TWI578211B - Capacitive input device and method for producing the same and image display device - Google Patents

Description

Method for manufacturing capacitance type input device, capacitance type input device, and image display device therewith

The present invention relates to a method of manufacturing a capacitance type input device capable of detecting a contact position of a finger as a change in electrostatic capacitance, and a capacitance type input device obtained by the manufacturing method, and the electrostatic capacitance type input device An image display device as a constituent element.

In an electronic device such as a mobile phone, a car navigation, a personal computer, a vending machine, or a bank terminal, in recent years, a tablet type input device is placed on the surface of a liquid crystal device or the like, and the liquid crystal device is referred to. In the image display area, the pointing image is touched by a finger or a stylus pen, and the information corresponding to the instruction image is input.

Such an input device (touch panel) includes a resistive film type, a capacitive type, and the like. However, the resistive film type input device has a structure in which the film is pressed and short-circuited by using two structures of a film and glass, and thus has a disadvantage that the operating temperature range is narrow or the change over time is weak.

On the other hand, the capacitance type input device has an advantage that a light-transmitting conductive film can be formed on one substrate. The electrostatic capacitance type input device has, for example, a type in which electrode patterns are extended in a direction crossing each other, and when a finger or the like comes into contact, a change in electrostatic capacitance between the electrodes is sensed to detect an input position (for example, refer to the following patent) Document 1).

Further, as an electrostatic capacitance type input device, there is also a type in which an in-phase, same-potential alternating current is applied to both ends of the light-transmitting conductive film, and finger connection is performed. The weak current flowing when the capacitor is formed is sensed by touching or approaching, thereby detecting the input position. As such a capacitance type input device, there is disclosed a capacitance type input device including: a plurality of first transparent electrode patterns formed by extending a plurality of pad portions in a first direction via a connection portion; and a plurality of The second transparent electrode pattern is electrically insulated from the first transparent electrode pattern via the interlayer insulating layer, and includes a plurality of pad portions formed to extend in a direction crossing the first direction (see, for example, Patent Document 2 below) . However, since the capacitance type input device laminates the front panel on the produced capacitance type input device, there is a problem that the capacitance type input device becomes thick or heavy.

Further, a capacitive touch panel is disclosed in which a mask layer, a sensing circuit, and an interlayer insulating layer are integrally formed on a non-contact side surface of the front panel (see, for example, Patent Document 3 below). In Patent Document 3, it is described that the front panel of the capacitive touch panel is integrated with the capacitance type input device, and the thin layer and the weight can be reduced. However, the detailed manufacturing method is not described.

On the other hand, there is disclosed a method in which ITO (indium tin oxide) is used as a material of the first and second transparent electrodes, and after patterning (exposure/development) by vacuum evaporation or liquid resist, the pair is not The portion covered with the liquid resist is subjected to an etching treatment to form a desired transparent electrode pattern (for example, refer to Patent Document 4). However, according to this method, there is a problem that the manufacturing apparatus is expensive and it is difficult to reduce the cost.

Moreover, as a method of performing the following protective plate (glass or acrylic plate), the protective plate is disposed on the touch panel body and the touch panel The outer side of the body (the side close to the contact surface), the touch panel body comprises a single or a plurality of substrates and electrode patterns formed on the substrates, and the following method is disclosed: using a pressure-sensitive adhesive sheet An air layer is prevented from being generated between the touch panel main body and the protective plate, and brightness and contrast are prevented from being lowered due to reflection of the air layer interface (for example, refer to Patent Document 5); the curable resin is applied under pressure reduction and bonded. Method (for example, refer to Patent Document 6). However, since the pressure is then high and the sheet price is high, the material cost is large, and since the pressure is applied to the thickness of the sheet, there is a problem that thinning or uniformization of the thickness of the layer is difficult.

Further, a method for producing a transparent electrode pattern in which a (metal) nanoparticle dispersion liquid as a material of the first and second transparent electrodes is patterned by screen printing, lithography, or inkjet printing is disclosed. Then, it is calcined (for example, refer to Patent Document 7). According to this manufacturing method, it is disclosed that the transparent electrode pattern can be easily manufactured, the cost can be easily reduced, and the conductive element group (electrode pattern) or the insulating layer can be directly provided on the protective plate, and the layer can be thinned/lightweight (for example, refer to the patent). Document 7). However, even with this method, there is a problem that the electrode pattern is thinned or the linearity of the pattern is insufficient.

Prior technical literature

Patent Document 1: Japanese Patent Laid-Open No. 2007-122326

Patent Document 2: Japanese Patent No. 4506875

Patent Document 3: Japanese Patent Laid-Open No. 2009-193587

Patent Document 4: U.S. Patent Application Publication No. 2008-0264699

Patent Document 5: Japanese Patent Laid-Open No. 2008-083491

Patent Document 6: Japanese Patent Laid-Open No. 2004-325788

Patent Document 7: Japanese Patent Laid-Open No. 2010-146283

On the other hand, the following content was developed and published: In a smart phone or tablet PC with a capacitive touch panel on a liquid crystal or organic EL display, the front panel (the surface directly touched by a finger) is used by Corning. Reinforced glass represented by reinforced glass (Gorilla glass). Further, an input device for forming an opening portion for opening and closing a switch (not a mechanical mechanism that is pressed by a change in electrostatic capacitance) is formed on a part of the front panel. These tempered glass have high strength and are difficult to process. Therefore, in order to form the opening, generally, an opening portion is formed before the tempering treatment, and then the tempering treatment is performed.

When a transparent electrode pattern is formed on the substrate after the tempering treatment having the opening portion by using a liquid resist for etching, the resist component may leak from the opening portion, or the resist component may form a light shield from the inside. The glass end on the mask layer up to the boundary of the front panel protrudes, so that there is a problem of contaminating the back side of the substrate. Further, in the method of forming a mask layer or a transparent electrode pattern using a dry film resist in which only a photocurable resin layer is formed on a temporary support, although the mask layer provided on the back side of the front panel must have a light shielding property However, there is a problem of light leakage due to bubbles in the dry film lamination, and a certain thickness is required from the viewpoint of the self-shielding property (a few micrometers in the case of a black layer and 30 in the case of a white layer) When the mask layer of the micron or so and the back surface of the front panel are laminated with a dry film, there is a problem that air bubbles remain in the portion of the thickness difference of the mask layer.

An object of the present invention is to provide a method of manufacturing a capacitance type input device capable of producing a thin layer/lightweight capacitance type input device with high quality in a simple step, and a capacitance type input device obtained by the manufacturing method And an image display device using the electrostatic capacitance type input device.

[1] A method of manufacturing a capacitance type input device having a front panel and having at least the following elements (1) to (5) on a non-contact side of the front panel, wherein the capacitance type The manufacturing method of the input device uses at least one of the following elements (1) to (5) using a photosensitive film, and the photosensitive film sequentially includes a temporary support, a thermoplastic resin layer, and a photocurable resin layer; (1) a mask layer; (2) a plurality of first transparent electrode patterns, wherein the plurality of pad portions are formed to extend in the first direction via the connection portion; (3) a plurality of second transparent electrode patterns, and the first transparent portion The electrode pattern is electrically insulated and includes a plurality of pad portions extending along a direction crossing the first direction; and (4) an insulating layer electrically insulating the first transparent electrode pattern from the second transparent electrode pattern And (5) the conductive element is electrically connected to at least one of the first transparent electrode pattern and the second transparent electrode pattern, and is different from the first transparent electrode pattern and the second transparent electrode pattern.

[2] The method of manufacturing the capacitance type input device according to [1], further comprising a method of covering all or a part of the elements (1) to (5) A transparent protective layer is provided.

[3] The method of manufacturing a capacitance type input device according to [2], wherein the transparent protective layer is formed using the photosensitive film.

[4] The method of manufacturing a capacitance type input device according to any one of [1] to [3], wherein the transparent conductive material is etched using an etching pattern formed by the photosensitive film. At least one of the first transparent electrode pattern, the second transparent electrode pattern, and the conductive element is formed.

The method of manufacturing a capacitance type input device according to any one of the above aspects of the present invention, wherein the photocurable resin layer of the photosensitive film is a conductive photocurable resin layer, and is used. The photosensitive film forms at least one of the first transparent electrode pattern, the second transparent electrode pattern, and the conductive element.

[6] The method of manufacturing the capacitance type input device according to any one of [1] to [5] wherein at least one of the first transparent electrode pattern and the second transparent electrode pattern is spanned to the front panel The non-contact surface and the surface of the mask layer on the opposite side to the front panel are provided.

[7] The method of manufacturing the capacitance type input device according to any one of [1] to [6] wherein the conductive element is provided on at least a surface side of the mask layer opposite to the front panel.

The method of manufacturing a capacitance type input device according to any one of the above aspects of the present invention, wherein the thermoplastic film has a thickness of from 3 μm to 30 μm, and the thermoplastic resin layer The viscosity measured at 100 ° C is at 1000 Pa. Sec~10000Pa. Sec area, the above light hard The viscosity of the resin layer measured at 100 ° C is 2000 Pa. Sec~50000Pa. In the region of sec, the viscosity of the thermoplastic resin layer is lower than the viscosity of the photocurable resin layer.

[9] The method of manufacturing a capacitive input device according to any one of [1] to [8], wherein the non-contact surface of the front panel is subjected to surface treatment, and the front panel on which the surface treatment has been performed is performed The above photosensitive film is provided on the non-contact surface.

[10] The method of manufacturing a capacitance type input device according to [9], wherein a decane compound is used for surface treatment of the front panel.

[11] The method of manufacturing a capacitance type input device according to any one of [1] to [10] wherein the front panel has an opening at least in part.

[12] A capacitance type input device manufactured by the method for manufacturing a capacitance type input device according to any one of [1] to [11].

[13] A video display device comprising a capacitance type input device manufactured by the method for manufacturing a capacitance type input device according to any one of [1] to [11] as a constituent element.

According to the present invention, it is possible to provide a method of manufacturing a capacitance type input device capable of producing a thin layer/lightweight capacitance type input device with high quality and a high quality, and a capacitance type input device obtained by the manufacturing method. And an image display device using the capacitance type input device.

Hereinafter, a method of manufacturing a capacitance type input device, a capacitance type input device, and a video display device according to the present invention will be described.

The description of the constituent elements described below is carried out in accordance with the representative of the present invention. The present invention is not limited to such an embodiment. In addition, the numerical range represented by "~" in this specification is the range which is contained in the numerical value of the [~~.

"Manufacturing method of electrostatic capacitance type input device"

The manufacturing method of the capacitance type input device of the present invention (hereinafter sometimes referred to simply as "the manufacturing method of the present invention") has a front panel and has at least the following (1) to (5) on the non-contact side of the front panel. At least one of the elements (1) to (5) is formed by using a photosensitive film including a temporary support, a thermoplastic resin layer, and a photocurable resin layer in this order: (1) a mask a layer; (2) a plurality of first transparent electrode patterns, wherein the plurality of pad portions are formed to extend in the first direction via the connection portion; and (3) a plurality of second transparent electrode patterns electrically insulated from the first transparent electrode pattern And including a plurality of pad portions extending in a direction crossing the first direction; (4) an insulating layer electrically insulating the first transparent electrode pattern from the second transparent electrode pattern; and (5) The conductive element is electrically connected to at least one of the first transparent electrode pattern and the second transparent electrode pattern, and is different from the first transparent electrode pattern and the second transparent electrode pattern.

First, the configuration of the capacitance type input device formed by the manufacturing method of the present invention will be described. Fig. 1 is a cross-sectional view showing the configuration of a capacitance type input device of the present invention. In Figure 1, the electrostatic capacitance type input device 10 includes a front panel 1, a mask layer 2, a first transparent electrode pattern 3, a second transparent electrode pattern 4, an insulating layer 5, a conductive element 6, and a transparent protective layer 7.

