TW201641397A - Electronic component transport device and electronic component inspection device - Google Patents
Electronic component transport device and electronic component inspection device Download PDFInfo
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- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G37/00—Combinations of mechanical conveyors of the same kind, or of different kinds, of interest apart from their application in particular machines or use in particular manufacturing processes
- B65G37/02—Flow-sheets for conveyor combinations in warehouses, magazines or workshops
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/06009—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code with optically detectable marking
- G06K19/06018—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code with optically detectable marking one-dimensional coding
- G06K19/06028—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code with optically detectable marking one-dimensional coding using bar codes
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
- G06K7/14—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation using light without selection of wavelength, e.g. sensing reflected white light
- G06K7/1404—Methods for optical code recognition
- G06K7/1408—Methods for optical code recognition the method being specifically adapted for the type of code
- G06K7/1413—1D bar codes
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
- G06K7/14—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation using light without selection of wavelength, e.g. sensing reflected white light
- G06K7/1404—Methods for optical code recognition
- G06K7/1408—Methods for optical code recognition the method being specifically adapted for the type of code
- G06K7/1417—2D bar codes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
- B65G2203/02—Control or detection
- B65G2203/0208—Control or detection relating to the transported articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
- B65G2203/02—Control or detection
- B65G2203/0208—Control or detection relating to the transported articles
- B65G2203/0216—Codes or marks on the article
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
- B65G2203/04—Detection means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2812/00—Indexing codes relating to the kind or type of conveyors
- B65G2812/02—Belt or chain conveyors
- B65G2812/02128—Belt conveyors
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Abstract
Description
本發明係關於一種電子零件搬送裝置及電子零件檢查裝置。 The present invention relates to an electronic component conveying device and an electronic component inspection device.
先前,使用有對各種裝置供給及卸除電子零件之電子零件搬送裝置。該電子零件搬送裝置亦稱為IC(Integrated Circuit,積體電路)處理機。移動收納於托盤中之電子零件之IC處理機係揭示於專利文獻1中。藉此,IC處理機將電子零件自托盤供給至進行檢查之測試頭(test head),並將檢查結束之電子零件收納於托盤中。於未檢查托盤收納部中重疊有複數個呈矩陣狀地載置有未檢查之電子零件之托盤。然後,零件取出部自托盤移動電子零件,零件供給部將電子零件供給至測試頭。 Previously, an electronic component transport apparatus that supplies and removes electronic components to various devices has been used. This electronic component transfer device is also referred to as an IC (Integrated Circuit) processor. An IC processing machine that moves electronic components housed in a tray is disclosed in Patent Document 1. Thereby, the IC processor supplies the electronic component from the tray to the test head for inspection, and stores the electronic component that has been inspected in the tray. A plurality of trays in which unchecked electronic components are placed in a matrix are stacked in the unchecked tray storage portion. Then, the part take-out unit moves the electronic parts from the tray, and the parts supply unit supplies the electronic parts to the test head.
托盤移送部將移動電子零件後之空托盤移動至空托盤收納部、良零件托盤收納部、不良托盤收納部。該未檢查托盤收納部、空托盤收納部、良零件托盤收納部、及不良托盤收納部係沿直線上而配置。而且,托盤移送部可藉由沿在1個方向上延伸之軌道構件進行移動而將托盤移動至各托盤收納部。 The tray transfer unit moves the empty tray after moving the electronic component to the empty tray storage unit, the good component tray storage unit, and the defective tray storage unit. The unchecked tray storage unit, the empty tray storage unit, the good component tray storage unit, and the defective tray storage unit are arranged along a straight line. Further, the tray transfer unit can move the tray to each of the tray storage portions by moving along the rail members extending in one direction.
[專利文獻1]日本專利特開2010-151589號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-151589
專利文獻1所示之先前之IC處理機不具備辨識IC、CIS(Contact Image Sensor,接觸式圖像感測器)等電子零件之識別編號之功能。因此,存在即便錯誤之電子零件進入IC處理機亦保持該狀態搬送至檢查裝置中,並接受檢查之情形,而無法獲得正常之檢查結果。因此,本案發明提供一種藉由辨識各IC之識別編號而可使錯誤之電子零件不流動的電子零件搬送裝置。 The conventional IC processor shown in Patent Document 1 does not have the function of identifying the identification number of an electronic component such as an IC or a CIS (Contact Image Sensor). Therefore, even if an erroneous electronic component enters the IC processor and is transported to the inspection apparatus in this state and is inspected, the normal inspection result cannot be obtained. Therefore, the present invention provides an electronic component transport apparatus that can prevent an erroneous electronic component from flowing by recognizing the identification number of each IC.
本發明係為了解決上述課題而完成者,可作為以下形態或應用例而實現。 The present invention has been made in order to solve the above problems, and can be realized as the following aspects or application examples.
本應用例之電子零件搬送裝置之特徵在於包括:識別資訊檢測部,其檢測顯示於電子零件之識別資訊;個體識別部,其使用上述識別資訊而進行上述電子零件之個體識別;及搬送機構,其可將上述電子零件搬送至特定場所。 The electronic component transport apparatus according to the application example includes: an identification information detecting unit that detects identification information displayed on the electronic component; and an individual identification unit that performs the individual identification of the electronic component using the identification information; and a transport mechanism. It can transport the above electronic parts to a specific place.
根據本應用例,於電子零件上設置有識別資訊,且識別資訊檢測部檢測識別資訊。然後,個體識別部根據識別資訊檢測電子零件之識別資訊。然後,搬送機構將電子零件搬送至特定場所。因此,電子零件搬送裝置可辨識電子零件之識別資訊。其結果為可使電子零件搬送裝置不會將錯誤之電子零件搬送至特定場所。 According to this application example, the identification information is provided on the electronic component, and the identification information detecting unit detects the identification information. Then, the individual identification unit detects the identification information of the electronic component based on the identification information. Then, the transport mechanism transports the electronic components to a specific location. Therefore, the electronic component transport device can recognize the identification information of the electronic component. As a result, the electronic component transport apparatus can transport the erroneous electronic components to a specific location.
如上述應用例之電子零件搬送裝置,其特徵在於包括:容器,其可於第1方向及與上述第1方向交叉之第2方向上載置複數個上述電子零件;第1移動部,其使上述容器沿上述第1方向移動;及第2移動部,其使上述識別資訊檢測部沿上述第2方向移動。 The electronic component conveying apparatus according to the application example of the invention, further comprising: a container that mounts the plurality of electronic components in a first direction and a second direction intersecting the first direction; and the first moving unit The container moves in the first direction; and the second moving unit moves the identification information detecting unit in the second direction.
根據本應用例,於容器中載置電子零件,該容器係設置於電子零件搬送裝置中。於容器中可在第1方向及與第1方向交叉之第2方向 上載置複數個電子零件。電子零件搬送裝置包括第1移動部及第2移動部。第1移動部沿第1方向移動容器。第2移動部沿與第1方向交叉之第2方向移動識別資訊檢測部。因此,藉由驅動第1移動部與第2移動部而電子零件搬送裝置可使電子零件與識別資訊檢測部二維地進行相對移動。因此,即便於電子零件呈複數行地載置於容器中時電子零件搬送裝置亦可辨識各電子零件之識別資訊。其結果為,可辨識所有設置於容器中之電子零件之識別資訊。 According to this application example, an electronic component is placed in a container, and the container is provided in the electronic component conveying device. In the container, the first direction and the second direction intersecting the first direction Upload multiple electronic parts. The electronic component conveying device includes a first moving portion and a second moving portion. The first moving unit moves the container in the first direction. The second moving unit moves the identification information detecting unit in the second direction intersecting the first direction. Therefore, by driving the first moving portion and the second moving portion, the electronic component conveying device can relatively move the electronic component and the identification information detecting portion in two dimensions. Therefore, the electronic component conveying device can recognize the identification information of each electronic component even when the electronic component is placed in the container in a plurality of rows. As a result, identification information of all electronic components disposed in the container can be identified.
如上述應用例之電子零件搬送裝置,其特徵在於基於由上述個體識別部獲得之識別結果,而進行將上述電子零件搬送至上述特定場所、或不進行搬送之切換。 In the electronic component transport apparatus according to the application example described above, the electronic component is transported to the specific location or the transport is not performed based on the recognition result obtained by the individual identification unit.
根據本應用例,個體識別部進行電子零件之個體識別,然後,基於所得之識別結果,於對電子零件實施特定處理時使搬送機構將電子零件搬送至上述特定場所。於未對電子零件進行特定之處理時,不搬送電子零件。因此,可確實地使電子零件搬送裝置不會對錯誤之電子零件進行特定之處理並使其流動。 According to this application example, the individual identification unit performs individual identification of the electronic component, and then, based on the obtained recognition result, causes the transport mechanism to transport the electronic component to the specific location when performing specific processing on the electronic component. Electronic parts are not transported when specific processing is not performed on electronic parts. Therefore, it is possible to surely prevent the electronic component transfer device from performing specific processing on the erroneous electronic component and flowing it.
如上述應用例之電子零件搬送裝置,其特徵在於上述第2移動部能夠在與使上述識別資訊檢測部移動之時序不同之時序使上述容器沿上述第2方向移動。 In the electronic component transport apparatus according to the above aspect of the invention, the second moving unit is configured to move the container in the second direction at a timing different from a timing at which the identification information detecting unit moves.
根據本應用例,電子零件搬送裝置包括第2移動部。第2移動部沿第2方向移動容器。藉此,可自第1移動部卸除容器。而且,第2移動部使容器與識別資訊檢測部以不同時序進行移動。因此,與設置用以移動容器之部位與用以移動識別資訊檢測部之部位之2個部位時相比可設為簡單之構造。其結果為,可生產性良好地製造電子零件搬送裝置。 According to this application example, the electronic component conveying device includes the second moving portion. The second moving unit moves the container in the second direction. Thereby, the container can be removed from the first moving portion. Further, the second moving unit moves the container and the identification information detecting unit at different timings. Therefore, it is possible to have a simple structure as compared with the case where the portion for moving the container and the portion for moving the identification information detecting portion are provided. As a result, the electronic component conveying apparatus can be manufactured with good productivity.
如上述應用例之電子零件搬送裝置,其特徵在於包括資訊輸出部,該資訊輸出部輸出上述個體識別之結果。 An electronic component transport apparatus according to the above application example is characterized by comprising an information output unit that outputs the result of the individual identification.
根據本應用例,資訊輸出部輸出個體識別之結果。因此,可活用電子零件之識別資訊。 According to this application example, the information output unit outputs the result of the individual identification. Therefore, the identification information of the electronic parts can be utilized.
如上述應用例之電子零件搬送裝置,其特徵在於上述資訊輸出部包括顯示上述個體識別之結果之資訊顯示部。 An electronic component transporting apparatus according to the above aspect of the invention is characterized in that the information output unit includes an information display unit that displays a result of the individual identification.
根據本應用例,資訊顯示部顯示個體識別之結果。因此,操作者可確認電子零件之識別資訊並進行與識別資訊之顯示相應之應對。 According to this application example, the information display unit displays the result of the individual identification. Therefore, the operator can confirm the identification information of the electronic component and respond to the display of the identification information.
如上述應用例之電子零件搬送裝置,其特徵在於上述資訊輸出部包括將上述個體識別之結果作為信號而輸出之輸出介面。 An electronic component transport apparatus according to the above aspect of the invention is characterized in that the information output unit includes an output interface that outputs a result of the individual recognition as a signal.
根據本應用例,輸出介面將個體識別之結果作為信號而輸出。因此,輸入信號之機器可確認電子零件之個體識別之結果並進行與識別資訊相應之應對。 According to this application example, the output interface outputs the result of the individual recognition as a signal. Therefore, the machine that inputs the signal can confirm the result of the individual identification of the electronic component and respond to the identification information.
本應用例之電子零件搬送裝置之特徵在於包括:圖像攝像部,其將電子零件上顯示之識別資訊拍攝為圖像;資料轉換部,其將藉由上述圖像攝像部所拍攝之上述識別資訊轉換為圖像資料;及個體識別部,其使用藉由上述資料轉換部轉換之圖像資料進行上述電子零件之個體識別。 The electronic component transport apparatus according to the application example of the present invention includes an image capturing unit that captures an identification information displayed on an electronic component as an image, and a data conversion unit that recognizes the image captured by the image capturing unit. The information is converted into image data; and the individual identification unit performs individual identification of the electronic component by using the image data converted by the data conversion unit.
根據本應用例,圖像攝像部拍攝顯示於電子零件之識別資訊作為圖像。其次,資料轉換部對藉由圖像攝像部拍攝之識別資訊進行資料轉換。繼而,個體識別部使用藉由資料轉換部轉換之資料進行電子零件之個體識別。因此,電子零件搬送裝置可辨識電子零件之識別資 訊。其結果為,可使電子零件搬送裝置不會對錯誤之電子零件進行特定之處理並使其流動。 According to this application example, the image capturing unit captures the identification information displayed on the electronic component as an image. Next, the data conversion unit performs data conversion on the identification information captured by the image capturing unit. Then, the individual identification unit performs individual identification of the electronic component using the material converted by the data conversion unit. Therefore, the electronic component transport device can recognize the identification of electronic components. News. As a result, the electronic component conveying device can prevent the erroneous electronic component from being specifically processed and flowing.
如上述應用例之電子零件搬送裝置,其特徵在於上述識別資訊包含文字,且上述個體識別部具有將上述圖像資料辨識為文字之文字辨識功能。 In the electronic component transport apparatus according to the application example described above, the identification information includes a character, and the individual recognition unit has a character recognition function for recognizing the image data as a character.
根據本應用例,個體識別部具有文字辨識功能。因此,於識別資訊包含文字時個體識別部可辨識文字之圖像資料為文字。 According to this application example, the individual identification unit has a character recognition function. Therefore, when the identification information includes a character, the individual identification unit can recognize the image data of the character as a text.
如上述應用例之電子零件搬送裝置,其特徵在於上述識別資訊包含條碼,且上述識別資訊檢測部包括讀取上述條碼之條碼讀取器。 An electronic component transporting apparatus according to the above aspect of the invention is characterized in that the identification information includes a barcode, and the identification information detecting section includes a barcode reader that reads the barcode.
根據本應用例,識別資訊檢測部包括條碼讀取器。再者,由條碼讀取器檢測之條碼包含一維條碼與二維條碼。因此,即便於識別資訊包含條碼時亦可容易地根據識別資訊讀取成為個體識別之資訊。 According to this application example, the identification information detecting section includes a bar code reader. Furthermore, the barcode detected by the barcode reader includes a one-dimensional barcode and a two-dimensional barcode. Therefore, even when the identification information includes the barcode, the information that becomes the individual identification can be easily read based on the identification information.
如上述應用例之電子零件搬送裝置,其特徵在於包括:資訊輸入部,其輸入與上述識別資訊進行比較之比較資訊;及警報輸出部,其於上述比較資訊與上述識別資訊不同時輸出警報資訊。 An electronic component transporting apparatus according to the above aspect of the invention, comprising: an information input unit that inputs comparison information that is compared with the identification information; and an alarm output unit that outputs an alarm information when the comparison information is different from the identification information .
根據本應用例,於資訊輸入部中輸入比較資訊。然後,個體識別部進行個體識別。資訊比較部對比較資訊與識別資訊進行比較,並於不同時輸出警報資訊。因此,於電子零件搬送裝置處理之預定電子零件與設置之電子零件不同時可進行與該狀況相應之應對。 According to this application example, comparison information is input in the information input unit. Then, the individual identification unit performs individual identification. The information comparison department compares the comparison information with the identification information and outputs the alarm information at different times. Therefore, when the predetermined electronic component processed by the electronic component conveying device is different from the installed electronic component, the corresponding situation can be dealt with.
