KR20160051520A - Flexible PCB(printed circuit board) - Google Patents

Abstract

The present disclosure provides a flexible printed circuit board (PCB) having enhanced stretchability and enhanced durability. The flexible PCB according to an aspect of the present disclosure comprises: a first polymer substrate having flexibility, stretchability or elasticity; a second polymer substrate having flexibility, stretchability or elasticity; a conductive track disposed between the first polymer substrate and the second polymer substrate, and including metal nanowires; and a cured silane coupling agent which bonds the conductive track to at least one of the first and second polymer substrates.

Description

[0001] Flexible printed circuit board [0002]

This disclosure relates to a printed circuit board (PCB), and more particularly to a printed circuit board having flexibility or stretchability.

As is well known, a PCB is a member that mechanically supports and electrically connects electronic components using conductive tracks, pads, and other means. Conventional PCBs are manufactured by etching a copper sheet laminated onto a nonconductive substrate and are rigid.

A flexible PCB (flexible PCB) is required. For example, a flexible PCB may be used as a bendable connecting-member connecting rigid PCBs. Accordingly, flexible PCBs overcome the weaknesses of rigid PCBs in the manufacture of miniaturized electronic products having complex structures.

Flexible PCBs, however, have the disadvantage of having poor workability and poor reliability in connection with the surface mounting process and the connector-bonding process It is known.

One practical alternative to avoid this disadvantage is the use of rigid PCBs with good workability and good reliability in connection with surface mount processes and connector bonding processes and flexible PCBs that can be used as bendable connecting- , And may be used in combination.

In either case, there is a demand for more flexible stretchability and improved durability (i.e., resistance to repeated bending stress) for flexible PCBs.

The present disclosure seeks to provide a flexible PCB that has further improved stretchability and improved durability. In particular, a flexible PCB is provided in which conductive tracks or conductive pads are not destroyed, even if repetitive bending impacts are applied. In addition, the adhesive force between the conductive track or the conductive pad and the substrate is greatly improved, so that a flexible PCB is provided in which the conductive track or the conductive pad is not peeled off from the substrate even if a repetitive bending impact is applied. Thereby, even if a repetitive bending impact is applied, a flexible PCB is provided in which the electrical conductivity of the conductive track or the conductive pad changes very small.

One embodiment of a flexible PCB, according to one aspect of the present disclosure,

A first polymer substrate having flexibility, stretch or elasticity;

A second polymer substrate having flexibility, stretch or elasticity;

A conductive track containing metal nanowires as conductive tracks interposed between the first polymer substrate and the second polymer substrate; And

A silane-based coupling agent cure to attach the conductive track to at least one of the first polymeric substrate and the second polymeric substrate;

.

One embodiment of a flexible PCB manufacturing method according to another aspect of the present disclosure,

Forming a conductive track pattern on the first polymer substrate, the conductive track pattern containing metal nanowires;

Applying a silane-based coupling agent-containing solution onto the conductive track pattern;

Disposing a second polymer substrate on the applied silane-based coupling agent-containing solution; And

And curing the silane-based coupling agent-containing solution.

Embodiments of the flexible PCB provided in this disclosure have improved stretchability and improved durability. In particular, in the flexible PCB embodiments provided in this disclosure, conductive tracks or conductive pads are not destroyed, even if repetitive bending impacts are applied. In addition, in the flexible PCB embodiments provided in this disclosure, the adhesion of the conductive track or conductive pad to the substrate is greatly enhanced, so that the conductive track or conductive pad is not stripped from the substrate, even though repetitive bending impacts are applied . Accordingly, in embodiments of the flexible PCB provided in this disclosure, the electrical conductivity of the conductive track or conductive pad does not change very much or substantially do not change, even if repetitive bending impacts are applied.

1 is a cross-sectional view diagrammatically illustrating an embodiment of a flexible PCB according to an aspect of the present disclosure;
Figure 2 is a cross-sectional view of an embodiment of the embodiment of Figure 1;
Figure 3 is a cross-sectional view of an embodiment of the bent embodiment of Figure 1;

Hereinafter, one embodiment of a flexible PCB according to one aspect of the present disclosure will be described in more detail with reference to Figures 1-3.

