200823469 九、發明說明： 【發明所屬之技術領域】 本發明係有關於—種測試治具，特別係有關於可適 於各種封裝體之電性測試之測試治具。 【先前技術】 晶片除了未封裝前之基本電性測試外，再經過封 步驟後仍需對封裝完成之封裝體進行完整之電性測試。如 第1圖所示，習之用於測試封裝體之電性功能之測試^ ⑽係包含有，110及一座體120，該蓋體110:; 以螺絲鎖固連接於該座體12G，或者該蓋冑110係可與該 座體120為一體成型之設計，該蓋體11〇係具有一容置： 111 ’該座體120係具有一通孔121及複數個彈性探針 122,由於該測試測具100係用以測試方型扁平式封裝技 術（Plastic Quad Flat Package，QFP )，因此該些彈性探針 122之排列設置係環繞於該座體12〇，將一待測之封裝體 (圖未繪出）放置於該座體12〇，該封裝體之複數個引腳 (圖未繪出）係接觸該些彈性探針122，再將該蓋體丄W 壓合於該座體iso,使該封裝體固定於該測試治具1〇〇並 將該測試治具100接合於一電性測試機台（圖未繪出）， 即可得知該封裝體之完整電性，然而封裝體之種類及尺寸 眾多，並非只有方型扁平式封裝，其他如超薄方型扁平式 封裝（Low Profile Plastic Quad FlatPackage，LQFp)或球 格陣列封裝（BallGridArray，BGA)等封裝技術所形成之 封裝體於封裝完成後同樣需要進行完整之電性測試，由於 6 200823469 f知封裝體之測試必須將待測之封裝體放置於該测試治 具之該座體並接觸該些彈性探針，目&封測I中必須具備 有符合各種封裴體尺寸之測試治具，且在上述之各種封裝 體中球礼陣列封裝之測試治具非常昂貴，無形中增加了 製造成本。 【發明内容】 本叙月之主要目的係在於提供一種測試治具，該測試 治具之T承載裝置係具有—載台及複數個支架，該測試治 =:一壓觸裝置係具有一升降部及一壓觸部，該升降部係 :邊於该載台之一通孔，該壓觸部係連接該升降部且位於 該載台之下方，該壓觸部係具有一接觸表面以接合一固定 塊。藉由轉動該壓觸裝置之該升降部，使該壓觸部可進行 上升或下降之作動。且由於該測試治具係結合於一測試基 f且㈣試治具之該壓觸部係接合於該固定塊，利用㈣ 觸但於該測試基座内之待測封裝體，使待測封裝體 凡王接觸該測試基座之測試端，因此不需將待測封裝體放 置於㈣心具内，故該測試治具係適用於各種待測封裝 體之尺寸’達到降低生產成本之功效。 依本發明之一種測試治具，其係用以結合於-測試基 座主要包含一承載裝置以纟一屡觸裝1，該承載裝置係 ^ 载0及複數個支架，該载台係具有一通孔，該些支 ，係連接於該載台，該壓觸裝置係具有—升降部及一屬觸 ^該升降部係穿設於該通孔，該壓觸部係連接於該升降 部且位於該載台之下方，該壓觸部係具有一接觸表面。 200823469 【實施方式】 請參閱第2 3 m& 4占， 圖依據本發明之一具體實施例係揭 示一種測試治且？ηΛ /、 主要包含一承載裝置210以及一壓 觸裝置220，該是哉# 表載裝置210係具有一載台211及複數個 支架212，該載a ? η後 士 口 1係具有一通孔2 1 3，其中該承載裝 置210之該载台211俜 、 货'力具有至少一導桿設置孔214，該 孔214係位於該通孔213之周圍，該些支架 係連接於該载台211，該承載裝置2ι〇之該些支架⑴係 另具有至少一定位孔215及至少一固定孔216。該壓觸裝200823469 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a test fixture, and more particularly to a test fixture suitable for electrical testing of various packages. [Prior Art] In addition to the basic electrical test before the package, the wafer still needs to be fully tested for electrical properties after the package is completed. As shown in FIG. 1 , the test for testing the electrical function of the package ^ (10) includes, 110 and a body 120, the cover 110:; is screwed to the seat 12G, or The cover 110 is integrally formed with the base 120. The cover 11 has an accommodation: 111 'The base 120 has a through hole 121 and a plurality of elastic probes 122 due to the test. The measuring tool 100 is used to test a square quad flat package (QFP). Therefore, the arrangement of the elastic probes 122 surrounds the base 12〇, and a package to be tested is shown. Not shown in the block body 12, a plurality of pins (not shown) of the package contact the elastic probes 122, and then the cover body 丄W is pressed against the seat body iso, The package is fixed to the test fixture 1 and the test fixture 100 is bonded to an electrical test machine (not shown), and the complete electrical properties of the package are known. There are many types and sizes, not only square flat packages, others such as ultra-thin square flat package (Low Profile) The package formed by the packaging technology such as Plastic Quad FlatPackage (LQFp) or Ball Grid Array (BGA) also needs to perform complete electrical test after the package is completed. As the test of 6 200823469 f must be tested The package is placed on the body of