TWI570909B - Organic light emitting display panel - Google Patents

Description

Organic light emitting display panel

The present invention relates to an organic light emitting display panel, and more particularly to an organic light emitting display panel structure capable of avoiding burning of an organic light emitting element caused by a solder paste process.

Organic Light-Emitting Diode (OLED) display panel has wide viewing angle, fast response time, high luminous efficiency, high contrast and low power consumption, and is suitable for making large-size display panels and flexible display panels. Therefore, there is an opportunity to become the mainstream product of the next generation of display panels.

Conventional techniques have been developed to use laser-irradiated fusion glue to bond the two substrates of the display panel together. However, in the process of laser irradiation of the fusion glue, when the laser moves to the turning point of the fusion glue, the organic material in the organic light-emitting element is damaged due to thermal stress concentration and heat conduction, thereby causing the organic light-emitting display panel to be displayed. Produces dark spots.

An object of the present invention is to provide an organic light-emitting display panel which can prevent damage of an organic material in an organic light-emitting element due to thermal stress concentration and heat conduction when a laser irradiates a corner of a fusion glue.

To achieve the above object, the present invention provides an organic light emitting display panel including a first substrate, a second substrate, a fusion paste, an insulating layer, and a plurality of organic light emitting elements. The first substrate has a display area and a non-display area, wherein the non-display area is disposed around the display area. The second substrate is disposed opposite to the first substrate. The solder paste is located in the non-display area and surrounds the display area for bonding and fixing the first substrate and the second substrate, wherein the fusion glue comprises at least one turning pattern. The insulating layer is disposed on the first substrate, wherein the insulating layer has at least one first opening pattern disposed between the solder paste and the display region, and the first opening pattern is disposed at least adjacent to the turning pattern. The organic light emitting element is located in the display area on the insulating layer.

In order to achieve the above object, the present invention further provides an organic light emitting display panel including a first substrate, a second substrate, a solder paste, an insulating layer, and a plurality of organic light emitting elements. The first substrate has a display area and a non-display area, wherein the non-display area is disposed around the display area. The second substrate is disposed opposite to the first substrate. The solder paste is located in the non-display area and surrounds the display area for bonding and fixing the first substrate and the second substrate. A plurality of organic light emitting elements are located in the display area on the first substrate. The insulating layer is disposed on the first substrate, wherein the insulating layer has a first portion and a second portion, the organic light emitting element is disposed on the first portion, the soldering adhesive is disposed on the second portion, and the first portion and the second portion are disposed A gap.

The present invention will be further understood by those of ordinary skill in the art to which the present invention pertains. .

Please refer to FIG. 1 to FIG. 3 together. FIG. 1 is a top view of the organic light emitting display panel according to the first embodiment of the present invention, and FIG. 2 is an enlarged schematic view of the X area in FIG. FIG. 3 is a cross-sectional view showing the organic light emitting display panel of the first embodiment of the present invention taken along line IIA of FIG. As shown in FIGS. 1 to 3 , the organic light-emitting display panel 1 of the present embodiment includes a first substrate 102 , a second substrate 104 , and a solder paste 106 . The first substrate 102 of the present embodiment may include a glass substrate, a plastic substrate, or other suitable rigid or flexible substrate, and may be used as an array substrate of the organic light-emitting display panel 1, but is not limited thereto. The first substrate 102 has a display area R1, a non-display area R2 and an outer pin bonding area R3, wherein the non-display area R2 is disposed around the display area R1, and the outer pin bonding area R3 is disposed adjacent to one side of the non-display area R2 in parallel. Side 108. The second substrate 104 may include a transparent substrate such as a glass substrate, a plastic substrate, or other suitable transparent or flexible transparent substrate, and may be used as a cover of the organic light-emitting display panel 1 , but is not limited thereto. The second substrate 104 is disposed in parallel with the display region R1 of the first substrate 102 and the non-display region R2 and exposes the pin bonding region R3 outside the first substrate 102, so that the wires or electronic components in the outer pin bonding region R3 can be externally connected. Other circuit components. In addition, the second substrate 104 of the present embodiment has a plurality of side edges 112, and the intersections of any two adjacent and non-parallel side edges 112 respectively define a corner region 114, as indicated by reference numeral 114 in FIG. The area indicated by the dotted line.