1 embodiment includes a first polymer substrate 100 having flexibility, stretch or elasticity; A second polymeric substrate (200) having flexibility, stretch or elasticity; A conductive track (300) containing metal nanowires (310) as conductive tracks interposed between the first polymer substrate (100) and the second polymer substrate (200); And a silane-based coupling agent cured (400) attaching the conductive track (300) to at least one of the first polymer substrate (100) and the second polymer substrate (200).

The first polymer substrate 100 and the second polymer substrate 200 serve to impart flexibility, stretch or elasticity to the flexible PCB. The first polymer substrate 100 and the second polymer substrate 200 may have, for example, a sheet form. The first polymer substrate 100 and the second polymer substrate 200 are opposed to each other.

The thickness of each of the first polymer substrate 100 and the second polymer substrate 200 may be, for example, from about 10 microns to about 3,000 microns. If the thickness of each of the first polymer substrate 100 and the second polymer substrate 200 is too thin, physical damage due to the low dimensional stability of the substrate may occur. If the thickness of each of the first polymer substrate 100 and the second polymer substrate 200 is too thick, it may exhibit low bending and elongation properties.

The first polymer substrate 100 and the second polymer substrate 200 may comprise a polymer having flexibility, stretch or elasticity. For example, the first polymer substrate 100 and the second polymer substrate 200 may each independently comprise at least one selected from the group consisting of PDMS (polydimethylsiloxane) resin, PI (polyimide) resin, polyamide resin, Based resin, a polyurethane-based resin, a polycarbonate-based resin, or a combination of two or more thereof.

In particular, the first polymer substrate 100 and the second polymer substrate 200 may be PDMS (polydimethylsiloxane) based resins. PDMS is an elastomer having viscoelastic properties. PDMS is used in silicon-based adhesive compositions. PDMS can be attached to a support such as, for example, PET (polyethylene terephthalate) or glass, and can also exhibit excellent durability, weatherability and flexibility. PDMS can have a linear elongation of about 30%, thereby imparting flexibility to the flexible PCB. PDMS is chemically inert and can have excellent heat resistance. In addition, PDMS can have excellent transparency.

The conductive track 300 provides an electron transfer path to the flexible PCB. The conductive track 300 is interposed between the first polymer substrate 100 and the second polymer substrate 200. As a result, the conductive track 300 can be effectively prevented from falling off the flexible PCB. Conductive track 300 may have any pattern.

The conductive track 300 may contain metal nanowires 310. For example, the conductive track 300 may be a collection of a plurality of metal nanowires 310. The plurality of metal nanowires 310 contact each other to form an electron conductive network. Accordingly, the plurality of metal nanowires 310 can effectively form the conductive track 300. One metal nanowire 310 can abundantly provide contact points for adjacent metal nanowires 310 over its length. Accordingly, even though the flexible PCB bends or stretches (see FIGS. 2 and 3), the plurality of metal nanowires 310 still contact each other, thereby still maintaining the electronic conductive network. In addition, one metal nanowire 310 can abundantly provide contact points for adjacent metal nanowires 310 over its length, so that even if the flexible PCB is repeatedly bent or stretched a large number of times, The metal nanowires 310 may still be in contact with each other, thereby still retaining the electronic conductive network. As a result, even if a repetitive bending impact is applied, the electrical conductivity of the conductive track 300 may vary very little or not change substantially.

The average aspect ratio of the metal nanowires 310 (i.e., the ratio of the average length of the metal nanowires 310 to the average diameter of the metal nanowires 310) may be, for example, from about 20 to about 300. If the average aspect ratio of the metal nanowires 310 is too low, they may not have the same shape as a wire and may not be suitable for rigid bending and bending properties. If the average aspect ratio of the metal nanowires 310 is too high, the shape stability may deteriorate and may not uniformly exist due to entanglement such as fiber strands.

