TWI470366B - Ilumination optical system, exposure apparatus and device manufacturing method - Google Patents

Description

Illumination optical system, exposure device, and component manufacturing method

The present invention relates to an illumination optical system, an exposure apparatus, and a component manufacturing method. More specifically, the present invention relates to an illumination optical system suitable for an exposure apparatus for manufacturing a semiconductor element, an image pickup element, a liquid crystal display element, and a thin film head by a lithography process (thin film) Magnetic head) and other components.

In such a typical exposure apparatus, light emitted from a light source forms a secondary light source composed of a plurality of light sources as a substantial surface light source via a fly eye lens as an optical integrator ( Generally speaking, it is a prescribed light intensity distribution in an illumination pupil). Hereinafter, the light intensity distribution in the illumination pupil is referred to as "the pupil intensity distribution". Further, the illumination pupil is defined as a position by which the illuminated surface becomes an action of an optical system between the illumination pupil and the illuminated surface (the mask or the wafer in the case of the exposure device). The position of the Fourier transition plane of the illumination pupil.

The light from the secondary light source is condensed by a condenser lens, and then the photomask on which the predetermined pattern is formed is superimposed and illuminated. The light penetrating the reticle is imaged on the wafer via the projection optical system, and the reticle pattern is projected (transferred) on the wafer. The pattern formed on the reticle is highly integrated, and in order to accurately transfer the fine pattern onto the wafer, it is indispensable to obtain a uniform illuminance distribution on the wafer.

Further, a technique of forming a pupil intensity distribution such as a belt shape or a multi-pole shape (2-pole shape, a 4-pole shape, etc.) and improving the depth of focus or resolution resolving power of the projection optical system has been proposed (refer to the patent) Document 1).

[Patent Document 1] US Patent Publication No. 2006/0055834

In order to faithfully transfer the fine pattern of the mask onto the wafer, it is necessary not only to adjust the pupil intensity distribution to a desired shape, but also to adjust the relative pupil intensity distribution at each point on the wafer to be approximately uniform. If there is a difference in the uniformity of the pupil intensity distribution at each point on the wafer, the pattern line width will be uneven at each position on the wafer, so that the mask cannot be spread over the entire exposure area at the desired line width. The fine pattern is transferred to the wafer. Thus, in order to accurately transfer the fine pattern of the photomask onto the wafer, it is important to adjust the illuminance distribution on the wafer as the final illuminated surface and the relevant pupil intensity distribution at each point on the wafer. The distribution of hope.

The present invention has been made in view of the above problems, and provides an illumination optical system capable of adjusting an illuminance distribution in an illuminated surface and an associated pupil intensity distribution at each point of the illuminated surface to a desired distribution. Further, the present invention provides an exposure apparatus that can adjust an illuminance distribution on an illuminated surface and an associated pupil intensity distribution at each point on the illuminated surface to a desired distribution, and can be based on appropriate lighting conditions. Good exposure.

In order to solve the above problems, a first aspect of the present invention provides an illumination optical system that illuminates an illuminated surface in accordance with light from a light source, including a spatial light modulator, which is two-dimensionally arranged and individually controlled. a plurality of optical elements; the concentrating optical system forms a predetermined surface on the surface of the spatial tiling of the plurality of optical elements of the spatial light modulator according to the light passing through the spatial light modulator a light intensity distribution; the optical integrator having a plurality of unit wavefront split surfaces arranged in two dimensions on the surface as the Fourier transform; and a control unit for controlling the spatial light modulator to pass the light collecting The optical system and the optical integrator and the light from the spatial light modulator adjust the pupil intensity distribution formed in the illumination pupil to a desired distribution, and form each of the plurality of unit wavefront split surfaces The light intensity distribution is adjusted to the desired distribution, respectively.

According to a second aspect of the present invention, there is provided an exposure apparatus comprising: an illumination optical system according to a first aspect of illuminating a predetermined pattern; and exposing the predetermined pattern to a photosensitive substrate.

According to a third aspect of the present invention, there is provided a method of manufacturing a device comprising: exposing, exposing the predetermined pattern to the photosensitive substrate using an exposure apparatus according to a second aspect; and developing the photosensitive property by transferring the predetermined pattern by a developing step The substrate is developed, and a mask layer having a shape corresponding to the predetermined pattern is formed on the surface of the photosensitive substrate; and in the processing step, the surface of the photosensitive substrate is preferably processed by the mask layer.

In the illumination optical system of the present invention, the control unit controls the plurality of optical elements of the spatial light modulator to appropriately change the light intensity distribution formed on each unit wavefront split surface of the optical integrator, thereby forming the optical intensity The illuminance distribution on the illuminated surface is adjusted to a desired distribution (for example, a uniform distribution), and the relevant pupil intensity distribution at each point of the illuminated surface can be adjusted to a desired distribution (for example, a uniform distribution).

That is, in the illumination optical system of the present invention, the illuminance distribution in the illuminated surface and the correlated pupil intensity distribution at each point of the illuminated surface can be adjusted to a desired distribution. As a result, the exposure apparatus of the present invention can use an illumination optical system that can adjust the illuminance distribution in the illuminated surface and the relevant pupil intensity distribution of each point of the illuminated surface to a desired distribution, and performs well based on appropriate lighting conditions. The exposure allows for the manufacture of good components.

The above described features and advantages of the present invention will be more apparent from the following description.

Embodiments of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a view schematically showing the configuration of an exposure apparatus according to an embodiment of the present invention. In FIG. 1, the normal direction of the transfer surface (exposure surface) of the wafer W, which is a photosensitive substrate, is set to the Z axis, and the direction parallel to the paper surface of FIG. 1 in the transfer surface of the wafer W is set to The Y axis is set to the X axis in a direction perpendicular to the paper surface of FIG. 1 in the transfer surface of the wafer W.

Referring to Fig. 1, in an exposure apparatus of this embodiment, exposure light (illumination light) is supplied from a light source LS. As the light source LS, an ArF (Argon-Fluoride) excimer laser light source that supplies, for example, 193 nm wavelength light, or a KrF (Krypton-Fluoride) excimer laser light source that supplies light of 248 nm wavelength can be used. The light emitted from the light source LS is incident on the spatial light modulation unit SU via the beam transfer unit 1. The beam transmitting portion 1 has a function of converting an incident light beam from the light source LS into a light beam having a cross section of an appropriate size and shape, and guiding it to the spatial light modulation unit SU, and actively correcting the incident light into the spatial light modulation unit SU The positional change of the beam and the angular variation.

The spatial light modulation unit SU includes: a spatial light modulator 3 having a plurality of mirror elements arranged in two dimensions and individually controlled; and a light guiding member 2 to be incident on the spatial light via the beam transmitting portion 1 The light of the modulation unit SU is directed to the spatial light modulator 3, and the light passing through the spatial light modulator 3 is directed to a subsequent relay optical system 4. The specific configuration and function of the spatial light modulation unit SU will be described later. The light emitted from the spatial light modulation unit SU is incident on the micro-overeye lens (or the fly-eye lens) 5 via the relay optical system 4.

The relay optical system 4 is set such that the front focus position of the relay optical system 4 substantially coincides with the position of the arrangement surface of the plurality of mirror elements of the spatial light modulator 3, and the rear focus position of the relay optical system 4 is The positions of the incident faces 5a of the micro fly's eye lens 5 are substantially the same. Therefore, as described below, the light passing through the spatial light modulator 3 forms a desired light intensity distribution corresponding to the posture of the plurality of mirror elements on the incident surface 5a of the micro-integrated eye lens 5. The micro-overlocular lens 5 is, for example, an optical element composed of a plurality of microlenses having a positive refractive power which are vertically and horizontally arranged in a densely arranged manner, and is formed by performing etching treatment on a parallel plane plate to form a microlens group.

