TWI584490B - Lighting device - Google Patents
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- TWI584490B TWI584490B TW104127401A TW104127401A TWI584490B TW I584490 B TWI584490 B TW I584490B TW 104127401 A TW104127401 A TW 104127401A TW 104127401 A TW104127401 A TW 104127401A TW I584490 B TWI584490 B TW I584490B
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Description
本發明係為一種照明裝置,特別是一種使用可撓性材料的照明裝置。 The present invention is a lighting device, and more particularly a lighting device using a flexible material.
隨著半導體元件以及照明技術的快速發展,過去使用傳統燈絲式燈泡的照明裝置現今已大量被使用如發光二極體(Light Emitting Diode,LED)等半導體發光元件的裝置所取代。 With the rapid development of semiconductor components and illumination technology, illumination devices using conventional filament lamps have been replaced by devices using semiconductor light-emitting elements such as light-emitting diodes (LEDs).
不過由於半導體發光元件的體積小,照射範圍有限。因此在製造照明裝置時,必須使用多個半導體發光元件依照所需的光型排列並固定在電路基板上。然而,習知以半導體發光元件所製成之照明裝置所使用的通常都是硬質的電路板,因此無法做成長度較長的裝置,否則容易折斷;又因為欠缺可撓性,所以無法滿足像聖誕燈飾或裝置燈飾之類的需求,而大大限制了應用的範圍。另外,有些習知以半導體發光元件所製成之照明裝置雖然採用了可撓式基板,但由於裝置中都僅使用一組直流電源來驅動所有半導體發光元件,因此當照明裝置長度增長之後,距離直流電源較遠的半導體發光元件便會因為直流電力之電流流經較 長的線路後所造成的壓降及損耗出現發光亮度較低甚或不足的狀況,而使得整個照明裝置的各個區域發光亮度分布不均勻,嚴重影響了照明的效果。 However, due to the small size of the semiconductor light-emitting element, the irradiation range is limited. Therefore, when manufacturing the lighting device, it is necessary to use a plurality of semiconductor light emitting elements arranged and fixed on the circuit substrate in accordance with a desired light pattern. However, conventionally, illumination devices made of semiconductor light-emitting elements are generally hard circuit boards, so that it is not possible to make a device having a long length, otherwise it is easy to break; and because of lack of flexibility, it cannot satisfy the image. The need for Christmas lighting or fixtures and lighting has greatly limited the scope of the application. In addition, some conventional illumination devices made of semiconductor light-emitting elements use a flexible substrate, but since only a group of DC power sources are used to drive all the semiconductor light-emitting elements in the device, when the length of the illumination device increases, the distance Semiconductor light-emitting components with a far-reaching DC power supply will flow through the current of DC power. The voltage drop and loss caused by the long line appear to be low or even insufficient, so that the luminance distribution of the entire area of the entire illumination device is uneven, which seriously affects the illumination effect.
有鑑於此,要如何改善上述習知以半導體發光元件所製成之照明裝置的問題便成為相關業者亟思解決的目標。 In view of this, how to improve the above-mentioned conventional illumination device made of a semiconductor light-emitting element has become a target of the related art.
本發明係要解決習知以半導體發光元件製成之照明裝置因不具可撓性而被限制了應用範圍;以及當照明裝置長度增長後,會因為增長的線路所造成之電源壓降及損耗而使得整體發光亮度分布不均勻等問題。 The invention is to solve the problem that the illumination device made of the semiconductor light-emitting element is limited in application range because of the lack of flexibility; and when the length of the illumination device is increased, the power supply voltage drop and loss caused by the increased line are The problem is that the overall luminance distribution is uneven.
本發明為一種照明裝置,包括:基板,具有一可撓性材料;第一與第二半導體元件,設置於基板上,第一與第二半導體元件可分別發出第一光線與第二光線;以及第一與第二電源供應電路,設置於基板上,第一與第二電源供應電路分別提供第一與第二驅動電壓分別用以驅動第一與第二半導體元件。 The present invention is a lighting device comprising: a substrate having a flexible material; first and second semiconductor components disposed on the substrate, the first and second semiconductor components respectively emitting a first light and a second light; The first and second power supply circuits are disposed on the substrate, and the first and second power supply circuits respectively provide first and second driving voltages for driving the first and second semiconductor elements, respectively.
藉由本發明的實施,可達到下列進步功效:一、可使照明裝置可隨應用上的需求而任意撓曲;以及二、可使照明裝置不致隨著長度的增加而使得電源電壓大幅降低以致造成局部發光亮度衰減,進而達到擴大應用範圍以及有效穩定發光亮度的功效。 Through the implementation of the present invention, the following advancements can be achieved: first, the lighting device can be flexibly arbitrarily adapted to the application requirements; and second, the lighting device can be prevented from being greatly reduced with the increase of the length of the power supply voltage. The local illuminating brightness is attenuated, thereby achieving the effect of expanding the application range and effectively stabilizing the illuminating brightness.