The average diameter of the metal nanowires 310 may be, for example, from about 1 nm to about 500 nm. If the average diameter of the metal nanowires 310 is too small, mechanical strength may be easily damaged, such as fracture or deformation, due to a decrease in strength. If the average diameter of the metal nanowires 310 is too large, flexibility may be degraded due to the rigid nature of the nanowires.

The average length of the metal nanowires 310 may be, for example, from about 5 microns to about 30 microns. If the average length of the metal nanowires 310 is too small, the nano-wire-to-wire contact in the stretching environment may be disadvantageous and electrical characteristics may be deteriorated. If the average length of the metal nanowires 310 is too large, the coating property is deteriorated and pattern formation of a specific size may be difficult.

The thickness of the conductive track 300 may be represented by an average number of metal nanowires 310 per unit area of the conductive track 300 (i.e., population density). The average density of the metal nanowires 310 in the conductive track 300 may be about 100 / cm ² to about 200,000 / cm ² . If the average individual density is too low, the number of contacts between the nanowires may be reduced and the resistance may be increased. If the average individual density is too high, delamination of the metal nanowires can occur in a stretching and bending environment.

The metal nanowires 310 can be, for example, Ag, Au, Cu, Pt, Pd, Ni, Co, alloys thereof, or combinations thereof (i.e., a mixture of nanowires based on different metals) .

In particular, the metal nanowire 310 may be Ag. Ag nanowires can have particularly strong flexibility, very high transparency, and especially high electrical conductivity. In particular, the Ag nanowire may have a very high average aspect ratio, for example, from about 30 to about 200. When the Ag nanowire has a particularly high average aspect ratio, the electrical conductivity can be improved by the increased nano-wire contact.

The silane coupling agent cure 400 serves to adhere the metal nanowires 310 to at least one of the first polymer substrate 100 and the second polymer substrate 200. The silane coupling agent cured 400 may be provided at the interface between the metal nanowire 310 and the first polymer substrate 100. Alternatively, the silane-based coupling agent cured 400 may be provided at the interface between the metal nanowire 310 and the second polymer substrate 200. Alternatively, the silane-based coupling agent cured 400 may be applied to both the interface between the metal nanowire 310 and the first polymer substrate 100 and the interface between the metal nanowire 310 and the second polymer substrate 200 Can be provided. Alternatively, the silane coupling agent cured product 400 may serve as a matrix in which the metal nanowires 310 are dispersed. The silane coupling agent cured product 400 may be provided at a portion of the interface between the first polymer substrate 100 and the second polymer substrate 200 where the metal nanowires 310 do not exist, Accordingly, bonding of the first polymer substrate 100 and the second polymer substrate 200 can be provided.

The silane-based coupling agent cured product (400) can be particularly effectively bonded to the PDMS-based resin. Due to the low surface properties of the PDMS resin, it is difficult to bond directly with the metal nanowires 310. However, by using a coupling agent having a silane-based functional group, adhesion between the first polymer base material 100 or the second polymer base material 200 including the PDMS resin and the metal nanowire 310 can be achieved very effectively .

The silane coupling agent cured product 400 can be formed from, for example, a silane coupling agent represented by the general formula of R _n SiX _(4-n) .

Here, the X functional group is involved in bonding with the metal nanowires 310. That is, the bond between X and Si can be replaced by the bond between Si and the metal nanowire 310. X may be, for example, a hydrolysable group such as an alkoxy group, an acyloxy group, an amine group or a halogen atom. The carbon number of the alkoxy group may be, for example, from 1 to 4. The alkoxy group may be a representative example, methoxy or ethoxy. The carbon number of the acyloxy group may be, for example, 1 to 4. Representative examples of the acyloxy group may be an acetoxy group.

R is a nonhydrolyzable organic radical. R, the first polymer substrate 100 or the second polymer substrate 200 and the silane coupling agent 400 are bonded. R may be, for example, an epoxy group, a (meth) acrylate group, an isocyanate group, a vinyl group, a styryl group, an amino group, an isocyanurate group, a ureide, a mercapto group, .

