KR20120071487A - System of cleaning slit nozzle used for substrate coater apparatus and cleaning method using same - Google Patents

Abstract

PURPOSE: A system for cleaning a slit nozzle in a substrate coating device and a cleaning method using the same are provided to stably secure the quality of a coating operation by fundamentally preventing the influence of impurities around the discharging hole of the slit nozzle. CONSTITUTION: A system(100) for cleaning a slit nozzle in a substrate coating device includes a tray(110), a cleaner(120), and a camera(140). The slit nozzle is moved to a cleaning position, and the tray is located under the slit nozzle. The tray collects impurities form the slit nozzle. The cleaner is located over the tray. The cleaner moves along the longitudinal direction of the discharging hole of the slit nozzle while being in contact with the circumferential surface of the discharging hole. The cleaner eliminates the impurities from the discharging hole. The camera photographs the cleaning state of the cleaner.

Description

Cleaning system of slit nozzle for substrate coater device and cleaning method using the same {SYSTEM OF CLEANING SLIT NOZZLE USED FOR SUBSTRATE COATER APPARATUS AND CLEANING METHOD USING SAME}

The present invention relates to a cleaning system of a slit nozzle for a substrate coater device and a cleaning method using the same, and more particularly, after applying a chemical to the surface of the substrate by a predetermined amount using the slit nozzle, The present invention relates to a cleaning system for a slit nozzle for a substrate coater device that can wipe out foreign substances such as chemical liquids more reliably and a cleaning method using the same.

In the process of manufacturing flat panel displays, such as LCD, the coating process of apply | coating chemical liquids, such as a resist liquid, to the surface of the to-be-processed substrate made from glass etc. is accompanied. Conventionally, when the size of the LCD was small, a spin coating method was used in which the chemical was applied to the surface of the substrate by rotating the substrate while applying the chemical to the center of the substrate.

However, as the size of the LCD screen becomes larger, the spin coating method is scarcely used, and a slit-shaped slit nozzle having a length corresponding to the width of the substrate to be processed and a slit nozzle A coating method of coating the surface of the substrate is used.

1 and 2 show the configuration and operation of a general substrate coater device 1. As shown in FIG. 1, the surface of the substrate G is moved while the slit nozzle 20 moves in the direction indicated by the arrow in FIG. 1, with the substrate G being fixed to the substrate chuck 10. The chemical liquid 55 is apply | coated to it. The chemical liquid discharged to the slit nozzle 20 is collected on the pump 30 through the supply pipe 31 from the outside, and is applied to the substrate G while the slit nozzle 20 moves in the direction indicated by reference numeral 20d.

The coating method using the slit nozzle 20 can apply the chemical liquid over the entire width of the substrate to be processed at once, and has the advantage of applying the chemical liquid with a uniform thickness as a whole. However, in order to coat the surface of the substrate G with a uniform thickness by using the slit nozzle 20, the gap between the slit nozzle 20 and the substrate G should be constant along the slit. In addition, the chemical liquid must be uniformly sprayed from the discharge port 21 of the slit nozzle 20.

On the other hand, after applying the chemical liquid 55 to the predetermined amount of the substrate G using the slit nozzle 20, the chemical liquid around the discharge port 21 of the slit nozzle 20 is wiped clean, The chemical liquid 55 applied to the substrate G by the chemical liquid buried around the discharge port 21 of the slit nozzle 20 is applied to a uniform thickness without being affected. To this end, the cleaner 40 provided at the cleaning position of the outer region of the substrate chuck 10 is positioned to abut the discharge port 21 of the slit nozzle 20, and then the cleaner as shown in Figs. 3A and 3B. The 40 is reciprocated in the slit direction 40d of the slit coater 20 to wipe the surface 21s around the discharge port 21 of the slit nozzle 20 by the cleaner 40.

However, since foreign substances such as chemical liquids on the surface 21s around the discharge port 21 of the slit nozzle 20 are fixed to the surface 21s around the discharge port depending on the time of staining, the cleaners 40 are packaged collectively. ) Even if the reciprocating movement once there was a problem that does not wipe clean. Accordingly, the process of applying the chemical liquid 55 to the surface of the substrate G by the foreign matter such as the chemical liquid buried around the discharge port 21 of the slit nozzle 20 is affected, and thus the substrate G is treated. There was also a problem that the quality of applying the chemical solution is low or cause a defect.

