the cooling device 500 in a disassembled manner. The components of the cooling device 500 may include a radiator 200, a base 300 and a cover 400. The cooling device 500 may further include two pipes, such as an inlet pipe 112 and an outlet pipe 114 coupled with the first circular hole 426 and the second circular hole 428 in FIG. 1. When the components of the cooling device 500 are assembled together, the bottom portions 208 of the fins 202 of the heat sink 200 are inserted into the grooves 302 on the top edge 306 of the base 300. Therefore, at least a part of the plurality of fins 202 of the heat sink 200 is received in and matched with the plurality of grooves 302 of the base 300. Therefore, the width of the plurality of fins 202 of the heat sink 200 is smaller than the width of the plurality of grooves 302 of the base 300 because each fin 202 is received in each groove 302. Generally speaking, at least most of the fins 202 are matched with the grooves 302. In some embodiments, when the number of the fins 202 is less than the grooves 302, less than the majority of the fins 202 are matched with the grooves 302.

After the heat sink 200 and the base 300 are joined, the cover 400 is inserted above the base 300. When the cover 400 is coupled to the base 300, the cover 400 encapsulates the heat sink 200. Therefore, the height of the fins 202 of the heat sink 200 is smaller than the height of the cover 400 because when the fins 202 are matched with the grooves 302 of the base 300, the cover 400 is just assembled on the heat sink 200. The cover 400 can be coupled to the base 300 by welding the boundary edges of the cover 400 and the base 300 together, so that no liquid will leak from the cover 400. In other embodiments, the cover 400 may be welded or permanently adhered to the base 300. Therefore, the cover 400 and the base 300 may have the same overall shape. In other embodiments, the base 300 may be larger than the cover 400 to ensure that there is enough surface area to fix the cover 400 to the base 300.

FIG. 6 is a cross-sectional view of the cooling device 500. As shown in FIG. As shown in the figure and the front content, the fins 202 on the heat sink 200 are matched with the grooves 302 on the base 300, and the cover 400 is coupled to the base 300. Therefore, the length of the heat sink 200 is less than the length of the base 300. The inner part 404 of the cover 400 covers the entire heat sink 200. When the cover 400 and the base 300 are coupled, a seal is formed at the internal connection between the cover 400 and the base 300, so no liquid can flow out from the inside of the cooling device 500. This seal can fuse, connect, fix or otherwise connect the components together through welding, soldering, or adhesives that can withstand higher temperatures. The first round hole 426 and the second round hole (as shown in FIG. 5) are configured to be coupled with the pipe connection mechanism to allow liquid to flow into and out of the cooling device 500.

The cross-sectional view of the cooling device 500 also shows the first space 602, the second space 604 and the third space 606. The first space 602 is defined as between the top portion 206 of the heat sink 200 and the top wall 406 of the inner portion 404 of the cover 400. The second space 604 is defined as between the left end 212 of the heat sink 200 and the first side wall 408 of the inner portion 404 of the cover 400. The third space 606 is defined as between the right end 214 of the heat sink 200 and the second side wall 410 of the inner portion 404 of the cover 400. There may also be additional spaces not shown in Figure 6 between the other walls of the inner portion 404 of the cover 400 and the two ends of the heat sink 200. Therefore, the height of the heat sink 200 is smaller than the height of the inner portion 404 of the cover 400. Similarly, the length of the heat sink 200 is also less than the length of the cover 400.

Each space including the first space 602, the second space 604, and the third space 606 provides an additional flow path opportunity for the liquid coolant to flow from the first circular hole 426 to the second circular hole 428 (shown in Figure 5) . In addition, the gap 210 between the plurality of fins 202 may also provide a flow path opportunity for the liquid coolant to flow. The purpose of the liquid coolant is to reduce the temperature of the surrounding components of the cooling device 500 by absorbing the heat of the electronic components from the base 300 and the fins 202 of the heat sink 200. Liquid coolant can cool the component to a lower temperature by transferring heat to the liquid coolant. Examples of liquid coolants or cooling fluids may include water, deionized water, inhibited glycol (inhibited glycol) or any mixture of dielectric fluids, including ethylene glycol, propylene glycol, HFE-7100, HFE- 7300, R-134a.

FIG. 7 is a cross-sectional view showing the potential heat path between the heat sink 200 and the base 300 by arrow 704. For the purpose of enumeration, FIG. 7 shows a high-density power processing chip as the heat source 702. In other embodiments, other components of the computing system, such as dual in-line memory modules (DIMMs), processor chips, etc., can be used as heat sources. As the plurality of fins 202 are inserted into the plurality of grooves 302, compared to the situation where the heat sink 200 is in an inverted position, more is provided from the sides of the fins 202 and the sides of the grooves 302. The surface area can be used to reduce the temperature of the heat source 702. In addition, each gap 210 provides a space for liquid coolant to pass through. Therefore, there are more possible heat-absorbing surfaces near the heat source 702 for cooling the heat source 702. Arrow 704 shows an exemplary path through which heat may be transferred to cool when liquid coolant is used. Therefore, the base 300 can absorb the heat generated by the heat source 702 to reduce the heat. The heat absorbed from the base 300 is transferred to the liquid coolant, and the radiator 200 assists in absorbing the additional heat, thereby maintaining a lower temperature.

