TW498162B - Compliant probe apparatus - Google Patents

Abstract

A mechanically compliant probe for electrically connecting to contact pads on microelectronic devices. The probe can be used for burn-in of integrated circuits at the wafer level. Additional applications include probe cards for testing integrated circuits and sockets for flip-chips. One configuration of the probe includes a probe tip (81), which is held on an extension arm (82) projecting laterally from an elongated flat spring (83). The spring is supported above a substrate (89) by posts (85) such that the probe tip is free to move vertically in response to a contact force on the probe tip. Deflection of the probe tip is compliantly limited by bending and torsional flexure of the sheet spring. Mechanical compliance of the tip allows arrays of the probe to contact pads on integrated circuits where the pads are not precisely planar.

Description

498162 A7

V. Description of the invention (1) Cross-reference of related applications This application uses the same name as the "contact device" in the application under review. FIELD OF THE INVENTION (Please read the notes on the back before filling out this page) This invention relates to the aging test and testing of microelectronic components, especially the individual wafers and complete wafers used to connect electrical signals to Contact assembly for integrated circuits. BACKGROUND OF THE INVENTION Microelectronic components undergo a series of test procedures during manufacturing to verify functionality and reliability. The test procedure is known to include wafer probe testing, in which microelectronic device wafers are tested to determine the operation of each wafer before being cut from the wafer and packaged. A probe card consisting of a long cantilever wire is used to test one or more wafers at the wafer level. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economics Typical ‘Not all wafers on the wafer are operational during the circular probe test’ The result is a yield of less than 100% good device. The wafers are diced into individual wafers, and good wafers are assembled into packages. The packaged device is loaded inside the receptacle of the burn-in test board and at 125 ° C to 150 ° C. (: Electrical operation for a period of aging test time of 8 to 72 hours, to induce the failure of the defective device 'and accept the dynamic aging test. Acceleration of the aging test can cause early failure or early failure of the faulty mechanism, allowing such defective devices Before commercial use, it was screened out by functional electrical test. Full functional test is performed on the packaged device. The packaged device is tested at various speeds and classified at the highest operating speed. The test of the discrete packaged device also allows to avoid aging. Failure of any device during the test. The test of the aging test of the packaged device is performed by using the paper conditions that are particularly suitable for the aging test under 4 national standards (CNS) A4 (210 X 297 mm). 5. Description of the invention (2 ) And the speed test is achieved. The conventional manufacturing method is expensive and time-consuming, because the test requires separate sets of several long steps to repeatedly dispose of the test results of individual discrete devices, resulting in an increase in the total manufacturing time of the device by several weeks. The diced die undergoes aging test and test before it becomes a discrete device. Both cost and processing time can be obtained. The significant advantages of the surface, the additional cost and processing time savings that can be obtained by manufacturing the chip-size package on each device on the wafer before cutting the wafers into discrete devices. The semiconductor industry has made extensive efforts to develop crystals Effective methods for round-level packaging, burn-in testing, and testing: Obtain the advantages of greatly simplified and shortened microelectronic device manufacturing processes. In order to obtain these effects, it is necessary to set the burn-in and burn-out before the chip is cut from the wafer into individual devices Device for speed test wafer. It is known that the cantilever wire probe is not suitable for aging and speed measurement of the device on the wafer. ”@@ The wire probe is too long and the magic is almost impossible to contact all the devices on the wafer at the same time, such as the wafer All of the above devices are subjected to aging test. In addition, the long cantilever wire probe is not suitable for the functional test of high-speed devices, because the high self-propagation and interactive inductance of the long and thin parallel wires including the probe are high. The low manufacturing cost of probes is required for the practical application of wafer aging and test procedures. Wafer aging test and test, the probe must reliably contact the king pad on the device under test when it is placed on the uncut wafer. The probe that contacts the wafer must be available to each device on the device. The electrical contacts' here vary in height on the surface of the crystal. In addition, the probe must pass through any oxide layer on the surface of the contact liner and make reliable electrical contact on each liner. Various methods have been tried to provide cost-effective Effective and reliable device for detecting aging and testing of wafers but failed to complete the work. 297 mm) The paper size is suitable for the financial standard (CNS) A4 specification (2 $ 498162 A7 B7 V. Description of the invention (3) Various attempts have been made to provide small vertical compliance probes for pads that reliably contact various devices on a wafer. According to the invention suggested by David R. Robillard and Robert L. Michaels, US Patent No. 4,189,825, cantilever probes are provided for Test integrated circuit devices. In the first figure, the cantilever 26 supports the sharp tip 26 above the aluminum contact pad 24 of the wafer 23. The compliance member 25 is pressed downward to move the tip end 26 into the contact pad 24. The aluminum oxide layer on the gasket 24 is pierced by the sharp tip 26 and an electrical contact is made between the tip 26 and the aluminum metal of the gasket 24. The rigidity of small cantilever beams is usually not sufficient to apply the force to the tip for a sufficient time to penetrate the aluminum oxide layer on the contact pad without any external force application device to the cantilever beam. Cantilever beams made of glass, silicon, ceramic materials, and tungsten have been tried in a variety of configurations but have failed to provide probes for weathering tests with sufficient strength and flexibility. The flexible member probe shown in Figure 2A is described in "Flexible Contact Probes", IBM Technical Disclosure Bulletin, October 1972, p. 1513. The flexible dielectric film 32 includes a terminal 33 adapted to make electrical contact with the pad of the integrated circuit. The terminal 33 is connected by a flexible wire 34 of a contact pad 35 attached to the terminal 33 to test the electronic device. Probes made on flexible polyimide sheets are described in the Proceedings of the IEEE International Test Conference (1988) by Lesiei et al. The flexible sheet allows a limited amount of vertical movement to match the height variation of the wiring pads of the integrated circuit on the wafer under test. Membrane probes such as those described by Leslie et al. Provide attachment to integrated circuit wafers for high performance testing. However, the shape stability of the film is not sufficient to allow contact with all of the entire wafer during the aging test temperature cycle. The manufacture of the contact on a thin silicon dioxide film is shown in Figure 2B, such as Gienn. This paper size is applicable China National Standard (CNS) A4 specification (210 X 297 mm) < Please read the notes on the back before filling this page) * _ -------- Order ----------- | line < Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 6 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 --- ~ ____ B7____ V. Description of the Invention (4)

