KR20150134986A - Lighting device - Google Patents

Abstract

A lighting device according to an embodiment includes a light source unit which comprises point light sources and a circuit board where the point light sources are located, and a cylindrical optical housing which accommodates the light source unit, and has a support part which supports a side of the circuit board. The circuit board includes a body, an electrode pattern which is formed on one side of the body and is electrically connected to the point light source, and a gap supporter which is located on the other side of the body, radiates the heat of the circuit board, and maintains a distance between the other side of the body and the inner surface of the optical hosing.

Description

LIGHTING DEVICE

An embodiment relates to a lighting device.

As a typical example of a light emitting device, a light emitting diode (LED) is a device for converting an electric signal into an infrared ray, a visible ray, or a light using the characteristics of a compound semiconductor, and is used for various devices such as household appliances, remote controllers, Automation equipment, and the like, and the use area of LEDs is gradually widening.

Light emitting diodes are attracting attention as lighting devices with high luminance and high efficiency.

However, the illumination provided with the light emitting diode has a problem that it is recognized as a point light source from the outside due to the strong directivity of the light emitting diode.

Further, the lighting apparatus requires a heat sink for discharging the heat generated from the point light source, but the heat sink can be omitted in a lighting apparatus of a low capacity.

However, in the case of omitting the heat sink in a lighting apparatus, a means for effectively discharging the heat generated in the point light source is required.

In addition, a method of easily and reliably combining the light source unit and the optical housing is being studied.

The embodiment provides a lighting apparatus which is simple in manufacturing method, effectively discharges the heat of the circuit board, and is reliably coupled to the optical housing.

An illumination apparatus according to an embodiment includes a light source unit including a plurality of point light sources and a circuit board on which the point light sources are disposed, a cylindrical optical unit having the support unit for receiving the light source unit therein, The circuit board includes a body, an electrode pattern formed on one side of the body and electrically connected to the point light source, a heat dissipating unit disposed on the other side of the body to radiate heat of the circuit board, And a gap supporter for maintaining a distance between the other surface and the inner surface of the optical housing.

The embodiment is advantageous in that the light source unit is reliably coupled to the optical housing since the light source unit is brought into close contact with the support portion by the gap supporter.

Further, the embodiment is advantageous in that manufacturing is easy since the light source unit is inserted and inserted in one opening of the optical housing.

In addition, the embodiment has an advantage of effectively dissipating the heat generated in the circuit board while preventing the point light source and the short-circuiting by a plurality of heat radiation patterns.

1 is a perspective view of a lighting apparatus according to an embodiment of the present invention.
2 is an exploded perspective view of the lighting apparatus according to Fig.
Fig. 3 is a cross-sectional view taken along line I-I of the illuminating device shown in Fig. 1. Fig.
4 is a cross-sectional view taken along a line II-II of the lighting apparatus shown in Fig.
5 is a cross-sectional view of a light source unit according to an embodiment of the present invention.
6 is an exploded perspective view of a light source unit according to an embodiment of the present invention.
7 is a cross-sectional view of a light source unit according to another embodiment of the present invention.
8 is a cross-sectional view of a lighting apparatus according to another embodiment of the present invention.

The angles and directions referred to in the process of describing the structure of the embodiment are based on those shown in the drawings. In the description of the structure in the specification, reference points and positional relationships with respect to angles are not explicitly referred to, refer to the relevant drawings.

Like reference numerals refer to like elements throughout the specification.

FIG. 1 is a perspective view of a lighting apparatus according to an embodiment of the present invention, FIG. 2 is an exploded perspective view of the lighting apparatus according to FIG. 1, and FIG. -? Fig. 4 is a cross-sectional view taken along a line in Fig. -? FIG. 5 is a cross-sectional view of a light source unit according to an embodiment of the present invention, and FIG. 6 is an exploded perspective view of a light source unit according to an embodiment of the present invention.

The lighting apparatus 100 according to an embodiment of the present invention includes a light source unit 110 having a circuit board 111 on which a plurality of point light sources 112 and a point light source 112 are positioned, And a supporting portion 125 for supporting one surface of the circuit board 111. The optical housing 120 has a cylindrical shape.

The illuminating device 100 of the embodiment includes an end cap 1300 for shielding the opening 129 of the optical housing 120 and a power supply unit 1301 electrically connecting the light source unit 110 and an external power source, As shown in FIG.

1 to 4, the optical housing 120 protects the light source unit 110 from external shocks, moisture, and the like, supports the light source unit 110, guides the light generated from the light source unit 110 And diffuses the light generated by the light source unit 110.

