KR20110053572A - Light emitting diode assembly and liquid crystal display using the same - Google Patents

Abstract

PURPOSE: A light emitting diode assembly and a liquid crystal display are provided to improve the light efficiency by projecting light from an LED to a light incident part of a light guide plate without light loss. CONSTITUTION: A light emitting diode assembly of a liquid crystal display comprises a first circuit board(122u) including a first group LED packages(123u), a first LED array including a first metal core(121u), a second circuit board(122d) in which a second group LED packages are installed, and a second LED array including a second metal core with a second extension part.

Description

LIGHT EMITTING DIODE ASSEMBLY AND LIQUID CRYSTAL DISPLAY USING THE SAME}

The present invention relates to a light emitting diode assembly which can be used as a light source of a backlight unit, and a liquid crystal display for displaying an image using the same.

BACKGROUND ART Liquid crystal display devices have tended to be gradually widened due to their light weight, thinness, and low power consumption. The liquid crystal display device is used as a portable computer such as a notebook PC, office automation equipment, audio / video equipment, indoor and outdoor advertising display devices, and the like. The transmissive liquid crystal display device, which occupies most of the liquid crystal display device, displays an image by controlling an electric field applied to the liquid crystal layer to modulate the light incident from the backlight unit.

The backlight unit is roughly divided into a direct type and an edge type. The direct type backlight unit has a structure in which a plurality of light sources are arranged in a row on the lower surface of the diffuser plate to directly propagate light to the front surface of the liquid crystal display. In contrast, the edge type backlight unit has a structure in which a light source is disposed to face the side of the light guide plate, and a plurality of optical sheets are disposed between the liquid crystal display panel and the light guide plate. In the edge type backlight unit, a light source irradiates light to one side of the light guide plate, and the light guide plate converts linear light or point light emitted from the light source into planar light, thereby advancing the light toward the front of the liquid crystal display.

Such an edge type backlight is installed at the bottom of the liquid crystal display panel to guide the bottom cover, a light source for supplying light from one side of the bottom cover, a light source housing for receiving and protecting the light source, and guide light from the light source to the liquid crystal display panel. A light guide plate, a reflection sheet for reflecting light reflected from the lower part of the light guide plate to the front surface of the light guide plate, an optical sheet stacked on the light guide plate to supply uniform light to the liquid crystal display panel, and a guide panel for supporting the liquid crystal display panel. do.

Conventionally, a cold cathode tube (CCFL) has been used as a light source of the backlight unit. However, in recent years, since it can be driven at a low voltage, the LED has low power consumption, excellent color reproducibility, contrast ratio, and long life. "Is in the spotlight."

However, in the edge type backlight, since the luminance specification is determined by the efficiency of light incident on the light incident part of the light guide plate, the incident efficiency of light incident on the light incident part of the light guide plate is very important. In particular, in the edge type backlight unit, the LED and the light guide plate must be precisely aligned so that the light emitted from the LED is incident without incident on the light guide plate while maintaining a constant distance between the LED and the light guide plate due to heat emitted from the LED. In the assembling process of the LED, the alignment between the LED and the light guide plate is misaligned, so that the light emitted from the LED does not enter the light guide plate.

An object of the present invention is to solve the problems of the prior art as a light emitting from the LED can be incident to the light incident portion of the light guide plate without loss to increase the utilization efficiency of the LED assembly and the backlight unit and the liquid crystal using the same It is to provide a display device.

In order to achieve the above object, an LED assembly according to an embodiment of the present invention is a first group of LED packages, a first circuit board on which the first group of LED packages are mounted, and the first circuit board is mounted A first LED array comprising a first metal core having a first extension extending outside the first circuit board; And a second metal having a second group of LED packages, a second circuit board on which the second group of LED packages are mounted, and a second extension to which the second circuit board is mounted and which extends outside the second circuit board. A second LED array including a core is provided.

In the LED assembly, the first and second extension portions of the first and the metal cores extending outward of the first and second circuit boards are respectively formed and are thinner than the thickness of the first and second circuit boards. It is preferable to comprise so that the 1st and 2nd elastic member which has the same thickness further may be included.

Further, in the LED assembly, first and second elastic members are formed on portions of the first and second extensions of the first and second metal cores, and adjacent to the first and second elastic members. Preferably, the first and second metal cores further include first and second heat insulating members formed on the remaining portions of the first and second extension portions.