本應用例之電子零件檢查裝置之特徵在於包括:識別資訊檢測部,其檢測電子零件上顯示之識別資訊;個體識別部,其使用上述識別資訊而進行上述電子零件之個體識別;檢查部,其檢查上述電子零 件;及搬送機構,其將上述電子零件搬送至上述檢查部。 The electronic component inspection apparatus according to the application example includes: an identification information detecting unit that detects identification information displayed on the electronic component; and an individual identification unit that performs individual identification of the electronic component using the identification information; and an inspection unit. Check the above electronic zero And a transport mechanism that transports the electronic component to the inspection unit.
根據本應用例,於電子零件上設置有識別資訊,識別資訊檢測部檢測識別資訊。然後,個體識別部根據識別資訊檢測電子零件之識別資訊。然後,搬送機構將電子零件搬送至實施特定處理之位置。因此,電子零件搬送裝置可辨識電子零件之識別資訊。搬送機構將電子零件搬送至檢查部,檢查部檢查電子零件。其結果為,可使電子零件檢查裝置不會檢查錯誤之電子零件。 According to this application example, the identification information is provided on the electronic component, and the identification information detecting unit detects the identification information. Then, the individual identification unit detects the identification information of the electronic component based on the identification information. Then, the transport mechanism transports the electronic components to a position where the specific processing is performed. Therefore, the electronic component transport device can recognize the identification information of the electronic component. The transport mechanism transports the electronic components to the inspection unit, and the inspection unit checks the electronic components. As a result, the electronic component inspection device can be prevented from checking for erroneous electronic components.
1、86‧‧‧零件檢查裝置 1, 86‧‧‧ parts inspection device
1a‧‧‧檢查部 1a‧‧‧Inspection Department
1b‧‧‧作為零件搬送裝置之搬送部 1b‧‧‧As the transport part of the parts transport device
2‧‧‧基台 2‧‧‧Abutment
3‧‧‧作為第1移動部之第1輸送機 3‧‧‧The first conveyor as the first moving part
3a‧‧‧皮帶輪 3a‧‧‧ Pulley
3b‧‧‧皮帶 3b‧‧‧Leather
3c‧‧‧第1方向 3c‧‧‧1st direction
4‧‧‧第2輸送機 4‧‧‧2nd conveyor
5‧‧‧第3輸送機 5‧‧‧3rd conveyor
6‧‧‧第4輸送機 6‧‧‧4th conveyor
7‧‧‧第5輸送機 7‧‧‧5th conveyor
8‧‧‧第6輸送機 8‧‧‧6th conveyor
9‧‧‧作為容器之托盤 9‧‧‧Tray as container
10‧‧‧電子零件 10‧‧‧Electronic parts
10a‧‧‧製造商名 10a‧‧‧Manufacturer name
10b‧‧‧品種顯示名 10b‧‧‧Variet display name
10c‧‧‧作為識別資訊之個體識別編號 10c‧‧‧ as the identification number of the identification information
11‧‧‧作為第2移動部之托盤搬送部 11‧‧‧Tray transfer unit as the second moving unit
12‧‧‧托盤搬送支撐部 12‧‧‧Tray transport support
13‧‧‧軌道 13‧‧‧ Track
14‧‧‧作為移動機構之托盤移動平台 14‧‧‧Tray mobile platform as a mobile organization
14a‧‧‧第2方向 14a‧‧‧2nd direction
15‧‧‧托盤握持支撐部 15‧‧‧Tray grip support
16‧‧‧托盤握持部 16‧‧‧Tray grip
17‧‧‧作為識別資訊檢測部及圖像攝像部之攝像裝置 17‧‧‧As an imaging device for the identification information detection unit and the image imaging unit
20‧‧‧作為搬送機構之零件除供材部 20‧‧‧Parts of the transporting unit except the supply department
21‧‧‧零件搬送支撐部 21‧‧‧Parts Transfer Support
21a‧‧‧支柱部 21a‧‧‧ Pillars
21b‧‧‧架橋構件 21b‧‧‧Bridge components
22‧‧‧軌道 22‧‧‧ Track
23‧‧‧供材Y平台 23‧‧‧Material Y platform
24‧‧‧除材Y平台 24‧‧‧Removal Y platform
25‧‧‧第1支撐樑 25‧‧‧1st support beam
26‧‧‧軌道 26‧‧‧ Track
27‧‧‧供材X平台 27‧‧‧Feeding X platform
28‧‧‧供材零件握持部 28‧‧‧Material parts grip
29‧‧‧作為搬送機構之零件供材部 29‧‧‧Parts supply part of the transport mechanism
30‧‧‧第2支撐樑 30‧‧‧2nd support beam
31‧‧‧除材X平台 31‧‧‧Excluding material X platform
32‧‧‧除材零件握持部 32‧‧‧Removal parts grip
33‧‧‧零件除材部 33‧‧‧Parts Department
34‧‧‧檢查用插槽 34‧‧‧Checking slots
35‧‧‧軌道 35‧‧‧ Track
36‧‧‧作為搬送機構之第1往返平台 36‧‧‧The first round-trip platform as the transport agency
37‧‧‧凹部 37‧‧‧ recess
37a‧‧‧供材用凹部 37a‧‧‧Containment recess
37b‧‧‧除材用凹部 37b‧‧‧Recessed recess
40‧‧‧軌道 40‧‧‧ Track
41‧‧‧作為搬送機構之第2往返平台 41‧‧‧ as the second round-trip platform of the transport agency
42‧‧‧凹部 42‧‧‧ recess
42a‧‧‧供材用凹部 42a‧‧‧Containment recess
42b‧‧‧除材用凹部 42b‧‧‧Recessed recess
43‧‧‧作為搬送機構之零件按壓裝置 43‧‧‧Parts pressing device as a transport mechanism
44‧‧‧按壓支撐部 44‧‧‧ Pressing support
45‧‧‧軌道 45‧‧‧ Track
46‧‧‧測定X平台 46‧‧‧Measure X platform
47‧‧‧檢查零件握持部 47‧‧‧Check the part grip
48‧‧‧資訊顯示裝置 48‧‧‧Information display device
50‧‧‧電性特性檢查裝置 50‧‧‧Electrical property inspection device
51‧‧‧控制部 51‧‧‧Control Department
51a‧‧‧作為資訊輸出部、資訊顯示部及警報輸出部之資訊顯示裝置 51a‧‧‧Information display device as information output unit, information display unit and alarm output unit
51b‧‧‧作為資訊輸入部之資訊輸入裝置 51b‧‧‧Information input device as information input department
52‧‧‧警告燈 52‧‧‧Warning lights
53‧‧‧外殼 53‧‧‧Shell
54‧‧‧空氣供給部 54‧‧‧Air Supply Department
55‧‧‧間隔板 55‧‧‧ Spacer
58‧‧‧CPU 58‧‧‧CPU
59‧‧‧記憶體 59‧‧‧ memory
60‧‧‧平台驅動裝置 60‧‧‧ platform drive
61‧‧‧輸送機驅動裝置 61‧‧‧Conveyor drive
62‧‧‧握持部驅動裝置 62‧‧‧Handheld drive
65‧‧‧作為資訊輸出部及輸出介面之資訊輸出裝置 65‧‧‧Information output device as information output and output interface
66‧‧‧資料匯流排 66‧‧‧ data bus
67‧‧‧輸入輸出介面 67‧‧‧Input and output interface
68‧‧‧托盤升降裝置 68‧‧‧Tray lifting device
69‧‧‧供材Z平台 69‧‧‧Supply Z platform
70‧‧‧除材Z平台 70‧‧‧Excluding material Z platform
71‧‧‧測定Z平台 71‧‧‧Measure Z platform
72‧‧‧程式軟體 72‧‧‧Program software
73‧‧‧圖像資料 73‧‧‧Image data
74‧‧‧作為比較資訊之比較判定資料 74‧‧‧Comparative data for comparative information
75‧‧‧作為識別資訊之個體識別資料 75‧‧‧ Individual identification data as identification information
76‧‧‧平台控制部 76‧‧‧ Platform Control Department
77‧‧‧握持控制部 77‧‧‧ Holding Control Department
78‧‧‧資料轉換部 78‧‧‧Data Conversion Department
79‧‧‧作為個體識別部之個體識別編號運算部 79‧‧‧As the individual identification number calculation unit of the individual identification department
80‧‧‧作為資訊比較部之個體識別編號判定部 80‧‧‧ as the Individual Identification Number Determination Department of the Information Comparison Department
81‧‧‧資訊顯示控制部 81‧‧‧Information Display Control Department
82‧‧‧資訊輸出控制部 82‧‧‧Information Output Control Department
84‧‧‧圖像 84‧‧‧ images
84a‧‧‧製造商名圖像 84a‧‧‧Manufacturer Name Image
84b‧‧‧品種顯示名圖像 84b‧‧‧Variet display name image
84c‧‧‧個體識別編號圖像 84c‧‧‧individual identification number image
85‧‧‧電子零件 85‧‧‧Electronic parts
85a‧‧‧製造商名 85a‧‧‧Manufacturer name
85b‧‧‧品種顯示名 85b‧‧‧Variet display name
85c‧‧‧個體識別編號 85c‧‧ ‧ individual identification number
85d‧‧‧品種條碼 85d‧‧‧Variet barcode
85e、88e‧‧‧作為識別資訊之個體識別條碼 85e, 88e‧‧‧ as an individual identification barcode for identification information
87‧‧‧條碼讀取器 87‧‧‧Barcode reader
87a‧‧‧光線 87a‧‧‧Light
88‧‧‧電子零件 88‧‧‧Electronic parts
88a‧‧‧製造商名 88a‧‧‧Manufacturer name
88b‧‧‧品種顯示名 88b‧‧‧Variet display name
88c‧‧‧個體識別編號 88c‧‧‧ Individual identification number
88d‧‧‧品種條碼 88d‧‧‧Variet barcode
圖1係表示第1實施形態之零件檢查裝置之構造之模式平面圖。 Fig. 1 is a schematic plan view showing the structure of a component inspection device according to a first embodiment.
圖2(a)及(b)係表示零件檢查裝置之構造之模式側視圖。 2(a) and 2(b) are schematic side views showing the structure of the component inspection device.
圖3係表示零件檢查裝置之構造之概略立體圖。 Fig. 3 is a schematic perspective view showing the structure of a part inspection device.
圖4係用以說明電子零件之模式平面圖。 Figure 4 is a schematic plan view showing the electronic parts.
圖5係零件檢查裝置之電控制方塊圖。 Figure 5 is an electrical control block diagram of the part inspection device.
圖6係表示電子零件之檢查方法之流程圖。 Fig. 6 is a flow chart showing a method of inspecting an electronic component.
圖7(a)-(d)係用以說明電子零件之檢查方法之模式圖。 7(a)-(d) are schematic diagrams for explaining an inspection method of an electronic component.
圖8(a)-(d)係用以說明電子零件之檢查方法之模式圖。 8(a)-(d) are schematic diagrams for explaining an inspection method of an electronic component.
圖9係關於第2實施形態,(a)係用以說明電子零件之模式平面圖,(b)係表示零件檢查裝置之構造之模式側視圖。 Fig. 9 is a second embodiment, (a) is a schematic plan view showing an electronic component, and (b) is a schematic side view showing a structure of the component inspection device.
圖10係用以說明變化例之電子零件之模式平面圖。 Fig. 10 is a schematic plan view showing an electronic component of a modification.
於本實施形態中,對包括零件搬送裝置之零件檢查裝置與該零件搬送裝置搬送零件之方法之特徵例進行說明。以下,根據圖式對實施形態進行說明。再者,各圖式中之各構件於各圖式上係設為可辨識程度之大小,因此針對各構件以不同比例尺進行圖示。 In the present embodiment, a description will be given of a characteristic example of a method of conveying a component by the component inspection device including the component conveying device and the component conveying device. Hereinafter, embodiments will be described based on the drawings. Further, each member in each drawing is identifiable in each drawing, and therefore, each member is illustrated at a different scale.
根據圖1~圖8對第1實施形態之零件檢查裝置進行說明。 A component inspection device according to the first embodiment will be described with reference to Figs. 1 to 8 .
圖1係表示零件檢查裝置之構造之模式平面圖,成為卸除外殼之圖。圖2(a)及圖2(b)係表示零件檢查裝置之構造之模式側視圖。圖3係表示零件檢查裝置之構造之概略立體圖。如圖1~圖3所示,零件檢查裝置1包括長方形板狀之基台2。將於基台2之俯視下基台2之相正交之2邊延伸的方向設為X方向與Y方向,將鉛垂方向設為-Z方向。零件檢查裝置1主要包括:檢查部1a,其檢查電子零件;及作為零件搬送裝置之搬送部1b,其將零件搬送至檢查部1a。 Fig. 1 is a schematic plan view showing the structure of a part inspecting apparatus, and is a view showing a housing removed. 2(a) and 2(b) are schematic side views showing the structure of the component inspection device. Fig. 3 is a schematic perspective view showing the structure of a part inspection device. As shown in FIGS. 1 to 3, the component inspection device 1 includes a base plate 2 having a rectangular plate shape. The direction in which the two sides of the base 2 are orthogonal to each other in the plan view of the base 2 is set to the X direction and the Y direction, and the vertical direction is set to the -Z direction. The component inspection device 1 mainly includes an inspection unit 1a that inspects electronic components, and a conveyance unit 1b that is a component conveyance device that conveys components to the inspection unit 1a.
於基台2上之X方向側設置有沿X方向較長地延伸之6個帶式輸送機。帶式輸送機自-Y方向側起依序成為作為第1移動部之第1輸送機3、第2輸送機4、第3輸送機5、第4輸送機6、第5輸送機7、及第6輸送機8。第1輸送機3係供材用帶式輸送機,於第1輸送機3上載置有作為容器之托盤9。托盤9係藉由間隔板而劃分為5列5行之矩陣狀,於各區塊中載置有電子零件10。因此,托盤9可於正交之2方向上排列並載置電子零件10。 Six belt conveyors extending in the X direction are provided on the X-direction side of the base 2. The belt conveyor sequentially becomes the first conveyor 3, the second conveyor 4, the third conveyor 5, the fourth conveyor 6, the fifth conveyor 7, and the first moving portion from the -Y direction side. The sixth conveyor 8. The first conveyor 3 is a belt conveyor for feeding, and a tray 9 as a container is placed on the first conveyor 3. The tray 9 is divided into a matrix of five rows and five rows by a partition plate, and the electronic component 10 is placed in each of the blocks. Therefore, the tray 9 can be arranged in the orthogonal direction 2 and the electronic component 10 can be placed.
第1輸送機3於內部包括馬達、減速機、及皮帶輪3a,馬達以藉由減速機減速之旋轉數使皮帶輪旋動。而且,皮帶3b與皮帶輪之外周相接觸地設置,藉由馬達使皮帶輪旋動,而使皮帶進行移動。而且,載置於第1輸送機3上之托盤9與皮帶一起沿X方向進行往返移動。將第1輸送機3使托盤9移動之X方向設為第1方向3c。第2輸送機4~第6輸送機8與第1輸送機3成為相同構造,可與第1輸送機3同樣地使托盤9沿X方向進行往返移動。 The first conveyor 3 internally includes a motor, a speed reducer, and a pulley 3a, and the motor rotates the pulley by the number of revolutions decelerated by the speed reducer. Further, the belt 3b is provided in contact with the outer circumference of the pulley, and the belt is rotated by the motor to move the belt. Further, the tray 9 placed on the first conveyor 3 reciprocates in the X direction together with the belt. The X direction in which the first conveyor 3 moves the tray 9 is set to the first direction 3c. The second conveyor 4 to the sixth conveyor 8 have the same structure as the first conveyor 3, and the tray 9 can be reciprocated in the X direction in the same manner as the first conveyor 3.
