TW201238716A - Abrasive article with replicated microstructured backing and method of using same - Google Patents

Abstract

An abrasive article is provided that includes a flexible backing having opposed first and second major surfaces. The first major surface includes a plurality of abrasive particles in at least one binder disposed thereon. The second major surface includes replicated microstructures having recesses. The abrasive article also includes adhesive contained substantially in the recesses of the replicated microstructures. A rigid substrate can be in contact with at least a portion of the replicated microstructures. Also provide is a method of polishing a work-piece that uses the provided articles.

Description

201238716 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to abrasive articles that can be used to polish composite materials. [Prior Art] A workpiece such as a read/write head for the hard disk drive (HDD) industry has a very hard and extremely soft composite material, which is generally subjected to polishing and polishing by using an abrasive article. The extremely soft material that makes up the read/write sensor is located at the edge of an extremely hard material such as alumina titania carbide (AlTiC). Since high pressure is required to remove the hard AlTiC material, it is applied to a pressure of 4 oz. If the abrasive substrate has a sufficiently low modulus, the load on the workpiece can cause the abrasive surface to shift. This can result in the abrasive material accumulating on the edge of the workpiece. Excessive abrasive on the edge of the workpiece can result in accelerated edge removal, or generally referred to as "crown" or "edge roll-off." This crowning effect destroys the sensor located on the edge of the workpiece. Multilayer abrasive articles with compliant pressure sensitive adhesives can exacerbate the crown of the read/write head. 1 is a schematic view of a polishing article system in accordance with one of the prior art techniques, in which abrasive particles 12 are dispersed in a binder 13 (forming an abrasive layer) on a first major surface i8a of the flexible backing 18, The flexible backing 18 has an adhesive layer 14 applied to the second major surface 18b of the abrasive article. The layer of adhesive (e.g., a layer of pressure sensitive adhesive) secures the abrasive article to the rigid support 22. When the components in the abrasive article 1 are compared, the adhesive layer is softer than the flexible backing and the abrasive particles (i.e., has a lower Young's modulus). As shown in Figures 1 and 2, in use, the workpiece 20 161856.doc 201238716 is exposed to the abrasive layer (including the abrasive particles 18a and the binder 13) under load P. The workpiece and the load applied thereto deform the relatively soft adhesive layer 14 in such environments. The contours of the flexible substrate 18 and the abrasive layer 13 will follow the deformation of the adhesive layer, resulting in rounding or crowning of the workpiece edges. In addition, the high stress at the edge of the workpiece 2 can also cause the edge of the workpiece to be rounded. SUMMARY OF THE INVENTION It is necessary to solve the workpieces to be polished, in particular, for the workpieces used in the sensitive electronics industry (such as 'reading/writing heads for hard disk drives or thin hard disk drives, drive itself) The problem of crowning occurs on the top. The abrasive article and method of the present invention is advantageous in that it extends the lifespan, allows the material to be easily removed from the workpiece, the ability to be polished to precision machining, and a high removal rate. In addition, they prevent crowning of the edges of the workpieces and make a more suitable product. In one aspect, an abrasive article is provided that includes a flexible backing having one of opposing first and second major surfaces; and an abrasive layer comprising a plurality of abrasive particles retained in at least one bonding agent, An abrasive layer disposed on the first major surface of the flexible backing, wherein at least a portion of the second major surface of the flexible backing comprises a replica microstructure having a recess; and an adhesive, wherein the adhesive is substantially Included in the recesses of the replicated microstructures. The article can further include a release liner that contacts one of the rigid substrates with at least a portion of the replicated microstructures or with at least a portion of the adhesive. The flexible backing may have a modulus of yang greater than about 0.5 gigapascals (GPa) or even greater than 2 GPa, and may include, among other possible shapes, a rod, a triangular body, a pyramidal cone, a truncated pyramid, a cone Shape, head-shaped conical body, spherical body or ellipsoidal body. 161836.doc 201238716 In another aspect, a polishing method is provided, comprising: providing a workpiece in contact with an abrasive article comprising: a first back and a second major surface a lining comprising an abrasive layer of a plurality of abrasive particles retained in at least one binder, the abrasive layer being disposed on the first major surface of the flexible backing, wherein the second major surface of the flexible backing is At least a portion comprising a replica microstructure having a recess, an adhesive; and a rigid substrate in contact with at least a portion of the replica microstructures, wherein the adhesive is substantially received in the recess of the replica microstructure; The abrasive article moves relative to the workpiece. The abrasive article is moved relative to the workpiece' thereby polishing a surface of the workpiece. In general, a load is applied to the workpiece. The abrasive articles and methods provided can be used to polish workpieces that require aurora/month and flatness throughout their dimensions. The removable backside including the replica microstructure supports the load that can be applied to the workpiece during polishing by a rigid substrate. The replica microstructures are subjected to a portion of the load, transferring at least a portion of the load to the rigid substrate, thereby reducing or eliminating adhesive deformation. The adhesive is substantially contained within the recesses of the replicated microstructures such that the replicated microstructures are in direct contact with the rigid substrate. The abrasive articles and methods provided provide finished articles with excellent flatness, thereby providing abrasive articles with long life, ease of application, easy removal, precision machining, and high removal rate benefits over crown reduction techniques. The above summary is not intended to describe the disclosed embodiments of the various embodiments of the invention. The illustrative embodiments will be more specifically illustrated by the following detailed description of embodiments and embodiments. 161856.doc 201238716 [Embodiment] The present invention can be further defined with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS In the following description, reference is made to the accompanying drawings, Other embodiments may be covered and implemented without departing from the spirit and scope of the invention. Therefore, the following embodiments are not to be construed as limiting. All numbers expressing feature sizes, quantities, and physical properties used in the specification and claims are to be construed as being modified by the term "about" in all instances. Therefore, unless otherwise stated, the numerical parameters of the specification (4) in the specification and attached financial statements are approximate, and the like may be changed by the skill of the person skilled in the art using the teachings disclosed herein. The numerical range with endpoints includes all numbers within the range (for example, ^5 includes 1' 1.5, 2, 2 75, 3, 38(), 4, and 5) and any range within the scope. The flexible article and method provided by the flexible backing include a surface-retractable profile. It can be used for the provided abrasive deposits: medium = scratched backing is generally known in the art of grinding. The materials include polymerized substrates, for example, polystyrene, polycarbonate, polypropylene, polyethylene, cellulose, poly(tetra), (tetra)imine, polyoxet and polytetraethylene; metal box, including Copper, tin and bronze; and paper, sentenced with dense kraft paper and polymer coated paper. The material of the flexible backing is contained in its first replica microstructure. In some embodiments, the separation of at least a portion of the two major surfaces comprises a replica microstructure. I61856.doc • 6 - 201238716 The backing can be selected to provide uniform material removal throughout the workpiece, ie, good uniformity And the polishing structure of flatness (including flatness). Importantly, the material properties of the flexible backing and the replicated microstructure features contained thereon have material properties that smooth all dimensions of the surface of the workpiece, particularly the edge of the workpiece. The abrasive article provided includes an abrasive layer, the abrasive The layer includes a plurality of abrasive particles retained in the at least one binder, the abrasive layer disposed on the first major surface of the flexible backing, wherein at least a portion of the second major surface of the flexible backing comprises a concave The copy of the micro-structure. Suitable abrasive particles that can be used in the articles and methods provided include fused alumina, heat treated alumina, white fused alumina, niobium carbide, green niobium carbide, titanium diboride, boron carbide, tungsten carbide, titanium carbide, diamond (natural and synthetic, including polycrystalline diamond), oxidized stone, iron oxide, chromium oxide, cerium oxide, zirconia, titanium oxide 'tantalate, tin oxide, cubic boron nitride, garnet, oxidized alumina oxidation error , gel-gel abrasive particles and the like. The sol-gel abrasive particles can be found in U.S. Patent Nos. 4,314,827 (Leitheis 4), 4,623,364 (Cottringer et al.), 4,744, 8〇2 (Schwabei) et al. 4,770,671 (M〇nroe et al.) and 4,88 l, 951 (w〇〇d et al.). As used herein, the term abrasive particles also encompass abrasive particles and polymerization.

