KR20140012226A

KR20140012226A - Solar cell module

Info

Publication number: KR20140012226A
Application number: KR1020120078035A
Authority: KR
Inventors: 이은주; 한익현; 문세영; 유재민
Original assignee: 엘지전자 주식회사
Priority date: 2012-07-18
Filing date: 2012-07-18
Publication date: 2014-02-03

Abstract

A solar cell module comprises multiple solar cells; a light transmitting front substrate which is located on the front surface of the solar cells; a base film; a silicone resin coating layer which is coated on at least one side of the base film; a back substrate which is located on the back surface of the solar cells so that the silicone resin coating layer is faced with the multiple solar cells; and a silicone resin. A sealing member for sealing the multiple solar cells is included between the light transmitting front substrate and the back substrate. The entire back surface of the sealing member is directly touched with the silicone resin coating layer.

Description

Solar cell module {SOLAR CELL MODULE}

The present invention relates to a solar cell module.

Photovoltaic power generation, which converts light energy into electrical energy using a photoelectric conversion effect, is widely used as a means for obtaining pollution-free energy. And with the improvement of the photoelectric conversion efficiency of a solar cell, the photovoltaic power generation system which uses many solar cell modules is installed also in a private house.

The solar cell module including a plurality of solar cells generated by solar light includes a protection member disposed above and below the solar cell to protect the solar cell from an external environment such as external shock and moisture.

The technical problem to be achieved by the present invention is to provide a solar cell module with improved long-term reliability.

According to one aspect of the invention, the solar cell module comprises a plurality of solar cells; A light transmissive front substrate positioned toward the front surface of the solar cells; A back film comprising a base film and a silicone resin coating layer coated on at least one side of the base film, the back surface being positioned toward the back surface of the solar cells such that the silicon resin coating film faces a plurality of solar cells. Board; And a silicone resin, the sealing member sealing a plurality of solar cells between the light transmissive front substrate and the rear substrate, wherein the entire rear surface of the sealing member is in direct contact with the silicone resin coating film.

The base film may be made of polyethylene terephthalate (PET) resin or polybutylene terephthalate (PBT) resin.

The back substrate including the base film and the silicone resin coating film has a tensile strength of 30 MPa or more, may have a light transmittance of 50% or less at 300 nm to 500 nm, and a light reflectance of 40% or more at 300 nm to 500 nm. Can be.

The sealing member may include a first sealing material located between the front substrate and the solar cell and a second sealing material located between the solar cell and the rear substrate, the first sealing material may be formed of a first silicone resin, and the second The sealing material may be formed of the second silicone resin.

In this case, the first silicone resin and the second silicone resin may be formed of the same silicone resin including the same component, or may be formed of different silicone resins including different components.

The second silicone resin and the silicone resin coating film may be formed of the same silicone resin including the same component, or may be formed of different silicone resins including different components.

The bonding surface of the first silicone resin and the second silicone resin may be formed as a non-flat surface.

According to this feature, since the sealing member is formed of a silicone resin, the rear substrate includes a silicone resin coating film, and the entire rear surface of the sealing member is in direct contact with the silicone resin coating film, the sealing member and the rear substrate are made of different materials. Compared with the case formed, the adhesion between the sealing member and the back substrate is very excellent.

For example, in the case of a Tedlar coated PET-based conventional back substrate, the adhesive force (vertical peel strength) with the sealing member formed of silicone resin is 10 kg / cm ² to 15 kg / cm ^2, however, in the case of the back substrate of this embodiment of the PTI series in which the silicone resin coating film is formed, the adhesive force of the sealing member formed of the silicone resin is 15 kg / cm ² or more, and thus the adhesive force of the sealing member and the rear substrate is improved.

Therefore, the penetration of moisture, oxygen, and impurities through the interface between the sealing member and the rear substrate can be effectively prevented for a long time, so the long-term reliability of the solar cell module is excellent.

When the back substrate is made of only silicone resin, a fiber material such as glass glass is used to reinforce the strength of the solar cell module. However, when the fiber material is used, current leakage may occur.

However, since the back substrate of the present embodiment is manufactured by forming a silicone resin coating film on a Piti-based base material, the strength of the solar cell module can be maintained even without using a fibrous material. Therefore, there is no fear of current leakage.

In addition, the silicone resin coating film coated on the base film is more durable than Tedler due to the temperature difference. It can be suppressed.

And various kinds of additives can be added to the silicone resin coating film as needed.

