KR20150031393A - Light emitting device having scattering particle - Google Patents
Light emitting device having scattering particle Download PDFInfo
- Publication number
- KR20150031393A KR20150031393A KR20130110751A KR20130110751A KR20150031393A KR 20150031393 A KR20150031393 A KR 20150031393A KR 20130110751 A KR20130110751 A KR 20130110751A KR 20130110751 A KR20130110751 A KR 20130110751A KR 20150031393 A KR20150031393 A KR 20150031393A
- Authority
- KR
- South Korea
- Prior art keywords
- light emitting
- scattering particles
- emitting device
- scattering
- plug
- Prior art date
Links
- 239000002245 particle Substances 0.000 title claims abstract description 89
- 239000011858 nanopowder Substances 0.000 claims abstract description 31
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 10
- 239000000377 silicon dioxide Substances 0.000 claims description 7
- 239000011324 bead Substances 0.000 claims description 6
- 239000002105 nanoparticle Substances 0.000 claims description 5
- 229920002050 silicone resin Polymers 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 239000004793 Polystyrene Substances 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 3
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 239000011863 silicon-based powder Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 239000008393 encapsulating agent Substances 0.000 abstract description 4
- 230000015556 catabolic process Effects 0.000 abstract 1
- 230000005494 condensation Effects 0.000 abstract 1
- 238000009833 condensation Methods 0.000 abstract 1
- 238000006731 degradation reaction Methods 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 14
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
- 239000004005 microsphere Substances 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 230000000704 physical effect Effects 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 5
- 238000001556 precipitation Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 230000002776 aggregation Effects 0.000 description 4
- 238000004220 aggregation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 230000001376 precipitating effect Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910018557 Si O Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
BACKGROUND OF THE
Light emitting diodes (LEDs) convert electrical energy into light, and light is generated in at least one active layer between layers doped with impurities, which are generally of opposite polarity. That is, when a bias is applied to both sides of the active layer, holes and electrons are injected into the active layer and recombined to generate light. Such light is emitted to the outside from the active layer and the entire surface of the light emitting diode. The light emitting diode is sealed in a package to provide various functions such as protection from external environmental or mechanical damage, color selection, focusing of light, and the like.
On the other hand, the light emitting device generates a desired color using a phosphor containing phosphorus contained in the plug. That is, the light emitted from the light emitting device reacts with the phosphor, and the scattering particles are uniformly dispersed in the plug to uniformly react the light with the phosphor. The use of the scattering particles not only increases the probability of reacting with the phosphor by varying the path of light emitted from the light emitting device, but also provides a path through which the changed light can escape, thereby enabling uniform emission. In other words, color uniformity can be secured not only at the center of the light emitting element but also at the outer periphery thereof by scattering particles.
However, in a light emitting device including scattering particles in the past, scattering particles often have a specific gravity higher than that of the plugs and sink or coexist, and often fail to fully exhibit their function as scattering particles. Particularly, the scattering particles may be layered or locally aggregated to be deposited around the light emitting device. As a result, the light emitted from the light emitting device passes through the scattering particles and the brightness is lowered. As a result, . In addition, even when scattering particles are added, color uniformity is not achieved over the entire light emitting device due to the precipitation and aggregation, and color irregularity occurs, for example, in the center and the periphery of the light emitting device.
SUMMARY OF THE INVENTION It is an object of the present invention to provide a light emitting device including scattering particles capable of realizing color uniformity without causing aggregation or precipitation and uniformly dispersing scattering particles so that luminance does not decrease.
A light emitting device including scattering particles to solve the problems of the present invention includes a light emitting diode mounted on a lead frame and a plug sealing the light emitting diode and scattering particles and nano powder dispersed therein. At this time, the nano powder preferably has a size smaller than ½ of the wavelength of light generated in the chip.
In the device of the present invention, the difference in refractive index between the scattering particles and the plugs is preferably 0.10 to 0.15, and may be selected from among silicon powder, silicone resin and epoxy resin. The average diameter of the scattering particles is preferably 2 탆 to 15 탆, and the scattering particles may be added in an amount of 0.5 to 2% by weight based on the total weight of the plugs. The nano powder may be at least one selected from the group consisting of silica, silica hollow spheres, glass, alumina, PMMA beads, and nano-sized polystyrene beads. . In the present invention, the scattering particles and the nano powder may be distributed in an upper region of the plug and may be distributed in a lower region of the plug.
