KR20210136442A - Flexible display divice bonding table structure - Google Patents

Abstract

An object of the present invention is to provide a flexible display device bonding table structure. The present invention includes: a base table (822) supporting and holding a flexible film (2) passing along a transfer line of a main frame (110); and a vacuum unit (824) which is provided on the base table (822) to adsorb and fix the flexible film (2) to an upper surface of the base table (822) by vacuum. Therefore, it is possible to improve device bonding operation efficiency by increasing device bonding operation precision, such as shortening a bonding operation time.

Description

Flexible display device bonding table structure {Flexible display device bonding table structure}

The present invention relates to a flexible display device bonding table structure, and more particularly, in a bonding operation between a device such as a semiconductor device and a flexible film, the device can be bonded to the flexible film in a state in which the flexible film is stably fixed with vacuum pressure. It relates to a flexible display device bonding table structure of a new configuration.

In general, flat panel displays such as LCDs and LEDs are gradually becoming lighter, thinner and smaller, and in response to this, elements such as semiconductor elements or circuit boards are directly bonded to the pattern part of glass and are often manufactured. and a device bonding device each having a bonding unit.

In order to bond glass and a semiconductor device to the device bonding apparatus, the glass and the semiconductor device are respectively loaded and set in the loading unit, and then the bonding is performed while the bonding unit is pressed with a bonding head.

However, a problem with this type of flat panel display device is that, due to the glass substrate, the substrate is very hard and heavy, and has a very low tolerance for bending stress. When the display device receives a bending moment, a display image is lost due to a change in the cell gap between the substrates because a change in the thickness of the liquid crystal layer occurs.

In addition, in order to implement a ubiquitous display environment, the characteristics of a display device that can display various multimedia information while improving the portability of the display device, and being lightweight, have a large display area, have excellent resolution, and have a fast display speed, are required. do.

Therefore, in order to simultaneously satisfy the excellent characteristics of flexibility, weight reduction and portability, the need for a flexible display device in which wiring and elements of the display device are formed on a plastic substrate is emerging. Flexible display devices are often manufactured in a Roll-to-Roll method. In the manufacturing process of such a flexible display, a bonding operation between the flexible film 2 and a device such as a semiconductor device or a flexible printed circuit board is performed.

However, in order to produce a flexible display device, a precise and error-free bonding operation between the flexible film 2 and the device is required. The flexible film (2) can be called a substrate of a flexible display, and for example, it can be a PI Film (2). Since this occurs, a bonding operation between the device and the flexible display substrate that is precise and error-free is required. In addition, the precision of the bonding operation is more required to prevent a case in which the process yield and efficiency are lowered.

Korean Patent Registration No. 10-1754511 (registered on June 29, 2017) Korean Patent Publication No. 10-1996-0035935 (published on October 28, 1996) Korean Patent Publication No. 10-2000-0074174 (published on December 05, 2000) Korea Registered Utility Model No. 20-0311427 (Registered on April 11, 2003)

The present invention was developed to solve the above-mentioned problems, and an object of the present invention is to attach the device to the flexible film in a state in which the flexible film is stably fixed with vacuum pressure during the pressure bonding operation between the flexible film and the device such as a semiconductor device. An object of the present invention is to provide a vacuum heating pressure bonding system of a process system for a flexible display device of a new configuration that enables bonding and guarantees the high quality of a flexible display due to which bonding precision can be improved.

According to the present invention for solving the above problems, a base table for supporting and supporting the flexible film passing along the transfer line of the main frame; A flexible display device bonding table structure is provided, comprising a; a vacuum unit provided on the base table to adsorb and fix the flexible film on the upper surface of the base table by vacuum.

The base table is characterized in that it is configured to support and support the flexible film passing along the transfer line under the laser head installed in the main frame.

The vacuum unit may include a vacuum forming hole secured inside the base table; and a plurality of suction holes connected to the vacuum forming hole and communicating with the upper surface of the base table.

The base table is characterized in that the heater is configured to be built therein.

The base table and the vacuum unit are configured to be raised and lowered by an up-down operation unit.

The element mounted on the flexible film is pressed by a bonding pressing means, and the base table is characterized in that it is configured to support the flexible film and the element from below.