The soldering paste 106 is disposed in the non-display area R2 and surrounds the display area R1, and is disposed between the first substrate 102 and the second substrate 104 to bond the first substrate 102 and the second substrate 104, wherein the fusion adhesive 106 includes a plurality of The turning pattern 110 is respectively disposed on one of the corner regions 114 of the second substrate 104. As shown in FIG. 1, the second substrate 104 of the embodiment has four corner regions 114, and the fusion bonding material 106 also includes four. The corner patterns 110 are located in a corner area 114, respectively. In detail, each of the corner patterns 110 is an R-angle pattern, and the radius of curvature d of the R-angle pattern of the embodiment ranges from about 0.7 mm to about 1 mm, but is not limited thereto. In addition, each of the corner patterns 110 of the solder paste 106 has a distance D from the display area R1, and the distance D of the embodiment ranges from about 450 micrometers to about 650 micrometers, but not limited thereto. The fusion splicing material 106 of the present embodiment is exemplified by a glass fusion splicer, but not limited thereto, any other suitable photocurable adhesive or rubber can be used in the present invention. The fusion bond 106 can include oxide particles, which can include a metal oxide, an oxide of a transition element, or a combination thereof. The fusion bonding material 106 of the present embodiment is exemplified by a glass fusion bonding material comprising vanadium pentoxide (V ₂ O ₅ ) particles, and the material of the oxide fine particles in the fusion bonding material 106 may also be, for example, cerium oxide (SiO ₂ ) or Alumina (Al ₂ O ₃ ), but not limited to this. Furthermore, the solder paste 106 of the present embodiment is adapted to be irradiated with laser light having a wavelength ranging from about 600 nm to about 1200 nm to be fused with the first substrate 102 and the second substrate 104, but not limit.

The organic light emitting display panel 1 may further include a buffer layer 116, a first conductive layer 118, a gate insulating layer 120, a second conductive layer 122, an interlayer dielectric layer 124, and an insulating layer 126 disposed on the first substrate 102. The buffer layer 116 is disposed on the first substrate 102 and may include an inorganic insulating material, an organic insulating material, or a combination or a combination of the above materials, but is not limited thereto. The first conductive layer 118 is disposed on the buffer layer 116, and can be used as a gate of a thin film transistor, or a scan line in the organic light-emitting display panel 1 or the like, but is not limited thereto. The gate insulating layer 120 is disposed on the first conductive layer 118, and the material thereof may include an inorganic insulating material such as hafnium oxide, tantalum nitride or hafnium oxynitride or a stack of the above materials, but is not limited thereto. For example, the gate insulating layer 120 of the present embodiment is a stack of tantalum oxide and tantalum nitride, wherein the thickness of the tantalum oxide is about 500 angstroms and the thickness of the tantalum nitride is about 200 angstroms, but not limited thereto. The second conductive layer 122 is disposed on the gate insulating layer 120, and may be used as a source or a drain of a thin film transistor, or a data line in the organic light-emitting display panel 1 or the like, but is not limited thereto. The material of the first conductive layer 118 and the second conductive layer 122 may be an opaque conductive material such as a metal or an alloy or a transparent conductive material such as indium tin oxide, but not limited thereto. The interlayer dielectric layer 124 is disposed on the second conductive layer 122, and the material thereof may include an inorganic insulating material such as tantalum oxide, tantalum nitride or hafnium oxynitride or a stack of the above materials, but is not limited thereto. For example, the interlayer dielectric layer 124 of the present embodiment is a stack of tantalum oxide and tantalum nitride, wherein the thickness of the tantalum oxide is about 3000 angstroms and the thickness of the tantalum nitride is about 3000 angstroms, but not limited thereto.