Leedy is described in US Patent No. 5,225,771. The shape stability of the silicon dioxide film 40 is better than that of polyimide, which slightly improves the shape and stability of the contact wafer of the service wafer during the aging test. The probe tip 41 is connected to a circuit track 45 through a through hole 44 passing through the film 40 hi. This circuit track is connected to an additional circuit layer 42 above the dielectric film 43. The limited vertical compliance of the test probes on the silicon dioxide film 40 allows the probe arrays to be reliably used for burn-in testing of devices on semiconductor wafers. The fabrication of a probe array for a burn-in test on a semiconductor wafer is described in U.S. Patent No. 4,585,991. For example, 3A and 3B 圊 show a top plan circle and a cross-sectional view, respectively. The probe 51 is a pyramid-shaped arm 54 attached to a semiconductor wafer substrate 52. The material 53 is removed from the semiconductor wafer 52 and the probe 51 is mechanically isolated. The probe in Figure 3A provides limited vertical movement, but does not allow any space on the substrate as the probe array required for dynamic burn-in testing to be connected to the wiring space required for testing electronic devices. A method of providing a flexible probe to a device contact pad involves using a flexible lead or post to attach the test circuit to the pad. The flexible probe shown by circle A is described in US Patent No. 5,977,787 to Gobina Das et al. Probe 60 is a curved beam, as outlined earlier in U.S. Patent No. 3,806,801 by Ronald Bove. The probe 60 is adapted to an aging test for a device on a wafer. The probe 60 is held by the guides 61 and 62, and the guide has a coefficient of expansion similar to that of the wafer under test. The upper end 63 of the probe is offset by a small distance 60 to provide the exact deflection pattern of the beam 60. Although Bezier beams are extremely suitable for testing individual integrated circuit wafers, they are too expensive to use in wafer burn-in tests that require thousands of contacts. Furthermore, the electrical performance of curved beam probes is limited because the paper size is fully compliant with Chinese National Standard (CNS) A4 (210 X 297 mm) ----------- — — — — — 1111111 ^ · 1111111 (Please read the precautions on the back before filling out this page) 498162 Printed by A7 B7, Consumer Cooperative of Intellectual Property Bureau, Ministry of Economic Affairs V. Description of Invention (5) Length required for curved beams. Another method of using flexible pillars is shown in Figure 4B, which is disclosed in

US Patent No. 5,513,430 to Arnold W. Yanof and William Dauksher. Fig. 4B shows a flexible probe in the form of a strut 66 which can be flexed in response to the addition of a probe tip 67. The post 66 is formed at an angle with respect to the base material 69, allowing it to bend vertically in response to the example from the mating contact pads plus tips 67. The strut 66 has a push-out 65 俾 from the tip end 67 of the bottom terminal 68 to assist in bending. Yet another method of using flexible wires and posts is shown in Section 4C 囷, disclosed in US Patent No. 5,878,486 to Benjamin N. Eldridge et al. The probe shown in FIG. 4C includes a probe tip 72 on a spring wire 71. The spring wire is bent into a specific shape and assisted in straightening. The wire 71 is bonded to the base material 74 by a conventional wire 73. The probe shown in Figure 4C requires a long spring length to achieve the contact force and compliance required for wafer aging tests. In addition, such probes using individual wires are too expensive for wafer burn-in tests that require thousands of probes per wafer. Yet another approach to providing a flexible probe involves using a flexible layer between the test head and the device to be tested. The terminal of the test head is therefore electrically connected to the matching contact level of the device. The electrical connector described in US Patent No. 3,795,037 by Willem Luttmer uses a flexible conductor embedded in the elastomer material to make an electrical connection between matched pairs of conductive land. The conductive land is pressed to contact the top and bottom surfaces of the electrical connector. . A variety of flexible conductor variations include beveled conductors, conductive fill polymers, plated struts, and other conductive devices that form a compliance interposer with an elastomer material. This paper size applies to Chinese national standards (CNS> A4 specification (210 X 297 public love) * ·. · --Η ---; -------------- Order ----- ---- Line < Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 498162 A7 ________B7_ _ 5. Description of the invention (6) The methods listed above and other attempts have not been successful Ground to provide high-performance probes, which allow economical aging and speed testing of microelectronic components on a wafer before the wafer is diced into individual wafers. SUMMARY OF THE INVENTION-According to the present invention, a small compliance probe is disclosed that includes a conductive tip disposed on a support surface in a manner that allows the tip on the probe to flexibly move relative to the support surface. The probe tip moves vertically in response to the force applied when the mating contact pad is biased toward the probe tip. The contact compliance of the probe allows electrical contact between the probe and the corresponding contact pad on the microelectronic component ', wherein the mechanical compliance can be adapted to the height change of the contact pad. The object of the present invention is to provide a method and device for making electrical contact with a contact pad of a microelectronic element on an uncut wafer, and subject the device to an aging test before the wafer is cut into chips. The compliance probe according to the present invention allows a reliable electrical connection to be made while all the contact pads are aligned on the wafer surface, so the microelectronic components on the wafer can be subjected to burn-in tests in a cost-effective manner. Another object of the present invention is to provide a clamping device for aging test of microelectronic components on an uncut wafer. The clamping device electrically connects the contact pads on each device to drive the circuit. The circuit is provided with an electric signal to the device during the high-temperature dynamic aging test as needed. The electrical signal is supplied to all wafers on the wafer at the same time. The mechanical compliance of the probes of the clamping device can be matched with changes in the contact pad height and probe tip height, so each probe tip remains in contact with and matches the contact pad during the entire aging test temperature cycle. Yet another object of the present invention is to provide an electric probe card with a permissible height ^ -------- t --------- ^ (Please read the precautions on the back before filling this page)

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 498162 A7 B7____ 5. Description of the Invention (7) Testing of unpackaged microelectronic components. A small compliance probe, as taught by this disclosure, is used to temporarily connect to the corresponding pad on the device, plus an electrical test signal to the device, and to measure the electrical signal from the device. The small size of the compliance probe allows high-speed electrical signals to be passed between devices without wastage due to excessive inductance or capacitance associated with the wire probes used in the prior art. Another object of the present invention is to provide an aging test, test, and Method and device for operating microelectronic components, where the electrical contacts on the components are arranged in the array area on the surface of the components. The small compliance probes taught in this disclosure are used to make reliable electrical connections with contacts on the device, where the contacts are arranged in the array area. Mechanical compliance allows each probe tip to maintain electrical contact with the mating contact on the device regardless of changes in the south of the contact at room temperature or over the component's operating temperature range. Another object of the present invention is to provide a small-sized receptacle for connecting an integrated circuit chip to a circuit for aging test, test and operation of the chip. The small contact size of each probe inside the receptacle allows the wafer to be mounted in the receptacle at high speed. The mechanical compliance of the probes as taught by this disclosure allows reliable electrical connections to rigid wafers with little or no packaging. The compliance probe according to the present invention allows the construction of small and economical receptacles for wafer size packages and flip-chips. The probes disclosed herein are a significant improvement over conventional cantilever probes because the probes disclosed herein provide a wider range of probe tip compliance motions for any given probe force and probe size. Conventional cantilever probes have a limited range of motion and are limited to the limit of elasticity that the probe material can achieve in response to a specified force. The maximum mechanical stress of the cantilever probe is concentrated on the surface of the bending point of the cantilever material. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 public love). 10 ^^ ------------- -^ --------- (Please read the precautions on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 498162 A7 -----— B7___ V. Description of Invention (8) . The invention provides a wider range of motion for a given spring material and probe force before it reaches the elastic limit of that material. 'The invention improves the manufacturing efficiency of microelectronic components by reliably providing testing and burn-in functions at the wafer level while reducing the size of the test clamping device. A mechanically compliant probe provides a larger range of motion compared to the probe size. This range of motion is important for contacting components with contact pads that are not substantially in the same plane. The compliance probe tip can be flexibly moved to match the height of the matching contact pad, while maintaining sufficient force on the probe tip on the contact pad to ensure reliable electrical contact during the period. These and other objects of the invention can be met by providing electrical probes that are mechanically compliant. The tip of the probe is arranged on an elongated strip of material. The strip of material receives support at both ends, and the probe tip is provided with a predetermined distance from the center line of the support member connecting the ends of the strip. The probe tip thus supported can move in compliance with the vertical direction by the torsional flexibility and bending flexibility of the thin strip. Φ The present invention provides reliable manufacturing of microelectronic components through the reliable testing and aging test functions at the wafer level while reducing the size of the test clamping device. Rate 0 Brief description of the diagram The novel features that are characteristic of the present invention are described in the accompanying The scope of patent application is attached. The invention itself and other features and advantages will be best understood by reference to the following detailed description and the accompanying drawings. In the drawings: FIG. 1 shows a cross-sectional view of a prior art cantilever probe. Figures 2A and 2B show cross-sectional views of prior art flexible membrane probes. This paper size applies to China National Standard (CNS) A4 specifications (210 X 297 public love) 11 II -----— — — — — — — — — — — I — ^ «— — — — I — II ( Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 498162 A7 ___B7______ V. Description of the Invention (9) Figures 3A and 3B show the probes manufactured on the silicon wafer by the prior art Figure 3A is a plan top view of the probe and Figure 3B is a cross-sectional view of the probe. Figures 4A to 4C show prior art flexible strut probes. Figure 5 shows a view of a compliance probe according to the invention. Fig. 6 shows a view of the configuration of another compliance probe according to the present invention. Figures 7A to 7C show a specific embodiment of a compliance probe, where Figure 7A is a top plan view, Figure 7B is a cross-sectional view of the probe when it is stationary, and Figure 7C is a probe when acting by force F Sectional view of the time. Fig. 8A shows a view of a specific embodiment of the flexible probe, in which the tip of the probe is acted by a direct vertical force F. Fig. 8B shows the deflection of the probe tip of Fig. 8A with changes in the force applied to the probe tip. Figures 9A to 9C show specific embodiments of the compliance probe. Here, Figure 9A is a top plan view, Figure 9B is a cross-sectional view of the probe when it is stationary, and Figure 9C is a view of the probe when force F is acting on it. Section 囷. Figure 10 shows the viewing circle of an embodiment of a compliance probe and its connection circuit. Figure 11 shows a view of a Zhao embodiment of a compliance probe with a ground plane. Figures 12A to 12C show a specific embodiment of the compliance probe with its circuit connection. Figure 12A is a top plan view, ub 囷 is a cross-sectional view of the probe when it is stationary, and Figure 12C is when the probe is subjected to The paper size of the section when the force ρ is applied is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -------- * -------- I! Order! --- I-- line (Please read the notes on the back before filling out this page) 498162 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (10). Figures 13A to 13C show top plan views of another design of a compliance probe according to the present invention. Figures 14A to 14D show top plan views of another design of a compliance probe according to the present invention. Figure 15A shows a contact probe for wafer level burn-in testing of components with area array contacts. > Fig. 15B shows a top plan view of a selected area of Fig. 15A for a contact probe of a component having an area array contact. Figure 16A shows a probe card for wafer level testing of components with area array contacts. Fig. 16B shows a top plan view of a selected area of Fig. 16A for a probe card with components contacting an area array. Figure ΠA shows a receptacle for operating microelectronic components with area array contacts. Figure 17B shows the top view 囷 of Figure 17A for a selected area of a receptacle with a device with area array contacts. Figures 18A to 18D show the probe tips for the compliance probe structure according to the present invention. Detailed description of the preferred embodiment According to the principle of the present invention, the first preferred embodiment of the compliance probe is shown in FIG. A probe is disclosed that allows reliable electrical connections to microelectronic components such as integrated circuits (1C), flip-chips, passive components, and contact pads on wafer-scale packages. Probe provides probe tip 81 response tip This paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) 13 — — — — — — — — — — — — — — — — — — — — — ^ · 1111111 (Please read the notes on the back before filling out this page) 498162 Printed by A7 B7, Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. The force on the invention description (11) moves vertically. In this way, when the contact liner is pressed to contact the probe tip 81, the mechanical compliance of the structure allows the tip and the matching contact pad to be sufficient to allow the probe tip 81 to penetrate the insulating oxide film on the pad. Make contact. The mechanical compliance of the probe can be matched to the contact area of the microelectronic component by a two-degree difference. At the same time, it provides sufficient force to the tip of each probe to ensure reliable electrical connection between the tip and the corresponding contact pad. Further, the mechanical compliance of the gasket is required to allow the tip to remain connected to the corresponding gasket during the test or burn-in test cycle, where thermal expansion causes the surface curvature of the element and probe support. In Fig. 5, the "probe tip 81 is supported on the laterally extending arm of the conductive material 82" and the arm is attached to the elongated flexible strip 83 of the conductive material. The elongated flexible strips 8 3 are supported at each end by pillars 