TWI516711B - Light emitting diode lamp - Google Patents
Light emitting diode lamp Download PDFInfo
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Description
本發明係有關於一種發光二極體燈泡,尤指一種使用透光基板以承載發光二極體晶粒之發光二極體燈泡。 The invention relates to a light-emitting diode bulb, in particular to a light-emitting diode bulb using a light-transmitting substrate to carry light-emitting diode crystal grains.
發光二極體(light emitting diode,LED)為一種半導體元件,主要透過半導體化合物將電能轉換為光能以達到發光效果,因此具有壽命長、穩定性高及耗電量小等優點,目前已被廣泛地應用於居家、辦公、室外與行動照明,以取代燈管及白熾燈泡等傳統的非指向性發光源。 A light emitting diode (LED) is a semiconductor component that converts electrical energy into light energy through a semiconductor compound to achieve a luminous effect. Therefore, it has the advantages of long life, high stability, and low power consumption. Widely used in home, office, outdoor and mobile lighting to replace traditional non-directional light sources such as lamps and incandescent bulbs.
配合參閱第一圖,為習知之發光二極體燈泡之側視圖。該發光二極體燈泡20包含一座體200、一電路板210、複數發光二極體226、一燈罩230以及一導電接頭240。該電路板210及該導電接頭240分別設置於該座體200的相反兩側。該電路板210呈矩形平板狀,且該電路板210具有較大面積之一表面係平貼於該座體200。該等發光二極體226設置於該電路板210上,並位於該電路板210另一具有較大面積之一表面;該等發光二極體226電連接於該電路板210,該電路板210係提供點亮該等發光二極體226的電力,其中,該等發光二極體226被點亮時係朝向相反於該座體200的方向發出光線。該燈罩230罩合該電路板210及該等發光二極體226,使該電路板210及該等發光二極體226位於該座體200及該燈罩230之間。 Referring to the first figure, it is a side view of a conventional light-emitting diode bulb. The LED bulb 20 includes a body 200, a circuit board 210, a plurality of LEDs 226, a lamp cover 230, and a conductive connector 240. The circuit board 210 and the conductive joint 240 are respectively disposed on opposite sides of the base 200. The circuit board 210 has a rectangular flat shape, and one surface of the circuit board 210 having a larger area is flatly attached to the base 200. The light-emitting diodes 226 are disposed on the circuit board 210 and are located on one surface of the circuit board 210 having a larger area. The light-emitting diodes 226 are electrically connected to the circuit board 210. The circuit board 210 is The power for illuminating the light-emitting diodes 226 is provided, wherein the light-emitting diodes 226 are illuminated to emit light in a direction opposite to the body 200. The lamp cover 230 covers the circuit board 210 and the light-emitting diodes 226 such that the circuit board 210 and the light-emitting diodes 226 are located between the base body 200 and the lamp cover 230.
由於發光二極體220為指向性光源,因此由該等發光二極體226發出的光線只能朝向前方出光(即該等發光二極體226發出的光線只能朝向相反於 該座體200的方向出光),使得該發光二極體燈泡20的發光區域遠不及於白熾燈泡,也無法達到白熾燈泡等非指向性光源的出光需求,並導致使用者降低使用該發光二極體燈泡20的意願。 Since the light-emitting diodes 220 are directional light sources, the light emitted by the light-emitting diodes 226 can only emit light toward the front (that is, the light emitted by the light-emitting diodes 226 can only face oppositely The light from the direction of the body 200 is such that the light-emitting area of the light-emitting diode bulb 20 is far less than that of an incandescent light bulb, and the light-emitting requirement of a non-directional light source such as an incandescent light bulb cannot be achieved, and the user is reduced in use of the light-emitting diode. The will of the body bulb 20.
鑒於先前技術所述,本發明之一目的,在於提供一種發光二極體燈泡,該發光二極體燈泡係使用透光基板以承載發光二極體晶粒。 In view of the foregoing, it is an object of the present invention to provide a light emitting diode bulb that uses a light transmissive substrate to carry light emitting diode dies.