為了使任何熟習相關技藝者了解本發明之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何熟習相關技藝者可輕易地理解本發明相關之目的及優 點,因此將在實施方式中詳細敘述本發明之詳細特徵以及優點。 In order to make the technical content of the present invention known to those skilled in the art and to implement the same, and according to the content, the patent scope and the drawings disclosed in the specification, those skilled in the art can easily understand the related objects and advantages of the present invention. The detailed features and advantages of the present invention will be described in detail in the embodiments.
100‧‧‧照明裝置 100‧‧‧Lighting device
10‧‧‧基板 10‧‧‧Substrate
11、12‧‧‧表面 11, 12‧‧‧ surface
13‧‧‧交流電輸入端 13‧‧‧AC input
111、112‧‧‧區段 111, 112‧‧‧ Section
20、30、40‧‧‧半導體元件 20, 30, 40‧‧‧ semiconductor components
50、60‧‧‧電源供應電路 50, 60‧‧‧ power supply circuit
51‧‧‧交流/直流轉換電路 51‧‧‧AC/DC converter circuit
52‧‧‧整流元件 52‧‧‧Rectifying components
53‧‧‧儲能電路 53‧‧‧ Energy storage circuit
54‧‧‧偏壓電路 54‧‧‧Bias circuit
55‧‧‧穩壓電路 55‧‧‧Variable circuit
56‧‧‧控制電路 56‧‧‧Control circuit
70‧‧‧交流電源 70‧‧‧AC power supply
80‧‧‧透光管體 80‧‧‧Light pipe body
81‧‧‧透光膠體 81‧‧‧Translucent colloid
BD‧‧‧交流/直流轉換器 BD‧‧•AC/DC converter
C1‧‧‧第一電容 C1‧‧‧first capacitor
D1、D2‧‧‧二極體 D1, D2‧‧‧ diode
Nd1~Nd4‧‧‧節點 Nd1~Nd4‧‧‧ nodes
R1~R6‧‧‧電阻 R1~R6‧‧‧ resistor
S1~S3‧‧‧光線 S1~S3‧‧‧Light
Q0、Q1‧‧‧電晶體 Q0, Q1‧‧‧ transistor
U0~U2‧‧‧電流控制器 U0~U2‧‧‧ current controller
A‧‧‧輸入端 A‧‧‧ input
K‧‧‧輸出端 K‧‧‧ output
CS‧‧‧電流感測端 CS‧‧‧current sensing end
ZD‧‧‧齊納二極體 ZD‧‧‧Zina diode
第1A圖為本發明實施例之一種照明裝置的外觀立體圖;第1B圖為本發明實施例之一種照明裝置的頂視圖;第1C圖為本發明實施例之一種照明裝置的側視圖;第2A圖為本發明實施例之一種照明裝置的電路結構方塊圖;第2B圖為本發明實施例之一種照明裝置的另一種電路結構方塊圖;第3圖為本發明實施例之一種照明裝置更包括有整流元件、儲能電路、偏壓電路、穩壓電路與控制電路的電路結構方塊圖;第4圖本發明實施例之一種照明裝置的電路圖;第5A圖為本發明實施例之一種照明裝置更包括一透光管體的局部側視圖;以及第5B圖為本發明實施例之一種照明裝置更包括一透光管體結構剖視圖。 1A is a perspective view showing an illumination device according to an embodiment of the present invention; FIG. 1B is a top view of a lighting device according to an embodiment of the present invention; and FIG. 1C is a side view of a lighting device according to an embodiment of the present invention; FIG. 2B is a block diagram of another circuit structure of a lighting device according to an embodiment of the present invention; FIG. 3 is a block diagram of another lighting device according to an embodiment of the present invention; FIG. 4 is a circuit diagram of a lighting device according to an embodiment of the present invention; FIG. 5A is a lighting diagram of an embodiment of the present invention; The device further includes a partial side view of a light-transmissive tube; and FIG. 5B is a cross-sectional view of a lighting device further including a light-transmissive tube structure according to an embodiment of the invention.
如第1A圖至第1C圖所示,本實施例為一種照明裝置100,其包括:一基板10;一第一半導體元件20與一第二半導體元件30;以及一第一電源供應電路50與一第二電源供應電路60。 As shown in FIG. 1A to FIG. 1C , the present embodiment is a lighting device 100 including: a substrate 10; a first semiconductor component 20 and a second semiconductor component 30; and a first power supply circuit 50 and A second power supply circuit 60.
基板10是由塑膠或橡膠等具有可撓性的材料所製成 之一體成形的單一結構,而不是由多節硬質或可撓性材料組合而成的多節組合結構。 The substrate 10 is made of a flexible material such as plastic or rubber. A single-body shaped single structure, rather than a multi-section combination of multiple sections of hard or flexible material.
基板10具有一第一表面11及一第二表面12。其中,表面11即為基板10的上表面,上面分布有導電線路以供電源電力或電氣訊號通過。表面11又可被區分為一第一區段111以及一第二區段112。而表面12則為基板10的下表面,其面上可視需要而分布有導電線路,或者不具任何線路。 The substrate 10 has a first surface 11 and a second surface 12. The surface 11 is the upper surface of the substrate 10, and conductive lines are distributed on the upper surface for power supply or electrical signals to pass. Surface 11 can in turn be divided into a first section 111 and a second section 112. The surface 12 is the lower surface of the substrate 10, and the surface thereof may be distributed with conductive lines as needed or without any wiring.