第2輸送機4及第3輸送機5成為放置空托盤9之場所,第4輸送機6成為放置存儲判定為不良之電子零件10之托盤9的場所。而且,第5輸送機7及第6輸送機8成為放置存儲判定為良品之電子零件10之托盤9之場所。 The second conveyor 4 and the third conveyor 5 are places where the empty tray 9 is placed, and the fourth conveyor 6 is a place where the tray 9 of the electronic component 10 determined to be defective is placed. Further, the fifth conveyor 7 and the sixth conveyor 8 are places where the tray 9 of the electronic component 10 determined to be good is stored.
電子零件10之形態並無特別限定,但於本實施形態中,例如,電子零件10可適用平面封裝(Flat Package)等各種封裝形態之IC(Integrated Circuit)、CIS、液晶面板、液晶模組及電子模組等。而且,零件檢查裝置1成為檢查電子零件10之電性特性而區別良品與不良品之裝置。 The form of the electronic component 10 is not particularly limited. However, in the present embodiment, for example, an IC (Integrated Circuit), a CIS, a liquid crystal panel, a liquid crystal module, and the like in various package forms such as a flat package (Flat Package) can be applied to the electronic component 10. Electronic modules, etc. Further, the component inspection device 1 is a device that inspects the electrical characteristics of the electronic component 10 to distinguish between good and defective products.
於與第1輸送機3~第6輸送機8相對向之場所設置有作為第2移動部之托盤搬送部11。托盤搬送部11包括跨及第1輸送機3~第6輸送機8而設置之門型之托盤搬送支撐部12。托盤搬送支撐部12為沿Y方向較長之形狀,於托盤搬送支撐部12之-X方向側設置有沿Y方向延伸之軌道13。 The tray transport unit 11 as the second moving unit is provided at a position facing the first conveyor 3 to the sixth conveyor 8 . The tray transport unit 11 includes a door type tray transport support unit 12 that is provided across the first conveyor 3 to the sixth conveyor 8 . The tray conveyance support portion 12 has a shape elongated in the Y direction, and a rail 13 extending in the Y direction is provided on the -X direction side of the tray conveyance support portion 12.
於軌道13之-X方向側設置有沿軌道13移動之作為移動機構之托盤移動平台14。將托盤移動平台14移動之Y方向設為第2方向14a。第2方向14a係與第1方向3c正交之方向,第1方向3c及第2方向14a成為於托盤9中排列電子零件10之方向。於托盤搬送支撐部12之內部設置有使托盤移動平台14移動之線性運動機構。該線性運動機構之種類並無特別限定,可使用線性馬達,馬達與滾珠螺桿之組合,齒條、小齒輪及馬達之組合等各種形態。於本實施形態中,例如採用伺服馬達與滾珠螺桿之組合。 A tray moving platform 14 as a moving mechanism that moves along the rail 13 is provided on the -X direction side of the rail 13. The Y direction in which the tray moving platform 14 is moved is set to the second direction 14a. The second direction 14a is a direction orthogonal to the first direction 3c, and the first direction 3c and the second direction 14a are directions in which the electronic component 10 is arranged in the tray 9. A linear motion mechanism for moving the tray moving platform 14 is provided inside the tray transport support portion 12. The type of the linear motion mechanism is not particularly limited, and a linear motor, a combination of a motor and a ball screw, and a combination of a rack, a pinion, and a motor can be used. In the present embodiment, for example, a combination of a servo motor and a ball screw is employed.
於托盤移動平台14之-X方向側之面經由托盤握持支撐部15而設置有托盤握持部16。托盤握持部16包括升降裝置與真空夾頭。真空夾頭包括吸盤,吸盤係藉由配管而與真空泵連接。而且,升降裝置具有使真空夾頭升降之功能。升降裝置使真空夾頭下降而使真空夾頭之吸盤與托盤9接觸。然後,藉由將吸盤與托盤9之間設為真空而使真空夾頭握持托盤9。其後,藉由以升降裝置使托盤9上升而使托盤9離開第1輸送機3,從而托盤移動平台14可使托盤9沿Y方向移動。托盤搬送部11包括托盤搬送支撐部12、軌道13、托盤移動平台14、托盤握持支撐 部15及托盤握持部16等。 A tray grip portion 16 is provided on the surface on the -X direction side of the tray moving platform 14 via the tray holding support portion 15. The tray grip 16 includes a lifting device and a vacuum chuck. The vacuum chuck includes a suction cup that is connected to the vacuum pump by a pipe. Moreover, the lifting device has a function of lifting and lowering the vacuum chuck. The lifting device lowers the vacuum chuck so that the suction cup of the vacuum chuck contacts the tray 9. Then, the vacuum chuck holds the tray 9 by setting a vacuum between the chuck and the tray 9. Thereafter, the tray 9 is moved away from the first conveyor 3 by raising the tray 9 by the lifting device, whereby the tray moving platform 14 can move the tray 9 in the Y direction. The tray transporting portion 11 includes a tray transport support portion 12, a rail 13, a tray moving platform 14, and a tray holding support The portion 15 and the tray holding portion 16 and the like.
於托盤移動平台14之-X方向側之面除托盤握持部16以外亦設置有識別資訊檢測部及作為圖像攝像部之攝像裝置17。而且,托盤移動平台14使攝像裝置17沿第2方向14a進行往返移動。托盤移動平台14所包括之移動機構使攝像裝置17與托盤握持部16進行移動。換言之,攝像裝置17與托盤握持部16具有共用之移動機構。 In addition to the tray grip portion 16, the surface of the tray moving platform 14 on the -X direction side is provided with an identification information detecting portion and an image pickup device 17 as an image capturing portion. Further, the tray moving platform 14 reciprocates the imaging device 17 in the second direction 14a. The moving mechanism included in the tray moving platform 14 moves the image pickup device 17 and the tray grip portion 16. In other words, the imaging device 17 and the tray grip portion 16 have a common moving mechanism.
攝像裝置17係於內部組入有物鏡、自動調焦(automatic focus)裝置、同軸落射照明裝置及CCD(Charge Coupled Device,電荷耦合器件)攝像元件者。攝像裝置17中物鏡係朝向電子零件10而設置。首先,自同軸落射照明裝置射出之光係照射電子零件10。攝像裝置17通過物鏡輸入由電子零件10反射之光。然後,自動調焦裝置於CCD攝像元件上成像。藉由以CCD攝像元件將圖像轉換為電信號從而攝像裝置17可拍攝電子零件10。 The imaging device 17 is internally incorporated with an objective lens, an automatic focus device, a coaxial epi-illumination device, and a CCD (Charge Coupled Device) imaging device. The objective lens of the imaging device 17 is provided toward the electronic component 10. First, the light emitted from the coaxial epi-illumination device illuminates the electronic component 10. The imaging device 17 inputs the light reflected by the electronic component 10 through the objective lens. Then, the autofocus device is imaged on the CCD image sensor. The image pickup device 17 can take the electronic component 10 by converting the image into an electric signal with the CCD image pickup element.
於第1輸送機3~第6輸送機8之-X方向側設置有作為搬送機構之零件除供材部20。零件除供材部20包括設置於基台2上之門型之零件搬送支撐部21。零件搬送支撐部21包括立設在基台2之一對支柱部21a與架橋於支柱部21a間之架橋構件21b。於架橋構件21b之基台2側之面設置有沿Y方向延伸之軌道22。而且,長方體狀之供材Y平台23及除材Y平台24懸架於架橋構件21b之軌道22而設置。於架橋構件21b中內置有線性運動機構,該線性運動機構使供材Y平台23及除材Y平台24沿Y方向進行往返移動。再者,架橋構件21b之線性運動機構可使用與驅動托盤移動平台14之線性運動機構相同之機構。 In addition to the supply unit 20, a component as a transport mechanism is provided on the -X direction side of the first conveyor 3 to the sixth conveyor 8. The component removing portion 20 includes a door type component carrying support portion 21 provided on the base 2. The component transport support portion 21 includes a bridge member 21b that is erected between one of the pair of pillar portions 21a of the base 2 and the bridge pillar portion 21a. A rail 22 extending in the Y direction is provided on the surface of the bridging member 21b on the base 2 side. Further, the rectangular-shaped material Y platform 23 and the material Y platform 24 are suspended from the rail 22 of the bridge member 21b. A linear motion mechanism is built in the bridging member 21b, and the linear motion mechanism reciprocates the material Y platform 23 and the material Y platform 24 in the Y direction. Further, the linear motion mechanism of the bridge member 21b can use the same mechanism as the linear motion mechanism that drives the tray moving platform 14.
於供材Y平台23之基台2側設置有沿X方向延伸之第1支撐樑25,於第1支撐樑25設置有沿X方向延伸之軌道26。而且,長方體狀之供材X平台27係懸架於第1支撐樑25之軌道26而設置。於第1支撐樑25中內置有線性運動機構,該線性運動機構使供材零件握持部28沿X方向 進行往返移動。再者,第1支撐樑25之線性運動機構可使用與驅動托盤移動平台14之線性運動機構相同之機構。於供材X平台27之基台2側設置有供材零件握持部28,供材零件握持部28包括升降裝置及真空夾頭。該升降裝置及真空夾頭與托盤握持部16所包括之升降裝置及真空夾頭為相同構造,故省略說明。作為搬送機構之零件供材部29由供材Y平台23、第1支撐樑25、供材X平台27及供材零件握持部28等而構成。 A first support beam 25 extending in the X direction is provided on the base 2 side of the material Y stage 23, and a rail 26 extending in the X direction is provided on the first support beam 25. Further, the rectangular-shaped material supply X platform 27 is suspended from the rail 26 of the first support beam 25. A linear motion mechanism is built in the first support beam 25, and the linear motion mechanism causes the material component grip portion 28 to follow the X direction. Make a round trip. Further, the linear motion mechanism of the first support beam 25 can use the same mechanism as the linear motion mechanism that drives the tray moving platform 14. A supply part grip portion 28 is provided on the base 2 side of the supply X platform 27, and the supply part grip portion 28 includes a lifting device and a vacuum chuck. Since the lifting device and the vacuum chuck have the same structure as the lifting device and the vacuum chuck included in the tray holding portion 16, description thereof will be omitted. The component feeding portion 29 as the conveying mechanism is constituted by the material Y platform 23, the first support beam 25, the material X platform 27, the material component grip portion 28, and the like.
於供材零件握持部28中,升降裝置使真空夾頭下降而使真空夾頭之吸盤接觸電子零件10。然後,藉由將吸盤與電子零件10之間設為真空而使真空夾頭握持電子零件10。其後,藉由以升降裝置使電子零件10上升從而供材Y平台23及供材X平台27可沿X方向及Y方向移動電子零件10。 In the feeding member grip portion 28, the lifting device lowers the vacuum chuck to bring the suction cup of the vacuum chuck into contact with the electronic component 10. Then, the vacuum chuck holds the electronic component 10 by setting a vacuum between the chuck and the electronic component 10. Thereafter, the electronic component 10 is lifted by the lifting device so that the material Y platform 23 and the material X platform 27 can move the electronic component 10 in the X direction and the Y direction.
同樣地,於除材Y平台24之基台2側設置有沿X方向延伸之第2支撐樑30,於第2支撐樑30之基台2側設置有沿X方向延伸之軌道26。而且,長方體狀之除材X平台31係懸架於第2支撐樑30之軌道26而設置。於第2支撐樑30中內置有線性運動機構,該線性運動機構使除材X平台31沿X方向進行往返移動。再者,第2支撐樑30之線性運動機構可使用與驅動托盤移動平台14之線性運動機構相同之機構。於除材X平台31之基台2側設置有除材零件握持部32,除材零件握持部32包括升降裝置及真空夾頭。該升降裝置及真空夾頭與托盤握持部16所包括之升降裝置及真空夾頭為相同構造,故省略說明。零件除材部33由除材Y平台24、第2支撐樑30、除材X平台31及除材零件握持部32等而構成。 Similarly, a second support beam 30 extending in the X direction is provided on the base 2 side of the material Y stage 24, and a rail 26 extending in the X direction is provided on the base 2 side of the second support beam 30. Further, the rectangular parallelepiped material X platform 31 is suspended from the rail 26 of the second support beam 30. A linear motion mechanism is built in the second support beam 30, and the linear motion mechanism reciprocates the material X platform 31 in the X direction. Furthermore, the linear motion mechanism of the second support beam 30 can use the same mechanism as the linear motion mechanism that drives the tray moving platform 14. A material removing portion 32 is provided on the base 2 side of the material X platform 31, and the material removing portion 32 includes a lifting device and a vacuum chuck. Since the lifting device and the vacuum chuck have the same structure as the lifting device and the vacuum chuck included in the tray holding portion 16, description thereof will be omitted. The component removing portion 33 is composed of the material Y platform 24, the second support beam 30, the material X platform 31, the material removal member holding portion 32, and the like.
於除材零件握持部32中,升降裝置使真空夾頭下降而使真空夾頭之吸盤接觸電子零件10。然後,藉由將吸盤與電子零件10之間設為真空而由真空夾頭握持電子零件10。其後,藉由以升降裝置使電子零 件10上升,從而除材Y平台24及除材X平台31可沿X方向及Y方向移動電子零件10。 In the removal part grip portion 32, the lifting device lowers the vacuum chuck to bring the suction cup of the vacuum chuck into contact with the electronic component 10. Then, the electronic component 10 is held by the vacuum chuck by setting a vacuum between the chuck and the electronic component 10. Thereafter, the electrons are zeroed by the lifting device The piece 10 is raised so that the material Y platform 24 and the material X platform 31 can move the electronic component 10 in the X direction and the Y direction.
於零件搬送支撐部21之-X方向上,在基台2上設置有檢查用插槽(socket)34。檢查用插槽34係檢查電子零件10之場所。於檢查用插槽34中設置有與電子零件10之外形形狀大致相同形狀之凹部,電子零件10可設置於該凹部中。而且,於凹部中設置有可與電子零件10之端子電性接觸之探針。於檢查用插槽34中設置有4個凹部,可同時檢查4個電子零件10。 In the -X direction of the component transport support portion 21, an inspection socket 34 is provided on the base 2. The inspection slot 34 is a place for inspecting the electronic component 10. A recess having substantially the same shape as the outer shape of the electronic component 10 is provided in the inspection slot 34, and the electronic component 10 can be disposed in the recess. Further, a probe that can be in electrical contact with the terminal of the electronic component 10 is provided in the recess. Four recesses are provided in the inspection slot 34, and four electronic components 10 can be inspected simultaneously.
於檢查用插槽34之X方向上,在檢查用插槽34與零件搬送支撐部21之間設置有一對軌道35。軌道35係沿Y方向延伸設置,於軌道35上設置有沿軌道35移動之第1往返平台(shuttle stage)36。於基台2中在一對軌道35之間內置有線性運動機構,該線性運動機構使第1往返平台36在Y方向上往返移動。再者,軌道35之間之線性運動機構可使用與驅動托盤移動平台14之線性運動機構相同之機構。 A pair of rails 35 are provided between the inspection slot 34 and the component transport support portion 21 in the X direction of the inspection slot 34. The rail 35 is extended in the Y direction, and a first shuttle stage 36 that moves along the rail 35 is provided on the rail 35. A linear motion mechanism is built in the base 2 between the pair of rails 35, and the linear motion mechanism reciprocates the first shuttle platform 36 in the Y direction. Furthermore, the linear motion mechanism between the tracks 35 can use the same mechanism as the linear motion mechanism that drives the tray moving platform 14.