A dense cerium oxide. Grinding agglomerates into - an annealing step at the temperature at which the abrasive material/cerium oxide is coalesced is described in U.S. Patent No. 161,856.doc 201238716 4,311,489 (Kressner), 4,652,275 (Bloecher et al.), 4,799,939 (Bloecher et al. ), 5,500,273 (H〇lmes et al.), 6 645 624 (Adefris et al.), 7,044,835 (Mujumdar et al.). Alternatively, the abrasive particles can be joined together by mutual attraction between the particles as described in U.S. Patent 5,201,916 (8!^ et al.). Common abrasive agglomerates include agglomerates having diamond as abrasive particles and cerium oxide as a binding component. When agglomerates are used, the size of the individual abrasive particles contained in the polymer may range from 0.1 to 50 microns (pm) (; 0.0039 to 2. mils), preferably 〇 2 to 2 〇 μη (0.0079) Between 0.79 mils and the best 〇.5 to 5 μηι (〇〇2〇 to 〇2〇 密). The average particle size of the abrasive particles can be less than 15 〇μηι (5·9 mil), in general, less than 100 μηη (3·9 mils) or even less than 5 〇 _ (2 〇 密 磨 abrasive particles are generally Refers to its longest dimension. In general, there is a range of particle size distributions. In some cases, the particle size distribution can be tightly controlled to provide a consistent surface force σ on the ground workpiece. Another type of useful abrasive-based metal-based abrasive particles having a substantially ellipsoidal metal-containing matrix having a circumference and at least partially embedded within the circumference of the metal-containing substrate having less than 5 μm, preferably less than 8, Ultra-abrasive material of average diameter. These abrasive particles can be made by filling a metal-containing matrix (mainly ellipsoid), superabrasive particles and grinding media into a container. Then, at room temperature 'Rotate the container for a period of time. Although not bound by theory', it is believed that the grinding process forces the superabrasive material to penetrate, attach to, and protrude out of the metal-containing matrix. 161856.doc 201238716 The circumference transforms from a pure metal or metal alloy to a composite of a superabrasive and a metal or metal alloy. The subsurface near the circumference of the metal-containing matrix also contains a superabrasive material' and is considered to be embedded in the metal-containing In the matrix, the metal-based abrasive particles are disclosed in U.S. Patent Application Publication No. 2010/0000160 (Lugg et al.), the entire disclosure of which is incorporated herein by reference. For example, it has been found that the material applied to the surface of the abrasive particles improves the adhesion between the abrasive particles and the binder. Further, when the softened particulate curable binder material is used as a binder, the material applied to the surface of the abrasive particles can be The adhesion of the abrasive particles is improved. Alternatively, the surface coating can modify and modify the cutting characteristics of the obtained abrasive particles. Such surface coatings are described, for example, in U.S. Patent No. 5,011,508 (Wald et al.), 3, 〇4U56. (R〇wse et al.), 5, 〇〇9,675 (KUnz et al.), 4,997,461 (Markh〇ff_Matheny et al.), 5,213,591 (Celikkaya et al.), 5,085,671 (Martin et al). And 5,042,991 (Kunz et al.) The abrasive articles and methods provided may include conventionally coated abrasive articles, coatings (primer coatings, cementitious coatings, and topcoats) and materials. The coated abrasive article is described in U.S. Patent No. 5,378,252, issued to U.S. Patent No. 5,834,109 (Follett et al.) and U.S. Patent No. 6,979,713 (Barber). The provided abrasive article and method can include molded or Structured abrasive coating. Formed or structured means that the abrasive coating has raised and recessed portions. An exemplary abrasive article comprising a shaped or patterned abrasive coating is available under the trade name TRIZACT from 3Μ Company, St. ., MN purchase. It is basically described in U.S. Patent No. 5,152,917, 16 I 856.doc 201238716 (Pieper et al.). Other polishing materials for the abrasive articles provided are also described; ^ and the prescription = can be used as a research (Gagnardi^) ^ 〇 ^ in the US patent case, and if the abrasive particles can be partially buried in the flexible The first opposing 2 of the backing can be maintained in place by the flexible backing. The abrasive particles can also be bonded to the flexible backing by means of thermal bonding, supersonic bonding or microwave activation bonding. The bonding agent can be used to secure the abrasive particles to the front surface of the flexible backing. Useful binders for securing abrasive particles to the first surface of the flexible backing are well known and accommodating to those skilled in the art. Suitable binder precursors generally flow in an uncured or uncrosslinked state at or near ambient conditions. The puncture precursor is then typically exposed to conditions (usually energy sources) that at least partially cure or crosslink the binder precursor (ie, free radicals), thereby converting it into a retentive dispersion grind. Adhesive. Exemplary energy sources include: electron beam 'ultraviolet radiation, visible light radiation, infrared radiation, gamma radiation, heat, and the like. Poly(indenyl)acrylic acid which may be used is intended to include monomers and/or oligomers having at least two (indenyl) acrylic acid groups; for example, tris(meth)acrylic acid vinegar, and tetrakis(曱) Acrylate). Exemplary poly(methacrylic acid S) includes: di(meth)acrylic acid vinegar, such as, for example, bismuth (meth) acrylate, 3 - butane diol, = (methyl) propylene M_ butanediol 、, bis(methyl)propene sulphate·hexanediol ester, bis(meth)acrylic acid oxime, 6·hexanediol ester, bis(indenyl)acrylic acid glycol hydrazine·oxidation (Methyl) acrylate, oxidized bis(indenyl) acrylate cyclohexane dimethanol ester, alkoxylated hexane (meth) acrylate, alkoxylated mono(indenyl) acrylate dipentane Alcohol ester, caprolactone modified hydroxy trimethyl I61856.doc •10· 201238716 ketoacetic acid di(meth)acrylic acid neopentyl glycol ester, di(meth)acrylic acid cyclohexanedimethanol ester, di(methyl) Diethylene glycol acrylate, dipropylene glycol di(meth)acrylate, bisphenol A ethoxylate (10) di(meth)acrylate, bisphenol A ethoxylate (3) di(meth)acrylate, B Oxidation of (30) bis(A) bis (meth) acrylate, ethoxylated (4) bis (meth) bisphenol A ester, hydroxytrimethyl acetaldehyde modification Di(hydroxy) propyl (meth) acrylate, neopentyl glycol di(indenyl) acrylate, polyethylene glycol (200) bis(meth) acrylate, poly(ethylene) di(meth) acrylate Alcohol (400) from the purpose, polyethylene (600) ester of bis(indenyl)acrylate, neopentyl glycol di(meth)acrylate, tetraethylene glycol bis(decyl)acrylate, Tricyclodecane dimethanol ester of methyl)acrylic acid, triethylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate; tris(meth)acrylate such as tris(decyl)acrylic acid glycerin Ester, tris(hydroxy)propyl tris(decyl) acrylate, tris(meth) acrylate (for example, ethoxylated (3) tris(mercapto)acrylic acid trimethylol propyl ester, ethoxylated (6) Trimethylolpropyl tris(meth)acrylate, ethoxylated (9) tris(meth)acrylic acid trishydroxypropyl propyl S, ethoxylated (20) tris(methyl) propyl tris(meth)acrylate) , tris(meth)isobornyl acrylate, tris(meth)acrylate (for example, propoxylated (3) tris(fluorenyl) propyl Glyceryl ester, propane oxidized (5.5) tris(decyl) acrylate, propoxylated (3) tris(mercapto)acrylic acid trishydroxypropyl propyl ester, propoxylated (6) tris(meth)acrylic acid trishydroxyindole Propyl propyl ester), tris(mercapto)acrylic acid trishydroxypropyl propyl vinegar, tris(2-hydroxyethyl)isocyanurate tris(meth)acrylate; and fluorene-containing thiol-based propylene Acid-based compounds such as tetras(mercapto)acrylic acid bis-trihydroxydecyl propyl ester, diisopentyl pentoxide (meth) acrylate, ethoxylated (4) tetrakis(meth) acrylate Alcohol ester, tetrakis(indenyl)isopentaerythritol 161856.doc •11- 201238716 ester, caprolactone modified hexa(meth)acrylic acid diisoamyl alcohol vinegar; oligomeric (meth)acrylic compound For example, polyester (meth) acrylate, epoxy (meth) acrylate; and combinations thereof. Such compounds are widely available from suppliers such as, for example, Sartomer c〇. of Exton, PA, UCB Chemicals Corporation of Smyrna and Aldrich Chemical