為達上述目的,本發明提供一種發光二極體燈泡,該發光二極體燈泡包含一電路板、至少一光源模組、一導電接頭以及一燈罩。該電路板包含至少一插槽。該光源模組位於該電路板之一側,該光源模組包含一透光基板、一電路層、一電極件以及複數發光二極體晶粒。該透光基板包含一第一表面及一相反於該第一表面之第二表面;該電路層貼設於該第一表面及該第二表面之其中之至少之一者;該電極件設置於該透光基板之一端部,該電極件插設於該插槽中並電連接於該電路層,使該透光基板立於該電路板上;該等發光二極體晶粒設置該第一表面及該第二表面之其中之至少之一者,並與該電路層形成電性連接。該導電接頭位於該電路板之另一側,並電連接於該電路板;該燈罩與該導電接頭結合,使該電路板及該光源模組置於該燈罩及該導電接頭之間。 To achieve the above objective, the present invention provides a light-emitting diode bulb comprising a circuit board, at least one light source module, a conductive joint, and a lamp cover. The board contains at least one slot. The light source module is located on one side of the circuit board. The light source module comprises a transparent substrate, a circuit layer, an electrode member and a plurality of light emitting diode dies. The transparent substrate includes a first surface and a second surface opposite to the first surface; the circuit layer is attached to at least one of the first surface and the second surface; the electrode member is disposed on One end of the light-transmitting substrate, the electrode member is inserted into the slot and electrically connected to the circuit layer, so that the light-transmitting substrate is standing on the circuit board; the light-emitting diode die is disposed first At least one of the surface and the second surface and electrically connected to the circuit layer. The conductive joint is located on the other side of the circuit board and electrically connected to the circuit board; the light cover is combined with the conductive joint to place the circuit board and the light source module between the lamp cover and the conductive joint.
根據本發明之一實施例,其中該光源模組更包含一螢光層,該螢光層包覆該等發光二極體晶粒。 According to an embodiment of the invention, the light source module further includes a phosphor layer covering the light emitting diode crystal grains.
根據本發明之一實施例,其中該透光基板呈矩形,該電極件係設置於該透光基板之一短邊方向。 According to an embodiment of the invention, the transparent substrate has a rectangular shape, and the electrode member is disposed in a short side direction of one of the transparent substrates.
根據本發明之一實施例,該發光二極體燈泡更包含一驅動器,設置於該 電路板上,並與該電路板形成電性連接。 According to an embodiment of the invention, the LED bulb further includes a driver disposed on the The circuit board is electrically connected to the circuit board.
根據本發明之一實施例,其中該等發光二極體晶粒分別地設置於該第一表面及該第二表面,且設置於該第二表面之該等發光二極體晶粒排列方式係相同於設置於該第一表面之該等發光二極體晶粒。 According to an embodiment of the present invention, the light emitting diodes are respectively disposed on the first surface and the second surface, and the light emitting diodes are arranged on the second surface. The same as the light emitting diode dies disposed on the first surface.
根據本發明之一實施例,其中該等發光二極體晶粒分別地設置於該第一表面及該第二表面,且設置於該第二表面之該等發光二極體晶粒與設置於該第一表面之該等發光二極體晶粒呈錯位排列。 According to an embodiment of the present invention, the illuminating diode dies are respectively disposed on the first surface and the second surface, and the illuminating diode dies disposed on the second surface are disposed on The light-emitting diode crystal grains of the first surface are arranged in a dislocation manner.
根據本發明之一實施例,該發光二極體燈泡更包含複數光源模組,各該光源模組之電極件係插設於形成在該電路板上的複數插槽,使各該光源模組之透光基板立於該電路板上。 According to an embodiment of the present invention, the light-emitting diode bulb further includes a plurality of light source modules, and the electrode members of each of the light source modules are inserted into a plurality of slots formed on the circuit board, so that the light source modules are The light transmissive substrate is standing on the circuit board.
根據本發明之一實施例,其中該等光源模組呈線性排列於該電路板上,且任二光源模組間的距離為一定值。 According to an embodiment of the invention, the light source modules are linearly arranged on the circuit board, and the distance between any two light source modules is a certain value.
根據本發明之一實施例,其中該透光基板的透光率大於等於50%。 According to an embodiment of the invention, the light transmissive substrate has a light transmittance of 50% or more.
