M348191 .八、新型說明： 【新型所屬之技術領域】 本創作有關-種L E D朗散熱裝置，尤指—種適合室内外 及機器、廣告等照明設備使用之L E D照明散熱裝置改良。 【先前技術】 目前照明設備包括桃燈照明、車燈照明、廣告照明、室内 照明及機器設備照明等種類，-般照明設備之照明光源 白熾燈泡、日絲管、水雜等_，除了汞觀造成環境汗毕 外’照明效報差’耗電量相對增加，並且料損壞，使用壽命 短，以致須經轉修更換，浪費人力、物力及時間，因此有待加 強改善。 爰現今室内外及機H、廣告物明設備之照明光源已逐漸採 用固態光源發光二極體，以提高_效率，並且節省電力。惟此 照明光源L E D必須於電路板上排列佈置多數個發光二極體，隨 者發光二極體之設置數量及輪出功率增加，在電〉光〉熱轉換過 =對產娜繼，心彡_嫩料至散熱器及 其鰭片進行散熱。 L E D發光二減之導電接㈣如銲接絲碌著於電路 t氣術，獅_咖__散熱器表面。 透㈣-減㊣溫賴量只能由本身《賴基體，依序 =過，路板之絕緣層傳導至本身金屬基板，以致影響熱傳導效 ’並且電路板絕緣層之熱傳導性不佳，導致散熱效率差，散敎 5 M348191 ^又It目此L Ed發光二極體長期間使科料造成溫度過 =，嚴重影響_致能，進而造成絲，縮減制壽命。又，目 、發光極體之導熱基體無法全面牢固密合於電路板 上’並J'因溫度變化容驗生__，嚴4影傳導效率與 散熱速度，因此有必要進一步創作改良。 , 【新型内容】 ‘ 本_之目的即在提供—種LED照明散熱裝置，主要由電 # _之金屬基缝合導熱㈣，進—步全職合LED發光二極 —導…、基體達到全面接觸擴散迅速散熱，降低熱阻係數，大 巾田度提焉熱傳導效率，確保L E D發光二極體之效能及使用壽 命’具備產業利用價值。 為達上揭目的，本創作電路板表面上至少電性連接設置一匕 E D發光二極體’該電路板包含有依序結合—金屬基板、一絕緣 層、-電氣線路及表面絕緣漆層，該LED發光二極體具有外周 #多數導電接腳及中間導熱基體；其特徵在於：該金屬基板上設有 延伸至電路板表面之導熱凸體，使該導熱凸體—端接觸l ed • 發光二極體之導熱基體相對端。 於較佳實施例中，該電路板之金屬基板上連體延伸出導熱凸 體。 於另一較佳實施例中，該電路板之金屬基板與絕緣層設有相 通之插孔，該導熱凸體另一端插接結合於插孔。 於又一較佳實施例中，該導熱凸體設為金屬體，以銲接該乙 6 M348191 - ed發光二極體之導熱基體。 【實施方式】 有關本創作為達成上述目的，所採用之技術手段及其功效， 兹舉出可行實施例，並且配合圖式說明如下： 首先，請參閱第1 B，本創作L E D照熱裝置適用於各 - 種室内及室外酬設備，例、桃㈣、廣告照明、 • μ照明域11設備㈣等麵，以提高卿效率及節省電力。 • 如圖所示，本創作LED照明散熱裝置係在電路板1 〇表面上至 少電性連接設置-個或多個L ED發光二極體2 〇，並且連接設 備電源’使L E D發光二極體2 Q u E D晶片2丄於順向電壓 下產生發光顧。同時，LED#t極體2 Q本身高溫度熱量 能夠傳導至電路板1〇之金屬基板工工’更可如第2圖所示進 一步透過散熱器3 Q及其散熱則3 1進行散熱，並且可配合螺 栓17鎖接固定。 • 於第1至5圖所示之較佳實施例中，本創作LED照明散熱 裝置主要針對電路板1Q與L ED發光二極體2 〇形成複合散熱M348191 . Eight, new description: [New technical field] This creation is related to a kind of L E D lang heat sink, especially a kind of L E D lighting heat sink for indoor and outdoor lighting and equipment, advertising and other lighting equipment. [Prior Art] At present, lighting equipment includes lantern lighting, headlight lighting, advertising lighting, indoor lighting and machine equipment lighting, etc., lighting lamps such as incandescent bulbs, Japanese silk tubes, water, etc. As a result of the environmental sweat, the 'lighting effect is poor', the power consumption is relatively increased, and the material is damaged, the service life is short, so that it needs to be replaced and replaced, which wastes manpower, material resources and time. Therefore, it is necessary to strengthen the improvement.照明 Today's indoor and outdoor and H, advertising and lighting equipment has gradually adopted solid-state light-emitting diodes to improve efficiency and save electricity. However, the illumination light source LED must have a plurality of light-emitting diodes arranged on the circuit board, and the number of the light-emitting diodes and the power of the wheel are increased, and the electric light is converted to the light. _ tender to the heat sink and its fins for heat dissipation. L E D illuminating the second reduction of the conductive connection (four) such as welding wire entangled in the circuit t gas, lion _ _ _ radiator surface. Through the (four)-reduction of the temperature can only be caused by its own "Lai matrix, in order = too, the insulation layer of the circuit board is conducted to its own metal substrate, which affects the thermal conductivity" and the thermal conductivity of the insulation of the circuit board is