The bonding pressing means includes an elevating slider, and quartz is coupled to a quartz holder provided in the elevating slider.

The lower surface of the quartz faces the flexible film below, and the lower surface of the quartz is characterized in that it is composed of a horizontal surface.

According to the present invention, a base table for supporting and supporting a flexible film passing along the transfer line of the main frame; a vacuum unit provided on the base table to adsorb and fix the flexible film to an upper surface of the base table by vacuum; and a lower slider is provided below the upper slider, and an upper surface of the lower slider includes a lower up-down inclined surface in surface contact with the upper up-down inclined surface, and the lower slider is moved forward and backward by a moving operation means to move the There is provided a flexible display device bonding table structure, characterized in that for elevating the upper slider and the base table.

According to the present invention, a base table for supporting and supporting a flexible film passing along the transfer line of the main frame; a vacuum unit provided on the base table to adsorb and fix the flexible film to the upper surface of the base table by vacuum; the main frame is provided with a bonding base support panel, and a guide is provided on the upper surface of the bonding base support panel A rail is provided, the guide rail is disposed in a direction parallel to the X-axis direction of the main frame, a block is slidably coupled to the guide rail, and the block is connected to a lower portion of the bonding base support block, and the The base table is coupled to the bonding base support panel, and there is provided a flexible display device bonding table structure, characterized in that the base table is configured to be moved in the X-axis direction through which the PI Film of the main frame passes.

In the flexible display device bonding table structure of the present invention, by repeating the process of raising the base table toward the PI Film, laser irradiation from the laser head, and press-bonding the device to the PI Flim by laser bonding means, the PI Film (substrate) The device (mainly a semiconductor device) is bonded to the device, and the flexible display device bonding table structure of the present invention makes the device flexible in a state in which the flexible film is stably fixed with vacuum pressure during pressure bonding between the flexible film and the device such as a semiconductor device. Since it can be bonded to a film, it has an effect that is very helpful in ensuring the high quality of flexible displays by minimizing device bonding errors, There is an effect.

1 is a front view showing a flexible display device bonding table structure and a main frame according to the present invention;
Figure 2 is a perspective view showing the flexible display device bonding table structure and the main frame shown in Figure 1;
3 is a perspective view of a flexible display device bonding table structure according to the present invention;
Figure 4 is a side cross-sectional view of Figure 3;
Fig. 5 is an enlarged front sectional view of the main part of Fig. 4;
6 is a side view of the base table and the laser bonding pressing unit shown in FIG.
7 is a side view showing an enlarged base table part of FIG. 6 ;
8 is a perspective view showing a part of the flexible film on which the device bonding operation is made according to the present invention;
9 is a perspective view showing a state in which the base table part of 2 is coupled to the lower slider;
Figure 10 is a front view of Figure 9
11 is a left side view of FIG.
Fig. 12 is a right side view of Fig. 9;

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The objects, features and advantages of the present invention will be more readily understood by referring to the accompanying drawings and the following detailed description. In the drawings, the same reference numbers are used for the same parts. In addition, in describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted.

In addition, in describing the components of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only for distinguishing the components from other components, and the essence, order, or order of the components are not limited by the terms. When it is described that a component is “connected”, “coupled” or “connected” to another component, the component may be directly connected or connected to the other component, but another component is between each component. It will be understood that may also be "connected", "coupled" or "connected".

Referring to the drawings, the flexible display device bonding table structure according to the present invention supports and supports the flexible film 2 passing along the transfer line under the laser head 812 installed in the main frame 110. Base table 822 and a vacuum unit provided on the base table 822 to adsorb and fix the flexible film 2 to the upper surface of the base table 822 by vacuum. In the present invention, the flexible film 2 is a PI Film (polyimide film). The PI Film (2) can be called a flexible substrate.

The main frame 110 is configured in a hexahedral frame shape. The main frame 110 is provided with a main base 112 . An unwinder unit 210 and a rewinder unit 310 are disposed at both left and right positions of the main frame 110, respectively, and the PI Film 2 is formed by the unwinder unit 210 and the rewinder unit 310. It is fed along a transport path on the main base 112 of this main frame 110 . In addition to the unwinder unit 210 and the rewinder unit 310 , the PI Film 2 may be configured to be supplied along the transport path of the main frame 110 by other known feeding means.