Company of Milwaukee, WI. The binder precursor can comprise an effective amount of at least one photoinitiator; for example, from 0.1, 1 or 3 weight percent, up to 5, 7 or even 1 weight percent or greater. Photoinitiators which can be used include those known to be useful in free radical photocuring (fluorenyl) acrylic acid. Exemplary photoinitiators include benzoin and its derivatives, such as (X-methylbenzoin, alpha-phenylbenzoin, alpha-allyl acylate, alpha-~ basic acyloin; benzoin Ethers such as benzoin dimethyl ketal (IRGACURE 651 from Ciba Specialty Chemicals, Tarrytown, )), benzoin methyl ether, benzoin ethyl ether, benzoin n-butyl ether; phenyl Ketones and derivatives thereof, such as 2-hydroxy-2-methyl-l-phenyl-1_acetone (DAROCUR 1173 available from Ciba Specialty Chemicals) and 1-cyclohexylphenyl ketone (purchased from Ciba Specialty Chemicals) IRGACURE 184), 2· Mercapto-l-[4-(indolylthio)phenyl]-2-(4-morpholinyl)-1-propanone (IRGACURE 907 purchased from Ciba Specialty Chemicals), 2-' Benzyl-2-(monomethylamino)-1-[4-(4·?)-phenyl]-1-butanone (IRGACURE 369 purchased from Ciba Specialty Chemicals) and phenyl bis (2,4) , 6·trimercaptobenzylidene) phosphine oxide (IRGACURE 819 available from Ciba Specialty Chemicals, NY). Other photoinitiators that can be used include early- and double-branched (eg, from Ciba Specialty 161856. Doc 12 201238716

IRGACURE 1700 > IRGACURE 1800, IRGACURE 1850 and DAROCUR 4265, purchased from Chemicals, may contain an effective amount of at least one thermal initiator; for example, from 0.1, 1 or 3 weight percent 'to Shangda 5, 7 or Even 1% by weight or more. Exemplary thermal free radical initiators include: azo compounds such as, for example, 2,2-azo-bisisobutyronitrile, dimercapto 2,2, azobis(isobutyrate), azobis (diphenylmethane), 4,4,-azobis-(4-cyanovaleric acid), 2,2'-azobis(2,4.dimethylpentanenitrile) (from E j du p 〇nt heart