poor, resulting in heat dissipation Poor efficiency, divergence 5 M348191 ^ It It is this L Ed light-emitting diode during the long period of time caused the temperature of the material too =, seriously affecting _ enable, and then cause silk, reduce the life. Moreover, the heat-conducting substrate of the target and the illuminating electrode body cannot be completely and firmly adhered to the circuit board ’ and J′ is subjected to the test of temperature change __, strict 4 shadow conduction efficiency and heat dissipation speed, so further development and improvement are necessary. , [new content] 'The purpose of this _ is to provide - a kind of LED lighting heat sink, mainly by the metal # _ metal-based suture heat conduction (four), step-by-step full-time LED light-emitting diode-guide..., the substrate reaches full contact diffusion Rapid heat dissipation, lowering the thermal resistance coefficient, and the heat transfer efficiency of the large towel field ensures the efficiency and service life of the LED light-emitting diodes. In order to achieve the goal, at least one ED LED is disposed on the surface of the circuit board. The circuit board includes a metal substrate, an insulating layer, an electrical circuit and a surface insulating lacquer layer. The LED light-emitting diode has a plurality of conductive pins and an intermediate heat-conductive substrate; the metal substrate is provided with a heat-conducting protrusion extending to the surface of the circuit board, so that the heat-conducting convex body-end contact l ed The opposite end of the thermally conductive substrate of the diode. In a preferred embodiment, the metal substrate of the circuit board is connected to the heat conducting convex body. In another preferred embodiment, the metal substrate of the circuit board and the insulating layer are provided with a corresponding insertion hole, and the other end of the thermal conductive protrusion is inserted and coupled to the insertion hole. In still another preferred embodiment, the thermally conductive protrusion is a metal body to solder the thermally conductive substrate of the B 6 M348191 - ed light emitting diode. [Embodiment] For the purpose of achieving the above objectives, the technical means and its functions, the following examples are given, and the following description is given as follows: First, please refer to the first B, the LED lighting device is applicable. In all kinds of indoor and outdoor equipment, such as, peach (four), advertising lighting, • μ lighting domain 11 equipment (four), etc., to improve the efficiency and save electricity. • As shown in the figure, the LED lighting heat sink of this creation is electrically connected to at least one or more L ED light-emitting diodes 2 on the surface of the circuit board 1 and connected to the device power supply to make the LED light-emitting diodes 2 Q u ED wafer 2 produces a luminous illumination at the forward voltage. At the same time, the LED#t pole body 2 Q itself has a high temperature heat that can be conducted to the metal substrate of the circuit board. The heat dissipation can be further transmitted through the heat sink 3 Q and its heat dissipation as shown in Fig. 2, and It can be locked and fixed with bolts 17. • In the preferred embodiment shown in Figures 1 to 5, the LED lighting heat sink of the present invention is mainly for composite heat dissipation of the circuit board 1Q and the L ED light-emitting diode 2 〇