請同時參考第2A圖及第2B圖,半導體元件20可以是由一個發光二極體構成,或是如第2A圖所示的由複數個發光二極體並聯而形成,又或者是如第2B圖所示的由複數個發光二極體串聯而形成。 Referring to FIGS. 2A and 2B simultaneously, the semiconductor device 20 may be formed of one light-emitting diode or formed by a plurality of light-emitting diodes connected in parallel as shown in FIG. 2A, or as shown in FIG. 2B. The figure is formed by connecting a plurality of light emitting diodes in series.
如第1A圖、第2A圖及第2B圖所示,半導體元件20是設置於基板10的表面11上之區段111中。且半導體元件20包括一第一端與一第二端。半導體元件20之第一端即為其陽極端,用以連接一驅動電力中的正電端;半導體元件20之第二端即為其陰極端,是用來連接一驅動電力中的負電端。 As shown in FIGS. 1A, 2A, and 2B, the semiconductor element 20 is provided in the segment 111 on the surface 11 of the substrate 10. The semiconductor component 20 includes a first end and a second end. The first end of the semiconductor component 20 is an anode terminal for connecting a positive terminal of a driving power; the second terminal of the semiconductor component 20 is a cathode terminal thereof for connecting a negative terminal of a driving power.
半導體元件30同樣可以是由一個發光二極體構成,或是由複數個發光二極體並聯而形成,又或者是由複數個發光二極體串聯而形成。另外,半導體元件30還可以依照應用上的需要而採用與半導體元件20發出不同顏色之色光的發光元件。 The semiconductor element 30 can also be formed by one light-emitting diode, or by a plurality of light-emitting diodes connected in parallel, or by a plurality of light-emitting diodes connected in series. In addition, the semiconductor element 30 can also employ a light-emitting element that emits color light of a different color from the semiconductor element 20 in accordance with the needs of the application.
半導體元件30是設置於基板10的表面11上之區段112中,且半導體元件30同樣也包括一第一端與一第二端。其中,半導體元件30之第一端係為其陽極端,用以連接一驅動電力中的正電端;半導體元件30之第二端係為其陰極端,用來連接一驅動 電力中的負電端。 The semiconductor component 30 is disposed in the section 112 on the surface 11 of the substrate 10, and the semiconductor component 30 also includes a first end and a second end. The first end of the semiconductor component 30 is an anode terminal for connecting a positive terminal of a driving power; the second end of the semiconductor component 30 is a cathode terminal thereof for connecting a driving end. The negative terminal in electricity.
請再參閱第1C圖,半導體元件20與半導體元件30可分別發出一光線S1以及一光線S2。因為半導體元件20與半導體元件30可以分別採用發出不同色光之發光元件,因此光線S1及光線S2可以是相同的顏色或是不同的顏色之色光。 Referring again to FIG. 1C, the semiconductor component 20 and the semiconductor component 30 can respectively emit a light S1 and a light S2. Since the semiconductor element 20 and the semiconductor element 30 can respectively use light-emitting elements that emit different colors of light, the light S1 and the light S2 can be the same color or different colors of color light.
請再同時參閱第1A圖至第1C圖,電源供應電路50是用來提供一第一電壓以驅動半導體元件20工作的。電源供應電路50可以如第1A圖與第1B圖中所顯示的設置於基板10表面11之區段111中,或者也可如第1C圖所示的設置在基板10的表面12上。 Referring to FIGS. 1A through 1C at the same time, the power supply circuit 50 is for supplying a first voltage to drive the semiconductor device 20 to operate. The power supply circuit 50 may be disposed in the section 111 of the surface 11 of the substrate 10 as shown in FIGS. 1A and 1B, or may be disposed on the surface 12 of the substrate 10 as shown in FIG. 1C.
而為了避免遮蔽半導體元件20發出之光線S1的行進及反射而造成亮度分布的不均勻,當電源供應電路50是設置於表面11之區段111中時,電源供應電路50的設置位置會被安排在組成半導體元件20的各發光二極體陣列以外的地方,而不會設置在發光二極體陣列中的各發光二極體之間,因而會稍微增加基板10的寬度。 In order to avoid unevenness in luminance distribution caused by shielding the traveling and reflection of the light S1 emitted from the semiconductor element 20, when the power supply circuit 50 is disposed in the section 111 of the surface 11, the setting position of the power supply circuit 50 is arranged. Outside of each of the light-emitting diode arrays constituting the semiconductor element 20, it is not provided between the respective light-emitting diodes in the light-emitting diode array, and thus the width of the substrate 10 is slightly increased.