根據本發明之一實施例,其中該透光基板的材質選自氧化鋁、氮化鎵、玻璃、磷化鎵、碳化矽及化學氣相沉積鑽石所構成的材料族群。 According to an embodiment of the invention, the material of the transparent substrate is selected from the group consisting of alumina, gallium nitride, glass, gallium phosphide, tantalum carbide and chemical vapor deposited diamond.
10、10a、10b‧‧‧發光二極體燈泡 10, 10a, 10b‧‧‧Light Bulbs
110‧‧‧基座 110‧‧‧Base
120‧‧‧電路板 120‧‧‧ boards
122‧‧‧插槽 122‧‧‧Slots
126‧‧‧板面 126‧‧‧ board
130、130a、130b‧‧‧光源模組 130, 130a, 130b‧‧‧ light source module
132、132a‧‧‧透光基板 132, 132a‧‧‧Transparent substrate
1320、1320a‧‧‧第一表面 1320, 1320a‧‧‧ first surface
1322、1322a‧‧‧第二表面 1322, 1322a‧‧‧ second surface
134、134a‧‧‧電路層 134, 134a‧‧‧ circuit layer
135‧‧‧電極件 135‧‧‧Electrode parts
136、136a‧‧‧發光二極體 136, 136a‧‧‧Lighting diode
138a‧‧‧螢光層 138a‧‧‧Fluorescent layer
140‧‧‧燈罩 140‧‧‧shade
150‧‧‧導電接頭 150‧‧‧Electrical connector
170‧‧‧驅動器 170‧‧‧ drive
20‧‧‧發光二極體燈泡 20‧‧‧Lighting diode bulb
200‧‧‧座體 200‧‧‧ body
210‧‧‧電路板 210‧‧‧ boards
226‧‧‧發光二極體 226‧‧‧Lighting diode
230‧‧‧燈罩 230‧‧‧shade
240‧‧‧導電接頭 240‧‧‧Electrical connector
第一圖為習知之發光二極體燈泡之側視圖。 The first figure is a side view of a conventional light-emitting diode bulb.
第二圖本發明第一實施例之發光二極體燈泡之立體圖。 Fig. 2 is a perspective view of a light-emitting diode bulb according to a first embodiment of the present invention.
第三圖為本發明第一實施例之發光二極體燈泡之剖視圖。 Fig. 3 is a cross-sectional view showing a light-emitting diode bulb according to a first embodiment of the present invention.
第四圖為本發明第二實施例之發光二極體燈泡之剖視圖。 The fourth figure is a cross-sectional view of a light-emitting diode bulb according to a second embodiment of the present invention.
第五圖為本發明第三實施例之發光二極體燈泡之剖視圖。 Fig. 5 is a cross-sectional view showing a light-emitting diode bulb according to a third embodiment of the present invention.
請參考隨附圖示,本發明之以上及額外目的、特徵及優點將透過本發明之較佳實施例之以下闡釋性及非限制性詳細描敘予以更好地理解。 The above and other objects, features and advantages of the present invention will become more apparent from the <RTIgt;
配合參閱第二圖及第三圖,分別為本發明第一實施例之發光二極體燈泡之立體圖及剖視圖。該發光二極體燈泡10主要用以提供與白熾燈泡所產生之光強度分佈相近似的光源;該發光二極體燈泡10包含一基座110、一電路板120、至少一光源模組130、一燈罩140以及一導電接頭150。 Referring to the second and third figures, respectively, a perspective view and a cross-sectional view of a light-emitting diode bulb according to a first embodiment of the present invention. The light-emitting diode bulb 10 is mainly used to provide a light source similar to the light intensity distribution generated by the incandescent light bulb. The light-emitting diode bulb 10 includes a base 110, a circuit board 120, and at least one light source module 130. A lamp cover 140 and a conductive joint 150.
該基座110可例如(但不限定)為使用塑膠或陶瓷製作而成,於本實施例中,該基座110為圓形柱體,實際實施時則不以此限。該基座110係用以支撐該電路板120及該光源模組130。 The base 110 can be made of, for example, but not limited to, a plastic or ceramic. In this embodiment, the base 110 is a circular cylinder, which is not limited in practice. The pedestal 110 is used to support the circuit board 120 and the light source module 130.