The front panel 1 includes a light-transmitting substrate such as a glass substrate, and tempered glass represented by Corning's Gorilla glass can be used. Further, in Fig. 1, one side of each element on which the front layer 1 is provided is referred to as a non-contact surface. In the capacitance type input device 10 of the present invention, a finger or the like is brought into contact with a contact surface (opposite surface of the non-contact surface) of the front panel 1 and the like. Hereinafter, the front panel may be referred to as a "substrate".

Further, a mask layer 2 is provided on the non-contact surface of the front panel 1. The mask layer 2 is a frame-like pattern formed around the display area on the non-contact side of the touch panel front panel, and is formed in order to prevent the guide wiring or the like from being invisible.

As shown in FIG. 2, in the capacitance type input device 10 of the present invention, the mask layer 2 is provided so as to cover a portion of the front panel 1 (a region other than the input surface in FIG. 2). Further, in the front panel 1, the opening portion 8 can be provided in a part as shown in Fig. 2 . A mechanical switch that is pressed by pressing can be provided in the opening portion 8.

Forming a plurality of first transparent electrode patterns 3 on the contact surface of the front panel 1, the plurality of pad portions are formed to extend in the first direction via the connection portion; the plurality of second transparent electrode patterns 4, and the first transparent electrode pattern 3 electrically insulating, and comprising a plurality of pad portions extending along a direction crossing the first direction; and an insulating layer 5 electrically insulating the first transparent electrode pattern 3 from the second transparent electrode pattern 4. The first transparent electrode pattern 3, the second transparent electrode pattern 4, and the conductive element 6 to be described later can be, for example, indium tin oxide (ITO) or indium zinc oxide (Indium Zinc Oxide, IZO). Production of a light conductive metal oxide film. Examples of such a metal film include an ITO film; a metal film of Al, Zn, Cu, Fe, Ni, Cr, Mo, or the like; a metal oxide film such as SiO ₂ or the like. In this case, the film thickness of each element can be set to 10 nm to 200 nm. Further, by baking, the amorphous ITO film is made of a polycrystalline ITO film, and thus the electric resistance can be lowered. Further, the first transparent electrode pattern 3, the second transparent electrode pattern 4, and the conductive element 6 to be described later may be produced by using a photosensitive film having a photocurable resin layer using the above-mentioned conductive fibers. In the case where the first conductive pattern or the like is formed by ITO or the like, reference is made to paragraphs [0014] to [0016] of Japanese Patent No. 4,506,785.

Further, at least one of the first transparent electrode pattern 3 and the second transparent electrode pattern 4 may be disposed across both the non-contact surface of the front panel 1 and the surface of the mask layer 2 opposite to the front panel 1 . In FIG. 1, it is illustrated that the second transparent electrode pattern is provided across both the non-contact surface of the front panel 1 and the surface of the mask layer 2 opposite to the front panel 1. Thus, even when a photosensitive film is laminated across a mask layer having a certain thickness and a back surface of the front panel, it is not necessary to use a vacuum laminator by using a photosensitive film having a specific layer structure of the present invention. Such high-priced equipment, in a simple step, can be used to cover the stack of partial boundaries without generating bubbles.

The first transparent electrode pattern 3 and the second transparent electrode pattern 4 will be described with reference to Fig. 3 . 3 is an explanatory view showing an example of a first transparent electrode pattern and a second transparent electrode pattern of the present invention. As shown in FIG. 3, the pad portion 3a of the first transparent electrode pattern 3 is formed to extend in the first direction via the connection portion 3b. Moreover, the second transparent electrode pattern 4 is insulated by the insulating layer 5 The first transparent electrode pattern 3 is electrically insulated and includes a plurality of pad portions formed to extend in a direction crossing the first direction (the second direction in FIG. 3). Here, in the case where the first transparent electrode pattern 3 is formed, the pad portion 3a and the connection portion 3b may be integrally formed, or only the connection portion 3b may be formed to bond the pad portion 3a and the second transparent electrode. The pattern 4 is made to be integrated (patterned). When the pad portion 3a and the second transparent electrode pattern 4 are integrally formed (patterned), as shown in FIG. 3, a part of the connection portion 3b and a part of the pad portion 3a are connected, and Each layer is formed by electrically insulating the first transparent electrode pattern 3 from the second transparent electrode pattern 4 by the insulating layer 5.

In Fig. 1, a conductive element 6 is provided on the surface side of the mask layer 2 opposite to the front panel 1. The conductive element 6 is electrically connected to at least one of the first transparent electrode pattern 3 and the second transparent electrode pattern 4, and is an element different from the first transparent electrode pattern 3 and the second transparent electrode pattern 4. The conductive element 6 is connected to the second transparent electrode pattern 4 in FIG.

Further, in FIG. 1, the transparent protective layer 7 is provided so as to cover all of the constituent elements. The transparent protective layer 7 may be configured to cover only a part of each constituent element. The insulating layer 5 and the transparent protective layer 7 may be the same material or different materials. As a material constituting the insulating layer 5 and the transparent protective layer 7, a material having high surface hardness and heat resistance is preferably used, and a known photosensitive siloxane resin material, acrylic resin material or the like is used.

In the manufacturing method of the present invention, at least one of the mask layer 2, the first transparent electrode pattern 3, the second transparent electrode pattern 4, the insulating layer 5, the conductive element 6, and the optional transparent protective layer 7 is Use in order The photosensitive film of the present invention of the temporary support, the thermoplastic resin layer, and the photocurable resin layer is formed.

The mask layer 2, the insulating layer 5, and the transparent protective layer 7 can be formed by transferring the photocurable resin layer to the front panel 1 by using the photosensitive film of the present invention. For example, in the case of forming the black mask layer 2, the photosensitive film of the present invention having the black light curable resin layer as the photocurable resin layer can be used, and the black light curable resin layer can be transferred. It is formed by printing on the surface of the front panel 1 described above. When the insulating layer 5 is formed, the photosensitive film of the present invention having an insulating photocurable resin layer as the photocurable resin layer can be used, and the photocurable resin layer can be transferred and formed. The surface of the front panel 1 of the first transparent electrode pattern is formed. When the transparent protective layer 7 is formed, the photosensitive film of the present invention having a transparent photocurable resin layer as the photocurable resin layer can be used, and the photocurable resin layer can be transferred and formed. The surface of each of the elements of the front panel 1 is formed.

When the mask layer 2 or the like is formed using the photosensitive film, even if the substrate (front panel) having the opening portion is formed, the resist component does not leak from the opening portion, and in particular, the resist component does not need to be shielded from light. The glass end of the mask layer from the pattern to the boundary limit of the front panel is protruded so as not to contaminate the back side of the substrate, and the touch panel having the advantage of thin layer/light weight can be manufactured in a simple procedure.

Further, in the formation of the mask layer 2 which is required to have a light-shielding property, the photosensitive film of the present invention having a specific layer having a thermoplastic resin layer between the photocurable resin layer and the temporary support can be prevented. Photosensitive film The generation of bubbles at the time of lamination can form a high-quality mask layer 2 without light leakage.

The first transparent electrode pattern 3, the second transparent electrode pattern 4, and the conductive element 6 can be formed using an etching process or a photosensitive film of the present invention having a conductive photocurable resin layer.

When the first transparent electrode pattern 3, the second transparent electrode pattern 4, and the other conductive element 6 are formed by etching, first, the front panel 1 on which the mask layer 2 or the like is formed by sputtering is formed. A transparent electrode layer of ITO or the like is formed on the non-contact surface. Then, the photosensitive film of the present invention having the photocurable resin layer for etching as the photocurable resin layer is used to form an etching pattern on the transparent electrode layer by exposure and development. Then, the transparent electrode layer is etched to pattern the transparent electrode, and the etching pattern is removed, whereby the first transparent electrode pattern 3 and the like can be formed.

When the first transparent electrode pattern 3, the second transparent electrode pattern 4, and the other conductive element 6 are formed by using the photosensitive film of the present invention having a conductive photocurable resin layer, the conductivity can be obtained by the above conductivity. The photocurable resin layer is formed by being transferred onto the surface of the front panel 1 described above.

When the first transparent electrode pattern 3 or the like is formed using a photosensitive film having the above-described conductive photocurable resin layer, even if the substrate (front panel) having an opening is formed, the resist component does not leak from the opening portion. Therefore, the back side of the substrate is not contaminated, and the touch panel having the advantage of thin layer/lightweight can be manufactured in a simple procedure.

Further, in the formation of the first transparent electrode pattern 3 or the like, heat is contained between the conductive photocurable resin layer and the temporary support by using The photosensitive film of the present invention having a specific layer of a plastic resin layer can prevent generation of bubbles during lamination of the photosensitive film, and can form the first transparent electrode pattern 3 and the second transparent layer with excellent electrical conductivity and low electrical resistance. Electrode pattern 4 and additional conductive elements 6.

Examples of the form formed in the process of the manufacturing method of the present invention include the aspects of FIGS. 4 to 8. FIG. 4 is a plan view showing an example of the tempered glass 11 in which the opening 8 is formed. FIG. 5 is a plan view showing an example of a front panel in which the mask layer 2 is formed. FIG. 6 is a plan view showing an example of a front panel on which the first transparent electrode pattern 3 is formed. FIG. 7 is a plan view showing an example of a front panel in which the first transparent electrode pattern 3 and the second transparent electrode pattern 4 are formed. FIG. 8 is a plan view showing an example of a front panel in which the conductive elements 6 different from the first and second transparent electrode patterns are formed. The above description is intended to exemplify the above description, and the scope of the present invention is not limited by the drawings.

"Photosensitive film of the present invention"

Next, the photosensitive film of the present invention used in the production method of the present invention will be described. The photosensitive film of the present invention has a thermoplastic resin layer between the temporary support and the photocurable resin layer. When a mask layer or the like is formed using a photosensitive film that does not have the above-mentioned thermoplastic resin layer, bubbles are generated in the elements formed by transferring the photocurable resin layer, and image unevenness occurs in the image display device, and thus it is impossible to obtain Excellent display characteristics.

The photosensitive film used in the present invention may be a negative material or a positive material.

<temporary support>

As the temporary support, a material which is flexible, under pressure or under pressure and heated without causing significant deformation, shrinkage or elongation can be used. Examples of such a support include a polyethylene terephthalate film, a cellulose triacetate film, a polystyrene film, a polycarbonate film, etc., and particularly preferably a biaxially oriented polyethylene terephthalate. Diester film.

The thickness of the temporary support is not particularly limited, but is generally in the range of 5 μm to 200 μm, and particularly preferably in the range of 10 μm to 150 μm in terms of ease of handling and versatility.

Further, the temporary support may be transparent, and may also contain a dyeing ruthenium, an alumina sol, a chromium salt, a zirconium salt or the like.

Further, in the temporary support of the present invention, conductivity can be imparted by the method described in JP-A-2005-221726 or the like.

<The thermoplastic resin layer>

In the photosensitive film of the present invention, a thermoplastic resin layer is provided between the temporary support and the colored photosensitive resin layer. The above thermoplastic resin layer is preferably alkali-soluble. The thermoplastic resin layer functions to act as a cushioning material so as to absorb irregularities on the surface of the substrate (including irregularities such as formed images), and preferably has a property of being deformable according to the unevenness of the surface of the object.

The thermoplastic resin layer is preferably in the form of a component containing an organic polymer material as described in Japanese Laid-Open Patent Publication No. Hei 5-72724, and particularly preferably in a form selected from the group consisting of (Vicat) method [specifically, by the polymer softening point measurement method of American Material Testing Method ASTM D1235], the organic polymer substance having a softening point of about 80 ° C or less is One less.

