92 五、新型說明： 【新型所屬之技術領域】 一本新型係有關於-種發光裝置，尤其是—種基板上具有至少 一發光二極體模組，且發光二極體模組係由多個發光二極體所組 成之發光裝置。 【先前技術】 隨著科技的日漸沿革，各類電子產品之發展亦日新月異。其 中電子產品’以照日錄置等背光模組為最，*大量地使用到發 光二極體(LightEmittingDi〇de，LED)，以作為其照明之光源。 由於發光二減具㈣用、輕巧、使轉命長且低耗電的優 點’因此發光二極體逐漸成為照明產業與半導體產業之主流。一 般而言’發光二極體可觀於裝置、液晶顯示器之背光模組 或是指示燈之光源。然而，於實務層面上而言，目前的發光二極 體光源存在有僅能以直流1 絲作齡货^也就是說，在使用市 電或是其他交流電源的情況之下，發光二極體光源將無法使用， 於此造成發光二極體應用上的受限。 有繁於此，目前業界遂發展出適於交流電源可使用之交流發 =二極體(Alternating Current LED，ACLED)，其透過橋式整流的 架構進行設計’令交流發光二極體可直接使用市電所提供的交流 電源4又而5，^父ΛΜ·電源各自形成正、負週期時，發光二極 體中將有部分被導通’而未被導通之發光二極體财、須承受逆向 偏壓；在此情況之下，發光二極體係㈣承受逆向，而當逆 M421592 向偏壓過大時’便會產生高逆向偏壓的漏電流(leakagecurrem)，導 致發光二極體晶粒的擊穿現象，或影響到整體發光二極體之發光 壽命’降低其可靠度(reliability)。 其次，承以前例而言，由於經橋式整流所驅動之該些發光二 極體並無法同時地被點亮，也就是說，僅有1/2之發光二極體區段 可被點亮’於此’將使得發光二極體之有效載荷細_)大幅下 降’影響發光效益。 是以’如何解決習知交流發光二極體耐壓受限的問題，並且 提供種可用以；!^*壓輸人市電’並具有較高有效載荷之發光 裝置，貫為相關領域者目前迫切需要解決的問題。 【新型内容】 ,鑒於以上’本新型在於提供一種發光裝置，藉以解決習知技 術所存在的問題。 本新型係錢於-歸光裝置，包括：—基板、多個整流二 極體與至少—發光二極體模組。其中，基板具有-表面，且基板 於喊面上開紗第—凹槽、第二凹槽與第三凹槽。整流二極體 '、置於第凹槽與第二凹槽中。發光二極體模組係設置於第二 凹槽中’且發光二極體模組包括多個發光二極體。 根據本新型之—實施例，其中發光二極體模組中之該些發光 極體可選擇性地以串聯或並聯方式連接。 根據本新型之一實施例，其中整流二極體可平均地設置於第 —凹槽與第三凹槽之中。 根據本新塑之一實施例’其中第一凹槽與第三凹槽其中之一 更包括多個次凹槽，每一次凹槽係用以容置每一整流二極體。每 一次凹槽之間可以一突出埠間隔之’且連接每一整流二極體之導 電走線係貫穿突出埠。 根據本新塑之一實施例’其中每一次凹槽之間可以二隔離部 間隔之’且連接每一整流二極體之導電走線係跨越該隔離部。 根據本新型之一實施例’發光裝置可包括多個該發光二極體 模組’其中每一發光二極體模組皆包括該些發光二極體，且該些 發光二極體模組係以陣列式設置於第二凹槽中。 根據本新型之一實施例，其中該些整流二極體包括一第一整 流二極體、一第二整流二極體、一第三整流二極體與一第四整流 二極體，第一整流二極體係串聯第二整流二極體，第三整流二極 體係串聯第四整流二極體，第一整流二極體與第二整流二極體之 間具有一第一交流節點’第三整流二極體與第四整流二極體間 具有一第二交流節點，第一交流節點與第二交流節點係承接一交 流電源，交流電源經過該些整流二極體之整流後輪出一直流電 源’以驅動發光二極體模組發光。 根據本新型之一實施例，其中該些發光二極體模組包括一第 一發光二極體模組、一第二發光二極體模組、—第三發光二極體 模組與一第四發光二極體模組，第一發光二極體模組係電性連接 第三發光二極體模組，第二發光二極體模組係電性連接第四發光 二極體模組、第二整流二極體與第四整流二極體，第三發光二極 M421592 體 模組係電性連接第-發先二極體模組 整流二極體。 # ^一極體與第三 I根據本新型之-實施例，射基板之底部與凹槽之間另且有 I底層導電走線、至少一頂層導電走線與至少-中芦導電走 導電趙倾胁絲導電植與獅導权 頂層導電祕包括-頂層第―導電走線、—騎第二導電走^、 一頂層第三輸層㈣編 包 =第-概㈣蝴 第二整流-極翁各自藉由底層導電走線連接交流電源，第—發 先二極體模組與第二發光二極體模組係各自藉由頂層第—導電走 線與頂層第四導電走線而電性連接於第三發光二極體模組與第四 發先f極體模組。第—整流二極體與第三整流二極體係各自藉由 中層第導電走線與中層第二導電走線而電性連接於第二整流二 極體與第四整流二極體，其中第二發光二極體模組與第三發光二 極體模組另各自藉由頂層$二導電走線朗層第三導電走線而電 性連接於第二整流二極體與第四整流二極體、以及第—整流二極 體與第三整流二極體。 根據本新型之-實施例，其中該些整流二極體與發光二極體 模組可同時配置於基板上之同—凹射，抑歧直接配置於基板 之上。 根據本新型之-實施例，其中基板之材質可歧低溫共燒陶 瓷(Low-Temperature Cofired Ceramics，LTCC) 〇 M421592 根據本新型之一實施例，其中發光二極體可經由打線接合 (wire bonding)或倒裝晶片安裝(flip _ b〇nding)於基板。 知上所述，根據本新型提出之發絲置，其係藉㈣流二極 -將乂⑼之後輸出直流電源，令該直流電源驅動發光二 極體模組發光。 其次，根據本新型提出之發光裝置，發光二極體模組更可選 擇由夕個相互串聯或並聯的發光二極體所組成，藉此提高發 光f置㈣壓’並且相較於習知之發光裝置，可具有較佳的有效 载荷。 ―、有關於本新型的内容說明’與以下的實施方式係用以示 範”解釋本新型的精神與原理，並且提供本_的專辦請範圍 更進=的解釋。有關本新型的特徵、實作與功效，該合圖式 作較佳實施例詳細說明如下。 【實施方式] 、下在μ%方式巾詳細敘述本新型之詳細特徵以及優點，並 内容足錢任何熟f_技藝者了解本新型之技_容並據以實 施’且根縣酬書所揭露之魄、申請專利翻及圖式，任何 …、白相關技勢者可輕易地轉本新動目關之目的及優點。92 5. New description: [New technical field] A new type of light-emitting device, in particular, has at least one light-emitting diode module on the substrate, and the light-emitting diode module is composed of A light-emitting device composed of two light-emitting diodes. [Prior Art] With the gradual evolution of technology, the development of various electronic products is changing with each passing day. Among them, the electronic products are the most suitable for backlight modules such as Japanese recordings. * A large number of Light Emitting Diodes (LEDs) are used as the light source for illumination. Due to the advantages of light-emitting two-conduction (four), light weight, long life and low power consumption, the light-emitting diode has gradually become the mainstream of the lighting industry and the semiconductor industry. In general, a light-emitting diode can be viewed from a device, a backlight module of a liquid crystal display, or a light source of an indicator light. However, on the practical level, the current light-emitting diode source has the ability to use only DC 1 wire as the age of goods. That is to say, in the case of using commercial power or other AC power source, the light-emitting diode light source It will not be used, which limits the application of the LED. In this case, the industry has developed an alternating current (ACLED) suitable for AC power supply, which is designed through the bridge rectification architecture to make the AC LEDs directly usable. The AC power supply provided by the mains is 4, and 5, when the father and the power supply form a positive and negative cycle, the light-emitting diode will be partially turned on and the light-emitting diodes that are not turned on will be subjected to the reverse bias. Under this condition, the light-emitting diode system (4) is subjected to the reverse direction, and when the reverse M421592 is biased too much, a high reverse bias current leakage (leakage curem) is generated, resulting in breakdown of the light-emitting diode crystal grains. The phenomenon, or affecting the luminous lifetime of the overall light-emitting diode', reduces its reliability. Secondly, in the previous example, the LEDs driven by the bridge rectification cannot be illuminated at the same time, that is, only 1/2 of the LED segments can be illuminated. 