The insulating layer 126 is disposed between the interlayer dielectric layer 124 and the solder paste 106. The solder paste 106 of the embodiment is disposed directly above the insulating layer 126 and is in contact with the insulating layer 126. In other words, the solder paste 106 of the embodiment is disposed. Between the insulating layer 126 and the second substrate 104. The material of the insulating layer 126 may be tantalum nitride and the thickness is less than 5000 angstroms, but not limited thereto. It should be noted that the insulating layer 126 of the embodiment has a plurality of first opening patterns P1 disposed between the fusion bonding material 106 and the display region R1, and the first opening pattern P1 is disposed at least adjacent to the folding pattern 110. The distance between the first opening pattern P1 and the display area R1 is exemplified by about 650 um to 0 um, or the minimum distance between the first opening pattern P1 and the fusion splicing 106 is 650 um to 0 um, but not limited thereto. In detail, the fusion bonding material 106 of the embodiment has four turning patterns 110 respectively corresponding to the four corner regions 114 of the second substrate 104. When the turning pattern 110 of the fusion bonding material 106 conforms to the radius of curvature d thereof, the range is about 0.7 mm. When it is about 1 mm, the first opening pattern P1 is disposed on the insulating layer 126 between the corner pattern 110 of the solder paste 106 and the display region R1, whereby the insulating layer 126 and the display layer R1 in the display region R1 adjacent to the corner region 114 are located. The insulating layer 126 under the soldering material 106 of the corner region 114 is broken to prevent the organic light emitting layer 134 from being damaged due to thermal stress concentration and heat conduction when the laser illuminates the turning pattern 110.

In the present embodiment, the organic light-emitting display panel 1 includes a plurality of organic light-emitting elements 128 on the insulating layer 126, and is arranged in an array in the display region R1. The organic light emitting element 128 includes an anode 130, a cathode 132, and an organic light emitting layer 134, wherein the organic light emitting layer 134 is interposed between the anode 130 and the cathode 132. The cathode 132 of the organic light-emitting element 128 of the present embodiment is located on the anode 130, but is not limited thereto. The anode 130 can be a transparent or opaque electrode, and the cathode 132 can be a transparent electrode, but is not limited thereto. In other variations, the anode 130 of the organic light emitting element 128 can also be located on the cathode 132. Further, the organic light-emitting display panel 1 may further include a flat layer 136, a pixel defining layer 138, and a spacer 140. For example, the planarization layer 136 is between the insulating layer 126 and the organic light emitting element 128, the pixel defining layer 138 is on the planarization layer 136 to space adjacent the organic light emitting elements 128, and the spacer 140 is located in the pixel definition layer 138. Upper to maintain a gap between the first substrate 102 and the second substrate 104. The material of the flat layer 136, the pixel defining layer 138, and the spacer 140 may be an organic insulating material, and preferably may be photosensitive, whereby the pattern may be defined by an exposure and development process, but not limited thereto.

It should be noted that the design of the first opening pattern P1 is provided in the insulating layer 126 in this embodiment to avoid damage to the organic light-emitting layer 134 in the organic light-emitting element 128 when the laser illuminates the turning pattern 110 of the solder paste 106. in principle. For example, if the R angle of curvature d of the current transition pattern 110 is less than 1, the organic light-emitting layer 134 may be damaged due to thermal stress concentration and heat conduction when the laser illuminates the transition pattern 110. Therefore, according to the spirit of the present invention, the first opening pattern P1 may be disposed in the insulating layer 126 between the display region R1 and the fusion bonding material 106 in a region where there is a possibility of concentration of thermal stress, so as to intercept the path of heat conduction and thereby avoid organic light emission. Layer 134 is damaged. However, the condition for providing the first opening pattern P1 is not limited to the range of the radius of curvature d of the R corner of the above-described turning pattern 110, as long as the portion of the fusion bonding material 106 may affect the performance of the organic light emitting element 128 due to heat conduction when irradiated by the laser. The first opening pattern P1 may be disposed between the portion of the fusion splicing 106 and the display area R1 in accordance with the spirit of the present invention. The above principles are applicable to other embodiments and variations of the present invention, and are not described again.