Specific examples thereof include a polyolefin such as polyethylene or polypropylene, an ethylene copolymer of ethylene and vinyl acetate or a saponified product thereof, a copolymer of ethylene and an acrylate or a saponified product thereof, and polyvinyl chloride or vinyl chloride. a vinyl chloride copolymer such as vinyl acetate or a saponified product thereof, a polyvinylidene chloride copolymer, a vinylidene chloride copolymer, a polystyrene, a styrene copolymer of styrene and a (meth) acrylate or a saponified product thereof , polyvinyl toluene, vinyl toluene copolymer of vinyl toluene with (meth) acrylate or its saponified product, poly(meth) acrylate, butyl (meth) acrylate and vinyl acetate ( An organic polymer such as a methyl acrylate copolymer, a vinyl acetate copolymer, a copolymerized nylon, a N-alkoxymethylated nylon, or a polyamine resin such as N-dimethylaminolated nylon.

The layer thickness of the thermoplastic resin layer is preferably from 3 μm to 30 μm. When the layer thickness of the thermoplastic resin layer is less than 3 μm, the followability at the time of lamination is insufficient, and the unevenness of the surface of the substrate may not be completely absorbed. Further, in the case where the layer thickness exceeds 30 μm, a load is applied at the time of drying (solvent removal) when the thermoplastic resin layer is formed toward the temporary support, or development of the thermoplastic resin layer takes time or the process adaptability is deteriorated. The layer thickness of the thermoplastic resin layer is more preferably 4 μm to 25 μm, still more preferably 5 μm to 20 μm.

The thermoplastic resin layer can be formed by applying a preparation liquid or the like containing a thermoplastic organic polymer, and the preparation liquid used for coating or the like can be prepared using a solvent. The solvent is not particularly limited as long as it can dissolve the polymer component constituting the layer, and examples thereof include methyl ethyl ketone, cyclohexanone, and propylene glycol monomethyl. Ether acetate, n-propanol, 2-propanol, and the like.

<Photocurable resin layer>

The photosensitive film of the present invention may be added with an additive to the photocurable resin layer depending on the use thereof. In other words, when the photosensitive film is used for forming the mask layer, the photocurable resin layer contains a colorant. In the case where the photosensitive film of the present invention has a conductive photocurable resin layer, the photocurable resin layer contains conductive fibers or the like.

When the photosensitive film of the present invention is a negative material, it is preferred that the photocurable resin layer contains an alkali-soluble resin, a polymerizable compound, a polymerization initiator or a polymerization initiator. Further, a coloring agent, an additive, or the like is used, but is not limited thereto.

As the alkali-soluble resin contained in the photosensitive film used in the present invention, paragraph [0025] of Japanese Patent Laid-Open Publication No. 2011-95716, paragraph [0033] to [0052] of Japanese Patent Laid-Open No. 2010-237589 can be used. The polymer described in .

As the polymerizable compound, a polymerizable compound described in paragraphs [0023] to [0024] of Japanese Patent No. 4098550 can be used.

As the polymerization initiator or the polymerization initiation system, the polymerizable compound described in [0031] to [0042] described in JP-A-2011-95716 can be used.

(conductive photocurable resin layer (conductive fiber))

When the photosensitive film of the present invention in which the conductive photocurable resin layer is laminated is used for the formation of a transparent electrode pattern or another conductive element, the following conductive fibers or the like can be used for photocurability. Resin layer in.

The structure of the conductive fiber is not particularly limited and may be appropriately selected depending on the purpose, but is preferably any one of a medium-solid structure and a hollow structure.

Here, the fiber of the medium solid structure may be referred to as a "line", and the fiber of the hollow structure may be referred to as a "tube". Further, a conductive fiber having an average minor axis length of 5 nm to 1,000 nm and an average major axis length of 1 μm to 100 μm may be referred to as a "nanowire".

Further, the average short-axis length is 1 nm to 1,000 nm, and the average major axis length is 0.1 μm to 1,000 μm, and the conductive fiber having a hollow structure is referred to as a "nanotube".

The material of the conductive fiber is not particularly limited as long as it has conductivity, and may be appropriately selected according to the purpose, and is preferably at least one of a metal and carbon. Among them, the conductive fiber is preferably a metal naphthalene. At least one of a rice noodle, a metal nanotube, and a carbon nanotube.

[Metal nanowire] -metal-

The material of the metal nanowire is not particularly limited, and for example, at least one metal selected from the group consisting of the fourth cycle, the fifth cycle, and the sixth cycle including the long period law table (IUPAC 1991) is preferable. More preferably, it is at least one metal selected from Group 2 to Group 14, and more preferably selected from Group 2, Group 8, Group 9, Group 10, Group 11, Group 12, and Group 13. At least one metal of the group and the group 14 is particularly preferably contained as a main component.

Examples of the metal include copper, silver, gold, platinum, palladium, nickel, tin, cobalt, rhodium, ruthenium, iron, osmium, iridium, manganese, molybdenum, tungsten, rhenium, titanium, iridium, Niobium, lead, alloys of these, and the like. Among these, in terms of excellent electrical conductivity, an alloy mainly containing silver or an alloy containing a metal other than silver and silver is preferable.

The main content of the above-mentioned silver means that the metal nanowire contains 50% by mass or more of silver, preferably 90% by mass or more.

Examples of the metal used in the alloy with the above silver include platinum, rhodium, palladium, and rhodium. These may be used alone or in combination of two or more.

-shape-

The shape of the metal nanowire is not particularly limited, and may be appropriately selected according to the purpose, and may be, for example, a columnar shape, a rectangular parallelepiped shape, or a columnar shape having a polygonal cross section. However, in applications requiring high transparency, Preferably, the cylindrical shape and the angle of the polygonal shape of the cross section are circular cross-sectional shapes.

The cross-sectional shape of the above-mentioned metal nanowire can be investigated by coating a metal nanowire aqueous dispersion on a substrate and observing the cross section by a transmission electron microscope (TEM).

The angle of the cross section of the metal nanowire refers to the peripheral portion of the point where the sides of the cross section are extended and intersect with the perpendicular line hanging from the adjacent side. Moreover, "each side of the section" means a line connecting the adjacent corners and corners. In this case, the ratio of the "outer circumference length of the cross section" to the total length of the "sides of the cross section" is set as the sharpness. The sharpness is expressed, for example, in the metal nanowire cross section shown in Fig. 9, by the ratio of the outer circumferential length of the cross section indicated by the solid line to the outer circumferential length of the pentagon indicated by the broken line. The cross-sectional shape having a sharpness of 75% or less is defined as a cross-sectional shape having a circular angle. The above sharpness is preferably 60% or less, more preferably 50% or less. If the above sharpness is super When it exceeds 75%, electrons may locally exist in this angle, plasmon absorption increases, yellow remains, etc., and transparency deteriorates. Further, the linearity of the edge portion of the pattern may be lowered to cause sway. The lower limit of the above sharpness is preferably 30%, more preferably 40%.

- average short axis length and average long axis length -

The average minor axis length (sometimes referred to as "average short axis diameter" and "average diameter") of the metal nanowire is preferably 150 nm or less, more preferably 1 nm to 40 nm, still more preferably 10 nm to 40 nm. Especially preferred is 15nm~35nm.

When the average minor axis length is less than 1 nm, oxidation resistance is deteriorated and durability is deteriorated. When it exceeds 150 nm, scattering due to the metal nanowire may occur, and sufficient transparency may not be obtained.

The average short-axis length of the above-mentioned metal nanowire was observed by a transmission electron microscope (TEM; manufactured by JEOL Ltd., JEM-2000FX), and 300 metal nanowires were observed, and the metal nanowires were determined based on the average value thereof. Average short axis length. Further, when the short axis of the metal nanowire is not circular, the short axis length is the shortest axis length.

The average major axis length (sometimes referred to as "average length") of the metal nanowire is preferably 1 μm to 40 μm, more preferably 3 μm to 35 μm, still more preferably 5 μm to 30 μm.

When the average major axis length is less than 1 μm, it may be difficult to form a closed mesh, and sufficient conductivity may not be obtained. When the thickness exceeds 40 μm, the metal nanowire may be too long to be entangled during production, and the manufacturing process may be performed. Aggregates are produced.

The average long axis length of the above-mentioned metal nanowires is observed by, for example, a transmission electron microscope (TEM; manufactured by JEOL Ltd., JEM-2000FX), and 300 metal nanowires are observed, and the metal nanowires are determined based on the average value thereof. The average long axis length. Further, when the metal nanowire is bent, a circle having an arc shape is considered, and a value calculated from the radius and the curvature is a long axis length.

The layer thickness of the conductive photocurable resin layer is preferably from 0.1 μm to 20 μm, from the viewpoint of process suitability such as stability of the coating liquid or drying at the time of coating or development time during patterning. It is 0.5 μm to 18 μm, and particularly preferably 1 μm to 15 μm. The content of the conductive fiber in the total solid content of the conductive photocurable resin layer is preferably from 0.01% by mass to 50% by mass, more preferably from the viewpoint of conductivity and stability of the coating liquid. 0.05% by mass to 30% by mass, particularly preferably 0.1% by mass to 20% by mass.

(mask layer (colorant))

Further, when the photosensitive film used in the present invention is used as a mask layer, a coloring agent can be used for the photocurable resin layer. As the coloring agent used in the present invention, a known coloring agent (organic pigment, inorganic pigment, dye, or the like) can be preferably used. Further, in the present invention, in addition to the black colorant, a mixture of pigments such as red, blue, and green may be used.

When the photocurable resin layer is used as a black mask layer, it is preferable to contain a black colorant from the viewpoint of optical density. Examples of the black colorant include carbon black, titanium carbon, iron oxide, titanium oxide, and graphite. Among them, carbon black is preferred.

The photocurable resin layer is used as a white mask layer. In the case, the white pigment described in paragraph [0015] or [0114] of the Japanese Patent Laid-Open Publication No. 2005-7765 can be used. For use as a mask layer of another color, a pigment described in paragraphs [0183] to [0185] of Japanese Patent No. 4546276 or the like may be used or mixed with a dye. Specifically, the pigments and dyes described in paragraphs [0038] to [0054] of JP-A-2005-17716, and paragraph number [0068] of JP-A-2004-361447 can be preferably used. The pigments described in the paragraphs [0080] to [0088] of JP-A-2005-17521, and the coloring agents described in JP-A-2005-17521.

The above coloring agent (preferably a pigment, more preferably carbon black) is preferably used as a dispersion. This dispersion liquid can be prepared by adding a composition obtained by mixing the coloring agent and the pigment dispersing agent in advance to an organic solvent (or a vehicle) to be described later and dispersing it. The above-mentioned vehicle refers to a portion of a medium in which a pigment is dispersed when a coating material is in a liquid state, and includes a component (adhesive) which is in a liquid form and which combines with the pigment to form a coating film, and a component (organic solvent) which is dissolved and diluted.

The dispersing machine used for the dispersing of the above-mentioned pigments is not particularly limited, and for example, a kneading machine and a roll described in 1983, "The Encyclopedia of Pigments", the first edition, Asakura Shoten, 2000, 438 items are mentioned. A known dispersing machine such as a mill, an attritor, a high speed grinder, a dispersing mixer, a homomixer, a sand mill, or the like. Further, it is also possible to perform fine pulverization by frictional force by mechanical grinding as described on page 310 of the document.

From the viewpoint of self-dispersion stability, the coloring agent used in the present invention is preferably a coloring agent having a number average particle diameter of 0.001 μm to 0.1 μm, more preferably 0.01. A coloring agent of μm~0.08μm. In addition, the "particle diameter" as used herein refers to a diameter when an electron micrograph image of a particle is a circle having the same area, and the "number average particle diameter" is obtained by determining the particle diameter for a plurality of particles. Refers to the 100 averages.