'This' will make the light-emitting diode's payload fine _) greatly reduced 'affecting luminous benefits. It is based on 'how to solve the problem that the conventional AC light-emitting diode is limited in withstand voltage, and provides a kind of light-emitting device that can be used to invert human-powered electricity and has a high payload. issues that need resolving. [New content] In view of the above, the present invention provides a light-emitting device for solving the problems of the prior art. The novel is a money-returning device, comprising: a substrate, a plurality of rectifying diodes and at least a light emitting diode module. Wherein, the substrate has a surface, and the substrate opens the first groove, the second groove and the third groove on the face. The rectifying diode ' is placed in the first groove and the second groove. The LED module is disposed in the second recess ′ and the LED module includes a plurality of LEDs. According to an embodiment of the present invention, the plurality of illuminating bodies in the illuminating diode module are selectively connectable in series or in parallel. According to an embodiment of the present invention, the rectifying diodes are evenly disposed in the first groove and the third groove. According to one embodiment of the present invention, wherein one of the first recess and the third recess further comprises a plurality of sub-grooves, each recess is for receiving each rectifying diode. Each of the grooves may protrude from the gap and the conductive trace connecting each of the rectifying diodes penetrates the protruding turns. According to one embodiment of the present invention, wherein each of the grooves may be spaced apart by two spacers and the conductive trace connecting each of the rectifying diodes spans the spacer. According to an embodiment of the present invention, a light-emitting device may include a plurality of the light-emitting diode modules, wherein each of the light-emitting diode modules includes the light-emitting diodes, and the light-emitting diode modules are The array is disposed in the second groove. According to an embodiment of the present invention, the rectifying diodes include a first rectifying diode, a second rectifying diode, a third rectifying diode, and a fourth rectifying diode. The rectifying diode system is connected in series with the second rectifying diode, the third rectifying diode system is connected in series with the fourth rectifying diode, and the first rectifying diode and the second rectifying diode have a first alternating current node 'third The second alternating current node has a second alternating current node between the rectifier diode and the fourth alternating current diode, and the first alternating current node and the second alternating current node are connected to an alternating current power source, and the alternating current power is rectified through the rectifying diodes. The power supply 'drives the light-emitting diode module. According to an embodiment of the present invention, the light emitting diode module includes a first light emitting diode module, a second light emitting diode module, a third light emitting diode module and a first The fourth light emitting diode module is electrically connected to the third light emitting diode module, and the second light emitting diode module is electrically connected to the fourth light emitting diode module. The second rectifying diode and the fourth rectifying diode, and the third luminous diode M421592 body module are electrically connected to the first-first diode module rectifying diode. #^一极体与第三第一1 According to the present invention, there is an I underlying conductive trace between the bottom of the substrate and the recess, at least one top conductive trace and at least - the middle conductive conductive conductive Tilting wire conductive plant and lion guide top conductive secrets include - top layer - conductive trace, - ride second conductive walk ^, a top third transport layer (four) package = first - (four) butterfly second rectifier - polar Each of the first and second LED modules is electrically connected to the second conductive trace through the top conductive trace and the second conductive trace through the bottom conductive trace. The third light emitting diode module and the fourth first f body module. The first-rectifying diode and the third rectifying diode are electrically connected to the second rectifying diode and the fourth rectifying diode, respectively, by the middle conductive trace and the middle second conductive trace, wherein the second The LED module and the third LED module are electrically connected to the second rectifying diode and the fourth rectifying diode by the top layer of the second conductive trace and the third conductive trace. And a first-rectifying diode and a third rectifying diode. According to the embodiment of the present invention, the rectifying diodes and the LED modules can be simultaneously disposed on the substrate, and the dissimilarity is directly disposed on the substrate. According to an embodiment of the present invention, the material of the substrate may be Low-Temperature Cofired Ceramics (LTCC) 〇 M421592. According to an embodiment of the present invention, the