該電路板120設置於該基座110之一側。於本實施例中,該電路板120為具有高機械強度、不可燃及防潮等特性之FR4玻璃纖維電路板,實際實施時,該電路板120可以依實際需求而為金屬基電路板或其他種類的印刷電路板;其次,該電路板120大致呈圓形,且該電路板120具有較大面積之一板面的表面積小於該基座110與該電路板120接觸之一表面的面積。該電路板120上具有至少一插槽122,該插槽122為貫穿該電路板120的槽孔結構。該電路板120上設置有一用以驅動該光源模組130發出光線之驅動器170,該驅動器170電連接於該電路板120。 The circuit board 120 is disposed on one side of the base 110. In the embodiment, the circuit board 120 is an FR4 fiberglass circuit board having high mechanical strength, non-combustible and moisture-proof characteristics. In actual implementation, the circuit board 120 can be a metal-based circuit board or other types according to actual needs. The printed circuit board is next; the circuit board 120 is substantially circular, and the surface area of the board 120 having a larger area is smaller than the area of the surface of the base 110 in contact with the circuit board 120. The circuit board 120 has at least one slot 122 therein. The slot 122 is a slot structure extending through the circuit board 120. The circuit board 120 is provided with a driver 170 for driving the light source module 130 to emit light, and the driver 170 is electrically connected to the circuit board 120.
該光源模組130包含一透光基板132、一電路層134、一電極件135以及複數發光二極體晶粒136。該透光基板132為玻璃基板,且該透光基板132的透光率(transmittance)大於等於50%;其中,透光率是指通過該透光基板132之光強度與入射該透光基板132之光強度的比值。該透光基板132的材質可以選自氧化鋁、氮化鎵、玻璃、磷化鎵、碳化矽及化學氣相沉積鑽石所構 成的材料族群。該透光基板132具有一第一表面1320以及相反於該第一表面之第二表面1322;於本實施例中,該透光基板132為矩形板體,該第一表面1320及該第二表面1322分別為該透光基板132具有較大面積之表面。實際實施時,該透光基板132可依實際需求而為其他幾何圖形,如:圓形或多邊形。 The light source module 130 includes a transparent substrate 132, a circuit layer 134, an electrode member 135, and a plurality of light emitting diode dies 136. The transparent substrate 132 is a glass substrate, and the transmittance of the transparent substrate 132 is 50% or more. The light transmittance refers to the light intensity passing through the transparent substrate 132 and the light transmitting substrate 132. The ratio of the light intensity. The material of the transparent substrate 132 may be selected from the group consisting of alumina, gallium nitride, glass, gallium phosphide, tantalum carbide and chemical vapor deposited diamond. a group of materials. The transparent substrate 132 has a first surface 1320 and a second surface 1322 opposite to the first surface. In the embodiment, the transparent substrate 132 is a rectangular plate, the first surface 1320 and the second surface. 1322 is a surface having a large area of the transparent substrate 132. In actual implementation, the transparent substrate 132 can be other geometric shapes, such as a circle or a polygon, according to actual needs.
該電路層134貼設於該透光基板132之該第一表面1320及該第二表面1322之其中之至少一者,該電路層134係使用具有導電特性之材料(如:銅)製作而成,用以作為電力傳輸的路徑。於本實施例中,該電路層134同時設置於該第一表面1320及該第二表面1322,該電路層134呈條狀設置,且該電路層134的長度係相同於該第一表面1320及該第二表面1322的長度。 The circuit layer 134 is attached to at least one of the first surface 1320 and the second surface 1322 of the transparent substrate 132. The circuit layer 134 is made of a material having conductive properties (such as copper). Used as a path for power transmission. In this embodiment, the circuit layer 134 is disposed on the first surface 1320 and the second surface 1322. The circuit layer 134 is disposed in a strip shape, and the circuit layer 134 is the same length as the first surface 1320 and The length of the second surface 1322.