For example, the silane coupling agent in which R contains an epoxy group is 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3- 3-glycidoxypropyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltriethoxysilane, 5,6-epoxyhexyltriethoxysilane, (3-GLYCIDOXYPROPYL) METHYLDIETHOXYSILANE, (3-GLYCIDOXYPROPYL) METHYLDIMETHOXY SILANE (3-GLYCIDOXYPROPYL), (3-GLYCIDOXYPROPYL) (3-GLYCIDOXYPROPYL) DIMETHYLETHOXYSILANE), or a combination thereof. The term " (3-glycidoxypropyl) dimethylethoxysilane "

For example, the silane coupling agent containing R in the (meth) acrylate group may be 3-methacryloxypropyltrimethoxysilane, methacryloxypropyltrimethoxysilane, methacryloxypropyltrimethoxysilane, N- (3-acryloxy-2-hydroxypropyl) -3-aminopropyltriethoxysilane, N- (3- - (triethoxy-silylpropyl) urethane (O- (METHACRYLOXYETHYL) -N- (TRIETHOXY-SILYLPROPYL) URETHANE), N- (3-methacryloxy-2-hydroxypropyl) -3-aminopropyltriethoxy But not limited to, silane (N- (3-METHACRYLOXY-2-HYDROXYPROPYL) -3-AMINOPROPYLTRIETHOXYSILANE), METHACRYLOXY METHYLTRIETHOXYSILANE, METHACRYLOXYMETHYLTRIMETHOXY- SILANE, METHACRYLOXYPROPYL TRIETHOXYSILANE, (3-acryl (3-ACRYLOXYPROPYL) METHYLDIMETHOXYSILANE, (METHACRYLOXYMETHYL) METHYL-DIETHOXYSILANE, (METHACRYLOXYMETHYL) METHYL (METHYLRYXYMETHYL) METHYL METHACRYLOXYPROPYLMETHYLDI-ETHOXYSILANE, METHACRYLOXYPROPYLMETHYLDI-METHOXYILANE, METHACRYLOXYPROPYLDIMETHYLETHOXY-SILANE, METHACRYLOXYPROPYLMETHYLETHOXY-SILANE, METHACRYLOXYPROPYLDIMETHYLMETHOXY SILANE, or a combination thereof.

Specific examples of the silane coupling agent in which R contains an isocyanate group include isocyanatopropyltriethoxysilane, (isocyanatomethyl) methyldimethoxysilane, 3-iso (3-isocyanatopropyltrimethoxysilane), tris [3- (trimethoxysilyl) propyl] isocyanurate, Tris [3- (trimethoxysilyl) propyl] isocyanurate, (3-triethoxysilylpropyl) -t-butylcarbamate, triethoxysilylpropylethylcarbamate, 3-thiocyanatopropyl triethoxysilane, or Or a combination thereof.

As a specific example, a silane coupling agent in which R contains a vinyl and olefinic functional group is selected from the group consisting of allyltrimethoxysilane, 3- (N-styrylmethyl-2-aminoethylamino) -propyltrimethoxysilane Vinyltriethoxysilane, vinyltriethoxysilane, vinyltriethoxysilane, vinyltriethoxysilane, vinyltriethoxysilane, vinyltriethoxysilane, vinyltriethoxysilane, vinyltriethoxysilane, vinyltriethoxysilane, vinyltriethoxysilane, vinyltriethoxysilane, VINYL TRIISOPROPOXY SILANE, VINYL TRIMETHOXYSILANE, or a combination thereof.

Specifically, for example, the silane coupling agent in which R contains an amino functional group is preferably selected from the group consisting of 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, AMINOPHENYLTRIMETHOXYSILANE, m-AMINOPHENYLTRIMETHOXYSILANE, p-AMINOPHENYLTRIMETHOXYSILANE, AMINOPHENYLTRIMETHOXYSILANE, 3- (3-aminophenylmethoxy) silane, Aminopropyltris (methoxyethoxy-ethoxy) silane (3-AMINOPROPYL TRIS (METHOXYETHOXY-ETHOXY) SILANE, or a combination thereof.