the test fixture and is in contact with the elastic probes. The test fixture must have a test fixture conforming to various seal sizes, and in the above various packages. The test fixtures of the mid-ball array package are very expensive, which inevitably increases the manufacturing cost. SUMMARY OF THE INVENTION The main purpose of the present invention is to provide a test fixture having a T-bearing device having a carrier and a plurality of brackets, the test treatment: a pressure-contact device having a lifting portion And a pressing portion, the pressing portion is connected to the lifting portion and located under the loading platform, and the pressing portion has a contact surface for engaging and fixing Piece. By rotating the lifting portion of the pressure contact device, the pressure contact portion can be raised or lowered. And the test fixture is coupled to a test base f and (4) the pressure contact portion of the test fixture is bonded to the fixed block, and the package to be tested is touched by the test package in the test pedestal to make the package to be tested The body king contacts the test end of the test pedestal, so there is no need to place the package to be tested in the (4) heart tool, so the test fixture is suitable for the size of various packages to be tested to achieve the effect of reducing production cost. According to the present invention, a test fixture for binding to a test base mainly includes a carrying device for carrying a plurality of contacts 1 , the carrying device is configured to carry 0 and a plurality of brackets, and the carrier has a pass a hole, the branch is connected to the stage, the pressure contact device has a lifting portion and a lifting portion, the lifting portion is disposed through the through hole, and the pressing portion is connected to the lifting portion and located Below the stage, the pressure contact portion has a contact surface. [Embodiment] Please refer to the 2 3 m& 4, which shows a test according to an embodiment of the present invention. Λ Λ /, mainly includes a carrying device 210 and a pressure-contacting device 220, which is a 哉# surface-loading device 210 having a loading platform 211 and a plurality of brackets 212, the stern port 1 has a through hole 2 1 3, wherein the carrier 211 of the carrying device 210 has at least one guiding hole 214, and the hole 214 is located around the through hole 213, and the brackets are connected to the loading platform 211. The brackets (1) of the carrying device 2 ι have at least one positioning hole 215 and at least one fixing hole 216. The pressure touch
置 2 2 0 係具有 一 44- jt|T 9 0 1 TJL 升争$ 221及一壓觸部222,該升降部221 係穿設於該通孔213，兮it欠μ 3表升降部221係具有一旋轉頭 2 21 a ’該旋轉頭2 2 1 a在目士 係具有一凹槽（圖未繪出），其中該 升降部221係可為螺桿，嗜 干忑通孔21 3係具有螺紋，該升降 部22 1可於該通孔2 1 3内銘會τ /4； ye ^ Γ-The 2 2 0 system has a 44-jt|T 9 0 1 TJL ups and a pressure contact portion 222, and the lifting portion 221 is passed through the through hole 213, and the 欠it ows the μ 3 table lifting portion 221 Having a rotating head 2 21 a 'the rotating head 2 2 1 a has a groove (not shown) in the mesh system, wherein the lifting portion 221 can be a screw, and the dry-through hole 21 3 has a thread The lifting portion 22 1 can be τ /4 in the through hole 2 1 3; ye ^ Γ-