A laser head 812 is mounted on the main frame 110 to be disposed above the main base 112 . A lens is provided on the bottom surface of the laser head 812 so that the laser generated from the laser device provided inside the laser head 812 is irradiated toward the PI Film 2 through the lens.

The present invention is a flexible film 2 disposed under the laser head 812 and passing on the transport path of the main frame 110 (in the present invention, as PI Film 2, hereinafter for convenience, the flexible film 2 is used as a PI Film (referred to as (2)) and includes a base table supporting it.

The base table 822 is configured to have a heater built therein. A plurality of side by side heaters are built into the base table 822 , and the base table 822 may be heated by the heaters.

The base table 822 and the vacuum unit 824 are configured to be raised and lowered by an up-down operation unit.

The up-down operation unit includes a lifting operation servo motor 832 , a lifting operation ball screw 833 , a lifting operation ball nut 834 , an upper slider, and a lower slider.

A bonding base support block 826 is provided on the base frame plate of the main frame, and an upper slider and a lower slider are built in the bonding base support block 826 .

The base table 822 is coupled to the upper surface of the insulation 835 above the upper slider 828 . The base table 822 is configured to be raised and lowered by the up-down operation unit under the PI Film 2 passing along the transport path of the main frame 110 .

The upper surface of the lower slider 827 is composed of a lower up-down inclined surface 827SF. The lower slider 827 is movably embedded in the inner space of the bonding base support block 826 . The lower slider 827 is located in the inner space of the bonding base support block 826 so as to move forward and backward in the Y-axis direction, which is a direction orthogonal to the X-axis direction, which is the transport path of the main frame 110 through which the PI Film 2 passes. is built-in One of the lower up-down inclined surfaces 827SF constituting the upper surface of the lower slider 827 is a relatively higher inclined surface than the other. When viewed from one side of the bonding base support block 826, the higher side of the lower up-down inclined surface 827SF is disposed on the rear side of the bonding base support block 826, and the lower side of the lower up-down inclined surface 827SF is the bonding base support It is disposed on the front side of block 826 .

The lower slider 827 is movably coupled to the inner lower surface of the bonding base support block 826 by an up-down LM guide. The up-down LM guide is composed of an up-down guide rail and an up-down guide rail block, and the up-down guide rail is disposed in the front-rear direction of the bonding base support block 826 . In the main frame 110 , an up-down guide rail is disposed in a direction parallel to the Y-axis direction orthogonal to the X-axis direction, which is the transport direction of the PI Film 2 . An up-down guide rail block is slidably coupled to the up-down guide rail, the up-down guide rail block is connected to a lower slider 827, and the lower slider 827 is PI of the main frame 110 by an up-down LM guide. Film (2) is configured to be movable in a direction orthogonal to the transport direction. At this time, an up-down guide rail groove is provided on the bottom surface of the lower slider 827, and the up-down guide rail is parallel to the Y-axis direction orthogonal to the X-axis direction, which is the transport direction of the PI Film (2) in the main frame 110. It may be arranged so that the up-down guide rail groove of the lower slider 827 is slidably coupled to the up-down guide rail. In this case, the up-down LM guide includes the up-down guide rail groove and the up-down guide rail.

A lifting operation servo motor 832 is mounted on the bonding base support block 826 . The motor shaft of the lifting operation servomotor 832 is disposed in a direction perpendicular to the PI Film (2) transport direction (Y-axis direction) of the main frame 110 and in a direction parallel to the direction. The lifting operation ball screw 833 is provided on the motor shaft of the lifting operation servo motor 832 . The lifting operation ball screw 833 is also disposed in the Y-axis direction.

The lifting operation ball nut 834 is coupled to the lifting operation ball screw 833 . The lifting operation ball screw 833 is provided on the rear surface of the lower slider 827 , and the lifting operation ball nut 834 is coupled to the lifting operation ball screw 833 provided on the motor shaft of the lifting operation servo motor 832 . do.