The layer thickness of the photocurable resin layer containing a colorant is preferably from 0.5 μm to 10 μm, more preferably from 0.8 μm to 5 μm, even more preferably from 1 μm to 3 μm, from the viewpoint of the difference in thickness from the other layers. The content of the coloring agent in the solid content of the colored photosensitive resin composition of the present invention is not particularly limited, and is preferably 15% by mass to 70% by mass, more preferably from the viewpoint of sufficiently shortening the developing time. 20% by mass to 60% by mass, and more preferably 25% by mass to 50% by mass.

The total solid content referred to in the present specification means the total mass of the nonvolatile component from which the solvent or the like is removed from the colored photosensitive resin composition.

In addition, when the insulating layer is formed using the photosensitive film, the layer thickness of the photocurable resin layer is preferably from 0.1 μm to 5 μm, more preferably from 0.3 μm to 3 μm, from the viewpoint of maintaining the insulating property. It is 0.5 μm to 2 μm.

When the transparent protective layer is formed using the photosensitive film, the layer thickness of the photocurable resin layer is preferably from 0.5 μm to 10 μm, more preferably from 0.8 μm to 5 μm, from the viewpoint of exhibiting sufficient surface protection energy. More preferably, it is 1 μm to 3 μm.

<additive>

Further, an additive may be used as the photocurable resin layer. As the above-mentioned additive, for example, the paragraph of Japanese Patent No. 4502784 can be cited. [0017] The surfactant described in paragraphs [0060] to [0071] of JP-A-2009-237362, or the thermal polymerization inhibitor described in paragraph [0018] of Japanese Patent No. 4502784 Further, the other additives described in paragraphs [0058] to [0071] of JP-A-2000-310706.

In addition, as a solvent in the case of producing the photosensitive film of the present invention by coating, the solvent described in paragraphs [0043] to [0044] of JP-A-2011-95716 can be used.

The above description has been focused on the case where the photosensitive film of the present invention is a negative material, and the photosensitive film may be a positive material. In the case where the photosensitive film is a positive type material, for example, a material described in JP-A-2005-221726 is used for the photocurable resin layer, but the invention is not limited thereto.

<Viscosity of Thermoplastic Resin Layer and Photocurable Resin Layer>

The viscosity of the thermoplastic resin layer of the present invention measured at 100 ° C is 1000 Pa. Sec~10000Pa. In the sec region, the viscosity of the photocurable resin layer measured at 100 ° C is 2000 Pa. Sec~50000Pa. The region of sec further preferably satisfies the following formula (A).

Formula (A): Viscosity of thermoplastic resin layer < Viscosity of photocurable resin layer

Here, the viscosity of each layer can be measured as follows. By drying at atmospheric pressure and under reduced pressure, the solvent is removed from the coating liquid for the thermoplastic resin layer or the photocurable resin layer to prepare a measurement sample. For example, VIBRON (DD-III type: Toyo BALDWIN) is used as a measuring device. ))) The measurement was carried out under the conditions of a starting temperature of 50 ° C, a measurement end temperature of 150 ° C, a temperature increase rate of 5 ° C / min, and a vibration number of 1 Hz / deg, and a measured value of 100 ° C was used.

<other layer>

In the photosensitive film used in the present invention, an intermediate layer may be provided between the photocurable resin layer and the thermoplastic resin layer, or a protective film or the like may be further provided on the surface of the photocurable resin layer.

In the photosensitive film used in the present invention, in order to prevent mixing of components at the time of coating a plurality of layers and during storage after coating, it is preferred to provide an intermediate layer. An oxygen blocking film having an oxygen blocking function as a "separating layer" described in Japanese Laid-Open Patent Publication No. Hei 5-72724, the sensitivity of the exposure is improved, and the time load of the exposure machine can be reduced. Thereby the productivity is improved.

As the intermediate layer and the protective film, those described in paragraphs [0083] to [0087] and [0093] of JP-A-2006-259138 can be suitably used.

<Method for Producing Photosensitive Film>

The photosensitive film of the present invention can be produced by the method for producing a photosensitive transfer material described in paragraphs [0094] to [0098] of JP-A-2006-259138.

Specifically, in the case of forming the photosensitive film of the present invention having an intermediate layer, a solution of a thermoplastic polymer and an additive in which a thermoplastic is dissolved is applied to the temporary support (coating of the thermoplastic resin layer) a cloth liquid), after drying it to provide a thermoplastic resin layer, in the thermoplastic resin layer The preparation liquid (coating liquid for an intermediate layer) is prepared by adding a resin or an additive to a solvent in which the thermoplastic resin layer is not dissolved, and drying the mixture to form an intermediate layer, and further on the intermediate layer The coating liquid for a colored photosensitive resin layer prepared by dissolving a solvent which does not dissolve the intermediate layer is dried and laminated to color the photosensitive resin layer, whereby it can be preferably produced.

<<Method of Manufacturing Electrostatic Capacitive Input Device of the Present Invention》

As described above, in the method of manufacturing a capacitance type input device of the present invention, at least one of a mask layer, a first transparent electrode pattern, a second transparent electrode pattern, an insulating layer, a conductive element, and an optional transparent protective layer The element is formed using the photosensitive film of the present invention having a temporary support, a thermoplastic resin layer, and a photocurable resin layer in this order.

When the mask layer, the insulating layer, the transparent protective layer, or the conductive photocurable resin layer are used, the first transparent electrode pattern, the second transparent electrode pattern, and the conductive element are formed by using the photosensitive film of the present invention. In the case of a permanent material such as a photosensitive material, the photosensitive film is exposed to a desired pattern pattern after being laminated on the substrate, in the case of a negative-type material, in the case of a non-exposed portion, in the case of a positive-type material. The exposed portion is subjected to development processing to be removed, whereby a pattern can be obtained. In this case, in terms of development, the thermoplastic resin layer and the photocurable layer may be removed by development using various liquids, or may be removed by the same liquid. A known developing device such as a brush or a high pressure jet may be combined as needed. After development, post-exposure and post-baking may also be performed as needed.

Further, in order to improve the adhesion of the photosensitive resin layer by lamination in the subsequent transfer step, the non-contact surface of the substrate (front panel) can be previously prepared. Perform surface treatment. As the surface treatment, it is preferred to carry out a surface treatment (decane coupling treatment) using a decane compound. As the decane coupling agent, a coupling agent having a functional group that interacts with the photosensitive resin is preferable. For example, by spraying, a decane coupling solution (N-β(aminoethyl) γ-aminopropyltrimethoxydecane 0.3% by mass aqueous solution, trade name: KBM603, manufactured by Shin-Etsu Chemical Co., Ltd.) is sprayed for 20 seconds. And carry out pure water spray cleaning. Then, it is reacted by heating. A heating bath can also be used, and the substrate of the bonding machine can be heated to promote the reaction.

Further, by using the photosensitive film of the present invention as a release material, the first transparent electrode layer, the second transparent electrode layer, and other conductive members may be formed. In this case, after patterning is performed using the photosensitive film of the present invention, a transparent conductive layer is formed on the entire surface of the substrate, and then the photocurable resin layer of the present invention is removed and removed for each deposited transparent conductive layer. Thus, a desired transparent conductive layer pattern (peeling method) can be obtained.

(When the photosensitive film of the present invention is used to form a permanent material)

In the case of forming a permanent material using the photosensitive film of the present invention, a method of forming a mask layer (black) will be described as an example, and a patterning method using the photosensitive film of the present invention will be described.

The method of forming the above-mentioned mask layer includes a method of removing the cover film from the photosensitive film of the present invention, and removing the above-mentioned photosensitivity of the photosensitive transfer material from which the cover film is removed. a transfer step of transferring the resin layer onto the substrate, an exposure step of exposing the photosensitive resin layer transferred onto the substrate, and a developing step of developing the exposed photosensitive resin layer to obtain a pattern image .

- Transfer step -

The transfer step is a step of transferring the photocurable resin layer of the photosensitive film from which the cover film is removed onto a substrate.

In this case, a method in which the temporary support is removed by laminating the photocurable resin of the photosensitive film to the substrate is preferred.

The transfer (bonding) of the photocurable resin layer to the surface of the substrate is carried out by superposing the photocurable resin layer on the surface of the substrate and pressurizing and heating. A known laminating machine such as a laminator, a vacuum laminator, and an automatic laminator which can further improve productivity can be used for lamination.

- exposure step, development step, and other steps -

As an example of the above-mentioned exposure step, development step, and other steps, the method described in paragraphs [0035] to [0051] of JP-A-2006-23696 can be preferably used in the present invention.

The exposure step is a step of exposing the photocurable resin layer transferred onto the substrate.

Specifically, a method of arranging a predetermined mask over the photocurable resin layer formed on the substrate and then self-masking through the mask, the thermoplastic resin layer, and the intermediate layer is exemplified. Exposure.

Here, the light source for the exposure may be appropriately selected and used as long as it is a light source capable of irradiating light (for example, 365 nm or 405 nm) capable of curing the photocurable resin layer. Specifically, an ultrahigh pressure mercury lamp, a high pressure mercury lamp, a metal halide lamp, etc. are mentioned. The exposure amount is usually about 5 mJ/cm ² to 200 mJ/cm ² , preferably about 10 mJ/cm ² to 100 mJ/cm ² .

The above development step is a step of developing the exposed photocurable resin layer.

The above development can be carried out using a developer. A known developing solution such as a developing solution described in Japanese Laid-Open Patent Publication No. Hei 5-72724 is not particularly limited. Further, the developer is preferably a developer in which the photocurable resin layer is subjected to a dissolution-type development behavior, and for example, a developer containing a compound having a pKa of 7 to 13 at a concentration of 0.05 mol/L to 5 mol/L is preferably used. Further, an organic solvent which is miscible with water may be added in a small amount. Examples of the organic solvent miscible with water include methanol, ethanol, 2-propanol, 1-propanol, butanol, diacetone alcohol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, and ethylene glycol. Mono-n-butyl ether, benzyl alcohol, acetone, methyl ethyl ketone, cyclohexanone, ε-caprolactone, γ-butyrolactone, dimethylformamide, dimethylacetamide, hexamethyl Phosphoniumamine, ethyl lactate, methyl lactate, ε-caprolactam, N-methylpyrrolidone, and the like. The concentration of the organic solvent is preferably from 0.1% by mass to 30% by mass. Further, a known surfactant may be further added to the developer. The concentration of the surfactant is preferably from 0.01% by mass to 10% by mass.

The development method may be any one of stirring development, shower development, shower/spin coating development, immersion development, and the like. Here, in the above description of the shower development, the unhardened portion can be removed by spraying the developer on the exposed photocurable resin layer by showering. In the case where the thermoplastic resin layer or the intermediate layer is provided, it is preferred to spray an alkaline liquid having a low solubility of the photocurable resin layer by spraying or the like before development, and to form the thermoplastic resin layer and the intermediate layer. The layers are removed. Further, it is preferable to develop the image by wiping with a brush or the like by spraying a cleaning agent or the like after development. The residue is removed. The liquid temperature of the developer is preferably from 20 ° C to 40 ° C, and the pH of the developer is preferably from 8 to 13.

The manufacturing method of the present invention may also include other steps such as a post-exposure step, a post-baking step, and the like.

Further, the patterning exposure may be performed after the temporary support is peeled off, or may be exposed before the temporary support is peeled off, and then the temporary support is peeled off. It can be an exposure through a mask or a digital exposure using a laser or the like.

(When the photosensitive film of the present invention is used as an etching resist)

When the photosensitive film of the present invention is used as an etching resist (etching pattern), a resist pattern can be obtained similarly to the above method. The etching can be performed by etching or resist peeling using a known method described in paragraphs [0048] to [0054] of JP-A-2010-152155.