該電極件135設置於該透光基板132之一端部並電連接於該電路層134,於本實施例中,該電極件135設置於該透光基板132之一短邊方向,並與該電路層134形成電性連接。該電極件135插設於該插槽122中,使該透光基板132之該第一表面1320及該第二表面1322垂直於該電路板120之一板面126,使該透光基板132立於該電路板120上,同時使該電路板120及該光源模組130形成電性連接。其次,該電極件135及該插槽122間可藉由焊料(未圖示)以將電極件135固定於該電路板120上,使提高該電極件135及該插槽122之間的結合強度及導電性。 The electrode member 135 is disposed at one end of the transparent substrate 132 and electrically connected to the circuit layer 134. In this embodiment, the electrode member 135 is disposed in a short side direction of the transparent substrate 132, and the circuit Layer 134 forms an electrical connection. The electrode member 135 is inserted into the slot 122 such that the first surface 1320 and the second surface 1322 of the transparent substrate 132 are perpendicular to a plate surface 126 of the circuit board 120, so that the transparent substrate 132 is The circuit board 120 and the light source module 130 are electrically connected to each other on the circuit board 120. Next, the electrode member 135 and the socket 122 can be fixed to the circuit board 120 by solder (not shown) to improve the bonding strength between the electrode member 135 and the socket 122. And conductivity.
該等發光二極體晶粒136分別地設置於該透光基板132之該第一表面1320及該第二表面1322之其中之至少之一者,並與該電路層134形成電性連接,該等發光二極體晶粒136係藉由該電路層134而為串聯連接、並聯連接或串並聯連接。於本實施例中,該等發光二極體晶粒136同時設置於該 第一表面1320及該第二表面1322,設於該第一表面1320及該第二表面1322之發光二極體晶粒136的數量相同,且設於第二表面之發光二極體晶粒136的設置位置係對應設於該第一表面1320之發光二極體晶粒136的設置位置,意即設置於該第二表面1322之該等發光二極體晶粒136排列方式相同於設置於該第一表面1320之該等發光二極體晶粒136。該等發光二極體晶粒136可以透過固晶(die attachment)技術以固定於該透光基板132上,之後再與該電路層134形成電性連接。該等發光二極體晶粒136可以為覆晶(flip chip)形式的發光二極體晶粒,且其電極直接接觸該電路層134,或者,該等發光二極體晶粒136也可以為水平式結構或垂直式結構的發光二極體晶粒,並藉由至少一金屬焊線以與該電路層134形成電性連接。由於該透光基板132的透光率大於50%,如此一來,可以避免該等發光二極體晶粒136發出的光線被該透光基板132所遮蔽或吸收,進而提高該發光二極體燈泡10的光利用效率。 The light emitting diode dies 136 are respectively disposed on at least one of the first surface 1320 and the second surface 1322 of the transparent substrate 132, and are electrically connected to the circuit layer 134. The illuminating diode dies 136 are connected in series, in parallel, or in series and in parallel by the circuit layer 134. In this embodiment, the light emitting diode dies 136 are simultaneously disposed on the The first surface 1320 and the second surface 1322 have the same number of light emitting diode dies 136 disposed on the first surface 1320 and the second surface 1322, and the LED 136 is disposed on the second surface. The position of the light-emitting diode die 136 disposed on the first surface 1320 is the same as that of the light-emitting diode die 136 disposed on the second surface 1322. The light emitting diode dies 136 of the first surface 1320. The LED 136 can be fixed to the transparent substrate 132 by a die attachment technique and then electrically connected to the circuit layer 134. The LED 136 may be a flip chip in the form of a flip chip, and the electrodes directly contact the circuit layer 134. Alternatively, the LED 136 may be The LED structure of the horizontal structure or the vertical structure is electrically connected to the circuit layer 134 by at least one metal bonding wire. Since the light transmittance of the light-transmitting substrate 132 is greater than 50%, the light emitted by the light-emitting diode crystal grains 136 can be prevented from being shielded or absorbed by the light-transmitting substrate 132, thereby improving the light-emitting diode. The light utilization efficiency of the bulb 10.