- 設計，如圖所示，LED照明散熱裝置於電路板丄〇表面上至少 電性連接設置一LED發光二極體20，該電路板10包含有依 序結合一金屬基板1 1、一絕緣層12、一電氣線路i 3及表面 絕緣漆層14，並且該金屬基板1 1可採用銅質基板或鋁質基 板，以作為導熱板體。而該L E D發光二極體2 〇具有l £ D晶 片21，並且配合殼體2 2與透光頭罩2 3進行封裝，同時L· E 7 M348191 .D晶片21電性連接外周多數導電接腳24，以及其底部中間結 合一導熱基體2 5。 本創作LED照明散錄置主要特徵在於：該金屬基板工丄 上設有延伸至電路板1Q表面之導熱凸體丨5 (參閱第3、4及 5圖），使該導熱凸體15 -端接觸L E D發光二極體2 〇之導熱 •基體2 5相對端（參_ 5圖），達到全面接觸舰迅速散熱，降 低熱_數，大财提高熱傳導鱗，確保L㈣縣二極體2 0之效能及使用哥命。 於第3、4及5圖所示之LED照明散熱|置中，在電路板 10之金屬基板1 1上可直接連體延伸出金屬質導熱凸體15， 並且如圖所示延伸至電路板i Q表面，使該導熱凸體丨5 一端接 觸L E D發光二極體2 〇之_基體2 5相對端，以直接密合形 成熱傳導途徑。 於第6及7圖所示之另-種實施結構巾，LED照明散熱裝 • i係針對導熱凸體15之組合結構設計，如圖所示，該電路板1 • 0之金屬基板11與絕緣層12可直接設有相通之插孔16，使 該導熱凸體15另-端插接結合於插孔工6，以直接組合成熱傳 導體。尤其，於第4、5及6圖中，LE D照明散熱裝置將導熱 凸體15直接設為金屬體，以銲接或表面黏著該L E D發光二極 體2 0之導熱基體2 5，使導熱凸體15與導熱基體2 5密合一 體固定，避免彼此間因溫度變化產生剝離間隙，以提高熱傳導效 率。 8 M348191 於第8圖所示之另-較佳實施例中，Led照明散執裝置直 接在電路板1 0表面上封裝L EDW 2 i及其透光頭罩2 3斑 導熱基體2 5，並域L E㈣2 1峨_! 3構成電性 連接。 本創作L E D朗散絲置主要由電路板1 Q之金屬基板i 1結合導熱凸體i 5，進-步全面密合L E D發光二鋪2 〇之 導熱基體2 5，達到全面接觸擴散迅速散熱，降低酿係數，大 幅度提高熱料效率，確保L E D發光二極體2 q之效能及使用 壽命，具備產業彻價值。爰依法提出新型專利申請。 以上所舉實施鍾用為方便說明本創作，碰非加以限制， 在不離本鋪精神料，熟悉此-行紐#人士所可作之各種簡 易變化與修飾，均仍應含括於以下申請專利範圍中。 【圖式簡單說明】 第1圖係本創作較佳實施例之立體圖； 第2圖係第1圖之使用狀態圖； 第3圖係第1圖之立體分解圖； 第4圖係第3圖之剖視放大圖； 第5圖係第4圖之組立剖視圖； 第6圖係如第5圖另一種電路板散熱結構圖； 第7圖係第6圖之分解圖； 第8圖係本創作另一較佳實施例之使用狀態圖。 9 M348191 . 【主要元件符號說明】 10 電路板 1 1 金屬基板 1 2 絕緣層 13 電氣線路 1 4 絕緣漆層 1 5 導熱凸體 16 插孔 1 7 螺栓 2 0 L ED發光二極體 2 1 L E D晶片 2 2 殼體 2 3 透光頭罩 2 4 導電接腳 2 5 導熱基體 3 0 散熱器 3 1 散熱鰭片- design, as shown in the figure, the LED lighting heat sink is electrically connected to the surface of the circuit board at least electrically connected with an LED light emitting diode 20, the circuit board 10 comprises a metal substrate 1 1 in sequence, an insulating layer 12. An electrical circuit i3 and a surface insulating varnish layer 14, and the metal substrate 11 may be a copper substrate or an aluminum substrate as a heat conducting plate body. The LED light-emitting diode 2 has a l £ D wafer 21, and is packaged with the housing 22 and the light-transmitting cover 2 3, while the L·E 7 M348191 .D wafer 21 is electrically connected to the outer plurality of conductive pins. 24, and a bottom portion of the bottom thereof is coupled to a thermally conductive substrate 25. The main feature of the LED lighting scatter recording device is that the metal substrate has a heat conducting protrusion 丨5 extending to the surface of the circuit board 1Q (see Figures 3, 4 and 5), so that the heat conducting convex body 15-end Contact LED light-emitting diode 2 导热 heat conduction • base 2 5 opposite end (see _ 5 figure), to achieve full contact with the ship to quickly dissipate heat, reduce heat _ number, big fortune to improve heat conduction scale, to ensure L (four) county diode 20 Performance and use of life. In the LED lighting heat dissipation|centering shown in the figures 3, 4 and 5, the metal heat conductive convex body 15 can be directly connected and extended on the metal substrate 1 of the circuit