According to an embodiment of the present invention, a liquid crystal display device includes: a backlight unit including the LED array; And a light guide plate converting light emitted from the light emitting diode assembly into planar light and emitting the light. And a liquid crystal display panel which displays an image by controlling the transmittance of light from the backlight unit using liquid crystal molecules controlled by an electrical signal, wherein one end of the light guide plate is provided with the first and second portions of the light emitting diode assembly. It is characterized in that configured to be accommodated in the extension.

Further, in the liquid crystal display device, between the first and second circuit boards and the light guide plate at an inner position of the first and second extension parts of the first and second metal cores extending outside the first and second circuit boards. It is preferable to further include a first and a second elastic member positioned and having a thickness thinner or the same as the thickness of the first and second circuit board.

Further, in the liquid crystal display device, the first and second metal cores of the first and second metal cores adjacent to the first and second elastic members may be positioned at positions of the remaining portions of the first and second extension parts. Preferably, the first and second heat insulating members may further include first and second heat insulating members between the first and second extensions and the upper and lower edges of one end of the light guide plate such that heat generated from the light emitting diode assembly is not transferred to the light guide plate. .

According to the exemplary embodiment of the present invention, since the end of the light guide plate is configured to be received between the first and second metal cores of the LED assembly, since light emitted from the LED package does not leak to the outside and is incident on the light guide plate, light leakage phenomenon is Is prevented and the light efficiency is significantly improved.

In addition, since an elastic member is formed between the light guide plate and the first and second circuit boards, an impact applied to the circuit board on which the light guide plate and the LED package are mounted can be alleviated when an external shock or vibration is generated by driving of the liquid crystal display. This prevents damage to the device and increases durability.

In addition, since a heat insulation member is formed between the top surface of the light guide plate and the bottom surface of the first metal core and between the bottom surface of the light guide plate and the top surface of the second metal core, heat generated from the LED package is transferred to the light guide plate through the first and metal cores. Can prevent the light guide plate from being deformed due to heat.

Hereinafter, a backlight unit and a liquid crystal display using the same according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. Like reference numerals denote like elements throughout the specification.

<First Embodiment>

1 to 4 are diagrams showing the LED assembly 100 according to the first embodiment of the present invention. 1 is a front view showing a state before the first and second LED arrays are coupled, FIG. 2 is a front view showing a state where the first and second LED arrays are defective, and FIG. 3 is a first and second LED of FIG. 4 is a perspective view of a LED assembly showing the defective state of the array, and FIG. 4 is a side view of the LED array shown in FIG.

1 to 4, the LED assembly 100 of the present invention includes a first LED array and a second LED array.

The first LED array includes a first circuit board 122u on which the first group of LED packages 123u are mounted, and a first metal core 121u on which the first circuit board 122u is mounted.

Each of the first group of LED packages 123u is a side view type LED package in which light is emitted from the side. Each of these side view type LED packages 123u has a larger side height h that emits light than the thickness width w, as shown in FIG. 4, to make the light emitting surface larger and advantageous for slimming. Meanwhile, conventional side view type LED packages have a structure in which the side height h is smaller than the thickness width w. Each of the first LED packages 123u has a structure in which the side height h is larger than the thickness width w, as shown in FIG. 4, but may be implemented as an existing side view type LED package. The first group of LED packages 123u are mounted on the first circuit board 122u. Wires are formed on the first circuit board 122u to connect cathode terminal leads and anode terminal leads of each of the first group of LED packages 123u to an external power source. The first circuit board 122u may be selected from a flexible printed circuit board (FPCB), a flexible wire (FW), a flexible circuitry (FC), and the like. The spacing between the first group of LED packages 123u is wide enough that one or more LED packages can be placed so that the heat source is sufficiently dispersed. The first metal core 121u has a cross section having an “L” shape so that one side portion is recessed. The first circuit board 122u on which the LED package 123u of the first group is mounted is mounted on the horizontal surface of the concave portion of the first metal core 121u through an adhesive, an adhesive heat dissipation pad, a screw, and the like. As shown in FIG. 4, the first circuit board 122u is not formed at the end of the horizontal surface of the first metal core 121u. In other words, one end of the first metal core 121u (the end facing the light guide plate) extends longer than the first circuit board 122u. The first metal core 121u is made of a high thermal conductive metal such as aluminum (Al) copper (Cu) to emit heat generated from the LED packages 123u to the outside. The sidewall of the first metal core 121u is sufficiently thicker than the horizontal surface of the concave portion in order to enhance the heat dissipation effect of the LED packages 123u. The outer surface of the first metal core 121u may be embossed like a heat sink structure to further enhance the heat dissipation effect. Heat radiated from the first metal core 121u is emitted to the outside through the metal cover member of the liquid crystal display such as the bottom cover.