Nemours and Co. 〇f Wilmington, VAZO 52); peroxides such as, for example, benzamidine peroxide, cumene peroxide, dibutyl peroxide, cyclohexanone peroxide, peroxy pentoxide Diacid and dilauryl peroxide, hydrogen peroxide; hydroperoxides such as, for example, tert-butyl hydroperoxide and cumene hydroperoxide; peracids such as, for example, peracetic acid and perbenzoic acid Formic acid; potassium persulfate; and peresters such as, for example, diisopropyl percarbonate. In some embodiments, the binder precursor preferably includes one or more monoethylenically unsaturated radical polymerizable compounds, for example, to reduce the viscosity of the resulting binder and/or to reduce crosslink density. Exemplary monoethylenically unsaturated free soil polymerizable &amp; compounds include: mono (meth) acrylates, including (meth) hexyl acrylate, 2-ethyl hexyl acrylate, isophthalic acid (meth) acrylate , (meth)acrylic acid isobornyl cool, (meth)acrylic acid phenoxyethyl S, (meth)acrylic acid 2 red ethyl, (meth)acrylic acid 12 vinegar, (methyl) acrylic acid (A) Ethyl acrylate, n-propyl (meth) acrylate, (decyl) propyl (tetra) n-butyl acrylate, n-octyl (meth) acrylate, isobutyl methacrylate, (meth) acrylic acid Cyclohexanoic vinegar or (mercapto) acrylic acid 18 vinegar; N_B I6I856.doc 201238716 Alkenyl compounds such as, for example, Ν·vinylcarbamide, N-vinylpyrrolidone or N-ethylene Amidoxime; and combinations thereof. In some embodiments, the abrasive layer can also include one or more additives. The additives may include one or more of an antioxidant, a toner, a heat and/or a light stabilizer or a filler (a filler that does not substantially affect the abrasive properties). Thus, the binder can be prepared from a binder precursor comprising abrasive particles, a surfactant, and an additive (e.g., as a slurry) in which the abrasive particles are dispersed. The microstructure provided provides an abrasive article comprising a flexible backing having opposing first and second major surfaces. At least a portion of the second major surface of the flexible backing comprises a replica microstructure having a recess. The replicated microstructures are integrated into the flexible backing. Integration means that the replicated microstructure is part of a flexible backing (e.g., a second surface of the flexible backing). The replica microstructures can extend from a common substrate (i.e., a flexible backing), be disposed on a different backing, and the like, thereby forming protrusions (reproducing the distal ends of the microstructures) and recesses. In some embodiments, the replica microstructures can be extensions of the flexible backing material, such as, for example, the replica microstructures are simultaneously formed, molded or embossed with the flexible substrate or directly onto the flexible substrate. The situation of growth. In some embodiments, the replica microstructures form a recess in the second surface of the flexible backing, ie, the texture is textured on the flexible backing by a texturing process (eg, embossing) Surface. Flexible backings that can be used have been shown above and include polyester, polycarbonate, polypropylene, polyethylene, cellulose, polyamide, polyimine, polyoxymethylene, and polytetrafluoroethylene; metal foil 161856.doc -14· 201238716 Films, including Ming, Bronze, Tin and Bronze; and paper, including densified kraft paper and polymeric coated paper. Alternatively, the replica microstructures such as **Hai can be arranged or formed on a different backing. The different backing can be flexible or rigid. The different backing can then be structurally joined to the second side of the flexible backing. Any different backing can be used, however, the *JSJ backing should not be obvious. The variability can be pulled back—especially close to the overall modulus at which the top surface of the abrasive element can be formed. When a different backing is used, the replication microstructure on the first backing can utilize different mechanisms (including, for example, viscous compositions (such as structural adhesives), sonic fusion, heat sinking, mechanical fasteners, etc. Combined) structurally joined to the flexible backing. The replica microstructure can have a certain shape. Examples of such shapes include rods, triangular bodies, pyramidal cones, truncated pyramidal cones, conical bodies, truncated cones, cube corners, cubes, spheres or ellipsoids. The replica microstructures can have an elongated shape that forms a ridge. In some embodiments, the ridge has a cross-face of a triangular or truncated triangle (triangle with a flat top). In other embodiments, the ridges can have a rectangular, square or trapezoidal cross section. Alternatively, the replica microstructures can be in a random shape. Since the replicating microstructures are replicas, in general, the three-dimensional shape of the replica microstructures or the two-dimensional cross-section of the replica microstructures has a second major surface plane relative to the flexible backing of about 90. Or the side wall of the larger corner. In other words, the shape of the replica microstructure generally does not include undercut portions that cannot be easily removed from the mold while retaining the features of the replica microstructure. 'J as defined herein' "Replicated Microstructure" is a microstructure that can be created by copying or repeating processes. Such processes include replication processes well known to those skilled in the art of replicating micro-junctions such as, for example, embossing, injection molding, washing and curing, heat forming or screen printing. The replication microstructure can be formed in accordance with various methods including, for example, molding, extrusion, embossing, and the like. The methods of forming the microstructured elements are described in, for example, U.S. Patent Nos. 5,897,930 (Calh〇un et al.), 5,183,597 (Lu), 4,588,258 (Hoopman), 4,576,850 (Martens) and 4,374,077 (Kerfeld)f. Other methods of making a replica microstructure include the basic method of making a three-dimensional abrasive article as disclosed in U.S. Patent No. 5,958,794 (Buxvoort et al.). Replicated microstructures can also be fabricated by a variety of other methods. For example, the replicated microstructure can be transferred from the parent tool to other media such as polymeric tape or web by forming a master tool into the casting and curing process of the production tool. This production tool can then be used to fabricate a microreplicated structure comprising replicated microstructures using any of the above replication methods. Other methods such as electroforming can be used to replicate the master tool. Another alternative to making replicated microstructures is to directly cut or machine the second major surface of the flexible lining material to form a replica microstructure. For this, techniques such as chemical etching, laser ablation, bead blasting or - random surface modification techniques can be employed. When the microstructure is cut directly onto the main surface of the flexible backing, if the process is under the control of certain types of computer systems:: repeatedly cutting a cutting tool such as a laser cutting device to produce a plurality of composites </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; (Gardiner et al.). Adhesives The abrasive articles and methods provided include an adhesive that provides adhesion between the flexible backing and the rigid substrate. In some embodiments, the adhesive can be in contact with a release liner. Any adhesive which provides viscous properties is suitable for use in the present invention. The adhesive is substantially contained within the recess of the replication microstructure. "Substantially contained" means that the adhesive occupies most of the volume of the recess in the replica microstructure of the opposite second major surface of the flexible backing. When a rigid substrate is present, the volume of the recess is defined by the walls of the recess defined by the rigid substrate. When the rigid substrate is not present, the volume of the recess is defined by the wall of the recess and the volume defined by one of the planes across the distal end of the replica microstructure. In the articles and methods provided, the adhesive can occupy more than about 15 volume percent, greater than about 25 volume percent, or even greater than about 35 volume percent of the volume of the recesses. In some embodiments, the volume of the adhesive may be greater than the volume of the recess, which is 11%, 120% or even 13% of the volume of the recess, and generally does not exceed 1 50% of the volume of the recess. In addition, the adhesive may occupy approximately the entire volume of the recess, or may occupy less than about 85 volume percent of the volume of the recess, less than about 75 volume percent, or even less than about 65 volume percent. Further, "substantially contained" means that substantially no adhesive is present on the distal end or projection of the replica microstructure forming the second major surface of the flexible backing. In general, when a rigid substrate is present, the rigid substrate is in direct contact with at least a portion of the replication microstructure. "It is important for the abrasive article and method provided by the operation to have a flexible backing and a rigid support present. These direct contacts are used to support the load of 161856.doc • 17* 201238716 when the workpiece is under load during polishing or polishing. This important feature prevents or prevents crowning or edge rounding from occurring when the workpiece is polished using the provided abrasive article and method. Generally, there is substantially no adhesive present on the distal end or projection of the replica microstructure forming the second major surface of the flexible backing. In some embodiments, there is virtually no adhesive present on the known structure or protrusion of the replicated microstructure. In other embodiments, the average amount of adhesive that may be present on the distal end or projection of the microstructure is less than about 〇μΠ1, less than about 5 μΓη, or even less than about 3 μηι. It is important that the adhesive present does not