The organic light emitting display panel of the present invention is not limited to the above embodiment. Hereinafter, the organic light-emitting display panel of other preferred embodiments of the present invention will be described in order, and in order to facilitate the comparison of the differences of the embodiments and simplify the description, the same symbols are used to denote the same components in the following embodiments. The description of the differences between the embodiments will be mainly made, and the repeated parts will not be described again.

Please refer to FIG. 4 and FIG. 5 , FIG. 4 is a top view of the organic light emitting display panel according to a variation of the first embodiment of the present invention, and FIG. 5 is a cross-sectional view of the X area of FIG. A magnified view of the. As shown in FIGS. 4 and 5, the present modified embodiment is different from the first embodiment in that the first opening pattern P1 is a closed frame-like pattern or a ring-shaped pattern and surrounds the display area R1 so as to be located. The insulating layer 126 in the display region R1 is isolated from the insulating layer 126 located outside the first opening pattern P1. Therefore, the insulating layer 126 of the modified embodiment is provided with an annular groove between the display region R1 and the fusion splicing 106, which can more effectively cut off the path of heat conduction and avoid the laser of the organic light-emitting layer 134 of the organic light-emitting element 128. Damaged by the irradiation process. It is worth mentioning that the first opening pattern P1 having a frame pattern or a ring pattern can also be applied to other embodiments of the present invention, and details are not described below.

Referring to Fig. 6, there is shown a cross-sectional view of the organic light emitting display panel of the second embodiment of the present invention taken along line A-A' of Fig. 2. As shown in FIG. 6, the difference between the embodiment and the first embodiment is that the interlayer dielectric layer 124 has a plurality of second opening patterns P2 disposed between the fusion bonding material 106 and the display region R1, wherein the second opening pattern P2 is disposed adjacent to the folding pattern 110, and each of the second opening patterns P2 corresponds to one of the first opening patterns P1 and communicates with the corresponding first opening pattern P1. Thereby, the thermal conduction path from the transition pattern 110 to the display region R1 can be further blocked by the interlayer dielectric layer 124 to more effectively prevent the organic light-emitting layer 134 of the organic light-emitting element 128 from being damaged by the laser irradiation process. Furthermore, in the modified embodiment of the embodiment and other embodiments of the present invention, the second opening pattern P2 may also have a closed annular pattern and a frame-like pattern surrounding the display area R1.

Referring to Fig. 7, there is shown a cross-sectional view of the organic light emitting display panel of the third embodiment of the present invention taken along line A-A' of Fig. 2. As shown in FIG. 7, the difference between the present embodiment and the first embodiment is that the gate insulating layer 120 has a plurality of third opening patterns P3 disposed between the fusion bonding material 106 and the display region R1, wherein the third opening pattern P3 is disposed adjacent to the folding pattern 110, and each of the third opening patterns P3 corresponds to one of the first opening pattern P1 and the second opening pattern P2, and corresponds to the corresponding first opening pattern P1 and The two opening patterns P2 are in communication with each other. Thereby, the thermal conduction path from the transition pattern 110 to the display region R1 can be further blocked in the gate insulating layer 120 and the interlayer dielectric layer 124 to more effectively prevent the organic light-emitting layer 134 of the organic light-emitting element 128 from being exposed to laser light. Damaged by the irradiation process. Furthermore, in other embodiments of the present embodiment and other embodiments of the present invention, the third opening pattern P3 may also have a closed annular pattern and a frame-like pattern surrounding the display area R1.