light emitting diode may be wire bonded. Or flip-chip mounting (flip _ b〇nding) on the substrate. As described above, according to the hairline set proposed by the present invention, the DC power source is outputted by the (four) current diode--(9), and the DC power source drives the light-emitting diode module to emit light. Secondly, according to the illuminating device proposed by the present invention, the illuminating diode module can be further composed of illuminating diodes connected in series or in parallel with each other, thereby improving the illuminating f (four) voltage and compared with the conventional illuminating The device can have a better payload. ―, the content description of the new model 'and the following embodiments are used for demonstration” to explain the spirit and principle of the new model, and to provide an explanation of the scope of the special _ _ _ _ _ _ _ _ _ The present invention will be described in detail below with reference to the preferred embodiments. [Embodiment] The detailed features and advantages of the present invention are described in detail in the μ% method, and the content is sufficient for any skilled person to understand this. The new technology _ 容 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。
立第斤圖」知為根據本新型實施例之發光裝置之等效電路示 %、圖帛1B圖」係為根據「第1A圖」之發光裝置之結構示意 、回-中發光裝置(LightEmittingDev^o可適於一交流電源， 並且由整流後之交流電源(即直流電源)所驅動而發光。在「第1B 7 M421592 圖」中為了簡化圖式起見’係省略了—些元件走線的特徵，詳細 的連接以及有關本新型提出的發光裝置10之特徵，請配合參見「第 2A圖」至「第2C圖」，茲詳細說明如下。 發光裝置H)包括-基板102，基板搬之材f可以是低溫共 燒陶瓷(L〇w-Temperature Cofired Ceramics，„ bm)、矽基板 ' Kt|g(HTCC Al2〇3)、或其他具有可 材質。基板102於其表面上開設有多個凹槽，包括：第一凹槽、 第二凹槽202與第三凹槽2〇3。其中第—凹槽2〇1、第二凹槽咖 與第三凹槽203係各自分離，且第二凹槽2〇2係形成於第一凹槽 2〇1與第三凹槽203之間。在本實施例中，第一凹槽2〇1與第」 槽203係定義為-第-配置區，第二凹槽2〇2係定義為一第二配 置區’使得第-配置區用以容置整流二極體，而第二配置區用以 容置發光二極體模組。 第一整流二極體l〇4a、第二整流二極體1〇4b、第三整流二極 體l〇4c與第四整流二極體1〇4d係設置於第一凹槽2〇1與第三凹 槽203之中。根據本新型之實施例，第一整流二極體1〇如、第二 整流二極體lG4b、第三整流二極體1G4e與第四整流二極體麵 可以平均地設置於第一凹槽201與該第三凹槽2〇3之中。換言之， 第二整流二極體l〇4b與第四整流二極體1〇4d可位於第一凹槽2〇1 中，且第一整流二極體104a與第三整流二極體1〇4c可位於第三 凹槽203中。 其中，第一凹槽201中更包括—凸設的突出埠 M421592 portion)201c。突出埠2〇lc用以將第一凹槽201區分為兩個次凹槽 201a、201b，使得次凹槽2〇la、2〇lb各自容置第四整流二極體1〇4d 與第二整流二極體l〇4b。在本實施例中，第一凹槽2〇1、第二凹 槽202、第三凹槽203以及次凹槽2〇la、2〇lb可藉由在基板102 上實施蝕刻製程(etchingprocess)來形成，換言之，突出埠2〇lc係 透過次凹槽201a、201b的蝕刻步驟後自然形成，其材質係同於基 板102之材料’例如：低溫共燒陶瓷(LTCC)等絕緣材質。在本新 型其他的實施例中，上述凹槽亦可藉由在基板1〇2上配置隔離部 (或稱隔離牆)來形成，以省卻製程上之複雜度(容後詳述）。導線走 線28電性連接第二整流二極體1〇4b與第四整流二極體1〇4d，並 且貫穿突出埠201c，以與「第2A圖」至「第2C圖」所示之導電 走線相連接。於此，當發光裝置1〇電性連接一高壓的輸入電源時， 突出埠201c可視作一電壓隔絕埠(v〇ltage_resistant p〇rti〇n)，並用 以隔絕第二整流二極體l〇4b與第四整流二極體1〇4d，藉此，本新 型提出的發光裝置10可具有較高的耐壓能力。 第一凹槽202中具有第一發光二極體模組1〇如、第二發光二 極體模組106b、第三發光二極體模組106c與第四發光二極體模組 106d。其中，第一發光二極體模組1〇6a、第二發光二極體模組 l〇6b、第二發光二極體模組1〇6c與第四發光二極體模組皆 由多個發光二極體所組成。其中，發光二極體可經由打線接合^〜^^ bonding)或倒裝晶片安裝(flip也中bonding)於基板1〇2之上。藉 此，本新型提出之發光裝置10，於後續的封裝程序中，可經由封 9 M421592 裝體(例如：環氧樹脂(Epoxy resin))填充於第一凹槽2〇1、第二凹 槽202與第二凹槽203中，完成整流二極體與發光二極體之整體 封裝結構。 在另一實施例中，第二凹槽202更可形成複數個子凹槽，以 刀別各5又刖述之發光二極體模組。在此實施例中，將會形成有四 個凹槽、五個凹槽或者更多凹槽之結構。 值得注意的是，本新型提出之發光裝置1〇係以第二凹槽2〇2 中具有四個發光二極體模組(包括第-發光二極雜組施、第二 發光二極體歡K)6b、第三發光二極體模組廳e與第四發光二極 體模M 106d)，且該些發光二極體模組係以陣列(matrix)排列於第 二凹槽2G2 + ’作為-實施例之說明。其中，發光二極體模組的 數量可以是但祕於四個，設計者#可根據實際發絲置的对壓 規格而設狀，發光二極體餘讀目並_嫌定本新型之新 型範圍。 其次，在-實施例中，為簡化突出埠2〇lc的製程複雜度，「第 】「C圖」係為根據「第ία圖」之發光裝置的另一種實施態樣。如 「第ic圖」所示’為取代突出璋2〇lc，發光裝置1〇可包括至少 -隔離部刚用以隔·流二極體與電性接點11〇。在此結構下， 導線走線28係藉由隔離部108之隔絕，而跨越隔離部1〇8之頂端 連接電性接點110至第二錢二域雜與第四整流二極體 l〇4d。同樣地，第一整流二極體_與第三整流二極體取c亦 透過隔離部⑽之隔絕而電性連接於電性接點削。隔離部则的 M421592 材質可以但非限定是二氧化矽玻璃組成。因此，在此實施例中， 發光裝置丨〇係透過額外配置的隔離部108取代「第1Β圖」中的 突出埠201c，進一步達到發光裝置兼具耐壓效果與省卻製程複雜 度之目的。 「第2A圖」至「第2C圖」係分別為根據本新型「第1B圖」 之發光裝置，其各層之導電走線(^]^)的佈局示意圖。其中，「第 2A圖」至「第2C圖」所示之導電走線皆位在基板1〇2之底部與 其凹槽之間的區塊，換言之，該些導電走線係埋置於基板1〇2的 本體中。詳細而言，「第2A圖」所示之走線係位於基板1〇2之本 體中的底層(bottom layer)，「第2C圖」所示之走線係位於基板1〇2 之本體中的頂層(top layer) ’而「第2B圖」所示之走線則位於基 板102之本體中的中層(middle layer)，即底層與頂層之間。第一貫 穿孔(via)30a、第二貫穿孔30b、第三貫穿孔30c與第四貫穿孔遍 係貝牙底層、中層與頂層，.以使得基板1〇2之本體中的各層走線 可相互電性導通，其中第一貫穿孔30a係用以電性連接第二整流 二極體104b與第四整流二極體1 〇4d，第二貫穿孔3〇b係用以電性 連接第一發光二極體模組106a與第四發光二極體模組1〇6d，第三 貫穿孔30c與第四貫穿孔30d係分別用以電性連接第三整流二極 體104c與第一整流二極體l〇4a。· 請配合參閱「第3A圖」與「第3B圖」，第一整流二極體1〇4a 與第二整流二極體104b之間具有一第一交流節點2〇，第三整流二 極體104c與第四整流二極體104d之間具有一第二交流節點22， 11 M421592 第一交流節點20與第二交流節點22係用以承接—交流電源(即「第 3入圖」與「第3B圖」所示之AC1、AC2)。其中，交流電源可以 是但不限於110伏特或22〇伏特(v)。當交流電源形成一正半週期 時，第一整流二極體104a、第一發光二極體模組106a、第二發光 二極體模組106b、第三發光二極體模組l〇6c、第四發光二極體模 組106d與第四整流二極體1〇4d形成一第—導通路徑。當交流電 源形成一負半週期時’第二整流二極體104b、第一發光二極體模 組106a、第二發光二極體模組106b、第三發光二極體模組、 第四發光二極體模組l〇6d與第三整流二極體1〇4c形成—第二導 通路徑。 接著，如「第2B圖」與「第2C圖」所示，位於中層之中層 第-導電走線2½係藉由第四貫穿孔謝連接第一整流二極體 104a與第二整流二極體腿，中層第二導電走線2北則藉由第三 貝穿孔30c連接第三整流二極體1〇4c與第四整流二極體1〇如。 位於頂層之頂層第一導電走線26a、頂層第二導電走線施、 頂層第二導電走線26e與頂層第四導電走線26d則用以連接各個 發光二極體模組。詳細來說’頂層第一導電走線26a係連接第一 發光二極雜組職與第三發光二極體歡職，頂層第二導電 走線26b係連接第二發光二極體模組1〇邠、第二整流二極體1〇4匕 與第四整流二極體胸，補第Z導電走線心係連接第三發光 二極體模組lG6e、第-整流二極體购與第三整流二極體刚c， 頂層第四導電走線26d係、連接第二發光二極體模組1〇61)與第四發 12 M421592 光二極體模組l〇6d。 根據本新型之實施例，第一整流二極體104a係串聯第二整流 二極體104b’第三整流二極體l〇4c係串聯第四整流二極體l〇4d。 因此，「第3A圖」與「第3B圖」係為根據「第1B圖」之發光裝 置之等效電路示意圖，其中，第一整流二極體l〇4a、第二整流二 極體104b、第三整流二極體104c與第四整流二極體104d係用以 整流交流電源為直流電源’以驅動第一整流二極體1〇知與第四整 _ 流二極體104d’以及第二整流二極體l〇4b與第三整流二極體i〇4c 之間的發光二極體模組發光。其中’每一發光二極體模組(第一發 光二極體模組106a、第二發光二極體模組106b、第三發光二極體 模組106c與第四發光二極體模組1〇6d)皆包括多個發光二極體 301 ’且該些發光二極體3〇1可選擇性地以串聯(如「第3八圖」） 或並聯(如「第3B圖」）的方式相互連接。 