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SG10201804286QA - Wafer producing apparatus - Google Patents

Wafer producing apparatus

Info

Publication number
SG10201804286QA
SG10201804286QA SG10201804286QA SG10201804286QA SG10201804286QA SG 10201804286Q A SG10201804286Q A SG 10201804286QA SG 10201804286Q A SG10201804286Q A SG 10201804286QA SG 10201804286Q A SG10201804286Q A SG 10201804286QA SG 10201804286Q A SG10201804286Q A SG 10201804286QA
Authority
SG
Singapore
Prior art keywords
ingot
wafer
unit
producing apparatus
holding
Prior art date
Application number
SG10201804286QA
Inventor
Iizuka Kentaro
Omiya Naoki
Mori Takashi
Yamanaka Satoshi
Hirata Kazuya
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201804286QA publication Critical patent/SG10201804286QA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02373—Group 14 semiconducting materials
    • H01L21/02378—Silicon carbide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02656—Special treatments
    • H01L21/02664—Aftertreatments
    • H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
    • H01L21/02686—Pulsed laser beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
    • H01L29/1608—Silicon carbide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)

Abstract

WAFER PRODUCING APPARATUS Disclosed herein is a wafer producing apparatus for producing an SiC wafer from a single crystal SiC ingot. The wafer producing apparatus includes a holding unit for holding the ingot, a flattening unit for grinding the upper surface of the ingot held by the holding unit, thereby flattening the upper surface of the ingot, a laser applying unit for setting the focal point of a laser beam having a transmission wavelength to the ingot inside the ingot at a predetermined depth from the upper surface of the ingot held by the holding unit, the predetermined depth corresponding to the thickness of the wafer to be produced, and next applying the laser beam to the ingot to thereby form a separation layer for separating the wafer from the ingot, a wafer separating unit for holding the upper surface of the ingot to separate the wafer from the ingot along the separation layer, and a wafer storing unit for storing the wafer separated from the ingot. (Figure 1)
SG10201804286QA 2017-06-08 2018-05-21 Wafer producing apparatus SG10201804286QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017113391A JP6904793B2 (en) 2017-06-08 2017-06-08 Wafer generator

Publications (1)

Publication Number Publication Date
SG10201804286QA true SG10201804286QA (en) 2019-01-30

Family

ID=64332889

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201804286QA SG10201804286QA (en) 2017-06-08 2018-05-21 Wafer producing apparatus

Country Status (8)

Country Link
US (1) US10981250B2 (en)
JP (1) JP6904793B2 (en)
KR (1) KR102482218B1 (en)
CN (1) CN109037027B (en)
DE (1) DE102018208190B4 (en)
MY (1) MY192235A (en)
SG (1) SG10201804286QA (en)
TW (1) TWI754744B (en)

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US12054415B2 (en) * 2018-03-29 2024-08-06 Corning Incorporated Methods for laser processing rough transparent workpieces using pulsed laser beam focal lines and a fluid film
US10576585B1 (en) 2018-12-29 2020-03-03 Cree, Inc. Laser-assisted method for parting crystalline material
US11024501B2 (en) 2018-12-29 2021-06-01 Cree, Inc. Carrier-assisted method for parting crystalline material along laser damage region
US10562130B1 (en) 2018-12-29 2020-02-18 Cree, Inc. Laser-assisted method for parting crystalline material
US10611052B1 (en) 2019-05-17 2020-04-07 Cree, Inc. Silicon carbide wafers with relaxed positive bow and related methods
JPWO2021025086A1 (en) 2019-08-06 2021-02-11
CN114423888A (en) 2019-09-27 2022-04-29 学校法人关西学院 Method and apparatus for manufacturing semiconductor substrate
CN114423890B (en) 2019-09-27 2024-10-25 学校法人关西学院 Method for manufacturing SiC semiconductor device and SiC semiconductor device
JP7358193B2 (en) * 2019-10-28 2023-10-10 株式会社ディスコ Wafer processing method
JP7443053B2 (en) * 2019-12-26 2024-03-05 株式会社ディスコ laser processing equipment
JP2022096455A (en) * 2020-12-17 2022-06-29 株式会社ディスコ Wafer generation device
DE102022213809A1 (en) 2022-12-16 2024-06-27 Apag Elektronik Ag Method and device for automated laser cutting of workpiece parts from a flat workpiece

Family Cites Families (20)

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JP2000094221A (en) 1998-09-24 2000-04-04 Toyo Advanced Technologies Co Ltd Electric discharge wire saw
JP4464113B2 (en) * 2003-11-27 2010-05-19 株式会社ディスコ Wafer processing equipment
KR20070049349A (en) * 2005-11-08 2007-05-11 삼성전자주식회사 Wafer back grinding apparatus having sawing unit
JP2007165802A (en) * 2005-12-16 2007-06-28 Disco Abrasive Syst Ltd Grinding machine and method for substrate
JP4909657B2 (en) * 2006-06-30 2012-04-04 株式会社ディスコ Processing method of sapphire substrate
JP2009302369A (en) * 2008-06-16 2009-12-24 Disco Abrasive Syst Ltd Method and apparatus for processing plate-like object
JP2010021398A (en) * 2008-07-11 2010-01-28 Disco Abrasive Syst Ltd Method of treating wafer
RU2459691C2 (en) * 2010-11-29 2012-08-27 Юрий Георгиевич Шретер Method of separating surface layer of semiconductor chip (versions)
JP5480169B2 (en) * 2011-01-13 2014-04-23 浜松ホトニクス株式会社 Laser processing method
JP5912287B2 (en) * 2011-05-19 2016-04-27 株式会社ディスコ Laser processing method and laser processing apparatus
JP5917862B2 (en) * 2011-08-30 2016-05-18 浜松ホトニクス株式会社 Processing object cutting method
JP2013237097A (en) * 2012-05-17 2013-11-28 Disco Corp Modified layer forming method
US9196503B2 (en) * 2012-08-23 2015-11-24 Michael Xiaoxuan Yang Methods for fabricating devices on semiconductor substrates
JP2014053510A (en) * 2012-09-07 2014-03-20 Toshiba Corp End face processing method and end face processing device
JP6341639B2 (en) 2013-08-01 2018-06-13 株式会社ディスコ Processing equipment
JP6328485B2 (en) * 2014-05-13 2018-05-23 株式会社ディスコ Wafer processing method
JP2015223589A (en) * 2014-05-26 2015-12-14 株式会社ディスコ METHOD FOR PRODUCTION OF SiC PLATE-LIKE WORKPIECE
US9789623B2 (en) * 2014-07-25 2017-10-17 Symmetry Medical Manufacturing, Inc. Method and apparatus for releasing laser cut work pieces
JP6391471B2 (en) * 2015-01-06 2018-09-19 株式会社ディスコ Wafer generation method
JP6444249B2 (en) * 2015-04-15 2018-12-26 株式会社ディスコ Wafer generation method

Also Published As

Publication number Publication date
TW201904739A (en) 2019-02-01
KR102482218B1 (en) 2022-12-27
DE102018208190B4 (en) 2023-11-30
KR20180134285A (en) 2018-12-18
DE102018208190A1 (en) 2018-12-13
JP6904793B2 (en) 2021-07-21
TWI754744B (en) 2022-02-11
CN109037027B (en) 2024-02-27
US10981250B2 (en) 2021-04-20
CN109037027A (en) 2018-12-18
US20180354067A1 (en) 2018-12-13
MY192235A (en) 2022-08-10
JP2018207034A (en) 2018-12-27

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