board 10, and extended to the circuit board as shown in the figure. The surface of the i Q is such that one end of the thermally conductive convex body 接触 5 contacts the opposite ends of the base body 2 5 of the LED light-emitting diode 2 to directly form a heat conduction path. Another embodiment of the structural towel shown in Figures 6 and 7 is an LED illumination heat sink. The i-system is designed for the combined structure of the heat-conducting convex body 15. As shown in the figure, the metal substrate 11 and the insulation of the circuit board 1 The layer 12 can be directly provided with the communicating jack 16 so that the thermally conductive protrusion 15 is additionally and end-coupled to the jack 6 for direct combination into a heat conductor. In particular, in the fourth, fifth and sixth figures, the LE D illumination heat sink directly sets the heat conductive protrusion 15 as a metal body to solder or surfacely adhere the heat conductive substrate 25 of the LED light emitting diode 20 to make the heat conductive convex The body 15 is integrally fixed to the heat-conducting substrate 25 to prevent a peeling gap from occurring due to temperature changes, thereby improving heat transfer efficiency. 8 M348191 In another preferred embodiment shown in FIG. 8, the Led illumination dispersing device directly encapsulates the L EDW 2 i and its transmissive hood 2 3 spot thermal conductive substrate 25 on the surface of the circuit board 10, and The domain L E (four) 2 1 峨 _! 3 constitutes an electrical connection. The LED splicing wire of the present invention is mainly composed of a metal substrate i 1 of the circuit board 1 Q combined with a heat-conducting convex body i 5 , and the thermal conductive substrate 2 5 is fully integrated with the LED illuminating 2 ,, to achieve full contact diffusion and rapid heat dissipation. Reduce the brewing coefficient, greatly improve the efficiency of the hot material, ensure the efficiency and service life of the LED light-emitting diode 2, and have the industrial value.提出 Propose a new type of patent application according to law. The above-mentioned implementation of the clock is used to explain the creation of the book. It is not limited. If you are not familiar with the spirit of the shop, you should be familiar with the various changes and modifications that can be made by the person in this line. In the scope. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a preferred embodiment of the present invention; Fig. 2 is a state diagram of use of Fig. 1; Fig. 3 is an exploded perspective view of Fig. 1; Fig. 4 is a third diagram Fig. 5 is a sectional view of the group of Fig. 4; Fig. 6 is a heat dissipation structure diagram of another circuit board as shown in Fig. 5; Fig. 7 is an exploded view of Fig. 6; A state diagram of the use of another preferred embodiment. 9 M348191 . [Main component symbol description] 10 Circuit board 1 1 Metal substrate 1 2 Insulation layer 13 Electrical circuit 1 4 Insulating lacquer layer 1 5 Thermal conductive protrusion 16 Jack 1 7 Bolt 2 0 L ED LED 2 1 LED Wafer 2 2 Case 2 3 Transmissive hood 2 4 Conductive pin 2 5 Thermal base 3 0 Heat sink 3 1 Heat sink fin