8 5 which are joined to the terminals 84 of the elongated strips 8 3. The probe tip 81 is flexibly moved in response to a force applied to the tip 81 in the vertical direction. The vertical movement of the tip 81 compresses the arm 82 and twists and bends the strip 83 so as to exert a restoring force on the tip 81. In the compliance probe shown in FIG. 5, the pillar 81 is supported on the substrate 89 by a gasket 86. The gasket is electrically connected to the circuit track 87, and the circuit execution wire is connected to the substrate 87 by a through hole 88. Circuits, vias connect the surface circuits 87 to the various circuit layers of the substrate 89. Through the aforementioned series connection, the probe tip 8m is electrically connected to the circuit of the substrate 89, and the circuit operates the element connected to the probe. In essential applications such as aging tests, the substrate 89 is made of silicon or a low-expansion ceramic material. It achieves the stability of a wide temperature range used in aging tests. Here the temperature cycle is from 25 ° C to 150 ° C. Or higher. For high-frequency operation, the electrical connection setting from the probe 81 to the through-hole contact 88 This paper size is applicable to China National Standard (CNS) A4 size ⑵G χ297 public love> Factory 14 · --- (Please read the precautions on the back first (Fill in this page again) -I ί Order! -Line 1 498162

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5. Description of the Invention (I2) is used to minimize the inductance connected to the probe tip 81. The inductance loop is minimized by positioning the through hole 88 under the probe tip 81. Although the location of the through hole $$ is not always so ideal, for applications requiring high frequency operation, the distance between the tip 81 and the through hole 88 must be small. Fig. 6 shows a second embodiment of the compliance probe. Here, the conductive arm 82 of Fig. 5 is replaced by a curved or "V" shaped segment 92 of the elongated sheet 93 of Fig. 6. Terminals 94 at each end of the elongated sheet 93 are joined to the pillars 95, which in turn rest on the pads 96 of the substrate 99. The electrical connection system sheet 93 to the tip 91 is connected to the pad 94 bonded to the pillar 95, and the pillar 95 rests on the liner 96. The liner 96 utilizes the through-hole 98 through the circuit track 97 of the circuit connected to the substrate 99. To make electrical connections. As can be seen in Fig. 6, the probe tip 91 is supported by the curved portion 92 of the sheet 93, so the center of the probe tip 91 is located at a distance from the virtual line 100 between the pillars 95 at each end of the thin sheet 93. The initial vertical force on the probe tip 91 generates a torque with the axis indicated by the line 100 as an axis. The torsion causes twisting of the elongated sheet 93, resulting in a reaction force acting in a direction opposite to the force initially applied to the tip 91. Figure 7A shows a top plan view of the first embodiment of the pull probe of this type illustrated in Figure 6. The flexible slender strip 103 is composed of a metal plate. It is shaped to include a horizontal extension at the end of the strip 103! 〇2 和 于 条 103 each includes contact summary 104. The conductive material of the strip 103 is selected to have high drop strength and medium elongation in the event of a failure. It is suitable to use a metal selected from the group consisting of corrugated-copper alloy, nickel, copper, copper, molybdenum, chain-titanium, stainless steel and alloys thereof. A suitable metal is beryllium-copper alloy ASTM Specification B534, with a drop strength of 550 million pascals. The other paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) — — — — — — — — — — — — 1111111 ^ i — — — — — — (Please read the Note: Please fill in this page again) 15 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 498162 A7 B7___ V. Description of the invention (13) A suitable metal is titanium alloy Ti, 8, Al, 1 Mo, IV, with a drop strength of 910 hundred Wambaska. The probe tip 101 shown in FIG. 7 is supported on an extension arm 102, so the probe tip 101 will press the substrate 10 in the vertical direction in response to the vertical force F. The effects of the arm 102 and the probe tip 101 are shown in the cross-sections of Figures 7B and 7C. The force F applied to the probe tip 101 has a torque on the strip 103, which twists the strip and allows the arm 102 to be pressed toward the substrate 109. As shown in section 7C 第, the vertical movement of the probe tip 101 is caused by the good deflection and twisting of the strip 103. The probe tip 101 is a pyramid formed by etching indentation formed on the (100) silicon surface by a well-known method. The tip angle of 54.75 degrees is determined by the (111) crystallographic plane of silicon. The tip material is tungsten, forming a sharp, hard tip that can pierce the aluminum oxide layer on aluminum contact pads typically used in semiconductor integrated circuit components. Suitable materials for sharp and hard tips are selected from the group consisting of molybdenum, nickel alloys, hungry, Paliney 7, rhodium, baht, titanium, tungsten and their alloys. The sharp tip of the hard probe is converted into electrical contact by the repeated etching pits on silicon. It is well-known and thoroughly described in the public document of D.A. Kiewit in 1973, "Synthesis of Scientific Instruments" Vol. 44, No. 1741 -Page 1742. Kiewit explained that the probe tip was fabricated by silicon-reproducing the pits by depositing a butterfly-butterfly alloy inside the pit and then removing the stone matrix material to expose the pyramid. Kiewit forms a pyramidal etch pit on the silicon (100) surface by treating the surface with a boiling hydrate. The strip 103 is a contact pad 104 joined to each end of the strip 103 by the pillar 105. The paper size is translated to Chinese National Standard (CNS) A4 specifications ⑽X 297 public love y 16 — IJ-IIJI — — — — · I- IIIII ^ · 1111111 (Please read the notes on the back before filling in this page)

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It is supported above the base material 109. The pillar 105 is made of an electrodeposited material, and is preferably selected from the group consisting of hard copper, nickel, copper-nickel alloy, and hard gold. The electrical connection between the probe tip 101 and the circuit for testing the integrated circuit is conducted through the arm 102, the strip 103, the contact 104, the pillar 105, the contact pad 106, the conductor 107, and the through hole 108. Reached. The circuit system from the through-hole 108 to the probe 101 is configured to form as small a loop as possible, reducing inductance and allowing operation at the highest frequency or highest data rate. Figures 8A and 8B illustrate further details of the operation of the configuration of the preferred embodiment, in which the probe tip U1 is supported by a laterally extending arm 112 supported by an elongated strip material 113 held between two pillars 115. The force F is applied in the vertical direction to deflect δτ and press the tip 111. Figure 8B shows that the total deflection δτ of the tip 111 is the sum of the beam bending component δ0 and the twisting deflection component. Figure 8B shows the total deflection δτ (in micrometers) caused by the force (in grams) applied vertically to the probe tip 111. The strip 113 used in this study was made of 25 micron thick, 25 micron wide and 200 micron long. The arm 112 measures 100 micrometers in length from the midline of the strip 113 to the tip of the probe. A detailed view of the first embodiment of the compliance probe is shown in a top plan view of FIG. 9A. The probe tip 121 is supported on the “V” -shaped extension 122 of the elongated sheet 123. The extension 122 supports the tip 121 at one side of the virtual link line between the centers of the pillars 125 that support the ends of the elongated sheet 123. The extension portion 122 is thicker than the elongated sheet 123 to prevent distortion of the extension portion due to the applied force F. The probe tip 121 responds to the vertical force F applied to the tip 121 toward the basic paper size and applies the Chinese National Standard (CNS) A4 specification (210 x 297 mm). 