但是,當電源供應電路50是如第1C圖所示的設置於基板10的表面12時,由於不需考慮對發光均勻度的影響,因此可以設置在隔著基板10與半導體元件20相對的位置,故而可以縮減基板10的寬度,但會略微增加整個照明裝置100的厚度。因為可以有這兩種不同的設置位置的選擇,因此大大增加了本實施例所提供之照明裝置100的應用範圍。 However, when the power supply circuit 50 is provided on the surface 12 of the substrate 10 as shown in FIG. 1C, since it is not necessary to consider the influence on the uniformity of light emission, it can be disposed at a position opposed to the semiconductor element 20 via the substrate 10. Therefore, the width of the substrate 10 can be reduced, but the thickness of the entire illumination device 100 is slightly increased. Since the selection of these two different setting positions is possible, the application range of the lighting device 100 provided by the present embodiment is greatly increased.
電源供應電路60是用來提供一第二電壓以驅動半導體元件30工作的。而與電源供應電路50的設置類似的,電源供應電路60也可選擇被設置於基板10表面11之區段112中或是表面12 上以符合不同的應用需求。 The power supply circuit 60 is for providing a second voltage to drive the semiconductor device 30 to operate. Similar to the arrangement of the power supply circuit 50, the power supply circuit 60 can also be disposed in the section 112 of the surface 11 of the substrate 10 or the surface 12 To meet different application needs.
請再參閱第2A圖及第2B圖,電源供應電路50可以包括一第一交流/直流轉換電路51。如前所述,第2A圖與第2B圖間不同之處僅在於第2A圖中之半導體元件20是由複數個發光二極體元件並聯而成,而2B圖中之半導體元件20是由複數個發光二極體元件串聯而成的。 Referring to FIGS. 2A and 2B again, the power supply circuit 50 may include a first AC/DC conversion circuit 51. As described above, the difference between FIG. 2A and FIG. 2B is only that the semiconductor element 20 in FIG. 2A is formed by a plurality of light emitting diode elements connected in parallel, and the semiconductor element 20 in FIG. 2B is composed of plural numbers. A plurality of light emitting diode elements are connected in series.
請再同時參閱第1A圖、第1B圖、第2A圖及第2B圖,交流/直流轉換電路51具有一端、第二端、第三端與第四端,而基板10上則設置有交流電輸入端13。 Please refer to FIG. 1A, FIG. 1B, FIG. 2A and FIG. 2B at the same time. The AC/DC conversion circuit 51 has one end, a second end, a third end and a fourth end, and the substrate 10 is provided with an AC input. End 13.
交流/直流轉換電路51的第一端與第四端經由交流電輸入端13分別與一交流電源70的兩端耦接,而交流/直流轉換電路51的第二端與第三端則分別耦接半導體元件20的第一端與第二端以供應一第一驅動電壓來驅動半導體元件20。 The first end and the fourth end of the AC/DC conversion circuit 51 are respectively coupled to the two ends of an AC power source 70 via the AC input terminal 13, and the second end and the third end of the AC/DC conversion circuit 51 are respectively coupled. The first end and the second end of the semiconductor element 20 drive the semiconductor element 20 to supply a first driving voltage.
而電源供應電路60同樣也具有第一端、第二端、第三端與第四端,而電源供應電路60的第一端與第四端則是分別耦接於電源供應電路50中之交流/直流轉換電路51的第一端與第四端的。也就是說,電源供應電路60與電源供應電路50中之交流/直流轉換電路51的輸入端是在並聯連後經由基板10上的交流電輸入端13耦接於交流電源70之兩端的。 The power supply circuit 60 also has a first end, a second end, a third end, and a fourth end, and the first end and the fourth end of the power supply circuit 60 are respectively coupled to the AC in the power supply circuit 50. / DC conversion circuit 51 of the first end and the fourth end. That is, the input terminals of the AC/DC conversion circuit 51 in the power supply circuit 60 and the power supply circuit 50 are coupled to the two ends of the AC power source 70 via the AC input terminal 13 on the substrate 10 after being connected in parallel.
這樣的配置,讓使用者在設置及使用本實施例所提供之照明裝置100時,不用考慮照明裝置100上採用的是何種發光元件以及其所需的工作電壓為何,只要直接將市電等外接交流電源70直接接到交流電輸入端13即可。即使照明裝置100上設置的半導體元件20與半導體元件30為兩種發出不同色光、需要不同工作 電壓的發光元件,也毋須先將交流電整流並調整成不同的電壓後再送入照明裝置100。因而大大提高了應用的範圍以及使用上的便利性。 Such a configuration allows the user to set and use the lighting device 100 provided by the embodiment, regardless of the lighting component used in the lighting device 100 and the required operating voltage, as long as the external power supply is directly connected. The AC power source 70 can be directly connected to the AC input terminal 13. Even if the semiconductor element 20 and the semiconductor element 30 provided on the illumination device 100 emit different colors of light, different operations are required. The voltage light-emitting element does not need to be rectified and adjusted to a different voltage before being sent to the illumination device 100. This greatly increases the scope of the application and the convenience of use.