For example, as a method of etching, a wet etching method which is generally performed by immersing in an etching liquid can be mentioned. The etching liquid used in the wet etching may be appropriately selected from an etching liquid of an acidic type or a basic type depending on the object to be etched. The acidic type of etching liquid may, for example, be an aqueous solution of an acidic component such as hydrochloric acid, sulfuric acid, hydrofluoric acid or phosphoric acid, or a mixed aqueous solution of an acidic component with a salt of ferric chloride, ammonium fluoride or potassium permanganate. As the acidic component, a component in which a plurality of acidic components are combined can be used. In addition, as the alkaline type etching liquid, an aqueous solution of an alkaline component such as a salt of an organic amine such as sodium hydroxide, potassium hydroxide, ammonia, an organic amine or tetramethylammonium hydroxide can be exemplified, and an alkaline component and an alkaline component are used. A mixed aqueous solution of a salt such as potassium permanganate or the like. Alkaline ingredients can also be used A combination of a plurality of alkaline components.

The temperature of the etching solution is not particularly limited, but is preferably 45 ° C or lower. In the present invention, a resin pattern used as an etching mask (etching pattern) is formed by using the photocurable resin layer, and it is possible to exhibit particularly excellent resistance to an acidic or alkaline etching liquid in such a temperature range. Therefore, the resin pattern is prevented from being peeled off in the etching step, and the portion where the resin pattern is not present is selectively etched.

After the above etching, in order to prevent contamination of the production line, the washing step and the drying step may be performed as needed. For the washing step, for example, the substrate is washed with pure water at a normal temperature for 10 seconds to 300 seconds, and for the drying step, a blast can be used for the blast pressure (about 0.1 kg/cm ² to 5 kg/cm ² ). Make appropriate adjustments.

Next, the peeling method of the resin pattern is not particularly limited, and for example, it is preferably immersed in a stripping liquid in a stirring at 30 ° C to 80 ° C at 50 ° C to 80 ° C for 5 minutes to 30 minutes. Minute method. The resin pattern used as the etching mask in the present invention exhibits excellent chemical liquid resistance at 45 ° C or lower as described above, but exhibits a property of swelling by an alkaline peeling liquid when the chemical liquid temperature is 50 ° C or higher. . According to such a property, when the peeling step is carried out using a peeling liquid of 50 ° C to 80 ° C, the step time is shortened, and the peeling residue of the resin pattern is reduced. That is, a difference in chemical liquid temperature is set between the etching step and the peeling step, whereby the resin pattern used as the etching mask in the present invention exhibits good chemical liquid resistance in the etching step, and on the other hand, Good peeling performance in the peeling step, so that the two opposite chemical liquid resistance and peeling properties can be satisfied. characteristic.

Examples of the peeling liquid include an inorganic alkaline component such as sodium hydroxide or potassium hydroxide, or an organic alkaline component such as a tertiary amine or a tertiary ammonium salt, and are dissolved in water, dimethyl sulfoxide, and N-methyl. The compound obtained in the pyrrolidone or a mixed solution of these. The peeling liquid can also be used for peeling by a spray method, a shower method, a paddle stirring method, or the like.

"Capacitance type input device and image display device including a capacitance type input device as a constituent element"

The electrostatic capacitance type input device obtained by the manufacturing method of the present invention and the video display device including the capacitance type input device as the constituent elements can use the "newest touch panel technology" (July 6, 2009 issue Techn adjacent time) (share)), Editor-in-Chief of Sangu Yuji, "Technology and Development of Touch Panels", CMC Publishing (2004, 12), FPD International 2009 Forum (FTD International Forum 2009) T-11 lecture materials, Cypress Semiconductor Corporation ( Cypress Semiconductor Corporation) The application disclosed in Application Note AN2292 et al.

Instance

Hereinafter, the present invention will be specifically described by way of examples, and the present invention is not limited to the following examples as long as the present invention does not exceed the gist thereof. In addition, "%" and "parts" are quality standards unless otherwise specified.

[Example 1] "Formation of the mask layer" [Modulation of Photosensitive Film K1 for Mask Layer Formation]

Polyethylene terephthalate film temporary support at a thickness of 75 μm The coating liquid for a thermoplastic resin layer containing the following prescription H1 was applied and dried using a slit nozzle. Next, the coating liquid for an intermediate layer containing the following prescription P1 is applied and dried. Further, the coating liquid for a black light curable resin layer containing the following prescription K1 is applied and dried. Thus, a thermoplastic resin layer having a dry film thickness of 15.1 μm was provided on the temporary support, and an intermediate layer having a thickness of 1.6 μm was dried, and a black light curable property having a dry film thickness of 2.2 μm was provided at an optical density of 4.0. The resin layer was finally crimped with a protective film (thickness 12 μm polypropylene film). In this manner, a transfer material in which a temporary support, a thermoplastic resin layer, an intermediate layer (oxygen barrier film), and a black photocurable resin layer are integrated is prepared, and the sample name is referred to as a photosensitive film K1 for mask layer formation.

(Coating liquid for thermoplastic resin layer: prescription H1)

. Methanol: 11.1 parts by mass

. Propylene glycol monomethyl ether acetate: 6.36 parts by mass

. Methyl ethyl ketone: 52.4 parts by mass

. Methyl methacrylate / 2-ethylhexyl acrylate / benzyl methacrylate / methacrylic acid copolymer (copolymerization composition ratio (mole ratio) = 55 / 11.7 / 4.5 / 28.8, molecular weight = 100,000, Tg≒70°C): 5.83 parts by mass

. Styrene/acrylic acid copolymer (copolymerization composition ratio (mole ratio) = 63/37, weight average molecular weight = 10,000, Tg ≒ 100 ° C): 13.6 parts by mass

. Monomer 1 (trade name: BPE-500, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.): 9.1 parts by mass

. Fluoropolymer: 0.54 parts by mass

The above fluorine-based polymer is 40 parts of C ₆ F ₁₃ CH ₂ CH ₂ OCOCH=CH ₂ , H(OCH(CH ₃ )CH ₂ ) ₇ OCOCH=CH ₂ 55 parts and H(OCHCH ₂ ) ₇ OCOCH=CH ₂ 5 Copolymer, weight average molecular weight 30,000, methyl ethyl ketone 30% by mass solution (trade name: Megafac F780F, manufactured by Dainippon Ink Chemical Industry Co., Ltd.)

Further, the viscosity at 120 ° C after removal of the solvent of the coating liquid H1 for the thermoplastic resin layer was 1500 Pa. Sec.

(coating solution for intermediate layer: prescription P1)

. Polyvinyl alcohol: 32.2 parts by mass

(trade name: PVA205, manufactured by Kuraray), saponification degree = 88%, degree of polymerization 550)

. Polyvinylpyrrolidone: 14.9 parts by mass

(trade name: K-30, manufactured by ISP Japan)

. Distilled water: 524 parts by mass

. Methanol: 429 parts by mass

(Coating liquid for black photocurable resin layer: prescription K1)

. K pigment dispersion 1: 31.2 parts by mass

. R pigment dispersion 1 (composition below): 3.3 parts by mass

. MMPGAc (manufactured by Daisel Chemical Co., Ltd.): 6.2 parts by mass

. Methyl ethyl ketone (manufactured by Tonson Chemical Co., Ltd.): 34.0 parts by mass

. Cyclohexanone (made by Kanto Electrochemical Industry Co., Ltd.) : 8.5 parts by mass

. Adhesive 2 (benzyl methacrylate / methacrylic acid = 78/22 molar ratio random copolymer, weight average molecular weight 38,000): 10.8 parts by mass

. Phenothiazine (manufactured by Tokyo Chemical Industry Co., Ltd.): 0.01 parts by mass

. Propylene glycol monomethyl ether acetate solution (76% by mass) of DPHA (dipentaerythritol hexaacrylate, manufactured by Nippon Kayaku Co., Ltd.): 5.5 parts by mass

. 2,4-bis(trichloromethyl)-6-[4'-(N,N-bis(ethoxycarbonylmethyl)amino-3'-bromophenyl]-s-triazine: 0.4 parts by mass

. Surfactant (trade name: Megafac F-780F, manufactured by Dainippon Ink (stock)): 0.1 parts by mass

In addition, the viscosity at 100 ° C after removal of the solvent of the coating liquid K1 for a black photocurable resin layer is 10000 Pa. Sec.

(Composition of K Pigment Dispersion 1)

. Carbon black (trade name: Nipex35, manufactured by Degussa): 13.1% by mass

. The following dispersant 1: 0.65 mass%

. Adhesive 1 (benzyl methacrylate / methacrylic acid = 72/28 molar ratio random copolymer, weight average molecular weight 37,000): 6.72% by mass

. Propylene glycol monomethyl ether acetate: 79.53% by mass

-R pigment dispersion 1 composition -

. Pigment (C.I. Pigment Red 177): 18% by mass

. Adhesive 1 (benzyl methacrylate / methacrylic acid = 72/28 molar ratio random copolymer, weight average molecular weight 37,000): 12% by mass

. Propylene glycol monomethyl ether acetate: 70% by mass

[Formation of mask layer]

Then, on the tempered glass (300 mm × 400 mm × 0.7 mm) in which the opening (15 mm Φ) was formed, the glass cleaning agent liquid adjusted to 25 ° C was spray-sprayed for 20 seconds while using the rotation with nylon hair. The brush is cleaned, and after washing with pure water, a decane coupling solution (N-β(aminoethyl) γ-aminopropyltrimethoxydecane 0.3% by mass aqueous solution is sprayed by spraying, trade name: KBM603, manufactured by Shin-Etsu Chemical Co., Ltd.), was sprayed with pure water for 20 seconds. The substrate was heated at 140 ° C for 2 minutes using a substrate preparation heating device. On the obtained decane-coupled glass substrate, the cover film is removed from the photosensitive layer K1 for mask layer formation obtained above, and the surface of the black light-curable resin layer exposed after removal is coupled with the above-described decane-coupled glass substrate. The surface of the material was superposed on each other, and a laminating machine (Hitachi Industries Co., Ltd. (Lamic II type)) was used, and a rubber roll temperature of 130 ° C was applied to the substrate heated at 140 ° C above. The laminate was pressed at a pressure of 100 N/cm and a conveying speed of 2.2 m/min. Then, the temporary support of polyethylene terephthalate is peeled off at the interface with the thermoplastic resin layer, thereby removing the temporary support. After peeling off the temporary support, using a proximity exposure machine (manufactured by Hitachi High-Tech Electronics Engineering Co., Ltd.) having an ultra-high pressure mercury lamp, the substrate and the exposure mask (having In the state in which the quartz crystal exposure mask of the bezel pattern was vertically erected, the distance between the exposure mask surface and the black photo-curable resin layer was set to 200 μm, and pattern exposure was performed at an exposure amount of 70 mJ/cm ² (i-ray).

Next, a triethanolamine-based developing solution (a liquid obtained by diluting 10-fold triethanolamine, trade name: T-PD2 (manufactured by Fujifilm Co., Ltd.) in pure water) was treated at 33 ° C for 60 seconds. Spray development was carried out using a flat nozzle pressure of 0.1 MPa to remove the thermoplastic resin layer and the intermediate layer. Then, air was sprayed on the upper surface of the glass substrate to remove the liquid, and then pure water was sprayed and sprayed for 10 seconds to perform pure water spray cleaning, and air was sprayed to reduce liquid retention on the substrate.

Then, using a sodium carbonate/sodium bicarbonate-based developing solution (a product obtained by diluting the product name: T-CD1 (manufactured by Fujifilm Co., Ltd.) in pure water to 5 times), the spray pressure was set to 32 ° C. 0.1 MPa, developed for 45 seconds, and washed in pure water.