For example, the silane coupling agent containing an ester functional group as R may be selected from the group consisting of acetoxymethyl triethoxysilane, acetoxymethyl triethoxysilane, acetoxymethyl triethoxysilane, acetoxymethyl triethoxysilane, , Benzoyloxypropyltrimethoxysilane (BENZOYLOXYPROPYLTRIMETHOXY SILANE), or a combination thereof.

When the silane coupling agent undergoes hydrolysis, the X substituent is replaced by a silanol group. The silanol groups in one molecule can condense with the silanol groups in other molecules to form siloxane linkages, whereby the silane coupling agent can be cured. Or an R substituent in one molecule (for example, an epoxy group, a (meth) acrylate group, or an isocyanate group) is bonded to an R substituent (for example, epoxy group, (meth) acrylate group, or isocyanate group) By condensation or polymerization, the silane coupling agent can be cured.

Particularly, in the presence of a polyol, a silane coupling agent having an isocyanate group is cured, whereby a polyurethane resin having high elasticity can be produced. In this case, since the silane coupling agent cured product 400 itself has high elasticity, the elasticity of the flexible PCB can be further improved.

The embodiment of FIG. 1 may further include a conductive pad 500. The conductive pad 500 may serve as a contact terminal. In addition, the conductive pad 500 may provide a soldering point of the semiconductor device. 1, the conductive pads 500 are disposed at both ends of the conductive track 300, but the conductive pads 500 may be disposed at any positions of the conductive track 300. [ Conductive pad 500 may be formed of any electrically conductive material. The conductive pad 500 may be, for example, Ag, Au, Cu, Pt, Pd, Ni, Co, or a combination thereof.

Hereinafter, one embodiment of a flexible PCB manufacturing method according to another aspect of the present disclosure will be described in detail.

One embodiment of a flexible PCB manufacturing method comprises:

Forming a conductive track pattern on the first polymer substrate, the conductive track pattern containing metal nanowires;

Applying a silane-based coupling agent-containing solution onto the conductive track pattern;

Disposing a second polymer substrate on the applied silane-based coupling agent-containing solution; And

And curing the silane-based coupling agent-containing solution.

The step of forming the conductive track pattern containing the metal nanowires on the first polymer substrate may include, for example, coating the metal nanowire colloid solution onto the first polymer substrate, for example, by painting, spraying or printing For example, by using a coating means and applying it so as to have a pattern. The individual density of the metal nanowires in the conductive track pattern can be adjusted, for example, by adjusting the content of the metal nanowires in the metal nanowire colloid solution, or by forming a conductive track pattern containing the metal nanowires on the first polymer substrate By adjusting the number of repetitions of the step, it can be adjusted.

The dispersion medium of the metal nanowire colloid solution may be, for example, water, an organic solvent (for example, ethanol, propanol, butanol, acetone, etc.), or a combination thereof. The content of metal nanowires in the metal nanowire colloid solution may be, for example, from about 0.01 to about 30 weight percent.

The step of applying the silane-based coupling agent-containing solution onto the conductive track pattern can be performed, for example, by applying a silane-based coupling agent-containing solution using a coating means such as painting, spraying or printing. In addition, the silane-based coupling agent containing solution can be applied not only to the conductive track pattern region but also to other regions on the first polymer substrate.

The silane-based coupling agent-containing solution may be, for example, a mixture containing water, an alcohol and a silane coupling agent.

The amount of water may be, for example, from about 0.01 parts by weight to about 30 parts by weight, based on 100 parts by weight of the silane coupling agent.

The alcohol may be, for example, ethanol, propanol, butanol, or a combination thereof. The amount of alcohol may be, for example, from about 20 parts by weight to about 90 parts by weight, based on 100 parts by weight of the silane coupling agent.

The silane-based coupling agent-containing solution may further include at least one of a photoinitiator and a thermosetting agent. The photoinitiator may be, for example, Irgacure 184, Irgacure 369, Irgacure 184, Irgacure 651, Triphenylsulfonium triflate, Triarylsulfonium hexafluorophosphate salts, (4-tert-butylphenyl) sulfonium triflate, or a combination thereof. The thermosetting agent may be selected from, for example, diethylamino propyl amine, Menthane diamine, N-aminoethyl piperazine, M-xylene diamine, Isophorone diamine, or a combination thereof.