於第1往返平台36之朝向Z方向之面上設置有8個用以設置電子零件10之凹部37。其中4個凹部37係配置於第1往返平台36之-Y方向側,將該凹部37設為供材用凹部37a。其餘4個凹部37係配置於第1往返平台36之Y方向側,將該凹部37設為除材用凹部37b。當除材用凹部37b位於檢查用插槽34附近時,於基台2之俯視下供材用凹部37a位於零件供材部29之供材零件握持部28可移動之場所。同樣地,當供材用凹部37a位於檢查用插槽34附近時,於基台2之俯視下除材用凹部37b位於零件除材部33之除材零件握持部32可移動之場所。 Eight recesses 37 for arranging the electronic component 10 are provided on the surface of the first shuttle platform 36 in the Z direction. The four recessed portions 37 are disposed on the -Y direction side of the first reciprocating platform 36, and the recessed portion 37 is a supply recessed portion 37a. The remaining four recessed portions 37 are disposed on the Y-direction side of the first reciprocating platform 36, and the recessed portion 37 is a material-receiving recessed portion 37b. When the cutout recess 37b is located in the vicinity of the inspection slot 34, the supply recess 37a is located in a position where the supply member grip portion 28 of the component supply portion 29 is movable in a plan view of the base 2. Similarly, when the supply recessed portion 37a is located in the vicinity of the inspection slot 34, the material removing recess 37b is located at a position where the removal component holding portion 32 of the component removing portion 33 is movable in the plan view of the base 2.
於檢查用插槽34之-X方向上,在檢查用插槽34與基台2之端部之間設置有一對軌道40。軌道40係沿Y方向延伸設置,於軌道40上設置有沿軌道40移動之第2往返平台41。於基台2中在一對軌道40之間內置有線性運動機構,該線性運動機構使第2往返平台41在Y方向上往返 移動。再者,軌道40之間之線性運動機構可使用與驅動托盤移動平台14之線性運動機構相同之機構。 A pair of rails 40 are provided between the inspection slot 34 and the end of the base 2 in the -X direction of the inspection slot 34. The rail 40 is extended in the Y direction, and the second reciprocating platform 41 that moves along the rail 40 is provided on the rail 40. A linear motion mechanism is built in the base 2 between the pair of rails 40, and the linear motion mechanism causes the second shuttle platform 41 to reciprocate in the Y direction. mobile. Furthermore, the linear motion mechanism between the tracks 40 can use the same mechanism as the linear motion mechanism that drives the tray moving platform 14.
於第2往返平台41之朝向Z方向之面上設置有8個用以設置電子零件10之凹部42。其中4個凹部42係配置於第2往返平台41之-Y方向側,將該凹部42設為供材用凹部42a。其餘4個凹部42係配置於第2往返平台41之Y方向側,將該凹部42設為除材用凹部42b。當除材用凹部42b位於檢查用插槽34附近時,於基台2之俯視下供材用凹部42a位於零件供材部29之供材零件握持部28可移動之場所。同樣地,當供材用凹部42a位於檢查用插槽34附近時,於基台2之俯視下除材用凹部42b位於零件除材部33之除材零件握持部32可移動之場所。 Eight recesses 42 for arranging the electronic component 10 are provided on the surface of the second shuttle platform 41 in the Z direction. The four recessed portions 42 are disposed on the -Y direction side of the second reciprocating platform 41, and the recessed portion 42 is a supply recessed portion 42a. The remaining four recessed portions 42 are disposed on the Y-direction side of the second reciprocating platform 41, and the recessed portion 42 is a material-receiving recessed portion 42b. When the cutout recess 42b is located in the vicinity of the inspection slot 34, the supply recess 42a is located in a position where the supply member grip portion 28 of the component supply portion 29 is movable in a plan view of the base 2. In the same manner, when the supply recess 42a is located in the vicinity of the inspection slot 34, the removal recess 42b in the plan view of the base 2 is located at a position where the removal component grip portion 32 of the component removal portion 33 can move.
於與第1往返平台36及第2往返平台41相對向之場所設置有作為搬送機構之零件按壓裝置43。零件按壓裝置43具備橫跨第1往返平台36及第2往返平台41而設置之門型之按壓支撐部44。按壓支撐部44為沿X方向較長之形狀,於按壓支撐部44之Y方向側設置有沿X方向延伸之軌道45。 A component pressing device 43 as a conveying mechanism is provided at a position facing the first shuttle platform 36 and the second shuttle platform 41. The component pressing device 43 includes a gate-type pressing support portion 44 that is provided across the first reciprocating platform 36 and the second reciprocating platform 41 . The pressing support portion 44 has a shape elongated in the X direction, and a rail 45 extending in the X direction is provided on the Y direction side of the pressing support portion 44.
於軌道45之Y方向側設置有沿軌道45移動之測定X平台46。於按壓支撐部44之內部設置有使測定X平台46移動之線性運動機構。再者,測定X平台46之線性運動機構可使用與驅動托盤移動平台14之線性運動機構相同之機構。 A measurement X platform 46 that moves along the track 45 is provided on the Y-direction side of the track 45. A linear motion mechanism for moving the measurement X stage 46 is provided inside the pressing support portion 44. Furthermore, the linear motion mechanism that measures the X platform 46 can use the same mechanism as the linear motion mechanism that drives the tray moving platform 14.
於測定X平台46之Y方向側設置有檢查零件握持部47,檢查零件握持部47包括升降裝置及真空夾頭。該升降裝置及真空夾頭與托盤握持部16所包括之升降裝置及真空夾頭為相同構造,故省略說明。檢查零件握持部47之真空夾頭包括4個吸盤,可1次握持4個電子零件10。 An inspection part grip portion 47 is provided on the Y direction side of the measurement X stage 46, and the inspection part grip portion 47 includes a lifting device and a vacuum chuck. Since the lifting device and the vacuum chuck have the same structure as the lifting device and the vacuum chuck included in the tray holding portion 16, description thereof will be omitted. The vacuum chuck for inspecting the part grip portion 47 includes four suction cups, and the four electronic parts 10 can be held once.
於檢查零件握持部47中,升降裝置使真空夾頭下降而使真空夾頭之吸盤接觸電子零件10。然後,藉由將吸盤與電子零件10之間設為真空而使真空夾頭握持電子零件10。其後,藉由以升降裝置使電子零 件10上升從而測定X平台46可使電子零件10沿X方向進行往返移動。 In the inspection part grip portion 47, the lifting device lowers the vacuum chuck to bring the suction cup of the vacuum chuck into contact with the electronic component 10. Then, the vacuum chuck holds the electronic component 10 by setting a vacuum between the chuck and the electronic component 10. Thereafter, the electrons are zeroed by the lifting device The piece 10 is raised so that the X platform 46 can be moved to reciprocate the electronic component 10 in the X direction.
而且,零件按壓裝置43握持載置於第1往返平台36之供材用凹部37a中之電子零件10而將其移動至檢查用插槽34。然後,零件按壓裝置43將電子零件10按壓至檢查用插槽34中。此時,由於電子零件10之端子係按壓於探針,因此端子與探針係確實地電性連接。維持該狀態進行電子零件10之電特性檢查。然後,於電子零件10之電特性檢查結束後,零件按壓裝置43將電子零件10移動至第1往返平台36之除材用凹部37b。以相同順序,檢查零件握持部47藉由將載置於第2往返平台41上之電子零件10移動至檢查用插槽34為止,並將電子零件10按壓於檢查用插槽34中而輔助電特性檢查。 Further, the component pressing device 43 holds the electronic component 10 placed in the supply recess 37a of the first shuttle platform 36 and moves it to the inspection slot 34. Then, the component pressing device 43 presses the electronic component 10 into the inspection slot 34. At this time, since the terminal of the electronic component 10 is pressed against the probe, the terminal and the probe are reliably electrically connected. This state is maintained to perform electrical characteristic inspection of the electronic component 10. Then, after the electrical characteristic inspection of the electronic component 10 is completed, the component pressing device 43 moves the electronic component 10 to the removing recess 37b of the first shuttle platform 36. In the same order, the inspection component grip portion 47 moves the electronic component 10 placed on the second shuttle platform 41 to the inspection slot 34, and presses the electronic component 10 against the inspection slot 34. Electrical characteristics check.
零件供材部29、第1往返平台36、第2往返平台41及零件按壓裝置43之搬送機構係進行搬送至實施特定處理之位置。該特定處理係指:為了將電子零件10放入檢查用插槽34而改變電子零件10之朝向、將電子零件10插入檢查用插槽34中、及使檢查電流流入電子零件10而進行檢查等處理。搬送部1b係主要於測試處理機中使用者,並非單純以帶式輸送機搬送IC之裝置。 The transport mechanism of the component supply unit 29, the first shuttle platform 36, the second shuttle platform 41, and the component pressing device 43 is transported to a position where the specific processing is performed. This specific processing means that the electronic component 10 is placed in the inspection slot 34, the orientation of the electronic component 10 is changed, the electronic component 10 is inserted into the inspection slot 34, and the inspection current flows into the electronic component 10 to perform inspection. deal with. The transport unit 1b is mainly a user in the test processor, and is not a device that simply transports the IC by a belt conveyor.
於基台2之-X方向側設置有電特性檢查裝置50。電特性檢查裝置50與設置於檢查用插槽34之探針連接。而且,電特性檢查裝置50與電子零件10進行電信號之通信,係進行電子零件10之電性特性之良否判定之裝置。於基台2之X方向側設置有控制部51。控制部51係控制零件檢查裝置1之動作之裝置。於控制部51中搭載有作為資訊輸出部、資訊顯示部及警報輸出部之資訊顯示裝置51a及作為資訊輸入部之資訊輸入裝置51b。進而,於第3輸送機5之位於Z方向之場所設置有資訊顯示裝置48。資訊顯示裝置48及資訊顯示裝置51a係液晶顯示裝置等顯示裝置,係顯示通知操作者之資訊之裝置。資訊輸入裝置51b係鍵盤或滑鼠墊等裝置,係用以供操作者輸入對控制部51進行指示之內容 之裝置。進而,資訊輸入裝置51b具有與外部機器進行通信而輸入資料之功能。 An electrical property inspection device 50 is provided on the -X direction side of the base 2 . The electrical property inspection device 50 is connected to a probe provided in the inspection slot 34. Further, the electrical property inspection device 50 communicates with the electronic component 10 by electrical signals, and is a device for determining whether or not the electrical characteristics of the electronic component 10 are good or not. A control unit 51 is provided on the X direction side of the base 2 . The control unit 51 is a device that controls the operation of the component inspection device 1. An information display device 51a as an information output unit, an information display unit, and an alarm output unit, and an information input device 51b as an information input unit are mounted in the control unit 51. Further, an information display device 48 is provided in a place where the third conveyor 5 is located in the Z direction. The information display device 48 and the information display device 51a are display devices such as liquid crystal display devices, and are devices that display information for notifying the operator. The information input device 51b is a device such as a keyboard or a mouse pad for the operator to input the content indicating the control unit 51. Device. Further, the information input device 51b has a function of inputting data by communicating with an external device.
於基台2之X方向側且Y方向側之角設置有警告燈52。警告燈52係於混入有非預定檢查之電子零件10時,閃爍而提醒操作者注意之裝置。零件檢查裝置1於Z方向側設置有外殼53,資訊顯示裝置48係固定於外殼53。外殼53係藉由使光透過之樹脂而形成,可通過外殼53而觀察內部。而且,外殼53防止灰塵或塵埃侵入零件檢查裝置1中。 A warning light 52 is provided on the X-direction side of the base 2 and on the Y-direction side. The warning light 52 is a device that blinks to alert the operator when the electronic component 10 having an unintended inspection is mixed. The component inspection device 1 is provided with a casing 53 on the Z direction side, and the information display device 48 is fixed to the casing 53. The outer casing 53 is formed by a resin that transmits light, and the inside can be observed through the outer casing 53. Moreover, the outer casing 53 prevents dust or dust from intruding into the component inspection device 1.
於外殼53之Z方向側設置有空氣供給部54。空氣供給部54包括防止灰塵或塵埃通過之過濾器與風扇。而且,空氣供給部54對零件檢查裝置1供給已除去灰塵或塵埃之空氣。空氣係自空氣供給部54流入外殼53之內部,並自基台2及基台2與外殼53之間流出。藉此,可使灰塵或塵埃不會侵入零件檢查裝置1中。 An air supply portion 54 is provided on the Z direction side of the outer casing 53. The air supply portion 54 includes a filter and a fan that prevent dust or dust from passing therethrough. Further, the air supply unit 54 supplies the component inspection device 1 with air from which dust or dust has been removed. The air flows into the inside of the casing 53 from the air supply portion 54, and flows out from between the base 2 and the base 2 and the casing 53. Thereby, dust or dust can be prevented from intruding into the component inspection device 1.
檢查用插槽34包括加熱器,可對電子零件10進行加熱。藉此,可在特定溫度下檢查電子零件10。而且,包圍檢查用插槽34及零件按壓裝置43而設置有間隔板55。間隔板55抑制熱自檢查用插槽34之周圍發散。藉此,可使對電子零件10進行加熱之熱保留在檢查用插槽34周圍。 The inspection slot 34 includes a heater to heat the electronic component 10. Thereby, the electronic component 10 can be inspected at a specific temperature. Further, a partition plate 55 is provided to surround the inspection slot 34 and the component pressing device 43. The partition plate 55 suppresses the divergence of the heat from the periphery of the inspection slot 34. Thereby, the heat for heating the electronic component 10 can be retained around the inspection slot 34.
零件檢查裝置1中之檢查用插槽34及電特性檢查裝置50構成檢查部1a。而且,零件檢查裝置1中之於托盤9與檢查用插槽34之間搬送電子零件10之各平台及輸送機構成搬送部1b。 The inspection slot 34 and the electrical property inspection device 50 in the component inspection device 1 constitute an inspection portion 1a. Further, in each of the parts and inspection apparatuses 1 in which the electronic component 10 is transported between the tray 9 and the inspection slot 34, the conveyor and the conveyor constitute the transport unit 1b.
圖4係用以說明電子零件之模式平面圖。如圖4所示,於電子零件10上印刷有表示製造商名10a、品種顯示名10b、及作為識別資訊之個體識別編號10c的字串。再者,所謂識別資訊,係指標記於電子零件10上之標識或標記等圖形、製造商名等文字資訊、電子零件之類型編號或系列編號、批號等數字資訊等可區別該電子零件與其他電子零件之資訊。文字之內容或配置等屬性並無特別限定,可針對每個電子 零件10進行設定。較佳為製造商名10a、品種顯示名10b、個體識別編號10c之字串成為可藉由攝像裝置17拍攝之色調。於本實施形態中,例如背景成為黑色,文字色成為白色。 Figure 4 is a schematic plan view showing the electronic parts. As shown in FIG. 4, a character string indicating the manufacturer name 10a, the product display name 10b, and the individual identification number 10c as the identification information is printed on the electronic component 10. In addition, the identification information refers to a graphic such as a logo or a mark marked on the electronic component 10, a text information such as a manufacturer name, a type number or a serial number of an electronic component, a digital number such as a batch number, etc., which can distinguish the electronic component from other Information on electronic parts. The attributes such as the content or configuration of the text are not particularly limited and can be targeted at each electronic The part 10 is set. Preferably, the character string of the manufacturer name 10a, the article display name 10b, and the individual identification number 10c becomes a color tone that can be captured by the image pickup device 17. In the present embodiment, for example, the background is black and the character color is white.