該導電接頭150設置於該電路板120之另一側,並與該燈罩140結合,使該電路板110及該光源模組130分別置於該導電接頭150及該燈罩140之間。該燈罩140可選擇性地設計為透明狀或半透明狀,藉以調整通過該燈罩140出射後之光線的光強度;同時,該燈罩140也可用以調整由該等發光二極體晶粒136發出之光線的出光特性,如:聚光或散光,使該發光二極體燈泡10的光學特性更符合實際的需求。該導電接頭150係供轉接於燈具上,藉以擷取點亮該發光二極體燈泡10的電力。該導電接頭150及該電路板120之間跨接有複數導線(未圖示),該等導線可貫穿該基座110,該等導線用以將該導電接頭150擷取到的電力傳遞至該電路板120,並由該電極件135傳 遞至該光源模組130,以點亮該等發光二極體晶粒136。 The conductive connector 150 is disposed on the other side of the circuit board 120 and coupled to the lamp cover 140 such that the circuit board 110 and the light source module 130 are respectively disposed between the conductive connector 150 and the lamp cover 140. The lamp cover 140 can be selectively designed to be transparent or translucent to adjust the light intensity of the light emitted through the lamp cover 140. Meanwhile, the lamp cover 140 can also be used to adjust the light emitted by the light emitting diode die 136. The light-emitting characteristics of the light, such as condensing or astigmatism, make the optical characteristics of the light-emitting diode bulb 10 more in line with actual needs. The conductive joint 150 is connected to the luminaire for drawing power to illuminate the illuminating diode bulb 10. A plurality of wires (not shown) are connected between the conductive connector 150 and the circuit board 120, and the wires can pass through the base 110, and the wires are used to transmit power drawn by the conductive connector 150 to the The circuit board 120 is transmitted by the electrode member 135 The light source module 130 is delivered to illuminate the light emitting diode dies 136.
配合參閱第四圖,為本發明第二實施例之發光二極體燈泡之立體圖。第四圖所示之發光二極體燈泡10a與第一實施例的發光二極體燈泡10類似,且相同的元件標示以相同的符號。值得注意的是,兩者的差異在於:第四圖所示之光源模組130a。 Referring to the fourth figure, a perspective view of a light-emitting diode bulb according to a second embodiment of the present invention is shown. The light-emitting diode bulb 10a shown in the fourth figure is similar to the light-emitting diode bulb 10 of the first embodiment, and the same elements are denoted by the same reference numerals. It is worth noting that the difference between the two is: the light source module 130a shown in the fourth figure.
該光源模組130a包含一透光基板132a、一電路層134a、複數發光二極體晶粒136a以及一螢光層138a。該電路層134a設置於該透光基板132a之一第一表面1320a及一相反於該第一表面1320a之第二表面1322a上。 The light source module 130a includes a transparent substrate 132a, a circuit layer 134a, a plurality of light emitting diode dies 136a, and a phosphor layer 138a. The circuit layer 134a is disposed on a first surface 1320a of the transparent substrate 132a and a second surface 1322a opposite to the first surface 1320a.
該等發光二極體晶粒136a分別地設置於該第一表面1320a及該第二表面1322a上,並與該電路層120形成電性連接,且設置於該第一表面1320a之該等發光二極體晶粒136a係與設置於該第二表面1322a之該等發光二極體晶粒136a呈錯位排列。 The LEDs 136a are respectively disposed on the first surface 1320a and the second surface 1322a, and are electrically connected to the circuit layer 120, and are disposed on the first surface 1320a. The polar crystal grains 136a are arranged in a staggered manner with the light emitting diode crystal grains 136a disposed on the second surface 1322a.