Unlike a fly-eye lens composed of mutually isolated lens elements, the micro-eye-eye lens integrally forms a plurality of microlenses (micro-refractive surfaces) that are not isolated from each other. However, in terms of the vertical and horizontal arrangement of the lens elements, the micro-overlook lens and the fly-eye lens are both wavefront split type optical integrators. The rectangular micro-refractive surface as the unit wavefront dividing surface in the micro-fussy eye lens 5 has a rectangular shape similar to the shape of the illumination field of view to be formed on the mask M (and the shape of the exposure region to be formed on the wafer W). Further, as the micro-overlocular lens 5, for example, a cylindrical micro fly eye lens can be used. The constitution and function of the columnar micro-popcorn lens are disclosed, for example, in U.S. Patent No. 6,913,373.

The light beam incident on the micro fly's eye lens 5 is two-dimensionally divided by a plurality of microlenses, and an illumination pupil is formed on the rear side focal plane of the micro fly's eye lens 5 or in the vicinity of the micro fly's eye lens 5: having illumination with the incident light beam A secondary light source (ie, a pupil intensity distribution) of light intensity distribution having substantially the same field of view. The light beam of the secondary light source formed from the rear side focal plane of the micro fly's eye lens 5 or the vicinity of the micro fly's eye lens 5 is incident on the aperture stop 6 disposed in the vicinity of the micro fly's eye lens 5.

The aperture stop 6 has an opening (light transmitting portion) having a shape corresponding to a secondary light source formed in the vicinity of the rear focal plane or the micro fly's eye lens 5 of the micro fly's eye lens 5. The aperture stop 6 is configured to be detachably attachable to the illumination optical path, and is configured to be switchable to a plurality of aperture stops having openings having different sizes and shapes. As a switching method of the aperture stop, for example, a well-known turret method, a slide method, or the like can be used. The aperture stop 6 is disposed at a position that is substantially optically conjugate with the incident pupil plane of the projection optical system PL described below, and defines a range that contributes to illumination of the secondary light source. Furthermore, the setting of the aperture stop 6 can also be omitted.

The light from the secondary light source limited by the aperture stop 6 is superimposedly illuminated by the concentrating optical system 7 to the mask blind 8. In this manner, a rectangular illumination field of view corresponding to the shape of the rectangular micro-refractive surface of the micro-integral lens 5 and the focal length is formed at the mask mask 8 as the illumination field stop. The light beam passing through the rectangular opening portion (light transmitting portion) of the mask mask 8 is subjected to the condensing action of the imaging optical system 9, and then the photomask M having the predetermined pattern is superimposedly illuminated. That is, the imaging optical system 9 forms an image of the rectangular opening portion of the reticle 8 on the reticle M.

The light beam that has passed through the mask M held on the mask stage MS passes through the projection optical system PL, and the image of the mask pattern is formed on the wafer (photosensitive substrate) W held on the wafer stage WS. In this way, in the plane (XY plane) orthogonal to the optical axis AX of the projection optical system PL, two-dimensional drive control is performed on the wafer stage WS, and the wafer W is two-dimensionally driven and controlled. Single exposure or scanning exposure. Thereby, the pattern of the mask M is sequentially exposed to each exposure region of the wafer W.

In the present embodiment, a secondary light source formed by the micro fly's eye lens 5 is used as a light source, and Kohler illumination is applied to the mask M disposed on the illuminated surface of the illumination optical system. Therefore, the position at which the secondary light source is formed is optically conjugate with the position of the aperture stop AS of the projection optical system PL, so that the surface on which the secondary light source is formed can be referred to as the illumination surface of the illumination optical system. Typically, the illuminated surface (the surface on which the mask M is disposed or the surface on which the wafer W is disposed in consideration of the illumination optical system including the projection optical system PL) is an optical Fourier conversion surface with respect to the illumination pupil plane. In addition, the pupil intensity distribution means a light intensity distribution (brightness distribution) in an illumination pupil plane of the illumination optical system or a plane optically conjugate with the illumination pupil plane.

When the number of wavefront divisions of the micro-multi-eye lens 5 is relatively large, the overall light intensity distribution formed on the incident surface of the micro-multi-eye lens 5 and the overall light intensity distribution (the pupil intensity distribution) of the entire secondary light source are displayed. Higher correlation. Therefore, the light intensity distribution in the incident surface of the micro fly's eye lens 5 and the surface optically conjugate with the incident surface can be referred to as a pupil intensity distribution. In the configuration of FIG. 1, the spatial light modulation unit SU, the relay optical system 4, and the micro fly-eye lens 5 are configured to form a distribution of pupil intensity distribution in the illumination pupil on the rear side of the micro fly's eye lens 5. system.

Referring to Fig. 2, the light guiding member 2 in the spatial light modulation unit SU has a triangular prism shape which extends in the X direction, for example. The light from the light source LS passing through the beam transfer unit 1 is reflected by the first reflection surface 2a of the light guiding member 2, and then incident on the spatial light modulator 3. The light modulated by the spatial light modulator 3 is reflected by the second reflecting surface 2b of the light guiding member 2 and guided to the relay optical system 4.

As shown in FIG. 2 and FIG. 3, the spatial light modulator 3 includes a body 3a having a plurality of mirror elements SE arranged in two dimensions, and a driving unit 3b for individually controlling the driving of the plurality of mirror elements SE. . In order to simplify the description and the illustration, the body 3a of the spatial light modulator 3 shown in FIGS. 2 and 3 includes a configuration example of 4×4=16 mirror elements SE, but actually includes far more than 16 Most of the mirror elements SE.

Referring to FIG. 2, the light ray L1 is incident on the mirror element SEa of the plurality of mirror elements SE in the ray group incident on the first reflecting surface 2a of the light guiding member 2 in a direction parallel to the optical axis AX. L2 is incident on the mirror element SEb different from the mirror element SEa. Similarly, the light ray L3 enters the mirror element SEc different from the mirror elements SEa and SEb, and the light ray L4 enters the mirror element SEd different from the mirror elements SEa to SEc. The mirror elements SEa to SEd correspond to the positions of the mirror elements SEa to SEd, and apply the set spatial modulation to the lights L1 to L4.

The spatial light modulator 3 is configured such that a reference state (hereinafter referred to as a "reference state") set on one plane (XY plane) of the reflection surface of all the mirror elements SE is along the optical axis AX The light rays incident in the parallel direction are reflected by the respective mirror elements SE of the spatial light modulator 3, and then reflected by the second reflection surface 2b of the light guiding member 2 in a direction substantially parallel to the optical axis AX. Further, the surface of the spatial light modulator 3 in which the plurality of mirror elements SE are arranged is positioned at the front focus position of the relay optical system 4 or in the vicinity of the relay optical system 4.

Therefore, light of a predetermined angular distribution is reflected by the mirror elements SEa to SEd of the spatial light modulator 3, and predetermined light intensity distributions SP1 to SP4 are formed on the incident surface 5a of the micro fly's eye lens 5. In other words, the relay optical system 4 applies the angles of the emitted light to the mirror elements SEa to SEd of the spatial light modulator 3, and converts it to the far-field region (the Fraunhofer diffraction region) as the spatial light modulator 3. Fraunhofer diffraction area), that is, the position on the incident surface 5a.