Then, using a cleaning solution containing a surfactant (a liquid obtained by diluting a product of T-SD3 (manufactured by Fujifilm Co., Ltd.) in pure water by 10 times) was treated at 33 ° C for 20 seconds to form a cone nozzle. (cone nozzle) pressure 0.1 MPa was sprayed by spraying, and the formed pattern image was wiped off by a rotating brush having soft nylon hair to remove the residue. Further, the ultrapure water was sprayed at a pressure of 9.8 MPa by an ultrahigh pressure washing nozzle to remove the residue, and secondly, it was post-exposed at an exposure amount of 1300 mJ/cm ² in the air, and further post-baking treatment was performed at 240 ° C for 80 minutes. Thus, a front panel in which a mask layer having an optical density of 4.0 and a film thickness of 2.0 μm was formed was obtained.

"Formation of the first transparent electrode pattern" [Formation of Transparent Electrode Layer]

The front panel on which the mask layer was formed was introduced into a vacuum chamber, and an ITO target (indium: tin = 95:5 (mole ratio)) having a SnO ₂ content of 10% by mass was used, and DC magnetron sputtering was performed. (Condition: substrate temperature: 250 ° C, argon gas pressure: 0.13 Pa, oxygen pressure: 0.01 Pa), an ITO film having a thickness of 40 nm was formed, thereby obtaining a front plate on which a transparent electrode layer was formed. The surface resistance of the ITO film was 80 Ω/□.

[Modulation of Photosensitive Film E1 for Etching]

In the preparation of the photosensitive layer K1 for mask layer formation, the coating liquid for a photocurable resin layer for etching is replaced with the coating liquid for etching photocurable resin layer containing the following prescription E1, In the same manner as the preparation of the photosensitive layer K1 for forming the cover layer, the photosensitive film E1 for etching (the film thickness of the photocurable resin layer for etching was 2.0 μm) was obtained.

(Coating liquid for photocurable resin layer for etching: prescription E1)

. Methyl methacrylate/styrene/methacrylic acid copolymer

(Copolymer composition (% by mass): 31/40/29, mass average molecular weight 60000, acid value 163 mgKOH/g): 16 parts by mass

. Monomer 1 (trade name: BPE-500, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.): 5.6 parts by mass

. Tetraethylene oxide monomethacrylate 0.5 mA adduct of hexamethylene diisocyanate: 7 parts by mass

. Cyclohexanedimethanol monoacrylate as a compound having one polymerizable group in the molecule: 2.8 parts by mass

. 2-chloro-N-butylacridone: 0.42 parts by mass

. 2,2-bis(o-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole: 2.17 parts by mass

. Peacock oxalate: 0.02 parts by mass

. Hidden crystal violet: 0.26 parts by mass

. Phenothiazine: 0.013 parts by mass

. Surfactant (trade name: Megafac F-780F, manufactured by Dainippon Ink (stock)): 0.03 parts by mass

. Methyl ethyl ketone: 40 parts by mass

. 1-methoxy-2-propanol: 20 parts by mass

In addition, the viscosity at 100 ° C after removal of the solvent of the coating liquid E1 for etching photocurable resin layer was 2500 Pa. Sec.

[Formation of First Transparent Electrode Pattern]

In the same manner as the formation of the mask layer, the front panel on which the transparent electrode layer was formed was cleaned, and the etching photosensitive film E1 from which the cover film was removed was laminated (substrate temperature: 130 ° C, rubber roller temperature: 120 ° C) , line pressure 100N / cm, conveying speed 2.2m / min). After peeling off the temporary support, the distance between the surface of the exposure mask (the quartz exposure mask having the transparent electrode pattern) and the photocurable resin layer for etching was set to 200 μm, and the exposure amount was 50 mJ/cm ² (i-ray). Perform pattern exposure.

Next, a triethanolamine-based developer (a liquid obtained by diluting 10-fold triethanolamine, trade name: T-PD2 (manufactured by Fujifilm Co., Ltd.) in pure water) was treated at 25 ° C for 100 seconds. Using a cleaning solution containing a surfactant (a product obtained by diluting the product name: T-SD3 (manufactured by Fujifilm Co., Ltd.) in pure water by 10 times) at 33 ° C for 20 seconds, using a rotating brush, The ultrahigh pressure cleaning nozzle was subjected to residue removal, and further subjected to a post-baking treatment at 130 ° C for 30 minutes to obtain a front panel in which a pattern of a transparent electrode layer and an etching photocurable resin layer was formed.

The front plate on which the transparent electrode layer and the photocurable resin layer pattern for etching were formed was immersed in an etching bath in which an ITO etchant (hydrochloric acid, potassium chloride aqueous solution, liquid temperature: 30° C.) was placed, and treated for 100 seconds. The transparent electrode layer in the exposed region which is not covered with the photocurable resin layer for etching is dissolved and removed, thereby obtaining a front plate having a pattern of a transparent electrode layer having a pattern of a photocurable resin layer for etching.

Next, the front panel with the pattern of the transparent electrode layer having the pattern of the photocurable resin layer for etching is immersed in a resist stripping solution (N-methyl-2-pyrrolidone, monoethanolamine, surfactant (product) In the resist stripping tank of the name: Surfynol 465 (air temperature: 45 ° C), the etching is performed for 200 seconds, and the photocurable resin layer for etching is removed to obtain a mask layer and a first transparent electrode pattern. Front panel.

"Formation of Insulation Layers" [Modulation of Photosensitive Film W1 for Forming Insulating Layer]

In the preparation of the photosensitive layer K1 for the formation of the mask layer, the coating liquid for the photocurable resin layer for an insulating layer containing the following prescription W1 is replaced with the coating liquid for the photocurable resin layer for an insulating layer. In the same manner as the preparation of the photosensitive layer K1 for forming the cover layer, the photosensitive film W1 for forming an insulating layer (the film thickness of the photocurable resin layer for an insulating layer was 1.4 μm) was obtained.

(Coating liquid for forming an insulating layer: prescription W1)

. Adhesive 3 (cyclohexyl methacrylate (a) / methyl methacrylate (b) / methacrylic acid copolymer (c) glycidyl methacrylate adduct (d) (composition (% by mass) :a/b/c/d=46/1/10/43, mass average molecular weight: 36000, acid value 66 mgKOH/g) 1-methoxy-2-propanol, methyl ethyl ketone solution (solid content :45%)): 12.5 parts by mass

. Propylene glycol monomethyl ether acetate solution (76% by mass) of DPHA (dipentaerythritol hexaacrylate, manufactured by Nippon Kayaku Co., Ltd.): 1.4 parts by mass

. Aurethane-based monomer (trade name: NK oligo UA-32P, manufactured by Shin-Nakamura Chemical Co., Ltd.: 75% non-volatile content, propylene glycol monomethyl ether acetate: 25%): 0.68 parts by mass

. Tripentaerythritol octaacrylate (trade name: V#802, manufactured by Osaka Organic Chemical Industry Co., Ltd.): 1.8 parts by mass

. Diethyl thioxanthone: 0.17 parts by mass

. 2-(Dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone (trade name: Irgacure 379, manufactured by BASF): 0.17 parts by mass

. Dispersing agent (trade name: Solsperse 20000, manufactured by Avecia): 0.19 parts by mass

. Surfactant (trade name: Megafac F-780F, manufactured by Dainippon Ink): 0.05 parts by mass

. Methyl ethyl ketone: 23.3 parts by mass

. MMPGAc (manufactured by Daisel Chemical Co., Ltd.): 59.8 parts by mass

Further, the viscosity at 100 ° C after removal of the solvent of the coating liquid W1 for forming an insulating layer was 4000 Pa. Sec.

In the same manner as the formation of the mask layer, the front surface of the first transparent electrode pattern is cleaned and subjected to a decane coupling treatment, and the photosensitive film W1 for forming an insulating layer from which the cover film is removed is laminated (base temperature: 100 ° C, rubber roller temperature 120 ° C, line pressure 100 N / cm, conveying speed 2.3 m / min). After the temporary support was peeled off, the distance between the surface of the exposure mask (the quartz exposure mask having the pattern for the insulating layer) and the photocurable resin layer for etching was set to 100 μm, and the exposure amount was 30 mJ/cm ² (i-ray). Perform pattern exposure.

Next, a triethanolamine-based developing solution (a liquid obtained by diluting 10% by mass of triethanolamine, trade name: T-PD2 (manufactured by Fujifilm Co., Ltd.) in pure water) was treated at 33 ° C for 60 seconds. The sodium carbonate/sodium bicarbonate-based developer (a product obtained by diluting the product name: T-CD1 (manufactured by Fujifilm Co., Ltd.) in pure water to 5 times) was treated at 25 ° C for 50 seconds, and was used. Surfactant cleaning solution (trade name: T-SD3 (Limited by Fujifilm Co., Ltd.), which was diluted 10 times in pure water, was treated at 33 ° C for 20 seconds, and the residue was removed by a rotating brush or an ultra-high pressure cleaning nozzle, and further carried out at 230 ° C for 60 minutes. The post-baking treatment is performed to obtain a front panel in which a mask layer, a first transparent electrode pattern, and an insulating layer pattern are formed.

"Formation of the second transparent electrode pattern" [Formation of Transparent Electrode Layer]

Similarly to the formation of the first transparent electrode pattern, the front panel on which the first transparent electrode pattern and the insulating layer pattern are formed is subjected to DC magnetron sputtering (condition: substrate temperature 50 ° C, argon gas pressure 0.13 Pa, oxygen) At a pressure of 0.01 Pa), an ITO film having a thickness of 80 nm was formed, thereby obtaining a front panel on which a transparent electrode layer was formed. The surface resistance of the ITO film was 110 Ω/□.

In the same manner as the formation of the first transparent electrode pattern, the front surface of the first transparent electrode pattern, the insulating layer pattern, the transparent electrode layer, and the photocurable resin layer for etching is obtained by using the photosensitive film E1 for etching (post Baking treatment; 130 ° C, 30 minutes).

Further, in the same manner as the formation of the first transparent electrode pattern, etching (30 ° C, 50 seconds) is performed, and the photocurable resin layer for etching is removed (45 ° C, 200 seconds), thereby obtaining a mask layer, a first transparent electrode pattern, an insulating layer pattern, and a front panel of the second transparent electrode pattern.

"Formation of Conductive Elements Different from First and Second Transparent Electrode Patterns"

Forming the first transparent electrode pattern, the insulating layer pattern, and the second transparent electrode pattern in the same manner as the formation of the first and second transparent electrode patterns described above The front panel was subjected to DC magnetron sputtering treatment to obtain a front panel on which an aluminum (Al) film having a thickness of 200 nm was formed.

In the same manner as the formation of the first and second transparent electrode patterns, the first transparent electrode pattern, the insulating layer pattern, the second transparent electrode pattern, and the photocurable resin layer for etching are obtained by using the photosensitive film E1 for etching. The front panel of the pattern. (post-baking treatment; 130 ° C, 30 minutes).

Further, etching (30 ° C, 50 seconds) was carried out in the same manner as in the formation of the first transparent electrode pattern, and the photocurable resin layer for etching was removed (45 ° C, 200 seconds), whereby a mask layer was formed, and the first a transparent electrode pattern, an insulating layer pattern, a second transparent electrode pattern, and a front panel of a conductive element different from the first and second transparent electrode patterns.