此外,又由於位於基板10上不同區段中的半導體元件20與半導體元件30各自擁有與其位於同一區段中的電源供應電路。因此,即使本實施例所提供之照明裝置100長度因應用上的需求而增長,每一電源供應電路和其驅動的半導體元件間的距離不會因此而加大。這樣就不會造成電源電力因距離增加而產生過大的壓降及損耗,並因而造成部分發光元件所產生的亮度降低。因此本實施例所提供之照明裝置100也可提供亮度均勻的發光效果。 Furthermore, since the semiconductor element 20 and the semiconductor element 30 located in different sections on the substrate 10 each have a power supply circuit located in the same section thereof. Therefore, even if the length of the illumination device 100 provided by the present embodiment is increased due to application requirements, the distance between each power supply circuit and the semiconductor element it drives is not increased. This does not cause excessive voltage drop and loss of power supply power due to an increase in distance, and thus causes a decrease in luminance generated by a part of the light-emitting elements. Therefore, the illumination device 100 provided by the embodiment can also provide a uniform illumination effect.
請再參閱第1B圖及第1C圖,本實施例所提供之照明裝置100還可更包括一第三半導體元件40。半導體元件40同樣也可以是由一個或複數個發光二極體所構成。而半導體元件40是設置於區段111中,並且同樣藉由電源供應電路50所提供的第一電壓驅動。並且,半導體元件40可發出一光線S3。半導體元件40可以採用與半導體元件20相同或是不同的發光元件構成,因此光線S3可以與光線S1顏色相同或不同,端看使用上的需求。 Referring to FIG. 1B and FIG. 1C again, the illumination device 100 provided in this embodiment may further include a third semiconductor component 40. The semiconductor element 40 can also be composed of one or a plurality of light-emitting diodes. The semiconductor component 40 is disposed in the section 111 and is also driven by the first voltage supplied from the power supply circuit 50. Also, the semiconductor element 40 can emit a light S3. The semiconductor element 40 can be formed of the same or different light-emitting elements as the semiconductor element 20, so that the light S3 can be the same or different in color from the light S1, and the requirements of use can be seen from the end.
而為了讓本實施例所提供之照明裝置100所發出的光線亮度能夠均勻分布,半導體元件20、半導體元件40及半導體元件30在排列時是以等間距方式沿著基板10的長邊來進行排列的。 In order to uniformly distribute the brightness of the light emitted by the illumination device 100 provided in the embodiment, the semiconductor element 20, the semiconductor element 40, and the semiconductor element 30 are arranged along the long side of the substrate 10 in an equally spaced manner during alignment. of.
另外,為了避免半導體元件40因距離電源供應電路50太遠而導致供電電壓不足,因此電源供應電路50是設置在半導體元件20與半導體元件40之間並且比較靠近半導體元件40的位 置。 In addition, in order to prevent the semiconductor element 40 from being insufficient due to being too far from the power supply circuit 50, the power supply circuit 50 is disposed between the semiconductor element 20 and the semiconductor element 40 and relatively close to the semiconductor element 40. Set.
如第3圖及第4圖所示,本實施例所提供之照明裝置100還可更包括有一整流元件52、一儲能電路53、一偏壓電路54、一穩壓電路55及一控制電路56。其中,第3圖所示的是本發明實施例之一種照明裝置100的電路結構方塊圖;第4圖所示的則是根據第3圖所示之電路結構方塊圖所設計出來的一種具體的照明裝置100電路圖。 As shown in FIG. 3 and FIG. 4, the illumination device 100 provided in this embodiment further includes a rectifying component 52, a storage circuit 53, a biasing circuit 54, a voltage stabilizing circuit 55, and a control. Circuit 56. 3 is a block diagram of a circuit structure of a lighting device 100 according to an embodiment of the present invention; and FIG. 4 is a specific block designed according to the circuit block diagram shown in FIG. 3. Circuit diagram of lighting device 100.
交流/直流轉換電路51在實際的電路應用中可以是簡單地由一顆交流/直流轉換器BD所構成,也可以由複數顆分立的二極體來組成。第4圖中所示的是以一顆交流/直流轉換器BD所構成的。 The AC/DC conversion circuit 51 may be composed of an AC/DC converter BD simply in an actual circuit application, or may be composed of a plurality of discrete diodes. Figure 4 shows an AC/DC converter BD.
整流元件52具有第一端與第二端,整流元件52的第一端與交流/直流轉換電路51的第二端耦接於第一節點Nd1,又整流元件52之第二端與半導體元件20之第一端耦接於一第二節點Nd2。也就是說,整流元件52是串聯連接於交流/直流轉換電路51的第二端與半導體元件20之第一端之間的。 The rectifying element 52 has a first end and a second end. The first end of the rectifying element 52 and the second end of the AC/DC converting circuit 51 are coupled to the first node Nd1, and the second end of the rectifying element 52 is connected to the semiconductor element 20. The first end is coupled to a second node Nd2. That is, the rectifying element 52 is connected in series between the second end of the AC/DC converting circuit 51 and the first end of the semiconductor element 20.
設置整流元件52的作用在於保護半導體元件20,確保不會有任何逆向電流流經半導體元件20而對半導體元件20造成損害。一般而言,整流元件52只要簡單地由一二極體D1構成即可。 The function of the rectifying element 52 is to protect the semiconductor element 20, ensuring that no reverse current flows through the semiconductor element 20 to cause damage to the semiconductor element 20. In general, the rectifying element 52 may simply be constituted by a diode D1.