In addition, in order to solve the above problems, the surface around the discharge port 21 of the slit nozzle 20 is cleaned more than necessary, and the chemical liquid application process on the substrate G to be continuously performed is delayed, thereby increasing the efficiency of the process. This deterioration problem was also caused.

In order to solve the above problems, after applying the chemical to the surface of the substrate by a predetermined amount by using the slit nozzle, it is possible to clean and reliably wipe off foreign substances such as chemicals around the discharge port of the slit nozzle. An object of the present invention is to provide a cleaning system for a slit nozzle for a substrate coater device and a cleaning method using the same.

In addition, the present invention cleanly wipes off foreign matters such as chemical liquid around the discharge port of the slit nozzle, thereby preventing the adverse effect of the foreign matter around the discharge port of the slit nozzle during the chemical liquid application process of the substrate to be treated and excellent coating. It is another purpose to secure the quality stably.

Further, another object of the present invention is to clean the foreign matter around the discharge port of the slit nozzle reliably and cleanly, cleaning the conventional removal of the foreign matter around the discharge port more than necessary as the chemical liquid around the discharge port is not completely wiped It is to solve the problem that the process efficiency is reduced by performing a lot of processes.

In order to achieve the object described above, the present invention provides a substrate coating apparatus having a slit nozzle for applying a coating liquid to a surface of a substrate, wherein the slit nozzle is positioned below the slit nozzle in a state where the slit nozzle is moved to a cleaning position. A tray for collecting foreign matters; A cleaner disposed above the tray and moving along the longitudinal direction of the discharge hole in contact with the peripheral surface of the discharge hole of the slit nozzle located at the cleaning position to wipe off the foreign matter on the peripheral surface of the discharge hole; A camera for photographing a cleaning state of the cleaner; It provides a cleaning system of a slit nozzle for a substrate coating device, characterized in that it comprises a.

In order to clean the surface around the discharge port of the slit nozzle while reciprocating in contact with the cleaner, the cleaning state around the discharge port wiped by the cleaner can be photographed by a camera so that the operator can visually check the slit. This is to completely remove the foreign matter stuck to the discharge port of the nozzle.

In addition, as the tray is installed at the lower side of the cleaning position in which the cleaner is in contact with the discharge port, the foreign matter such as chemical liquids and dust removed by the cleaning of the cleaner is collected by the tray, so that the discharge port of the slit nozzle is discharged. A clean environment can be maintained without contaminating the surroundings during the cleaning process.

The camera may further include a camera moving rail arranged parallel to the moving path of the cleaner, and the camera may move along the guide rail to photograph the cleaning state around the discharge port, whereby the camera moves along with the cleaner and may be moved by the cleaner. The cleaning state around the discharge port of the slit nozzle can be confirmed in real time. In addition, the display unit for displaying in real time the image taken by the camera is further provided.

At this time, the camera is moved together with the cleaner, it is preferable to follow the cleaner. This prevents the camera from being contaminated by foreign matter that is wiped off and removed from the surface around the discharge port of the slit nozzle by the movement of the cleaner.

On the other hand, in order to photograph the cleaning state around the discharge port of the slit nozzle, the camera should be installed to face upward, upward or leftward from the bottom of the cleaner. In this case, the foreign matter wiped by the cleaner may contaminate the camera lens while floating in the air. In order to prevent this, a reflection mirror for changing the path of the camera photographing the cleaning state of the cleaner may be installed, and the camera may be configured to photograph the periphery of the discharge port projected on the reflection mirror. In this case, since the camera photographs around the discharge port projected through the reflection mirror, the camera is located above the cleaner, so that foreign matters separated from the discharge port periphery by the cleaner can be minimized toward the camera.

On the other hand, according to another field of the invention, the present invention provides a cleaning method of a slit nozzle used in a substrate coating apparatus for applying a coating liquid on the surface of the substrate, the step of moving the slit nozzle above the tray; Contacting both sides of the discharge port of the slit nozzle with the cleaning surface of the cleaner; A cleaning step of removing the foreign matter while moving the cleaner along the longitudinal direction of the discharge port of the slit nozzle; A photographing step of photographing a periphery of the discharge port cleaned by the cleaner with a camera; It provides a cleaning method of the discharge portion of the slit nozzle for substrate coating apparatus comprising a.

Then, the photographing step is performed at the same time as the cleaning step to check the cleaning state in real time, so that additional cleaning can be performed when the cleaning state around the discharge port is insufficient.

