TWI417550B - Probe card - Google Patents

Description

Probe card

The present invention relates to a probe card for electrically connecting a wiring structure to an inspection object in which a plurality of conductive regions including a wiring structure for inputting or outputting electrical signals are formed on the surface.

Conventionally, a TCP (Tape Carrier Package) such as TAB (Tape Automated Bonding) or COF (Chip On Film) has been known as a driving circuit for constituting a liquid crystal panel such as a liquid crystal display. With the package). TCP is formed by mounting a semiconductor wafer on a flexible film substrate having a wiring structure formed on its surface, and sealing the mounted semiconductor wafer with a resin.

When TCP is manufactured, as in the case of other semiconductor integrated circuits, electrical inspection is performed for the purpose of detecting defective products and the like. Specifically, the wiring structure formed on, for example, a thin film substrate is inspected for electrical short-circuiting/disconnection, or the semiconductor wafer is mounted, and the predetermined inspection signal is input and output to the semiconductor wafer via the wiring structure. Check and so on. In the electrical inspection, the conductive probe is used to input and output the inspection signal. However, in order to make the probe contact the predetermined portion of the inspection object, the wiring structure and the probe formed on the film substrate must be performed. The correct alignment. Therefore, in the conventional inspection apparatus, a mechanism for discriminating the contact portion between the input/output terminal and the wiring structure is provided.

A technique for discriminating a contact portion is known to form a through hole that linearly extends from the contact portion to the outside, and can be externally transmitted through the through hole A technique for recognizing the positional relationship of the contact portion (see, for example, Patent Document 1).

(Patent Document 1) Japanese Patent Laid-Open No. 4-307953

However, when the probe is in contact with the surface in a direction substantially orthogonal to the surface of the inspection object, even if the camera is to be used to confirm the contact state between the front end of the probe and the electrode of the inspection object, there is a probe front end and an inspection object. When the electrodes are stacked, it is difficult to confirm the contact state of the two, and it is necessary to worry about the alignment.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a probe and an inspection object that can be easily and surely performed even when a probe that is in contact with the surface in a direction substantially perpendicular to the surface of the inspection target is used. The alignment probe card.

In order to solve the above problems and achieve the above object, the probe card of the present invention electrically connects a test object to a circuit structure for generating an inspection signal, and transmits a signal to the receiver. The characteristics of the probe card are The probe includes a plurality of probes each made of a conductive material, and one end of the longitudinal direction is in contact with the surface in a direction substantially orthogonal to a surface of the inspection object; and the probe holder has a thickness direction a plurality of holes that penetrate and accommodate any one of the plurality of probes, and have a first opening that penetrates in a thickness direction; the wiring substrate is fixed to the probe holder and has a plurality of probes And a wiring portion electrically connected to the circuit structure, and having a through hole extending in a thickness direction and communicating with the first opening portion The second opening portion and the plurality of marking members each have a distal end portion, and the distal end portion is located in a three-dimensional manner in which the first and second opening portions are extended in the thickness direction of the probe holder and the wiring substrate. The interior of the area.

Furthermore, in the probe card of the present invention, when the plurality of probes are in contact with a predetermined position on a surface of the inspection object, each of the plurality of marking members has a front end portion disposed along the front end portion The probe holder and the thickness direction of the wiring board overlap with any of a plurality of alignment areas provided on the surface of the inspection target.

Further, in the probe card of the present invention, the inspection target is formed on a surface of a film-form insulating material, and a plurality of circuits each having the plurality of alignment regions are formed along the longitudinal direction. a region; when the plurality of probes contact any one of the plurality of circuit formation regions, each of the plurality of marker members has a front end portion disposed on a plate along the probe holder and the wiring substrate The thick direction is a position overlapping with any of the plurality of alignment regions provided on the surface of the circuit formation region adjacent to the circuit formation region to be contacted.

Furthermore, in the probe card of the present invention, the plurality of marking members are provided in the probe holder.