For example, an ultraviolet stabilizer may be added to the silicone resin coating layer or dyes of various colors may be added.

And since the interface of a 1st sealing material and a 2nd sealing material is formed in the non-planar surface, the light incident through the front substrate is diffusely reflected at the interface of a 1st sealing material and a 2nd sealing material. Therefore, the amount of light incident on the solar cell is increased to improve the output of the solar cell module.

1 is a conceptual diagram illustrating a schematic configuration of a solar cell module according to a first embodiment of the present invention.
FIG. 2 is a graph showing light absorption coefficients of the first silicone resin and ethylene vinyl acetate according to the wavelength range of light.
3 is an enlarged view of a portion “C” of FIG. 1.
FIG. 4 is a process chart showing a method of manufacturing the solar cell module shown in FIG. 1.
5 is a conceptual diagram illustrating a schematic configuration of a solar cell module according to a first modified embodiment of FIG. 1.
6 is a conceptual diagram illustrating a schematic configuration of a solar cell module according to a second modified embodiment of FIG. 1.
7 is a conceptual diagram illustrating a schematic configuration of a solar cell module according to a second embodiment of the present invention.
8 is a flowchart illustrating a method of manufacturing the solar cell module shown in FIG. 7.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

In the drawings, the thickness is enlarged to clearly represent the layers and regions. Like parts are designated with like reference numerals throughout the specification. When a layer, film, region, plate, or the like is referred to as being "on" another portion, it includes not only the case directly above another portion but also the case where there is another portion in between.

Conversely, when a part is "directly over" another part, it means that there is no other part in the middle. In addition, when a part is formed as "whole" on another part, it includes not only the part formed on the entire surface (or the entire surface) of the other part but also the part not formed on the edge part.

Next, a solar cell module according to an embodiment of the present invention will be described with reference to the accompanying drawings.

1 is a conceptual diagram illustrating a schematic configuration of a solar cell module according to an embodiment of the present invention.

The solar cell module according to the present embodiment includes a plurality of solar cells 10, an interconnector 20 for electrically connecting the plurality of solar cells 10, and light positioned at a front surface side of the solar cell 10. A transmissive front substrate 30, a rear substrate 40 positioned on the back surface side of the solar cell 10, and a sealing member 50 positioned between the front substrate 30 and the rear substrate 40. do.

The light transmissive front substrate 30 is located on the first surface of the solar cell 10, for example, on the light receiving surface side of the solar cell, and is made of tempered glass having high transmittance. At this time, the tempered glass may be a low iron tempered glass having a low iron content. The light-transmissive front substrate 30 may be embossed on the inner side to enhance the light scattering effect.

The sealing member 50 includes a first sealing material 51 positioned between the solar cell 10 and the front substrate 30, and a second sealing material 53 positioned between the solar cell 10 and the rear substrate 40. It includes, to prevent corrosion of the metal due to moisture infiltration and to protect the solar cell 10 from impact.

The first seal member 51 is a short wavelength band, for example 300㎚ to a light transmittance of 80% or more of the light-transmitting 500㎚ in the adhesive force between the front substrate (30) 10kg / cm ² to 15kg / cm ² in the first silicone resin It is formed of (silicon resin). The first sealing material 51 may be formed by applying a liquid first silicone resin and curing the same.

The first silicone resin forming the first sealing material 51 may be made of a siloxane such as polydimethylsiloxane (PDMS) or polydialkylsiloxane (PDAS).

Referring to FIG. 2, the extinction coefficient (cm ⁻¹ ) of the first silicone resin and the ethylene vinyl acetate (EVA) according to the wavelength of light is as follows.

In the graph shown in FIG. 2, the graph "A" is a graph showing the change of the absorption coefficient of light of EVA according to the wavelength range of light, and the graph "B" is the light of the first sealing material 51 according to the wavelength of light. It is a graph showing the change in absorption coefficient of.

EVA used in the experiment is a conventional product used as a sealing member of a solar cell, and the first silicone resin used in the graph "B" is polydimethylsiloxane (PDMS).

As shown in Fig. 2, the light absorption coefficient of EVA in the short wavelength band, for example, 300 nm to 500 nm, is higher than that of PDMS. Therefore, the light absorption in the short wavelength band is lower than that of the first silicone resin EVA.

Low light absorption in the short wavelength band means that the light in the short wavelength band is well transmitted. According to the inventor's experiment, it was found that the first silicone resin, more specifically, the siloxane such as PDMS or PDAS, has a light transmittance of 80% or more in the short wavelength band.