In this manner, the relay optical system 4 constitutes a collecting optical system that becomes optical on the arrangement surface of the plurality of mirror elements SE of the spatial light modulator 3 in accordance with the light passing through the spatial light modulator 3 The surface of the Fourier transform, that is, the incident surface 5a of the micro fly's eye lens 5 forms a predetermined light intensity distribution. The light intensity distribution (the pupil intensity distribution) of the secondary light source formed by the micro-overlocular lens 5 corresponds to the light intensity distribution formed on the incident surface 5a of the spatial light modulator 3 and the relay optical system 4.

As shown in FIG. 3, the spatial light modulator 3 is a movable multiple mirror including a plurality of micromirror elements SE, and the micromirror elements SE are in a state where the planar reflecting surface is the upper surface, along the The planes are arranged regularly and in two dimensions. Each of the mirror elements SE is movable, and the inclination of the reflection surface, that is, the inclination angle and the inclination direction of the reflection surface are independently controlled by the drive unit 3b that is actuated by the command of the control unit CR. Each of the mirror elements SE may have two directions parallel to the reflection surface, that is, two directions orthogonal to each other (for example, the X direction and the Y direction) as the rotation axis, and only rotate the desired rotation angle continuously or discretely. That is, the inclination of the reflecting surface of each of the mirror elements SE can be two-dimensionally controlled.

Further, when the reflecting surfaces of the respective mirror elements SE are discretely rotated, a plurality of states (for example, ‧ ‧ , -2.5 degrees , -2.0 degrees , ‧ ‧ о degrees , + 0.5 degrees ‧ ‧ ‧ +2.5 degrees, ‧‧‧) Switch control rotation angle. Fig. 3 shows a mirror element SE having a square outer shape, but the outer shape of the mirror element SE is not limited to a square. However, from the viewpoint of light use efficiency, a shape (a shape that can be most densely filled) that can be arranged such that the gap of the mirror elements SE becomes small can be used. Further, from the viewpoint of light use efficiency, the interval between two adjacent mirror elements SE can be suppressed to a minimum required.

In the present embodiment, as the spatial light modulator 3, for example, a spatial light modulator that continuously changes the directions of the plurality of mirror elements SE arranged two-dimensionally is used. As such a spatial light modulator, for example, Japanese Patent Laid-Open No. Hei 10-503300, and the corresponding European Patent Publication No. 779530, Japanese Patent Laid-Open No. 2004-78136, and the corresponding US A spatial light modulator disclosed in Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Furthermore, the orientation of the plurality of mirror elements SE arranged in two dimensions may be controlled in a manner in which the discreteness has a plurality of stages.

In the spatial light modulator 3, the positions of the plurality of mirror elements SE are changed by the action of the driving unit 3b that is activated by the control signal from the control unit CR, and the respective positions are set in the predetermined directions. Mirror element SE. The light reflected at a predetermined angle by the plurality of mirror elements SE of the spatial light modulator 3 forms a desired light intensity distribution in the incident surface 5a of the micro fly's eye lens 5, and further in the micro fly's eye lens 5. At the rear focus surface or the illumination pupil (the position where the aperture stop 6 is disposed) in the vicinity of the micro fly's eye lens 5, a pupil intensity distribution having a desired shape and size is formed. Furthermore, other illumination light pupil positions that are optically conjugate with the aperture stop 6, that is, the pupil position of the imaging optical system 9 and the pupil position of the projection optical system PL (the aperture stop AS is disposed) Position) to form the desired pupil intensity distribution.

In the exposure apparatus, in order to transfer the pattern of the mask M to the wafer W with high precision and faithfulness, it is important to perform exposure in accordance with appropriate lighting conditions corresponding to the pattern characteristics. In the present embodiment, the spatial light modulator 3 in which the postures of the plurality of mirror elements SE are individually changed is used as a mechanism for variably forming a light intensity distribution in the illumination pupil. Therefore, the pupil intensity distribution (and thus the illumination condition) formed in the illumination pupil can be freely and rapidly changed by the action of the spatial light modulator 3.

However, when the illuminance distribution on the wafer W as the final illuminated surface and the pupil intensity distribution associated with each point on the wafer W are not adjusted to a desired distribution (for example, a uniform distribution), The fine pattern of the mask M is accurately transferred onto the wafer W. Therefore, the present embodiment includes the illuminance distribution measuring unit 10 that measures the illuminance distribution in the image plane of the projection optical system PL, and the pupil intensity distribution measuring unit 11 that opposes the projection optical system in accordance with the light passing through the projection optical system PL. The pupil intensity distribution in the pupil plane of the PL is measured; and the control unit CR determines the plurality of spatial light modulators 3 based on the measurement result of the illuminance distribution measuring unit 10 and the measurement result of the pupil intensity distribution measuring unit 11. The posture of the optical element SE is controlled.

The illuminance distribution measuring unit 10 monitors the illuminance distribution in the image plane of the projection optical system PL in accordance with a well-known configuration. The pupil intensity distribution measuring unit 11 includes a charge coupled device (CCD) imaging unit, and the charge coupled device imaging unit has an imaging surface, and the imaging surface is disposed optically with, for example, a pupil position of the projection optical system PL. The position of the yoke and the associated pupil intensity distribution at each point on the image plane (i.e., the illuminated surface) of the projection optical system PL (light incident on each point is formed on the pupil plane of the projection optical system PL) The pupil intensity distribution is monitored. For details of the configuration and operation of the pupil intensity distribution measuring unit 11, for example, US Patent Publication No. 2008/0030707 can be referred to.

In the following description, in order to make the effect of the present embodiment easy to understand, the illumination pupil in the vicinity of the rear focal plane of the micro fly's eye lens 5 or the vicinity of the micro fly's eye lens 5 is formed to include two elliptical shapes as shown in FIG. A two-pole pupil intensity distribution (secondary light source) 20 of the substantial surface light sources (hereinafter simply referred to as "surface light sources") 20a and 20b. In the following description, when it is simply referred to as "illumination pupil", it means an illumination pupil near the rear focal plane of the micro fly's eye lens 5 or the vicinity of the micro fly's eye lens 5.

Referring to Fig. 4, a two-pole pupil intensity distribution 20 formed in the illumination pupil has a pair of surface light sources 20a and 20b spaced apart in the Z direction across the optical axis AX. As shown in FIG. 5, the light which forms the two-pole pupil intensity distribution 20 is incident on a plurality of rectangular microlenses 5b which are vertically and horizontally arranged and arranged in a fine manner, that is, a hatching is attached to the figure. A plurality of microlenses 5ba. However, in FIG. 5, in order to clarify the drawing, the number of the rectangular microlenses 5b constituting the micro fly's eye lens 5 is expressed to be much smaller than the actual number.

In this manner, the micro-overlocular lens 5 constitutes an optical integrator having a plurality of unit wavefront division faces (incidence faces of the respective microlenses 5b) arranged two-dimensionally and positioned in the space light modulator 3 The arrangement surface of the plurality of mirror elements SE is an optical Fourier-converted surface. Further, the plurality of unit wavefront division surfaces that are two-dimensionally arranged in the micro fly's eye lens 5 are optically conjugate with the mask M (and further the wafer W) that is the irradiation surface.

Further, in a range in which the effects of the embodiment are exerted, a plurality of unit wavefront split surfaces in which the micro fly's eye lens 5 is two-dimensionally arranged may be disposed on the plurality of mirrors from the spatial light modulator 3 The arrangement surface of the element SE becomes a position where the surface of the optical Fourier transform is defoucs. Further, in a range in which the effects of the embodiment are exerted, a plurality of unit wavefront split surfaces in which the micro fly's eye lens 5 is two-dimensionally arranged may be disposed from the mask M (wafer W) as the illuminated surface. ) is the position where the optically conjugated surface is out of focus.