Further, in the probe card according to the invention, in the plurality of marking members, the foremost end of the distal end portion passes a line mark substantially parallel to an arrangement direction of a portion in which the plurality of probes are arranged in a row. The number of members is two or more; the maximum value of the distance between the tips of the front ends of the two or more marking members passing through the straight line is substantially equal to the length of the line in which the one of the plurality of probes is arranged in a row. .

Furthermore, in the probe card of the present invention, the front end of the front end portion of the marking member and the plane orthogonal to the thickness direction of the probe holder and the wiring board are compared to the plural When the probes are in full stroke, the front end surface of each of the probes protruding from the probe holder is closer to the wiring board.

According to the probe card of the present invention, since the probe card has the following members, even when a probe that contacts the surface in a direction substantially perpendicular to the surface of the inspection object is used, it is possible to use a plurality of markers. The member is easily and surely aligned with the inspection object, and the member includes: a plurality of probes each composed of a conductive material, and one end of the longitudinal direction is substantially orthogonal to the surface of the inspection object The probe holder has a plurality of holes that penetrate through the plate thickness direction and accommodates any one of the plurality of probes, and has a first opening that penetrates in the thickness direction; the wiring substrate And a wiring portion that is electrically connected to a plurality of probes and a circuit structure, and has a second opening that penetrates in a thickness direction and communicates with the first opening; and a plurality of Each of the marking members has a distal end portion, and the distal end portion is located to extend the first and second openings toward the thickness of the probe holder and the wiring substrate Internal three-dimensional region.

Hereinafter, the best mode for carrying out the invention (hereinafter referred to as "embodiment") will be described with reference to the drawings. In addition, the drawings are schematic, it should be noted that the relationship between the thickness and width of each part, the thickness ratio of each part, etc. In different cases, the drawings also of course contain mutually different dimensional relationships or ratios.

(Embodiment 1)

Fig. 1 is a plan view showing the configuration of a main part of a probe card according to a first embodiment of the present invention. The probe card 1 shown in Fig. 1 is a device for inspecting the electrical characteristics of the contacted object 10 to be inspected, and includes a plurality of probes 2 whose one end in the longitudinal direction is in contact with the contacted body 10. The probe holder 3 has a plurality of holes each penetrating in the thickness direction and individually accommodating the plurality of probes 2; the wiring substrate 4 is fixed to the probe holder 3, and each probe 2 The end portion of the end portion that is not in contact with the contact body 10 is electrically connected, and is electrically connected to a circuit structure for generating a signal transmitted to the contact body 10; and the plurality of marking members 5 are The alignment of the plurality of probes 2 when they are in contact with the contacted body 10.

Fig. 2 is a view showing the configuration of the main portions of the probe card 1 and the contacted body 10. The probe card 1 shown in Fig. 2 is a cross-sectional view taken along line A-A of Fig. 1 . Fig. 3 is a perspective view showing the probe holder 3 and the main portion of the contacted body 10. Fig. 4 is a plan view showing a configuration of the probe holder 3, and is an enlarged view of a central portion of Fig. 1. Fig. 5 is a partial cross-sectional view showing the configuration of the probe 2 and the probe accommodating portion of the probe holder 3. Hereinafter, the detailed configuration of the probe 1 and the contacted body 10 will be described with reference to Figs. 1 to 5 .

First, the configuration of the contacted body 10 will be described. As shown in FIGS. 2 and 3, the contacted body 10 has a plurality of circuit formation regions 10a formed on the surface of the film-shaped insulating material at regular intervals along the longitudinal direction. The circuit formation region 10a includes a wafer mounting region 11 on which a semiconductor wafer is mounted; a plurality of inner leads 12 connected to the wafer mounting region 11; a plurality of outer leads 13 respectively connected to the plurality of inner leads 12; and a plurality of outer leads 13 respectively connected to the plurality of outer leads 13 and used for inputting and outputting electrical signals during inspection Test pads 14.

