TWM537774U - LED driving integrated component - Google Patents

Description

LED driving integrated component

This creation is related to a light-emitting diode, and in particular to a light-emitting diode driving integrated component.

Please refer to FIG. 1 , which is a conventional segmented linear constant current LED driving circuit, which is composed of a plurality of first light emitting diodes 1, a second light emitting diode 2, and a third number. The LED device 3 includes a voltage detecting unit, a switch control unit, a constant current unit, a first switch 6, and a semiconductor driving device 5. The second switch 7 and the third switch 8 are configured to detect, by the voltage detecting and determining unit, the rise, fall, and the transmission of the input voltage to the first switch 6 and the second switch. 7 and the third switch 8 performs a switching operation.

When the driving diode is used to drive the LED, the bridge rectifier 4 can be connected to the commercial power supply 9. When the input voltage rises to the ON voltage of the first LEDs 1, the semiconductor driving component 5 The switch control unit controls the first switch 6 to be turned on to illuminate the first light-emitting diodes 1 to generate a light source, and when the input voltage rises to the first light-emitting diodes 1 and the second light-emitting diodes When the sum of the on-voltages of the body 2, the semiconductor driving element 5 controls the first switch 6 to be turned off, and controls the second switch 7 to be turned on to illuminate the first light-emitting diodes 1 and the second light-emitting diodes The diode 2 generates a light source, and when the input voltage rises to the sum of the first light-emitting diodes 1, the second light-emitting diodes 2, and the on-voltages of the third light-emitting diodes 3, The semiconductor driving component 5 controls the first switch 6 and the second switch 7 to be turned off, and controls the third switch 8 to be turned on to illuminate the first light emitting diodes 1 and the second light emitting diodes 2 And the third light emitting diodes 3 generate a light source, if inputting electricity When dropped, the process and the results of the opposite.

Therefore, when the light-emitting diode is driven by the driving circuit, since one semiconductor driving element 5 is shared, the semiconductor driving element 5 must withstand all the power consumption increased by the external voltage rise, so that the semiconductor driving element 5 The temperature will rise sharply, further making it easy to malfunction and poor reliability, not only increasing the manufacturer's manufacturing process and time to market, but also improving the manpower, procurement and preparation costs of the manufacturer's subsequent maintenance.

In view of this, the creators of this case, after observing the above-mentioned deficiencies, adhered to the spirit of excellence and concentrating on research and improvement, and finally had the creation of this creation.

The main purpose of the present invention is to provide a light-emitting diode driving integrated component, which can be used to form a lighting component by combining the integrated components, simplifying the number of components of the conventional light-emitting diode driving circuit, and even averaging the power consumption to each On these integrated components, the temperature at which they work is reduced, further improving the reliability and stability of the lighting components.

In order to achieve the above object, the LED driving integrated component provided by the present invention can be used to form a lighting component by combining a plurality of integrated components, the integrated component includes a light emitting component, and a driving chip is disposed under the light emitting component. And a driving component is embedded in the driving component, and the driving component is electrically connected to the illuminating component, and is configured to drive the illuminating component to generate a light source.

The LED device of the present invention drives the integrated component, and when the driving chip of the lighting component is electrically connected to the power source, the driving chips respectively drive the light-emitting components to generate a light source, so that the power consumption is evenly distributed to each of the light-emitting diodes. Driving the wafer to increase the reliability and stability of the lighting assembly.

Please refer to FIG. 2 , which is a schematic cross-sectional view of the LED-integrated component of the first embodiment of the present invention, showing the state of using the circuit board process to complete the integrated component. The component 100 is configured to form a lighting assembly 200 by combining the number of integrated components 100. The integrated component 100 includes:

A illuminating member 10, wherein the illuminating member 10 can be a light emitting diode chip or a lamp bead package. In this embodiment, the illuminating member 10 can be a light emitting diode chip, and the illuminating member 10 can be It consists of a single or multiple packages or wafers connected in series or in parallel. The illuminating member 10 can also be a series or parallel combination of various different illuminating diode chips such as red, green, blue, ultraviolet light, and infrared light.

A driving chip 20 is disposed under the illuminating member 10 to avoid shielding the light generated above the illuminating member 10. The driving chip 20 is electrically connected to the illuminating member 10, wherein, in this embodiment, The driving chip 20 is electrically connected and fixed to the illuminating member 10 through a circuit board process. The illuminating diode driving integrated component 100 includes an uppermost illuminating member 10, and the illuminating member 10 is a illuminating diode chip. The driving wafer 20 includes a flip chip substrate 21 and a flip chip 22, and the top surface of the flip chip substrate 21 is combined with the adjacent heat conducting layer 11 under the illuminating member 10. The bottom surface of the flip chip substrate 21 is bonded to the flip chip 22. The peripheral side of the bottom surface of the flip chip substrate 21 is provided with a circuit board or a copper substrate. In this embodiment, the peripheral side of the bottom surface of the flip chip substrate 21 is A copper substrate 23 is convexly disposed.

In order to further understand the characteristics of this creation, the use of technical means and the expected results, we will describe the use of this creation, and believe that we can have a deeper and more specific understanding of this creation, as follows:

Please refer to FIG. 3 again, which is a circuit diagram of the lighting assembly 200. The lighting assembly 200 is composed of a plurality of integrated components 100 electrically connected in series to form a distributed structure of the lighting assembly 200. The driving chip 20 of the integrated component 100 is further electrically connected to a power source 400 through a power stabilizing component 300. The power stabilizing component 300 can be composed of a bridge rectifier, a voltage protection component, and a current protection component. When the power source 400 is turned on, the power stabilizing element 300 can provide stable power, so that the driving chips 20 of the integrated components 100 respectively drive the illuminating members 10 to generate a light source.