The second LED array includes a second circuit board 122d on which the second group of LED packages 123d are mounted, and a second metal core 121d on which the second circuit board 122d is mounted.

Each of the second group of LED packages 123d is a side view type LED package in which light is emitted from the side. Each of these side view type LED packages 123d has a greater lateral height h that emits light than a thickness width w, similar to those of the first group described above. Each of the second LED packages 123d has a structure in which the side height h is greater than the thickness width w as shown in FIG. 4, but may be implemented as an existing side view type LED package. The second group of LED packages 123d are mounted on the second circuit board 122d. Wirings for connecting the cathode terminal leads and the anode terminal leads of each of the LED packages 123d of the second group to the external power source are formed on the second circuit board 122d. The second circuit board 122d may be selected from FPCB, FW, and FC. The spacing between the second group of LED packages 123d is wide enough that one or more LED packages can be placed so that the heat source can be sufficiently dispersed. The second metal core 121d has a cross section of an “L” shape such that one side portion is recessed. A second circuit board 122d is mounted on the horizontal surface of the recessed portion of the second metal core 121d by mounting the second group of LED packages 123d through an adhesive, an adhesive heat dissipation pad, a screw, and the like. As shown in FIG. 4, the second circuit board 122d is not formed at the end of the horizontal surface of the second metal core 121d. That is, one end of the second metal core 121d (the end facing the light guide plate) extends longer than the second circuit board 122d. The second metal core 121d is made of a high thermal conductive metal such as aluminum (Al) and copper (Cu) to emit heat generated from the second group of LED packages 123d to the outside. The sidewall of the second metal core 121d is sufficiently thicker than the horizontal surface of the concave portion in order to enhance the heat dissipation effect of the LED groups 123d of the second group. The outer surface of the second metal core 121d may be embossed like a heat sink structure to further increase the heat dissipation effect. Heat radiated from the second metal core 121d is emitted to the outside through the metal cover member of the liquid crystal display such as the bottom cover.

The first and second LED arrays are assembled such that the first group of LED packages 123u and the second group of LED packages 123d are alternated and arranged in line as shown in FIGS. 2 and 4. do. Each of the LED packages 123u and 123d is a combination of R LED chip + G LED chip + B LED chip, or a combination of R LED + 2 G LED + B LED chip to emit white light or different It can be selected as a white LED package that emits white light, including two LED chips that generate colored light and a silicon layer containing phosphors. Further, the LED packages 123u and 123d are combined into the R LED package 123u of the first group, the G LED package 123d of the second group, and the B LED package 123u of the first group to emit white light. You may.

&Lt; Embodiment 2 >

5 to 7 show the LED assembly 200 according to the second embodiment of the present invention. FIG. 5 is a front view showing a state before the first and second LED arrays are coupled; FIG. 6 is a front view showing a state where the first and second LED arrays are defective; FIG. 7 is a first and second LED arrays Is a perspective view of an LED assembly showing a defective state.

5 to 7, the LED array 200 of the present invention includes a first LED array 200u, a second LED array 200d, and a third LED array 200m.

The first LED array 200u includes a first circuit board 222u on which the first group of LED packages 223u are mounted, and a first metal core 221u on which the first circuit board 222u is mounted.