A motor shaft of a lifting operation servo motor 832 is connected to the lower slider 827 . The lifting operation servomotor 832 is fixed to the bonding base support block 826 by fixing means such as bolts and brackets, and a lifting operation ball screw 833 is provided on the motor shaft of the lifting operation servomotor 832 . A lifting operation ball nut 834 is provided on the bonding base support block 826 , and the lifting operation ball nut 834 is coupled to the slider ball screw. The motor shaft of the lifting operation servomotor 832 is connected to the lower slider 827 in a state in which it is disposed in a direction orthogonal to the transport path of the PI Film (2). When viewed from one side of the lower slider 827 , the motor shaft of the lifting operation servo motor 832 is connected to the rear surface of the lower slider 827 .

The lower slider 827 is configured to move forward and backward by an up-down operation unit. In the present invention, the up-down operation unit includes a lifting operation servo motor 832 , a lifting operation ball screw 833 , a lifting operation ball nut 834 , and an upper slider and a lower slider.

Therefore, when the motor shaft of the lifting operation servomotor 832 rotates forward and reverse, the lifting operation ball screw 833 rotates forward and reverse, and the lower slider 827 connected to the lifting operation ball nut 834 moves up and down by the LM guide. It becomes possible to move forward or backward along the Y-axis direction orthogonal to the feed direction of (2). When the motor shaft of the lifting operation servo motor 832 and the lifting operation ball screw 833 rotate forward and reverse, the lower up-down movement ball nut to which the lower slider 827 is connected moves forward and backward along the up-down guide rail of the lower up-down LM guide. , the lower slider 827 connected to the lower up-down movement ball nut can move forward or backward along the Y-axis direction orthogonal to the transport direction of the PI Film (2). The rotational force of the motor shaft of the lifting operation servomotor 832 is converted into a linear motion by the lifting operation ball screw 833 and the lifting operation ball nut 834, and the lower slider 827 is moved by the PI Film ( It becomes possible to move forward and backward in the Y-axis direction orthogonal to the transfer direction of 2). When the lower slider 827 moves in a direction perpendicular to the transport direction of the PI Film 2 , the lower up-down inclined surface 827SF can also move in a direction perpendicular to the transport direction of the PI Film 2 .

An upper slider 828 is disposed on the lower slider 827 . The upper slider 828 may be referred to as a table up-down slider. An upper slider 828 is provided in the inner space of the bonding base support block 826 . The bottom surface of the upper slider 828 is composed of an upper up-down inclined surface 828SF. The upper slider 828 is embedded in the inner space of the bonding base support block 826 to be liftable. That is, the upper slider 828 is coupled to the bonding base support block 826 to be elevating by the slider elevating LM guide. The upper slider 828 is embedded in the inner space of the bonding base support block 826 so as to be raised and lowered under the PI Film 2 passing along the transport path of the main frame 110 . One of the upper up-down inclined surfaces 828SF constituting the bottom surface of the upper slider 828 is a relatively higher inclined surface than the other. When viewed from one side of the bonding base support block 826, the high side of the upper up-down inclined surface 828SF is disposed on the rear side of the bonding base support block 826, and the lower side of the upper up-down inclined surface 828SF is the bonding base support It is disposed on the front side of block 826 . The upper up-down inclined surface 828SF of the lower surface of the upper slider 828 is in contact with the lower up-down inclined surface 827SF of the upper surface of the lower slide. When viewed from one side of the bonding base support block 826, the upper up-down inclined surface 828SF of the upper slider 828 and the lower up-down inclined surface of the lower slider 827 are in contact with each other. Bonding base support block 826 It is formed as a slope inclined from the rear to the front of the

As the motor shaft of the lifting operation servo motor 832 and the lifting operation ball screw 833 constituting the up-down operation means rotate in one direction, the lower slider 827 advances. When viewed from one side of the bonding base support block 826 , the lower slider 827 advances from the rear to the front of the bonding base support block 826 . Then, the upper slider 828 rises by the lower up-down guide surface of the lower slider 827 and the upper up-down guide surface of the upper slider 828 .

As the motor shaft of the lifting operation servo motor 832 and the lifting operation ball screw 833 rotate in the other direction, the lower slider 827 moves backward. When viewed from one side of the bonding base support block 826 , the lower slider 827 advances from the front to the rear of the bonding base support block 826 . Then, the upper slider 828 descends by the lower up-down guide surface of the lower slider 827 and the upper up-down guide surface of the upper slider 828 .