The silane-based coupling agent-containing solution may further contain a polyol. In this case, when an isocyanate-based silane coupling agent is used, a polyurethane-based silane coupling agent cured product can be obtained by reacting the polyol with an isocyanate-based silane coupling agent. The polyol may be selected from, for example, poly (ethylene oxide), poly (tetramethylene oxide), poly (propylene oxide), polyisobutylene oxide polyisobutylene oxide, poly (ethylene adipate), polycaprolactone, or a combination thereof.

The step of curing the silane-based coupling agent-containing solution can be carried out, for example, by condensation or polymerization of the silane-based coupling agent by applying heat or ultraviolet rays. The curing temperature may be, for example, from about 25 ° C to about 110 ° C. By curing the silane-based coupling agent-containing solution, a silane-based coupling agent cured product is produced. Silane-Based Coupling Agents By curing, conductive track patterns containing metal nanowires can be effectively bonded to a first polymer substrate or a second polymer substrate.

Claims (18)

A first polymer substrate having flexibility, stretch or elasticity;
A second polymer substrate having flexibility, stretch or elasticity;
A conductive track containing metal nanowires as conductive tracks interposed between the first polymer substrate and the second polymer substrate; And
A silane-based coupling agent cure to attach the conductive track to at least one of the first polymeric substrate and the second polymeric substrate;
. The flexible PCB of claim 1 wherein the thickness of each of the first polymer substrate and the second polymer substrate is between 10 μm and 3,000 μm. The method of claim 1, wherein the first polymer substrate and the second polymer substrate each independently comprise at least one of PDMS (polydimethylsiloxane) resin, PI (polyimide) resin, polyamide resin, polyester resin, , A polypropylene resin, a polyurethane resin, a polycarbonate resin, or a combination of two or more thereof. The flexible PCB of claim 1, wherein the first polymer substrate and the second polymer substrate are polydimethylsiloxane (PDMS) resins. 2. The flexible PCB of claim 1, wherein the average aspect ratio of the metal nanowires is between 20 and 300. The flexible PCB of claim 1, wherein the average diameter of the metal nanowires is 1 nm to 500 nm. 2. The flexible PCB of claim 1, wherein the average length of the metal nanowires is between 5 and 30 mu m. According to claim 1, wherein the average density of the object, the metal nanowires in the conductive track is flexible, characterized in that to 100 / cm ² to 200,000 pieces / cm ² on the PCB. The flexible PCB according to claim 1, wherein the metal nanowire is Ag, Au, Cu, Pt, Pd, Ni, Co, an alloy thereof, or a combination thereof. The flexible PCB according to claim 1, wherein the metal nanowire is Ag. 2. The composition of claim 1 wherein the silane coupling agent cure is formed from a silane coupling agent represented by the formula R _n SiX _(4-n) , wherein X is an alkoxy group, an acyloxy group, an amine group, or a halogen Atoms, and R is a non-hydrolyzable organic radical. The method according to claim 11, wherein R is selected from the group consisting of an epoxy group, (meth) acrylate group, isocyanate group, vinyl group, styryl group, amino group, isocyanurate group, ureide group, mercapto group, A flexible PCB comprising at least one functional group. 