Each of the first group of LED packages 223u is a side view type LED package in which light is emitted from the side. The first group of LED packages 223u are mounted on the first circuit board 222u. Wires are formed on the first circuit board 222u to connect cathode terminal leads and anode terminal leads of each of the first group of LED packages 223u to an external power source. The first circuit board 222u may be selected from FPCB, FW, and FC. The spacing between the first group of LED packages 223u is wide enough that two or more LED packages can be placed so that the heat source is sufficiently dispersed. The first metal core 221u is designed in a flat structure on which the first circuit board 222u is mounted. The first metal core 221u is mounted with a first circuit board 222u on which the first group of LED packages 223u is mounted through an adhesive, an adhesive heat dissipation pad, a screw, or the like, as shown in FIG. 7. The first circuit board 222u is mounted so that the first circuit board 222u is not formed at the end of the horizontal surface of the first metal core 221u. That is, one end of the first metal core 221u (the end facing the light guide plate) extends longer than the first circuit board 222u. The first metal core 221u is made of a high thermal conductive metal such as aluminum (Al) copper (Cu) to emit heat generated from the first group of LED packages 223u to the outside. The outer surface of the first metal core 221u may be embossed like a heat sink structure to further increase the heat dissipation effect. Heat radiated from the first metal core 221u is emitted to the outside through the metal cover member of the liquid crystal display such as the bottom cover.

The second LED array 200d includes a second circuit board 222d on which the second group of LED packages 223d are mounted, and a second metal core 221d on which the second circuit board 222d is mounted. .

Each of the second group of LED packages 223d is a side view type LED package in which light is emitted from the side. The second group of LED packages 223d are mounted on the second circuit board 222d. Wirings for connecting the cathode terminal leads and the anode terminal leads of each of the LED package 223d of the second group to the external power source are formed on the second circuit board 222d. The second circuit board 222d may be selected from FPCB, FW, and FC. The spacing between the second group of LED packages 223d is wide enough that two or more LED packages can be placed so that the heat source can be sufficiently distributed. The second metal core 221d is designed to have a flat plate structure on which the second circuit board 222d is mounted. The second metal core 221d is mounted with a second circuit board 222d on which the second group of LED packages 223d is mounted through an adhesive, an adhesive heat dissipation pad, a screw, and the like, as shown in FIG. 7. The second circuit board 222d is attached to the end of the horizontal surface of the second metal core 221d so as not to be formed. That is, one end of the second metal core 221d (the end facing the light guide plate) extends longer than the second circuit board 222d. The second metal core 221d is made of a high thermal conductive metal such as aluminum (Al) copper (Cu) to emit heat generated from the second group of LED packages 223d to the outside. The outer surface of the second metal core 221d may be embossed like a heat sink structure to further enhance the heat dissipation effect. Heat radiated from the second metal core 221d is emitted to the outside through the metal cover member of the liquid crystal display such as the bottom cover.

The third LED array 200m includes a third circuit board 222m on which the third group of LED packages 223m are mounted, and a third metal core 221m on which the third circuit board 222m is mounted. .

Each of the third group of LED packages 223m is a top view type LED package in which light is emitted from the top surface. Each of the third group of LED packages 223m is preferably a top view type LED package in which the thickness width w is greater than the side height h so that the emission surface of the light is large. A third group of LED packages 223m is mounted on the third circuit board 222m. Wires for connecting the cathode terminal leads and the anode terminal leads of each of the third group of LED packages 223m to an external power source are formed on the third circuit board 222m. The third circuit board 222m may be selected from FPCB, FW, and FC. The spacing between the third group of LED packages 223m is wide enough that two or more LED packages can be placed so that the heat source can be sufficiently dispersed. The third metal core 221m is designed to have a flat plate structure on which the third circuit board 222m is mounted, and the thickness thereof is thicker than that of the first and second metal cores 221u and 221d. A third circuit board 222m on which the third group of LED packages 223m is mounted is mounted via an adhesive heat dissipation pad, a screw, or the like. The third metal core 221m is made of a high thermal conductive metal such as aluminum (Al) copper (Cu) to emit heat generated from the third group of LED packages 223m to the outside. The outer surface of the third metal core 221m may be embossed like a heat sink structure to further increase the heat dissipation effect. Heat radiated from the third metal core 221m is emitted to the outside through the metal cover member of the liquid crystal display such as the bottom cover.