儲能電路53具有第一端與第二端,儲能電路53的第一端是與整流元件52的第二端耦接於該第二節點Nd2,而儲能電路53的第二端則是與半導體元件20的第二端耦接於第三節點Nd3。也就是說,儲能電路53的兩端是並聯在半導體元件 20的兩端上的。 The storage circuit 53 has a first end and a second end. The first end of the storage circuit 53 is coupled to the second end of the rectifying element 52 to the second node Nd2, and the second end of the storage circuit 53 is The second end of the semiconductor component 20 is coupled to the third node Nd3. That is, both ends of the tank circuit 53 are connected in parallel to the semiconductor element. On both ends of 20.
儲能電路53可以簡單地由至少一電阻R3與至少一電容C1並聯形成。電容C1在半導體元件20被供電並處於發光的狀態時進行儲能;當半導體元件20不被供電且未發光時,電容C1會進行放電,半導體元件20的頻閃(flicker)就會降低。而電阻R3則將電容C1內吸收到的電量轉換成熱能散發掉,以讓電容C1持續保有可吸收及儲存電量的空間。 The tank circuit 53 can be formed simply by paralleling at least one resistor R3 with at least one capacitor C1. The capacitor C1 stores energy when the semiconductor element 20 is powered and in a light-emitting state; when the semiconductor element 20 is not powered and does not emit light, the capacitor C1 is discharged, and the flicker of the semiconductor element 20 is lowered. The resistor R3 converts the amount of power absorbed in the capacitor C1 into heat energy, so that the capacitor C1 maintains a space for absorbing and storing power.
偏壓電路54具有第一端、第二端與第三端。其中偏壓電路54的第一端是耦接於第一節點Nd1上的,以便由該處獲得一正電壓輸入。偏壓電路54之功用是在提供控制電路56中之各主動元件工作時所需要的偏壓。一般而言,可以簡單地由電阻構成即可,而在本實施例所採用的電路中,偏壓電路54是由電阻R1、R2所構成的。 The biasing circuit 54 has a first end, a second end, and a third end. The first end of the biasing circuit 54 is coupled to the first node Nd1 to obtain a positive voltage input therefrom. The function of bias circuit 54 is to provide the bias voltage required to operate each of the active components in control circuit 56. In general, it may be simply constituted by a resistor, and in the circuit employed in the embodiment, the bias circuit 54 is constituted by resistors R1, R2.
穩壓電路55具有第一端與第二端。穩壓電路55的第一端是與偏壓電路54的第三端耦接,以由偏壓電路54的第三端獲得一正電壓。一般而言,穩壓電路55可以簡單地由一個齊納二極體ZD所構成,並利用齊納二極體ZD的崩潰電壓來達到穩壓的目的。 The voltage stabilizing circuit 55 has a first end and a second end. The first end of the voltage stabilizing circuit 55 is coupled to the third end of the bias circuit 54 to obtain a positive voltage from the third end of the bias circuit 54. In general, the voltage stabilizing circuit 55 can be simply constituted by a Zener diode ZD and utilizes the breakdown voltage of the Zener diode ZD to achieve voltage stabilization.
控制電路56具有第一端、第二端、第三端與第四端。控制電路56的第一端、第二端分別與穩壓電路55的第一端、偏壓電路54的第二端耦接,而控制電路56的第三端是與半導體元件20的第二端耦接於第三節點Nd3,控制電路56的第四端則與穩壓電路55的第二端以及交流/直流轉換電路51的第三端耦接於第四節點Nd4。 Control circuit 56 has a first end, a second end, a third end, and a fourth end. The first end and the second end of the control circuit 56 are respectively coupled to the first end of the voltage stabilizing circuit 55 and the second end of the bias circuit 54, and the third end of the control circuit 56 is the second end of the semiconductor component 20. The terminal is coupled to the third node Nd3, and the fourth end of the control circuit 56 is coupled to the second terminal of the voltage stabilization circuit 55 and the third terminal of the AC/DC conversion circuit 51 to the fourth node Nd4.
控制電路56之功用在於藉由控制流經半導體元件20的電流而控制半導體元件20之發光亮度。而本實施例所採用的控制電路56的主要元件包括有電晶體Q0及Q1,電流控制器U0、U1及U2。 The function of the control circuit 56 is to control the luminance of the semiconductor element 20 by controlling the current flowing through the semiconductor element 20. The main components of the control circuit 56 used in this embodiment include transistors Q0 and Q1, current controllers U0, U1 and U2.
電晶體Q0及電晶體Q1分別均可為一金屬氧化物半導體場效電晶體(Metal-Oxide-Semiconductor Field-Effect Transistor,MOSFET),例如iML3160。 Each of the transistor Q0 and the transistor Q1 may be a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET), such as iML3160.
電流控制器U0、電流控制器U1及電流控制器U2的功用是用以調整及穩定電流之用,其可選用如iML8684等專供調整發光二極體電源電流之控制器。 The functions of the current controller U0, the current controller U1 and the current controller U2 are used for adjusting and stabilizing the current, and a controller such as the iML8684 for adjusting the current of the LED output current can be selected.