A heat insulating material 835 is provided on the upper surface of the upper slider 828 . A base table 822 is provided on the insulator 835 . A heat insulating material 835 is interposed between the lower portion of the base table 822 and the upper surface of the upper slider 828 . That is, an upper slider 828 is provided under the base table 822 , a bottom surface of the upper slider 828 is composed of an upper up-down inclined surface 828SF, and a lower slider is below the upper slider 828 . 827 is provided, and the upper surface of the lower slider 827 includes a lower up-down inclined surface 827SF that is in surface contact with the upper up-down inclined surface 828SF, and the lower slider 827 is moved back and forth by an up-down operation unit. As the lower slider 827 moves forward and backward, the upper slider 828 and the base table 822 are raised and lowered. Of course, the heat insulating material 835 is also raised and lowered together with the upper slider 828 and the base table 822 .

The vacuum unit includes a vacuum forming hole (824VH) secured inside the base table (822), and a plurality of suction holes (824SH) connected to the vacuum forming hole (824VH) and communicating with the upper surface of the base table (822); includes

The vacuum chuck 824 includes a vacuum forming hole 824VH secured inside the base table 822 and a plurality of suction holes connected to the vacuum forming hole 824VH and communicating with the upper surface of the base table 822 ( 824SH).

The vacuum forming hole 824VH forms a passage for forming a vacuum inside the base table 822 . A vacuum device (not shown) is connected to the vacuum forming hole 824VH through a connecting means such as a vacuum nipple and a connecting pipe.

The plurality of adsorption holes 824SH communicate with the vacuum forming hole 824VH. A plurality of suction holes 824SH are distributed on the base table 822 in a grid arrangement. A plurality of suction holes 824SH are arranged in a lattice form at uniform intervals on the upper surface of the base table 822 . When a vacuum is formed in the vacuum forming hole 824VH by the operation of a vacuum device, the PI Film 2 placed on the upper surface of the base table 822 is adsorbed by vacuum pressure in the plurality of adsorption holes 824SH to the base table. It is fixed to the upper surface of the 822. The PI Film (2) is adsorbed with a uniform vacuum pressure by a plurality of adsorption holes (824SH) arranged in a uniform grid on the upper surface of the base table 822 and fixed to be stably adhered to the upper surface of the vacuum adsorption plate. will be.

In addition, a bonding base support panel 837 is mounted on the main base 112 of the main frame 110 . A bonding base support panel 837 is mounted under the main base 112 . The bonding base support panel 837 may be mounted under the main base 112 by fixing means such as fasteners such as brackets and bolts.

The base table 820 is movably coupled to the bonding base support panel 837 by the LM guide.

A guide rail 837GR is provided on the upper surface of the bonding base support panel 837 . The guide rail is disposed in a direction parallel to the X-axis direction of the main frame 110 (ie, the X-axis direction through which the PI Film 2 passes). At least two guide rails are disposed side by side on the upper surface of the moving guide panel 714 .

A block 837RB is slidably coupled to the guide rail. A block is slidably coupled to each guide rail.

The block 837RB is connected to the bottom of the bonding base support block 826 . A table mounting base 826TMB is provided at a lower end of the bonding base support block 826 , and the block 837RB is connected to a lower surface of the table mounting base 837TMB. As a result, the block 837RB has a structure connected to the lower portion of the bonding base support block 826 constituting the base table 820 . At this time, the main base 112 of the main frame 110 is provided with a block movement guide hole extending along the X-axis direction, so that the block is supported by the bonding base by the block movement guide hole of the main base 112 . The block 826 may be connected to the table mounting base at the lower end by a fixing means such as a bolt. The number of block movement guide holes in the main base 112 corresponds to the number of blocks. When two blocks are coupled to two guide rails, two block movement guide holes of the main base 112 are provided.

As a result, the guide rail and the block are LM guides, and the base table 820 is coupled to the bonding base support panel 837 under the main base 112 of the main frame 110 by the LM guide, and the base The table 820 is configured to be movable in the X-axis direction through which the PI Film 2 of the main frame 110 passes.

A bonding base moving ball screw 839 supported by a fastener such as a bolt and a bracket is mounted on the upper surface of the bonding base support panel 837 . The bonding base moving ball screw 839 is disposed in a direction parallel to the guide rail of the LM guide. That is, the bonding base moving ball screw 839 is disposed in a direction parallel to the X-axis direction through which the PI Film 2 of the main frame 110 passes.