Fig. 6 is a view for explaining the action of the embodiment. In FIG. 6, in order to make the description easy to understand, the four microlenses 5ba that cause light to enter in correspondence with the two-pole pupil intensity distribution 20 among the plurality of microlenses 5b constituting the micro fly's eye lens 5, And one microlens 5bb that is not incident on the light. Further, the intensity distribution along the YZ plane of the light incident on the four microlenses 5ba is indicated by the hatched area. Here, the intensity of incident light is larger at a position where the height of the hatching region in the Y direction is larger.

In the present embodiment, the spatial light modulator 3 has a plurality of mirror elements SE which are far larger than the number of microlenses 5b constituting the micro fly's eye lens 5, and the postures of the mirror elements SE can be individually changed. Therefore, the light intensity distribution formed on the incident surface 5a of the micro-overlocular lens 5 can be freely changed by the action of the spatial light modulator 3, and the incident surface of each microlens 5b incident on the micro fly's eye lens 5 can be made. (i.e., the intensity distribution of light in each unit wavefront splitting surface) is free to change.

In the example shown in FIG. 6, the intensity distributions of the light incident on the two microlenses 5ba located in the +Z direction are the same as each other, and the intensity distributions of the light incident on the two microlenses 5ba located in the -Z direction are mutually the same. Further, the intensity distribution of the light incident on the two microlenses 5ba on the +Z direction side and the intensity distribution of the light incident on the two microlenses 5ba on the -Z direction side are symmetrical with respect to the optical axis AX.

Specifically, among the intensity distributions of the light incident on the two microlenses 5ba on the +Z direction side, the intensity is the largest at one end on the +Z direction side and the smallest at the center position along the Z direction, from + The end of the Z-direction side is monotonously reduced toward the center position, and the intensity is monotonously increased from the center position toward the -Z direction side. At this time, the intensity distribution of the light incident on the four microlenses 5ba is superimposed on the position of the mask mask 8 which is optically conjugate with the mask M (and thus the wafer W) which is the surface to be irradiated, and is formed substantially. Uniform illumination distribution.

The light reaching the center point in the exposure area on the wafer W (the still exposure area in the case of scanning exposure), that is, the light reaching the center point P1 of the opening of the mask mask 8, as shown by the dotted line in FIG. It is shown that the intensity of the center of the four microlenses 5ba is the smallest. Therefore, as shown in the central view of FIG. 7, the 2-pole light intensity distribution formed by the light reaching the center point P1 in the illumination pupil, that is, the pupil intensity distribution 21 associated with the center point P1, the +Z direction The light intensity of the surface light source 21a on the side and the light intensity of the surface light source 21b on the -Z direction side are equal to each other, and the light intensity thereof is relatively small.

The light reaching the one peripheral point in the Y direction from the center point in the exposure region on the wafer W, that is, the light reaching the +Z direction side peripheral point P2 of the opening portion of the mask mask 8 is from the +Z direction The light of the two microlenses 5ba on the side is light having a relatively large intensity passing through one end on the -Z direction side as shown by a thin solid line in FIG. 6, and light of two microlenses 5ba from the -Z direction side is as shown in FIG. The thick solid line in Fig. 6 shows the light having the strongest intensity at the end on the -Z direction side. Therefore, as shown in the left diagram of FIG. 7, the 2-pole light intensity distribution formed on the illumination pupil at the light reaching the peripheral point P2, that is, the pupil intensity distribution 22 associated with the peripheral point P2, +Z The light intensity of the surface light source 22a on the direction side is relatively large, and the light intensity of the surface light source 22b on the -Z direction side is the largest.

The light from the center point in the exposure region on the wafer W to the other peripheral point in the Y direction, that is, the light reaching the -Z direction side peripheral point P3 of the opening portion of the reticle 8 is from +Z The light of the two microlenses 5ba on the direction side is the light having the strongest intensity passing through one end on the +Z direction side as shown by the thick solid line in Fig. 6, and the light from the two microlenses 5ba on the -Z direction side is as shown in Fig. 6. The thin solid line shows light having a relatively large intensity at one end on the +Z direction side. Therefore, as shown in the right side view of FIG. 7, the 2-pole light intensity distribution formed by the light reaching the peripheral point P3 in the illumination pupil, that is, the pupil intensity distribution 23 associated with the peripheral point P3, +Z The surface light source 23a on the direction side has the largest light intensity, and the surface light source 23b on the -Z direction side has a relatively large light intensity.

As described above, in the example shown in FIGS. 6 and 7, the pupil intensity distribution associated with the predetermined one point P2 on the illuminated surface 8 is the first pupil intensity distribution, and is made on the illuminated surface 8. The pupil intensity distribution associated with the other one point (P1 or P3) different from the predetermined one point P2 is the second pupil intensity distribution. In this way, the light intensity distribution formed in each of the plurality of unit wavefront split surfaces is two or more light intensity distributions.

In the example shown in FIGS. 6 and 7 described above, in other words, the first setting step includes setting the pupil intensity distribution target related to the predetermined one point P2 on the illuminated surface, that is, the first target pupil intensity distribution. And the second setting step of setting the pupil intensity distribution target related to the other one point (P1 or P3) different from the predetermined one point P2 on the illuminated surface, that is, the second target pupil intensity distribution. Here, the pupil intensity distribution associated with the predetermined one point P2 is the first target pupil intensity distribution, and the pupil intensity distribution associated with the other one point (P1 or P3) is the second target pupil intensity distribution. In the manner of distribution, the pupil intensity distribution formed in the illumination pupil is adjusted, and the light intensity distributions formed in each of the plurality of unit wavefront division planes are respectively adjusted.

In this case, the first step of distinguishing may be performed to distinguish the first target pupil intensity distribution from the plurality of unit wavefront division planes, and the first light intensity calculation step to calculate and distinguish the first target pupil intensity a light intensity at a position corresponding to one of the predetermined points in the distribution; a second step of distinguishing the second target pupil intensity distribution based on the plurality of unit wavefront division surfaces; and the second light intensity calculation step, respectively calculating The light intensity at the position corresponding to the other one point in the second target pupil intensity distribution; and the calculation step, based on the predetermined one point P2 and the other one calculated in the first and second light intensity calculation steps The light intensity at a position corresponding to the point (P1 or P3) is calculated, and the light intensity distributions to be formed on the plurality of unit wavefront split faces are respectively calculated.

Next, in the example shown in FIG. 8, the intensity distribution of the light in the two microlenses 5ba incident on the +Z direction side in Fig. 6 is the same distribution of light, and the microlens 5ba incident on the -Z direction side is made. The light having the same distribution of the intensity of the light incident on the two microlenses 5ba on the -Z direction side in FIG. 6 is incident on the microlens 5ba on the +Z direction side. In the example shown in FIG. 8, also in the same manner as the example shown in FIG. 6, the reticle 8 is optically conjugate with the mask M (and thus the wafer W) as the illuminated surface. The position is such that the intensity distribution of the light incident into the four microlenses 5ba is superimposed to form a substantially uniform illuminance distribution.

Further, the light reaching the center point P1 of the opening of the mask mask 8 is the light having the smallest intensity passing through the center position of the four microlenses 5ba as indicated by a broken line in FIG. Therefore, as shown in the central view of Fig. 9, in the pupil intensity distribution 21 associated with the center point P1, the light intensity of the surface light source 21a on the -Z direction side and the light intensity of the surface light source 21b on the -Z direction side are equal to each other. And its light intensity is relatively small.