其中，第一發光二極體模組l〇6a、第二發光二極體模組1〇况 第二發光二極體模組106c與第四發光二極體模組l〇6d所包含 發光二極體30卜並不以連續串聯或連續並聯之電性連接方式 限。根據本新型之一實施例，該些發光二極體3〇1亦可以部分 聯’搭配部分串聯的結構形成，以利發光裝置在製作上具有彈, (flexibility)之優點。其次’當每一發光二極體模組皆包含有如 30個發光一極體301，且每一個發光二極體3〇1可用以承受3 , 特以上之逆向偏壓時’本新型提出之發光裝置ig之耐壓即^ 地被提升錢雜以上。1以，搞麵出之發樣置1〇和 13 M421592 於習知之照明S置更具有較高的有效載荷㈣load)，在無形中亦降 低了發光裝置電路的製作成本。 「第4A圖」係為根據本新型又一實施例之發光裝置之結構示 意圖，發光裝置10’包括有基板1〇2、第一整流二極體1〇4&、第二 整流二極體104b、第三整流二極體1〇4c、第四整流二極體l〇4d、 第一發光二極體模缸l〇6a、第二發光二極體模組l〇6b、第三發光 二極體模組106c與第四發光二極體模組1〇6d。其中，該些整流二 極體(第一整流二極體l〇4a、第二整流二極體i〇4b、第三整流二極 體104c與第四整流二極體丨〇4(1)以及該些發光二極體模組(第一發 光二極體模組106a、第二發光二極體模組106b、第三發光二極體 模組106c與第四發光二極體模組106d)之間的導電走線與電性連 接關係，請一併參閱「第5A圖」至「第5C圖」所示，其如同本 新型刖一貫施例「第2A圖」至「第2C圖」所言，故不再贅述； 唯不同的是，本新型又一實施例提出之發光裝置10，，其整流二極 體與發光二極體模組係共同配置於基板1〇2上的一凹槽2〇4中， 而僅以隔離部108相間隔之。藉此，發光裝置1〇,係透過第一整流 '一極體〗〇4a、苐.一整流一極體104b、第三整流二極體鱼第 四整流二極體l〇4d整流交流電源為直流電源，以驅動第一發光二 極體板組106a、第·一發光一極體模組l〇6b、第三發光二極體模組 l〇6c與第四發光二極體模組i〇6d發光，同樣可用來實施本新型之 新型目的。 其次，該些整流二極體與發光二極體模組亦不以設置於基板 14 M421592 102上之同一凹槽中為限。根據本新型之一實施例，如「第4B圖」 所不’凹槽204可被區分為一第一子凹槽204a與·一第二子凹槽 204b ’以分別容置整流二極體與發光二極體模組。換言之，在此 一貫施例中，第一子凹槽204a係定義為第一配置區，以用來容置 第一整流二極體l〇4a、第二整流二極體i〇4b、第三整流二極體l〇4c 與第四整流二極體104d。第二子凹槽204b係定義為第二配置區， 以用來容置第一發光二極體模組106a、第二發光二極體模組 籲 106b、第三發光二極體模組106c與第四發光二極體模組1〇6d。藉 此配置’第一整流二極體l〇4a、第二整流二極體i〇4b、第三整流 二極體.104c與第四整流二極體1〇4d可用以整流交流電源為直流 電源，以驅動第一發光二極體模組106a、第二發光二極體模組 l〇6b、第三發光二極體模組106c與第四發光二極體模組1〇6d發 光。 以上關於「第4A周」與「第4B圖」所示之發光裝置1〇，， 皆具有可以隔離部108隔絕第一整流二極體1〇4a、第二整流二極 體104b、第三整流二極體i〇4c與第四整流二極體⑴如於電性接 點110的實施態樣，其連接方式可配合參閱「第1C圖」所示。在 一實施例中，此一隔離部1〇8之材質例如可以是二氧化矽(si〇2)。 由於在基板1〇2上進行氧化製程，係為本領域具通常知織者所熟 知的技術，藉此，不僅可簡化發光裝置1〇，的製程步驟，亦。”、 步地降低其製作成本。 進一 同樣地，「第1B圖」至「第1C圖」所示之發光裝 i U)亦可 15 M421592 以利用製程步驟較容易的隔離部⑽來取代在基板1〇2上形成凹 槽的蝕刻步驟，其示意圖請配合參閱「第6A圖」與「第6β圖」。 在第6A圖」與「第6B圖」所示的實施例中，整流二極體與發 光二極體模組之間僅以多個隔離部108相間隔之，而省去了前述 形成凹槽的蝕刻步驟，亦可用以實現本新型之新型目的。 除此之外’由於一般而言’經整流二極體整流後所輸出的直 流電’尚非怪定的直流電|。因此’為了將交流電源整流產生穩 定的直流電，本新型任一實施例所揭露之發光裝置，另可配置一 個或一個以上的濾波電路，以降低交流電源的漣波，使得輸出電 壓平滑化。在-實酬巾，舰電路可選雜地在整流二極體的 輸出端加上—個能儲存電能的電容器，通常稱域波電容或平滑 電容(smoothing capacitor)，以穩壓整流後之輸出電壓。 紅上所述，本新型提出的發光裝置，不僅可藉由整流二極體 整流交流電源為直流f源，以驅動發光二紐發光。本新型提出 的發光裝置’更可藉由整流二極體與發光二極體分別設置於基板 上不同的凹槽中’以提高整體發光裝置的耐壓程度。 其次，本新型提出的發光裝置，其中發光二極體更不限於以 串聯或並聯的方式連接，藉此，每—發光二極體模組皆可包括多 個發光二極體，使得發光裝置之耐壓亦隨之有效提升。 根據本新型所揭露之發光裝置，在實際應用層面上，設計者 可選擇性地省卻凹槽的製作步驟，而直接將上述整流二極體、發 光-極體模组等設置於基板上’僅以隔離牆間隔之。此種做法亦 M421592 現本新型之新型目的，唯在此種實施例中，#發光裝置 端封襄W又時’仍需要其他特殊製程步驟來完成封裝體之 封裝。 雖…、本新型以前述的較佳實闕揭露如上，然其並非用以限 定本:型’任何熟習相像技藝者，在不脫離本新型之精神與範圍 ▲、田可作麵更動與潤飾，因此本新型之專利保護範圍須視本 兒月㈢所附之巾请專利範圍所界定者為準。 【圖式簡單說明】 第1A圖係為根據本新型實施例之發光裝置之等效電路示意 圖。 第出圖係為根據「第1A圖」之發光裂置之結構示意圖。 第ic圖係為根據「第1A圖」之發光裝置之結構示意圖。 第SI係為根據「第圖」之發光裝置之底層導電走線的 佈局示意圖。 第2B圖係為根據「第1B圖」之發光裝置之中層導電走線的 佈局示意圖。 第2C圖係為根據「第1B圖」之發光裝置之頂層導電走線的 佈局示意圖。 第3A圖係為根據「第1B圖」之發光裝置具有串聯發光二極 體之等效電路示意圖。 第3B圖係為根據「第iB圖」之發光裝置具有並聯發光二極 體之等效電路示意圖。 17 M421592 第4A圖係為根據本新型又一實施例之發光裝置之結構示意 圖。 第4B圖係為根據本新型又一實施例之發光裝置之結構示意 圖。 第5A圖係為根據「第4八圖」之發光裝置之底層導電走線的 佈局示意圖。 第5B圖係為根據「第4A圖」之發光裝置之中層導電走線的 佈局示意圖。 第5C圖係為根據「第4A圖」之發光裝置之頂層導電走線的 佈局示意圖.。 第6A圖係為根據本新型又一實施例之發光裝置之結構示意 圖。 、"Equivalent circuit diagram of the illuminating device according to the present embodiment, and Fig. 1B" is a schematic diagram of the structure of the illuminating device according to "Fig. 1A", and the back-to-middle illuminating device (LightEmittingDev^) o can be adapted to an AC power source, and is driven by the rectified AC power source (ie, DC power source) to emit light. In the "1B 7 M421592 diagram", in order to simplify the drawing, the system is omitted. Features, detailed connections, and features of the light-emitting device 10 proposed in the present invention, please refer to "2A" to "2C", as described in detail below. The light-emitting device H) includes a substrate 102, a substrate material f may be a low temperature co-fired ceramic (L〇w-Temperature Cofired Ceramics, „bm), a ruthenium substrate 'Kt|g (HTCC Al2〇3), or other materials. The substrate 102 has a plurality of concaves on its surface. The groove includes: a first groove, a second groove 202 and a third groove 2〇3, wherein the first groove 2〇1, the second groove coffee and the third groove 203 are separated from each other, and the second The groove 2〇2 is formed between the first groove 2〇1 and the third groove 203. In the embodiment, the first groove 2〇1 and the first groove 203 are defined as a -th-arrangement area, and the second groove 2〇2 is defined as a second arrangement area such that the first-arrangement area is used for accommodating The rectifier diode is used, and the second configuration area is used for accommodating the LED module. The first rectifying diode l〇4a, the second rectifying diode 1〇4b, the third rectifying diode l〇4c and the fourth rectifying diode 1〇4d are disposed in the first recess 2〇1 and Among the third grooves 203. According to the embodiment of the present invention, the first rectifying diode 1 , for example, the second rectifying diode 1G4b, the third rectifying diode 1G4e and the fourth rectifying diode plane may be evenly disposed on the first recess 201 And the third groove 2〇3. In other words, the second rectifying diode 104b and the fourth rectifying diode 1〇4d may be located in the first recess 2〇1, and the first rectifying diode 104a and the third rectifying diode 1〇4c It may be located