The bonding base support block 826 is provided with a bonding base moving ball nut 841 . Since the bonding base moving ball nut 841 is coupled to the table mounting base coupled to the lower end of the bonding base support block 826, the bonding base moving ball nut 841 is provided in the bonding base support block 826. becomes

The bonding base moving ball nut 841 is coupled to the bonding base moving ball screw 839, and according to the rotation of the bonding base moving ball screw 839, the bonding base moving ball nut 841 and the base table 820 are It is possible to move in the X-axis direction of the main frame 110 .

At this time, a bonding base movement servo motor 843 is mounted on the bottom surface of the main base 112 or the bonding base support panel 837, and the motor shaft of the bonding base movement servo motor 843 is a bonding base movement ball screw ( 839), as the motor shaft of the bonding base movement servo motor 843 rotates, the bonding base movement ball screw 839 rotates, and the bonding base movement ball nut 841 and the base table 820 are main The frame 110 may be moved along the X-axis direction. The main base 112 of the main frame 110 is provided with a movement guide hole in the X-axis direction, so that the bonding base movement ball nut 841 and the block are not caught in the main base 112 and the movement guide hole is provided. Accordingly, the block and the bonding base moving ball nut 841 can move in the X-axis direction, and the base table 820 connected to the lower part of the block and the bonding base moving ball nut 841 is connected to the main frame 110 by the X-axis. It can be moved along the direction. That is, the rotational motion of the motor shaft of the bonding base moving servomotor 843 is converted into a linear motion by the bonding base moving ball screw 839 and the bonding base moving ball nut 841, so that the base table 820 is the main frame. (110) is configured to move in the X-axis direction.

That is, the main frame 110 is provided with a bonding base support panel, and a guide rail 837GR is provided on the upper surface of the bonding base support panel 837 , and the guide rail is in the X-axis direction of the main frame 110 . and a block 837RB is slidably coupled to the guide rail, the block is connected to the lower portion of the bonding base support block 826, and the base table 822 is attached to the bonding base support panel. It is coupled, and the base table is configured to be movable in the X-axis direction through which the PI Film 2 of the main frame 110 passes.

The element mounted on the flexible film is pressed by a bonding pressing means, and the base table 822 is configured to support the flexible film and the element from below.

The bonding pressing means includes an elevating slider, and the quartz is coupled to a quartz holder provided in the elevating slider. The elevating slider is mounted to the main frame to be elevating, and the elevating slider may be configured to be elevated by elevating operation means such as a press device or elevating operation cylinder.

A bottom surface of the quartz faces the flexible film below, and the bottom surface of the quartz is configured as a horizontal plane. A quartz holder 854HD is fixed to a lower portion of the elevating slider 854 , and a quartz 855 is coupled to the quartz holder 854HD, and a quartz 855 is disposed under the elevating slider 854 . At this time, the quartz 855 is configured in a block shape, and is disposed at a position where it meets the laser irradiation space inside the elevating slider 854 at the top and bottom. The quartz 855 is disposed at a position where it also meets the lens (laser optical system lens) of the laser head 812 mounted on the base 724 of the main frame 110 from above and below. When the laser generated in the laser head 812 passes through the lens and is irradiated downward, the laser passing through the quartz 855 is irradiated to the PI Film 2 passing along the transport path of the main frame 110 . At this time, the quartz 855 is configured in a hexahedral block shape, the bottom surface of the quartz 855 faces the PI Film 2 (flexible film), and the bottom surface of the quartz 855 is configured as a horizontal plane. The bottom surface of the quartz 855 is a horizontal plane, and the entire bottom surface of the quartz 855 is configured to press the PI Film 2 with a uniform force. Since the entire bottom surface of the quartz 855 is a uniform horizontal surface, the entire bottom surface of the quartz 855 can press the PI Film 2 from above with a uniform force.

The element mounted on the flexible film is pressed by a bonding pressing means, and the base table 822 is configured to support the flexible film and the element from below.

The bonding pressing means includes an elevating slider, and the quartz is coupled to a quartz holder provided in the elevating slider. The elevating slider may be elevated above the base table by a known elevating operation means such as a press device or an elevating operating cylinder.