17 — — — — — — — — — — — — · 1111111 > — — — — — — — (Please read the notes on the back before filling in this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 498162 A7 B7____ 5. Description of the invention (15) Material 129 is biased in the vertical direction . The deflections of the extension 122 and the probe tip 121 are shown in the cross-sectional views of FIGS. 9B and 9C. Example F, which is applied to the probe tip 121, shows torque on the strip 123, thus twisting the strip 123 and allowing the extension 122 to be pressed toward the substrate 129. As shown in the cross-sectional view of FIG. 9C, the vertical movement of the probe tip 121 is caused by the beam deflection and torsional bending of the elongated sheet 123. The sheet 123 is supported by the pillars 125 engaging the contact pads 124 at each end of the sheet 123 On the substrate 129. The pillar 125 is a rigid metal pillar. The electrical connection between the probe tip 121 and the test circuit is electrically connected by the conduction of the arm 122, the sheet 123, the contact pad 124, the post 125, the contact pad 126, the circuit track 127, and the through hole 128. The circuit configuration from the through-hole 128 to the probe 121 forms a loop as small as possible to reduce inductance and thus allows high electrical performance operation. Figures 10 and 11 show additional embodiments of the compliance probe, where the functions of the extension arm and the elongated sheet are combined into a structure. A third specific example is shown in FIG. 10, in which the probe tip 131 is disposed on the thin and elongated sheet 133, so that the center line of the probe tip 131 is located at a section of a virtual line between the centers of the pillars 135 connecting the ends of the sheet 133 Predetermined distance. The thin sheet I "I should be twisted and bent in response to the force applied by the vertical probe tip 131. The torsional torque is derived from the force applied from a distance from the centerline of the pillar 135. Torsional bending is relative to beam bending The amount is determined based on the deviation of the probe tip 131 from the centerline and the length of the strip 133. According to the size of the device under test and the material properties of the sheet 133, the offset is preferably 0 · 05 of the length of the sheet id The probe in Figure 10 includes a curved plate 133, which supports the center line of the pillar 135. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 18 (Please read the note on the back first) Please fill in this page for more information.) I!! Order ·!-Line 1 498162 Printed by A7 B7, Consumer Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs 5. Description of the invention (16) Probe tip 131. Probe tip 131 The electrical connection is connected to the contact terminal 134 via a strip 133. The terminal 134 is in turn connected to the post 135 resting on the contact pad 136, which is connected to the circuit track 137, and the circuit execution wire is connected to the via hole 138 Test circuit for substrate 139. Through hole 138 Located near the probe tip, the connection inductance between the test circuit and the probe tip 13 1 is minimized. A fourth specific example of a compliance probe incorporating a ground plane shield is shown in FIG. 11. The probe of FIG. 11 includes a bent plate. The position of the probe tip 141 is supported by the center line of the pillar 145. The electrical connection to the probe tip 141 is through the bent plate 143. To the contact pad 144. The contact pad 144 is in turn joined to the post 145 resting on the terminal 146, which is connected to the circuit execution wire 147, which is connected to the test circuit of the substrate 149 through the through hole 148. The stratum 140 is located under the probe tip 141 and the probe is electrically shielded to achieve higher performance. ^ The detailed diagram of the specific embodiment 3 is shown in Figs. 12A-12C. The top plan view shows the specific example 3 In a typical configuration, the tip 151 here is supported at the midpoint of the “V” flat flat sheet 153 of the spring material. "V" shape • The sheet 153 is supported by a middle end 154 provided at each end of the sheet. The flakes of this embodiment are made of titanium alloys Ti, A1 8, V4, but other high-strength or elastic materials are also effective. The thickness of the sheet 153 is 10 to 75 micrometers, and more preferably 20 to 50 micrometers. The narrowest section of each arm 153 has a width of 20 to 200 microns and more preferably a width of 35 to 75 microns. The centroids of the pillars 155 at the first end of the sheet 153 and the centroids of the pillars 155 at the second end of the sheet 153 are about 200 to 1500 microns long, and a better center-to-center line interval is 250 to 750 micrometers. China National Standard (CNS) A4 Specification (210 X 297 mm) 19 I --- I --- IIIII i — — — — — — ^ * — — — 1 — I (Please read the precautions on the back before (Fill in this page) A7 ---------- B7 V. Description of invention (Π) m. (Please read the precautions on the back before filling this page) Example 3 The response of the force F applied to the tip 151 of the probe is illustrated in Figures 12B and 12C. It is shown before and after the force F is applied. Sectional view of the needle. As shown in FIG. 12C, the force F on the probe tip 151 deflects the curved sheet 153 toward the base material 159 downward. The bending sheet 153 is bent and twisted by deflection. The twisting and bending deflection of the sheet 153 causes a reaction force, which is opposite to the further deflection direction when the tip 151 is subjected to the force F. The probe tip 151 is electrically connected by the sheet 153 supported by the sheet 153 contacting the sheet 153 and the contact pad 154. . The pillar 155 rests on the terminal 156 on the base material 159, where the terminal 156 is connected to the circuit execution wire 157. The circuit track 157 is a circuit bonded to the substrate 159 through the conductive via 158. Alternatively, the ground plane can be inserted between the probe tip 151 and the circuit of the substrate 159, and the shield tip 151 does not contact signals near the circuit execution line of the substrate 159. There are many variations of the design of the compliance probe's leaf springs to meet the testing needs of specific electronic components. Several designs are illustrated in Figures 13A to 13C. In each example, the position of the tip of the probe is offset from the axis determined by the virtual line between the centroids of the struts that support the plate spring at the first and second ends. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Figure 13A illustrates the design of a probe 160, where the probe tip 161 is supported by the apex of a "V" shaped segment 162 of a leaf spring 163. The segment 162 is set to face the end of the leaf spring 163 and let the leaf spring nest 俾 achieve a close distance between the probe tips. The pillars 165 and 167 are arranged in a staggered pattern, allowing the probes to be closely spaced. In contrast, the contact pads 164 and 166 at opposite ends of the leaf spring 163 are matched with the pillars 165 and 167, respectively. Figure 13B shows the design of the probe 170. Here, the probe tip 171 is 20 pieces. The paper size is applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm). 