The first to third LED arrays 200u, 200d, and 200m are assembled in a structure as shown in FIGS. 6 and 7. In the assembled LED assembly, each of the third LED arrays 200m is disposed between the first LED array 200u and the second LED array 200d. The first to third metal cores 221u, 221d, and 221m are assembled in a 'c' shape surrounding three surfaces except for the light emitting surface of the LED packages 223u, 223d and 223m, so that the LED assembly 200 To increase the heat dissipation effect. Each of the LED packages 223u, 223d, and 223m is a white LED package that emits white light with a combination of R LED chip + G LED chip + B LED chip, or a combination of R LED + 2 G LED + B LED chip, or It can be selected as a white LED package that emits white light, including two LED chips generating different colors of light and a silicon layer containing phosphors. In addition, white light may be emitted by combining the R LED package 223u of the first group, the G LED package 223m of the third group, and the B LED package 223d of the second group.

Modified Example

The LED assemblies according to the first and second embodiments of the present invention have been described above, but the LED packages 123u, 123d, 223u, 223d, and 223m constituting the LED assembly are limited to the above-described embodiments. Various modifications are possible without departing from the spirit of the present invention.

8 is a front view of an LED assembly according to another embodiment of the present invention configured by changing the arrangement of the LED package of the LED assembly. As shown in FIG. 8, each of the first group of LED packages 323u and the second group of LED packages 323d is continuous by a predetermined number, and the first group of LED packages 323u and the second group LED packages 323u and 323d may be disposed in a structure in which the LED packages 323d are alternately configured to configure the LED assembly 300 of another embodiment.

Figure 9 is a front view of an LED assembly according to another embodiment of the present invention configured by changing the metal core of the LED assembly. As shown in FIG. 9, the sidewalls of each of the first and second metal cores 421u and 421d are processed in an uneven form, and the first and second metal cores 421u and 421d are as if the teeth of the star are engaged. The LED assembly 400 of another embodiment can be constructed by combining the structures to engage with each other similarly to the structure. Ends facing the light guide plate in the first and second metal cores 421u and 421d extend longer than the first and second circuit boards 422u and 422d as in the first and second embodiments.

Next, a liquid crystal display using the LED assembly according to the embodiment of the present invention will be described. Hereinafter, for convenience, only an example in which the LED assembly according to the first embodiment is applied will be described. However, the present invention is also applied to the second and modified embodiments of the present invention and other modified embodiments without departing from the technical spirit of the present invention.

10A is a cross-sectional view illustrating a state before the LED assembly 100 and the light guide plate 500 are coupled according to an embodiment of the present invention, and FIG. 10B is a view illustrating the LED assembly 100 and the light guide plate 500 according to an embodiment of the present invention. ) Is a cross-sectional view showing a combined state.

10A and 10B, one end of the first metal core 121u and the second metal core 121d of the LED assembly 100 may accommodate an edge portion of the light guide plate 500 of the edge type backlight unit. Consists of. That is, the upper edge of one end of the light guide plate 500 facing the LED assembly 100 is configured to contact the lower surface of the end of the first metal core 121u and the end of the first circuit board 122u. In addition, the lower edge of one end of the light guide plate 500 facing the LED assembly 100 is configured to contact the upper surface of the light guide plate side of the second metal core 121d and the end of the second circuit board 122d. As such, when the light guide plate 500 is configured to be received between the first and second metal cores 121u and 121d of the LED assembly, the light emitted from the LED packages 123u and 123d does not leak out to the outside, but the light guide plate 500 Since it is incident to 500, light leakage can be prevented and the light efficiency can be significantly improved.

In addition, the end portions of the first and second metal cores 121u and 121d where the first and second circuit boards 122u and 122d are not formed have a thickness thinner than those of the first and second circuit boards 122u and 122d. It is preferable that the first elastic member 510a and the second elastic member 510b each have the same thickness. As such, when the elastic members 510a and 510b are formed between the light guide plate 500 and the first and second circuit boards 122u and 122d, respectively, the light guide plate 500 may be generated during external shock or vibration caused by driving of the liquid crystal display. And shocks applied to the circuit boards 122u and 122d on which the LED packages 123u and 123d are mounted can be alleviated, thereby preventing damage to the device and increasing durability. Silicone, rubber, resin, sponge, etc. may be used as the elastic members 510a and 510b, but embodiments of the present invention are not limited thereto, and may provide a buffer function between the circuit boards 122u and 122d and the light guide plate 500. Any material can be used.