Among the light reaching the peripheral point P2 of the opening of the mask mask 8, the light from the two microlenses 5ba on the -Z direction side is the strongest one passing through the one end in the -Z direction as shown by the thick solid line in FIG. Light, the light from the two microlenses 5ba on the -Z direction side is light having a relatively large intensity passing through one end on the -Z direction side as shown by a thin solid line in FIG. Therefore, as shown in the left diagram of Fig. 9, in the pupil intensity distribution 22 associated with the peripheral point P2, the light intensity of the surface light source 22a on the +Z direction side is the largest, and the light intensity of the surface light source 22b on the -Z direction side is relatively Larger.

Among the light reaching the peripheral point P3 of the opening of the mask mask 8, the light from the two microlenses 5ba on the +Z direction side is relatively strong as shown by the thin solid line in Fig. 8 through the one end in the +Z direction side. The large light, the light from the two microlenses 5ba on the -Z direction side is the light having the strongest intensity passing through one end on the +Z direction side as shown by the thick solid line in FIG. Therefore, as shown in the right side view of Fig. 9, in the pupil intensity distribution 23 associated with the peripheral point P3, the light intensity of the surface light source 23a on the +Z direction side is relatively large, and the light of the surface light source 23b on the -Z direction side is relatively large. The strength is the greatest.

However, for example, referring to FIG. 6, it can be understood that in the optical ideal state, when the intensity of light incident on the four microlenses 5ba is uniform and equal to each other, the position of the reticle 8 is formed. A uniform illuminance distribution, and a uniform illuminance distribution is also formed on the wafer W as the final illuminated surface. Moreover, it can be understood that in the pupil intensity distributions 21, 22, 23 associated with the respective points P1, P2, P3 of the opening portion of the reticle 8, the surface light sources 21a, 21b, 22a, 22b, 23a The light intensities of 23b are equal to each other. That is, the pupil intensity distribution associated with each point in the opening of the mask mask 8 becomes uniform, and the pupil intensity distributions associated with the respective points in the exposure region on the wafer W are also uniform.

However, in the actual optical system, even if the intensity distribution of the light incident into the desired microlens 5ba is set to be uniform and equal to each other, it may not be uniform in the position of the reticle 8 for various reasons. The illuminance distribution, and the points in the opening of the reticle 8 obtain a uniform pupil intensity distribution. Furthermore, even if a uniform illuminance distribution is obtained in the position of the reticle 8 and a uniform pupil intensity distribution is obtained at each point, it is not necessarily possible to obtain a uniform illuminance distribution on the wafer W, and on the wafer W. A uniform pupil intensity distribution is obtained for each point in the exposed area.

This situation means that in an actual optical system, in order to obtain a uniform illuminance distribution on the wafer W, it is required to adjust the illuminance distribution in the position of, for example, the reticle 8 to a desired distribution that is not uniform. Moreover, this case means that, in order to obtain a uniform pupil intensity distribution at each point in the exposed area on the wafer W, it is required to, for example, the pupil intensity associated with each point in the opening of the reticle 8 The distribution is adjusted to the desired distribution that is not uniform.

Referring to FIGS. 6 to 9, it can be understood that in the present embodiment, the intensity of light incident on the incident surface of each microlens 5b of the micro fly's eye lens 5 can be made by using the spatial light modulator 3. The distribution is appropriately changed, and the illuminance distribution formed at the position of the reticle 8 is maintained substantially uniform, and the pupil intensity distribution associated with the points P1, P2, and P3 in the opening of the reticle 8 is independently adjusted. . Further, it is easy to estimate that the intensity distribution of light incident on the incident surface (each unit wavefront dividing surface) of each microlens 5b can be appropriately changed to be formed at the position of the reticle 8 The illuminance distribution is adjusted to a desired distribution, and the pupil intensity distribution associated with each point in the opening of the reticle 8 is adjusted to a desired distribution.

In other words, in the present embodiment, the control unit CR individually controls the postures of the plurality of mirror elements SE of the spatial light modulator 3 so as to be formed in each of the plurality of unit wavefront split surfaces of the micro fly's eye lens 5. The light intensity distribution is appropriately changed, whereby the exposed area on the wafer W (or the illumination area on the mask M) located at a position optically conjugate with the position of the mask mask 8 can be formed. The illuminance distribution is adjusted to a desired distribution, and the pupil intensity distribution associated with each point in the exposed area on the wafer W (or the illumination area on the reticle M) is adjusted to a desired distribution, respectively. In this manner, the control unit CR has a function of controlling the spatial light modulator 3 to be formed in the illumination pupil in accordance with the light from the spatial light modulator 3 via the relay optical system 4 and the micro fly-eye lens 5. The pupil intensity distribution is adjusted to a desired distribution, and the light intensity distribution among the plurality of unit wavefront split surfaces formed in the micro fly's eye lens 5 is adjusted to a desired distribution, respectively.

Specifically, in the present embodiment, the control unit CR performs the posture of the plurality of mirror elements SE of the spatial light modulator 3 based on the measurement result of the illuminance distribution measuring unit 10 and the measurement result of the pupil intensity distribution measuring unit 11. Control, whereby the illuminance distribution formed in the exposed area on the wafer W at the image plane position of the projection optical system PL can be adjusted to a desired distribution (for example, a uniform distribution), and respectively incident on the crystal The pupil intensity distribution formed by the light among the points in the exposure region on the circle W at the pupil position of the projection optical system PL is adjusted to a desired distribution (for example, a uniform distribution).

As described above, in the illumination optical systems (1 to 11) of the present embodiment, the illuminance distribution on the wafer W as the final illuminated surface and the points in the exposure region on the wafer W can be correlated. The pupil intensity distribution is adjusted to the desired distribution. Therefore, in the exposure apparatuses (1 to 11, MS, PL, and WS) of the present embodiment, the illuminance distribution on the wafer W and the pupil intensity associated with each point in the exposure region on the wafer W can be used. The illumination optical system (1 to 11) whose distribution is adjusted to a desired distribution is subjected to appropriate illumination conditions according to appropriate illumination conditions corresponding to the fine pattern of the mask M, and thus can be spread over the entire exposure area at a desired line width. The fine pattern of the mask M is accurately transferred onto the wafer W.

Furthermore, in the above-described embodiment, the relay optical system 4 as a collecting optical system that functions as a Fourier transform lens is disposed in the optical path between the spatial light modulation unit SU and the micro fly's eye lens 5. However, the present invention is not limited thereto, and an optical system including an afocal optical system, a conical axicon system, a zoom optical system, and the like may be disposed instead of the relay optical system 4. Such an optical system is disclosed in International Publication No. 2005/076045 A1, and in its corresponding US Patent Application Publication No. 2006/0170901 A.

Further, in the above description, the effect of the present invention has been described with reference to the case where the illumination pupil is formed with the distortion illumination of the two-pole pupil intensity distribution, that is, the two-pole illumination. However, the present invention is not limited to the two-pole illumination, and may be the same, for example, a belt-shaped illumination in which a band-shaped aperture intensity distribution is formed, a multi-pole illumination in which a multi-pole pupil intensity distribution other than a two-pole shape is formed, or the like. The present invention is applied to obtain the same effects.

Further, in the above description, the optical integrator of the wavefront division type is exemplified by the micro-folding eye lens 5 in which the lens elements are arranged vertically and horizontally and two-dimensionally. However, the present invention can be similarly applied to the columnar micro fly's eye lens disclosed in, for example, U.S. Patent No. 6,913,373, to obtain the same effects.

In addition, when a columnar micro-multi-eye lens is applied, the columnar micro-multi-eye lens has a plurality of cylindrical surface-shaped refractive surfaces (first lenticular lens group) arranged in parallel in the first direction transverse to the optical axis, and Since the plurality of cylindrical surface-shaped refractive surfaces (second lenticular lens groups) are arranged side by side in the second direction orthogonal to the first direction of the optical axis, the first and second lenticular lens groups are used. Define the unit wavefront split plane.