498162 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (18) The vertex of the "V" shaped segment 172 holding the leaf spring 173. The segment 173 is disposed toward the end of the leaf spring 173 to allow the spring nest to achieve a close interval between the ends of the probe tips. The pillars 175 and 177 are arranged in a staggered pattern to allow the probes to be closely spaced. In contrast, the contact bushes 174 and 176 at the two opposite ends of the leaf spring 173 match the pillars 175 and 177, respectively. Fig. 13C illustrates the design of the compliance probe 180, in which the probe tip 181 is supported at the vertex of the curved leaf spring 182. The crossbow leaf spring 182 is shaped to allow > a nest of springs to achieve close spacing between the probe tips. The probe tip 181 is offset from a center line formed by the center of the center of the terminal 184 provided at each end of the leaf spring 182 and the post 185. The asymmetric configuration of the compliance probes shown in Figures 14A-14D provides the capabilities required for specific testing and burn-in applications. The asymmetric configuration helps detect constrained spaces, corners, and contact pads with small pad spacing. Further, grounding allows the ground shield to be bonded to the probe structure. The compliance probe 190 shown in FIG. 14A uses a post 195 and an additional post | 197 to support the first end of the flat assembly 192. An additional strut 197 is used to stabilize the structure from lateral forces. The additional post 197 is also used to make electrical contact with the ground plane 199 of the combined and flat assembly 191. Post 197 is terminated to terminal 196 of ground plane 199. The flat assembly 192 is supported by a post 195 that is joined to the flat assembly 192 by a terminal 194. The flat assembly 192 supports the probe tip 191. The probe tip 191 is disposed on the flat assembly 192 at a position offset from the shaft 198 of the probe 190. The center axis is a virtual straight line connecting the rectangles of the pillars 195 and 197 at the first end of the supporting member 192 and the rectangles of the pillars 194 at the second end of the supporting member 192. Applicable to Chinese paper standard (CNS) A4 specification (210 X 297 mm) added to this paper size 21 111 — Qian — 111 — — — Zhao® IIII Snow I 1 t — — — — — — — (Please read the back first Note: Please fill in this page again) 498162 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (19) The force of the probe tip 191 forms a torque centered on the center axis 198, causing the component 192 to bend and To reverse. In FIG. 14B, the compliance probe 200 includes a leaf spring having a short arm 202 supported by the contact pad 206 and a long arm 203 supported by the contact pad 204. The leaf spring supports a probe tip 201 provided between the arms 202 and 203 at a position offset from the probe center line 208. The center line 208 is a virtual straight line connecting the centroid of the pillar 205 and the centroid of the pillar 207. Applying a force of 201 to the tip of the probe creates a torque centered on the centerline 208, causing the arms 202 and 203 to bend and twist. In FIG. 14C, the compliance probe 210 includes a leaf spring, a short arm 212 supported by the contact pad 216, and a long arm 213 supported by the contact pad 214. The leaf spring supports the probe tip 211, and the probe tip is disposed between the arms 212 and 213 at a distance from the center line 218 of the probe 210. The center line 218 is an imaginary line connecting the centroid of the support post 215 and the centroid of the support post 217. The force applied to the probe tip 211 creates a torque around the centerline 218, causing the arms 212 and 213 to bend and twist. The compliance probe 220 of FIG. 14D includes a leaf spring, a short arm 222 supported by the contact pad 226, and a long arm 223 supported by the contact pad 224. The leaf spring supports a probe tip 221, which is disposed between the arm 222 and the arm 223 at a position offset from the center line 228 of the probe 220. The center line 228 is a virtual straight line connecting the centroid of the pillar 225 and the centroid of the pillar 227. The force applied to the probe tip 221 forms a torque centered on the center line 228, causing the arms 222 and 223 to bend and twist, thereby generating a reaction force that limits the further deflection of the probe tip 221. Compliance in accordance with the teachings of the present invention Probes can be used for aging tests on wafers containing integrated circuits and other microelectronic devices. As shown in Figure 15A, the size of the crystal paper is applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm) 22 ·· ------- ΊΙ —--------— i— Order !! !! (Please read the precautions on the back before filling this page) 498162 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (20) The circular contactor 230 combines the probe 232 according to the specific example 3 on the silicon base 231 on the surface. Each probe 232 is connected to a terminal 233 of the contactor 230 through a circuit track 234 of the silicon substrate 231. In this example, silicon is used as the base material 231, and the coefficient of thermal expansion is provided, and this coefficient matches the thermal expansion coefficient of the silicon wafer containing the integrated circuit subjected to the aging test. During the burn-in test, the contactor 230 aligns the wafers to be tested, and then uses a mechanical clamping device to hold the probes of the contactor back against the matching contact pads of the wafer with a sufficient and reliable contact force. The pad is biased. In order to contact a standard aluminum gasket, 5-10 grams of force are required to ensure contact. The assembly is then heated to an aging test temperature, typically 125 ° C to 150 ° C. Electrical stimulation was applied to each integrated circuit to operate the circuit and complete the dynamic aging test. FIG. 15B shows a probe portion provided on the surface of the contactor 230. The probe tips are arranged in an area array that matches the array of areas on the contact pads on the flip-chip wafer to be tested. Each probe tip 241 is provided to match a corresponding contact pad on a flip chip. The dimensions of the probe 232 are compatible with the current grid spacing of 150 microns to 500 microns for flip chip. The probes 240 are arranged in a nest pattern, which allows each probe to fit the available space. Adding additional non-functional probes to the array and local areas with a lower average density of contact pads on the wafer support the wafer under test. The probe tip 241 of the probe 232 provides a hard surface for penetrating any oxide on the aluminum wafer under test wafer. The probe tip 241 is provided at the apex of a "V" shaped spring 242. The spring is supported by the posts 245, and the posts are connected to the contact pads 244 at each end of the spring 242. The compliance probe according to the teachings of the present invention provides a test for high-speed printing. The paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm). 23 ------------- Install! I order! I —— I-line < Please read the notes on the back before filling this page) 498162

The method of printing the body circuit by the employees' cooperatives of the Intellectual Property Bureau of the Ministry of Economics is due to the low self- and interactive inductance of each probe. The probe card 249 incorporating the compliance probe is shown in FIG. 16A. The area array pattern of the probe 240 not placed on the substrate 248 is suitable for flip chip testing with the area array contact pad. Each probe 24 is electrically connected to the probe card 249 terminal 247 by a circuit track device 246 coupled to a substrate 248. The substrate 248 preferably includes a shape-stable substrate such as alumina ceramic material, and copper circuit traces on the substrate. It is placed between the layers of polyimide dielectric material. FIG. 16B shows a compliance probe 240 array configured in accordance with the teachings of Specific Example 1. FIG. The probe tip 241 is provided at the end of an arm 243 attached to the midpoint of the elongated leaf spring 242. The support posts 245 are joined to the contact pads 244 at each end of the elongated leaf spring 242. The wafer holder shown in Figure 17A provides a removable device for testing, burn-in testing, and handling of flip-chip wafers. The flip-chip 261 is held by the positioning device 262, so each contact pad on the flip-chip 261 matches the corresponding probe 250 on the surface of the base substrate 58. Each of the probes 250 is electrically connected to a terminal 257 on the receptacle base 258 by a circuit track device 256. The flip-chip 261 suitable for operation is electrically guided by the electrical circuit device 264 to the receptacle via the interconnection device 263. The cable 265 connects the electronic circuit 264 to the flip chip 261 for aging test, test or inactive system. Figure 17B shows a portion of the compliance probe 240 array in the receptacle of Figure HA. The probe tip 251 is provided at the end of the arm 253, and the arm 253 is attached to the midpoint of the elongated leaf spring 252. The post 254 engages a contact pad 255 at the end of the elongated leaf spring 252. The probe tips shown in Figures 18A-18D are configured for testing and aging. This paper is sized for China National Standard (CNS) A4 (X 297 mm) 24 IJ 0, -------- ^- --- — 1! ^. (Please read the notes on the back before filling out this page) A7 B7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs

V. Description of the invention (22) Specific use of the test. These probe tips and others are well known in the integrated circuit industry, and the examples given here represent a variety of probe tip types available. The manufacturing method is well known to skilled persons in the electrical contact manufacturing industry. The probe tip shown in Figure 18A is preferably used to detect the aluminum wiring pad on the integrated circuit. Here, the sharp apex 273 is suitable for piercing the oxide layer on the aluminum wiring pad. The pyramid 272 reproduces the formation of etch pits on the (100) silicon surface. The pyramid 272 is supported on the leaf spring 271. The vertex 273 of the pyramid 272 is defined as an acute angle with an included angle between the two opposite faces of 54.75 degrees. A hard material is used for the probe tip 272. Here, the material is preferably selected from the group consisting of chain, tape, hungry, parini 7, hafnium, baht, titanium, crane and alloys thereof. When detecting soft contact, materials such as hunger, thorium, and tungsten are preferred because they react slowly to solder and other soft materials. The probe tip shown in Figure 18B is suitable for contacting precious metal contact pads. The thin disc 277 is supported on a metal post 276 provided on the leaf spring 275. The pillar 276 exposes the edge of the disc 277 by chemical etching. The thin disc 277 is made of an inert metal. The inert metal is preferably selected from the group consisting of gold, Parini 7, platinum, rhenium, and alloys thereof. The probe tip shown in Figure 18C is suitable for contact with solder and other soft materials. The rounded metal tip 281 is supported on a metal post 282, and the post is provided on a leaf spring 280. The rounded metal tip 281 can be formed by melting a high-temperature material with a rapid laser and then flowing into a spherical cross-sectional shape. Materials used for rounded metal tips 281 include nickel, platinum, rhodium, copper-nickel alloys, beryllium copper alloys, and Parini 70. Probe tips shown in Figure 18D are suitable for contacting small contact pads and tightly spaced This paper size applies to China National Standard (CNS) A4 specification (210 X 297 public love) 25 11! · I — — — — — — til —!! A (Please read the precautions on the back before filling this page) 5 The Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed a description of the invention (23). A probe tip 287 with a top edge 286 is disposed on the top surface of the leaf spring 285. The probe tip 287 is preferably formed by plating the edge of a protective material and then removing the material to leave a metal 287 edge. Although a number of preferred embodiments of the present invention have been described, those skilled in the art can make countless modifications to it and change the component numbers without departing from the spirit and scope of the present invention. 23 ... Wafer 24 ... Contact 25 ... Compliance member 26 ... Tip 28 ... Cantilever 32 ... Dielectric film 33 ... Terminal 34 ... Flexible wire 35 ... Contact pad 40 ... Silicon dioxide film 41 ... Probe tip 42 … Circuit 43 ·· Dielectric film 44 ·· Through hole 45 ·· Circuit wire 51… Probe 52… Semiconductor wafer 53 ·· Material 54 ·· Arm 60… Probe 61-2 ··· Guide 63 ··· Probe tip 65 ··· Pushing 66 ... Pillar 6 7 ... Probe tip 68 ··· Terminal 69 ··· Base material 71 ... Spring wire 72 ... Probe tip End 73 ... Wiring This paper size is applicable to China National Standard (CNS) A4 specification (21G x 297 public love) LI J .---: -------------- Order ----- ---- Line (Please read the precautions on the back before filling this page) 26 498162 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs V. Description of the invention (24) 74 .. Substrate 82 .. Conductive Material 8 4 ... terminal 86 ..... pad-88 ... through hole 91 .. .Probe tip 93 ... sheet, 95 ... pillar 97 ... circuit track 99..substrate 101 ... probe tip 103..long 105..pillar 107..conductor 109 .. Base material 112 ... Arm 115 ... Pillar surface 122 ... Extension 124 ... Contact pad 126 ... Contact pad 128 ... Through hole 131 ... Probe tip 134 ... Terminal 137 ... Circuit holder Line 81 ... probe tip 8 3 ... long strip 85 ... pillar 8 7 ... circuit track 89 ... substrate 92 ... bend portion 94 ... lining 96 ... lining 98 ... through hole 100 ... 102 ... arm 104 ... contact pad 106 ... contact pad 108 ... L 111 ... probe tip 113 ... long strip 121 ... probe tip 123 ... sheet 125 ... Pillar 12 7… Circuit track 129… Substrate 133… Sheet 135 ··. Pillar 138 ··. Through hole 1IIIIIIII1II1 · 1 IIIIII · 1111111 · (Please read the precautions on the back before filling this page) This paper Standards are applicable to China National Standard (CNS) A4 specifications (210 X 297 mm) 27 498162 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (25) 139.... 144 ... contact pads 147 ... circuit implementation 149 ... substrate 153 ... sheet 155 ... pillar 15 7 ... circuit track 159 ... substrate 161 ... probe tip 163 ... leaf spring 165 ... pillar 167 ... pillar 171 ... probe tip 173 ... leaf spring 175 .... pillar 177 .... pillar 181 ... probe tip 184 ... terminal 190 ... compliance probe 192 ... flat member 196 ... terminal 198 ... Bottom axis 200 .. Compliance probe 140 .. Ground layer 143 .. Bent piece 145 .. Pillar 148 .. Through hole 151 .. Tip end 154 .. Contact pad 156 .. Terminal 158..through hole 160..probe 162..bent segment 164..contact pad 166 ... contact pad 170 ... probe 172 ... beginning of segment 174..contact Gasket 176 .. Contact gasket 180 ... Compliance probe 182 ... Curved leaf spring 185 ... Pillar 191 ... Probe tip 194-5 ... Pillar 197 ... Pillar 199 ... Ground plane 201 ... Probe Needle tip end (Please read the precautions on the back before filling this page) This paper size applies to Chinese National Standard (CNS) A4 (210 X 297 mm) 28 498162 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Description of the invention (26) 202 ... The short arm 204 ... the contact pad 206 ... Touch pad 208 ... Center line 211 ... Probe tip 213 ... Long arm 215 ... Pillar> 217 ... Pillar 220 ... Compliance probe 222 ... Short arm 224 ... contact pad 226… contact pads 228 .. center line 231 ... silicon substrate 233 .. terminal & 240 ... probe 242 ... spring 244. contact pads 246 .. circuit track assembly 248 .. Base material 250 .. Probe 252 ... Leaf spring 254 .. Pillar 256 .. Circuit holding device 203 ... Long arm 205 .. Pillar 207 .. Pillar 210 .. Compliance probe Needle 212 ... Short arm 214 ... Contact pad 216 ... Contact pad 218 ... Center line 221 ... Probe tip 223 ... Long arm 225 ... Post 227 ... Post 230 .. Contactor 232 ... Probe 234 ... Circuit Track 241 ... Probe Tip 243 ... Arm 245 ... Pillar 247 ... Terminal 249 ... Probe Card 251 ... Probe Tip 253 ... Arm 255 ... Contact pad 257 ... Terminal -----------I-fit ...! 1 order-! I-line (please read the precautions on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) 29 498162 A7 B7 V. Description of the invention (27) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 258 ... Receptor base 261 ... Flip chip 262 ... Positioning device 263 ... Interconnecting device 264 ... Circuit device 265 ... Cable 271 ... Leaf spring 272 ... Tip 273 ... Vertex 275 ... Leaf spring 276 ... Pillar 277 ... Plate 280 ... Plate sauce 281 ... Tip 282 ... Pillar 285 ... Plate spring 286 ... Top grade 287 ... Probe tip (please read the precautions on the back before filling this page) This paper size applies to Chinese national standard (CNS > A4 specification (210 X 297 mm) 30

Claims (1)