Therefore, when the first silicone resin is used as the first sealing material 51, the amount of light absorbed by the first sealing material 51 decreases, so that the amount of light incident into the solar cell 10 increases. Thus, the output efficiency of the solar cell module is improved.

In addition, it is possible to suppress the discoloration problem of the first sealing material 51 due to the ultraviolet exposure and the corrosion problem due to the absorption of air and oxygen to increase the durability of the module.

In addition, since the first sealing material 51 can be formed in a thinner thickness than the EVA used as a protective film, the thickness of the module can be reduced.

For example, the EVA is formed to a thickness of approximately 1.0 mm, but the first seal 51 may be formed to a thickness of approximately 0.7 mm or less, preferably 0.3 to 0.5 mm. Therefore, the overall thickness of the solar cell module can be reduced as compared with the conventional.

In addition, since the curing temperature of the first silicone resin is lower than that of EVA, the modularization process can be performed at a lower temperature, and the curing time can be shortened.

For example, the first silicone resin is cured at a temperature of approximately 80 ° C. or higher, for example, from 90 ° C. to 150 ° C., while the EVA is cured at a temperature of approximately 165 ° C. Thus, the modularization process can be carried out at lower temperatures.

And about 1.5 minutes (min) time is consumed in hardening a 1st silicone resin, but about 16 minutes is used time in hardening EVA. Therefore, the time spent on the hardening and modularization process of a protective film can be shortened.

The second sealing material 53 is formed of a second silicone resin. The second sealing member 53 may be made of a resin having a lower light transmittance in the shorter wavelength band than the first sealing member 51.

The second sealing member 53 may be formed to a thickness of 0.3 mm to 0.5 mm, and may be formed to be the same as the thickness of the first sealing material 51.

However, in order to increase weather resistance of the solar cell module, the thickness of the second sealing material 53 may be formed to be thicker than the thickness of the first sealing material 51.

Since the light transmittance of the second sealing material 53 is lower than that of the first sealing material 51, some of the light in the short wavelength band that has passed through the first sealing material 51 does not pass through the second sealing material 53. .

Therefore, it is possible to prevent the back substrate 40 from discoloring and deteriorating due to the light of the short wavelength band transmitted through the second sealing member 53.

In the above description, the first silicone resin and the second silicone resin are different silicone resins including different components, but the second silicone resin may be the same silicone resin including the same component as the first silicone resin. .

The interface S of the first sealing material 51 and the second sealing material 53 is formed as an uneven surface as shown in the enlarged portion of FIG. 3. Here, the uneven surface, that is, the non-flat surface, refers to a bumpy surface on which irregularities are formed.

Thus, in order to form the interface S of the 1st sealing material 51 and the 2nd sealing material 53 into a non-planar surface, after coating a liquid 1st silicone resin, it hardens | cures at a preset temperature and the 1st sealing material 51 is After forming, after coating the liquid second silicone resin to cure at a set temperature to form a second sealing material 53 on the first sealing material (51).

As described above, when the interface S between the first sealing material 51 and the second sealing material 53 is formed as a non-flat surface, the light passing through the first sealing material 51 is indicated by the arrow as shown by the arrow. Diffused from Therefore, the amount of light incident on the solar cell increases.

The plurality of solar cells 10 are located on the upper portion of the first sealing material 51, as shown in FIG. That is, the plurality of solar cells 10 are disposed above the interface S of the first sealing material 51 and the second sealing material 53. Thus, the side and top of the solar cell are covered by the second sealing member 53.

The back substrate 40 is composed of a base film 41 and a silicone resin coating film 43 coated on one side of the base film 41.

The base film 41 may be formed of a PET resin used as a conventional back substrate material, or may be formed of a PBT resin that is less expensive than the PET resin.

The silicone resin coating film 43 may be the same silicone resin as the second silicone resin constituting the second sealing member 53, but may be another kind of silicone resin including a different component from the second silicone resin.

For example, the silicone resin for forming the silicone resin coating film 40 has a light transmittance of 50% or less, preferably 20% or less in the short wavelength band, and a light transmittance in the 200 nm to 1200 nm band of 30% or less. The light reflectance of the band is 40% or more, the light reflectance in the 200nm to 1200nm band may be formed of a resin of 50% or more.

In order to reduce the light transmittance of the rear substrate 40, a white pigment may be dispersed in the silicone resin coating layer 43.