in the third recess 203. Wherein, the first groove 201 further includes a protruding protrusion M421592 portion 201c. The protrusion 〇 2 〇 lc is used to divide the first groove 201 into two sub-grooves 201a, 201b, so that the sub-grooves 2〇1, 2〇 lb each accommodate the fourth rectifying diode 1〇4d and the second The rectifier diode l〇4b. In this embodiment, the first recess 2 〇1, the second recess 202, the third recess 203, and the secondary recesses 2〇1, 2〇1b can be performed by performing an etching process on the substrate 102. Forming, in other words, the protrusion 〇2 lc is naturally formed by the etching step of the sub-grooves 201a, 201b, and the material is the same as the material of the substrate 102, such as an insulating material such as low temperature co-fired ceramic (LTCC). In other embodiments of the present invention, the recess may be formed by disposing a spacer (or a spacer) on the substrate 1 2 to eliminate the complexity of the process (detailed later). The wire trace 28 is electrically connected to the second rectifying diode 1〇4b and the fourth rectifying diode 1〇4d, and penetrates the protruding port 201c to conduct electricity as shown in “A2A” to “2C”. The wires are connected. Here, when the light-emitting device 1 is electrically connected to a high-voltage input power source, the protruding port 201c can be regarded as a voltage isolation port (v〇ltage_resistant p〇rti〇n), and is used to isolate the second rectifying diode l〇4b. And the fourth rectifying diode 1 〇 4d, whereby the illuminating device 10 proposed by the present invention can have a higher withstand voltage capability. The first recess 202 has a first LED module 1, for example, a second LED module 106b, a third LED module 106c and a fourth LED module 106d. The first light emitting diode module 1〇6a, the second light emitting diode module l〇6b, the second light emitting diode module 1〇6c and the fourth light emitting diode module are all composed of multiple It consists of a light-emitting diode. The light emitting diodes may be mounted on the substrate 1〇2 via wire bonding or flip chip mounting. Therefore, the light-emitting device 10 proposed by the present invention can be filled in the first groove 2〇1 and the second groove via a package 9 M421592 (for example, epoxy resin) in a subsequent packaging process. In the 202 and the second recess 203, the overall package structure of the rectifying diode and the light emitting diode is completed. In another embodiment, the second recess 202 can further form a plurality of sub-grooves to illuminate the LED modules. In this embodiment, a structure having four grooves, five grooves or more grooves will be formed. It is worth noting that the light-emitting device 1 of the present invention has four light-emitting diode modules in the second recess 2〇2 (including the first-light-emitting diode group and the second light-emitting diode). K) 6b, the third light emitting diode module chamber e and the fourth light emitting diode module M 106d), and the light emitting diode modules are arranged in a matrix in the second groove 2G2 + ' As an illustration of the embodiment. Among them, the number of the light-emitting diode modules can be but the secret is four, the designer # can be set according to the actual pressure setting of the hairline, the light-emitting diodes are read and the new range of the new type is suspected. . Next, in the embodiment, in order to simplify the process complexity of highlighting 〇2〇lc, "C" is a different embodiment of the illuminating device according to the "Fig. As shown in "the ic diagram", instead of the protrusion 〇2〇lc, the illuminating device 1 〇 may include at least the isolation portion just used to separate the current and the diode and the electrical contact 11 〇. In this configuration, the wire traces 28 are isolated by the isolation portion 108, and the electrical contacts 110 are connected across the top of the isolation portion 1〇8 to the second money domain and the fourth rectifier diode l〇4d. . Similarly, the first rectifying diode _ and the third rectifying diode taking c are also electrically isolated from the electrical contact by the isolation of the isolation portion (10). The M421592 material in the isolation section can be composed of, but not limited to, cerium oxide glass. Therefore, in this embodiment, the illuminating device 取代 is replaced by the additionally disposed spacer 108 instead of the protruding 埠 201c in the "first drawing", thereby further achieving the purpose of the illuminating device having both the withstand voltage effect and the process complexity. The "2A" to "2C" drawings are schematic views of the layout of the conductive traces (^) of the respective layers of the light-emitting device according to the "Fig. 1B" of the present invention. The conductive traces shown in the "2A" to "2C" are all located between the bottom of the substrate 1〇2 and the groove thereof. In other words, the conductive traces are buried on the substrate 1. In the body of 〇2. Specifically, the trace shown in "Fig. 2A" is located in the bottom layer of the substrate 1 〇 