電晶體Q0的源極與電流控制器U0之輸入端耦接藉以控制電流控制器U0。電晶體Q0之閘極與汲極則分別與偏壓電路54之第三端以及偏壓電路54之第二端耦接獲得工作所需的偏壓。 The source of the transistor Q0 is coupled to the input of the current controller U0 to control the current controller U0. The gate and the drain of the transistor Q0 are coupled to the third terminal of the bias circuit 54 and the second terminal of the bias circuit 54, respectively, to obtain a bias voltage required for operation.
電晶體Q1之源極係同時與電流控制器U1之輸入端以及電流控制器U2之輸入端耦接,藉以控制電流控制器U1及電流控制器U2。而電晶體Q1之閘極係與偏壓電路54之第三端以獲得工作所需的偏壓。 The source of the transistor Q1 is coupled to the input of the current controller U1 and the input of the current controller U2 to control the current controller U1 and the current controller U2. The gate of transistor Q1 and the third terminal of bias circuit 54 are used to obtain the bias voltage required for operation.
電晶體Q1之汲極則與半導體元件20之第二端耦接,以調整流過半導體元件20電流,並藉由調整電流的大小來控制半導體元件20或的發光亮度。 The drain of the transistor Q1 is coupled to the second terminal of the semiconductor device 20 to adjust the current flowing through the semiconductor device 20, and to control the luminance of the semiconductor device 20 or by adjusting the magnitude of the current.
此外,電流控制器U0之輸出端與電流控制器U0之電流感測端間耦接有一電阻R4及一二極體D2,且電阻R4與二極體D2係為互相並聯連接,藉以讓電流控制器U0之電流感測端可以獲得 其所需的感測電流,並藉由二極體D2來保護電流控制器U0之電流感測端不致受到逆向電流之損害。 In addition, a resistor R4 and a diode D2 are coupled between the output end of the current controller U0 and the current sensing end of the current controller U0, and the resistor R4 and the diode D2 are connected in parallel with each other to allow current control. The current sensing terminal of U0 can be obtained The required current is sensed, and the current sensing terminal of the current controller U0 is protected from the reverse current by the diode D2.
電流控制器U1之輸出端是耦接於電流控制器U0之電流感測端,以使電流控制器U0可以監控電流控制器U1的輸出電流。且電流控制器U1之輸出端與電流控制器U1之電流感測端間耦接有一電阻R5,以使電流控制器U1之電流感測端可以獲得所需的感測電流。 The output of the current controller U1 is coupled to the current sensing terminal of the current controller U0, so that the current controller U0 can monitor the output current of the current controller U1. A resistor R5 is coupled between the output of the current controller U1 and the current sensing terminal of the current controller U1, so that the current sensing terminal of the current controller U1 can obtain the required sensing current.
又電流控制器U2之輸出端也一樣耦接到電流控制器U0之電流感測端。這使得電流控制器U2之輸出電流也一樣可以受到電流控制器U0的監控。且電流控制器U2之輸出端與電流控制器U2之電流感測端間耦接有一電阻R6,以使電流控制器U2之電流感測端可以獲得所需的感測電流。 The output of the current controller U2 is also coupled to the current sensing terminal of the current controller U0. This allows the output current of the current controller U2 to be monitored by the current controller U0 as well. A resistor R6 is coupled between the output of the current controller U2 and the current sensing terminal of the current controller U2, so that the current sensing terminal of the current controller U2 can obtain the required sensing current.
另外,本實施例所提供之照明裝置100除了可同時包括有整流元件52、儲能電路53、偏壓電路54、穩壓電路55及控制電路56之外,也可以將整流元件52、及儲能電路53省略,而只包括有偏壓電路54、穩壓電路55及控制電路56。 In addition, the illumination device 100 provided in this embodiment may include the rectifying component 52, the energy storage circuit 53, the bias circuit 54, the voltage regulator circuit 55, and the control circuit 56, and may also include the rectifying component 52, and The tank circuit 53 is omitted, and only the bias circuit 54, the voltage regulator circuit 55, and the control circuit 56 are included.
其中需要注意的是由於整流元件52是串聯連接在交流/直流轉換電路51的第二端與半導體元件20的第一端之間的。若是直接將整流元件52移除會造成交流/直流轉換電路51的第二端與半導體元件20的第一端之間形成斷路。因此必須在將整流元件52移除後把第一節點Nd1與第二節點Nd2互相耦接,以使電流能夠由交流/直流轉換電路51的第二端流經第一節點Nd1與第二節點Nd2之後流入半導體元件20的第一端。 It should be noted that the rectifying element 52 is connected in series between the second end of the AC/DC converting circuit 51 and the first end of the semiconductor element 20. If the rectifying element 52 is directly removed, an open circuit is formed between the second end of the AC/DC converting circuit 51 and the first end of the semiconductor element 20. Therefore, the first node Nd1 and the second node Nd2 must be coupled to each other after the rectifying element 52 is removed, so that current can flow through the first node Nd1 and the second node Nd2 from the second end of the AC/DC conversion circuit 51. It then flows into the first end of the semiconductor component 20.
