KR20240152125A - NTC thermistor element package and multi-channel temperature sensor using the same - Google Patents

Abstract

The present invention discloses an NTC thermistor element package and a multi-channel temperature sensor using the same, characterized by including: a first lead frame; a first lead terminal extending from one end of the first lead frame; a second lead frame arranged to be spaced apart from the first lead frame by a predetermined interval; a second lead terminal extending from one end of the second lead frame; a bare chip mounted on the first lead frame with a conductive adhesive; a conductive wire electrically connecting the bare chip and the second lead frame; and a mold part provided in a form in which portions of ends of the first lead terminal and the second lead terminal protrude outward and surround the first lead frame, the second lead frame, the bare chip, and the conductive wire.

Description

NTC thermistor element package and multi-channel temperature sensor using the same {NTC thermistor element package and multi-channel temperature sensor using the same}

The present invention relates to an NTC thermistor element package and a multi-channel temperature sensor using the same, characterized by including: a first lead frame; a first lead terminal extending from one end of the first lead frame; a second lead frame arranged to be spaced apart from the first lead frame by a predetermined interval; a second lead terminal extending from one end of the second lead frame; a bare chip mounted on the first lead frame with a conductive adhesive; a conductive wire electrically connecting the bare chip and the second lead frame; and a mold part provided in a form in which portions of ends of the first lead terminal and the second lead terminal protrude outward and surround the first lead frame, the second lead frame, the bare chip, and the conductive wire.

In general, temperature sensors are used in a variety of industrial fields, and are manufactured and used to suit the field of use.

Temperature sensors can be selected and used by considering the type of object being measured, the accuracy of measurement, etc.

In the existing industrial world, temperature sensors can be broadly classified into the following five types.

First, it is called a thermocouple, and it is a sensor that generates a small voltage when heat is applied to the junction of two metal wires with different characteristics. It is classified as K type or J type depending on the type of metal.

Next, there is an RTD temperature sensor that utilizes the fact that the resistance of platinum (Pt), a metal with 100Ω at 0 to 100°C, is proportional to temperature.

Next, there is a thermistor that has NTC (or PTC) characteristics sensed.

Next, there is a bimetallic method that uses the principle of overlapping two metal plates with different coefficients of thermal expansion into a plate or coil shape and bending depending on the temperature.

Finally, there is a gas pipe method that uses the principle of injecting gas into a sealed tube and changing the length of the corrugated tube according to the thermal expansion of the gas.

Among these, the NTC thermistor (Negative Coefficient Temperature thermistor) utilizes the property that resistance changes depending on temperature, and exhibits the characteristic that resistance decreases as temperature increases. Compared to other types of temperature sensors that utilize the resistance dependence on temperature, it is economical and has a stable signal, so it is used in various fields.

Figures 10a) to 10c) are schematic examples illustrating a conventional general NTC thermistor element. As illustrated, a conventional NTC thermistor element is typically formed by soldering two electrodes to a bare chip and then sealing them with epoxy or glass, and the other end of the electrode is electrically connected to a control unit of a temperature measurement target.

The above NTC thermistor element is electrically connected to the flexible printed circuit board by soldering at the ends of the first lead terminal and the second lead terminal protruding outside the mold portion, and is placed at a predetermined position of the temperature measurement target to measure the temperature.

However, a temperature sensor using a conventional NTC thermistor element can only measure one point of a temperature measurement target, and if the temperature is to be measured at multiple points or over a large area, a number of NTC thermistor elements corresponding to the measurement points must be prepared, and a number of electrodes connected to each NTC thermistor element must be connected to the PCB board of the temperature measurement target, which may cause a complex and cumbersome manufacturing process.

In addition, in the case of a temperature sensor using an NTC thermistor element being installed at a measuring point far from the PCB board among the various measuring points, the electrode length must be secured, and since the electrode may be exposed to the outside, there is a possibility of a short circuit or damage, and since the electrode is exposed to the outside, there may be an unsightly problem.

That is, conventional NTC thermistor elements have many difficulties in implementing multi-channel temperature sensors, and mass production of multi-channel temperature sensors also inevitably has many limitations.

Republic of Korea Patent Publication No. 10-2000-0028640 (Sub-characteristic thermistor device)

The present invention was invented to solve the above problems, and its purpose is to provide an NCT thermistor element capable of multi-channeling a temperature sensor and a multi-channel temperature sensor using the same.

