Nothing Special   »   [go: up one dir, main page]

SE0301381D0 - Extruded heat sink with integrated thermosyphon - Google Patents

Extruded heat sink with integrated thermosyphon

Info

Publication number
SE0301381D0
SE0301381D0 SE0301381A SE0301381A SE0301381D0 SE 0301381 D0 SE0301381 D0 SE 0301381D0 SE 0301381 A SE0301381 A SE 0301381A SE 0301381 A SE0301381 A SE 0301381A SE 0301381 D0 SE0301381 D0 SE 0301381D0
Authority
SE
Sweden
Prior art keywords
thermosyphon
base
lid
heat sink
integrated
Prior art date
Application number
SE0301381A
Other languages
English (en)
Inventor
Jin Hou
Bo Bengtsson
Seppo Tovinen
Anders Norlin
Original Assignee
Sapa Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sapa Ab filed Critical Sapa Ab
Priority to SE0301381A priority Critical patent/SE0301381D0/sv
Publication of SE0301381D0 publication Critical patent/SE0301381D0/sv
Priority to EP04076228A priority patent/EP1477762A3/en
Priority to US10/833,324 priority patent/US20050056403A1/en
Priority to CN2004100431418A priority patent/CN1551724B/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/16—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes extruded
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
SE0301381A 2003-05-12 2003-05-12 Extruded heat sink with integrated thermosyphon SE0301381D0 (sv)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SE0301381A SE0301381D0 (sv) 2003-05-12 2003-05-12 Extruded heat sink with integrated thermosyphon
EP04076228A EP1477762A3 (en) 2003-05-12 2004-04-26 Thermosyphon and method for producing it
US10/833,324 US20050056403A1 (en) 2003-05-12 2004-04-28 Thermosyphon and method for producing it
CN2004100431418A CN1551724B (zh) 2003-05-12 2004-05-12 热虹吸管及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0301381A SE0301381D0 (sv) 2003-05-12 2003-05-12 Extruded heat sink with integrated thermosyphon

Publications (1)

Publication Number Publication Date
SE0301381D0 true SE0301381D0 (sv) 2003-05-12

Family

ID=20291279

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0301381A SE0301381D0 (sv) 2003-05-12 2003-05-12 Extruded heat sink with integrated thermosyphon

Country Status (4)