achieve an amount that alters the overall mechanical properties and maintains the overall modulus of the abrasive article. The load from the workpiece on the abrasive article during polishing requires the support to be transferred to the rigid support to avoid crowning. Adhesives useful for securing abrasive articles to rigid substrates are well known to those of ordinary skill in the art. Suitable adhesives include pressure sensitive adhesives (PSAs), hot melt adhesives, and can be cured and/or vitrified by conventional means (including radiation curable, for example, photocurable, υν curable, electron beam curable, gamma Curable; heat curable, wet curable, and the like) liquid adhesives. The hot melt adhesive can flow when heated above the temperature of the glass and/or the molten transition m. Equivalent adhesive. When cooled below the transition temperature, the hot melt adhesive will condense @]. - Some of the hot smelting adhesives can flow during heating and then solidify due to further curing of the adhesive. Adhesives can be used including, for example, pressure sensitive adhesives, thermal offset adhesives, and glues. Suitable pressure sensitive adhesives include a variety of different pressure sensitive adhesives, including, for example, natural rubber based adhesives, (meth) acrylate polymers and copolymers, thermoplastic rubber AB or bismuth block copolymers, Example 161856 .doc 201238716 A styrene/butadiene or styrene/isoprene block copolymer, or a polyolefin, purchased under the trade name KRAT〇N (Shell Chemical Co., Houston, Tex.). Suitable heat-melt adhesive packages &amp;, for example, polyacetate, ethylene sulphur ethylene self-twisting (EVA), polyamine, epoxide and the like. The adhesive has a cohesive strength and peel resistance sufficient to maintain the components of the abrasive article in a fixed relationship during use, and should be resistant to chemical degradation under the conditions of use. Exemplary adhesives include epoxy resins, such as under the trade name SCOTCH- WELD is purchased from 3M Company, St. Paul, MN, such as 3M SCOTCH-WELD Ep〇xy Adhesives 1 838, 2158, 2216 and 3501. Rigid Substrate The term "rigid" describes a substrate that is at least self-supporting, i.e., that does not substantially deform under its own weight. Rigidness does not mean that the substrate is absolutely inflexible. The rigid substrate can be deformed or bent under the applied load but provides very low compressibility. In one embodiment, the rigid substrate comprises a material having a stiffness modulus of 1 χ 1 〇 1 〇 6 psi (7 x 1 〇 4 kg/cm 2 ) or greater. In another embodiment, the rigid substrate comprises a material having a stiffness modulus of 10 x 106 psi (7 x 1 〇 5 kg/cm2) or greater. Suitable materials for use as rigid substrates include metals, metal alloys, metal-matrix composites, metallized plastics, inorganic glass and vitrified organic resins, shaped ceramics, and polymer matrix reinforced composites. The rigid substrate can be a platform upon which the provided abrasive article can be mounted during substrate polishing. Suitable rigid substrate materials include, for example, organic polymers, inorganic polymerization 161856.doc 201238716, ceramic 'metals, composites of organic polymers, and the like. Suitable organic polymers can be thermoplastic or thermoset. Suitable thermoplastic materials include polycarbonates, polyesters, polyamino phthalates, polystyrenes, polyolefins, polyperfluoroolefins, polystyrene, and the like. Suitable thermoset polymers include, for example, epoxy, polyimine, polyester, and the like (ie, 'polymers containing at least two different monomers, including, for example, terpolymers and tetrapolymers ). The polymer of the rigid substrate can be strengthened. The reinforcement can take the form of a fibrous or granular material. Suitable materials for reinforcement include, for example, organic or inorganic fibers (for example, continuous or fixed length fibers), silicates, for example, mica or talc; materials based on cerium oxide, such as sand and quartz; metal particles, Glass, metal oxides and calcium carbonate, or combinations thereof. Particularly useful rigid substrates may also include poly(ethylene carbonate for polyethylene phthalate, glass reinforced epoxy sheets, aluminum, steel, stainless: for example, plates, for example, metal sheets or The board is used as a rigid substrate. Suitable metals include aluminum, stainless steel, copper, nickel and chromium. Multi-layer metals such as tin-clad steel or tin-coated aluminum may also be used. The articles and methods provided may be attached by the present invention Figure 3 is a schematic cross-sectional view of one embodiment of a provided abrasive article, wherein the microstructure is part of a second surface of the flexible backing and comprises a pyramid or a pyramidal cone Ridge. Figure 3 is a grinding comprising a flexible backing:: 〇〇 - Example. The abrasive layer 3G2 (containing abrasive particles retained in the binder) is disposed on the first major surface of the flexible backing 308 The flexible backing fan includes a notch on at least a portion of its second major surface: a knot 161856.doc -20· 201238716 306. The adhesive 305 is substantially located in the recesses. Where the cross sections of the microstructures are by the notches The defined V-shape. The workpiece 320 containing the surface to be polished contacts the abrasive layer 302 and moves relative to the abrasive article 300 to polish the workpiece 320. The load P is applied to the workpiece 320 as shown in Figure 2. The load P is At least a portion of the microstructures 3〇6 are in direct contact with the rigid substrate 312 to thereby 'minimize (if not eliminate) deformation of the adhesive layer and reduce (if not eliminated) crown crowning or rounding of the workpiece 320. A schematic cross-sectional view of another embodiment of an abrasive article provided. The abrasive article 400 includes a flexible backing 408. The abrasive layer 402 (containing abrasive particles retained in the binder) is disposed on the flexible backing On a first major surface of 408. On at least a portion of its second major surface, the flexible backing 4'8 includes a replica microstructure 406 having a recess. The adhesive 405 is substantially located in the recesses. The shape of the structure is the same as that of the embodiment shown in Figure 3. However, in the embodiment shown in Figure 4, the replication microstructure 406 has been formed on a different backing (not shown) and subsequently integrated into Scratching Backing 408 » Bag The workpiece 42 to be polished surface contacts the polishing layer 4〇2, and the polishing layer moves relative to the abrasive article 400 to polish the workpiece 42. The load P is applied to the workpiece 420 as shown in Fig. 2. The load p is borrowed The direct contact support of at least a portion of the replica microstructure 406 with the rigid substrate 412 minimizes (right without eliminating) deformation of the adhesive layer and reduces (if not eliminated) crown crowning or rounding of the edge of the workpiece 420. A schematic cross-sectional view of another embodiment of the provided abrasive article, wherein the replicated microstructures comprise truncated pyramids or pyramidal ridges. Figure 5 is abraded article 5 comprising a flexible backing 508. One embodiment. A grinding layer 502 (containing abrasive particles retained in the binder, not shown) will be disposed on the first major surface of the flexible backing 508. On at least a portion of its second major surface, the flexible backing 508 includes a replica microstructure 5〇6 having a recess. Adhesive 505 is located in the recesses. In this embodiment, the cross sections of the replicated microstructures are in the shape of a truncated shape defined by the notches. The truncated microstructures have a platform that increases the contact area between the flexible backing 5'8 and the rigid substrate 512. This approach provides a building that can withstand greater loads during polishing. The workpiece 52 containing the surface to be polished is in contact with the abrasive layer 502, which is moved relative to the abrasive article 5 to polish the workpiece 52. The load p is applied to the workpiece 52A as shown in FIG. The load p is supported by direct contact of at least a portion of the replica microstructure 506 with the rigid substrate 51, thereby minimizing (if not eliminating) deformation of the adhesive layer and reducing (if not eliminated) crown crowning of the workpiece 520 or Rounded. Figure 6 is a schematic cross-sectional view of yet another embodiment of a provided abrasive article wherein the replicated microstructures are cube or cube ridges. The cross-section of the replicated microstructures is a rectangle defined by the recesses. Figure 6 is an embodiment of a workpiece 6 包 comprising a flexible backing 608. An abrasive layer 602 (containing abrasive particles retained in the binder) is disposed on the first major surface of the flexible backing 6〇8. On at least a portion of its second major surface, the removable backing 608 includes a replica microstructure 6〇6 having a recess. Adhesive 605 is physically located in the recesses. The cube microstructures have a platform that increases the contact area between the flexible backing 608 and the rigid substrate 612. This approach provides support for greater loads during polishing. The workpiece 620 containing the surface to be polished contacts the abrasive layer 6〇2, which is moved relative to the abrasive article 600 161856.doc -22-201238716 to polish the workpiece 620. Load p is applied to workpiece 620 as shown in FIG. The load P is supported by direct contact of at least a portion of the replica microstructures 6〇6 with the rigid substrate 612, thereby minimizing (if not eliminating) deformation of the adhesive layer and reducing (if not eliminated) crown crowning of the workpiece 620 edge. Or round. The invention is further described in the following examples, and the particular materials and equivalents thereof, and other conditions and details are not to be construed as limiting the invention. Example Test method Light polishing program Using a research tool ’ Lapmaster model 15 (from Lapmaster