For the above purpose, the present invention is characterized by including: a first lead frame; a first lead terminal extending from one end of the first lead frame; a second lead frame arranged to be spaced apart from the first lead frame by a predetermined interval; a second lead terminal extending from one end of the second lead frame; a bare chip mounted on the first lead frame with a conductive adhesive; a conductive wire electrically connecting the bare chip and the second lead frame; and a mold part provided in a form in which a portion of the ends of the first lead terminal and the second lead terminal protrudes outward and surrounds the first lead frame, the second lead frame, the bare chip, and the conductive wire.

In addition, the present invention includes a flexible printed circuit board (FPCB) formed to a predetermined length and having a plurality of NTC thermistor element packages arranged along the longitudinal direction on one surface; and an FPCB connector electrically connected to a connector provided on a control board separately from the flexible printed circuit board; wherein the NTC thermistor element package measures the temperature of the temperature measurement target while having ends of first and second lead terminals protruding outside the mold portion electrically connected to the flexible printed circuit board by soldering, and wherein the plurality of NTC thermistor element packages are coupled along the longitudinal direction on one surface of the temperature measurement target to simultaneously measure the temperature between certain points of the temperature measurement target, thereby improving the reliability of the measured value.

In addition, the present invention includes a heat dissipation tape including a main body film having a heat dissipation function, a first adhesive layer provided on one surface of the main body film and adhesively bonded to one surface of the flexible printed circuit board, a second adhesive layer provided on the other surface of the main body film and adhesively bonded to one surface of the temperature measurement target, and a release paper attached to the first adhesive layer and the second adhesive layer; and is characterized in that the heat dissipation tape can be attached to a curved surface of the temperature measurement target to measure the temperature.

In addition, the flexible printed circuit board of the present invention is characterized in that an opening is formed in an area corresponding to the mold portion.

In addition, the present invention is characterized in that the first lead terminal and the second lead terminal extend horizontally from the ends of the first lead frame and the second lead frame, so as to improve the adhesion between the NTC thermistor element package and the temperature measurement target by adhesively bonding the bottom surface of the mold portion with the first adhesive layer of the heat-dissipating tape, thereby increasing the temperature measurement accuracy and sensitivity and reducing the response speed.

The NTC thermistor element package according to the present invention, which is formed as described above, can be manufactured as a temperature sensor by being mounted on a PCB substrate, and in particular, the NTC thermistor element packages are arranged at a predetermined interval on a conductive substrate having a predetermined length, so that the temperature between predetermined points of a temperature measurement target can be measured simultaneously from a plurality of NTC thermistor element packages, thereby providing high reliability of the measured value.

In addition, a multi-channel temperature sensor using an NTC thermistor element package according to an embodiment of the present invention can be used by attaching it to a curved surface of a temperature measurement target using a heat dissipation tape.

In addition, according to an embodiment of the present invention, the flexible printed circuit board has an opening formed in an area corresponding to the mold portion, thereby minimizing interference with the measured value of the NTC thermistor element package, thereby improving reliability.

In addition, according to an embodiment of the present invention, since the first lead terminal and the second lead terminal extend horizontally from the ends of the first lead frame and the second lead frame, respectively, and are positioned higher than the bottom surface of the mold part, the bottom surface of the mold part is adhesively bonded to the first adhesive layer of the heat dissipation tape, thereby improving the adhesion between the NTC thermistor element package and the temperature measurement target, thereby improving the temperature measurement accuracy and sensitivity, and reducing the response speed, which is the response time.

Figures 1a) and 1b) are schematic examples illustrating an NTC thermistor element package according to the present invention.
FIG. 2 is a schematic diagram illustrating a multi-channel temperature sensor using an NTC thermistor element package according to the present invention.
Figure 3 is a usage state diagram of a multi-channel temperature sensor using an NTC thermistor element package according to an embodiment of the present invention.
Figure 4 is a schematic illustration of a heat dissipation tape according to an embodiment of the present invention.
FIGS. 5 and 6 are schematic illustrations for explaining an opening formed in a flexible printed circuit board according to an embodiment of the present invention.
FIG. 7 is a schematic illustration showing a state in which the first lead terminal and the second lead terminal extend in a horizontal direction according to an embodiment of the present invention.
Figures 8 and 9 are application examples of a multi-channel temperature sensor using an NTC thermistor element package according to an embodiment of the present invention.
Figures 10a) to 10c) are schematic examples for explaining conventional technology.

Hereinafter, the NTC thermistor element package according to the present invention and the multi-channel temperature sensor using the same will be described in more detail with reference to the attached drawings. In describing with reference to the attached drawings, identical or corresponding components are assigned the same drawing numbers and redundant descriptions thereof will be omitted.