The optical housing 120 accommodates the light source unit 110 therein, and may have an opening 129 at least at one end thereof.

For example, the optical housing 120 may have a shape in which both end portions in the longitudinal direction are opened and have an empty space therein. Specifically, the optical housing 120 may be cylindrical in the longitudinal direction as shown in Fig.

The optical housing 120 has a structure in which the light source unit 110 is accommodated and the light source unit 110 is connected to the power source unit through openings 129 at both ends.

Specifically, the optical housing 120 may have an integral or detachable structure. In the embodiment, the optical housing 120 is integrally formed and can be formed by an injection method.

4, the optical housing 120 includes a front portion 121 which is positioned in front of the light source unit 110 and diffuses light generated by the point light source 112, And a rear portion 123, on which the first and second protrusions 125 are formed.

The front portion 121 diffuses the light generated by the point light source 112 and protects the light source unit 110 accommodated therein.

The shape of the front portion 121 is not limited, but the front portion 121 may have a predetermined distance from the point light source 112, and may have a fan shape on the optical axis, which is the main path along which light generated by the point light source 112 travels. Is preferable in terms of diffusion of light.

Specifically, the front portion 121 forms a partial area of the optical housing 120, and a cylindrical portion (semicircular) can be formed in the longitudinal direction.

The front portion 121 may include diffusion particles to prevent glare of light generated by the point light source 112 of the light source unit 110 and to uniformly emit light to the outside, 121 may have a prism pattern or the like formed on at least one of the inner and outer surfaces thereof.

Further, the phosphor may be applied to at least one of the inner surface and the outer surface of the front portion 121.

Since the light generated from the light source unit 110 is emitted to the outside through the front part 121, the front part 121 should have a good light transmittance and have sufficient heat resistance to withstand the heat generated by the light source unit 110 .

Therefore, the front portion 121 is preferably made of a material including polyethylene terephthalate (PET), polycarbonate (PC), or polymethyl methacrylate (PMMA).

The rear portion 123 provides a space in which the light source unit 110 is coupled. For example, the rear portion 123 forms a partial area of the optical housing 120 and has a semi-circular shape in the longitudinal direction, so that a cylindrical housing together with the front portion 121 can be formed.

When the optical housing 120 is formed long in the longitudinal direction, a rib 126 may be further formed on the rear portion 123 to reinforce the rigidity of the optical housing 120.

Specifically, the rib 126 may be formed to be long in the longitudinal direction of the optical housing 120 at the rear portion 123. In particular, the rib 126 may be positioned inside the rear portion 123 in consideration of user's aesthetics.

The supporting portion 125 supports the light source unit 110. [ The support portion 125 supports one surface of the circuit board 111. Here, one surface of the circuit board 111 means one surface of the body 19, which will be described later.

Specifically, the support portion 125 may be formed in the inner direction of the optical housing 120 from the inner surface of the rear portion 123. The support portion 125 may be disposed long in the longitudinal direction of the optical housing 120.

More specifically, the support part 125 supports both ends of one side of the circuit board 111 of the light source unit 110 in the width direction, so that the point light source 112 located on one side of the circuit board 111 is exposed. The support portion 125 allows the circuit board 111 to be positioned between the support portion 125 and the inner surface of the rear portion 123.

3, the end cap 130 shields the opening 129 of the optical housing 120 and accommodates the light source unit 110. The end cap 130 is preferably made of a resin material of insulating material to prevent a short circuit.

The end cap 130 may have a cylindrical structure in which one side is open and the other side is closed. For example at least including a plate 131 sized to shield the opening 129 of the optical housing 120 and an outer wall 133 extending from the rim of the plate 131 to define a space therein have.

The plate 131 is fixed through the terminal pin 141 to be described later. One end of the terminal pin 141 is exposed to the outside of the end cap 130 and the other end of the terminal pin 141 is positioned inside the end cap 130.

The outer wall 133 extends from the rim of the plate 131 to form a space in which the fixed terminal 142 and the connection portion 113 are accommodated. The outer wall 133 is formed in a cylindrical shape and is formed to correspond to the optical housing 120.

The power source unit electrically connects the light source unit 110 and an external power source. The power unit may have a configuration in which the power unit is fixed to the end cap 130, a part of the power unit is exposed to the outside of the end cap 130, and the other part is located inside the end cap 130. The power supply unit switches the external power supply to the driving power supply.

For example, the power source unit may include a terminal pin 141 and a fixed terminal 142.