2, and the trace shown in "Fig. 2C" is located in the body of the substrate 1 〇 2 The top layer 'and the trace shown in FIG. 2B is located in the middle layer of the body of the substrate 102, that is, between the bottom layer and the top layer. The first through hole 30a, the second through hole 30b, the third through hole 30c and the fourth through hole pass through the bottom layer, the middle layer and the top layer of the shell, so that the layers in the body of the substrate 1〇2 can be traced. The first through hole 30a is electrically connected to the second rectifying diode 104b and the fourth rectifying diode 1 〇4d, and the second through hole 3〇b is electrically connected to the first The light emitting diode module 106a and the fourth light emitting diode module 1〇6d, the third through hole 30c and the fourth through hole 30d are respectively electrically connected to the third rectifying diode 104c and the first rectifying diode Polar body l〇4a. · Please refer to "3A" and "3B". The first rectifying diode 1〇4a and the second rectifying diode 104b have a first alternating current node 2〇 and a third rectifying diode. Between the 104c and the fourth rectifying diode 104d, there is a second AC node 22, 11 M421592. The first AC node 20 and the second AC node 22 are used to receive AC power (ie, "3rd drawing" and "No. AC1, AC2) shown in Figure 3B. The AC power source can be, but is not limited to, 110 volts or 22 volts (v). When the AC power source forms a positive half cycle, the first rectifying diode 104a, the first LED module 106a, the second LED module 106b, and the third LED module l6c, The fourth LED module 106d and the fourth rectifying diode 1〇4d form a first conduction path. When the AC power source forms a negative half cycle, the second rectifying diode 104b, the first LED module 106a, the second LED module 106b, the third LED module, and the fourth illumination The diode module l〇6d forms a second conduction path with the third rectifying diode 1〇4c. Next, as shown in "2B" and "2C", the first-level conductive trace 21⁄2 in the middle layer is connected to the first rectifying diode 104a and the second rectifying diode through the fourth through-hole. The leg, the middle second conductive trace 2 is connected to the third rectifying diode 1〇4c and the fourth rectifying diode 1 by the third beacon perforation 30c. The top layer of the first conductive traces 26a, the top layer of the second conductive traces, the top layer of the second conductive traces 26e and the top layer of the fourth conductive traces 26d are used to connect the respective light emitting diode modules. In detail, the top layer of the first conductive trace 26a is connected to the first light-emitting diode and the third light-emitting diode, and the second conductive trace 26b is connected to the second light-emitting diode module.邠, the second rectifying diode 1〇4匕 and the fourth rectifying diode chest, the complementing the Z-conducting wiring center is connected to the third illuminating diode module lG6e, the first-rectifying diode purchase and the third The rectifying diode is just c, the top fourth conductive trace 26d is connected to the second light emitting diode module 1〇61) and the fourth 12 M421592 optical diode module l〇6d. According to an embodiment of the present invention, the first rectifying diode 104a is connected in series with the second rectifying diode 104b', and the third rectifying diode 10b is connected in series with the fourth rectifying diode 10b. Therefore, "3A" and "3B" are equivalent circuit diagrams of the light-emitting device according to "1B", wherein the first rectifying diode 104a, the second rectifying diode 104b, The third rectifying diode 104c and the fourth rectifying diode 104d are used for rectifying the alternating current power source into a direct current power source 'to drive the first rectifying diode 1 and the fourth whole _current diode 104d' and the second The light emitting diode module between the rectifying diode l〇4b and the third rectifying diode i〇4c emits light. Wherein each of the light emitting diode modules (the first light emitting diode module 106a, the second light emitting diode module 106b, the third light emitting diode module 106c and the fourth light emitting diode module 1) 〇6d) includes a plurality of light-emitting diodes 301' and the light-emitting diodes 3〇1 can be selectively connected in series (such as "3rd 8th") or in parallel (such as "3B") Connected to each other. The first LED module l〇6a, the second LED module 1, the second LED module 106c, and the fourth LED module 10〇6d include two LEDs. The polar body 30 is not limited by the electrical connection of continuous series or continuous parallel connection. According to an embodiment of the present invention, the light-emitting diodes 3〇1 may also be formed in a partially-connected portion in series to ensure that the light-emitting device has the advantage of flexibility in fabrication. Secondly, when each of the light-emitting diode modules includes, for example, 30 light-emitting diodes 301, and each of the light-emitting diodes 3〇1 can be used to withstand a reverse bias of 3 or more, the light emitted by the present invention The pressure resistance of the device ig is improved. 