The present invention discloses an NCT thermistor element package which can be manufactured as a temperature sensor by being mounted on a PCB substrate, and in particular, which can simultaneously measure multiple points of temperature between certain points of a temperature measurement target, thereby providing high reliability of measured values, and a multi-channel temperature sensor using the same.

Figures 1a) and 1b) are schematic illustrations of an NTC thermistor element package according to the present invention.

First, as shown in Fig. 1a), the present invention is provided with a pair of lead frames consisting of a first lead frame (110) and a second lead frame (120).

The above first lead frame (110) is made of a metal material and can be formed with a predetermined area and thickness so that a bare chip, which will be described later, can be stably mounted thereon.

The above second lead frame (120) is in the shape of a square or rectangular plate, is made of metal, and is placed on the side of the first lead frame.

The above first lead frame (110) and second lead frame (120) serve as leads that transfer the electrical characteristics of the semiconductor chip to an external terminal, a printed circuit board (PCB), and as frames that mount a semiconductor bare chip on the PCB, and are mounted spaced apart from each other on a conductive substrate.

In addition, the present invention includes a first lead terminal (111) extending from one end of the first lead frame; and a second lead terminal (121) extending from one end of the second lead frame.

The above first lead terminal (111) may be a terminal of (+) polarity, and the above second lead terminal (121) may be a terminal of (-) polarity.

The above first lead terminal (111) and second lead terminal (121) are grounded with the (+) terminal and the (-) terminal of a conductive substrate, for example, a flexible printed circuit board (FPCB) to be described later.

Next, a bare chip (130) is mounted on the upper surface of the first lead frame using a conductive adhesive.

The above bare chip (130) can be mounted on the first lead frame in a COB (Chip On Board) form.

The above bare chip (130) is a known element for a temperature sensor, and a detailed description thereof will be omitted.

Next, the present invention provides a conductive wire (140) that electrically connects a bare chip (130) on the first lead frame (110) and the second lead frame (120).

The above conductive wire may be made of a material with excellent conductivity, for example, gold.

In addition, the present invention is provided with a mold part (150) that is provided in a form that surrounds the first lead frame, the second lead frame, the bare chip, and the conductive wire.

The above mold part (150) can protect the first lead frame (110), the second lead frame (120), the bare chip (130), and the conductive wire (140), and can be formed in an appropriate shape so as to effectively block the inflow of contaminants such as moisture and foreign substances from the outside.

Here, a portion of the end of the first lead terminal (111) and the second lead terminal (121) protrudes outside the mold part (150), and the protruding terminals are soldered to the (+) terminal and (-) terminal on the PCB to be electrically connected to each other.

Meanwhile, in Fig. 1a), the mold part (150) is illustrated in a transparent form, but this is only an example for explaining the internal structure of the NTC thermistor element package (100) according to the present invention and does not limit the scope of the present invention. For example, the mold part (150) may be made of a transparent or translucent material as in Fig. 1a), or may be made opaque as in 1b).

Next, FIG. 2 is a schematic diagram illustrating a multi-channel temperature sensor (200) using an NTC thermistor element package (100) according to the present invention.

First, the multi-channel temperature sensor (200) according to the present invention includes a flexible printed circuit board (210) as a conductive substrate.

The above flexible printed circuit board (210) is a flexible printed circuit board (FPCB) that provides excellent flexibility and can be flexibly folded or bent around a temperature measurement target.

The above flexible printed circuit board (210) preferably has a predetermined length so that a plurality of the above NTC thermistor element packages (100) can be arranged at a predetermined interval to enable multi-channel temperature sensor. For example, the above flexible printed circuit board (210) may be formed in a band shape having a predetermined width and length as shown in Fig. 2.

In addition, an FPCB connector (220) is provided at one end of the flexible printed circuit board (210). The FPCB connector (220) is electrically connected to a control board or a driving system connector (not shown) provided separately from the flexible printed circuit board.

In addition, when the NTC thermistor element package (100) is mounted on the flexible printed circuit board (210), the ends of the first lead terminal (111) and the second lead terminal (121) protruding outside of the mold part and the flexible printed circuit board (200) are soldered so that the NTC thermistor element package (100) is electrically connected, thereby measuring the temperature of the temperature measurement target (400).

The temperature sensor of the present invention as described above is manufactured by combining the bare chip (130) in a surface mount device (SMD) manner, and in particular, when a plurality of the NTC thermistor element packages (100) are arranged at a certain interval on one surface of the flexible printed circuit board (210) and combined with a temperature measurement target, it is possible to simultaneously measure the temperature of several points between certain points of the temperature measurement target from each NTC thermistor element package (100), thereby enabling multi-channel measurement, and thus providing high reliability of the measured value.