Further, in the above embodiment, the micro fly's eye lens 5 is used as the optical integrator. Instead, an internal reflection type optical integrator (typically a rod integrator) can be used. At this time, on the rear side of the relay optical system 4, the condensing lens is arranged such that the front focus position of the relay optical system 4 coincides with the rear focus position of the relay optical system 4, and is positioned at the incident end. The integrating column is disposed in such a manner as to be in the vicinity of the rear focus position of the condensing lens. At this time, the emitting end of the integrating column is located at the reticle 8 . When an integrating column is used, a position in the imaging optical system 9 downstream of the integrating column that is optically conjugate with the position of the aperture stop AS of the projection optical system PL can be referred to as an illumination face. Further, since a virtual image of the secondary light source that illuminates the pupil surface is formed at the position of the incident surface of the integrator column, the position and the position at which the position is optically conjugated can be referred to as an illumination pupil plane.

Here, a plane perpendicular to the optical axis passing through a position where the rear focus position of the relay optical system 4 coincides with the front focus position of the condensing lens, and a plurality of unit wavefronts are two-dimensionally arranged when the micro fly's eye lens 5 is used. The face of the split face corresponds. Therefore, when the integrating column is used, the same effect as that of the above embodiment can be obtained by controlling the light intensity distribution in the surface passing through the rear focus position of the relay optical system 4 according to the above embodiment.

Further, in the above description, as a spatial light modulator having a plurality of optical elements which are two-dimensionally arranged and individually controlled, it is possible to individually control the orientation (angle: tilt) of a plurality of two-dimensionally arranged reflecting surfaces. Space light modulator. However, the present invention is not limited thereto, and for example, a spatial light modulator that can individually control the height (position) of a plurality of two-dimensionally arranged reflecting surfaces can be used. As such a spatial light modulator, for example, Japanese Patent Laid-Open No. Hei. 6-281869, and the corresponding US Pat. No. 5,312,513, and Japanese Patent Laid-Open No. 2004-520618, and the corresponding US patents can be used. The spatial light modulator disclosed in Figure 1d of U.S. Patent No. 6,885,493. In these spatial light modulators, the incident light can be applied to the same effect as the diffraction surface by forming a two-dimensional height distribution. Further, the above-described spatial light modulator having a plurality of reflecting surfaces arranged in two dimensions may be also exemplified by, for example, Japanese Patent Laid-Open No. 2006-513442, and the corresponding US Pat. No. 6,891,655, Japanese Patent Laid-Open Publication No. 2005 Modifications are made in the disclosure of the Japanese Patent Publication No. 2005-0095749.

Further, in the above description, a reflective spatial light modulator having a plurality of mirror elements is used, but the present invention is not limited thereto, and a transmissive spatial light modulation disclosed in, for example, U.S. Patent No. 5,229,872 may be used. Device.

Further, in the above embodiment, a variable pattern forming device that forms a predetermined pattern based on a predetermined electronic material may be used instead of the photomask. When such a variable pattern forming apparatus is used, even if the pattern surface is provided in the longitudinal direction, the influence on the synchronization accuracy can be minimized. Further, as the variable pattern forming device, for example, a digital micromirror device (DMD) including a plurality of reflective elements driven based on predetermined electronic data can be used. An exposure apparatus using a DMD is disclosed in, for example, Japanese Patent Laid-Open No. 2004-304135, International Patent Publication No. 2006/080285, and the corresponding US Patent Publication No. 2007/0296936. Further, in addition to a non-light-emitting reflective spatial light modulator such as a DMD, a transmissive spatial light modulator may be used, or a self-luminous image display element may be used. Further, the variable pattern forming device can be used even when the pattern surface is laterally disposed.

Further, in the above embodiment, the pupil intensity distribution in each point on the surface to be irradiated is substantially uniformly adjusted, but the pupil intensity distribution in each point on the surface to be irradiated may be adjusted to be not uniform. distributed. Further, the pupil intensity distributions at the respective points on the illuminated surface may be adjusted to different predetermined distributions. For example, in order to correct the line width error caused by the cause other than the uniformity of the pupil intensity distribution of the exposure apparatus itself, the coating development processing apparatus (coating and developing machine) used in combination with the exposure apparatus in the photolithography process The line width error caused by the device other than the exposure device such as the heating/cooling treatment device can adjust the pupil intensity distribution at each point on the illuminated surface to a different predetermined distribution.

As described below, the photolithography step in the manufacturing step of the semiconductor element is to form a photoresist (photosensitive material) film on the surface of the object to be processed such as a wafer, and then expose the circuit pattern on the photoresist film to perform development processing. Thereby, a photoresist pattern is formed. The photolithography process is performed by a coating and developing device (coating and developing machine) and an exposure device integrally provided with the device, and the coating and developing device has a photoresist for photoresist coating on the wafer. A coating processing unit or a development processing unit that develops the exposed wafer.

Further, such a coating and developing treatment apparatus includes, for example, a heat treatment apparatus or a cooling treatment apparatus that performs heat treatment such as heat treatment or cooling treatment on the wafer after the photoresist film is formed on the wafer or before the development processing. Here, when the thickness of the photoresist film in the wafer surface is not uniform, or the temperature distribution in the wafer surface is uneven due to the heat treatment, the uniformity of the line width in the irradiation region may be due to the wafer W. The position of the upper illuminated area is different and presents different characteristics. Further, in the etching apparatus in which the photoresist pattern is used as a mask and the film to be etched under the photoresist pattern is etched, when the temperature distribution in the wafer surface is not uniform, the line width in the irradiation region may be sometimes The uniformity distribution also exhibits different characteristics due to the position of the illuminated area on the wafer W.

Such a change in the uniformity distribution of the line width in the irradiation region due to the position of the irradiation region on the wafer caused by the coating and developing treatment device or the etching device, etc., is such that the wafer does not depend on the irradiation position to some extent. Stable error distribution (systematic error distribution). Therefore, in the exposure apparatus of the above-described embodiment, it is possible to correct the variation of the line width uniformity distribution in the irradiation region by adjusting the pupil intensity distribution at each point on the surface to be irradiated to a predetermined distribution different from each other. .

The exposure apparatus of the above-described embodiment is manufactured by assembling various subsystems including the respective constituent elements listed in the patent application scope while maintaining predetermined mechanical precision, electrical precision, and optical precision. In order to ensure these various precisions, adjustments for optical precision are performed for various optical systems before and after the assembly, and adjustments for mechanical precision are performed for various mechanical systems, and electrical precision is achieved for various electrical systems. Adjustment. The assembly procedure of the various subsystems to the exposure apparatus includes mechanical connection of various subsystems, wiring connection of an electric circuit, piping connection of a pneumatic circuit, and the like. Of course, prior to the assembly steps of the various subsystems to the exposure apparatus, there are individual assembly steps for each subsystem. After the assembly steps of the various subsystems to the exposure apparatus are completed, comprehensive adjustment is performed to ensure various precisions as the entire exposure apparatus. Further, it is preferable that the exposure apparatus be manufactured in a managed clean room such as temperature and cleanliness.

Next, a method of manufacturing an element using the exposure apparatus of the above embodiment will be described. Fig. 10 is a flow chart showing a manufacturing procedure of a semiconductor element. As shown in FIG. 10, the manufacturing process of the semiconductor element is performed by depositing a metal film on the wafer W as a substrate of the semiconductor element (step S40), and coating the vapor-deposited metal film as a photosensitive material. Photoresist (step S42). Next, using the exposure apparatus of the above-described embodiment, the pattern formed on the mask (reticle) M is transferred to each of the irradiation regions on the wafer W (step S44: exposure step), and after the transfer is completed The wafer W is developed, that is, developed by transferring the patterned photoresist (step S46: development step).