Each of the plurality of test pads 14 has a rectangular surface, and is disposed to be dispersed so as to sandwich the wafer mounting region 11 and form two rows parallel to each other. In addition to the function of the general test pad 14, the plurality of test pads 14 also function as a matching area for alignment with the probe card 1. Hereinafter, the test pad 14 which also has the function of the alignment area is referred to as "test pad 14p". In the first embodiment, the test pad 14p is tied at both ends of one of the two rows in which the plurality of test pads 14 are arranged. In addition, in the second and third figures, the state in which the semiconductor wafer is mounted on the wafer mounting region 11 is shown. However, in the first embodiment, the object to be contacted on which the semiconductor wafer is mounted can be inspected.

As shown in Fig. 5, the probe 2 has needle members 21 and 22 disposed at both ends in the longitudinal direction, and a spring member 23 that connects the needle members 21 and 22. The needle-shaped members 21 and 22 and the spring member 23 are each formed of a conductive material such as metal, and the needle-shaped member 21 and the spring member 23, the needle-shaped member 22, and the spring member 23 are physically integrally formed by being fixed to each other. And can be freely stretched along the length direction. The plurality of probes 2 having the configuration are arranged in parallel with each other in accordance with the arrangement pattern of the plurality of test pads 14 of the contact 10, and are substantially orthogonal to the surface of the corresponding test pad 14, respectively. The direction is in physical contact with the surface to perform input or output of predetermined electrical signals to the contacted body 10. Furthermore, a plurality of probes 2 The arrangement pattern is not limited to the case where the lines are linearly arranged in two lines, and may be set in accordance with the arrangement pattern of the test pads 14 of the circuit formation region 10a of the contact body 10. For example, it is also possible to arrange a plurality of probes 2 in a zigzag pattern in a row.

The probe holder 3 has a first substrate 31 located on the side facing the contacted body 10, a second substrate 32 laminated on the first substrate, and a third substrate 33 laminated on the second substrate. Each of the first substrate 31 and the second substrate 32 has hole portions 311 and 321 that communicate with each other and accommodate the probe 2 . On the other hand, the third substrate 33 has a hole portion 331 that communicates with the holes 311 and 321 and accommodates the lead wires 6. Each of the first substrate 31, the second substrate 32, and the third substrate 33 is made of an insulating material, and is fixed to each other by a screw member. The third substrate 33 is provided with a first opening 332 that penetrates in the thickness direction (see FIGS. 2 to 4).

The wiring board 4 has a wiring portion 41 which has a disk shape and is formed with a pattern on a surface that is not facing the contact body 10 (the lower surface side in FIG. 2); and the second opening portion 42 The first opening 332 of the probe holder 3 communicates with each other. In the wiring portion 41, the other end of the lead 6 which is in contact with the needle-like member 21 of the probe 2 at one end is welded to a predetermined portion. The wiring portion 41 is electrically connected to the signal processing circuit 100 that generates the output inspection signal via a predetermined wiring.

The lead wire 6 for electrically connecting the wiring portion 41 of the wiring board 4 and the needle-shaped member 22 of the probe 2 is crushed at the end portion 6e that is in contact with the needle-shaped member 22 as shown in Fig. 5 . machining. The end portion 6e has a function of preventing the peeling when the lead wire 6 is inserted into the hole portion 331 of the third substrate 33. In addition, The lead 6 may be next to the third substrate 33 by injecting an adhesive between the end portion 6e of the lead 6 and the hole portion 311. When the adhesive is used, the end portion of the lead may not be crushed.

The marking member 5 is provided with two first substrates 31 on the probe holder 3. As shown in FIG. 2, the marking member 5 has a distal end portion 5a which is positioned such that the communication portion between the first opening portion 332 and the second opening portion 42 faces the probe holder 3 and the wiring board 4 The inside of the 3-dimensional area D in which the direction is extended. When the probe 2 is in contact with the circuit formation region 10a of the contacted body 10, the front end portion 5a of the marking member 5 is disposed along the thickness direction of the probe holder 3 and the wiring substrate 4 (the lower direction in FIG. 2) A position overlapping each of the two test pads 14p adjacent to the circuit formation region 10a of the circuit formation region 10a. The surface of the surface of the marking member 5 on the side opposite to the contacted body 10 is flush with the surface of the probe 2 on the surface of the first substrate 31 of the probe holder 3 that protrudes toward the outside. As shown in FIG. 2, the front end portion 5a of the marking member 5 has a tapered shape which is smaller in thickness in the thickness direction of the distal end probe holder 3 and the wiring board 4 (the lower direction in FIG. 2). section.