As described above, various kinds of additives may be added to the silicone resin forming the silicone resin coating film 43 as necessary.

For example, an ultraviolet stabilizer may be added to the silicone resin coating film 43, and dyes of various colors may be added.

In addition, a filler for strength reinforcement may be added to the silicone resin coating layer 43.

The back substrate 40 composed of the base film 41 and the silicone resin coating film 43 has a tensile strength of about 10 times or more larger than the sealing member 50, such as a tensile strength of 30 MPa or more, and at 300 nm to 500 nm. It may have a light transmittance of 50% or less and a light reflectance of 40% or more.

According to this feature, the entire rear surface of the second sealing material 53 is in direct contact with the silicone resin coating film 43.

However, since the silicone resin coating film 43 is formed of a silicone-based resin like the second sealing material 53, the sealing member 50 and the rear substrate 40 of the sealing member 50 and the rear substrate 40 are compared with the conventional rear substrate coated with Tedlar. Adhesion is very good.

For example, when the sealing member 50 is formed of a silicone-based resin and the rear substrate 40 is formed of a Tedlar-coated PET-based material, the adhesive force of the rear substrate (vertically Peeling strength) is 10 kg / cm ² to 15 kg / cm ^2, but in this embodiment, the adhesive force of the rear substrate is 15 kg / cm ² or more.

In addition, the interface of the 2nd sealing material 53 and the silicone resin coating film 43 can also be formed in a non-flat surface.

In this case, after applying the liquid second silicone resin, it is cured at a set temperature to form a second sealing material 51, and after applying the silicone resin for forming a silicone resin coating film may be cured at a set temperature.

Therefore, since light is diffusely reflected at the interface between the second sealing material 53 and the silicone resin coating film 43, the amount of light incident on the solar cell is further increased, thereby improving the output of the solar cell module.

In addition, since the rear substrate including the silicone resin coating layer 43 has superior thermal conductivity as compared to a conventional rear substrate coated with a Tedlar, the heat generated from the solar cell module may be effectively emitted.

The solar cell module of the present invention can be used a solar cell having a variety of types and structures.

For example, the solar cell 10 may include a substrate, an emitter portion located on one surface of the substrate, for example, a front surface, a first antireflection film positioned on the emitter portion, and an area in which the first antireflection film is not located. A first electrode located above the emitter, a back surface field (BSF) located at the back surface of the substrate, a second antireflection film located at the rear of the rear electric field, and an area where the second antireflection film is not located It may include a second electrode located at the rear of the rear electric field of the.

The substrate is made of a silicon wafer of a first conductivity type, for example an n-type conductivity type. In this case, the silicon may be monocrystalline silicon, a polycrystalline silicon substrate, or amorphous silicon.

When the substrate has an n-type conductivity type, the substrate contains impurities of pentavalent elements such as phosphorus (P), arsenic (As), antimony (Sb), and the like.

Alternatively, however, the substrate may be of p-type conductivity type and may be made of a semiconductor material other than silicon.

When the substrate has a p-type conductivity type, the substrate may contain impurities of trivalent elements such as boron (B), gallium, indium and the like.

Such a substrate is formed of a texturing surface on which at least one of the front and back surfaces is textured.

The emitter portion is an impurity portion having a second conductivity type, for example, a p-type conductivity type, which is opposite to the conductivity type of the substrate, and forms a p-n junction with the substrate.

Due to the built-in potential difference due to this pn junction, electron-hole pairs, which are charges generated by light incident on a substrate, are separated into electrons and holes, electrons move toward n-type, and holes move toward p-type. To the side.

Thus, when the substrate is n-type and the emitter portion is p-type, the separated electrons move toward the substrate and the separated holes move toward the emitter portion. Therefore, electrons are the majority carriers in the substrate, and holes are the majority carriers in the emitter portion.

When the emitter portion has a p-type conductivity type, the emitter portion may be formed by doping a substrate with impurities of trivalent elements such as boron (B), gallium (Ga), and indium (In).

Alternatively, when the substrate has a p-type conductivity type, the emitter portion has an n-type conductivity type. In this case, the separated holes move toward the substrate and the separated electrons move toward the emitter portion.

When the emitter part has an n-type conductivity type, impurities of pentavalent elements such as phosphorus (P), arsenic (As), and antimony (Sb) may be formed by doping the substrate.