Jf夕勳’使得該壓觸裝置220可上 升或下降作動，該壓觸部229後、* @ Μ # i啊Η 222係連接於該升降部221且位 於該載台 211之下方，对敝雜如 心卜万該壓觸部222係具有一接觸表面 223。此外，該升降部221係另具有複數個輔助桿224，該 些輔助桿224㈣置於該旋轉頭22U μ以控制該升降 部221之升降作動。較佳地，該測試治具雇係另包含有 一中空轴承230、至少一塞4曰。ytn H 1 夕冷杯240及一彈簧250，該中空 軸承230係設置於該導桿設置孔214@，該導桿24〇係穿 設於該導桿設置孔214且穿設於該中空轴承23〇，該導桿 240之一端241係具有螺紋並結合於該壓觸部222之一結 合孔225’該導桿240之另一端242係結合於該升降部221 8 200823469 之該旋轉頭221a之凹槽内，以使該導桿24〇固定於旋轉 頭22la，該彈簧2S0係套設於該導桿24〇，且該彈簧25〇 係被限位於該中空軸承230之上方，該彈簧250係用以調 整該升降部221下降時所造成之公差效應。請再參閱第3 圖，該壓觸裝置220之該壓觸部222係另具有至少一預留 孔226，該預留孔226係用以設置溫度感應計、真空感應 計、靜電放電感應計或加熱器感應計。 此外，請參閱第4圖，該壓觸裝置22〇係另包含有一 固定塊227，該固定塊227係設置於該壓觸部222之該接 觸表面223，該固定塊227係具有一扣接件227&及一凸出 部227b，該扣接件227a係用以將該固定塊227扣接於該 壓觸部222。 請參閱帛5圖，-待測封裝冑a係放置於一測試基座 10之-容置槽11内’將該承載裝置21〇之該定位孔215 對準該測試基座H)之一定位柱（圖未緣出），利用複數個 螺絲（圖未纷出）穿設於該些支架212之該些固定孔 以將該測試治具200固定於該測試基座1〇，利用該些輔助 桿224轉動該升降部221之該旋轉頭221a，使該壓觸裝置 220往下移動至該固定塊227之該凸出部咖壓觸該待测 封裝體A，由於該測試治具200係結合於該測試基座1〇 且該測試治具200之該壓觸部222係接合於該固定塊 22八其係利用該固定塊227壓觸位於該測試基座ι〇内之. 待測封裝體A ’使待測封襄體A完全接觸該測試基座切 之測試端，以測試該待測封裝體A之完整電性，因此不需 9 200823469 將待測封裝體A放置於該測試治具200内即可测得兮待货 封裝體A之完整電性，故該測試治具200係適用於 ^ 測封裝體A而不需依照待測封裝體之尺寸來選擇測試户 具’達到降低生產成本之功效。 【圖式簡單說明】 弟1圖： 第2圖： 習知測試治具之立體圖。Jf Xi Xun's the pressure contact device 220 can be raised or lowered, and the pressure contact portion 229 is connected to the lifting portion 221 and below the loading table 211, and is noisy. For example, the pressure contact portion 222 has a contact surface 223. Further, the lifting portion 221 has a plurality of auxiliary levers 224, and the auxiliary levers 224 (four) are placed on the rotating head 22U to control the lifting and lowering of the lifting portion 221. Preferably, the test fixture employs a hollow bearing 230 and at least one plug. The ytn H 1 is a cold cup 240 and a spring 250. The hollow bearing 230 is disposed on the guide rod setting hole 214@. The guide rod 24 is disposed through the guide rod setting hole 214 and penetrates the hollow bearing 23 The one end 241 of the guiding rod 240 is threaded and coupled to one of the pressing portions 222. The other end 242 of the guiding rod 240 is coupled to the concave portion 221a of the lifting portion 221 8 200823469. In the slot, the guide rod 24 is fixed to the rotating head 22la, the spring 2S0 is sleeved on the guiding rod 24〇, and the spring 25 is restrained above the hollow bearing 230, and the spring 250 is used. To adjust the tolerance effect caused when the lifting portion 221 is lowered. Referring to FIG. 3 again, the pressure contact portion 222 of the pressure contact device 220 further has at least one reserved hole 226 for setting a temperature sensor, a vacuum sensor, an electrostatic discharge sensor or Heater sensor. In addition, referring to FIG. 4 , the pressing device 22 further includes a fixing block 227 disposed on the contact surface 223 of the pressure contact portion 222 , and the fixing block 227 has a fastening component. The 227& and a protruding portion 227b are used to fasten