The straight line L connecting the front ends of the end portions 5a of the two marking members 5 is parallel to the arrangement direction of the probes 2 arranged in a row (upward and downward directions in FIG. 4). Further, the interval d between the tips of the front end portions 5a of the two marking members 5 is substantially equal to the length of the rows of the probes 2 arranged in a row. Further, one or a plurality of the marking members 5 passing through the straight line L at the foremost end of the front end portion 5a may be provided in the middle of the two marking members 5. Thus, the foremost end of the front end portion 5a of the plurality of marking members 5 passes through In the case of a straight line, the maximum value of the interval between the foremost ends of the front end portions 5a of the two marking members 5 may be substantially equal to the length of the row of the probes 2 arranged in a row.

Fig. 6 is a view showing the distal end surface of the probe 2 passing through the side in contact with the contacted body 10 at the full stroke, and the reference surface in the horizontal direction passing through the foremost end of the front end portion 5a of the marking member 5; A diagram of the positional relationship. In Fig. 6, the reference surface H2 in the horizontal direction of the marking member 5 is closer to the wiring substrate 4 by Δh than the front end surface H1 at the full stroke of the probe 2. Thereby, the marking member 5 does not come into contact with the contacted body 10, and the marking member 5 does not damage the surface of the contacted body 10 at the time of inspection. The specific value of Δh is, for example, about 1 mm, and more preferably about 0.1 to 0.3 mm.

The front end portion 5a of the marking member 5 can pass through the second opening portion 42 and the first opening portion 332, and can be visually viewed from the surface side of the wiring substrate 4 where the probe holder 3 is not fixed. In the first embodiment, as shown in FIG. 2, the camera 7 is provided on the surface side of the wiring substrate 4 where the probe holder 3 is not fixed, and the image is captured based on the image captured by the camera 7. The member 5 is aligned with the contacted body 10. The camera 7 is a small camera such as a CCD camera, and is movable in a direction orthogonal to each other in one plane (a plane substantially parallel to the horizontal direction of the second drawing) substantially parallel to the surface of the wiring board 4. The camera 7 is provided with a light-emitting portion (not shown) that emits light to the imaging region. The light emitting unit may not be integrally formed with the camera 7.

Fig. 7 is a view showing the alignment of the front end portion 5a of the marking member 5 and the test pad 14p of the contacted body 10 which is performed before the inspection by the contact body 10. It is a diagram and is a diagram schematically showing a part of an image photographed by the camera 7. When the front end portion 5a of the marking member 5 is aligned with the test pad 14p of the contacted body 10, the probe card 1 or the contacted body 10 is moved to form the front end of the front end portion 5a and the test pad 14p. The center appears to overlap along the plate thickness direction of the probe holder 3 and the wiring substrate 4.

As described above, the front end portion 5a of the marking member 5 has a tapered cross section which is smaller toward the thickness direction of the front end probe holder 3 and the wiring board 4. Therefore, when the thickness of the probe holder 3 and the wiring board 4 in the thickness direction of the tip end portion 5a is made as small as possible, the front end of the front end portion 5a can be made from the camera 7 to the front end portion 5a. The difference between the distance and the distance from the camera 7 to the surface of the test pad 14p is minimized, so that the camera 7 can clearly photograph both the marker member 5 and the test pad 14p.

Further, in Fig. 7, although the front end of the front end portion 5a of the marking member 5 is aligned with the center of the test pad 14p, the front end of the front end portion 5a of the marking member 5 and the outer periphery of the test pad 14p may be applied. The proper position is aligned.

