TWI320341B - Method for simulating parameters under which to dispense a paste and apparatus capable of simulating parameters under which to dispense a paste - Google Patents
Method for simulating parameters under which to dispense a paste and apparatus capable of simulating parameters under which to dispense a pasteInfo
- Publication number
- TWI320341B TWI320341B TW096118536A TW96118536A TWI320341B TW I320341 B TWI320341 B TW I320341B TW 096118536 A TW096118536 A TW 096118536A TW 96118536 A TW96118536 A TW 96118536A TW I320341 B TWI320341 B TW I320341B
- Authority
- TW
- Taiwan
- Prior art keywords
- dispense
- paste
- parameters under
- simulating parameters
- apparatus capable
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060047062A KR100696933B1 (en) | 2006-05-25 | 2006-05-25 | Apparatus and Method for dispensing simulation for a paste dispenser |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200804002A TW200804002A (en) | 2008-01-16 |
TWI320341B true TWI320341B (en) | 2010-02-11 |
Family
ID=38782741
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096118536A TWI320341B (en) | 2006-05-25 | 2007-05-24 | Method for simulating parameters under which to dispense a paste and apparatus capable of simulating parameters under which to dispense a paste |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2007313502A (en) |
KR (1) | KR100696933B1 (en) |
CN (1) | CN100524326C (en) |
TW (1) | TWI320341B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6365396B2 (en) * | 2015-05-08 | 2018-08-01 | トヨタ車体株式会社 | Sealer application requirement check device, sealer application requirement check program, and storage medium |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2535474B2 (en) * | 1987-08-27 | 1996-09-18 | 富士機械製造株式会社 | High-viscosity fluid coating device with trial-driving function |
JPH1125137A (en) * | 1997-07-01 | 1999-01-29 | Nippon Paint Co Ltd | Device and method for preparing sample for coated board, coated board sample and sample coated board and design-coated board produced based on the coated board sample |
JP3492190B2 (en) * | 1998-03-17 | 2004-02-03 | 株式会社 日立インダストリイズ | Paste application method and paste application machine |
JP2000153194A (en) * | 1999-01-01 | 2000-06-06 | Ricoh Co Ltd | Method and apparatus for forming resin structure and resin structure |
JP4151151B2 (en) * | 1999-04-06 | 2008-09-17 | 松下電器産業株式会社 | Paste coating apparatus and paste coating method for die bonding |
JP4277428B2 (en) * | 2000-07-18 | 2009-06-10 | パナソニック株式会社 | Bonding paste coating apparatus and coating method |
TWI224478B (en) * | 2002-08-20 | 2004-11-21 | Dainippon Screen Mfg | Coater and coating method |
KR20050082239A (en) * | 2004-02-18 | 2005-08-23 | 주식회사 탑 엔지니어링 | Method for controlling of paste dispenser |
JP2005329306A (en) * | 2004-05-19 | 2005-12-02 | Tokyo Electron Ltd | Coating film formation apparatus and coating film formation method |
JP4762596B2 (en) * | 2005-04-13 | 2011-08-31 | パナソニック株式会社 | Chip bonding apparatus and bonding method |
-
2006
- 2006-05-25 KR KR1020060047062A patent/KR100696933B1/en active IP Right Grant
-
2007
- 2007-05-16 JP JP2007129967A patent/JP2007313502A/en active Pending
- 2007-05-24 CN CNB2007101061549A patent/CN100524326C/en active Active
- 2007-05-24 TW TW096118536A patent/TWI320341B/en active
Also Published As
Publication number | Publication date |
---|---|
KR100696933B1 (en) | 2007-03-20 |
CN100524326C (en) | 2009-08-05 |
TW200804002A (en) | 2008-01-16 |
JP2007313502A (en) | 2007-12-06 |
CN101051330A (en) | 2007-10-10 |
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