When the elevating slider descends in a state where the PI Film (2) on which the element (mainly semiconductor element) is mounted is placed on the upper surface of the base table, the quartz 855 is pushed down to release the quartz 855 to the PI Film (2). Pressing the device mounted on the device with a certain pressure, the device is bonded to the PI Film 2 by a bonding paste by the laser irradiated from the laser head 812 to the bottom of the quartz 855 .

The quartz 855, which descends the element (semiconductor element) on the PI Film 2 supported on the base table, presses it, and bonds it onto the PI Film 2 by the bonding paste. At this time, a silicon block may be provided on the bottom surface of the quartz 855 , and in this case, the silicon block contacts the device 3 to bond the device 3 on the PI Film 2 .

By pressing down the elevating slider 854 and the quartz 855, the element 3 in which the quartz 855 is mounted on the PI Film 2 is pressed to the upper surface of the base table 822 with a constant pressure, and Similarly, the upper slider 827 moves forward and backward by the lifting operation ball nut 834 while the lifting operation ball screw 833 (table up-down slider ball screw) is rotated by the lifting operation servo motor 832. A state in which the upper surface of the base table 822 is in contact with the lower surface of the PI Film 2 on which the element 3 is mounted due to the rise of the upper slider 828 while the 828 (table up-down slider) rises or descends. A vacuum is formed through the vacuum nipple and the vacuum forming hole 824VH, and the PI Film 2 is adsorbed by vacuum pressure through the adsorption hole 824SH The vacuum nipple is connected to a vacuum generator (not shown) with a hose. It is connected through a connecting pipe such as a vacuum nipple, and the vacuum nipple is connected to a vacuum forming hole (824VH) provided in the interior of the base table 822, and the internal vacuum of the base table 822 is generated by the vacuum generated by the vacuum generator. A vacuum pressure is formed in the forming hole 824VH, and the vacuum pressure acts from the vacuum forming hole 824VH through the suction hole 824SH connected to the upper surface of the base table 822, so that the PI Film 2 is subjected to vacuum pressure. Thus, it is stably adsorbed and fixed to the upper surface of the base table 822 .

A quartz holder 854HD and a quartz 855 are connected to the elevating slider 854, so that when the elevating slider 854 is lowered, the PI Film 2 and the element 3 (mainly a semiconductor element) are pressed. do.

On the other hand, the PI Film (2) is maintained in a fixed state by vacuum pressure while the base table (822) below is supported.

The laser head 812 irradiates a laser through a lens (laser optical lens) to bond the device (semiconductor device) onto the PI Film 2 by a bonding material such as a bonding paste. At this time, the base table 822 is maintained at an appropriate temperature (about 100° C.) by the heater for heating and the sensor for temperature measurement. A heater for heating and a sensor for temperature measurement are provided in the base table 822, and the temperature at which the heater for heating in the control unit or the like heats the base table 822 according to the temperature detected by the sensor for temperature measurement is set to the appropriate temperature (about 100). ℃), so that the device is stably bonded to the PI Film (2) without defects or the like.

In the present invention, the quartz 855 is in contact with the device to press the device and the PI Film (2). When the quartz 855 descends, the element and the PI Film 2 may be pressed. In a state where the bottom of the quartz 855 is in contact with the device (semiconductor device) mounted on the PI Film (2), the device can be bonded to the PI Film (2).

The pressure bonding system of the thermal process system for a flexible display device according to the present invention of the above configuration is a precise and error-free bonding operation between the PI Film (2) (Polyimid Film) and the device (mainly a semiconductor device) in order to produce a flexible display device. This is possible, and the precision of the bonding operation can be achieved more reliably to prevent the case where the process yield and efficiency are lowered. The PI Film (2) is a kind of flexible substrate, and it will be understood that the PI Film (2) described in the present invention, the flexible substrate, and the flexible display film are the same.