After the alignment of the marking member 5 and the test pad 14p, when the contacted body 10 is brought close to the probe card 1, the plurality of test pads 14 (including the test pad 14p) of the circuit forming region 10a described below can be correctly formed. The plurality of probes 2 corresponding to the respective test pads 14 are in contact with each other: the circuit formation region 10a is adjacent to the circuit formation region 10a having the test pad 14p aligned with the marker member 5. Thereafter, the inspection signal is output from the signal processing circuit 100 to perform electrical inspection of the contacted body 10. For one circuit After the formation of the formation region 10a, the contact between the contacted body 10 and the probe 2 is released, and the contacted body 10 is moved along the longitudinal direction. This movement is performed by the handler through the sprocket holes 15 provided at regular intervals along the longitudinal direction at both end portions in the width direction of the contacted body 10. After the contacted body 10 is moved, the adjacent circuit forming region 10a is aligned in the same manner as described above. In this manner, all of the circuit formation regions 10a of the contacted body 10 are inspected in order.

According to the probe card of the first embodiment described above, since the probe card has the following members, even when the probe whose longitudinal direction is in contact with the surface of the inspection target in a direction substantially perpendicular to the surface is used, The alignment of the probe with the inspection object is easily and surely performed by using a plurality of marking members, the member comprising: a plurality of probes each composed of a conductive material, and one end of the length direction is from the inspection object The surface of the probe holder is in contact with the surface in a substantially orthogonal direction; the probe holder has a plurality of holes that penetrate through the plate thickness direction and accommodate any one of the plurality of probes, and have a plurality of holes penetrating in the thickness direction. (1) an opening portion; the wiring board is fixed to the probe holder, and has a wiring portion electrically connected to the plurality of probes and the circuit structure, and has a portion penetrating in the thickness direction and communicating with the first opening portion a second opening portion; and a plurality of marking members each having a front end portion, wherein the front end portion is located at the first and second opening portions toward the probe holder and the wiring Inner plate extend in the thickness direction of the three-dimensional region.

According to the first embodiment, since the opening portion around the marker member can be increased, the light irradiated from the side of the camera 7 can easily reach the marker. The periphery of the member makes the image captured by the camera bright, and the pattern of the surface of the object can be visually inspected in a wide range, so that the initial alignment can be performed very easily.

Furthermore, the shape of the front end portion of the marking member is not limited to the foregoing. Fig. 8 is a view showing a configuration of a marking member provided in a probe card according to a modification of the first embodiment, and a schematic view of alignment by the marking member. The marking member 8 shown in Fig. 8 is provided with a belt-shaped distal end portion 8a having the same width as one side of the test pad 14p. In the present modification, the straight line forming the foremost end of the front end portion 8a of the marking member 8 is opposed to one side of the test pad 14p (in the case shown in Fig. 8, the side opposite to the side to which the outer lead 13 is connected) The side is aligned in a consistent manner.

(Embodiment 2)

Fig. 9 is a cross-sectional view showing the configuration of a main part of a probe card according to a second embodiment of the present invention. Fig. 10 is a plan view showing the configuration of a probe holder and a marker member provided in the probe card according to the second embodiment of the present invention. The probe card 9 shown in the figures includes a plurality of probes 2, a probe holder 16, a wiring board 17, and a plurality of marking members 5.

The probe holder 16 has a first substrate 161 provided with four marking members 5, a second substrate 162 laminated on the first substrate 161, and a third substrate 163 laminated on the second substrate 162. The third substrate 163 is provided with two first openings 164 that penetrate in the thickness direction. The configuration of the hole portion of the first substrate 161 and the second substrate 162 of the probe probe 2 is the hole portion 311 and the second substrate 32 of the first substrate 31 of the probe holder 3 described in the first embodiment, respectively. The configuration of the hole portion 321 (see Fig. 5) is the same. Again, for The configuration of the hole portion of the third substrate 163 through which the lead 6 is inserted is the same as the configuration of the hole portion 331 of the third substrate 33 of the probe holder 3 (see FIG. 5).

The wiring board 17 has a wiring portion 171 which is formed in a disk shape, and has a pattern formed on a surface that is not facing the contact body 10 (the lower surface side of FIG. 9); and two second openings 172. They are in communication with the two first openings 164 of the probe holder 16 respectively. In the wiring portion 171, the other end of the lead 6 which is in contact with the needle-like member 21 of the probe 2 at one end is welded to a predetermined portion. The wiring portion 171 is also electrically connected to the signal processing circuit 100 via a predetermined wiring.