Then, the photoresist pattern formed on the surface of the wafer W by the step S46 is used as a mask, and the surface of the wafer W is subjected to etching or the like (step S48: processing step). Here, the photoresist pattern refers to a photoresist layer in which irregularities having a shape corresponding to the pattern transferred by the exposure apparatus of the above-described embodiment are formed, and the concave portion penetrates the photoresist layer. In step S48, surface processing of the wafer W is performed via the photoresist pattern. The processing performed in step S48 includes, for example, at least one of etching of the surface of the wafer W or film formation of a metal film or the like. In the exposure apparatus of the above-described embodiment, the exposure apparatus of the above-described embodiment performs pattern transfer by using the wafer W on which the photoresist is applied as the flat plate P which is a photosensitive substrate.

11 is a flow chart showing a manufacturing procedure of a liquid crystal element such as a liquid crystal display element. As shown in FIG. 11, in the manufacturing process of the liquid crystal element, a pattern forming step (step S50), a color filter forming step (step S52), a cell assembly step (step S54), and a module assembling step are sequentially performed ( Step S56). In the pattern forming step of step S50, a predetermined pattern such as a circuit pattern and an electrode pattern is formed on the glass substrate on which the photoresist is applied as the flat plate P by using the projection exposure apparatus of the above-described embodiment. The pattern forming step includes an exposure step of transferring the pattern to the photoresist layer using the projection exposure apparatus of the above embodiment, and a developing step of developing the flat plate P on which the pattern is transferred, that is, the photoresist on the glass substrate. The layer is developed to form a photoresist layer having a shape corresponding to the pattern; and a processing step of processing the surface of the glass substrate via the developed photoresist layer.

In the color filter forming step of step S52, a color filter is formed which has a plurality of colors arranged in a matrix (Red, R), green (Green), and blue (Blue, B). The corresponding three dot groups or three strips of filter sets of R, G, and B are arranged in the horizontal scanning direction. In the unit assembly step of step S54, a liquid crystal panel (liquid crystal cell) is assembled using a glass substrate having a predetermined pattern formed in step S50 and a color filter formed in step S52. Specifically, for example, a liquid crystal panel is formed by injecting liquid crystal between a glass substrate and a color filter. In the module assembly step of step S56, various components such as an electric circuit and a backlight module that cause the liquid crystal panel to perform a display operation are attached to the liquid crystal panel assembled in step S54.

Furthermore, the present invention is not limited to being applied to an exposure apparatus for manufacturing a semiconductor element, and can be widely applied, for example, to an exposure apparatus for manufacturing a liquid crystal display element formed on a square glass plate or a display device such as a plasma display, or An exposure device for various elements such as an imaging element (CCD or the like), a micromachine, a thin film magnetic head, and a deoxyribonucleic acid (DNA) wafer. Further, the present invention is also applicable to an exposure step (exposure device) in the case of producing a photomask (photomask, reticle, or the like) having a mask pattern of various elements by using a photolithography step.

Further, in the above embodiment, ArF excimer laser light (wavelength: 193 nm) or KrF excimer laser light (wavelength: 248 nm) is used as the exposure light, but the invention is not limited thereto, and the present invention may be applied to other appropriate A laser light source, for example, an F ₂ laser light source that supplies laser light having a wavelength of 157 nm.

Further, in the above embodiment, a method of filling a medium having a refractive index of more than 1.1 (typically a liquid) into an optical path between the projection optical system and the photosensitive substrate, that is, a so-called liquid immersion method, may be applied. . At this time, as a method of filling a liquid into the optical path between the projection optical system and the photosensitive substrate, a method of partially filling a liquid disclosed in the pamphlet of International Publication No. WO99/49504, or Japanese Patent Laid-Open No. 6 can be employed. a method of moving a stage on which an exposure target substrate is held in a liquid tank, or a liquid having a predetermined depth on a stage disclosed in Japanese Laid-Open Patent Publication No. Hei 10-303114 a method of holding a substrate in the liquid tank, and the like. Further, in the above-described embodiment, a so-called polarized illumination method disclosed in U.S. Patent Publication No. 2006/0170901 and No. 2007/0146676 can be applied.

Further, in the above embodiment, the present invention is applied to an illumination optical system that illuminates a mask (or a wafer) in an exposure apparatus. However, the present invention is not limited thereto, and the present invention can also be applied to a mask (or wafer). A general illumination optical system that illuminates the illuminated surface.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

1. . . Beam transmission unit

2. . . Light guiding member

2a. . . First reflecting surface

2b. . . Second reflecting surface

3. . . Space light modulator

3a. . . Ontology

3b. . . Drive department

4. . . Relay optical system

5. . . Micro compound eye lens

5a. . . Incident surface

5b, 5ba, 5bb. . . Microlens

6. . . Aperture stop

7. . . Concentrating optical system

8. . . Mask mask

9. . . Imaging optical system

10. . . Illumination distribution measurement department

11. . . Optical intensity distribution measurement department

20. . . 2 pole diaphragm intensity distribution

20a, 20b. . . Surface light source

21, 22, 23. . . Aperture intensity distribution

21a, 21b, 22a, 22b, 23a, 23b. . . Surface light source

AS. . . Aperture stop

AX. . . Optical axis

L1～L4. . . Light

LS. . . light source

SP1 ~ SP4. . . Light intensity distribution

SU. . . Spatial light modulation unit

CR. . . Control department

M. . . Mask

P. . . flat

PL. . . Projection optical system

P1. . . Center point

P2, P3. . . Peripheral point

SE, SEa ~ SEd. . . Mirror element

S40～S56. . . step

W. . . Wafer

WS. . . Wafer stage

Fig. 1 is a view schematically showing the configuration of an exposure apparatus according to an embodiment of the present invention.

Fig. 2 is a view for explaining the action of a spatial light modulator in a spatial light modulation unit.

Fig. 3 is a partial perspective view of a main portion of a spatial light modulator.

4 is a view schematically showing a 2-pole light intensity distribution formed in an illumination pupil.

Fig. 5 is a view schematically showing a configuration of an incident surface of a micro fly's eye lens and a unit wavefront split surface in which light is incident in accordance with the pupil intensity distribution of Fig. 4;

Fig. 6 is a first view for explaining the operation of the embodiment.

Fig. 7 is a view showing a correlation pupil intensity distribution at each of points P1, P2, and P3 of Fig. 6.

Fig. 8 is a second view for explaining the operation of the embodiment.

Fig. 9 is a view showing a correlation pupil intensity distribution at each of points P1, P2, and P3 of Fig. 8.

Fig. 10 is a flow chart showing a manufacturing procedure of a semiconductor element.

11 is a flow chart showing a manufacturing procedure of a liquid crystal element such as a liquid crystal display element.