圖5係零件檢查裝置之電控制方塊圖。於圖5中,零件檢查裝置1包括控制零件檢查裝置1之動作之控制部51。而且,控制部51包括進行各種運算處理之CPU(Central Processing Unit,中央運算處理裝置)58、及記憶各種資訊之記憶體59作為處理器。進而,平台驅動裝置60、輸送機驅動裝置61、握持部驅動裝置62、攝像裝置17、資訊輸入裝置51b、資訊顯示裝置48、資訊顯示裝置51a、作為資訊輸出部及輸出介面之資訊輸出裝置65、及電特性檢查裝置50係經由入輸出介面66及資料匯流排67而連接於CPU58。 Figure 5 is an electrical control block diagram of the part inspection device. In FIG. 5, the component inspection device 1 includes a control unit 51 that controls the operation of the component inspection device 1. Further, the control unit 51 includes a CPU (Central Processing Unit) 58 that performs various types of arithmetic processing, and a memory 59 that stores various kinds of information as a processor. Further, the platform driving device 60, the conveyor driving device 61, the grip driving device 62, the imaging device 17, the information input device 51b, the information display device 48, the information display device 51a, and the information output device as the information output portion and the output interface 65. The electrical characteristic inspection device 50 is connected to the CPU 58 via the input/output interface 66 and the data bus 67.
平台驅動裝置60驅動托盤移動平台14、及設置於托盤握持部16之托盤升降平台68。各平台包括檢測位置之裝置。而且,平台驅動裝置60藉由移動平台直至到達移動目標場所為止而可使托盤握持部16移動並停止於所期望之場所。 The platform driving device 60 drives the tray moving platform 14 and the tray lifting platform 68 provided on the tray holding portion 16. Each platform includes means for detecting the location. Moreover, the platform driving device 60 can move the tray grip portion 16 and stop at a desired place by moving the platform until reaching the moving target site.
進而,平台驅動裝置60驅動供材X平台27、供材Y平台23、及設置於供材零件握持部28之供材Z平台69。進而,平台驅動裝置60驅動除材X平台31、除材Y平台24、及設置於除材零件握持部32之除材Z平台70。而且,平台驅動裝置60藉由移動平台直至到達移動目標場所為止而可使供材零件握持部28及除材零件握持部32移動並停止於所期望之場所。 Further, the platform driving device 60 drives the material supply X platform 27, the material Y platform 23, and the supply material Z platform 69 provided in the material component holding portion 28. Further, the platform driving device 60 drives the material X platform 31, the material Y platform 24, and the material Z platform 70 provided in the material component holding portion 32. Further, the platform driving device 60 can move the feeding member grip portion 28 and the removing member grip portion 32 to stop at a desired place by moving the platform until reaching the moving target site.
進而,平台驅動裝置60驅動第1往返平台36、第2往返平台41、測定X平台46、及設置於檢查零件握持部47之測定Z平台71。而且,平台驅動裝置60藉由驅動各平台而可使電子零件於第1往返平台36、第2往返平台41、及檢查用插槽34之間移動。 Further, the platform driving device 60 drives the first shuttle platform 36, the second shuttle platform 41, the measurement X platform 46, and the measurement Z platform 71 provided in the inspection component grip portion 47. Further, the platform driving device 60 can move the electronic components between the first shuttle platform 36, the second shuttle platform 41, and the inspection slot 34 by driving the respective platforms.
輸送機驅動裝置61驅動第1輸送機3~第6輸送機8。輸送機驅動 裝置61藉由驅動各輸送機使輸送機移動至托盤9到達移動目標場所為止而可使托盤9移動並停止於所期望之場所。 The conveyor driving device 61 drives the first conveyor 3 to the sixth conveyor 8. Conveyor drive The device 61 can move the tray 9 and stop at a desired place by driving the respective conveyors to move the conveyor to the tray 9 to reach the moving target site.
握持部驅動裝置62驅動托盤握持部16、供材零件握持部28、除材零件握持部32及檢查零件握持部47。握持部驅動裝置62驅動與各握持部連接之真空泵。而且,驅動設置於各握持部與真空泵之間之閥而使閥開閉。藉此,握持部驅動裝置62可使各握持部握持電子零件10後釋放。資訊輸出裝置65係與外部機器連接,且具有將資訊作為電信號而輸出至外部機器之介面功能的裝置。 The grip driving device 62 drives the tray grip portion 16, the material component grip portion 28, the material removal member grip portion 32, and the inspection component grip portion 47. The grip driving device 62 drives a vacuum pump connected to each grip. Further, a valve provided between each of the grip portions and the vacuum pump is driven to open and close the valve. Thereby, the grip driving device 62 can release the electronic component 10 after each grip portion is gripped. The information output device 65 is connected to an external device and has a device function of outputting information to an external device as an electrical signal.
記憶體59係包含RAM(Random Access Memory,隨機存取記憶體)、ROM(Read Only Memory,唯讀記憶體)等半導體記憶體、硬碟、DVD-ROM(Digital Video Disc-Read Only Memory,數位化通用光碟-唯讀記憶體)等外部記憶裝置之概念。自功能而言,設定記憶記述有零件檢查裝置1之動作之控制順序之程式軟體72的記憶區域、及記憶攝像裝置17所拍攝之圖像之資料即圖像資料73之記憶區域。除此以外,設定用以記憶用以判定電子零件10是否為預定檢查者之資料即作為比較資訊之比較判定資料74的記憶區域。於該比較判定資料74中包含有預定檢查之電子零件10之個體識別編號10c之一覽表。比較判定資料74係使用資訊輸入裝置51b而輸入。除此以外,設定記憶檢測設置於電子零件10之個體識別編號10c而所得之資料即作為識別資訊之個體識別資料75的記憶區域。除此以外,設定用於CPU58之工作區、作為暫時檔案等而發揮功能之記憶區域或其他各種記憶區域。 The memory 59 includes a semiconductor memory such as a RAM (Random Access Memory) or a ROM (Read Only Memory), a hard disk, and a DVD-ROM (Digital Video Disc-Read Only Memory). The concept of external memory devices such as general-purpose optical discs (read-only memory). From the function, the memory area of the program software 72 in which the control sequence of the operation of the parts inspection device 1 and the image of the image captured by the memory imaging device 17, that is, the memory area of the image data 73 are described. In addition to this, a memory area for storing the comparison determination data 74 as the comparison information for determining whether or not the electronic component 10 is a predetermined examiner is set. The comparison determination data 74 includes a list of the individual identification numbers 10c of the electronic components 10 scheduled to be inspected. The comparison determination data 74 is input using the information input device 51b. In addition to this, the data obtained by setting the memory detection to the individual identification number 10c of the electronic component 10 is the memory area of the individual identification material 75 as the identification information. In addition to this, a work area for the CPU 58, a memory area functioning as a temporary file, or the like, or other various memory areas are set.
CPU58係根據記憶於記憶體59內之程式軟體72而進行檢查電子零件10之控制者。具有平台控制部76作為具體之功能實現部。平台控制部76與平台驅動裝置60進行通信而取得各平台之位置資訊。然後,平台控制部76以使各平台移動並停止於所希望之場所之方式對平台驅動裝置60輸出指令信號。進而,平台控制部76與輸送機驅動裝置61進行 通信而取得第1輸送機3~第6輸送機8之位置資訊。然後,平台控制部76以使各輸送機移動並停止於所希望之場所之方式對輸送機驅動裝置61輸出指令信號。 The CPU 58 performs a check of the controller of the electronic component 10 based on the program software 72 stored in the memory 59. The platform control unit 76 is provided as a specific function realization unit. The platform control unit 76 communicates with the platform drive unit 60 to acquire position information of each platform. Then, the platform control unit 76 outputs a command signal to the platform driving device 60 in such a manner that each platform moves and stops at a desired place. Further, the platform control unit 76 performs the same with the conveyor driving device 61. The position information of the first conveyor 3 to the sixth conveyor 8 is obtained by communication. Then, the platform control unit 76 outputs a command signal to the conveyor driving device 61 so that each conveyor moves and stops at a desired place.
除此以外,CPU58具有握持控制部77。握持控制部77使握持部驅動裝置62驅動托盤握持部16、供材零件握持部28、除材零件握持部32、及檢查零件握持部47。然後,對各握持部進行吸附電子零件10之動作與釋放電子零件10之動作之控制。然後,平台控制部76與握持控制部77協作搬送電子零件10。 In addition to this, the CPU 58 has a grip control unit 77. The grip control unit 77 causes the grip driving device 62 to drive the tray grip portion 16 , the material component grip portion 28 , the material removal member grip portion 32 , and the inspection component grip portion 47 . Then, the operation of adsorbing the electronic component 10 and the operation of releasing the electronic component 10 are performed on each of the grip portions. Then, the platform control unit 76 and the grip control unit 77 cooperate to transport the electronic component 10.
除此以外,CPU58具有資料轉換部78。資料轉換部78將攝像裝置17所輸出之電信號轉換為數位資料並將圖像資料73記憶於記憶體59中。除此以外,CPU58具有作為個體識別部之個體識別編號運算部79。個體識別編號運算部79使用由攝像裝置17拍攝所得之圖像資料73而進行抽出個體識別資料75之運算。設置於電子零件10之個體識別編號10c包含文字與數字。而且,個體識別編號運算部79具有辨識個體識別編號10c之圖像資料73為文字並將其轉換為文字資料之文字辨識功能,並將計算出之包含文字資訊之個體識別資料75記憶於記憶體59中。藉由個體識別資料75而對電子零件10進行個體識別。 In addition to this, the CPU 58 has a data conversion unit 78. The data conversion unit 78 converts the electric signal output from the imaging device 17 into digital data and memorizes the image data 73 in the memory 59. In addition to this, the CPU 58 has an individual identification number calculation unit 79 as an individual identification unit. The individual identification number calculation unit 79 performs an operation of extracting the individual identification data 75 using the image data 73 captured by the imaging device 17. The individual identification number 10c provided in the electronic component 10 contains characters and numbers. Further, the individual identification number calculation unit 79 has a character recognition function for recognizing the image data 73 of the individual identification number 10c as a character and converting it into text data, and memorizing the calculated individual identification data 75 containing the text information in the memory. 59. The electronic component 10 is individually identified by the individual identification material 75.
除此以外,CPU58具有作為資訊比較部之個體識別編號判定部80。個體識別編號判定部80對預先記憶於記憶體59中之比較判定資料74與個體識別資料75進行比較。而且,判定計算出之個體識別資料75與比較判定資料74是否一致。於個體識別資料75與比較判定資料74不一致時輸出警報資訊。 In addition to this, the CPU 58 has an individual identification number determining unit 80 as an information comparing unit. The individual identification number determining unit 80 compares the comparison determination data 74 previously stored in the memory 59 with the individual identification data 75. Further, it is determined whether or not the calculated individual identification data 75 matches the comparison determination data 74. The alarm information is output when the individual identification data 75 does not match the comparison determination data 74.
除此以外,CPU58具有資訊顯示控制部81。資訊顯示控制部81於資訊顯示裝置48及資訊顯示裝置51a顯示計算出之個體識別資料75。進而,資訊顯示控制部81將個體識別編號判定部80判定之結果顯示於資訊顯示裝置48及資訊顯示裝置51a。於個體識別資料75與比較判定 資料74不一致時,資訊顯示控制部81使警告燈52閃爍。而且,資訊顯示控制部81將表示個體識別資料75與比較判定資料74不一致之警報資訊顯示於資訊顯示裝置48及資訊顯示裝置51a而通知操作者。 In addition to this, the CPU 58 has an information display control unit 81. The information display control unit 81 displays the calculated individual identification data 75 on the information display device 48 and the information display device 51a. Further, the information display control unit 81 displays the result of the determination by the individual identification number determining unit 80 on the information display device 48 and the information display device 51a. On individual identification data 75 and comparison judgment When the data 74 does not match, the information display control unit 81 blinks the warning light 52. Further, the information display control unit 81 displays the alarm information indicating that the individual identification data 75 does not match the comparison determination data 74 on the information display device 48 and the information display device 51a, and notifies the operator.
除此以外,CPU58具有資訊輸出控制部82。資訊輸出控制部82經由資訊輸出裝置65而對外部機器輸出個體識別資料75及個體識別編號判定部80判定之結果。藉此,外部機器可活用個體識別資料75,進行與個體識別編號判定部80判定之結果相對應之動作。 In addition to this, the CPU 58 has an information output control unit 82. The information output control unit 82 outputs the result of the determination by the individual identification data 75 and the individual identification number determining unit 80 to the external device via the information output device 65. Thereby, the external device can use the individual identification data 75 to perform an operation corresponding to the result of the determination by the individual identification number determining unit 80.
再者,於本實施形態中,上述各功能係使用CPU58藉由程式軟體而實現,但於上述各功能可藉由未使用CPU58之單獨之電子電路(硬體)而實現之情形時,亦可使用此種電子電路。 Furthermore, in the present embodiment, each of the above-described functions is realized by the program software using the CPU 58. However, when the above functions can be realized by using a separate electronic circuit (hardware) of the CPU 58, Use such an electronic circuit.
其次,藉由圖6~圖8對使用上述零件檢查裝置1檢查電子零件10之方法進行說明。圖7及圖8係用以說明電子零件之檢查方法之模式圖。 Next, a method of inspecting the electronic component 10 using the above-described component inspection device 1 will be described with reference to FIGS. 6 to 8. 7 and 8 are schematic views for explaining an inspection method of an electronic component.
圖6係表示電子零件之檢查方法之流程圖。於圖6中,步驟S1相當於比較資訊輸入步驟。係操作者使用資訊輸入裝置51b輸入比較判定資料74之步驟。其次進行至步驟S2。步驟S2相當於托盤設置步驟。該步驟係操作者於第1輸送機3設置托盤9之步驟。其次進行至步驟S3。步驟S3相當於標記攝像步驟。該步驟係攝像裝置17拍攝電子零件10之步驟。其次進行至步驟S4。步驟S4相當於識別資訊運算步驟。該步驟係個體識別編號運算部79使用圖像運算個體識別資料75之步驟。其次進行至步驟S5。 Fig. 6 is a flow chart showing a method of inspecting an electronic component. In Fig. 6, step S1 corresponds to a comparison information input step. The operator inputs the comparison determination data 74 using the information input device 51b. Next, proceed to step S2. Step S2 is equivalent to the tray setting step. This step is a step in which the operator sets the tray 9 on the first conveyor 3. Next, proceed to step S3. Step S3 corresponds to the mark imaging step. This step is a step in which the imaging device 17 captures the electronic component 10. Next, proceed to step S4. Step S4 is equivalent to the identification information operation step. This step is a step in which the individual identification number calculation unit 79 calculates the individual identification material 75 using the image. Next, proceed to step S5.
步驟S5係相當於個體識別判定步驟之步驟。於該步驟中,個體識別編號判定部80對比較判定資料74與個體識別資料75進行比較。當資料不一致時進行至步驟S10。當資料一致時進行至步驟S6。步驟S6係相當於確認結束判定步驟之步驟。於該步驟中,CPU58判定是否已 全部確認設置於托盤9中之電子零件10。於托盤9內存在未確認之電子零件10時進行至步驟S3。當已全部確認托盤9內之電子零件10時進行至步驟S7。 Step S5 corresponds to the step of the individual identification determining step. In this step, the individual identification number determining unit 80 compares the comparison determination data 74 with the individual identification material 75. When the data is inconsistent, it proceeds to step S10. When the data is consistent, it proceeds to step S6. Step S6 corresponds to the step of confirming the end determination step. In this step, the CPU 58 determines whether it has All the electronic components 10 provided in the tray 9 are confirmed. When the unconfirmed electronic component 10 is present in the tray 9, the process proceeds to step S3. When all the electronic components 10 in the tray 9 have been confirmed, the process proceeds to step S7.