498162 Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A8 Βδ C8 D8 VI. Patent application scope 1. A probe for electrical connection with the contact pad of a microelectronic device, the probe contains: (a) — conductive material The sheet is attached with a top surface and a bottom surface; (b) — the substrate is attached with a top surface and a bottom surface; (e) an electrical terminal is provided on the top surface of the substrate; (d) conductive pillars are each connected to the sheet at one end The bottom surface is connected to one of the electrical terminals on the top surface of the substrate at the other end, so the sheet is supported at a distance higher than the top surface of the substrate; (e) — a base is attached to the conductive tip end and is set on the top surface of the sheet And the top surface is higher than the top surface of the sheet, so that the top surface of the conductive tip is suitable for electrical connection to the contact pad; (f) wherein the conductive tip is disposed on the sheet at a certain distance from the virtual line passing through the pillars, The tip end is moved in the vertical direction by twisting and bending the sheet. 2. The probe of claim 1 in which the sheet is a substantially flat metal foil having a longest dimension of i 50 to 1500 microns and a thickness of 10 to 75 microns. 3. The probe according to item 1 of the scope of patent application, wherein the sheet is a metal thin film, and its thickness is the largest under the probe tip. 4. The probe according to item 1 of the scope of patent application, wherein the conductive material is a metal selected from the group consisting of Shao, Zhen, Ni, Lu, Titanium, Wrinkled-Copper, stainless steel and alloys thereof. 5. The probe according to item 1 of the scope of patent application, wherein the top surface of the conductive tip end is selected from a group consisting of tungsten, titanium alloy, rhodium, baht, e, and Palinet 7 (please read the precautions on the back first) Fill in again Binding Book Paper Scale Coffee Towel® Standard (CNS) A4 Specification (210X297mm) 31 Patent Application Range Nickel A8 B8 C8 D8 Chromium and alloys of these materials made of hard metal _ Economic Department % Member of Intellectual Property Bureau X Consumer Cooperative prints the probe of item 1 of the “Patent Application” month, which further includes a circuit pattern located below the conductive tip and electrically connected to a thin strip. The probe, wherein the tip includes a reproduction of a pyramid-shaped pit engraved on the surface of the single crystal hair. 8. The probe of the scope of patent application item No.!, Wherein the tip includes a thin metal projection plated on a thinner surface than a thin film. High substantially vertical edge. 9. The probe of the first scope of the patent application, wherein the tip includes a metal spherical cross section. 10. The probe of the scope of the patent application, wherein the tip includes a hard metal film. The pillar is supported. The pillar has been etched so that the hard metal film is recessed to expose the bottom surface of the hard metal film. U · For example, the probe in the scope of patent application No. 1, wherein the pillar is an electric metal pillar. U For example, the probe in the scope of the patent application, further comprising an elastic dielectric material disposed between the thin sheet of the conductive material and the top surface of the substrate. 13. For the probe in the scope of the patent application, the elastic dielectric material It is selected from the group consisting of polylithium oxygen, fluoropolylithium oxygen, carbon fluoride and urethane elastomer. 14. A probe for electrically connecting a contact pad on a microelectronic device The probe contains: (a)-a thin and long strip of conductive material with a top surface and a surface; (please read the precautions on the back before filling this page) gutter bottom 32 A8 B8 C8 ________ D8 VI. Application The scope of the patent (b) supports a first end and a second end of the strip; (c) a conductive tip end is attached with a base system arranged on the top surface of the strip, wherein the tip end is raised beyond the top of the elongated strip (D) wherein the conductive tip end is disposed at a distance from the first end of the conductive strip and a second end of the conductive strip, and is also disposed at the center of the support member connected to the first end as far as the first The virtual line at the center of the support at both ends is a certain distance; (e) In this way, the conductive tip end moves in the vertical direction by the crossbow slender strip. 15. If the probe of the scope of patent application No. 14, wherein the long crossbow includes connecting the center of the first end to the second end The virtual line in the center of the support is the center twisted curved strip. 16. The probe of item 14 in the scope of the patent application, wherein the thin strip includes a conductive sheet, a metal film, and a film of a dielectric material disposed therebetween, here The metal thin film is connected to the ground circuit. 17. The probe according to item 14 of the patent application scope, wherein the thin strip includes a flat metal piece, and the metal piece is rounded so that the pattern is curved in a parallel long direction. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 18. If the probe of the scope of application for patent No. 14, the first support member includes a first metal pillar and the second support member includes a second metal pillar 〇19. A Each receptacle of a microelectronic device is operated. Each receptacle has a substantially flat surface and an array of contact pads is arranged on the receptacle. The receptacle includes: (a) — the substrate has a top surface and a bottom surface; Standard (CNS) A4 (210X297 mm) 33 498162 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A8 B8 C8 D8 VI. Patent application scope (b) Multiple flexible probes are used to make electrical connection with contact pads Wherein the net probe is arranged in an array on the top surface of the substrate; U) the circuit device is connected to the flexible probe, thereby the microelectronic device can be actuated when the flexible probe is connected to the contact pad; (d ) Each of the flexible probes includes an elongated strip of conductive material with a first end and a second end, where the strip is supported by at least one pillar at the first end and at least one pillar at the second end. And 0) wherein the probe tip is set at a distance from the first end and the second end, so the probe tip is set at a virtual line connecting the center of gravity of the first end pillar to the center of the second end pillar distance. 20. The receptacle of claim 19, wherein the contact pad array is a regular area array of contact pads. 21. The receptacle of claim 19, wherein the contact pad array is a linear array of contact pads. 22. The receptacle according to item 19 of the scope of patent application, wherein the substrate is made of silicon material. 23. The receptacle of claim 20, wherein the microelectronic device is a plurality of integrated circuits arranged on an uncut silicon wafer. 24. The receptacle of claim 20, wherein the silicon material is a silicon wafer having a thickness of 200 micrometers to 1000 micrometers. 25. The receptacle of claim 19, wherein the substrate is made of a ceramic material. 26. For example, the holder of the scope of application for patent No. 25, wherein the substrate is a metal-ceramic multilayer structure, whereby each probe is connected to a microelectronic device. The paper size is applicable to China National Standard (CNS) A4 specifications. (21 Ox297 mm) I Pack-II order II line (please read the precautions on the back before filling this page) -34 8 8 8 8 ABCD Printed by the Employee Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 498162 6. Scope of Patent Application To test and aging test circuit devices. 27. The receptacle according to item 19 of the scope of patent application, further comprising a region where a ground electrode is integrated into the top surface of the substrate substantially below the thin strip. This paper size applies to China National Standard (CNS) A4 (210X297 mm) (Please read the precautions on the back before filling this page) 35