Next, a multi-channel temperature sensor using an NTC thermistor element package according to an embodiment of the present invention may include a heat dissipation tape (300) that enables adhesive bonding to a temperature measurement target.

A heat dissipation tape (300) according to an embodiment of the present invention may include, as shown in FIG. 4, a main body film (310) having a heat dissipation function, first and second adhesive layers (320, 330) provided on both sides of the main body film, and a release paper (340) attached to the first and second adhesive layers.

The above-mentioned main body film (310) may have an appropriate length and width so that the flexible printed circuit board can secure a sufficient bonding area for the temperature measurement target (400). In addition, the above-mentioned main body film (310) may include a heat-dissipating high-density layer formed by applying a heat-dissipating polymer having a heat-dissipating function to improve thermal conductivity, although not shown in the drawing, and a metal thin plate layer such as copper or aluminum used as a heat transfer path.

The first adhesive layer (320) is provided on one side of the main body film, and an adhesive is applied to bond the first side of the flexible printed circuit board, and the second adhesive layer (330) is provided on the other side of the main body film, and an adhesive is applied to bond the first side of the temperature measurement target.

The above release paper (340) protects the adhesive of the first adhesive layer and the second adhesive layer and can be removed as needed.

The multi-channel temperature sensor (200) according to the present invention can measure temperature by adhesively bonding to a temperature measurement target (400) via the heat dissipation tape (300) as well as a flat surface and a rounded curved surface. That is, the present invention has excellent compatibility in that it can be installed at a desired location without limitation on the shape of the target, and the NTC thermistor element package (100) can be placed as close as possible to the point where temperature measurement is required, so that high reliability of the measured value can be provided.

Next, according to an embodiment of the present invention, the flexible printed circuit board (210) may have an opening (211) formed in an area corresponding to the mold portion (150) as shown in FIGS. 5 and 6.

The above NTC thermistor element package (100) is mounted on the flexible printed circuit board (210) and is adhesively bonded to a temperature measurement target (400) to measure temperature. Here, the flexible printed circuit board (210) and heat dissipation tape (300) positioned between the NTC thermistor element package (100) and the temperature measurement target (400) due to the bonding structure may act as factors that lower the accuracy of the measured value.

Therefore, it is desirable to secure reliability of the measurement value of the NTC thermistor element package (100) by forming a predetermined opening (211) in an area of the flexible printed circuit board (210) corresponding to the mold portion (150).

Next, according to an embodiment of the present invention, the first lead terminal (111) and the second lead terminal (121) can extend horizontally from the first lead frame (110) and the second lead frame (120) as shown in FIG. 7.

According to one embodiment, the first lead terminal (111) and the second lead terminal (121) are formed with a downward diagonal folded portion on one side so that the end portion on that side is positioned on the flexible printed circuit board (210). Accordingly, an opening (211) can be formed in the lower part of the mold part (150). However, since the mold part (150) is separated from the heat dissipation tape (300), the load of the NTC thermistor element package (100) directly acts on the first and second lead terminals (111, 121) on both sides, which may cause a problem in that the durability of the first and second lead terminals is reduced. In addition, if the heat emitted from the temperature measurement target (400) remains on the opening (211), the reliability of the measured value may be reduced.

The present invention forms an opening in an area of a flexible printed circuit board (210) corresponding to the mold portion (150) as shown in FIG. 7, and when the first lead terminal (111) and the second lead terminal (121) extend horizontally from the first lead frame (110) and the second lead frame (120), the bottom surface of the mold portion (150) is firmly fixed to the flexible printed circuit board (210) by adhesive bonding with the first adhesive layer (320) of the heat dissipation tape, thereby ensuring the durability of the first and second lead terminals (111, 121), improving the adhesion between the NTC thermistor element package (100) and the temperature measurement target (400), and significantly improving the temperature measurement accuracy and response time performance by bringing the NTC thermistor element package (100) and the temperature measurement target (400) closer.

Figures 8 and 9 are exemplary drawings showing the application of the multi-channel temperature sensor (200) according to a preferred embodiment of the present invention. The present invention can be used by adhesively bonding various shapes to a temperature measurement target.

Recently, electric vehicles have been rapidly becoming widespread, and in addition to improving battery performance, they require optimal temperature sensors for fire prevention. In the case of batteries, there is a trend to switch from existing cylindrical cells to pouch-type cell batteries to optimize space efficiency. Pouch-type batteries have the advantage of packaging battery materials into films, so they have high energy density and can be manufactured in various shapes required by electric vehicle manufacturers. However, due to the structural limitations of stacking and then packaging battery materials, the internal space of the pouch is narrow, making heat management difficult. In addition, when the temperature exceeds a certain temperature, the battery swells, and if the temperature sensor is located between cells, it is exposed to an environment pressurized by the volume expansion of the battery, which is not desirable.