1、,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, FIG. 4A is a schematic view showing the structure of a light-emitting device according to still another embodiment of the present invention. The light-emitting device 10' includes a substrate 1 and 2, a first rectifying diode 1〇4& and a second rectifying diode 104b. a third rectifying diode 1〇4c, a fourth rectifying diode l〇4d, a first illuminating diode mold cylinder 〇6a, a second illuminating diode module 〇6b, and a third illuminating diode The body module 106c and the fourth light emitting diode module 1〇6d. The rectifying diodes (the first rectifying diode 104a, the second rectifying diode i〇4b, the third rectifying diode 104c, and the fourth rectifying diode 丨〇4(1) and The light emitting diode modules (the first light emitting diode module 106a, the second light emitting diode module 106b, the third light emitting diode module 106c and the fourth light emitting diode module 106d) For the relationship between the conductive traces and the electrical connections, please refer to the "5A" to "5C" diagrams as they are described in the "Examples 2A" to "2C". Therefore, the light-emitting device 10 of another embodiment of the present invention has a rectifying diode and a light-emitting diode module disposed together on a groove 2 of the substrate 1〇2. In the 〇4, only the isolation portion 108 is spaced apart. Thereby, the illuminating device 1 透过 passes through the first rectifying body 1a, 4a, a rectifying body 104b, and a third rectifying diode The fish fourth rectifying diode l〇4d rectifying AC power source is a DC power source to drive the first LED array 106a, the first one LED module l〇6b, and the third The diode module l〇6c and the fourth LED module i〇6d emit light, which can also be used to implement the novel object of the present invention. Secondly, the rectifying diode and the LED module are not It is disposed in the same groove on the substrate 14 M421592 102. According to an embodiment of the present invention, the groove 204 can be divided into a first sub-groove 204a and a first The two sub-grooves 204b' respectively accommodate the rectifying diode and the LED module. In other words, in the consistent embodiment, the first sub-groove 204a is defined as a first configuration area for accommodating a first rectifying diode 104a, a second rectifying diode i〇4b, a third rectifying diode 104a and a fourth rectifying diode 104d. The second sub-groove 204b is defined as a second configuration The illuminating diode module 106a, the second illuminating diode module 106b, the third illuminating diode module 106c and the fourth illuminating diode module 〇6d are disposed. Thereby, the first rectifying diode l〇4a, the second rectifying diode i〇4b, the third rectifying diode .104c and the fourth rectifying diode 1〇4d are configured. The rectified AC power source is a DC power source for driving the first LED module 106a, the second LED module 106, the third LED module 106c and the fourth LED module The group 1 〇 6d illuminates. The illuminating device 1 所示 shown in the "4A week" and "4B" has the isolation portion 108 to isolate the first rectifying diode 1 〇 4a and the second rectifying diode. For the embodiment of the body 104b, the third rectifying diodes i4c and the fourth rectifying diodes (1) as in the electrical contact 110, the connection manner can be referred to as shown in "FIG. 1C". In an embodiment The material of the partition portion 1〇8 may be, for example, cerium oxide (si〇2). Since the oxidation process is performed on the substrate 1A2, it is a technique known to those skilled in the art, whereby the process steps of the light-emitting device can be simplified. In the same way, the light-emitting device i U shown in "1B to "1C" can also be replaced by the isolation portion (10) which is easier to use the process step. The etching step of forming the groove on 1〇2, please refer to “6A” and “6β” for the schematic diagram. In the embodiment shown in FIG. 6A and FIG. 6B, the rectifier diode and the LED module are separated by a plurality of spacers 108, and the aforementioned recess is omitted. The etching step can also be used to achieve the novel object of the present invention. In addition to this, the DC current output by the rectified diode is generally not a strange DC. Therefore, in order to rectify the alternating current power to generate a stable direct current, the light-emitting device disclosed in any of the embodiments of the present invention may further configure one or more filter circuits to reduce the chopping of the alternating current power source to smooth the output voltage. In the actual pay towel, the ship circuit can be mixed with a capacitor that can store electrical energy at the output end of the rectifying diode, usually called a domain wave capacitor or a smoothing capacitor, to stabilize the output after rectification. Voltage. According to the red, the light-emitting device proposed by the