該螢光層138a包覆該等發光二極體晶粒136a,用以與該等發光二極體晶粒136a發出的部分光線發生波長轉換,並產生一波長轉換光線。該波長轉換光線與該等發光二極體晶粒136a發出的其他部分光線混光後,可供產生一需求光色之光線。於本實施例中,該螢光層138a同時包覆多個設置於該第一表面1320a或該第二表面1322a之發光二極體晶粒136a,藉以提高製作上的方便性。於實際實施時,該螢光層138a也可以僅包覆其中之至少一個發光二極體晶粒136a。發光二極體燈泡10a的各元件的功用與相關說明,實際上與第一實施例的發光二極體燈泡10相同,在此不予贅述。發光二極體燈泡10a至少可達到與發光二極體燈泡10相同的功能。 The phosphor layer 138a covers the LED dipoles 136a for wavelength conversion with a portion of the light emitted by the LED dipoles 136a and generates a wavelength-converted light. The wavelength-converted light is mixed with other portions of the light emitted by the light-emitting diode dies 136a to generate a light of a desired color. In this embodiment, the phosphor layer 138a simultaneously covers a plurality of light emitting diode dies 136a disposed on the first surface 1320a or the second surface 1322a, thereby improving the convenience in fabrication. In actual implementation, the phosphor layer 138a may also cover only at least one of the light emitting diode dies 136a. The function and related description of each element of the light-emitting diode bulb 10a are substantially the same as those of the light-emitting diode bulb 10 of the first embodiment, and will not be described herein. The light-emitting diode bulb 10a can at least achieve the same function as the light-emitting diode bulb 10.
配合參閱第五圖,為本發明第三實施例之發光二極體燈泡之立體圖。第 五圖所示之發光二極體燈泡10b與第二實施例的發光二極體燈泡10a類似,且相同的元件標示以相同的符號。值得注意的是,兩者的差異在於:第五圖所示之發光二極體燈泡10b包含複數呈線性排列之光源模組130b。 Referring to FIG. 5, a perspective view of a light-emitting diode bulb according to a third embodiment of the present invention is shown. First The light-emitting diode bulb 10b shown in FIG. 5 is similar to the light-emitting diode bulb 10a of the second embodiment, and the same elements are denoted by the same reference numerals. It should be noted that the difference between the two is that the LED bulb 10b shown in FIG. 5 includes a plurality of linear arrays of light source modules 130b.
該等光源模組130b分別地插接在形成於該電路板120上之複數插槽122中,藉以提供該發光二極體燈泡10b點亮時所需的光源。其次,任二光源模組130b間的距離為一定值,如此一來,不但可以提高該發光二極體燈泡10b的輝度,更可以提供均勻光強度分佈之光源。實際實施時,該等光源模組130b的排列方式可以依需求的光強度而為其它形式,如:不規則狀。發光二極體燈泡10b的各元件的功用與相關說明,實際上與第二實施例的發光二極體燈泡10a相同,在此不予贅述。發光二極體燈泡10b至少可達到與發光二極體燈泡10a相同的功能。 The light source modules 130b are respectively inserted into a plurality of slots 122 formed on the circuit board 120 to provide a light source required for the LEDs 10b to illuminate. Secondly, the distance between any two light source modules 130b is a certain value, so that not only the brightness of the light-emitting diode bulb 10b but also a light source of uniform light intensity distribution can be provided. In actual implementation, the arrangement of the light source modules 130b may be other forms according to the required light intensity, such as irregular shapes. The function and related description of each element of the light-emitting diode bulb 10b are substantially the same as those of the light-emitting diode bulb 10a of the second embodiment, and will not be described herein. The light-emitting diode bulb 10b can at least achieve the same function as the light-emitting diode bulb 10a.
然以上所述者,僅為本發明之較佳實施例,當不能限定本發明實施之範圍,即凡依本發明申請專利範圍所作之均等變化與修飾等,皆應仍屬本發明之專利涵蓋範圍意圖保護之範疇。 However, the above is only a preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the equivalent changes and modifications made by the scope of the present invention should still be covered by the patent of the present invention. The scope of the scope is intended to protect.
10‧‧‧發光二極體燈泡 10‧‧‧Lighting diode bulb
110‧‧‧基座 110‧‧‧Base
120‧‧‧電路板 120‧‧‧ boards
130‧‧‧光源模組 130‧‧‧Light source module
132‧‧‧透光基板 132‧‧‧Transparent substrate
134‧‧‧電路層 134‧‧‧ circuit layer
135‧‧‧電極件 135‧‧‧Electrode parts
136‧‧‧發光二極體 136‧‧‧Lighting diode
140‧‧‧燈罩 140‧‧‧shade
150‧‧‧導電接頭 150‧‧‧Electrical connector
170‧‧‧驅動器170‧‧‧ drive
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