The elevating slider 854 is lowered so that the quartz presses the PI Film 2 and the device (semiconductor device) with an appropriate and uniform force so that the device is laser-bonded to the PI Film 2, which is provided on the base table The vacuum pressure acting on the plurality of vacuum adsorption holes allows the bonding operation to be performed while the PI Film (2) and the device are stably adsorbed and fixed without shaking. It can be bonded to the Film (2). For example, if four elements are placed in a region that can be pressed by the quartz 855, the quartz 855 presses the four elements to be bonded to the PI Film 2, and the quartz 855 presses the four elements. PI Film (2) is bonded to the PI Film (2) while pressing the elements with a uniform force while simultaneously holding the PI Film (2) and the element without shaking with the vacuum pressure of the base table. to precisely bond. That is, the base table 822 is provided with a vacuum forming hole 824VH and a plurality of adsorption holes 824SH, so that the PI Film 2 mounted on the base table 822 is formed with a vacuum forming hole 824VH and a vacuum forming hole 824VH. Since the device can be laser-bonded on the PI Film (2) in a state where it is stably fixed with vacuum pressure through the suction hole (824SH), the device bonding precision is lowered due to the flow of the PI Film (2) and the device during the bonding operation. It is possible to prevent cases from occurring, and it is possible to reliably prevent the occurrence of defects in bonding (bonding) of devices, and furthermore, it is possible to improve the work efficiency by guaranteeing the high quality of the flexible display and preventing the working time delay.

In addition, the rotational motion of the motor shaft of the bonding base moving servomotor 843 is converted into a linear motion by the bonding base moving ball screw 839 and the bonding base moving ball nut 841, so that the position of the PI Film (2) and Since the base table 820 can be moved in the X-axis direction of the main frame 110, that is, along the transport direction of the PI Film 2 according to the position of the device, the PI Film 2 and the device are bonded during device bonding. According to the position, the bonding operation can be performed more easily and quickly.

In the above, specific embodiments of the present invention have been described above. However, the spirit and scope of the present invention is not limited to these specific embodiments, and various modifications and variations are possible within the scope that does not change the gist of the present invention. Anyone who has it will understand.

Accordingly, since the embodiments described above are provided to fully inform those of ordinary skill in the art to which the present invention belongs the scope of the invention, it should be understood that they are exemplary in all respects and not limiting, The invention is only defined by the scope of the claims.

2. Flexible Film (PI Film) 3. Device
110. Main Frame 112. Main Base
812. Laser head 822. Base table 824VH. Vacuum forming hole 824SH. suction hole
826. Bonding base support block 827. Lower slider
827SF. Lower up-down slope 828. Upper slider
828SF. Upper up-down slope 832. Elevating operation servomotor
833. Lifting action ball screw 834. Lifting action ball nut
835. Insulation material 837. Bonding base support panel
839. Bonding base moving ball screw 841. Bonding base moving ball nut
843. Bonding base moving servomotor

Claims (8)

a base table 822 supporting and supporting the flexible film 2 passing along the transfer line of the main frame 110;
A flexible display device bonding table comprising a; a vacuum unit 824 provided on the base table 822 to adsorb and fix the flexible film 2 on the upper surface of the base table 822 by vacuum structure.
According to claim 1,
The base table 822 is a flexible display device bonding table structure, characterized in that it is configured to support and support the flexible film 2 passing along the transfer line under the laser head 812 installed in the main frame 110 .
According to claim 1,
The vacuum unit 824,
a vacuum forming hole (824VH) secured inside the base table (822);
A flexible display device bonding table structure comprising a; a plurality of suction holes (824SH) connected to the vacuum forming hole (824VH) and communicating with the upper surface of the base table (822).
4. The method of claim 3,
The base table 822 is a flexible display device bonding table structure, characterized in that configured to have a built-in heater therein.
According to claim 1,
The base table 822 and the vacuum unit 824 are flexible display device bonding table structure, characterized in that configured to be lifted by an up-down operation unit.
According to claim 1,
The element mounted on the flexible film is pressed by a bonding pressing means, and the base table 822 is a flexible display element bonding table structure, characterized in that it is configured to support the flexible film and the element from below.
7. The method of claim 6,
The bonding pressing means is provided with an elevating slider, and a flexible display element bonding table structure, characterized in that quartz is coupled to a quartz holder provided in the elevating slider.
8. The method of claim 7,
A flexible display device bonding table structure, characterized in that the lower surface of the quartz faces the flexible film below, and the lower surface of the quartz is configured as a horizontal surface.

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