International LLC, Mount Prospect, Illinois)) for three

The AlTiC coupon (2.40 cm x 〇.20 cm x 〇.5 cm) was subjected to simultaneous polishing. A platform having joined abrasive articles is mounted to the base of the tool. Using a SCOTCHWELD DP100 two-part epoxy adhesive (available from 3Μ Company, St. Paul, Minnes〇ta), a 15 (10) diameter χΐ mm Amc 曰 yen dress to the 5.5 inch (14.0 cm) of the Lapmaster model 15 On the top surface of the diameter ring. Three AlTiC coupons were mounted to the AlTiC wafer surface using the same epoxy adhesive. The coupons are mounted along a 45 mm half of the wafer and are evenly spaced, i.e., separated from each other by about 2 〇. And its equal length is perpendicular to the equal radii. Install the specimens so that a surface of 2 4 〇 cm x 〇 .20 cm is mounted to the wafer. The polishing conditions are 2 旋 rotation, 40 rpm platform rotation and 3 hours of polishing time. A -2 kg load was applied to the head during the first hour; during the second hour, a 161S56.doc •23·201238716 4 kg load was applied and during the third hour a 6 kg load was applied. The AiTiC coupons are rotated along a path between the outer and inner diameters of the abrasive material covering the platform. Using a polishing fluid, anhydrous ethylene glycol was dripped onto the platform at a rate of Q 36 g/min in the 3-hour process. Crown convex measurement procedure M〇del P16 Pr〇m〇meter (obtained from the ruler)

Teneor* Coi*p〇fation' Milpitas, California) measures the flatness of the AlTiC coupon. Four surface level scans were performed along the width of 2 cm per sample block. The four sweeps were carried out in increments of about 5 cm over the length of the coupon. The crown is defined as the difference between the maximum and minimum heights of the & surface leveler scan. The 12 measurements obtained from the three coupons were then averaged to obtain an average crown value. The width of the backing of the backing having a microstructure comprising a notch is cut on a diamond lathe with a steel roller having a copper surface of 25 25 inches (641 and 12 inches (3 0.5 cm) diameter) to have a A series of microstructures and having a surface of the recess between the microstructures. A cross-sectional view of the microstructured roller surface 700, the parent wheel -]F ρ 74 Λ @ m &lt; small section 740 is shown in FIG. The concave σ71〇 is cut out so as to extend along the circumference of the roller and perpendicular to the direction of the roller shaft 73 显示 indicated by the double-headed arrow 730. This is done to extend along the circumference of the roller. Series of microstructure features. The average iceness of the concave 7 10 is i 3 mils (33 〇). The average width of the base of the microstructure feature no is U mil (15 4 pm). The base of the microstructure feature 72 〇 The average distance between the two is 4848 mil (12) (4). The microstructure features 720 are trapezoidal, and the average internal angle measured at the top of the features is approximately 161856.doc • 24-201238716 110 degrees. After cutting on a lathe, de-oiling the parent wheel with isopropyl alcohol and using an alkaline solution Clean the surface. Use the electroless recording method to apply nickel plating to the copper surface of the steel roller to protect the surface from oxidation. Use this roller as a tool in continuous casting and curing process to make micro-selective surfaces and ridges. And forming a notch on the backing "in this casting and curing process" a 23 inch (58.4 cm) wide X 0.005 inch (127 micrometer) thick polyester film is used as a backing. Application of photopolymerizable acrylic resin To the tool, a width of about 20 inches (50.8 cm) is applied along the length of the roller. The acrylic resin is 75% by weight of aliphatic carbamic acid g for diacrylic acid (in the trade name)

PHOTOMER 6210 available from Cognis Corporation, Cincinnati, OH), 24% by weight of diacrylic acid i,6-hexanediol (available from Sartomer Company, Inc., Exton, PA under the trade name SR238) and 1 weight. Photoinitiator of /0 (obtained under the trade name LUCIRIN TPO from BASF Corp., Charlotte, NC). The backing was then applied to the acrylic coating section of the tool. The acrylate resin is UV cured through the backing but still in the recess of the roller microstructure. The backing is then peeled off from the tool. The cured acrylic resin adheres to the backing and is released from the tool to create a microstructured surface. A cross-sectional view of the backing microstructure (corresponding to a cross-sectional web view) is shown in FIG. FIG. 8 shows a microstructured backing surface 800 having a recess 810 and microstructure features 820 on the backing surface 840. The direction of the transverse web is indicated 830 » The replicated microstructured surface of the backing has a microstructure that is reciprocal to the microstructure of the tool. The average depth of the notch 81〇 is 1.3 mils (33·0 μm) » the average width of the base of the microstructure feature 82〇 is 1 〇 mil (1 5.4 μm) ^ the average distance between the bases of the microstructure feature 820 Department 0.48 161856.doc -25- 201238716 mil (12·1 μΓΠ)»The microstructure features 82 are trapezoidal, and the average external angle measured at the bottom of the features is about 1 degree. The corresponding recess between the microstructure and its etc. is in the direction of the longitudinal web of the web. An example is to glue a 2 inch (5 〇 8 cm) x 2 inch (50.8 cm) plate with a microstructured surface to an 18 inch (45 7 cm) x 2l inch (53 3 cm) x 〇 .625 inch ( 0.159 cm) aluminum plate with the microstructured surface facing the aluminum plate. Preparation is mixed according to the supplier's instructions! g 3M sc〇tch_wel