Country Link
US (1) US20050056403A1 (sv)
EP (1) EP1477762A3 (sv)
CN (1) CN1551724B (sv)
SE (1) SE0301381D0 (sv)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6935409B1 (en) 1998-06-08 2005-08-30 Thermotek, Inc. Cooling apparatus having low profile extrusion
US7147045B2 (en) 1998-06-08 2006-12-12 Thermotek, Inc. Toroidal low-profile extrusion cooling system and method thereof
US7305843B2 (en) * 1999-06-08 2007-12-11 Thermotek, Inc. Heat pipe connection system and method
US9113577B2 (en) 2001-11-27 2015-08-18 Thermotek, Inc. Method and system for automotive battery cooling
US7198096B2 (en) * 2002-11-26 2007-04-03 Thermotek, Inc. Stacked low profile cooling system and method for making same
US7857037B2 (en) * 2001-11-27 2010-12-28 Thermotek, Inc. Geometrically reoriented low-profile phase plane heat pipes
US7958935B2 (en) * 2004-03-31 2011-06-14 Belits Computer Systems, Inc. Low-profile thermosyphon-based cooling system for computers and other electronic devices
EP1738127B1 (en) * 2004-03-31 2011-10-05 Belits Computer Systems, Inc. Low-profile thermosyphon-based cooling system for computers and other electronic devices
US7772456B2 (en) * 2004-06-30 2010-08-10 Kimberly-Clark Worldwide, Inc. Stretchable absorbent composite with low superaborbent shake-out
TWI262285B (en) * 2005-06-03 2006-09-21 Foxconn Tech Co Ltd Loop-type heat exchange apparatus
US7900692B2 (en) * 2005-10-28 2011-03-08 Nakamura Seisakusho Kabushikigaisha Component package having heat exchanger
CN101155497A (zh) * 2006-09-29 2008-04-02 诺亚公司 相变散热装置与方法
CN101184381A (zh) * 2006-11-14 2008-05-21 诺亚公司 具有相变散热装置的机壳
JP5334288B2 (ja) * 2008-09-05 2013-11-06 日本モレックス株式会社 ヒートパイプおよび電子機器
EP2246653B1 (en) * 2009-04-28 2012-04-18 ABB Research Ltd. Twisted tube thermosyphon
EP2246654B1 (en) * 2009-04-29 2013-12-11 ABB Research Ltd. Multi-row thermosyphon heat exchanger
US9091489B2 (en) 2010-05-14 2015-07-28 Paragon Space Development Corporation Radiator systems
CN102338581B (zh) * 2010-07-23 2013-10-30 奇鋐科技股份有限公司 热虹吸板结构
CN102338583B (zh) * 2010-07-23 2014-05-07 奇鋐科技股份有限公司 一种压力差驱动热板
CN103384808B (zh) * 2011-02-22 2016-12-28 日本电气株式会社 冷却装置及其制造方法
US20130291555A1 (en) 2012-05-07 2013-11-07 Phononic Devices, Inc. Thermoelectric refrigeration system control scheme for high efficiency performance
WO2013169774A2 (en) 2012-05-07 2013-11-14 Phononic Devices, Inc. Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance
JP5754431B2 (ja) * 2012-10-10 2015-07-29 日本軽金属株式会社 ヒートシンクの製造方法及び伝熱板の製造方法
ITBO20120618A1 (it) * 2012-11-09 2014-05-10 Mecc Al S R L A Socio Unico Procedimento per la realizzazione di un dissipatore e dissipatore cosi' ottenuto
CN103813695B (zh) * 2012-11-13 2016-08-17 台达电子工业股份有限公司 虹吸式散热装置
US9593871B2 (en) 2014-07-21 2017-03-14 Phononic Devices, Inc. Systems and methods for operating a thermoelectric module to increase efficiency
US10458683B2 (en) 2014-07-21 2019-10-29 Phononic, Inc. Systems and methods for mitigating heat rejection limitations of a thermoelectric module
JP6679573B2 (ja) 2014-08-28 2020-04-15 アアヴィッド・サーマロイ・エルエルシー 一体構成要素を備えたサーモサイホン
CN108917439B (zh) * 2018-08-30 2024-04-19 无锡格林沃科技有限公司 相变散热器
CN109900146A (zh) * 2019-03-28 2019-06-18 南昌大学 一种带有热虹吸回路的双锥度微通道散热器