The marking member 5 is provided with four first substrates 161 on the probe holder 16. The marking member 5 has a distal end portion 5a which is located in a direction in which the first opening portion 164 and the second opening portion 172 communicate with each other in the thickness direction of the probe holder 16 and the wiring substrate 17 (Fig. 9) The inside of either of the two three-dimensional regions D2 that is extended in the vertical direction. When the probe 2 is in contact with the circuit forming region 10a of the contacted body 10, the front end portion 5a of the marking member 5 is disposed along the thickness direction of the probe holder 16 and the wiring substrate 17 (the lower direction in FIG. 9) The predetermined test pads 14p which are respectively overlapped with each of the two circuit formation regions 10a adjacent to the both sides of the circuit formation region 10a are overlapped. Therefore, in the second embodiment, the test pads 14p having the function of the alignment regions in the circuit formation region 10a of the contacted body 10 are placed on the test pads 14 at the four corners of the circuit formation region 10a.

As shown in Fig. 10, a straight line L2 and a row connecting the foremost ends of the front end portions 5a of the two marking members 5 located in the same three-dimensional region D2 are connected. The arrangement direction of the probes 2 arranged in a row (upward direction in FIG. 10) is parallel. Further, the interval d2 between the tips of the front end portions 5a of the two marking members 5 is substantially equal to the length of the row of the probes 2 arranged in a row.

When the probe card 1 is aligned with the contacted body 10 by the camera 7, the two circuit formation regions 10a adjacent to each other in the longitudinal direction of the circuit formation region 10a that contacts the probe 2 are provided. In the test pad 14p, the center position of the test pad 14p which is shorter than the distance between the circuit forming region 10a in contact with the probe 2, and the position of the front end of the front end portion 5a of the corresponding mark member 5 are adjusted to The plate thickness direction of the probe holder 16 and the wiring substrate 17 appears to overlap.

According to the probe card of the second embodiment of the present invention described above, it is possible to perform alignment with higher precision.

(Embodiment 3)

Figure 11 is a cross-sectional view showing the configuration of a main part of a probe card according to a third embodiment of the present invention. Fig. 12 is a plan view showing the configuration of a probe holder and a marker member provided in the probe card of the third embodiment. The probe card 18 shown in the figures includes a plurality of probes 2, a probe holder 19, a wiring board 4, and a plurality of marking members 5.

The probe holder 19 includes a first substrate 191 provided with two marking members 5, a second substrate 192 laminated on the first substrate 191, and a third substrate 193 laminated on the second substrate 162. The first substrate 191 is provided with an opening 194 that penetrates in the thickness direction. The second substrate 192 and the third substrate 193 are also provided with openings 195 and 196 that penetrate the plate thickness direction of each substrate and communicate with the opening 194 of the first substrate 191. The three openings 194 to 196 The first opening portion 197 is formed. The first opening 197 is in communication with the second opening 42 of the wiring board 4 . The configuration of the hole portion of the first substrate 191 and the second substrate 192 of the probe probe 2 is the hole portion 311 and the second substrate 32 of the first substrate 31 of the probe holder 3 described in the first embodiment. The configuration of the hole portion 321 (see Fig. 5) is the same. In addition, the configuration of the hole portion of the third substrate 193 through which the lead wire 6 is inserted is the same as the configuration of the hole portion 331 of the third substrate 33 of the probe holder 3 (see FIG. 5).

The marking member 5 is provided with two first substrates 161 on the probe holder 19. As shown in Fig. 12, the marking member 5 has a distal end portion 5a which is located so that the communication portion between the first opening portion 197 and the second opening portion 42 faces the probe holder 19 and the wiring board 4 The inside of the three-dimensional region D3 in which the direction (the upper and lower directions in Fig. 12) is extended. The straight line L3 connecting the distal ends of the end portions 5a of the two marking members 5 is parallel to the arrangement direction of the probes 2 arranged in the row (upward and downward directions in Fig. 12). Further, the interval d3 between the tips of the front end portions 5a of the two marking members 5 is substantially equal to the length of the rows of the probes 2 arranged in a row. In the third embodiment, the front end portion 5a of the marking member 5 is directed in the direction of the probe 2, and is directed in the opposite direction to the front end portion 5a of the marking member 5 of the probe card 1 of the first embodiment. .