To this end, the photographing step is preferably taken while moving the camera with the movement of the cleaner. In addition, the camera is better than the cleaner to prevent contamination by the foreign matter to be removed.

Although the cleaning state around the discharge port by the cleaner may be photographed directly by the camera, the camera may be performed by photographing the area around the discharge port of the slit nozzle reflected by the reflection mirror.

As described above, in the present invention, the surface around the discharge port of the slit nozzle is cleaned while reciprocating while being in contact with the cleaner, and the discharge port of the slit nozzle is photographed while photographing the cleaning state around the discharge port wiped by the cleaner with a camera. The present invention provides a cleaning system of a slit nozzle for a substrate coater device and a method of cleaning using the same, by wiping the surroundings, so that foreign substances such as chemical liquids around the discharge port of the slit nozzle can be wiped out more cleanly and reliably.

That is, the present invention can completely remove the foreign matter even if it is locally fixed around the discharge port of the slit nozzle. By doing so, the present invention reliably wipes out foreign substances such as chemical liquids around the discharge openings of the slit nozzle, thereby preventing the negative influences by the foreign substances around the discharge openings of the slit nozzle during the chemical liquid applying process of the substrate to be treated. The coating quality can be secured stably.

In addition, according to the present invention, since the foreign matters around the discharge port of the slit nozzle can be wiped reliably and cleanly, the cleaning process of removing the foreign matter around the discharge port is excessively necessary as the chemical liquid around the discharge port is not completely wiped. Many problems can be solved by reducing the efficiency of the process.

In addition, according to the present invention, as the tray is installed at the lower side of the cleaning position in which the cleaner is in contact with the discharge port, the slit nozzle is collected by collecting the foreign substances such as chemical liquids and dust removed by the cleaning of the cleaner. It is possible to maintain a clean environment without contaminating the surroundings during the cleaning process of the discharge port.

In addition, the present invention is configured to be positioned to the upper side than the cleaner by using a reflection mirror to the camera photographing the state of cleaning around the discharge port located in the lower side of the slit nozzle by the cleaner, so that the cleaning state in real time to shoot and monitor At the same time, it is possible to obtain an advantageous effect of preventing contamination of the camera.

1 is a perspective view showing the configuration of a general substrate coating apparatus
Figure 2 is a schematic diagram showing the principle of operation of Figure 1
3A and 3B are views showing a configuration of cleaning around the discharge port of the slit nozzle with the cleaning mechanism of the slit nozzle of FIG.
4 is a diagram illustrating a configuration of a cleaning system of a slit nozzle for a substrate coater device according to an embodiment of the present invention.
5 is an enlarged view of portion 'A' of FIG.
6 is a view illustrating a principle of movement of the cleaner of FIG.
7 is a view illustrating a principle of movement of the camera of FIG.
8 is a block diagram showing a control unit of the cleaning system of FIG.
9 is a flowchart sequentially illustrating a cleaning method of a slit nozzle for a substrate coater device according to an embodiment of the present invention.
10A to 10C are diagrams showing the configuration according to the cleaning method of FIG.
11 illustrates a cleaning system of a slit nozzle for a substrate coater device according to another embodiment of the present invention.

Hereinafter, a cleaning system 100 of a slit nozzle for a substrate coater device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the following description, well-known functions or constructions are not described in detail to avoid obscuring the subject matter of the present invention.

4 is a view illustrating a configuration of a cleaning system of a slit nozzle for a substrate coater device according to an embodiment of the present invention, FIG. 5 is an enlarged view of a portion 'A' of FIG. 4, and FIG. 8 is a view of the cleaning system of FIG. 9 is a block diagram showing a control unit, FIG. 9 is a flowchart sequentially showing a cleaning method of a slit nozzle for a substrate coater device according to an embodiment of the present invention, and FIGS. One drawing.

As shown in the figure, the cleaning system 100 of the slit nozzle for a substrate coater device according to an embodiment of the present invention, the slit in the state that the slit nozzle 20 of the substrate coater device 1 is moved to the cleaning position A tray 110 located below the nozzle 20 to collect foreign substances and a peripheral surface 21s of the discharge port 21 of the slit nozzle 20 located above the tray 110 and located in the cleaning position. In the state in which the cleaner 120 is moved along the slit direction 120d of the discharge port 21 in contact with the cleaner to wipe off and remove foreign substances on the peripheral surface 21s of the discharge port 21, and the cleaner 120 is fixed. The cleaner moving unit 130 moving along the cleaner moving rail 130R fixedly installed in the tray 110 across the slit direction, and across the tray 110 in the slit direction below one side of the cleaner moving rail 130R. The toe moves along the installed camera rail 140R. And a camera 140 for photographing the peripheral surface of the opening 21, is configured of an image recorded with the camera 140 as the display unit 150 for display on the screen.