present invention can not only drive the alternating current source of the rectified diode to be a direct current f source, but also drive the light-emitting two-button illumination. The light-emitting device of the present invention can be further provided in a different groove on the substrate by the rectifying diode and the light-emitting diode respectively to improve the withstand voltage of the overall light-emitting device. Secondly, in the light-emitting device of the present invention, the light-emitting diodes are not limited to being connected in series or in parallel, whereby each of the light-emitting diode modules may include a plurality of light-emitting diodes, so that the light-emitting device The withstand voltage is also effectively improved. According to the light-emitting device disclosed in the present invention, on the practical application level, the designer can selectively eliminate the manufacturing steps of the groove, and directly set the rectifying diode, the light-polar body module and the like on the substrate. Intersected by the wall. In this way, M421592 is also a new type of object of the present invention. In this embodiment, the illuminating device is further sealed and requires other special processing steps to complete the package of the package. Although the present invention is disclosed above in the above preferred embodiment, it is not intended to limit the type: any skilled artisan, without departing from the spirit and scope of the present invention, and can be modified and retouched. Therefore, the scope of patent protection of this new type shall be subject to the definition of the patent scope of the towel attached to this month (3). BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A is an equivalent circuit diagram of a light-emitting device according to an embodiment of the present invention. The first drawing is a schematic view of the structure of the luminescent slit according to "Fig. 1A". The ic diagram is a schematic structural view of a light-emitting device according to "A-1A". The SI is a schematic diagram of the layout of the underlying conductive traces of the illuminating device according to the "figure". Fig. 2B is a schematic view showing the layout of the conductive traces in the light-emitting device according to the "Fig. 1B". Fig. 2C is a schematic view showing the layout of the top conductive traces of the light-emitting device according to "Fig. 1B". Fig. 3A is a schematic diagram showing an equivalent circuit of a light-emitting device having a series-connected light-emitting diode according to "Fig. 1B". Fig. 3B is a schematic diagram showing an equivalent circuit of a light-emitting device according to the "i-th diagram" having parallel light-emitting diodes. 17 M421592 Fig. 4A is a schematic view showing the structure of a light-emitting device according to still another embodiment of the present invention. Fig. 4B is a schematic view showing the structure of a light-emitting device according to still another embodiment of the present invention. Fig. 5A is a schematic view showing the layout of the underlying conductive traces of the illuminating device according to "Ath 4th". Fig. 5B is a schematic view showing the layout of the conductive traces in the light-emitting device according to "Fig. 4A". Figure 5C is a schematic diagram of the layout of the top conductive traces of the illuminating device according to "Ath 4A". Fig. 6A is a schematic view showing the structure of a light-emitting device according to still another embodiment of the present invention. ,
第6B圖係為根據本新型又一實施例之發光裝置之結構示意 【主要元件符號說明】 10 10, 20 22 24a 24b 26a 發光裝置 發光裝置 第一交流節點 第二交流節點 中層第一導線走線 中層第二導線走線 頂層第一導電走線 M4215926B is a schematic structural diagram of a light-emitting device according to still another embodiment of the present invention. [Main component symbol description] 10 10, 20 22 24a 24b 26a Light-emitting device light-emitting device First AC node Second AC node middle layer first wire trace Middle second wire trace top layer first conductive trace M421592
26b 頂層第二導電走線 26c 頂層第三導電走線 26d 頂層第四導電走線 28 導線走線 30a 第一貫穿孔 30b 第二貫穿孔 30c 第三貫穿孔 30d 第四貫穿孔 102 基板 104a 第一整流二極體 104b 第二整流二極體 104c 第三整流二極體 104d 第四整流二極體 106a 第一發光二極體模組 106b 第二發光二極體模組 106c 第三發光二極體模組 106d 第四發光二極體模組 108 隔離部 110 電性接點 201 第一凹槽 201a,201b 次凹槽 201c 突出埠 19 M421592 202 第二凹槽 203 第三凹槽 204 凹槽 204a 第一子凹槽 204b 第二子凹槽 301 發光二極體 2026b top layer second conductive trace 26c top layer third conductive trace 26d top layer fourth conductive trace 28 wire trace 30a first through hole 30b second through hole 30c third through hole 30d fourth through hole 102 substrate 104a first Rectifying diode 104b second rectifying diode 104c third rectifying diode 104d fourth rectifying diode 106a first illuminating diode module 106b second illuminating diode module 106c third illuminating diode Module 106d fourth light emitting diode module 108 isolation portion 110 electrical contact 201 first groove 201a, 201b secondary groove 201c protrusion 埠 19 M421592 202 second groove 203 third groove 204 groove 204a a sub-groove 204b, a second sub-groove 301, a light-emitting diode 20