A solution of Epoxy B/A adhesive (available from 3M C〇mpany, St Paul, mn) and 3 § mercaptoethyl ketone (MEK). The solution was poured onto a polyester backing and spread onto the entire surface of the backing using a rubber roller. The surface is repeatedly pressed while the solvent evaporates and the epoxy adhesive is applied to the surface in a uniform manner. A 1 gram of abrasive composite particles comprising i micron diamond / vermiculite 50/50% by weight prepared according to U.S. Patent No. 6,645,624 (Adefris et al.) and sieved to a size of less than 38 microns are poured onto the epoxy along the edge line. Adhesive. Maintain the nameplate and coated backing 4 5 . Corners and taps to cause the particles to roll and coat the adhesive resin. This procedure is repeated until the backing contains a complete coating. The panel is then maintained vertically and severely tapped to dislodge loose particles. The bound abrasive is then covered by a piece of polyoxygen lining and pressed by a rubber hand held roller to force the particles into a single plane of the epoxy. The coating was allowed to cure at room temperature for up to 2 hours and then at 7 Torr. [Cure for another 2 hours. The abrasive layer is then sprayed by a resin cementitious coating. The cement-coated resin solution consists of 4 g of phenoxy resin in 2-butanone, 3 〇 161,856.doc •26·201238716, % solution, (under the trade name YP-50S from Tohto Kasei Co) , Lt. Inabata America Corp, NY, NY purchased); 2.3 g polyester polyurethane solution in MEK (from 21 wt. / 〇 neopentyl glycol, 29 wt% polycaprolactone and 50 wt 35 parts by weight of rhodium/iridium solution in the synthesis of % of methylene diisocyanate; 1.1 g of polyisocyanate (purchased from Bayer Chemical, Pittsburgh, PA. under the trade name Mondur MRS); 40 g MEK and 1〇 g cyclohexanone. The cemented coating resin solution is placed in an aerosol container. The abrasive surface is sprayed by the cement coating solution in a well vented hood for about 6 seconds or until the surface appears wet. The nameplate and the abrasive article were then heated in an oven at 7 ° C for 1 hour. After cooling, the microstructured film was flipped so that the abrasive surface contacted the aluminum panel and exposed the microstructured surface. Subsequently, using a rubber roller to have a nominal thickness of 0.0009 inches (22.9 microns), coated on a poly-stone oxidized kraft paper release liner, one uncrosslinked, acrylic acid acrylate, pressure sensitive adhesive layer manually Laminated to the microstructured surface of the backing. Removing the release liner of the abrasive article and manually laminating the abrasive article to a 16 inch (10)) outer diameter, 8 inch (2 inch - 3 cm) inner diameter and using standard rubber cutting techniques.丨 5 inches (3 8 is the thickness of the flat annular aluminum platform. &amp; then the platform with the abrasive article is placed face down on a 23 inch (58.4 cm) xl8 inch (45.7 cm) x 3/8 inch (〇 95 The quartz plate is placed on the top of the first stage with the bonding abrasive and the entire stack is heated in the oven at 70t to remove the self-bake phase. The second platform is removed from the stack. And cooling the platform having the joined abrasive article while the abrasive article (4) is in contact with the stone. The abrasive article is trimmed to match the size of the platform by a razor blade. After the crown measurement procedure, the average crown crown of the three AlTiC coupons is 0.9 microinches (0.0229 μm). It will be apparent to those skilled in the art that various modifications and substitutions of the present invention are possible without departing from the scope and spirit of the invention. It is to be understood that the invention is not to be construed as limited by the illustrative embodiments and examples described herein All references cited in the present invention are incorporated herein by reference in their entirety. The following is exemplary of the disclosure of the s s s s s s s s s s s s s s s s s s s s s s s s s s s s s Embodiment 1 is an abrasive article comprising: a flexible backing having one of the first first major surfaces opposite, wherein at least a portion of the second primary representation of the flexible backing comprises a replica microstructure of the recess; comprising an abrasive layer of a plurality of abrasive particles in the at least one binder of the remaining side, the grinding/disposing on the first major surface of the flexible backing; and an adhesive, wherein the monologue Substantially contained in the recess of the replica microstructure. Embodiment 2 is the abrasive article of embodiment 1, further comprising: contacting at least a portion of the replica microstructure such as Embodiment 3 is the abrasive article of Embodiment 1, which further comprises at least a partial contact-release profile of the adhesive. Embodiment 4 is an abrasive article as described in Embodiment 1, wherein the Scratching lining i free-density kraft paper, polymeric frost-coated only paper, metal foil and polymeric substrate set; Groups 16T8S6.doc • 28· 201238716 Embodiment 5 is the abrasive article of Example 4, wherein The metal strip is selected from the group consisting of aluminum, copper, tin and bronze. Embodiment 6 is the abrasive article of embodiment 4, wherein the polymeric substrate is selected from the group consisting of polyester, polycarbonate, polypropylene, poly Ethylene, cellulose, polyamide, polyimide, polyoxymethylene and polytetrafluoroethylene. Embodiment 7 is the abrasive article of Embodiment ,, wherein the abrasive particles are selected from the group consisting of fused alumina, heat-treated alumina, white smelting oxide, black carbonized fossil, green carbonized fossil, diboron Titanium, boron carbide, tungsten carbide, titanium carbide, diamond, yttria, iron oxide, chromium oxide, oxidized bromine, oxidized oxidized, oxidized chin, oxalate, tin oxide, cubic boron nitride, garnet, melt oxidation Aluminium oxidization, sol-gel abrasive particles, abrasive agglomerates, metal-based particles, and the like. Embodiment 8 is the abrasive article of embodiment, wherein the flexible backing has a Young's modulus greater than about 0.5 GPa. Embodiment 9 is the abrasive article of embodiment 8, wherein the flexible backing has a Young's modulus greater than about 2.0 GPa. Embodiment 10 is the abrasive article of embodiment 1, wherein the replicated microstructures comprise a rod, a triangular body, a pyramidal cone, a truncated pyramid, a conical, a truncated cone, a cube cube, One of a spherical body or an ellipsoidal shape. Embodiment 11 is the abrasive article of Embodiment 1 wherein the replica microstructures have a shape including one of the ridges. Embodiment 12 is the abrasive article of Embodiment 1, wherein the adhesive is selected from the group consisting of a free-standing adhesive, a hot smelting point agent, and a curable liquid adhesive. I61856.doc -29· 201238716. Embodiment 1 The abrasive article of Embodiment 1, wherein the adhesive occupies more than about 25 volume percent and less than about 120 volume percent of the volume of the recess of the replicate microstructure. Embodiment 14 is a polishing method comprising: providing a workpiece to be polished; contacting the workpiece with an abrasive article, the abrasive article comprising: a flexible backing having one of the first and second major surfaces opposite, wherein At least a portion of the second major surface of the flexible backing comprises a replica microstructure having a recess; an abrasive layer comprising a plurality of abrasive particles retained in at least one binder - the abrasive layer being disposed on the a first major surface of the scratch, an adhesive; and a rigid substrate in contact with at least a portion of the replica microstructures, wherein the adhesive is substantially contained in the recesses of the replica microstructures; The abrasive article moves relative to the workpiece. Embodiment 15 is the polishing method of Embodiment 14, wherein the abrasive particles are selected from the group consisting of fused alumina, heat-treated oxidation, white smelting, black carbonized stone, green carbonized stone, diboron Titanium, boron carbide, tungsten carbide, titanium carbide, diamond, cerium oxide, iron oxide, chromium oxide, cerium oxide, cerium oxide, titanium oxide, cerium salt, tin oxide, cubic nitriding shed, vermiculite, (iv) oxygen (4) Oxidation n suspected abrasive particles agglomerate 'metal based particles and combinations thereof. Example 1 6 is a polishing method as in Example 14, a method of depicting h, wherein the replica microstructures have a rod comprising: r &amp; An angular body, a pyramidal cone, a truncated pyramidal conical body, a truncated conical body, a shape of a spheroidal body, a spherical body, and an ellipsoid. Embodiment 17 is the polishing method of Embodiment 14, wherein the replication microstructures have a shape including a ridge. Embodiment 1 The polishing method of Embodiment 14, wherein the adhesive is selected from the group consisting of a pressure sensitive adhesive, a hot melt adhesive, and a curable liquid adhesive. Embodiment 19 is the polishing method of embodiment 14, wherein the adhesive occupies more than about 25 volume percent and less than about 120 volume percent of the volume of the recess of the replicate microstructure. Embodiment 20 is the polishing method of Embodiment 14, further comprising a release liner disposed on the adhesive. Although specific embodiments have been described herein for the purposes of describing the preferred embodiments, those skilled in the art will understand that various alternatives and/or equivalents can be The specific embodiments are described without departing from the scope of the invention. Those skilled in the art of mechanical, electrical, and electrical engineering will readily appreciate that the present invention can be implemented in a variety of different embodiments. This application is intended to cover any adaptations or variations of the preferred embodiments disclosed herein. Therefore, the invention is obviously limited only by the scope of the patent application and its equivalents. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic cross-sectional view of a prior art abrasive system; Figure 2 is a schematic cross-sectional view of the prior art abrasive system of Figure 1 and having applied a load to the workpiece; Figure 3 is provided A schematic cross-sectional view of one embodiment of an abrasive article, wherein the replicated microstructure is one of the second surface of the flexible backing 161856.doc • 31 - 201238716 and includes a pyramid or a pyramidal cone Figure 4 is a schematic cross-sectional view of one embodiment of an abrasive article provided, wherein the replicated microstructures are structurally bonded to a second surface of the flexible backing and include pyramids or pyramids Rough ridge; Figure 5 is a schematic cross-sectional view of another embodiment of the abrasive article provided, wherein the replicated microstructure comprises a truncated pyramid or a pyramidal ridge; and Figure 6 is provided by the abrasive article A schematic cross-sectional view of another embodiment, wherein the replica microstructure comprises a square ridge; FIG. 7 is a cross-sectional view of one of the microstructured roll surfaces used in an exemplary embodiment of the provided abrasive article; Figure 8 is the use of the micro in Figure 7. A cross-sectional or cross-sectional web view of an exemplary backing microstructure made of a structured roll surface. [Main Component Symbol Description] 10 Abrasive Object System 12 Abrasive Particles 13 Adhesive 14 Adhesive Layer 18 Flexible Backing 18a First Main Surface 18b Second Main Surface 20 Workpiece 22 Rigid Support 300 Abrasive Object 302 Abrasive Layer 161856.doc 32 - 201238716 305 Adhesive 306 Microstructure 308 Flexible Backing 312 Rigid Substrate 320 Workpiece 400 Abrasive Object 402 Abrasive Layer 405 Adhesive 406 Microstructure 408 Flexible Backing 412 Rigid Substrate 420 Workpiece 500 Abrasive Object 502 Abrasive Layer 505 Adhesive Agent 506 microstructure 508 flexible backing 512 rigid substrate 520 workpiece 600 abrasive article 602 abrasive layer 605 adhesive 606 microstructure 608 flexible backing 161856.doc • 33 201238716 612 rigid substrate 620 workpiece 700 Port 720 Microstructure Features 730 Lucky Kun Wheel Axle 740 Roller One Small Section 800 Microstructure Backing Surface 810 Notch 820 Microstructure Feature 830 Web Direction 840 Backing Surface P Load 161856.doc -34-