The tray 110 is installed at a cleaning position to wipe off the foreign matter on the surface around the discharge port 21 of the slit nozzle 20 to which the chemical liquid 55 is applied to the substrate G to be processed. The said cleaning position is located in the outer area | region of the board | substrate chuck 10 in which the chemical | medical solution application process of the to-be-processed substrate G is performed.

The cleaner 120 has a cleaning surface 120s formed in the shape of the surface 21s around the discharge port 21 to wipe the surface around the discharge port 21 having a 'V' shape. The cleaning surface 120s of the cleaner 120 is periodically cleaned or replaced.

The moving unit 130 is driven to move along the cleaner moving rail 130R while the cleaner 120 is fixed, thereby reciprocating the cleaner 120 in the slit direction 120d of the slit nozzle 20. To this end, as shown in Figure 6, the cleaner moving rail 130R is formed in a hollow tube shape so that the belt 135 for driving the movement of the moving unit 130 passes. At both ends of the belt 135, a driving pulley 130p 'which is rotationally driven by a driving motor (not shown) and an idler pulley 130p for guiding a traveling path of the belt 135 are installed. As a result, the belt 135 moves by the forward and reverse rotation of the drive motor, and the moving unit 130 is reciprocated in the slit direction 120d along the cleaner moving rail 130R.

The camera 140 is installed in the moving body 141 and reciprocated in the slit direction 130d by the moving body 141 moving along the camera moving rail 140R installed in parallel with the cleaner moving rail 130R. do. To this end, as shown in Figure 7, the camera moving rail 140R is formed in a hollow tube shape so that the belt 145 for driving the movement of the moving body 141 passes. At both ends of the belt 145, a driving pulley 140p 'which is rotationally driven by a driving motor (not shown) and an idler pulley 140p for guiding a traveling path of the belt 145 are installed. Accordingly, the belt 145 is moved by forward and reverse rotation of the drive motor, and the moving body 141 is reciprocated in the slit direction 120d along the camera moving rail 140R.

In order to photograph the cleaning state around the discharge port 21 of the slit nozzle 20 wiped by the cleaner 120, the camera 140 is positioned below the cleaner 120 and installed upward or horizontally. While the cleaner 120 moves the slit nozzle 20 in the slit direction 120d in the form of wrapping the discharge port 21, the cleaner 120 cleans foreign substances such as chemical liquid and dust on the peripheral surface 21s of the cleaner 120. In order to prevent the camera 140 from being contaminated by the foreign matter 44 that is wiped off by the surface of the slit nozzle 20 and separated from the surface 21s of the slit nozzle 20, as shown in FIG. It follows the distance S1 where the foreign matter 44 falling from the position of 120 will not be buried.

The display unit 150 reproduces the image photographed by the camera 140 on the screen in real time by the image display control unit 159. Through this, the operator can remotely check whether the peripheral surface of the discharge port 21 of the slit nozzle 20 being cleaned is completely clean, and if the foreign matter is stuck locally and the foreign matter is not completely removed in one round trip, The cleaner 120 moves back and forth several times to the area where the foreign matter is fixed so that the periphery of the discharge port 21 is cleanly cleaned without chemical or dust.

As a result, the foreign matter 44 such as the chemical liquid around the discharge port 21 of the slit nozzle 20 can be wiped out more cleanly and reliably, and the slit nozzle 20 during the chemical liquid applying process of the substrate G to be processed. It is possible to prevent a bad influence by the foreign matters around the discharge port 21 of the () to implement a good coating state without causing a poor coating by the foreign matters.

Hereinafter, the cleaning method S100 using the cleaning system 100 of the slit nozzle for the substrate coating apparatus configured as described above will be described in detail with reference to FIGS. 9 to 10C.

Step 1 : First, the slit nozzle 20 having the chemical liquid 55 applied to the surface of the predetermined number of substrates G to be processed has a tray (outside the area of the substrate chuck 10) as shown in FIG. Move to the cleaning position on the 110 (S110).