One end of the terminal pin 141 is exposed through the end cap 130 and the other end is positioned inside the end cap 130. The fixed terminal 142 is brought into contact with the other end of the terminal pin 141.

The terminal pin 141 has a size and an arrangement that can be inserted into a standardized socket. Preferably, the terminal pins 141a and 141b may include at least two terminals. The two terminal pins 141 may be supplied with power of the same polarity, may be supplied with a power of another polarity, and either one of the two terminal pins 141 may be an insulator.

The fixed terminal 142 is electrically connected to the terminal pin 141 and fixes the connection portion 113 accommodated in the end cap 130 with an elastic force.

Specifically, the fixed terminal 142 closely contacts the connection portion 113 received in the end cap 130 with the inner peripheral surface of the end cap 130 by an elastic force. Therefore, the fixed terminal 142 and the circuit board 111 are electrically connected and elastically fixed.

Since the power source unit is located at both ends of the optical housing 120 in the direction of the length of the optical housing 120, the space occupied by the power source unit in the optical housing 120 can be eliminated.

The light source unit 110 generates light. The light source unit 110 may include a plurality of point light sources 112.

The plurality of point light sources 112 may be arranged with a constant pitch for supplying uniform light to the lighting apparatus 100. [ The plurality of point light sources 112 can be set in pitch and number in consideration of the luminous intensity of the illuminating device 100.

In addition, the plurality of point light sources 112 may be white in color, or the colors of adjacent point light sources 112 may be mixed to emit white light.

The point light source 112 includes a self-emitting element such as a light emitting element (diode) or a laser diode (LD).

The light source unit 110 may have various structures for generating light, but includes, for example, a circuit board 111 on which the point light source 112 and the point light source 112 are located.

The circuit board 111 supports the point light source 112 and is electrically connected to the point light source 112 to supply power to the point light source 112.

For example, the circuit board 111 may include a body 19, an electrode pattern 12 and a gap supporter 160.

5 and 6, the body 19 is a bar-shaped electrothermal material, which forms a frame of the circuit board 111 and provides a space in which the electrode pattern 12 and the point light source 112 are located do.

At both ends of the body 19, a connection portion 113 connected to the fixed terminal 142 may be formed.

6, the body 19 includes a base layer 11 forming the base of the body 19, an insulating layer 13 formed of an insulating material on the base layer 11, An electrode pattern 12 disposed in the insulating layer 13 and a cover layer 15 covering the insulating layer 13 and the electrode pattern 12 on the insulating layer 13 may be formed.

An opening 17 is formed in the cover layer 15 at a position where the point light source 112 is to be disposed so that the electrode pattern 12 can be exposed through the opening 17. [

The electrode pattern 12 is formed on one surface of the circuit board 111 (specifically, the body 19) and is electrically connected to the point light source 112. Specifically, one surface of the body 19 is a surface on which the point light source 112 is located.

The gap supporter 160 maintains the distance between the optical housing 120 and the circuit board 111 (the body 19) and dissipates the heat of the circuit board 111.

The gap supporter 160 is located on the other side of the circuit board 111. [ Here, the other surface of the circuit board 111 means the other surface of the body 19.

The gap supporter 160 may be formed on the other surface of the body 19 and protrude from the other surface of the body 19 toward the inner surface of the optical housing 120. Here, the other surface of the body 19 will refer to a surface facing the body 19.

Specifically, as shown in Figs. 5 and 6, the gap supporter 160 can be coupled to the base 11. Fig.

4, the support portion 125 supports both ends of one side of the circuit board 111 in the width direction, and the gap supporter 160 is disposed between the inner surface of the rear portion 123 and the other side of the circuit board 111 .

The gap supporters 160 are located at the center in the width direction of the body 19 and can be repeatedly arranged at a constant pitch along the longitudinal direction of the circuit board 111. [

The gap supporter 160 may have a length such that the body 19 of the circuit board 111 is fixed between the support portion 125 and the inner surface of the rear portion 123. [

The gap supporter 160 prevents the body 19 from being held between the support portion 125 and the inner surface of the rear portion 123. That is, the gap supporter 160 causes one surface of the circuit board 111 (the body 19) to be brought into close contact with the support portion 125.

Accordingly, it is preferable that the circuit board 111 is inserted and inserted in the opening 129 of the optical housing 120 in the direction of the other opening 129.

A screw hole (not shown) is formed in the gap supporter 160 to improve the coupling force between the optical housing 120 and the circuit board 111. An optical housing 120 corresponding to the gap supporter 160 A bolt hole 127 through which the coupling bolt 500 passes may be formed.