步驟S7相當於檢查步驟。於該步驟中,搬送部1b將電子零件10搬送至檢查用插槽34中,檢查部1a檢查電子零件10之電性特性。然後,係搬送部1b將經檢查之電子零件10收納於托盤9中之步驟。其次進行至步驟S8。步驟S8相當於空托盤移動步驟。該步驟係托盤搬送部11於第1輸送機3~第6輸送機8之間移動空托盤9之步驟。其次進行至步驟S9。步驟S9相當於托盤除去步驟。該步驟係操作者自第4輸送機6~第6輸送機8除去收納有檢查過之電子零件10之托盤9的步驟。自步驟S5後行進之步驟S10相當於異常報知步驟。該步驟係通知操作者比較判定資料74與個體識別資料75不一致之步驟。藉由以上步驟而結束檢查電子零件10之步驟。 Step S7 is equivalent to the inspection step. In this step, the transport unit 1b transports the electronic component 10 to the inspection slot 34, and the inspection unit 1a checks the electrical characteristics of the electronic component 10. Then, the transport unit 1b stores the inspected electronic component 10 in the tray 9. Next, proceed to step S8. Step S8 corresponds to the empty tray moving step. This step is a step in which the tray transport unit 11 moves the empty tray 9 between the first conveyor 3 and the sixth conveyor 8. Next, the process proceeds to step S9. Step S9 corresponds to the tray removing step. This step is a step in which the operator removes the tray 9 in which the inspected electronic component 10 is housed from the fourth conveyor 6 to the sixth conveyor 8. Step S10, which proceeds from step S5, corresponds to the abnormality notification step. This step is a step of notifying the operator to compare the determination data 74 with the individual identification data 75. The step of inspecting the electronic component 10 is ended by the above steps.
其次,使用圖7及圖8,與圖6所示之步驟相對應地詳細說明電子零件10之檢查方法。首先,於步驟S1之比較資訊輸入步驟中,操作者使用資訊輸入裝置51b輸入預定檢查之品種顯示名10b及個體識別編號10c。輸入之資料係作為比較判定資料74之一覽表而記憶於記憶體59中。 Next, the inspection method of the electronic component 10 will be described in detail using FIG. 7 and FIG. 8 in correspondence with the steps shown in FIG. 6. First, in the comparison information input step of step S1, the operator inputs the item display name 10b and the individual identification number 10c of the predetermined inspection using the information input device 51b. The input data is stored in the memory 59 as a list of comparison determination data 74.
個體識別編號10c包含文字與數字。當設置於1個托盤9中之複數個電子零件10之個體識別編號10c包含連續之數字時,亦可由操作者輸入連續之數字之最初與最後之數字,並由CPU58運算之間之數字而進行登錄。除此以外,當已經於其他機器中記憶有個體識別編號10c之資料時,亦可藉由經由資訊輸入裝置51b進行通信而輸入資料並將其作為比較判定資料74記憶於記憶體59中。 The individual identification number 10c contains text and numbers. When the individual identification number 10c of the plurality of electronic components 10 disposed in one of the trays 9 includes consecutive numbers, the operator may input the first and last digits of the consecutive digits, and the number between the CPUs 58 is calculated. log in. In addition, when the data of the individual identification number 10c is already stored in another device, the data can be input by communication via the information input device 51b and stored in the memory 59 as the comparison determination data 74.
圖7(a)係與步驟S2之托盤設置步驟相對應之圖。如圖7(a)所示,操作者於托盤9中排列並設置電子零件10。該電子零件10係於步驟S1 之比較資訊輸入步驟中登錄有比較判定資料74者,且係接下來預定進行電特性檢查者。其次,操作者將設置有電子零件10之托盤9載置於第1輸送機3中。 Fig. 7(a) is a view corresponding to the tray setting step of step S2. As shown in FIG. 7(a), the operator arranges and sets the electronic component 10 in the tray 9. The electronic component 10 is in step S1 In the comparison information input step, the comparison determination data 74 is registered, and the electric property checker is scheduled to be next. Next, the operator places the tray 9 provided with the electronic component 10 in the first conveyor 3.
圖7(b)及圖7(c)係與步驟S3之標記攝像步驟相對應之圖。如圖7(b)所示,於步驟S3中平台控制部76使輸送機驅動裝置61驅動第1輸送機3。然後,平台控制部76使電子零件10沿第1方向3c移動。進而,平台控制部76使平台驅動裝置60驅動托盤移動平台14。然後,平台控制部76使攝像裝置17沿第2方向14a移動。藉此,平台控制部76可使攝像裝置17與檢查對象之電子零件10移動至相對向之場所。其次,攝像裝置17使同軸落射照明裝置射出光而照射電子零件10,並驅動自動調焦裝置於電子零件10對焦。然後,拍攝電子零件10。 7(b) and 7(c) are diagrams corresponding to the mark imaging step of step S3. As shown in FIG. 7(b), the platform control unit 76 causes the conveyor driving device 61 to drive the first conveyor 3 in step S3. Then, the platform control unit 76 moves the electronic component 10 in the first direction 3c. Further, the platform control unit 76 causes the stage drive unit 60 to drive the tray moving platform 14. Then, the platform control unit 76 moves the imaging device 17 in the second direction 14a. Thereby, the platform control unit 76 can move the imaging device 17 and the electronic component 10 to be inspected to a position opposite thereto. Next, the imaging device 17 causes the coaxial epi-illumination device to emit light to illuminate the electronic component 10, and drives the autofocus device to focus on the electronic component 10. Then, the electronic component 10 is photographed.
其結果為,如圖7(c)所示,拍攝出拍攝有電子零件10之圖像84。於圖像84中拍攝有與製造商名10a相對應之製造商名圖像84a、與品種顯示名10b相對應之品種顯示名圖像84b、及與個體識別編號10c相對應之個體識別編號圖像84c。然後,資料轉換部78將表示圖像之類比電信號轉換為數位資料而設為圖像資料73。資料轉換部78將圖像資料73記憶於記憶體59中。 As a result, as shown in FIG. 7(c), an image 84 on which the electronic component 10 is imaged is taken. A manufacturer name image 84a corresponding to the manufacturer name 10a, a variety display name image 84b corresponding to the article display name 10b, and an individual identification number map corresponding to the individual identification number 10c are captured in the image 84. Like 84c. Then, the material conversion unit 78 converts the analog electrical signal representing the image into digital data and sets it as the image data 73. The data conversion unit 78 stores the image material 73 in the memory 59.
於步驟S4之識別資訊運算步驟中,首先,個體識別編號運算部79自圖像84抽出個體識別編號圖像84c。由於個體識別編號圖像84c之位置係預先設定,因此可藉由匹配特定之標記圖像與圖像84而抽出個體識別編號圖像84c。其次,個體識別編號運算部79以個體識別編號圖像84c之連續之線段作為線索而將個體識別編號圖像84c分離為個別之文字圖像。繼而,判定文字圖像接近數字「1」~「9」與字母「A」~「Z」中之哪個文字。此時,計算出文字圖像中包含之縱線之數量、橫線之數量、斜線之數量、曲線之數量、及交點之數量等特徵量。預先於記憶體59中記憶有各文字及數字之特徵量。然後,對文 字圖像之特徵量與已知文字之特徵量進行比較並進行判定。如此,個體識別編號運算部79根據個體識別編號圖像84c而計算出個體識別資料75並記憶於記憶體59中。再者,根據個體識別編號圖像84c計算個體識別資料75之方法並不限定於該方法,可使用眾所周知之方法。 In the identification information calculation step of step S4, first, the individual identification number calculation unit 79 extracts the individual identification number image 84c from the image 84. Since the position of the individual identification number image 84c is set in advance, the individual identification number image 84c can be extracted by matching the specific marker image with the image 84. Next, the individual identification number calculation unit 79 separates the individual identification number image 84c into individual character images using the continuous line segment of the individual identification number image 84c as a clue. Then, it is determined which text of the character "1" to "9" and the letters "A" to "Z" are close to the character image. At this time, the feature quantity such as the number of vertical lines included in the character image, the number of horizontal lines, the number of oblique lines, the number of curves, and the number of intersection points are calculated. The feature quantity of each character and number is memorized in the memory 59 in advance. Then, the text The feature amount of the word image is compared with the feature amount of the known character and determined. In this manner, the individual identification number calculation unit 79 calculates the individual identification material 75 based on the individual identification number image 84c and stores it in the memory 59. Furthermore, the method of calculating the individual identification material 75 based on the individual identification number image 84c is not limited to this method, and a well-known method can be used.
於步驟S5之個體識別判定步驟中,檢索於步驟S4中計算出之個體識別資料75是否存在於比較判定資料74之一覽表中。當個體識別資料75存在於比較判定資料74中時,判斷為正常狀態。然後,進行至步驟S6之確認結束判定步驟。於步驟S6中,判斷是否全部已確認設置於托盤9中之電子零件10。然後,反覆進行步驟S3~步驟S5直至已全部確認設置於托盤9中之電子零件10為止。於步驟S6中當已全部確認設置於托盤9中之電子零件10時,進行至步驟S7。 In the individual identification determining step of step S5, it is searched whether or not the individual identification data 75 calculated in step S4 exists in the list of comparison determination materials 74. When the individual identification material 75 is present in the comparison determination data 74, it is determined to be in a normal state. Then, the process proceeds to the confirmation end determination step of step S6. In step S6, it is determined whether or not all of the electronic components 10 provided in the tray 9 have been confirmed. Then, steps S3 to S5 are repeatedly performed until all the electronic components 10 provided in the tray 9 have been confirmed. When all the electronic components 10 provided in the tray 9 have been confirmed in step S6, the process proceeds to step S7.
於步驟S5中,當個體識別資料75不存在於比較判定資料74中時,判斷為混入有無檢查預定之電子零件10之異常狀態而進行至步驟S10。於步驟S10之異常報知步驟中,於資訊顯示裝置48及資訊顯示裝置51a中顯示混入有預定外之電子零件10之情況。進而,警告燈52閃爍而通知操作者處於異常狀態。進而,亦可自資訊輸出控制部82與外部機器進行通信而通知處於異常狀態。於任一情形時操作者均可進行替換電子零件10之作業,從而修正為將預定之電子零件10設置於托盤9中之正常狀態。 In step S5, when the individual identification data 75 does not exist in the comparison determination data 74, it is determined that the abnormal state of the electronic component 10 in which the inspection is scheduled is mixed, and the process proceeds to step S10. In the abnormality notification step of step S10, the information display device 48 and the information display device 51a are displayed in a state in which the predetermined electronic component 10 is mixed. Further, the warning light 52 blinks to notify the operator that the abnormal state is present. Further, the information output control unit 82 may communicate with an external device to notify that the abnormal state is present. In either case, the operator can perform the work of replacing the electronic component 10, thereby correcting the normal state in which the predetermined electronic component 10 is placed in the tray 9.
圖7(d)~圖8(b)係與步驟S7之檢查步驟相對應之圖。如圖7(d)所示,於步驟S7中平台控制部76使輸送機驅動裝置61驅動第1輸送機3而使托盤9接近零件除供材部20。其次,平台控制部76使平台驅動裝置60移動第1往返平台36。然後,使供材用凹部37a移動至供材零件握持部28之移動範圍內。 7(d) to 8(b) are diagrams corresponding to the inspection steps of step S7. As shown in FIG. 7(d), in step S7, the platform control unit 76 causes the conveyor driving device 61 to drive the first conveyor 3 to bring the tray 9 closer to the component removal unit 20. Next, the platform control unit 76 causes the platform drive unit 60 to move the first shuttle platform 36. Then, the supply recessed portion 37a is moved into the movement range of the supply member grip portion 28.
繼而,平台控制部76及握持控制部77使平台驅動裝置60及握持部驅動裝置62驅動零件供材部29,使托盤9上之4個電子零件10移動至 供材用凹部37a中。其次,如圖8(a)所示,平台控制部76使平台驅動裝置60移動第1往返平台36而使供材用凹部37a移動至檢查用插槽34旁。 Then, the platform control unit 76 and the grip control unit 77 cause the platform driving device 60 and the grip driving device 62 to drive the component feeding unit 29 to move the four electronic components 10 on the tray 9 to In the supply recess 37a. Next, as shown in FIG. 8(a), the platform control unit 76 moves the platform driving device 60 to the first shuttle platform 36 to move the supply recess 37a to the side of the inspection slot 34.
繼而,平台控制部76及握持控制部77使平台驅動裝置60及握持部驅動裝置62驅動零件按壓裝置43。然後,握持控制部77使檢查零件握持部47握持電子零件10。其次,平台控制部76使測定X平台46及測定Z平台71移動而使電子零件10自供材用凹部37a移動至檢查用插槽34。 Then, the platform control unit 76 and the grip control unit 77 cause the table driving device 60 and the grip driving device 62 to drive the component pressing device 43. Then, the grip control unit 77 causes the inspection component grip portion 47 to hold the electronic component 10. Next, the platform control unit 76 moves the measurement X stage 46 and the measurement Z stage 71 to move the electronic component 10 from the supply recess 37a to the inspection slot 34.
繼而,平台控制部76使零件按壓裝置43將電子零件10按壓至檢查用插槽34中。藉此,檢查用插槽34之探針與子零件10之端子導通。其次,電特性檢查裝置50與電子零件10進行通信從而檢查電子零件10之電性特性。 Then, the platform control unit 76 causes the component pressing device 43 to press the electronic component 10 into the inspection slot 34. Thereby, the probe of the inspection slot 34 is electrically connected to the terminal of the sub-assembly 10. Next, the electrical property inspection device 50 communicates with the electronic component 10 to check the electrical characteristics of the electronic component 10.
於電特性檢查裝置50檢查電子零件10之電性特性之期間,平台控制部76使第1往返平台36移動而將除材用凹部37b移動至檢查用插槽34旁。繼而,平台控制部76使第2往返平台41移動。然後,使供材用凹部42a移動至供材零件握持部28之移動範圍內。其次,平台控制部76及握持控制部77使平台驅動裝置60及握持部驅動裝置62驅動零件供材部29,將托盤9上之4個電子零件10移動至第2往返平台41之供材用凹部42a。其次,平台控制部76使平台驅動裝置60移動第2往返平台41,而使供材用凹部42a移動至檢查用插槽34旁。然後,搬送部1b待機至電子零件10之檢查結束為止。 While the electrical property inspection device 50 inspects the electrical characteristics of the electronic component 10, the platform control unit 76 moves the first shuttle platform 36 to move the removal recess 37b to the side of the inspection slot 34. Then, the platform control unit 76 moves the second shuttle platform 41. Then, the supply recess 42a is moved into the movement range of the supply member grip portion 28. Next, the platform control unit 76 and the grip control unit 77 cause the platform drive unit 60 and the grip unit drive unit 62 to drive the component supply unit 29, and move the four electronic components 10 on the tray 9 to the second shuttle platform 41. The material recess 42a. Next, the platform control unit 76 moves the platform driving device 60 to move the second shuttle platform 41, and moves the supply recess 42a to the side of the inspection slot 34. Then, the transport unit 1b waits until the inspection of the electronic component 10 is completed.
電子零件10之檢查結束後,平台控制部76使平台驅動裝置60移動測定X平台46及測定Z平台71,將電子零件10自檢查用插槽34移動至第1往返平台36之除材用凹部37b。 After the inspection of the electronic component 10 is completed, the platform control unit 76 causes the platform drive unit 60 to move the measurement X stage 46 and the measurement Z stage 71, and moves the electronic component 10 from the inspection slot 34 to the removal recess of the first shuttle platform 36. 37b.