The first anti-reflection film may include at least one of a silicon oxide film (SiOx: H), a silicon nitride film (SiNx: H), an aluminum oxide film (AlOx), and a titanium dioxide film (TiO ₂ ), and may also function as a passivation film. can do.

The first electrode is electrically and physically connected to the emitter portion. At this time, the first electrode extends in a direction determined substantially in parallel.

This first electrode collects charges, for example holes, that have migrated towards the emitter portion. The first electrode 140 may be a finger electrode, and may further include a current collector for the finger electrode.

The second electrode located at the rear side of the substrate collects the charges moving to the substrate, for example, electrons, and outputs them to the external device. The second electrode may be a finger electrode and may further include a current collector for the finger electrode.

The backside electric field where the second electrode is electrically and physically connected is located on the backside of the substrate and is formed of a region doped with a higher concentration of impurities of the same conductivity type as the substrate, for example, an n + region.

The backside electric field prevents hole movement toward the backside of the substrate by forming a potential barrier due to the difference in impurity concentration with the substrate. Thus, the recombination and disappearance of electrons and holes near the surface of the substrate is reduced.

Like the first anti-reflection film, the second anti-reflection film positioned on the rear side of the rear electric field part where the second electrode is not disposed may be a silicon oxide film (SiOx: H), a silicon nitride film (SiNx: H), an aluminum oxide film (AlOx), It may include at least one film of the titanium dioxide film (TiO ₂ ), it may also function as a passivation film.

Hereinafter, a method of manufacturing the solar cell module shown in FIG. 1 will be described with reference to FIG. 4.

First, the first silicon is applied to one surface of the front substrate 30 to a thickness of 0.3 mm to 0.5 mm, and left for 30 seconds to 60 seconds to level the first silicon.

In this case, a frame having a predetermined height surrounding the front substrate 30 may be provided to prevent the coated first silicon from flowing into the outer space of the front substrate 30.

Subsequently, the front substrate coated with the liquid first silicone resin is disposed in an oven, and a curing process is performed for 60 seconds to 120 seconds at a temperature of 80 ° C. or higher, for example, 90 ° C. to 150 ° C. By advancing, the 1st sealing material 51 is formed by hardening a 1st silicone resin.

When the curing process is performed, the first sealing material 51 is bonded to the front substrate, and one surface of the first sealing material 51, that is, the surface opposite to the surface bonded to the front substrate is formed as a non-flat surface.

Thereafter, the plurality of solar cells 10 are disposed on the first sealing material 51, the second silicone resin is applied to a thickness of 0.3 mm to 0.5 mm, and then left for 30 seconds to 60 seconds to form the second silicone resin. Leveling.

At this time, the operation | work which apply | coats a liquid 2nd silicone resin can also be performed in the state provided with the frame (frame) similarly to the case of apply | coating 1st silicone resin.

According to the application and leveling operation of the second silicone resin, the liquid second silicone resin is also filled in the space between the adjacent solar cells 10 and the space between the solar cells 10 and the first sealing material 51.

Subsequently, the front substrate coated with the liquid second silicone resin is placed in an oven, and the curing process is performed for 60 seconds to 120 seconds at a temperature of 80 ° C or higher, for example, 90 ° C to 150 ° C. By advancing, the 2nd sealing material 53 is formed by hardening a 2nd silicone resin.

When the curing process is performed, the second sealing material 53 is bonded to the first sealing material 51, and one surface of the second sealing material 53, that is, the surface opposite to the surface bonded to the first sealing material 51, is a non-flat surface. Is formed.

Subsequently, the silicone resin for forming the silicone resin coating film 43 is coated on the second sealing material 53, and left for 30 seconds to 60 seconds to perform a leveling operation.

At this time, the operation of applying the silicone resin for forming the silicone resin coating film 43 can also be performed in a state in which a frame is provided, as in the case of applying the first silicone resin and the second silicone resin.

Thereafter, after the coated base film 41 is positioned, a lamination process is performed. When the lamination process is performed, the rear substrate 40 is adhered to the second sealing member 53.

Hereinafter, a solar cell module according to a modified embodiment of FIG. 1 will be described with reference to FIGS. 5 and 6.

In the following embodiments, the same components as those in the above-described first embodiment will be denoted by the same reference numerals, and detailed description thereof will be omitted.

5 is a conceptual diagram illustrating a schematic configuration of a solar cell module according to a first modified embodiment of FIG. 1, and FIG. 6 is a conceptual diagram illustrating a schematic configuration of a solar cell module according to a second modified embodiment of FIG. 1.