Claims (1)

201238716 VII. Patent Application Range: 1. An abrasive article comprising: a flexible backing having opposing first and second major surfaces, wherein at least a portion of the second major surface of the flexible backing comprises a replica microstructure of the recess; the abrasive layer 'comprising a plurality of abrasive particles remaining in the at least one binder' disposed on the first major surface of the flexible backing; and an adhesive, wherein the adhesive The agent is substantially contained within the recesses of the replicated microstructures. 2. The abrasive article of claim 1, further comprising: a rigid substrate in contact with at least a portion of the replicate microstructures. 3. The abrasive article of claim 1, further comprising: a release liner in contact with at least a portion of the adhesive. 4. The abrasive article of claim 1, wherein the flexible backing is selected from the group consisting of densified kraft paper, polymeric coated paper, metal release sheets, and polymeric substrates. 5. The abrasive article of claim 4, wherein the metal foil is selected from the group consisting of aluminum, copper, tin, and cyan. 6. The abrasive article of claim 4, wherein the polymeric substrate is selected from the group consisting of polyester, polycarbonate, polypropylene, polyethylene, cellulose, polyamide, polyimine, polyfluorene Oxygen and polytetrafluoroethylene. 7. The abrasive article according to claim ,, wherein the abrasive particles are selected from the group consisting of: (4) oxidation nucleus, heat treatment oxidation, white melting oxidization, black carbonized fossil, green carbonized fossil eve, and second shed鈥,carburization,carbon t61856.doc 201238716 Tungsten, titanium carbide, diamond, , ^. yttrium oxide, iron oxide, chromium oxide, oxyboron, ^ ^ m cubic nitriding, also aluminum yttrium oxide, lyotropic gel grinding Particles 'abrasive agglomerates, metal-based particles, and the like. 8. The abrasive article of claim 1 wherein + § β wherein the sigma flexible backing has a Young's modulus greater than about 〇 5 GPa. Wherein the flexible backing has a Young's modulus greater than about 2 〇 9. The abrasive article GPa of claim 8. The replica microstructures include, a truncated pyramid, a conical cube, a sphere, or an ellipsoid. 10. The abrasive article of claim 1, wherein the rod, the triangle, the pyramid, the truncated cone, Cube angle, shape of the body. 11. The abrasive article of claim 1, wherein the replicated microstructures have a shape comprising a ridge. 12. The abrasive article of claim 2, wherein the adhesive is selected from the group consisting of a pressure sensitive adhesive, a thermal sizing adhesive, and a curable liquid adhesive. 13. The abrasive article of claim 3, wherein the adhesive occupies more than about 25 volume percent and less than about 〇2 〇 volume percent of the recess volume of the replicate microstructures. 14. A polishing method comprising: providing a workpiece to be polished; contacting the workpiece with an abrasive article, the abrasive article comprising: a flexible backing having opposing first and second major surfaces, wherein at least one of the second major surfaces of the replaceable backing A portion includes a replica microstructure having a recess 161856.doc 201238716; an abrasive layer comprising a plurality of abrasive particles retained in at least one binder, the abrasive layer being disposed on the first major surface adhesive of the flexible backing And a rigid substrate in contact with at least a portion of the replica microstructures, wherein the adhesive is substantially received in the recess of the replica microstructure; and the abrasive article is moved relative to the workpiece. 15. The polishing method of claim 14, wherein the abrasive particles are selected from the group consisting of: melt oxidation, heat treatment oxygen (four), white smelting alumina, black carbon carbide, green carbon carbide, titanium diboride, Boron carbide, carbonized crane, carbonized plastic, diamond, oxygen cut, iron oxide, oxidized complex, oxidized ytterbium oxide, oxidized chin, oxalate, tin oxide, cubic gas-reduced stone, oxidized oxide Coagulating knee abrasive particles, abrasive agglomerates, metal-based particles, and the like, β. 16. The shape of the polished rod, the triangular body, the body, and the frustoconical body of claim 14. The method wherein the replica microstructures comprise a pyramidal body, a pyramidal cone, a conical shape, a cube corner, a cube, a spherical body, or an ellipsoidal shape. The shape of the ridge of the polishing method of claim 14. 18. A method of polishing a coating, a coating, a hot melt adhesive, and wherein the replication microstructure comprises, wherein the adhesive is selected from the group consisting of pressure sensitive adhesive liquid adhesives. 19. The method of polishing of claim 14, wherein the adhesive occupies greater than about 25 volume percent and less than about 120 volume percent of the notch volume of the replicated microstructures. 20. The polishing method of claim 14, further comprising a release liner disposed on the adhesive. 161856.doc