Step 2 : Then, as shown in FIG. 10B, the slit nozzle 20 is moved downward by the gantry, so that the peripheral surface 21s including both sides of the discharge port 21 of the slit nozzle 20 is formed. In contact with the cleaning surface (120s) of the cleaner (120) (S120).

Step 3 : Then, a current is applied from the cleaner movement control unit 139 to the rotor of the moving unit 130 so that the cleaning surface 120s of the cleaner 120 contacts the discharge port peripheral surface 21s of the slit nozzle 20. While maintaining the state, the cleaner 120 is first moved in the slit direction 120d. As a result, the cleaning surface 120s of the cleaner 120 comes into contact with the surface of the slit nozzle 20 to push the foreign matter out, and the foreign matter 44 such as chemical liquid or dust buried from the peripheral surface 21s of the discharge port 21. To separate and drop to the tray (110).

At this time, while the cleaning liquid is supplied to the cleaning surface 120s of the cleaner 120 in order to effectively remove the foreign matter 44 from the surface 21s around the discharge port of the slit nozzle 20, the cleaning process by the cleaner 120 is performed. It may be done.

Step 4 : At the same time, a current is applied from the camera movement control unit 149 to the rotor of the moving body 141, while maintaining the rear side of the traveling direction by a predetermined distance S1 from the cleaner 120 while maintaining the slit direction ( Move the camera 140 to 140d). That is, the control signal of the cleaner movement control unit 139 is transmitted to the camera movement control unit 149, so that the movement of the movement unit 130 and the movement body 141 are interlocked with each other. As described above, the camera 140 trails the cleaner 120 by a predetermined distance S1 so that the foreign matter 44 separated from the discharge port peripheral surface 21s by the cleaner 120 reaches the camera 140. can do.

While the camera 140 moves by the camera movement control unit 149 along the camera transfer rail 140R, the direction 77 toward the discharge port peripheral surface 21s of the slit nozzle 20 is maintained as it is, and the cleaner 120 Photographing whether or not the discharge port peripheral surface 21s is cleanly cleaned (S140).

Step 5 : The image photographed by the camera 140 is stored in the captured image storage unit 149 'in real time, and is simultaneously displayed on the display unit 150 by the image display control unit 159. The cleaning state of the peripheral surface 21s of the discharge port displayed on the display unit 150 is visually checked (S150).

When the surface 21s around the discharge port meets a predetermined criterion by the cleaner 120 through steps 1 to 5, the cleaning around the discharge port of the slit nozzle 20 is completed. However, when foreign matter is locally fixed and remains on the surface 21s of the slit nozzle 20, the cleaner 120 intensively reciprocates the area by moving the cleaner 120 to a position where the foreign matter still adheres. Thus, it is possible to clean the discharge port peripheral surface 21s more than the reference value at all times.

As described above, since the cleaning of the peripheral surface 21s of the discharge port of the slit nozzle 20 can be reliably cleaned, conventionally, the chemical liquid around the discharge port is not completely wiped, thereby removing foreign matters around the discharge port more than necessary. To solve the problem that the process efficiency is reduced by excessively performing the process, the cleaning cycle of the surface around the discharge port of the slit nozzle 20 can be properly maintained to improve the process efficiency.

Hereinafter, the cleaning system 200 of the slit nozzle for the substrate coater device according to another embodiment of the present invention will be described in detail. However, in describing another embodiment of the present invention, a detailed description of functions or configurations overlapping with the above-described embodiment will be omitted to clarify the gist of the present embodiment.

11 is a view showing a cleaning system of a slit nozzle for a substrate coater device according to another embodiment of the present invention. As shown in the figure, the cleaning system 200 of the slit nozzle for the substrate coater apparatus according to another embodiment of the present invention, the slit in the state in which the slit nozzle 20 of the substrate coater apparatus 1 is moved to the cleaning position A tray 210 for collecting foreign matter located under the nozzle 20 and a peripheral surface 21s of the discharge port 21 of the slit nozzle 20 located above the tray 210 and positioned in the cleaning position. Cleaner 220 which moves along the slit direction of the discharge port 21 in contact with the cleaner to wipe off and removes foreign substances on the peripheral surface 21s of the discharge port 21, and in the slit direction with the cleaner 220 fixed. A cleaner moving unit (not shown) moving along a cleaner moving rail (not shown) fixed to the tray 210 and across the tray 210 in a slit direction on one side higher than the moving path of the cleaner 220. Along the installed camera rail (not shown) While the camera 240 to photograph the peripheral surface of the discharge port 21, the reflection mirror 250 is installed so as to change the path of the camera 240 to photograph the cleaning state of the cleaner 220, and the camera 140 The display unit (not shown) displays the captured images on the screen.