According to the light emitting device including the scattering particles of the present invention, scattering particle microspheres having similar physical properties to the plugging material are dispersed in the plug together with the nano powder to prevent aggregation or precipitation of scattering particles, So that the luminance is not deteriorated and the color uniformity can be realized. In addition, the scattering layer containing the scattering particles can be restricted to a certain region of the plug, so that the scattering effect can be sufficiently obtained while reducing the amount of the scattering particles and the nano powder.
1 is a cross-sectional view conceptually illustrating a first light emitting device including scattering particles according to an embodiment of the present invention.
2 is a cross-sectional view conceptually illustrating a second light emitting device including scattering particles according to another embodiment of the present invention.
3 is a cross-sectional view conceptually illustrating a third light emitting device including scattering particles according to another embodiment of the present invention.
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments described below can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. The embodiments of the present invention are provided to enable those skilled in the art to more fully understand the present invention.
In the embodiment of the present invention, scattering particle microspheres having similar physical properties to the plug body are dispersed in the plug together with the nano powder, so that the scattering particles do not aggregate or precipitate and are uniformly dispersed, And a light emitting device including scattering particles capable of realizing color uniformity. For this purpose, a detailed description will be made of a process in which scattering particle microspheres and nano powder are dispersed in the bag, and the color uniformity of the light emitting device is improved. Meanwhile, the light emitting device to which the present invention is applied can be variously formed regardless of the presence or absence of the reflection cup within the scope of the present invention. Here, for example, a light-emitting element having a reflection cup.
1 is a cross-sectional view conceptually illustrating a first
1, a first
The
In addition, the
The size of the
The
The first
2 is a cross-sectional view conceptually illustrating a second
2, in the second
Even when the scattering layer is limited to the upper region (a) as in the second
3 is a cross-sectional view conceptually illustrating a third
3, in the third
Even if the scattering layer is limited to the lower region (b) as in the third
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but many variations and modifications may be made without departing from the spirit and scope of the invention. It is possible.
10; A
22; A
30;
50;
100, 200, 300; The first to third light emitting elements
Claims (9)
A light emitting device comprising scattering particles including scattering particles and a plug including a nano powder having a size smaller than 1/2 of the light wavelength generated in the chip.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20130110751A KR20150031393A (en) | 2013-09-14 | 2013-09-14 | Light emitting device having scattering particle |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20130110751A KR20150031393A (en) | 2013-09-14 | 2013-09-14 | Light emitting device having scattering particle |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20150031393A true KR20150031393A (en) | 2015-03-24 |
Family
ID=53024978
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR20130110751A KR20150031393A (en) | 2013-09-14 | 2013-09-14 | Light emitting device having scattering particle |
Country Status (1)
Country | Link |
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KR (1) | KR20150031393A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10468388B2 (en) | 2016-03-10 | 2019-11-05 | Samsung Display Co., Ltd. | Display apparatus having LED effectively prevented from being recognized as point source of light |
CN112259571A (en) * | 2020-10-22 | 2021-01-22 | 武汉华星光电技术有限公司 | Flexible backboard and display device |
WO2023104529A1 (en) * | 2021-12-09 | 2023-06-15 | Ams-Osram International Gmbh | Optoelectronic element and method for producing an optoelectronic element |
-
2013
- 2013-09-14 KR KR20130110751A patent/KR20150031393A/en not_active Application Discontinuation
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10468388B2 (en) | 2016-03-10 | 2019-11-05 | Samsung Display Co., Ltd. | Display apparatus having LED effectively prevented from being recognized as point source of light |
US11764193B2 (en) | 2016-03-10 | 2023-09-19 | Samsung Display Co., Ltd. | Display apparatus including light-emitting diode in concave portion of pixel-defining layer |
CN112259571A (en) * | 2020-10-22 | 2021-01-22 | 武汉华星光电技术有限公司 | Flexible backboard and display device |
CN112259571B (en) * | 2020-10-22 | 2023-05-30 | 武汉华星光电技术有限公司 | Flexible backboard and display device |
WO2023104529A1 (en) * | 2021-12-09 | 2023-06-15 | Ams-Osram International Gmbh | Optoelectronic element and method for producing an optoelectronic element |
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WITN | Withdrawal due to no request for examination |