The present invention, which is manufactured in the form of a thin film, can be applied to electric vehicle batteries, and multi-channeling is possible through multiple NTC thermistor element packages, enabling excellent heat management. In addition, since it can be installed on the surface of the battery through a heat-dissipating tape, it can be unaffected by volume expansion of the battery due to temperature increase.

In particular, in a secondary battery of a high-output and high-capacity model, when a large current flows in a short period of time due to high-rate discharge, overcharge, external short circuit, etc., a large amount of heat is generated at the electrode tab due to the current concentration. The present invention can effectively eliminate heat generation at the electrode tab by using a heat dissipation tape (300) as a means for coupling a multi-channel temperature sensor (200) to a temperature measurement target (400).

The terms and words used in this specification and claims described above should not be interpreted as limited to their usual or dictionary meanings, but should be interpreted as meanings and concepts that conform to the technical idea of the present invention based on the principle that the inventor can appropriately define the concept of the term in order to explain his own invention in the best way.

Therefore, the configurations depicted in the drawings and embodiments described in this specification are only the most preferred embodiment of the present invention, and do not represent all of the technical ideas of the present invention. Therefore, it should be understood that there may be various equivalents and modified examples that can replace them at the time of filing this application.

100: NTC thermistor element package
110: 1st lead frame
111: 1st lead terminal
120: 2nd lead frame
121: Second lead terminal
130 : Bare Chip
140 : Challenge Wire
150 : Mold part
200 : Multi-channel temperature sensor
210 : FPCB
211 : Opening
220 : FPCB connector
230 : Soldering
300 : Heat dissipation tape
310 : Body film
320: First adhesive layer
330: Second adhesive layer
340: Lee Hyung-ji
400: Temperature measurement target

Claims (5)

The first lead frame (110) and;
A first lead terminal (111) extending from one end of the first lead frame;
A second lead frame (120) arranged at a predetermined interval from the first lead frame;
A second lead terminal (121) extending from one end of the second lead frame;
A bare chip (130) mounted on the first lead frame using a conductive adhesive;
A conductive wire (140) electrically connecting the above bare chip and the second lead frame;
A mold part (150) provided in a form in which a portion of the end of the first lead terminal and the second lead terminal protrudes outward and wraps the first lead frame, the second lead frame, the bare chip, and the conductive wire;
An NTC thermistor element package characterized by including a .
A flexible printed circuit board (FPCB) formed to a predetermined length and having a plurality of NTC thermistor element packages according to claim 1 arranged along the length direction on one side;
It includes an FPCB connector electrically connected to a connector provided on a control board separately from the above-mentioned flexible printed circuit board;
The above NTC thermistor element package measures the temperature of the temperature measurement target while the ends of the first lead terminal and the second lead terminal protruding outside the mold part are electrically connected to the flexible printed circuit board by soldering,
A multi-channel temperature sensor using an NTC thermistor element package, characterized in that the plurality of NTC thermistor element packages are bonded along the longitudinal direction to one surface of the temperature measurement target so as to simultaneously measure the temperature between certain points of the temperature measurement target, thereby improving the reliability of the measured value.
In the second paragraph,
A body film with heat dissipation function,
A first adhesive layer provided on one side of the above body film and adhesively bonded to one side of the above flexible printed circuit board,
A second adhesive layer provided on the other side of the main body film and adhesively bonded to one side of the temperature measurement target,
A heat-dissipating tape including a release paper attached to the first adhesive layer and the second adhesive layer;
A multi-channel temperature sensor using an NTC thermistor element package, characterized in that the temperature can be measured by attaching it to a curved surface of the temperature measurement target through the heat-dissipating tape.
A multi-channel temperature sensor using an NTC thermistor element package, characterized in that in the third paragraph, the flexible printed circuit board has an opening formed in an area corresponding to the mold portion.
In the fourth paragraph, the bottom surface of the mold part is bonded to the first adhesive layer of the heat dissipation tape to improve the adhesion between the NTC thermistor element package and the temperature measurement target, thereby increasing the temperature measurement accuracy and sensitivity and reducing the response speed.
A multi-channel temperature sensor using an NTC thermistor element package, characterized in that the first lead terminal and the second lead terminal extend horizontally from the ends of the first lead frame and the second lead frame.