The coupling bolt 500 is inserted into the gap supporter 160 through the bolt hole 127 to fix the optical housing 120 and the circuit board 111.

The gap supporter 160 may have a certain rigidity to support the body 19 and may be made of a material having excellent thermal conductivity in order to discharge heat of the circuit board 111. [

For example, the gap supporter 160 may include a metal material. The gap supporter 160 can be coupled to the body 19 by screwing or soldering.

Of course, the circuit board 111 may be a printed circuit board (PCB). However, the circuit board 111 may include not only a general PCB but also a metal core PCB (MCPCB), a flexible PCB (FPCB), and the like, but the present invention is not limited thereto.

The bottom heat radiation pattern 153 for radiating heat of the circuit board 111 may be further formed on the other side of the circuit board 111. [

Referring to FIGS. 5 and 6, the bottom heat radiation pattern 153 radiates heat of the circuit board 111.

As the bottom heat radiation pattern 153, a metal material having excellent thermal conductivity may be selected. Preferably, when the point light source 112 (light emitting element) is mounted on one surface of the circuit board 111 by surface mounter technology (SMT), the bottom heat radiation pattern 153 is also surface mounted Solder (lead, Pb).

In the case where the bottom heat radiation pattern 153 is formed of solder, there is an advantage that a separate process is unnecessary since the point light source 112 can be mounted simultaneously.

Specifically, a plurality of the bottom radiation patterns 153 may be arranged on the other surface of the body 19 along the longitudinal direction of the circuit board 111, with a predetermined pitch. At this time, the gap supporter 160 and the bottom heat radiation pattern 153 formed on the other surface of the body 19 may be connected to each other or may be spaced apart from each other. In FIG. 5, the gap supporter 160 and the bottom heat radiation pattern 153 are shown to be spaced apart from each other.

The bottom heat radiation pattern 153 may be electrically connected to the electrode pattern 12, but may be electrically isolated from each other to prevent electrical shorting.

6, when the bottom heat radiation pattern 153 is located on the lower surface of the base layer 11 and the electrode pattern 12 is located on the upper surface of the base layer 11, The bottom heat radiation pattern 153 and the electrode pattern 12 are insulated by the layer 11.

At this time, it is preferable that the gap supporter 160 and the electrode pattern 12 are also electrically insulated, and the gap supporter 160 may be located on the lower surface of the base layer 11.

A top radiation pattern 151 for radiating heat of the circuit board 111 may be further formed on one side of the circuit board 111.

Referring to FIGS. 5 and 6, the top radiation pattern 151 radiates heat from the circuit board 111.

The top radiation pattern 151 may be made of a metal material having excellent thermal conductivity. Preferably, when the point light source 112 (light emitting element) is mounted on one surface of the circuit board 111 by surface mounter technology (SMT), the top heat radiation pattern 151 is also surface mounted Solder (lead, Pb).

In the case where the top radiation pattern 151 is formed of solder, there is an advantage that a separate process is unnecessary since the point radiation source 112 can be mounted simultaneously.

Specifically, a plurality of the top radiation patterns 151 may be disposed at a predetermined pitch on one side of the body 19 along the longitudinal direction of the circuit board 111.

At this time, the top radiation pattern 151 may be disposed between the point light sources 112. The top heat radiation pattern 151 is disposed between the point light sources 112 so that effective heat transmission is possible in the point light source 112 where heat is generated.

The top radiation pattern 151 may cause an electrical short when the electrode pattern 12 is energized. Therefore, the top radiation pattern 151 and the electrode pattern 12 can be electrically insulated from each other.

6, the top radiation pattern 151 is located on the top surface of the cover layer 15. When the electrode pattern 12 is positioned below the cover layer 15, The top radiation pattern 151 and the electrode pattern 12 are insulated by the layer 15.

At this time, the bottom heat radiation pattern 153 and the top heat radiation pattern 151 formed on the other surface of the body 19 may be connected to each other or may be spaced apart from each other.

For example, the top heat radiation pattern 151 may be connected to the bottom heat radiation pattern 153. [ 5, the top heat radiation pattern 151 and the bottom heat radiation pattern 153 may be connected to each other through through holes formed in the other surface of the circuit board 111 (body 19). At this time, the top heat radiation pattern 151 and the bottom heat radiation pattern 153 may be positioned so as to correspond to each other (overlap each other).