FIG. 8 is a perspective view of the cooling assembly 800 with the cover 400, showing the base 300 and the heat sink 200 in outline. The cooling assembly 800 includes a radiator 200, a base 300, a cover 400, an inlet pipe 806 and an outlet pipe 808. As shown in the figure, the first group of pipes 802 and the second group of pipes 804 are respectively used on the first round hole 426 and the second round hole 428 of the cover 400. The function of the first circular hole 426 and the second circular hole 428 is to fix the pipe carrying the liquid coolant to the cooling assembly 800. The first set of pipes 802 and the second set of pipes 804 can be used to connect one end of the inlet pipe 806 and the outlet pipe 808 to the cover 400, respectively. The first set of pipes 802 and the second set of pipes 804 can be replaced with pipe joints. The first set of pipes 802 and the second set of pipes 804 provide a liquid-tight seal, which minimizes the chance of leakage of the first round hole 426 and the second round hole 428.

The liquid coolant enters the cooling assembly 800 via the inlet pipe 806. The liquid coolant enters the first circular hole 426 from the inlet pipe 806, and then flows into the first cavity 810 formed by the opening between the cover 400, the left side 310 of the base 300 and the left end 212 of the radiator 200. Then, the liquid coolant flows through the radiator 200 through the plurality of fins 202 and/or any one of the first space 602, the second space 604, and the third space 606 described and shown in FIG. 6 in the front. Then, the liquid coolant flows into the second cavity 812 formed by the opening between the cover 400, the right side 312 of the base 300, and the right end 214 of the radiator 200. After that, the liquid coolant can continuously flow into the second circular hole 428 of the cover 400 and enter the outlet pipe 808 to leave the cooling assembly 800. Although the flow through the cooling assembly 800 is generally linear, some liquid coolant may accumulate in certain areas.

The liquid coolant reduces the temperature of the cooling assembly 800. Because the heat absorbed by the cooling component 800 can then be transferred to the liquid coolant, as a result, the temperature of the components surrounding the cooling component 800 in the server system 100 is lowered. Therefore, when the liquid coolant passes from the first cavity 810 of the cooling assembly 800 through the radiator 200 to the second cavity 812, the temperature of the liquid coolant will rise. Similarly, when the liquid coolant flows from the first circular hole 426 of the cover 400 to the second circular hole 428, its temperature will also increase. When the higher-temperature liquid coolant flows through the second cavity 812 of the cooling assembly 800, after absorbing the heat from different components of the server system 100 (as shown in Figure 1), it flows out of the second cavity of the cover 400 Two round holes 428.

Although various embodiments of the present disclosure have been described above, it should be understood that these embodiments are only presented by way of example, rather than limiting. Without departing from the spirit or scope of the present disclosure, numerous changes can be made to the disclosed embodiments according to the disclosure herein. Therefore, the breadth and scope of the present disclosure should not be limited by any of the foregoing embodiments. On the contrary, the scope of the present disclosure should be defined according to the scope of the following patent applications and their equivalents.

Although the disclosed embodiments have been illustrated and described in terms of one or more implementations, after reading and understanding this specification and the accompanying drawings, those skilled in the art will think of equivalent changes and Revise. In addition, although a particular feature of the present disclosure may only be disclosed for one of several embodiments, this feature can be combined with one or more other features of other embodiments, because for any given or specific application, this Features may be needed and advantageous.

The foregoing description of the embodiments, including the illustrated embodiments, is presented only for the purpose of illustration and description, and is not intended to exhaustively list or limit the precise form disclosed. For those of ordinary knowledge in the field, its numerous modifications, adaptations and uses will be clear and easy to understand.

The terms used herein are only used to describe specific embodiments, not to limit the content of this disclosure. The singular forms "a" and "the" as used herein mean that plural forms are also included, unless the context clearly dictates otherwise. In addition, when the terms "include", "have", "have", "have", "and" or their variants are used in the detailed description and/or the scope of the patent application, these terms are intended to be similar to the term "include" included.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as commonly understood by those skilled in the art. In addition, the terms defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in related technologies. Unless clearly defined in this article, they will not be interpreted in an idealized or over-formalized meaning.