繼而,平台控制部76及握持控制部77使平台驅動裝置60及握持部驅動裝置62驅動零件按壓裝置43。然後,握持控制部77使檢查零件握持部47握持位於供材用凹部42a之電子零件10。其次,平台控制部 76使平台驅動裝置60移動測定X平台46及測定Z平台71,從而將電子零件10自供材用凹部42a移動至檢查用插槽34。 Then, the platform control unit 76 and the grip control unit 77 cause the table driving device 60 and the grip driving device 62 to drive the component pressing device 43. Then, the grip control unit 77 causes the inspection component grip portion 47 to grip the electronic component 10 located in the supply recess 42a. Second, the platform control department When the platform driving device 60 moves the measurement X stage 46 and the measurement Z stage 71, the electronic component 10 is moved from the supply recess 42a to the inspection slot 34.
繼而,平台控制部76使檢查零件握持部47將電子零件10按壓至檢查用插槽34中。此時,檢查用插槽34之探針與電子零件10之端子導通。其次,電特性檢查裝置50與電子零件10進行通信從而檢查電子零件10之電性特性。 Then, the platform control unit 76 causes the inspection component grip portion 47 to press the electronic component 10 into the inspection slot 34. At this time, the probe of the inspection slot 34 is electrically connected to the terminal of the electronic component 10. Next, the electrical property inspection device 50 communicates with the electronic component 10 to check the electrical characteristics of the electronic component 10.
於電特性檢查裝置50檢查電子零件10之電性特性之期間,平台控制部76使平台驅動裝置60移動第2往返平台41。然後,平台驅動裝置60使除材用凹部42b移動至檢查用插槽34旁。其次,平台控制部76使平台驅動裝置60移動第1往返平台36。然後,平台驅動裝置60使除材用凹部37b移動至除材零件握持部32之移動範圍內。繼而,平台控制部76及握持控制部77使除材零件握持部32握持電子零件10。 While the electrical property inspection device 50 checks the electrical characteristics of the electronic component 10, the platform control unit 76 causes the platform drive device 60 to move the second shuttle platform 41. Then, the stage driving device 60 moves the removing recess 42b to the side of the inspection slot 34. Next, the platform control unit 76 causes the platform drive unit 60 to move the first shuttle platform 36. Then, the stage driving device 60 moves the removing recess 37b into the moving range of the removing member grip portion 32. Then, the platform control unit 76 and the grip control unit 77 hold the electronic component 10 by the unloading component grip portion 32.
電特性檢查之結果為經檢查之電子零件10為良品時,平台控制部76使零件除材部33將電子零件10載置於第5輸送機7或第6輸送機8上之托盤9中。電特性檢查之結果為電子零件10為不良品時,平台控制部76使零件除材部33將電子零件10載置於第4輸送機6上之托盤9中。 As a result of the electrical characteristic inspection, when the electronic component 10 to be inspected is a good product, the platform control unit 76 causes the component removing unit 33 to mount the electronic component 10 on the tray 9 on the fifth conveyor 7 or the sixth conveyor 8. As a result of the electrical characteristic inspection, when the electronic component 10 is a defective product, the platform control unit 76 causes the component removal unit 33 to mount the electronic component 10 on the tray 9 on the fourth conveyor 6.
其次,平台控制部76使平台驅動裝置60驅動第1往返平台36。而使供材用凹部37a移動至供材零件握持部28之移動範圍內。如此,零件供材部29、第1往返平台36、第2往返平台41、零件按壓裝置43將電子零件10自第1輸送機3上之托盤9移動至檢查用插槽34中。然後,檢查用插槽34及電特性檢查裝置50檢查電子零件10之電性特性。其次,零件按壓裝置43將電子零件10自檢查用插槽34移動至第1往返平台36或第2往返平台41。 Next, the platform control unit 76 causes the platform drive unit 60 to drive the first shuttle platform 36. The supply recessed portion 37a is moved to the movement range of the supply member grip portion 28. In this manner, the component supply unit 29 , the first reciprocating platform 36 , the second reciprocating platform 41 , and the component pressing device 43 move the electronic component 10 from the tray 9 on the first conveyor 3 to the inspection slot 34 . Then, the inspection socket 34 and the electrical property inspection device 50 check the electrical characteristics of the electronic component 10. Next, the component pressing device 43 moves the electronic component 10 from the inspection slot 34 to the first shuttle platform 36 or the second shuttle platform 41.
如圖8(b)所示,其次,零件除材部33將電子零件10自第1往返平台36或第2往返平台41移動至第4輸送機6~第6輸送機8上之托盤9。依序反覆進行該動作而進行電子零件10之電特性檢查。再者,各電子零 件10之電特性檢查之判定結果係記憶於記憶體59中,並顯示於資訊顯示裝置48及資訊顯示裝置51a中。又,電特性檢查之判定結果可藉由資訊輸出裝置65而自記憶體59輸出至外部機器。 As shown in FIG. 8( b ), the component removing unit 33 moves the electronic component 10 from the first shuttle platform 36 or the second shuttle platform 41 to the tray 9 on the fourth conveyor 6 to the sixth conveyor 8 . This operation is repeatedly performed in sequence to perform electrical characteristic inspection of the electronic component 10. Furthermore, each electronic zero The result of the determination of the electrical characteristic of the device 10 is stored in the memory 59 and displayed in the information display device 48 and the information display device 51a. Further, the determination result of the electrical characteristic check can be output from the memory 59 to the external device by the information output device 65.
圖8(c)係與步驟S8之空托盤移動步驟相對應之圖。如圖8(c)所示,於步驟S8中,平台控制部76使平台驅動裝置60移動托盤移動平台14,並使輸送機驅動裝置61驅動第1輸送機3。然後,平台控制部76以使電子零件10被移動而變空之托盤9與托盤握持部16相對向之方式使托盤9與托盤握持部16進行移動。 Fig. 8(c) is a view corresponding to the empty tray moving step of step S8. As shown in FIG. 8(c), in step S8, the platform control unit 76 causes the stage driving device 60 to move the tray moving platform 14, and causes the conveyor driving device 61 to drive the first conveyor 3. Then, the platform control unit 76 moves the tray 9 and the tray grip portion 16 such that the tray 9 that is moved and the electronic component 10 is moved is opposed to the tray grip portion 16.
其次,平台控制部76使平台驅動裝置60驅動設置於托盤握持部16之托盤升降平台68而使托盤握持部16下降。繼而,平台控制部76對握持部驅動裝置62輸出指令信號而使托盤握持部16握持托盤9。其次,平台控制部76對平台驅動裝置60及握持部驅動裝置62輸出指令信號而使托盤9移動至第2輸送機4上或第3輸送機5上。 Next, the platform control unit 76 causes the table driving device 60 to drive the tray lifting platform 68 provided on the tray holding portion 16 to lower the tray holding portion 16. Then, the platform control unit 76 outputs a command signal to the grip driving device 62 to cause the tray grip portion 16 to grip the tray 9. Next, the platform control unit 76 outputs a command signal to the platform driving device 60 and the grip driving device 62 to move the tray 9 to the second conveyor 4 or the third conveyor 5.
當於第4輸送機6~第6輸送機8上之托盤9中不存在載置電子零件10之場所,而存在設置托盤9之場所時,平台控制部76對平台驅動裝置60、輸送機驅動裝置61、握持部驅動裝置62輸出指令信號。然後,平台控制部76使托盤9自第2輸送機4及第3輸送機5移動至第4輸送機6~第6輸送機8上。 When there is no place where the electronic component 10 is placed in the tray 9 on the fourth conveyor 6 to the sixth conveyor 8, and the place where the tray 9 is placed, the platform control unit 76 drives the platform driving device 60 and the conveyor. The device 61 and the grip driving device 62 output a command signal. Then, the platform control unit 76 moves the tray 9 from the second conveyor 4 and the third conveyor 5 to the fourth conveyor 6 to the sixth conveyor 8.
圖8(d)係與步驟S9之托盤除去步驟相對應之圖。如圖8(d)所示,於步驟S9中,平台控制部76對輸送機驅動裝置61輸出指令信號。然後,平台控制部76使輸送機驅動裝置61驅動第4輸送機6~第6輸送機8,將載置有電子零件10之托盤9移動至外殼53之外側。繼而,操作者自零件檢查裝置1除去載置有電子零件10之托盤9而搬送至後續步驟之作業場所。藉由以上步驟而結束檢查電子零件10之步驟。 Fig. 8(d) is a view corresponding to the tray removing step of step S9. As shown in FIG. 8(d), in step S9, the platform control unit 76 outputs a command signal to the conveyor driving device 61. Then, the platform control unit 76 causes the conveyor driving device 61 to drive the fourth conveyor 6 to the sixth conveyor 8, and moves the tray 9 on which the electronic component 10 is placed to the outside of the casing 53. Then, the operator removes the tray 9 on which the electronic component 10 is placed from the component inspection device 1 and transports it to the work site in the subsequent step. The step of inspecting the electronic component 10 is ended by the above steps.
如上所述,根據本實施形態,具有以下效果。 As described above, according to the present embodiment, the following effects are obtained.
(1)根據本實施形態,於托盤9中載置電子零件10,且該托盤9係 設置於零件檢查裝置1。於電子零件10上設置個體識別編號10c,且攝像裝置17拍攝個體識別編號10c。而且,根據個體識別編號運算部79所拍攝之個體識別編號10c而運算電子零件10之個體識別資料75。因此,零件檢查裝置1可辨識電子零件10之個體識別資料75。 (1) According to this embodiment, the electronic component 10 is placed on the tray 9, and the tray 9 is It is installed in the part inspection device 1. The individual identification number 10c is set on the electronic component 10, and the imaging device 17 captures the individual identification number 10c. Then, the individual identification material 75 of the electronic component 10 is calculated based on the individual identification number 10c captured by the individual identification number calculation unit 79. Therefore, the part inspection device 1 can recognize the individual identification material 75 of the electronic component 10.
(2)根據本實施形態,零件檢查裝置1包括第1輸送機3及托盤搬送部11。第1輸送機3沿第1方向3c移動托盤9。托盤搬送部11沿與第1方向3c交叉之第2方向14a移動攝像裝置17。因此,藉由驅動第1輸送機3與托盤搬送部11驅動從而零件檢查裝置1可使托盤9與攝像裝置17於二維方向上進行相對移動。因此,即便於在托盤9上呈矩陣狀地載置有複數個電子零件10時零件檢查裝置1亦可辨識各電子零件10之個體識別資料75。 (2) According to the present embodiment, the component inspection device 1 includes the first conveyor 3 and the tray conveyance unit 11. The first conveyor 3 moves the tray 9 in the first direction 3c. The tray transport unit 11 moves the imaging device 17 in the second direction 14a that intersects the first direction 3c. Therefore, the component inspection device 1 can relatively move the tray 9 and the imaging device 17 in the two-dimensional direction by driving the first conveyor 3 and the tray conveyance unit 11 to be driven. Therefore, the component inspection device 1 can recognize the individual identification data 75 of each electronic component 10 even when a plurality of electronic components 10 are placed in a matrix on the tray 9.
於如專利文獻1之IC處理機中,托盤移送部僅沿一方向移動,即便於可在托盤移送部中設置檢測器件之情形時,亦無法全數識別IC。由於零件檢查裝置1可使托盤9與攝像裝置17於二維方向上進行相對移動,因此可全數識別設置於托盤上之IC。 In the IC processor of Patent Document 1, the tray transfer unit moves only in one direction, and even when the detection device can be provided in the tray transfer unit, the IC cannot be recognized in its entirety. Since the part inspection device 1 can relatively move the tray 9 and the image pickup device 17 in the two-dimensional direction, the IC provided on the tray can be recognized in its entirety.
(3)根據本實施形態,零件檢查裝置1包括零件供材部29及托盤搬送部11。零件供材部29自托盤9依序移動電子零件10。藉此,托盤9成為未載置電子零件10之狀態。托盤搬送部11沿第2方向14a移動托盤9。藉此,可自第1輸送機3移除托盤9。而且,移動空托盤9之部位與移動攝像裝置17之部位成為具有共用之移動機構之托盤移動平台14。因此,與設置用以移動空托盤9之移動機構與用以移動攝像裝置17之移動機構的2個移動機構時相比可成為簡單之構造。 (3) According to the present embodiment, the component inspection device 1 includes the component supply unit 29 and the tray conveyance unit 11. The part feeding portion 29 sequentially moves the electronic component 10 from the tray 9. Thereby, the tray 9 is in a state in which the electronic component 10 is not placed. The tray transport unit 11 moves the tray 9 in the second direction 14a. Thereby, the tray 9 can be removed from the first conveyor 3. Further, the portion where the empty tray 9 is moved and the portion of the moving image pickup device 17 become the tray moving platform 14 having the shared moving mechanism. Therefore, it is simpler than the case where the moving mechanism for moving the empty tray 9 and the two moving mechanisms for moving the moving mechanism of the image pickup unit 17 are provided.
(4)根據本實施形態,資訊顯示裝置48、資訊顯示裝置51a及資訊輸出裝置65輸出個體識別資料75。因此,可活用電子零件10之個體識別資料75。 (4) According to the present embodiment, the information display device 48, the information display device 51a, and the information output device 65 output the individual identification data 75. Therefore, the individual identification material 75 of the electronic component 10 can be utilized.
(5)根據本實施形態,資訊顯示裝置48及資訊顯示裝置51a顯示個 體識別資料75。因此,操作者可確認電子零件10之個體識別資料75而進行與個體識別資料75相應之應對。 (5) According to the present embodiment, the information display device 48 and the information display device 51a display Body identification data 75. Therefore, the operator can confirm the individual identification material 75 of the electronic component 10 and perform the response corresponding to the individual identification material 75.
(6)根據本實施形態,資訊輸出裝置65將個體識別資料75輸出至外部機器。因此,外部機器可確認電子零件10之個體識別資料75而進行與個體識別資料75相應之應對。 (6) According to the present embodiment, the information output device 65 outputs the individual identification data 75 to an external device. Therefore, the external device can confirm the individual identification data 75 of the electronic component 10 and perform the response corresponding to the individual identification material 75.
(7)根據本實施形態,於托盤搬送部11設置有攝像裝置17。攝像裝置17除托盤搬送部11以外可設置於零件供材部29。零件供材部29係移動電子零件10之部位。由於電子零件10之個數多於托盤9之個數,因此與較快地移動托盤9相比較快地移動電子零件10有助於生產性之提高。 (7) According to the present embodiment, the image pickup device 17 is provided in the tray transport unit 11. The imaging device 17 can be provided in the component feeding unit 29 in addition to the tray conveying unit 11 . The part feeding portion 29 is a portion that moves the electronic component 10. Since the number of the electronic parts 10 is more than the number of the trays 9, moving the electronic parts 10 faster than moving the trays 9 faster contributes to the improvement in productivity.
而且,當於零件供材部29之供材X平台27設置攝像裝置17時供材X平台27變重,因此移動速度降低。因此,於該構造中零件供材部29移動電子零件10需要較長時間。與該構造相比,於本實施形態中於托盤搬送部11設置有攝像裝置17,因此可生產性良好地使電子零件10移動。 Further, when the image pickup device 17 is placed on the supply X platform 27 of the parts supply unit 29, the supply material X platform 27 becomes heavy, and thus the moving speed is lowered. Therefore, it takes a long time for the part feeding portion 29 to move the electronic component 10 in this configuration. In the present embodiment, the image pickup device 17 is provided in the tray transport unit 11 as compared with this configuration. Therefore, the electronic component 10 can be moved with good productivity.