The through hole may be provided with a connection portion 155 connecting the top heat radiation pattern 151 and the bottom heat radiation pattern. Of course, it is preferable that the connection portion 155 is formed of solder.

When the top radiation pattern 151 is connected to the bottom radiation pattern 153, the heat generated by the point light source 112 is transmitted to the adjacent top radiation pattern 151 and the heat transmitted to the top radiation pattern 151 And is quickly transferred to the thermally connected bottom heat radiation pattern 153. [

7 is a cross-sectional view of a light source unit according to another embodiment of the present invention.

The light source unit 110 of the embodiment differs from the embodiment of FIG. 5 in the arrangement of the bottom heat radiation patterns 153A.

Referring to FIG. 7, the bottom heat radiation pattern 153A may be arranged long along the longitudinal direction of the circuit board 111. FIG. Specifically, the bottom heat radiation pattern 153A is disposed on the other surface of the body 19 in a lengthwise direction of the circuit board 111. [ More specifically, the bottom heat radiation pattern 153A can be formed to correspond to the other side of the sea.

Since the point light source 112 is disposed on one side of the body 19, there is a limit to the arrangement of the top heat radiation pattern 151, but there is no limitation on the bottom heat radiation pattern 153A located on the other side of the body 19 . Therefore, when the bottom heat radiation pattern 153A is formed to correspond to the other surface of the body 19 and the heat radiation area is enlarged and connected to the top heat radiation pattern 151, the circuit board 111 is effectively cooled, 112 can be prevented from being electrically short-circuited.

At this time, the gap supporter 160 may be coupled to the other surface of the body 19 through the bottom heat radiation pattern 153A. Of course, the gap supporter 160 and the bottom heat radiation pattern 153A may be thermally connected.

8 is a cross-sectional view of a lighting apparatus according to another embodiment of the present invention.

In the lighting apparatus 100A of the embodiment of Fig. 8, there is a difference between the position of the converter 170 of the power unit and the arrangement of the gap supporter 160A.

Referring to Fig. 8, the converter 170 of the embodiment is located inside the optical housing 120, unlike the embodiment of Fig. In the embodiment of FIG. 4, the converter may be located at either end of the aperture 129 of the optical housing 120, or may be located inside the end cap 130.

Converter 170 converts commercial power to driving power.

Specifically, the converter 170 is located long inside the rear portion 123 of the optical housing 120 along the longitudinal direction of the optical housing 120. More specifically, the converter 170 is positioned between the inner surface of the rear portion 123 and the other surface of the circuit board 111.

At this time, the gap supporters 160A may be positioned on both sides of the converter 170 as viewed in the longitudinal direction of the optical housing 120. That is, a plurality of gap supporters 160A may be arranged along the longitudinal direction of the optical housing 120 in two rows.

Here, the end of the gap supporter 160 may be formed to correspond to the shape of the inner surface of the rear portion 123.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

100: Lighting equipment
110: Light source unit
120: optical housing

Claims (10)

A light source unit having a plurality of point light sources and a circuit board on which the point light sources are located; And
And a cylindrical optical housing housing the light source unit therein and having a support portion for supporting one surface of the circuit board,
The circuit board includes:
An electrode pattern formed on one surface of the circuit board and electrically connected to the point light source; And
And a gap supporter disposed on the other surface of the circuit board to dissipate heat of the circuit board and to maintain a distance between the other surface of the circuit board and an inner surface of the optical housing. The method according to claim 1,
Further comprising apertures at both ends of the optical housing,
Wherein the circuit board is inserted and inserted into the other opening from any of the openings. The method according to claim 1,
And a plurality of bottom heat radiation patterns for radiating heat transferred to the circuit board are further formed on the other surface of the circuit board. The method of claim 3,
And a plurality of top radiation patterns for radiating heat transferred to the circuit board are further formed on one surface of the circuit board. The method of claim 3,
Wherein the bottom heat radiation pattern is solder. 5. The method of claim 4,
Wherein the top radiation pattern is a solder. 5. The method of claim 4,
Wherein the top heat radiation pattern and the bottom heat radiation pattern are thermally connected through a connection hole formed in the circuit board. 8. The method of claim 7,
Wherein the top radiation pattern and the bottom radiation pattern are insulated from the electrode pattern. The method according to claim 1,
The support portion providing a space in which the circuit board is located between the inner surface of the optical housing,
Wherein the gap supporter closely contacts one surface of the circuit board with the support. 3. The method of claim 2,
An end cap shielding an opening of the optical housing; And
Further comprising a power unit electrically connected to the light source unit and an external power source and located in the end cap.

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