"Formation of Transparent Protective Layer"

In the same manner as the formation of the insulating layer, the photosensitive film W1 for forming an insulating layer from which the cover film is removed is laminated on the front plate on which the conductive elements different from the first and second transparent electrode patterns are formed, and the temporary support is temporarily supported. After the body is peeled off, the front side exposure is performed at an exposure amount of 50 mJ/cm ² (i-ray) without exposure mask, and development, post-exposure (1000 mJ/cm ² ), and post-baking treatment are performed, thereby obtaining a cover layer, The front panel 1 of the insulating layer (transparent protective layer) is laminated on the first transparent electrode pattern, the insulating layer pattern, the second transparent electrode pattern, and the conductive elements different from the first and second transparent electrode patterns.

"Production of Image Display Device (Touch Panel)"

A liquid crystal display element manufactured by the method described in JP-A-2009-47936 is bonded to a front panel manufactured first, and a known one is used. The image display device 1 including a capacitance type input device as a constituent element was produced.

"Front panel 1, evaluation of image display device 1"

In each of the above steps, the front panel 1 in which the mask layer, the first transparent electrode pattern, the insulating layer pattern, the second transparent electrode pattern, and the conductive elements different from the first and second transparent electrode patterns are formed is opened. There is no pollution in the part and the back, it is easy to clean, and there is no problem of contamination of other components.

Further, the mask layer has no pinholes and is excellent in light shielding properties.

Further, there is no problem in the respective conductivity of the first transparent electrode pattern, the second transparent electrode pattern, and the different conductive elements, and the first transparent electrode pattern and the second transparent electrode pattern have Insulation.

Further, the transparent protective layer is free from defects such as bubbles, and an image display device having excellent display characteristics is obtained.

[Example 2] "Production of Photosensitive Film C1 Layered with Conductive Photocurable Resin Layer"

In the preparation of the photosensitive layer K1 for mask layer formation, the coating liquid for forming a black curable resin layer is replaced with a coating liquid for forming a conductive photocurable resin layer containing the following prescription C1. In the same manner as the preparation of the photosensitive layer K1 for forming the cover layer, the photosensitive film C1 in which the conductive photocurable resin layer was laminated (the film thickness of the conductive photocurable resin layer was 2.0 μm) was obtained.

<Preparation of Coating Liquid for Forming Conductive Photocurable Resin Layer> (modulation of silver nanowire dispersion (1))

A silver nitrate solution in which 0.51 g of silver nitrate powder was dissolved in 50 mL of pure water was prepared. Then, 1 N aqueous ammonia was added to the silver nitrate solution until it became transparent, and pure water was added so as to have a total amount of 100 mL to prepare an additive liquid A.

Further, 0.5 g of glucose powder was dissolved in 140 mL of pure water to prepare an addition liquid G.

Further, 0.5 g of HTAB (cetyltrimethylammonium bromide) powder was dissolved in 27.5 mL of pure water to prepare an addition liquid H.

Then, 20.6 mL of the above-mentioned addition liquid A was placed in a three-necked flask and stirred at room temperature. The funnel was added to the liquid in the order of 41 mL of pure water, 20.6 mL of the addition liquid H, and 16.5 mL of the addition liquid G, and the mixture was heated while stirring at 90 ° C for 5 hours at 200 rpm to obtain a silver nanowire water dispersion ( 1).

After the obtained silver nanowire water dispersion (1) was cooled, the polyvinylpyrrolidone (trade name: K-30, manufactured by Wako Pure Chemical Industries Co., Ltd.) was 0.05 with respect to the mass 1 of silver. The mixture was added with stirring, and then centrifuged to obtain a conductivity of 50 μS/cm or less. The mixture was centrifuged with propylene glycol monomethyl ether to remove water, and finally propylene glycol monomethyl ether was added to prepare a silver nanowire solvent. Dispersion (1).

(Preparation of Coating Liquid C1 for Forming Conductive Photocurable Resin Layer)

The following composition was stirred, and the silver nanowire dispersion (1) was mixed so that the final silver concentration was 1.0 mass%, and the coating liquid for forming a conductive photocurable resin layer was prepared.

In addition, the viscosity at 100 ° C after removal of the solvent of the coating liquid C1 for forming a conductive photocurable resin layer is 4500 Pa. Sec.

- Composition of Coating Liquid C1 for Conductive Photocurable Resin Layer Formation -

. The above adhesive 3 (solid content: 45%): 3.80 parts by mass

. KAYARAD DPHA (manufactured by Nippon Kayaku Co., Ltd.): 1.59 parts by mass

. 2-(Dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone (trade name: Irgacure 379, manufactured by BASF): 0.159 parts by mass

. EHPE-3150 (made by Daisel Chemical Co., Ltd.): 0.150 parts by mass

. Surfactant (trade name: Megafac F-781F, manufactured by Dainippon Ink): 0.002 parts by mass

. MMPGAc (manufactured by Daisel Chemical Co., Ltd.): 19.3 parts by mass

"Formation of Transparent Electrode Patterns, Insulation Layers, etc."

In the same manner as in Example 1, after obtaining the front panel on which the mask layer was formed, the first transparent electrode pattern was formed using the photosensitive film C1 in which the conductive photocurable resin layer was laminated.

First, the front panel on which the mask layer was formed was cleaned, and the photosensitive film C1 from which the cover film was removed was laminated (base material temperature: 120 ° C, rubber roll temperature: 120 ° C, line pressure: 100 N/cm, and conveyance speed: 1.7 m). /min). After the temporary support was peeled off, the distance between the surface of the exposure mask (the quartz exposure mask having the transparent electrode pattern) and the conductive photocurable resin layer was set to 100 μm, and the exposure amount was 100 mJ/cm ² (i-ray). Pattern exposure.

Next, a triethanolamine-based developing solution (a liquid obtained by diluting 10-fold triethanolamine, trade name: T-PD2 (manufactured by Fujifilm Co., Ltd.) in pure water) was treated at 30 ° C for 60 seconds. The sodium carbonate/sodium bicarbonate-based developer (liquid obtained by diluting the product name: T-CD1 (manufactured by Fujifilm Co., Ltd.) in pure water by 5 times) was treated at 25 ° C for 60 seconds, and the interface was used. The cleaning solution of the active agent (the liquid obtained by diluting the product name: T-SD3 (manufactured by Fujifilm Co., Ltd.) in pure water by 10 times) was treated at 33 ° C for 20 seconds, using a rotating brush and an ultra-high pressure cleaning nozzle. The residue was removed, and post-baking treatment was performed at 230 ° C for 60 minutes to obtain a front panel in which a mask layer and a first transparent electrode pattern were formed.

Then, an insulating layer was formed in the same manner as in Example 1. Then, the second transparent electrode pattern is formed by using the photosensitive film C1 in which the conductive photocurable resin layer is laminated. Further, in the same manner as in Example 1, the formation of the conductive element and the transparent protective layer different from the first and second transparent electrode patterns was performed, and the front panel 2 was obtained.

Further, in the same manner as in Example 1, the video display device 2 was produced.

"Evaluation of Front Panel 2 and Image Display Device 2"

In each of the above steps, the front layer 2, the opening portion, and the mask layer, the first transparent electrode pattern, the insulating layer pattern, the second transparent electrode pattern, and the conductive elements different from the first and second transparent electrode patterns are formed. There is no pollution on the back side, it is easy to clean, and there is no problem of contamination of other components.

Further, the mask layer has no pinholes and is excellent in light shielding properties.

Further, there is no problem in the respective conductivity of the first transparent electrode pattern, the second transparent electrode pattern, and the conductive elements different therefrom, and the other one The surface has insulation between the first transparent electrode pattern and the second transparent electrode pattern.

Further, the transparent protective layer is free from defects such as bubbles, and an image display device having excellent display characteristics is obtained.

[Comparative Example 1]

The tempered glass (300 mm × 400 mm × 0.7 mm) in which the opening (15 mm Φ) was formed was cleaned by a UV cleaning device, and then brushed with a cleaning agent, and ultrasonic cleaning was performed using ultrapure water. The substrate was heat-treated at 120 ° C for 3 minutes to stabilize the surface state. After the substrate was cooled and the temperature was adjusted to 23° C., the black light obtained in Example 1 was applied by a glass substrate coater (FIS JAPAN Co., Ltd., trade name: MH-1600) having a slit nozzle. The coating liquid K1 for a curable resin layer. Then, by using a VCD (Vacuum Drying Apparatus, manufactured by Tokyo Ohka Kogyo Co., Ltd.) to dry a part of the solvent in 30 seconds and eliminating the fluidity of the coating layer, Edge Bead Removal (EBR) was used. The excess coating liquid around the substrate was removed, and prebaked at 120 ° C for 3 minutes to obtain a black photocurable resin layer K1 having a film thickness of 2.33 μm and an optical density of 4.0 on the tempered glass. Agent method).

Using a proximity exposure machine (manufactured by Hitachi High-Technologies Co., Ltd.) having an ultra-high pressure mercury lamp, the substrate and the exposure mask (quartz exposure mask having a bezel pattern) are vertically erected. The distance between the exposure mask surface and the black photocurable resin layer K1 was set to 200 μm, and pattern exposure was performed from the black photocurable resin layer K1 side at an exposure amount of 300 mJ/cm ² in a nitrogen atmosphere.

Next, pure water is sprayed by a shower nozzle to uniformly wet the surface of the black photocurable resin layer with K1, and a KOH-based developer (KOH, containing a nonionic surfactant, trade name: CDK) is uniformly wetted. -1, manufactured by Fuji Film Electronic Materials Co., Ltd.) The liquid obtained by diluting 100 times was spray-developed at 23 ° C for 80 seconds and at a flat nozzle pressure of 0.04 MPa, and further, by ultra-high pressure cleaning nozzle Ultrapure water was sprayed under a pressure of 9.8 MPa to carry out residue removal, followed by post exposure in an atmosphere at an exposure amount of 1300 mJ/cm ² , and further post-baking treatment at 240 ° C for 80 minutes to obtain an optical density. 4.0. Front panel of a mask layer having a film thickness of 2.0 μm.

Then, in the same manner as in the case of the example 1, the ITO sputtering was performed, and the coating liquid E1 for the photocurable resin layer for etching was applied in the same manner as the formation of the black curable resin layer K1 of the comparative example 1 (liquid resist). The front panel in which the photocurable resin layer for etching is formed is obtained, and the distance between the surface of the exposure mask (the quartz exposure mask having the transparent electrode pattern) and the photocurable resin layer for etching is set to 200 μm. In the environment, pattern exposure was performed at an exposure amount of 260 mJ/cm ² from the side of the photocurable resin layer for etching.

Next, a triethanolamine-based developing solution (a liquid obtained by diluting 10-fold triethanolamine, trade name: T-PD2 (manufactured by Fujifilm Co., Ltd.) in pure water) was treated at 23 ° C for 70 seconds. The residue was removed by an ultrahigh pressure cleaning nozzle, and further post-baking treatment was performed at 130 ° C for 30 minutes to obtain a front plate on which a transparent electrode layer and a photocurable resin layer pattern for etching were formed. This was etched in the same manner as in Example 1. The resist is peeled off, thereby obtaining a front panel in which the mask layer and the first transparent electrode pattern are formed.

Further, in the same manner as the formation of the black-light-curable resin layer K1 of the comparative example 1, the coating liquid W1 for forming an insulating layer (liquid resist method) was applied to obtain a photocurable resin layer for forming an insulating layer. In the front panel, the distance between the surface of the exposure mask (the quartz exposure mask having the pattern for the insulating layer) and the photocurable resin layer for etching is set to 200 μm, and the photocurable resin layer side for self-etching is used in a nitrogen atmosphere. Pattern exposure was performed at an exposure amount of 200 mJ/cm ² .