That is, in another embodiment of the present invention, instead of being installed and photographed in the direction in which the camera 140 directly faces the cleaning state around the discharge port of the slit nozzle 20, the photographing path of the camera 240 is reflected mirror 250. There is a difference from the above-described embodiment 100 in that it is converted to the ().

To this end, the reflective mirror 250 is installed so as to project the periphery of the discharge port 21 in the camera 240 as shown in Figure 9, even if the camera 240 is installed to face downward in a high position discharge port 21 You can take a picture of the surroundings. Therefore, it is possible to fundamentally prevent the foreign matter 44 falling from the surface of the slit nozzle 20 by the cleaner 220 reaching the camera 240 and contaminating the camera 240.

Therefore, the camera 240 does not need to be moved backward compared to the cleaner 220, and the camera 240 may photograph the cleaning state while moving to a position where it is best to check the surface cleaned by the cleaner.

In this case, the reflective mirror 250 may be fixed to the tray 210, and the reflective mirror 250 may be photographed while moving with the camera 240.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention.

100, 200: Slit nozzle cleaning system 110, 210: Tray
120, 220: cleaner 130: moving unit
140, 240: camera 150: display unit
250: reflection mirror

Claims (14)

In the substrate coating apparatus provided with the slit nozzle which apply | coats a coating liquid to the surface of a board | substrate,
A tray located below the slit nozzle to collect foreign matters while the slit nozzle is moved to a cleaning position;
A cleaner disposed above the tray and moving along the longitudinal direction of the discharge hole in contact with the peripheral surface of the discharge hole of the slit nozzle located at the cleaning position to wipe off the foreign matter on the peripheral surface of the discharge hole;
A camera for photographing a cleaning state of the cleaner;
Cleaning system of the slit nozzle for substrate coating apparatus comprising a.
The method of claim 1,
A camera moving rail arranged parallel to the moving path of the cleaner;
In addition, the camera cleaning system of the slit nozzle for the substrate coating apparatus, characterized in that for photographing the cleaning state around the discharge port while moving along the guide rail.
The method of claim 2,
And a display unit for displaying in real time an image captured by the camera.
The method of claim 2,
The camera moves together with the cleaner, so that the cleaning state around the discharge port of the slit nozzle by the cleaner can be confirmed in real time.
The method of claim 4, wherein
And the camera moves together with the cleaner, but following the cleaner.
The method of claim 4, wherein
A reflection mirror for changing a path through which the camera photographs the cleaning state of the cleaner;
In addition, the camera is cleaning system of the slit nozzle for substrate coating apparatus, characterized in that for taking a picture of the periphery of the discharge port projected on the reflection mirror.
The method according to claim 6,
And said camera is located above said cleaner.
The method according to any one of claims 2 to 7,
The camera is fixed to a moving body, the moving body is installed to be movable along the camera moving rail, by moving any one of the pulleys located on both sides of the belt fixed to the moving body, thereby moving the camera And a slit nozzle for substrate coating apparatus, configured to move along the camera moving rail.
The method of claim 8,
The camera moving rail has a hollow portion, and the belt is a cleaning system of the slit nozzle for substrate coating apparatus, characterized in that at least a portion is located in the hollow portion.
As a cleaning method of the slit nozzle used for the board | substrate coating apparatus which apply | coats a coating liquid to the surface of a board | substrate,
Moving the slit nozzle above the tray;
Contacting both sides of the discharge port of the slit nozzle with the cleaning surface of the cleaner;
A cleaning step of removing the foreign matter while moving the cleaner along the longitudinal direction of the discharge port of the slit nozzle;
A photographing step of photographing a periphery of the discharge port cleaned by the cleaner with a camera;
The cleaning method of the discharge portion of the slit nozzle for substrate coating apparatus comprising a.
The method of claim 10,
And the photographing step is performed simultaneously with the cleaning step.
12. The method of claim 11,
The photographing step is a cleaning method of the discharge portion of the slit nozzle for substrate coating apparatus, characterized in that for taking a picture while moving the camera with the cleaner.
13. The method of claim 12,
And said camera is lagging behind said cleaner.
13. The method of claim 12,
And the camera photographs a periphery of a discharge port of the slit nozzle reflected by a reflection mirror.

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