其次,使用圖9對顯示有個體識別編號之電子零件及零件檢查裝置之一實施形態進行說明。圖9(a)係用以說明電子零件之模式平面圖,圖9(b)係表示零件檢查裝置之構造之模式側視圖。本實施形態與第1實施形態之不同之處在於:品種顯示名10b或個體識別編號10c之顯示使用條碼。再者,省略與第1實施形態為相同點之說明。 Next, an embodiment of an electronic component and a component inspection device showing an individual identification number will be described with reference to FIG. Fig. 9(a) is a schematic plan view for explaining an electronic component, and Fig. 9(b) is a schematic side view showing the configuration of the component inspection device. This embodiment differs from the first embodiment in that a bar code is used for display of the product display name 10b or the individual identification number 10c. Further, the description of the same points as those of the first embodiment will be omitted.
即,於本實施形態中,如圖9(a)所示,於電子零件85上印刷有表示製造商名85a、品種顯示名85b、及個體識別編號85c之字串。進而,於電子零件85上印刷有以條碼顯示品種顯示名85b之品種條碼85d、及以條碼顯示個體識別編號85c之作為識別資訊之個體識別條碼85e。再者,文字或條碼之內容或配置等屬性並無特別限定,係針對 每個電子零件85而進行設定。 That is, in the present embodiment, as shown in FIG. 9(a), a character string indicating the manufacturer name 85a, the product display name 85b, and the individual identification number 85c is printed on the electronic component 85. Further, the electronic component 85 is printed with a bar code 85d for displaying the article display name 85b in the bar code and an individual identification bar code 85e for displaying the individual identification number 85c as the identification information. Furthermore, the attributes such as the content or configuration of the text or bar code are not particularly limited. Each electronic component 85 is set.
如圖9(b)所示,於零件檢查裝置86中在托盤移動平台14中設置有條碼讀取器87。條碼讀取器87對品種條碼85d及個體識別條碼85e射出光線87a而進行掃描。然後,條碼讀取器87接收反射光,將反射光之光強度信號轉換為條碼所示之文字資訊。該文字資訊為個體識別資料75。CPU58自條碼讀取器87輸入文字資訊並將其記憶於記憶體59中。 As shown in FIG. 9(b), a bar code reader 87 is provided in the tray moving platform 14 in the part inspection device 86. The barcode reader 87 scans the varietal barcode 85d and the individual identification barcode 85e to emit light ray 87a. Then, the barcode reader 87 receives the reflected light and converts the light intensity signal of the reflected light into the text information indicated by the barcode. The text information is individual identification data 75. The CPU 58 inputs text information from the barcode reader 87 and memorizes it in the memory 59.
如上所述,根據本實施形態,具有以下效果。 As described above, according to the present embodiment, the following effects are obtained.
(1)根據本實施形態,零件檢查裝置86具有條碼讀取器87。因此,於電子零件85之識別資訊包含條碼時亦可容易地根據識別資訊而辨識個體識別資料75。 (1) According to the present embodiment, the component inspection device 86 has a bar code reader 87. Therefore, the individual identification material 75 can be easily recognized based on the identification information when the identification information of the electronic component 85 includes the barcode.
(2)根據本實施形態,零件檢查裝置86包括條碼讀取器87。條碼讀取器87與藉由攝像裝置17與個體識別編號運算部79辨識文字資訊時相比成為簡單之裝置。因此,可生產性良好地製造零件檢查裝置86。 (2) According to the present embodiment, the component inspection device 86 includes a bar code reader 87. The barcode reader 87 is a simpler device than when the image recognition device 79 recognizes the character information by the imaging device 17. Therefore, the component inspection device 86 can be manufactured with good productivity.
再者,本實施形態並不限定於實施形態,於本發明之技術思想內,本領域具有通常知識者亦可施加各種變更或改良。於以下敍述變化例。 Further, the present embodiment is not limited to the embodiment, and various changes or improvements can be added to those skilled in the art within the technical idea of the present invention. Variations are described below.
於上述第2實施形態中,於電子零件85上印刷有一維個體識別條碼85e。條碼並不限定於一維,亦可設為二維條碼。圖10係用以說明電子零件之模式平面圖。如圖10所示,於電子零件88上印刷有表示製造商名88a、品種顯示名88b、及個體識別編號88c之字串。進而,於電子零件88上印刷有以二維條碼顯示品種顯示名88b之品種條碼88d、及以二維條碼顯示個體識別編號88c之作為識別資訊之個體識別條碼88e。 In the second embodiment described above, the one-dimensional individual identification bar code 85e is printed on the electronic component 85. Bar codes are not limited to one-dimensional, and can also be set as two-dimensional barcodes. Figure 10 is a schematic plan view showing an electronic component. As shown in FIG. 10, a string indicating the manufacturer name 88a, the product display name 88b, and the individual identification number 88c is printed on the electronic component 88. Further, on the electronic component 88, the article barcode 88d which displays the article display name 88b in a two-dimensional bar code and the individual identification bar code 88e which displays the individual identification number 88c as a recognition information in a two-dimensional bar code are printed.
而且,條碼讀取器87成為將二維條碼轉換為文字資料之裝置。藉由使條碼自一維成為二維,而可增加可顯示之文字數量。因此,可 使顯示於電子零件88之資訊量變多。 Further, the barcode reader 87 is a device that converts a two-dimensional barcode into text data. By making the barcode one-dimensional into two dimensions, the number of characters that can be displayed can be increased. Therefore, The amount of information displayed on the electronic component 88 is increased.
於上述第1實施形態中,第1輸送機3~第6輸送機8移動托盤9。亦可不限定於輸送機而由包括線性運動機構之平台移動托盤9。平台可位置精度良好地移動托盤9。除此以外亦可由搬送車移動托盤9。從而可設定自由度較高之搬送路。 In the first embodiment described above, the first conveyor 3 to the sixth conveyor 8 move the tray 9. The tray 9 can also be moved by a platform including a linear motion mechanism without being limited to a conveyor. The platform can move the tray 9 with good positional accuracy. In addition to this, the tray 9 can be moved by the transport vehicle. Thereby, a transport path with a high degree of freedom can be set.
於上述第1實施形態中,攝像裝置17係於內部組入有CCD攝像元件。將圖像轉換為電信號之裝置並不限定於CCD攝像元件。可使用攝像管或CMOS(Complementary Metal-Oxide-Semiconductor,互補性金屬氧化膜半導體)影像感測器(image sensor)。除此以外,可使用紅外線影像感測器。亦可根據攝像之環境或電子零件10之印刷狀況進行選擇。 In the first embodiment described above, the imaging device 17 is internally incorporated with a CCD image sensor. The means for converting an image into an electrical signal is not limited to the CCD image sensor. A camera tube or a CMOS (Complementary Metal-Oxide-Semiconductor) image sensor can be used. In addition to this, an infrared image sensor can be used. It can also be selected according to the environment of the camera or the printing condition of the electronic component 10.
於上述第1實施形態中,托盤搬送部11使攝像裝置17移動。亦可並不限定於此,而設置使攝像裝置17沿第2方向14a移動之攝像裝置移動部。而且,設為攝像裝置移動部移動攝像裝置17,且托盤搬送部11移動托盤握持部16。藉此,可同時進行攝像裝置17拍攝電子零件10之步驟與托盤搬送部11移動空托盤9之步驟。因此,可生產性良好地進行步驟。 In the first embodiment described above, the tray transport unit 11 moves the imaging device 17. The imaging device moving portion that moves the imaging device 17 in the second direction 14a is not limited thereto. Further, it is assumed that the imaging device moving unit moves the imaging device 17, and the tray transport unit 11 moves the tray holding portion 16. Thereby, the step of the imaging device 17 capturing the electronic component 10 and the step of moving the empty tray 9 by the tray transporting portion 11 can be simultaneously performed. Therefore, the steps can be carried out with good productivity.
於上述第1實施形態中,第2方向14a成為與第1方向3c正交之方向。第1方向3c與第2方向14a亦可未必正交。第1方向3c與第2方向14a亦可為交叉之方向。於該情形時,攝像裝置17可拍攝復述行之電子零件10。而且可提高設計之自由度。 In the first embodiment described above, the second direction 14a is a direction orthogonal to the first direction 3c. The first direction 3c and the second direction 14a may not necessarily be orthogonal. The first direction 3c and the second direction 14a may be directions in which they intersect. In this case, the image pickup device 17 can take a picture of the electronic component 10 of the repetitive line. And can increase the freedom of design.
於上述第1實施形態中,進行步驟S3之標記攝像步驟~步驟S6之確認結束判定步驟後進行至步驟S7之檢查步驟。亦可並不限定於此,而同時進行步驟S3之標記攝像步驟~步驟S6之確認結束判定步驟與步驟S7之檢查步驟。即,亦可於藉由步驟S5之個體識別判定步驟判定個體識別資料75存在於比較判定資料74之一覽表中時,對已檢查個體識別編號10c之電子零件10依序進行步驟S7之檢查步驟。由於同時進行個體識別資料75之確認與電特性檢查,因此可生產性良好地進行檢查。 In the first embodiment described above, the step of confirming the end of the mark imaging step to the step S6 of step S3 is performed, and then the step of checking to step S7 is performed. The present invention is not limited thereto, and the step of marking the imaging step of step S3, the step of confirming the end of step S6, and the step of checking of step S7 are simultaneously performed. In other words, when the individual identification data 75 is determined to be present in the list of comparison determination data 74 by the individual identification determination step of step S5, the electronic component 10 of the examined individual identification number 10c may be sequentially subjected to the inspection step of step S7. Since the confirmation of the individual identification data 75 and the electrical property inspection are performed at the same time, the inspection can be performed with good productivity.
1‧‧‧零件檢查裝置 1‧‧‧Part inspection device
1a‧‧‧檢查部 1a‧‧‧Inspection Department
1b‧‧‧作為零件搬送裝置之搬送部 1b‧‧‧As the transport part of the parts transport device
2‧‧‧基台 2‧‧‧Abutment
3‧‧‧作為第1移動部之第1輸送機 3‧‧‧The first conveyor as the first moving part
3c‧‧‧第1方向 3c‧‧‧1st direction
4‧‧‧第2輸送機 4‧‧‧2nd conveyor
5‧‧‧第3輸送機 5‧‧‧3rd conveyor
6‧‧‧第4輸送機 6‧‧‧4th conveyor
7‧‧‧第5輸送機 7‧‧‧5th conveyor
8‧‧‧第6輸送機 8‧‧‧6th conveyor
9‧‧‧作為容器之托盤 9‧‧‧Tray as container
10‧‧‧電子零件 10‧‧‧Electronic parts
11‧‧‧作為第2移動部之托盤搬送部 11‧‧‧Tray transfer unit as the second moving unit
12‧‧‧托盤搬送支撐部 12‧‧‧Tray transport support
13‧‧‧軌道 13‧‧‧ Track
14‧‧‧作為移動機構之托盤移動平台 14‧‧‧Tray mobile platform as a mobile organization
14a‧‧‧第2方向 14a‧‧‧2nd direction
15‧‧‧托盤握持支撐部 15‧‧‧Tray grip support
16‧‧‧托盤握持部 16‧‧‧Tray grip
17‧‧‧作為識別資訊檢測部及圖像攝像部之攝像裝置 17‧‧‧As an imaging device for the identification information detection unit and the image imaging unit
20‧‧‧作為搬送機構之零件除供材部 20‧‧‧Parts of the transporting unit except the supply department
21‧‧‧零件搬送支撐部 21‧‧‧Parts Transfer Support
21a‧‧‧支柱部 21a‧‧‧ Pillars
21b‧‧‧架橋構件 21b‧‧‧Bridge components
23‧‧‧供材Y平台 23‧‧‧Material Y platform
24‧‧‧除材Y平台 24‧‧‧Removal Y platform
25‧‧‧第1支撐樑 25‧‧‧1st support beam
27‧‧‧供材X平台 27‧‧‧Feeding X platform
28‧‧‧供材零件握持部 28‧‧‧Material parts grip
29‧‧‧作為搬送機構之零件供材部 29‧‧‧Parts supply part of the transport mechanism
30‧‧‧第2支撐樑 30‧‧‧2nd support beam
31‧‧‧除材X平台 31‧‧‧Excluding material X platform
32‧‧‧除材零件握持部 32‧‧‧Removal parts grip
33‧‧‧零件除材部 33‧‧‧Parts Department
34‧‧‧檢查用插槽 34‧‧‧Checking slots
35‧‧‧軌道 35‧‧‧ Track
36‧‧‧作為搬送機構之第1往返平台 36‧‧‧The first round-trip platform as the transport agency
37‧‧‧凹部 37‧‧‧ recess
37a‧‧‧供材用凹部 37a‧‧‧Containment recess
37b‧‧‧除材用凹部 37b‧‧‧Recessed recess
40‧‧‧軌道 40‧‧‧ Track
41‧‧‧作為搬送機構之第2往返平台 41‧‧‧ as the second round-trip platform of the transport agency
42‧‧‧凹部 42‧‧‧ recess
42a‧‧‧供材用凹部 42a‧‧‧Containment recess
42b‧‧‧除材用凹部 42b‧‧‧Recessed recess
43‧‧‧作為搬送機構之零件按壓裝置 43‧‧‧Parts pressing device as a transport mechanism
44‧‧‧按壓支撐部 44‧‧‧ Pressing support
45‧‧‧軌道 45‧‧‧ Track
46‧‧‧測定X平台 46‧‧‧Measure X platform
47‧‧‧檢查零件握持部 47‧‧‧Check the part grip
50‧‧‧電性特性檢查裝置 50‧‧‧Electrical property inspection device
51‧‧‧控制部 51‧‧‧Control Department
51a‧‧‧作為資訊輸出部、資訊顯示部及警報輸出部之資訊顯示裝置 51a‧‧‧Information display device as information output unit, information display unit and alarm output unit
51b‧‧‧作為資訊輸入部之資訊輸入裝置 51b‧‧‧Information input device as information input department
52‧‧‧警告燈 52‧‧‧Warning lights
53‧‧‧外殼 53‧‧‧Shell
55‧‧‧間隔板 55‧‧‧ Spacer
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JP6083140B2 (en) * | 2012-07-20 | 2017-02-22 | セイコーエプソン株式会社 | Electronic component conveying device and electronic component inspection device |
-
2012
- 2012-07-20 JP JP2012161283A patent/JP6083140B2/en not_active Expired - Fee Related
-
2013
- 2013-07-16 TW TW105111892A patent/TWI622541B/en not_active IP Right Cessation
- 2013-07-16 TW TW102125418A patent/TWI591353B/en not_active IP Right Cessation
- 2013-07-18 CN CN201610580246.XA patent/CN106185236A/en active Pending
- 2013-07-18 CN CN201310304651.5A patent/CN103569624B/en not_active Expired - Fee Related
- 2013-07-18 CN CN201610579222.2A patent/CN106185235A/en active Pending
- 2013-07-19 KR KR20130085391A patent/KR101491281B1/en active IP Right Grant
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2014
- 2014-08-25 KR KR1020140110558A patent/KR20140117319A/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
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JP6083140B2 (en) | 2017-02-22 |
KR101491281B1 (en) | 2015-02-06 |
TW201404697A (en) | 2014-02-01 |
TWI622541B (en) | 2018-05-01 |
CN106185236A (en) | 2016-12-07 |
TWI591353B (en) | 2017-07-11 |
CN103569624A (en) | 2014-02-12 |
KR20140012600A (en) | 2014-02-03 |
KR20140117319A (en) | 2014-10-07 |
CN106185235A (en) | 2016-12-07 |
JP2014020985A (en) | 2014-02-03 |
CN103569624B (en) | 2016-08-10 |
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