Please refer to FIG. 8 and FIG. 9 together. FIG. 8 is a top view of the organic light emitting display panel according to the fourth embodiment of the present invention, and FIG. 9 is a fourth embodiment of the present invention. A cross-sectional view of the organic light emitting display panel taken along line A-A' of Fig. 8. As shown in FIG. 8 and FIG. 9 , the difference between the embodiment and the above embodiment is that the shape of the organic light-emitting display panel 4 is circular, but not limited thereto. For example, in other modified embodiments, organic The shape of the light-emitting display panel 4 may be elliptical, rectangular or other various shapes. The organic light-emitting display panel 4 of the present embodiment includes a first substrate 102, a second substrate 104 (not shown in FIG. 8, see FIG. 9), a fusion bonding material 106, an insulating layer 126, and a plurality of organic light-emitting elements 128. The first substrate 102 has a display area R1 and a non-display area R2, wherein the non-display area R2 is disposed around the display area R1. The second substrate 104 is disposed opposite to the first substrate 102. The solder paste 106 is located in the non-display area R2 and surrounds the display area R1 for bonding and fixing the first substrate 102 and the second substrate 104. The organic light emitting element 128 is located in the display region R1 on the first substrate 102. The insulating layer 126 is disposed on the first substrate 102. The insulating layer 126 has a first portion 144 and a second portion 146. The organic light emitting element 128 is disposed on the first portion 144, and the solder paste 106 is disposed on the second portion 146. There is a gap 142 between a portion 144 and the second portion 146. The remaining features of the organic light-emitting display panel 4 of the present embodiment may be the same as those of the above embodiment, and will not be described again. Further, the features of the organic light-emitting display panel 4 of the present embodiment are also applicable to the above embodiments.

In the conventional organic light-emitting display panel, when the first substrate and the second substrate are assembled, when the radius of curvature of the transition pattern of the fusion adhesive is less than 1, in the laser irradiation process, thermal stress concentration occurs in a region near the turning pattern, and The generated heat is conducted to the organic light-emitting element, causing damage to the organic light-emitting layer. In view of the present invention, it can be seen from the foregoing embodiments that the main spirit of the present invention is to provide an opening pattern between the display area of the organic light emitting display panel and the fusion bonding material, and the opening pattern may be disposed at a position adjacent to the turning pattern of the fusion glue or around the entire Display area. The opening pattern may be disposed on the insulating layer, or in the insulating layer and the interlayer dielectric layer, or in the insulating layer, the interlayer dielectric layer and the gate insulating layer, or in other film layers as needed. Thereby, the heat conduction path from the fusion glue to the display area can be blocked to effectively avoid damage of the organic light emitting element, reduce the chance of the dark light emitting point of the organic light emitting display panel, and improve the yield of the organic light emitting display panel. The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

1, 2, 3, 4‧‧‧ organic light-emitting display panels
102‧‧‧First substrate
104‧‧‧second substrate
106‧‧‧welding glue
108, 112‧‧‧ side
110‧‧‧ turning pattern
114‧‧‧ corner area
116‧‧‧buffer layer
118‧‧‧First conductive layer
120‧‧‧ gate insulation
122‧‧‧Second conductive layer
124‧‧‧Interlayer dielectric layer
126‧‧‧Insulation
128‧‧‧Organic light-emitting elements
130‧‧‧Anode
132‧‧‧ cathode
134‧‧‧Organic light-emitting layer
136‧‧‧flat layer
138‧‧‧ pixel definition layer
140‧‧‧ spacer
142‧‧‧ gap
144‧‧‧ first
146‧‧‧ second
D‧‧‧ radius of curvature
D‧‧‧Distance
P1‧‧‧first opening pattern
P2‧‧‧ second opening pattern
P3‧‧‧ third opening pattern
R1‧‧‧ display area
R2‧‧‧ non-display area
R3‧‧‧outer pin junction
X‧‧‧ area