5 and 6, the rest of the configuration is the same as the first embodiment described above except that a part of the solar cell 10 is embedded in the first sealing material 51.

FIG. 5 shows that the interconnector 20 located on the first side of the solar cell 10 is embedded in the first seal 51. FIG. 6 shows the interconnection 20 located on the first side of the solar cell 10. A portion of the interconnector 20 and solar cell 10 is shown embedded in the first seal 51.

5 and 6, when a part of the interconnector 20 or the interconnector 20 and the solar cell 10 is embedded in the first sealing material 51, the position of the solar cell 10 is changed to the first position. Since it is fixed by the sealing material 51, the problem that a misalignment arises in a subsequent modularization process can be suppressed.

Hereinafter, a solar cell module according to another embodiment of the present invention will be described with reference to FIGS. 7 and 8.

7 is a conceptual diagram illustrating a schematic configuration of a solar cell module according to a second embodiment of the present invention, and FIG. 8 is a process diagram illustrating a method of manufacturing the solar cell module shown in FIG. 7.

The rear substrate 40 of this embodiment includes a base film 41 and a silicone resin coating film 43 coated on the entire outer surface of the base film 41, and the rest of the configuration is the same as the first embodiment described above.

The back substrate 40 having such a configuration can be manufactured by a method of forming the silicone resin coating film 43 by curing the silicone resin after the base film 41 is impregnated with the silicone resin.

Therefore, the base film 41 is completely embedded in the silicone resin coating film 43. Here, that the base film 41 is completely embedded means that both the upper surface and the lower surface of the base film 41 and the left and right ends are located inside the silicone resin coating film 43.

As illustrated in FIG. 8, in the solar cell module having the above-described configuration, the rear substrate 40 is manufactured in a state in which the base film 41 is embedded in the silicone resin coating film 43 as a separate component. After arranging on the second sealing material 53, it can be produced by a method of adhering the rear substrate 40 with the second sealing material 53 in accordance with a conventional lamination process.

When the base film 41 is made of a separate part of the back substrate 40 embedded in the silicone resin coating film 43, the width of the base film 41 may be smaller than the width of the back substrate 40. Here, the "width" refers to the length of each component measured in the transverse direction in FIG.

However, unlike the above-described structure, the base film 41 is disposed after the first coating of the silicone resin for forming the silicone resin coating film 43 and the second silicone coating for forming the silicone resin coating film 43 is applied thereon. It is also possible to manufacture a solar cell module.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It belongs to the scope of right.

10: solar cell 20: interconnect
30: front substrate 40: rear substrate
41: base film 43: silicone resin coating film
50: sealing member 51: first sealing material
53: second sealing material

Claims

A plurality of solar cells;
A light transmissive front substrate positioned toward a front surface of the solar cells;
A base film and a silicone resin coating layer coated on at least one side of the base film, wherein the silicone resin coating layer faces a back surface of the solar cells so as to face the plurality of solar cells. A rear substrate located; And
A sealing member comprising a silicone resin and sealing the plurality of solar cells between the light transmissive front substrate and the back substrate.
Including;
The entire rear surface of the sealing member is in direct contact with the silicone resin coating film.

In claim 1,
The rear substrate is a solar cell module having a tensile strength of 30 MPa or more.

In claim 1,
The rear substrate has a light transmittance of 50% or less at 300nm to 500nm.

In claim 1,
The rear substrate has a solar cell module having a light reflectance of at least 40% at 300nm to 500nm.

5. The method according to any one of claims 1 to 4,
The sealing member includes a first sealing member positioned between the front substrate and the solar cell and a second sealing member positioned between the solar cell and the rear substrate.

The method of claim 5,
The first sealing material is formed of a first silicone resin, the second sealing material is a solar cell module formed of a second silicone resin.

The method of claim 6,
The first silicone resin and the second silicone resin is a solar cell module formed of the same silicone resin containing the same component.

The method of claim 6,
The first silicone resin and the second silicone resin is a solar cell module formed of different silicone resins containing different components.

The method of claim 5,
The second silicone resin and the silicone resin coating film is a solar cell module formed of the same silicone resin containing the same component.

The method of claim 5,
The second silicone resin and the silicone resin coating film is a solar cell module formed of different silicone resins containing different components.

The method of claim 5,
The junction surface of the first silicone resin and the second silicone resin is a non-flat surface solar cell module.