Please refer to FIG. 4 again, which is a schematic diagram of the use of the lighting component for the creation. When the lighting component 200 is used for illumination, the integrated components 100 are collectively disposed on the same circuit board 201 in series, and then The power stabilizing element 300 is electrically connected.

Compared with the conventional light-emitting diode driving circuit, the lighting assembly 200 of the present invention is composed of the integrated components 100, and the integrated components 100 respectively have the driving wafer 20, so when the lighting assembly 200 is subjected to external When the power of the voltage rise is consumed, it is evenly distributed to each of the driving chips 20, and the heat is transmitted to the circuit board 201, the air, and the outside to reduce the operating temperature of each of the driving elements 21, and reduce the overheating of the single components. The risk of failure of the lighting assembly 200 further enhances the reliability and stability of the lighting assembly 200.

Please refer to FIG. 5 again, which is another schematic diagram of the use of the illumination component. The illumination component 200 is used for illumination, and the integrated components 100 are connected in series with the wires 202, and then stabilized with the power supply. The component 300 is electrically connected.

Please refer to FIG. 6 again, which is a schematic cross-sectional view of the LED driving integrated component 100 of the second embodiment, which is formed by integrating the illuminating member 30 and the embedded driving chip 40, wherein the illuminating member 30 is integrated. The light-emitting diode package is mounted on a substrate 41 by a sealing material, and is bonded under the light-emitting member 30 by a copper pillar 42 formed by the substrate 41.

Hereby, the characteristics of this creation and its achievable expected effects are stated as follows:

The LED device of the present invention drives the integrated component, and when the driving chip of the lighting component is electrically connected to the power source, each of the driving chips respectively drives each of the light emitting components to generate a light source, so that the power consumption is evenly distributed to each of the light-emitting diodes. The wafer is driven to reduce the temperature during operation to increase the reliability and stability of the lighting assembly.

In summary, this creation has its excellent progress and practicality in similar products. At the same time, it has investigated the technical information about such structures at home and abroad. The same structure has not been found in the literature. This creation has already possessed new types of patent requirements, and applied for it according to law.

However, the above-mentioned ones are only one of the preferred embodiments of the present invention, and the equivalent structural changes in the application of the present specification and the scope of the patent application are intended to be included in the scope of the present patent.

(known)
1‧‧‧First Light Emitting Diode
2‧‧‧Second light-emitting diode
3‧‧‧ Third Light Emitting Diode
4‧‧‧Bridge rectifier
5‧‧‧Semiconductor drive components
6‧‧‧First switch
7‧‧‧Second switch
8‧‧‧third switch
9‧‧‧Power
(this creation)
100‧‧‧Lighting diode drive integrated components
10‧‧‧Lighting parts
11‧‧‧Conducting layer
20‧‧‧Drive chip
21‧‧‧ flip chip substrate
22‧‧‧Flip chip
23‧‧‧ copper substrate
30‧‧‧Lighting parts
40‧‧‧Drive chip
41‧‧‧Substrate
42‧‧‧ copper pillar
200‧‧‧Lighting components
201‧‧‧ circuit board
202‧‧‧Wire
300‧‧‧Power Stabilizing Components
400‧‧‧Power supply

Figure 1 is a schematic diagram of a conventional segmented linear constant current LED driving circuit. Fig. 2 is a schematic cross-sectional view showing the light-emitting diode driving integrated component of the first embodiment of the present invention. Figure 3 is a circuit diagram of the lighting assembly constructed in accordance with the above preferred embodiment of the present invention. Fig. 4 is a schematic view showing the use of the above preferred embodiment to constitute a lighting assembly. Fig. 5 is a schematic view showing another use of the lighting assembly of the above preferred embodiment of the present invention. Fig. 6 is a schematic cross-sectional view showing the light-emitting diode driving integrated component of the second embodiment of the present invention.

100‧‧‧Lighting diode drive integrated components

10‧‧‧Lighting parts

11‧‧‧Conducting layer

20‧‧‧Drive chip

21‧‧‧ flip chip substrate

22‧‧‧Flip chip

23‧‧‧ copper substrate

Claims (5)

A light-emitting diode driving integrated component is provided for combining a plurality of integrated components to form a lighting component, the integrated component comprising: a light-emitting component; a driving chip disposed under the light-emitting component and having a driving component embedded therein And the driving component is electrically connected to the illuminating member, and is configured to drive the illuminating member to generate a light source; thereby, when the driving component of the lighting component is electrically connected to the power source, each of the driving components respectively drives each of the driving components The illuminating member generates a light source, and the power consumption is evenly distributed to each of the driving components, thereby increasing the reliability and stability of the lighting component. The illuminating diode driving integrated component according to claim 1, wherein the illuminating member is a light emitting diode chip, and the driving light is bonded to the driving wafer under the illuminating member. The driving chip comprises a flip-chip substrate and a flip chip, the top surface of the flip chip substrate is combined with the adjacent heat conducting layer, the bottom surface of the flip chip substrate is combined with the flip chip, and the peripheral side of the bottom surface of the flip chip substrate is convexly disposed. Copper substrate. The illuminating diode driving integrated component according to claim 1, wherein the illuminating member is a light emitting diode package, and the driving chip is embedded in a substrate and formed by the substrate The copper pillar is coupled to the underside of the illuminating member. The illuminating diode driving integrated component according to claim 2, wherein the illuminating component is commonly disposed on a circuit board by a plurality of integrated components, and is connected in series or in parallel with each other, and the illuminating component of the integrated component It can be a series or parallel combination of various different light emitting diode chips such as red, green, blue, ultraviolet light and infrared light. The illuminating diode driving integrated component according to claim 1, wherein the illuminating component is composed of a plurality of integrated components that are connected in series with each other by wires.