至於儲能電路53由於是與半導體元件20並聯連接 於第二節點Nd2與第三節點Nd3之間,因此可以直接移除省略,而不會對半導體元件20的工作造成任何影響。 As for the energy storage circuit 53, since it is connected in parallel with the semiconductor element 20 Between the second node Nd2 and the third node Nd3, the omission can be directly removed without any influence on the operation of the semiconductor element 20.
如第5A圖及第5B圖所示,本實施例所提供之照明裝置100可以更包括有一透光管體80,用以環繞包覆基板10、半導體元件20、半導體元件30、半導體元件40、電源供應電路50及電源供應電路60而形成如燈管式的結構。 As shown in FIG. 5A and FIG. 5B , the illumination device 100 of the present embodiment may further include a light transmissive tube body 80 for surrounding the cladding substrate 10 , the semiconductor component 20 , the semiconductor component 30 , and the semiconductor component 40 . The power supply circuit 50 and the power supply circuit 60 form a lamp type structure.
由於本實施例所提供之照明裝置100是採用基板10而具有可撓性,因此在裝入透光管體80時除了可以採取使基板10呈平整狀的方式外,也可依需求將基板10扭轉或撓曲成許多不同的形狀後再裝入透光管體80中,最後再注入透光膠體81予以固定。因而可以製作出許多過去無法製作或難以製作的特殊光型之燈管或燈條,大大擴增了照明裝置100的應用範圍。 Since the illuminating device 100 provided in this embodiment has flexibility by using the substrate 10, the substrate 10 can be disposed in a manner that the substrate 10 is flat when the light-transmissive tube 80 is placed. After being twisted or flexed into many different shapes, it is then placed in the light-transmissive tube body 80, and finally, the light-transmitting colloid 81 is injected and fixed. Therefore, it is possible to produce a plurality of special light type lamps or strips which have not been made or are difficult to manufacture in the past, which greatly expands the application range of the illumination device 100.
由以上的說明可知:本發明實施例所提供的照明裝置100確實可以隨應用上的需求而任意撓曲,同時也不會隨著長度的增加而使得電源電壓大幅降低以致造成局部發光亮度衰減。進而達到擴大應用範圍以及有效穩定發光亮度之功效。 It can be seen from the above description that the illumination device 100 provided by the embodiment of the present invention can be flexibly arbitrarily changed according to the application requirements, and the power supply voltage is not greatly reduced as the length is increased, so that the local illumination luminance is attenuated. In turn, the effect of expanding the application range and effectively stabilizing the illuminating brightness can be achieved.
惟上述各實施例係用以說明本發明之特點,其目的在使熟習該技術者能瞭解本發明之內容並據以實施,而非限定本發明之專利範圍,故凡其他未脫離本發明所揭示之精神而完成之等效修飾或修改,仍應包含在以下所述之申請專利範圍中。 The embodiments are described to illustrate the features of the present invention, and the purpose of the present invention is to enable those skilled in the art to understand the present invention and to implement the present invention without limiting the scope of the present invention. Equivalent modifications or modifications made by the spirit of the disclosure should still be included in the scope of the claims described below.
100‧‧‧照明裝置 100‧‧‧Lighting device
10‧‧‧基板 10‧‧‧Substrate
11‧‧‧表面 11‧‧‧ surface
13‧‧‧交流電輸入端 13‧‧‧AC input
111、112‧‧‧區段 111, 112‧‧‧ Section
20、30‧‧‧半導體元件 20, 30‧‧‧ semiconductor components
50、60‧‧‧電源供應電路 50, 60‧‧‧ power supply circuit
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TW201024596A (en) * | 2008-08-11 | 2010-07-01 | Rohm Co Ltd | Lighting device |
TW201103356A (en) * | 2009-07-13 | 2011-01-16 | Delta Electronics Inc | Lamp and light emitting diode tube thereof |
CN101959341A (en) * | 2009-07-14 | 2011-01-26 | 一诠精密工业股份有限公司 | Protective circuit for light-emitting diode (LED) strings with different electrical characteristics |
TWM451773U (en) * | 2012-12-12 | 2013-04-21 | Cheng Chi Lan | LED lamp |
CN204300726U (en) * | 2012-04-25 | 2015-04-29 | 松下知识产权经营株式会社 | Lamp and lighting device |
-
2015
- 2015-08-21 TW TW104127401A patent/TWI584490B/en not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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TW201024596A (en) * | 2008-08-11 | 2010-07-01 | Rohm Co Ltd | Lighting device |
TW201103356A (en) * | 2009-07-13 | 2011-01-16 | Delta Electronics Inc | Lamp and light emitting diode tube thereof |
CN101959341A (en) * | 2009-07-14 | 2011-01-26 | 一诠精密工业股份有限公司 | Protective circuit for light-emitting diode (LED) strings with different electrical characteristics |
CN204300726U (en) * | 2012-04-25 | 2015-04-29 | 松下知识产权经营株式会社 | Lamp and lighting device |
TWM451773U (en) * | 2012-12-12 | 2013-04-21 | Cheng Chi Lan | LED lamp |
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TW201709548A (en) | 2017-03-01 |
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