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2151769B (en) 1983-12-21 1987-11-04 Marconi Electronic Devices Heat sink arrangement
DE3504992A1 (de) * 1985-02-14 1986-08-14 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul mit integriertem waermerohr
DE3825981A1 (de) * 1988-07-27 1990-02-15 Licentia Gmbh Isothermisierter kuehlkoerper
US5308920A (en) * 1992-07-31 1994-05-03 Itoh Research & Development Laboratory Co., Ltd. Heat radiating device
US5303768A (en) * 1993-02-17 1994-04-19 Grumman Aerospace Corporation Capillary pump evaporator
US5394936A (en) * 1993-03-12 1995-03-07 Intel Corporation High efficiency heat removal system for electric devices and the like
JPH06266474A (ja) * 1993-03-17 1994-09-22 Hitachi Ltd 電子機器装置及びラップトップ型電子機器装置
JP3385482B2 (ja) * 1993-11-15 2003-03-10 株式会社日立製作所 電子機器
US5529115A (en) * 1994-07-14 1996-06-25 At&T Global Information Solutions Company Integrated circuit cooling device having internal cooling conduit
TW307837B (sv) * 1995-05-30 1997-06-11 Fujikura Kk
JP3634028B2 (ja) * 1995-09-08 2005-03-30 住友精密工業株式会社 半導体素子冷却装置
US5725049A (en) * 1995-10-31 1998-03-10 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Capillary pumped loop body heat exchanger
JPH10154781A (ja) * 1996-07-19 1998-06-09 Denso Corp 沸騰冷却装置
DE19805930A1 (de) * 1997-02-13 1998-08-20 Furukawa Electric Co Ltd Kühlvorrichtung
US6227287B1 (en) * 1998-05-25 2001-05-08 Denso Corporation Cooling apparatus by boiling and cooling refrigerant
DE60007674T2 (de) * 1999-03-05 2004-12-09 Denso Corp., Kariya Siede- und Kühlvorrichtung
US6360814B1 (en) * 1999-08-31 2002-03-26 Denso Corporation Cooling device boiling and condensing refrigerant
US6216343B1 (en) 1999-09-02 2001-04-17 The United States Of America As Represented By The Secretary Of The Air Force Method of making micro channel heat pipe having corrugated fin elements
KR100338810B1 (ko) * 1999-11-08 2002-05-31 윤종용 냉각장치
DE10006215A1 (de) * 2000-02-11 2001-08-16 Abb Semiconductors Ag Baden Kühlvorrichtung für ein Hochleistungs-Halbleitermodul
US6418017B1 (en) 2000-03-30 2002-07-09 Hewlett-Packard Company Heat dissipating chassis member
JP2002141449A (ja) * 2000-10-31 2002-05-17 Denso Corp 沸騰冷却器
US6483705B2 (en) * 2001-03-19 2002-11-19 Harris Corporation Electronic module including a cooling substrate and related methods
US6609560B2 (en) * 2001-04-28 2003-08-26 Samsung Electronics Co., Ltd. Flat evaporator
US6651735B2 (en) * 2001-05-15 2003-11-25 Samsung Electronics Co., Ltd. Evaporator of CPL cooling apparatus having fine wick structure
JP3946018B2 (ja) * 2001-09-18 2007-07-18 株式会社日立製作所 液冷却式回路装置
KR100438825B1 (ko) * 2001-10-29 2004-07-05 삼성전자주식회사 단열 수단을 구비하는 열 전달 장치
JP2004037039A (ja) * 2002-07-05 2004-02-05 Sony Corp 冷却装置、電子機器装置、表示装置及び冷却装置の製造方法
JP4032954B2 (ja) * 2002-07-05 2008-01-16 ソニー株式会社 冷却装置、電子機器装置、音響装置及び冷却装置の製造方法
JP2004077051A (ja) * 2002-08-20 2004-03-11 Sony Corp 熱輸送装置およびその製造方法

Also Published As

Publication number Publication date
CN1551724A (zh) 2004-12-01
CN1551724B (zh) 2010-08-04
US20050056403A1 (en) 2005-03-17
EP1477762A2 (en) 2004-11-17
EP1477762A3 (en) 2006-06-07

Similar Documents

Publication Publication Date Title
SE0301381D0 (sv) Extruded heat sink with integrated thermosyphon
US7106589B2 (en) Heat sink, assembly, and method of making
JP4391366B2 (ja) ヒートパイプを備えたヒートシンクおよびその製造方法
US6374905B1 (en) Scalable and modular heat sink-heat pipe cooling system
JP3119117U (ja) 熱管散熱器の構造
US20060032616A1 (en) Compound heat-dissipating device
US20130155616A1 (en) Hybrid heat sink and hybrid heat sink assembly for power module
ATE381780T1 (de) Kühlkörper mit gespaltenen rippen
TW511891U (en) A heat dissipating device
US8297341B2 (en) Heat dissipating structure and method of forming the same
FR2812382B1 (fr) Procede de fabrication d'une ailette d'echangeur de chaleur, ailettes selon le procede et module d'echange comportant ces ailettes
US20030155103A1 (en) Folded fin on edge heat sink
US20190234627A1 (en) Electric controller based on thermally superconductive heat dissipating plate and air conditioner outdoor unit
JPH02110296A (ja) 平板状ヒートパイプ
JP2010267435A (ja) Ｌｅｄ放熱装置およびｌｅｄ照明装置
CN205305315U (zh) 水冷式散热排及具有该散热排的散热装置
US20070151275A1 (en) Methods and apparatus for microelectronic cooling using a miniaturized vapor compression system
US20050135061A1 (en) Heat sink, assembly, and method of making
JP2000130972A (ja) 板型ヒートパイプとその製造方法
WO2023276938A1 (ja) 熱デバイス冷却用ヒートシンク
CN110198611B (zh) 散热装置
WO2023276940A1 (ja) 熱デバイス冷却用ヒートシンク
JPH05304383A (ja) 高出力電子機器用ヒートシンク
KR950034716A (ko) 히트 싱크 제조 방법, 히트 싱크 용도의 장치 및 열-발생 부품 냉각 장치
US20060102325A1 (en) Guiding fin heat sink