1. . . Beam transmission unit

2. . . Light guiding member

3. . . Space light modulator

3a. . . Ontology

3b. . . Drive department

4. . . Relay optical system

5. . . Micro compound eye lens

5a. . . Incident surface

6. . . Aperture stop

7. . . Concentrating optical system

8. . . Mask mask

9. . . Imaging optical system

10. . . Illumination distribution measurement department

11. . . Optical intensity distribution measurement department

AS. . . Aperture stop

AX. . . Optical axis

LS. . . light source

SU. . . Spatial light modulation unit

CR. . . Control department

M. . . Mask

PL. . . Projection optical system

W. . . Wafer

WS. . . Wafer stage

Claims (19)

An illumination optical system that illuminates an illuminated surface according to light from a light source, the illumination optical system comprising: a spatial light modulator having: two-dimensionally arranged in an optical path of light from the light source and controlled individually The optical element is configured to condense light passing through the spatial light modulator to a predetermined surface of the optical path, and the optical integrator has a plurality of optical surfaces arranged in two dimensions on the predetermined surface. And causing the light from the concentrating optical system to form a pupil intensity distribution on the illumination pupil surface; and a control unit that controls the spatial light modulator to adjust the pupil intensity distribution to a desired distribution, and The light intensity distribution in each of the plurality of optical surfaces is adjusted to a desired distribution. The illumination optical system according to claim 1, wherein the plurality of optical surfaces are optically conjugate with the illuminated surface. The illumination optical system according to claim 1 or 2, further comprising: an illuminance distribution measuring unit that measures an illuminance distribution in the illuminated surface; and a pupil intensity distribution measuring unit that is Measuring, according to the measurement result of the illuminance distribution measuring unit and the measurement result of the pupil intensity distribution measuring unit, the plurality of the above-mentioned spatial light modulators; The posture of the optical element is controlled. The illumination optical system of claim 1 or 2, wherein the spatial light modulator comprises: a plurality of mirror elements arranged in two dimensions; and performing postures of the plurality of mirror elements The drive unit of the drive is controlled separately. The illumination optical system according to claim 4, wherein the driving unit changes a direction continuity or a dispersion of the plurality of mirror elements. The illumination optical system according to claim 1 or 2, wherein the illumination optical system is combined with a projection optical system that forms a surface that is optically conjugate with the illuminated surface, and the illumination aperture is It is located at a position optically conjugate with the aperture stop of the above-described projection optical system. The illumination optical system according to claim 1 or 2, wherein the pupil intensity distribution associated with a predetermined one point on the surface to be illuminated is the first pupil intensity distribution, and The other one-point pupil intensity distribution different from the predetermined one point on the illuminated surface is a second pupil intensity distribution, and the light intensity distribution formed in each of the plurality of unit wavefront division surfaces is Two or more light intensity distributions. The illumination optical system of claim 7, further comprising: a pupil intensity distribution measuring unit that measures a pupil intensity distribution associated with each point on the illuminated surface, The control unit controls an attitude of the plurality of optical elements of the spatial light modulator to cause a pupil intensity distribution associated with a predetermined one point on the illuminated surface measured by the pupil intensity distribution measuring unit As the first pupil intensity distribution, the pupil intensity distribution related to the other one point different from the predetermined one point on the illuminated surface measured by the pupil intensity distribution measuring unit is used as the second pupil intensity distributed. An illumination optical system that illuminates an illuminated surface according to light from a light source, the illumination optical system comprising: a spatial light modulator having: two-dimensionally arranged in an optical path of light from the light source and controlled individually The optical integrator includes: a plurality of optical surfaces that are two-dimensionally arranged on a predetermined surface of the optical path of the light from the light source; and a control unit that performs the plurality of optical elements of the spatial light modulator The control unit is configured to independently change the pupil intensity distribution associated with the first point on the illuminated surface and the pupil intensity distribution associated with the second point different from the first point, respectively The directions of the lights of the plurality of optical elements are changed, and the positions of the lights passing through the plurality of optical elements on the predetermined surface are changed. The illumination optical system according to claim 9, wherein the control unit is configured to: a light intensity distribution in a first region in which the first optical surface of the plurality of optical surfaces of the optical integrator is located The light intensity distribution in the second region where the second optical surface is located is different, and the light passing through the plurality of optical elements respectively reaches the predetermined surface The location is changed. An exposure apparatus comprising: the illumination optical system according to any one of claims 1 to 10, wherein the predetermined pattern is exposed on the photosensitive substrate. The exposure apparatus according to claim 11, comprising: a projection optical system, wherein an image of the predetermined pattern is formed on the photosensitive substrate. The exposure apparatus according to claim 12, wherein the illuminance distribution measuring unit measures an illuminance distribution in an image plane of the projection optical system, and the pupil intensity distribution measuring unit is based on the projection optical system Light, while measuring the pupil intensity distribution in the pupil plane of the above projection optical system. A component manufacturing method comprising: an exposing step of exposing the predetermined pattern to the photosensitive substrate using an exposure apparatus according to any one of claims 11 to 13; and a developing step for transferring The photosensitive substrate having the predetermined pattern is developed, and a mask layer having a shape corresponding to the predetermined pattern is formed on a surface of the photosensitive substrate; and a processing step is performed on the surface of the photosensitive substrate via the mask layer Processing. A control method for controlling a spatial light modulator, the above empty The inter-optical modulator is assembled to an illumination optical system that illuminates the illuminated surface according to light from the light source, and the spatial light modulator has a plurality of optical elements that are two-dimensionally arranged and individually controlled, and the control method includes: 1 adjusting step of adjusting a pupil intensity distribution formed in the illumination pupil to a desired distribution according to light from the spatial light modulator via the collecting optical system and the optical integrator, wherein the collecting optical system is The plane of the plurality of optical elements of the spatial light modulator forms a predetermined light intensity distribution on the surface on which the optical Fourier transform is formed, and the optical integrator has a plurality of unit waves arranged in two dimensions on the surface as the Fourier transform. The front split surface; and the second adjustment step adjust the light intensity distribution formed in each of the plurality of unit wavefront split surfaces to a desired distribution. The control method according to claim 15, wherein the first adjustment step and the second adjustment step are performed simultaneously. The control method according to the fifteenth or sixteenth aspect of the patent application, comprising: a first setting step of setting a pupil intensity distribution target associated with a predetermined one point on the illuminated surface, that is, a first target pupil intensity And a second setting step of setting a second target pupil intensity distribution, that is, the first target pupil intensity distribution, which is different from the predetermined one point on the illuminated surface; In the adjustment step, the pupil intensity distribution associated with the predetermined one point is used as the first target pupil intensity distribution, and the pupil intensity distribution associated with the other one point is used as the In the mode of the target pupil intensity distribution, the pupil intensity distribution formed in the illumination pupil is adjusted, and the light intensity distribution formed in each of the plurality of unit wavefront division planes is adjusted. The control method according to claim 17, comprising: a first distinguishing step of distinguishing the first target pupil intensity distribution according to the plurality of unit wavefront splitting surfaces; and calculating, by the first light intensity calculating step, respectively a light intensity at a position corresponding to the predetermined one point in the first target pupil pupil intensity distribution; and a second distinguishing step of distinguishing the second target pupil intensity distribution from the plurality of unit wavefront split surfaces; The second light intensity calculation step calculates the light intensity at the position corresponding to the other one point in the second target pupil intensity distribution, and the calculation step, based on the first and second light intensity calculation steps The calculated light intensity at the position corresponding to the above-mentioned predetermined one point and the other one point is calculated as the light intensity distribution to be formed on the plurality of unit wavefront dividing surfaces, respectively. An illumination optical system that illuminates an illuminated surface according to light from a light source, the illumination optical system comprising: a spatial light modulator having a plurality of optical elements that are two-dimensionally arranged and individually controlled; and a collecting optical system The light of the spatial light modulator forms a predetermined light intensity distribution on a surface on which the array surface of the plurality of optical elements of the spatial light modulator is optically Fourier transformed; An optical integrator having a plurality of unit wavefront split surfaces arranged in two dimensions on a surface of the above-described Fourier transform; and a control unit according to any one of claims 15 to 18 The above-mentioned spatial light modulator is controlled.