FIG. 1 is a top plan view of an organic light emitting display panel according to a first embodiment of the present invention. FIG. 2 is an enlarged schematic view showing an X-region of the organic light-emitting display panel of the first embodiment of the present invention in FIG. 1. FIG. Fig. 3 is a cross-sectional view showing the organic light emitting display panel of the first embodiment of the present invention taken along line A-A' of Fig. 2. FIG. 4 is a top plan view of an organic light emitting display panel according to a variation of the first embodiment of the present invention. FIG. 5 is an enlarged schematic view showing an X-region of the organic light-emitting display panel according to a variation of the first embodiment of the present invention in FIG. Figure 6 is a cross-sectional view showing the organic light-emitting display panel of the second embodiment of the present invention taken along line II-A' of Figure 2; Figure 7 is a cross-sectional view showing the organic light-emitting display panel of the third embodiment of the present invention taken along line II-A' of Figure 2; FIG. 8 is a top plan view of an organic light emitting display panel according to a fourth embodiment of the present invention. Fig. 9 is a cross-sectional view showing the organic light emitting display panel of the fourth embodiment of the present invention taken along line A-A' of Fig. 8.

1‧‧‧Organic display panel

102‧‧‧First substrate

104‧‧‧second substrate

106‧‧‧welding glue

110‧‧‧ turning pattern

116‧‧‧buffer layer

118‧‧‧First conductive layer

120‧‧‧ gate insulation

122‧‧‧Second conductive layer

124‧‧‧Interlayer dielectric layer

126‧‧‧Insulation

128‧‧‧Organic light-emitting elements

130‧‧‧Anode

132‧‧‧ cathode

134‧‧‧Organic light-emitting layer

136‧‧‧flat layer

138‧‧‧ pixel definition layer

140‧‧‧ spacer

P1‧‧‧first opening pattern

R1‧‧‧ display area

R2‧‧‧ non-display area

Claims (10)

An organic light emitting display panel comprising: a first substrate having a display area and a non-display area, wherein the non-display area is disposed around the display area; a second substrate disposed opposite to the first substrate; a solder paste located at The non-display area surrounds the display area for bonding and fixing the first substrate and the second substrate, wherein the solder paste comprises at least one turning pattern having a radius of curvature; an insulating layer is disposed on the first substrate, Wherein the insulating layer has at least one first opening pattern disposed between the solder paste and the display region, and the first opening pattern is disposed at least adjacent to the turning pattern; and a plurality of organic light emitting elements are disposed on the insulating layer The display area. The organic light-emitting display panel of claim 1, wherein the second substrate has a plurality of sides, and any two adjacent and non-parallel sides of the sides have a corner region, and the corner patterns are respectively Set in one of the corner areas. The organic light-emitting display panel of claim 2, wherein the turning pattern is an R-angle pattern, and the radius of curvature of the R-angle pattern ranges from about 0.7 mm to about 1 mm. The organic light emitting display panel of claim 1, wherein the solder paste is disposed between the insulating layer and the second substrate. The organic light emitting display panel of claim 1, further comprising an interlayer dielectric layer disposed on The first substrate is between the insulating layer. The organic light-emitting display panel of claim 5, wherein the interlayer dielectric layer has at least one second opening pattern disposed between the solder paste and the display area, wherein the second opening pattern is disposed adjacent to the turning pattern. And the second opening patterns respectively correspond to the first opening patterns and communicate with each other. The OLED display panel of claim 6, further comprising a gate insulating layer disposed between the first substrate and the interlayer dielectric layer. The organic light-emitting display panel of claim 7, wherein the gate insulating layer has at least one third opening pattern disposed between the solder paste and the display area, wherein the third opening pattern is disposed adjacent to the turning pattern, And the third opening pattern respectively corresponds to the first opening pattern and the second opening pattern, and communicates with the corresponding first opening pattern and the second opening pattern. The organic light emitting display panel of claim 7, further comprising a first conductive layer disposed between the first substrate and the gate insulating layer. An organic light emitting display panel comprising: a first substrate having a display area and a non-display area, wherein the non-display area is disposed around the display area; a second substrate disposed opposite to the first substrate; a solder paste located at The non-display area surrounds the display area for engaging and fixing the first base And the second substrate; the plurality of organic light emitting elements are located in the display area on the first substrate; and an insulating layer is disposed on the first substrate, wherein the insulating layer has a first portion and a second portion The organic light emitting element is disposed on the first portion, the solder paste is disposed on the second portion, and a gap is formed between the first portion and the second portion.