100: server system 102: Cooling components 104: Chassis 106: Motherboard 108: Power 110: Port 112: inlet pipe 114: outlet pipe 116: electronic components 117: Cooled electronic components 118: top plate 120: bottom plate 122: first side wall 124: second side wall 126: front wall 128: back wall 200: radiator 202: Fins 206: top part 208: bottom part 210: gap 212: left end 214: right end 300: base 302: groove 306: top edge 308: Bottom 310: left 312: right 400: cover 402: External part 404: internal part 406: top wall 408: first side wall 410: second side wall 412: third side wall 414: fourth side wall 416: Fifth Side Wall 418: Sixth Side Wall 420: seventh side wall 422: Eighth Side Wall 424: bottom opening 426: first round hole 428: second round hole 500: cooling device 602: The First Space 604: Second Space 606: The Third Space 702: Heat Source 704: Arrow 800: Cooling components 802: The first set of pipe fittings 804: The second set of pipe fittings 806: inlet pipe 808: export pipe 810: first cavity 812: second cavity

From the following description of exemplary embodiments and with reference to the accompanying drawings, the content of the present disclosure and its advantages and drawings will be better understood. These drawings only describe exemplary embodiments, and therefore should not be regarded as limiting the scope of various embodiments or claims. Figure 1 is a perspective view of a computing system, and an exemplary cooling system is provided in the chassis of the computing system. Figure 2 is a cross-sectional view of an exemplary radiator that allows cooling fluid to flow through. Figure 3 is a cross-sectional view of an exemplary base, which fits with the heat sink of Figure 2. Figure 4 is a cross-sectional view of an exemplary top cover, which fits with the base of Figure 3. Fig. 5 is a perspective view of an exemplary cooling device in a disassembled manner. Fig. 6 is a cross-sectional view of the cooling device of Fig. 5. Figure 7 is a cross-sectional view of an exemplary heat path between the heat sink and the base. Figure 8 is a perspective view of an exemplary cooling assembly with a transparent top cover. Although the present disclosure is susceptible to various modifications and alternative forms, the specific implementation has been shown in the figure by way of example, and will be further described in detail herein. However, it should be understood that the purpose of this disclosure is not limited to the specific form disclosed. On the contrary, the present disclosure is intended to cover all modifications, equivalents, and alternative forms that fall within the spirit and scope of the present disclosure as defined by the scope of the attached patent application.

202: Fins

206: top part

210: gap

212: left end

214: right end

302: groove

306: top edge

308: Bottom

310: left

312: right

404: internal part

406: top wall

408: first side wall

410: second side wall

426: first round hole

500: cooling device

602: The First Space

604: Second Space

606: The Third Space

Claims (10)

A cooling device used in a computing system, the cooling device comprising: A heat sink having a plurality of fins, the fins extending from a first part of the heat sink; A base including a plurality of grooves on a first side, the grooves are configured to match at least a part of the fins of the heat sink; and A cover is configured to be coupled with the base and encapsulate the heat sink. The cooling device according to claim 1, wherein the cover further includes two holes, and each hole is configured to be connected to a pipe. The cooling device according to claim 1, wherein the width of the fins of the heat sink is smaller than the width of the grooves of the base; the height of the heat sink is smaller than the height of an inner part of the cover; the heat sink The length of the device is less than the length of the base. The cooling device according to claim 1, wherein the heat sink is formed of graphite, and wherein the cover and the base are formed of metal. A cooling component for a computing system, the cooling component includes: An inlet pipe configured to deliver liquid to the cooling assembly; An outlet pipe configured to output liquid to the cooling assembly; and A device including: A heat sink having a plurality of fins, the fins extending from a first part of the heat sink; A base including a plurality of grooves on a first side, the grooves are configured to match at least a part of the fins of the heat sink; and A cover body configured to be coupled to the base and package the radiator, wherein the cover body includes a connector connected to the inlet pipe to receive the inflow of the liquid coolant, and includes connection to the outlet pipe A connector to take away the liquid coolant. The cooling assembly according to claim 5, wherein the cover further includes two holes, and each hole is configured to be connected to the outlet pipe or the inlet pipe. The cooling assembly according to claim 5, wherein the width of the fins of the heat sink is smaller than the width of the grooves of the base; the height of the heat sink is smaller than the height of an inner part of the cover; the heat sink The length of the device is less than the length of the base. A computing system including: An inlet pipe capable of being coupled to a liquid coolant circulation system for conveying liquid coolant from the liquid coolant circulation system; An outlet pipe capable of being coupled to the liquid coolant circulation system for conveying the liquid coolant to the liquid coolant circulation system; An electronic component that generates heat; and A device thermally connected to the electronic component, the device comprising: A heat sink having a plurality of fins, the fins extending from a first part of the heat sink; A base including a plurality of grooves on a first side, the grooves are configured to match at least a part of the fins of the heat sink; and A cover is configured to be coupled to the base and package the heat sink, wherein the cover system is configured to be coupled to the inlet pipe and the outlet pipe. The computing system according to claim 8, wherein the cover further includes two holes, and each hole is configured to be connected to the outlet pipe or the inlet pipe. The computing system according to claim 8, wherein the width of the fins of the heat sink is smaller than the width of the grooves of the base; the height of the heat sink is smaller than the height of an inner part of the cover; the heat sink The length of the device is less than the length of the base.

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