When the probe card 18 is aligned with the contacted body 10 by the camera 7, the center position of the test pad 14p of the circuit formation region 10a adjacent to the circuit formation region 10a in contact with the probe 2, and corresponding The position of the front end of the front end portion 5a of the marking member 5 of the test pad 14p is adjusted to look along the thickness direction of the probe holder 19 and the wiring substrate 4. For overlap.

According to the probe card of the third embodiment of the present invention described above, in the same manner as in the first embodiment, even when the probe whose longitudinal direction is in contact with the surface of the inspection target in a direction substantially perpendicular to the surface is used, The alignment of the probe with the inspection object is easily and surely performed.

Although the best mode for carrying out the invention has been described in detail above, the invention is not limited by the three embodiments described above. For example, the marking member may be integrally formed with the first substrate.

Further, the marking member 5 may be provided at any place as long as it has a correct positional relationship with the probe holder, and may be provided, for example, on a wiring board of a probe card.

Furthermore, the marking member for alignment (the area for alignment) may be additionally provided at an appropriate position instead of performing the alignment with the test pad. For example, when the probe wiring or the like causes a problem such as obstruction of the field of view of the camera, the marking member for alignment may be provided at an appropriate position in the circuit formation region of the inspection target to which the probe is in contact. In addition, the test pad and the marking member for alignment may be used in combination for alignment. The surface shape of the front end portion of the marking member for alignment may be a polygon other than a triangle or a quadrangle or a circle.

Further, the probe to which the present invention is applied may be any one that is perpendicular to the test pad or the electrode, or may be a probe having a tubular member that covers the outer periphery of the spring member. Further, it may be a linear probe having no spring member, or a plate-shaped probe. Further, the needle member may be used in the end portion on the side in contact with the lead wire, and the lead member may be in direct contact with the spring member. As described above, the present invention can include various embodiments and the like which are not described herein, and various design changes and the like can be made without departing from the scope of the technical idea specified by the claims.

(industrial use possibility)

As described above, the probe card of the present invention relates to an inspection object in which a plurality of conductive regions including a wiring structure for inputting or outputting electrical signals are formed on the surface, and is suitable for electrically connecting the wiring structure. It is especially suitable for electrical inspection when manufacturing TCP.

1, 9, 18‧‧ ‧ probe card

2‧‧‧ probe

3,16,19‧‧‧ Probe Holder

4, 17‧‧‧ wiring substrate

5, 8‧‧‧ mark members

5a, 8a‧‧‧ front end

6‧‧‧ lead

6e‧‧‧End

7‧‧‧ camera

10‧‧‧Contacted body (inspected)

10a‧‧‧Circuit forming area

11‧‧‧ wafer loading area

12‧‧‧ Inner lead

13‧‧‧External leads

14, 14p‧‧‧ test pad

15‧‧‧Sprocket hole

21, 22‧‧‧ needle members

23‧‧‧Spring components

31, 191‧‧‧ first substrate

32, 192‧‧‧ second substrate

33, 193‧‧‧ third substrate

41, 171‧‧‧ wiring department

42, 172‧‧‧ second opening

100‧‧‧Signal Processing Circuit

164, 197, 332‧ ‧ the first opening

194, 195, 196‧‧ ‧ openings

200‧‧‧screw components

311, 321, 331‧‧ ‧ Hole Department

Fig. 1 is a plan view showing the configuration of a main part of a probe card according to a first embodiment of the present invention.

Fig. 2 is a view showing the configuration of a main part of a probe card and a contacted object (inspection target) according to the first embodiment of the present invention.

Fig. 3 is a perspective view showing a main portion of the probe holder and the contacted body.

Fig. 4 is a plan view showing the configuration of the probe holder.

Fig. 5 is a partial cross-sectional view showing the configuration of the probe accommodating portion of the probe and the probe holder.