the fixing block 227 to the pressing portion 222. Referring to FIG. 5, the package to be tested is placed in the receiving slot 11 of the test base 10 and the positioning hole 215 of the carrying device 21 is aligned with the test base H. The plurality of screws (not shown) are inserted through the plurality of screws (not shown) to the fixing holes of the brackets 212 to fix the test fixture 200 to the test base 1 The rod 224 rotates the rotating head 221a of the lifting portion 221, and the pressing device 220 moves downward until the protruding portion of the fixing block 227 presses against the package A to be tested, because the test fixture 200 is combined The test pedestal 1 〇 and the pressure contact portion 222 of the test fixture 200 is bonded to the fixed block 22 and is pressed by the fixing block 227 in the test pedestal ι. A 'the test package A to be tested is completely in contact with the test end of the test pedestal to test the complete electrical properties of the package A to be tested, so that the test package A to be tested is placed in the test fixture without 9 200823469 The complete electrical property of the package A to be inspected can be measured within 200, so the test fixture 200 is suitable for measuring package A without Measured according to the size of the package having the user selected test 'to reduce the effect of the production cost. [Simple diagram of the drawing] Brother 1 picture: Figure 2: A perspective view of a conventional test fixture.
依據本發明之一具體實施例，一種測試治具之元 件分解圖。 第3圖： 弟4圖： 第5圖： 依據本發明之一具體實施例，該測試治具之立體 圖。 依據本發明之一具體實施例，該測試治具接合有 一固定塊之立體圖。 依據本發明之一具體實施例，該測試治具結合於 一測試基座之截面示意圖。 【主要元件符號說明】 10 測試基座 11 容置槽 100 測試治具 110 蓋體 111 容置槽 120 座體 121 通孔 122 彈性探針 200 測試治具 210 承载裝置 211 載台 212 支架 213 通孔 214 導桿設置孔 215 定位孔 216 固定孔 220 壓觸裝置 221 升降部 221a 旋轉頭 222 壓觸部 223 接觸表面 200823469 224 輔助桿 225 結合孔 226 預留孔 227 固定塊 227a 扣接件 227b 凸出部 230 中空軸承 240 導桿 241 一端 242 另一端 250 彈簀 A 待測封裝體In accordance with an embodiment of the present invention, an exploded view of an element of a test fixture. Figure 3: Figure 4: Figure 5: A perspective view of the test fixture in accordance with an embodiment of the present invention. In accordance with an embodiment of the present invention, the test fixture is joined to a perspective view of a fixed block. According to one embodiment of the invention, the test fixture is coupled to a schematic cross-sectional view of a test susceptor. [Main component symbol description] 10 Test base 11 accommodating groove 100 Test fixture 110 Cover body 111 accommodating groove 120 Seat 121 Through hole 122 Elastic probe 200 Test fixture 210 Carrier device 211 Carrier 212 Bracket 213 Through hole 214 Guide rod setting hole 215 Positioning hole 216 Fixing hole 220 Pressing device 221 Lifting portion 221a Rotating head 222 Pressing portion 223 Contact surface 200823469 224 Auxiliary rod 225 Bonding hole 226 Reserved hole 227 Fixing block 227a Fastening member 227b Projection 230 hollow bearing 240 guide rod 241 one end 242 the other end 250 magazine A test package
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