Next, a sodium carbonate/sodium bicarbonate-based developer (a liquid obtained by diluting a product of T-CD1 (manufactured by Fujifilm Co., Ltd.) in pure water by a factor of five) was used for treatment at 23 ° C for 60 seconds. The high-pressure cleaning nozzle was subjected to residue removal, and post-baking treatment was performed at 230 ° C for 60 minutes to obtain a front panel in which a mask layer, a first transparent electrode pattern, and an insulating layer pattern were formed.

Further, similarly to the formation of the first transparent electrode pattern of Comparative Example 1, a front panel in which a mask layer, a first transparent electrode pattern, an insulating layer pattern, and a second transparent electrode pattern were formed was obtained.

Then, in the same manner as in Example 1, after the aluminum thin film was formed, the coating liquid E1 for etching photocurable resin layer (liquid resist method) was applied to form a mask layer, a first transparent electrode pattern, and a front layer of the insulating layer pattern, the second transparent electrode pattern, and the conductive elements different from the first and second transparent electrode patterns, and further, a transparent protective layer is formed by a liquid resist method in the same manner as the formation of the insulating layer , obtained to cover the mask layer, the first transparent In the electrode pattern, the insulating layer pattern, the second transparent electrode pattern, and the conductive elements different from the first and second transparent electrode patterns, the front panel 3 of the transparent protective layer is laminated, and the same manner as in the example 1 is performed. The image display device 3 is output.

"Evaluation of Front Panel 3 and Image Display Device 3"

In each of the above steps, the mask layer, the first transparent electrode pattern, the insulating layer pattern, the second transparent electrode pattern, and the front panel 3 having different conductive elements from the first and second transparent electrode patterns are formed, and the back surface has It is polluted and cannot be easily cleaned.

On the other hand, there is no pinhole in the mask layer, and the light shielding property is excellent.

Further, there is no problem in the respective conductivity of the first transparent electrode pattern, the second transparent electrode pattern, and the conductive element different therefrom, and the first transparent electrode pattern and the second transparent electrode pattern have insulation properties.

Further, although the transparent protective layer has no defects such as air bubbles, the image display device 3 has display unevenness due to contamination by the front panel 3, and excellent display characteristics cannot be obtained.

[Comparative Example 2]

In the first example, the front panel 4 and the image display device 4 were produced in the same manner as in Example 1 except that the photosensitive film K1 shown below was used instead of the photosensitive layer K1 for mask layer formation.

"Production of Photosensitive Film K2"

On the polyethylene terephthalate film temporary support having a thickness of 75 μm, a slit-like nozzle was used, and the thermoplastic resin layer and the intermediate layer were not formed, and the black light-curable resin layer containing the above-mentioned prescription K1 was directly applied. cloth The liquid is prepared by drying it. On the temporary support, a black photocurable resin layer having a dry film thickness of 2.2 μm was provided so as to have an optical density of 4.0, and a protective film (a polypropylene film having a thickness of 12 μm) was pressure-bonded to form a photosensitive film K2.

"Evaluation of Front Panel 4 and Image Display Device 4"

In each of the above steps, the front panel 2 having the mask layer, the first transparent electrode pattern, the insulating layer pattern, the second transparent electrode pattern, and the conductive elements different from the first and second transparent electrode patterns, the opening portion, and the opening portion, There is no pollution in the back and the cleaning is easy, and there is no problem of contamination of other components.

Further, there is no problem in the respective conductivity of the first transparent electrode pattern, the second transparent electrode pattern, and the conductive elements different therefrom, and the insulating layer between the first transparent electrode pattern and the second transparent electrode pattern is provided. .

Further, the transparent protective layer has no defects such as bubbles.

However, pinholes are formed in the mask layer, the light shielding property is insufficient, and the image display device 4 has light leakage, so that excellent display characteristics cannot be obtained.

[Comparative Example 3]

In the first example, the front panel 5 and the image display device 5 were produced in the same manner as in the example 1 except that the photosensitive film E1 shown below was used instead of the photosensitive photosensitive film E1 for the formation of the first transparent electrode pattern.

"Production of Photosensitive Film E2"

On the polyethylene terephthalate film temporary support having a thickness of 75 μm, a slit-shaped nozzle is used, and the photo-curable resin layer for etching containing the above-mentioned prescription W1 is directly applied without forming a thermoplastic resin layer or an intermediate layer. use After the coating liquid was dried, the protective film (polypropylene film having a thickness of 12 μm) was pressure-bonded to prepare a photosensitive film E2 (the thickness of the photocurable resin layer for etching was 2.0 μm).

"Evaluation of Front Panel 5 and Image Display Device 5"

In each of the above steps, the front panel 2 having the mask layer, the first transparent electrode pattern, the insulating layer pattern, the second transparent electrode pattern, and the conductive elements different from the first and second transparent electrode patterns, the opening portion, and the opening portion, There is no pollution in the back and the cleaning is easy, and there is no problem of contamination of other components.

Further, the mask layer has no pinholes, is excellent in light shielding property, and has no defects such as bubbles in the transparent protective layer.

Further, the second transparent electrode pattern and the conductive elements different from the first and second transparent electrode patterns have no problem in conductivity, and the first transparent electrode pattern and the second transparent electrode pattern have insulation properties. However, the first transparent electrode pattern has high resistance and insufficient conduction.

The video display device 5 has no problem in display characteristics, but has a problem in power consumption.

[Comparative Example 4]

In the first example, the front panel 6 and the image display device 6 were produced in the same manner as in Example 1 except that the photosensitive film W1 for the insulating layer formation was used instead of the photosensitive film W1 for forming the transparent protective layer.

"Production of Photosensitive Film W2"

On the polyethylene terephthalate film temporary support having a thickness of 75 μm, a slit-shaped nozzle is used to directly apply the photocurable resin layer for etching containing the above-mentioned prescription W2 without forming a thermoplastic resin layer or an intermediate layer. use After the coating liquid was dried, the protective film (polypropylene film having a thickness of 12 μm) was pressure-bonded to prepare a photosensitive film W4 (the film thickness of the photocurable resin layer for an insulating layer was 1.4 μm).

"Evaluation of Front Panel 6, and Image Display Device 6"

In each of the above steps, a front layer 1 having a mask layer, a first transparent electrode pattern, an insulating layer pattern, a second transparent electrode pattern, and a conductive element different from the first and second transparent electrode patterns, an opening portion, and an opening portion are formed. There is no pollution in the back and the cleaning is easy, and there is no problem of contamination of other components.

Further, the mask layer has no pinholes and is excellent in light shielding properties.

Further, there is no problem in the respective conductivity of the first transparent electrode pattern, the second transparent electrode pattern, and the conductive elements different therefrom, and the insulating layer between the first transparent electrode pattern and the second transparent electrode pattern is provided. .

However, bubbles are generated in the transparent protective layer, and the image display device 6 produces image unevenness, so that excellent display characteristics are not obtained.

As described above, according to the method of manufacturing the capacitance type input device of the present invention, the capacitance type input device having the advantages of thin layer/light weight can be manufactured with high quality in a simple procedure. Therefore, it is understood that the capacitance type input device manufactured by the manufacturing method of the present invention and the image display device using the same are of high quality.

1‧‧‧ front panel

2‧‧‧mask layer

3‧‧‧First transparent electrode pattern

3a‧‧‧pad portion

3b‧‧‧Connected section

4‧‧‧Second transparent electrode pattern

5‧‧‧Insulation

6‧‧‧Electrical elements

7‧‧‧Transparent protective layer

8‧‧‧ openings

10‧‧‧Electrostatic type input device

11‧‧‧Intensified treatment glass

Fig. 1 is a cross-sectional view showing the configuration of a capacitance type input device of the present invention.

Fig. 2 is an explanatory view showing an example of a front panel of the present invention.

3 is an explanatory view showing an example of a first transparent electrode pattern and a second transparent electrode pattern of the present invention.

4 is a plan view showing an example of a tempered glass in which an opening is formed.

FIG. 5 is a plan view showing an example of a front panel on which a mask layer is formed.

6 is a plan view showing an example of a front panel on which a first transparent electrode pattern is formed.

7 is a plan view showing an example of a front panel in which first and second transparent electrode patterns are formed.

8 is a plan view showing an example of a front panel in which conductive elements different from the first and second transparent electrode patterns are formed.

Fig. 9 is an explanatory view showing a cross section of a metal nanowire;

1‧‧‧ front panel

2‧‧‧mask layer

3‧‧‧First transparent electrode pattern

4‧‧‧Second transparent electrode pattern

5‧‧‧Insulation

6‧‧‧Electrical elements

7‧‧‧Transparent protective layer

10‧‧‧Electrostatic type input device

Claims (13)

In a method of manufacturing a capacitance type input device, the capacitance type input device includes a front panel, and has at least the following elements (1) to (5) on a non-contact side of the front panel, and the capacitance type input device In the production method, at least one of the following elements (1) to (5) is formed using a photosensitive film, and the photosensitive film sequentially includes a temporary support, a thermoplastic resin layer, and a photocurable resin layer; a mask layer; (2) a plurality of first transparent electrode patterns, wherein the plurality of pad portions are formed to extend in the first direction via the connection portion; (3) a plurality of second transparent electrode patterns, and the first transparent electrode pattern Electrically insulating, and comprising a plurality of pad portions extending along a direction crossing the first direction; (4) an insulating layer electrically insulating the first transparent electrode pattern from the second transparent electrode pattern; (5) The conductive element is electrically connected to at least one of the first transparent electrode pattern and the second transparent electrode pattern, and is different from the first transparent electrode pattern and the second transparent electrode pattern. The method of manufacturing a capacitance type input device according to claim 1, further comprising providing a transparent protective layer so as to cover all or a part of the elements (1) to (5). The method of manufacturing a capacitance type input device according to claim 2, wherein the transparent protective layer is formed using the photosensitive film. The method for manufacturing a capacitance type input device according to any one of claims 1 to 3, wherein the transparent conductive material is etched using an etching pattern formed by the photosensitive film, This forms at least one of the first transparent electrode pattern, the second transparent electrode pattern, and the conductive element. The method of manufacturing a capacitance type input device according to any one of the first to third aspect, wherein the photocurable resin layer of the photosensitive film is a conductive photocurable resin layer, and At least one of the first transparent electrode pattern, the second transparent electrode pattern, and the conductive element is formed using the photosensitive film. The method for manufacturing a capacitance type input device according to any one of claims 1 to 3, wherein at least one of the first transparent electrode pattern and the second transparent electrode pattern spans the front panel The non-contact surface and the surface of the mask layer on the opposite side of the front panel are provided. The method of manufacturing a capacitance type input device according to any one of claims 1 to 3, wherein the conductive element is provided on at least a surface side of the mask layer opposite to the front panel. The method of manufacturing a capacitance type input device according to any one of the first to third aspect, wherein the thermoplastic film has a thickness of from 3 μm to 30 μm, and the thermoplastic resin The viscosity of the layer measured at 100 ° C At 1000Pa. Sec~10000Pa. In the sec region, the viscosity of the photocurable resin layer measured at 100 ° C is 2000 Pa. Sec~50000Pa. In the region of sec, the viscosity of the thermoplastic resin layer is lower than the viscosity of the photocurable resin layer. The method of manufacturing a capacitance type input device according to any one of claims 1 to 3, wherein the non-contact surface of the front panel is subjected to surface treatment, and the surface treatment has been performed before The above-mentioned photosensitive film is provided on the non-contact surface of the panel. The method of manufacturing a capacitance type input device according to claim 9, wherein a decane compound is used for surface treatment of the front panel. The method of manufacturing a capacitance type input device according to any one of claims 1 to 3, wherein the front panel has an opening at least in part. A capacitance type input device manufactured by the method of manufacturing a capacitance type input device according to any one of claims 1 to 3. An image display device includes a capacitance type input device manufactured by the method for manufacturing a capacitance type input device according to any one of the first to third aspects of the invention.