Fig. 6 is a view showing the positional relationship between the front end surface and the reference surface passing through the front end of the front end portion of the marking member at the time of full stroke.

Figure 7 is a schematic view showing the alignment of the marking member and the test pad.

Fig. 8 is a schematic view showing a configuration of a marking member provided in a probe card according to a modification of the first embodiment of the present invention, and a positioning by the marking member.

Fig. 9 is a cross-sectional view showing the configuration of a main part of a probe card according to a second embodiment of the present invention.

Fig. 10 is a plan view showing the configuration of a probe holder and a marker member provided in the probe card according to the second embodiment of the present invention.

Figure 11 is a cross-sectional view showing the configuration of a main part of a probe card according to a third embodiment of the present invention.

Fig. 12 is a plan view showing the configuration of a probe holder and a marking member provided in the probe card according to the third embodiment of the present invention.

1‧‧‧ probe card

2‧‧‧ probe

3‧‧‧ Probe Holder

4‧‧‧Wiring substrate

5‧‧‧Marking components

Claims (7)

A probe card electrically connecting a test object to a circuit structure for generating an inspection signal, and transmitting and receiving a signal, and confirming, by a camera, the probe card itself and the object to be inspected, The probe card includes a plurality of probes each composed of a conductive material, and one end of the longitudinal direction is in contact with the surface in a direction substantially perpendicular to a surface of the inspection object; the probe holder a plurality of holes each penetrating in a thickness direction and accommodating any one of the plurality of probes, and having a first opening penetrating in a thickness direction; the wiring board is fixed to the probe holder, and a wiring portion electrically connected to the plurality of probes and the circuit structure, and a second opening portion penetrating in the thickness direction and communicating with the first opening portion; and a plurality of marking members for the alignment Each has a front end portion, and the front end portion is located in a three-dimensional region in which the first and second openings are extended in the thickness direction of the probe holder and the wiring substrate. The interior of each of the plurality of marking members has a front end portion disposed along the probe holder and the wiring substrate when the plurality of probes contact a predetermined position of a surface of the inspection object The plate thickness direction is aligned with any of a plurality of alignment areas respectively provided on the surface of the inspection object, and is not in contact with the inspection object. The probe card of claim 1, wherein when the plurality of probes contact a predetermined position of a surface of the inspection object, each of the plurality of marking members has a front end portion disposed along the aforementioned The probe holder and the thickness direction of the wiring board overlap with any of a plurality of alignment areas respectively provided on the surface of the inspection target. The probe card according to the second aspect of the invention, wherein the object to be inspected is a surface on which a film-shaped insulating material is formed, and a plurality of circuit forming regions each having the plurality of alignment regions are provided along a longitudinal direction. When the plurality of probes contact any one of the plurality of circuit formation regions, each of the plurality of marker members has a front end portion disposed along a thickness of the probe holder and the wiring substrate The direction is a position overlapping with any one of the plurality of alignment areas provided on the surface of the circuit formation region adjacent to the circuit formation region to be contacted. The probe card according to any one of claims 1 to 3, wherein the plurality of marking members are provided in the probe holder. The probe card according to any one of the preceding claims, wherein, in the plurality of marking members, the front end of the front end portion passes through an arrangement of a portion arranged in a line with the plurality of probes The marking member having a substantially parallel straight line includes two or more, and the maximum value of the distance between the foremost ends of the front end portions of the two or more marking members passing through the straight line is one of the plurality of probes The lengths of the portions partially arranged in a row are substantially equal. The probe card according to any one of claims 1 to 3, wherein the front end of the front end portion of the marking member is orthogonal to the thickness direction of the probe holder and the wiring substrate The plane is closer to the wiring board than the front end surface of each of the probes protruding from the probe holder when the plurality of probes are fully stroked. The probe card of claim 6, wherein, in the plurality of marking members, a leading end portion of the front end portion passes through a linear marking member substantially parallel to an arrangement direction of a portion of the plurality of probes arranged in a line shape The maximum value of the distance between the foremost ends of the front end portions of the two or more marking members passing through the straight line is substantially equal to the length of the line in which the one of the plurality of probes is arranged in a row.