12. The method of claim 11, wherein the silane coupling agent is 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3- glycidoxypropyltrimethoxysilane, (3-glycidoxypropyltrimethoxysilane), 2- (3,4-epoxycyclohexyl) ethyltriethoxysilane, 5,6-epoxyhexyltriethoxysilane (5,6- (3-GLY CIDOXYPROPYL) METHYLDIETHOXYSILANE, (3-GLYCIDOXYPROPYL) METHYLDIMETHOXY SILANE), (3-GLYCIDOXYPROPYL) (3-GLYCIDOXYPROPYL) DIMETHYLETHOXYSILANE), or a combination thereof. 12. The method of claim 11, wherein the silane coupling agent is selected from the group consisting of 3-methacryloxypropyltrimethoxysilane, methacryloxypropyltrimethoxysilane, N- (3-acryloxy-2-hyde (3-ACRYLOXY-2-HYDROXYPROPYL) -3-AMINO PROPYLTRIETHOXYSILANE), O- (methacryloxyethyl) -N- (triethoxy-silylpropyl) 3-aminopropyltriethoxysilane (N- (3-METHACRYLOXYYL) -N- (TRIETHOXY-SILYLPROPYL) URETHANE), N- (3-methacryloxy- 2-HYDROXYPROPYL) -3-AMINOPROPYLTRIETHOXYSILANE, METHACRYLOXY METHYLTRIETHOXYSILANE, METHACRYLOXYMETHYLTRIMETHOXY-SILANE, METHACRYLOXYPROPYL TRIETHOXYSILANE, (3-acryloxypropyl) methyldimethoxysilane ((3-ACRYLOXYP ROPYL) METHYLDIMETHOXYSILANE, METHACRYLOXYMETHYL METHYL-DIETHOXYSILANE, METHACRYLOXYMETHYL METHYL-DIMETHOXYSILANE, (meth) acryloxypropylmethyl (meth) acryloxypropylmethyldimethoxysilane, diethoxysilane (METHACRYLOXYPROPYLMETHYLDI-eTHOXYSILANE), methacrylic hydroxypropyl methyl dimethoxy silane (METHACRYLOXYPROPYLMETHYLDI-mETHOXYSILANE), the methacrylate hydroxypropyl-dimethyl-silane (METHACRYLOXYPROPYLDIMETHYLETHOXY-sILANE), hydroxypropyl methacrylate dimethyl silane (METHACRYLOXYPROPYLDIMETHYLMETHOXY sILANE ), Or a combination thereof. 12. The method of claim 11, wherein the silane coupling agent is selected from the group consisting of isocyanatopropyltriethoxysilane, isocyanatomethyl methyldimethoxysilane, 3-isocyanatopropyltrimethoxysilane, (3-isocyanatopropyltrimethoxysilane), tris [3- (trimethoxysilyl) propyl] isocyanurate, Tris [3- (trimethoxysilyl) propyl] isocyanurate, (3-triethoxysilylpropyl) -t-butylcarbamate, triethoxysilylpropylethylcarbamate, 3-thiocyanatopropyl triethoxysilane, or a combination thereof. Features flexible PCB. The method of claim 11, wherein the silane coupling agent is selected from the group consisting of allyltrimethoxysilane, 3- (N-styrylmethyl-2-aminoethylamino) -propyltrimethoxysilane (3- (N-STYRYL METHYL -2-AMINOETHYLAMINO-PROPYLTRIMETHOXYSILANE, VINYLTRIACETOXY SILANE, VINYLTRIETHOXYSILANE, VINYLTRIISOPROPENOXYSILANE, VINYLTRIISOPROPOXY SILANE, Vinyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 4-aminobutyltriethoxysilane, 4-aminopropyltrimethoxysilane, ), m-aminophenyl trimethoxysilane, p-aminophenyl trimethoxysilane, aminophenyl trimethoxysilane, 3-aminopyridine, (3-AMINOPROPYL TRIS (METHOXYETHOXY-ETHOXY) SILANE, ACETOXYMETHYLTRIETHOXYSILANE, ACETOXYMETHYL TRIMETHOXYSILANE, ACETOXYMETHYL TRIMETHOXYSILANE, Wherein the flexible PCB is characterized in that the flexible PCB is one selected from the group consisting of ACETOXYPROPYLTRIMETHOXYSILANE, BENZOYLOXYPROPYLTRIMETHOXY SILANE, and combinations thereof. The flexible PCB of claim 1, further comprising a conductive pad in electrical contact with the conductive track. Forming a conductive track pattern on the first polymer substrate, the conductive track pattern containing metal nanowires;
Applying a silane-based coupling agent-containing solution onto the conductive track pattern;
Disposing a second polymer substrate on the applied silane-based coupling agent-containing solution; And
Curing the silane-based coupling agent-containing solution;
Of the flexible PCB.

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