In addition, between the upper surface of the end of the light guide plate 500 accommodated at the ends of the first and second metal cores 121u and 121d and the inner surface of the first metal core 121u, and the lower surface and the first surface of the end of the light guide plate 500, respectively. It is preferable that the first heat insulating member 520a and the second heat insulating member 520b are respectively formed between the inner surfaces of the two metal cores 121d. As such, the first and second portions are respectively disposed between the upper surface of the end of the light guide plate 500 and the inner surface of the first metal core 121u and the lower surface of the end of the light guide plate 500 and the inner surface of the second metal core 121d, respectively. When the insulation members 520a and 520b are formed, heat generated from the LED packages 123u and 123d may be blocked from being transferred to the light guide plate 500 through the first and second metal cores 121u and 121d. As a result, the phenomenon in which the light guide plate 500 is deformed can be prevented.

11 is a cross-sectional view illustrating an example in which an edge type backlight unit including an LED assembly according to an exemplary embodiment of the present invention is applied to a liquid crystal display.

Referring to FIG. 11, the liquid crystal display of the present invention includes an LED assembly 100 for irradiating light to the side surface of the light guide plate 500. Optical sheets 560 are disposed between the light guide plate 500 and the liquid crystal display panel 700. The optical sheets 560 may include at least one prism sheet, at least one diffusion sheet, and the like to diffuse light incident from the light guide plate 500 and may be substantially perpendicular to the light incident surface of the liquid crystal display panel 700. To deflect the path of light. The optical sheets 560 may further include a dual brightness enhancement film (DBEF). The guide panel 530 surrounds the sides of the liquid crystal display panel 700 and the edge type backlight unit and supports the liquid crystal display panel 700 between the liquid crystal display panel 700 and the optical sheets 560. The bottom cover 540 surrounds the bottom surface of the edge type backlight unit and partially faces the metal cores 121u, 121d and 121m of the LED array. The reflective sheet 550 is disposed between the bottom cover 540 and the light guide plate 500. The top case 570 surrounds the side of the liquid crystal display panel 700 and the side of the guide panel 530. Heat emitted from the LED assembly 100 is discharged to the outside through the metal cores 121u and 121d and the bottom cover 540.

12 is a block diagram illustrating a circuit configuration and a backlight unit of a liquid crystal display device to which an edge type backlight unit including an LED assembly according to an exemplary embodiment of the present invention is applied.

12, a liquid crystal display according to an exemplary embodiment of the present invention includes a liquid crystal display panel 700, a data driving circuit 720 connected to data lines D1 to Dm of the liquid crystal display panel 700, and a liquid crystal display. A gate driving circuit 730 connected to gate lines G1 to Gn of the display panel 700, a timing controller 710 for controlling the data driving circuit 720, and the gate driving circuit 730. .

In addition, the liquid crystal display according to the exemplary embodiment of the present invention includes a backlight unit 600 for irradiating light to the liquid crystal display panel 700.

The liquid crystal display panel 700 includes an upper glass substrate and a lower glass substrate facing each other with the liquid crystal layer interposed therebetween. The liquid crystal display panel 700 includes a pixel array for displaying video data. The pixel array of the lower glass substrate includes TFTs formed at intersections of the data lines D1 to Dm and the gate lines G1 to Gn, and a pixel electrode connected to the TFTs. Each of the liquid crystal cells of the pixel array is driven by the voltage difference between the pixel electrode 1 charging the data voltage through the TFT and the common electrode 2 to which the common voltage Vcom is applied to transmit light incident from the backlight unit. Adjust the amount to display an image of the video data.

A black matrix, a color filter, and a common electrode are formed on the upper glass substrate of the liquid crystal display panel 700. The common electrode 2 is formed on the upper glass substrate in the vertical electric field driving method such as TN mode and VA mode, and on the lower glass substrate together with the pixel electrode 1 in the horizontal electric field driving method such as IPS mode and FFS mode. Is formed.

A polarizing plate is attached to each of the upper and lower glass substrates of the liquid crystal display panel 700 to form an alignment layer for setting the pre-tilt angle of the liquid crystal.

The liquid crystal mode of the liquid crystal display panel 700 applicable to the present invention may be implemented in any liquid crystal mode as well as the above-described TN mode, VA mode, IPS mode, FFS mode. In addition, the liquid crystal display of the present invention may be implemented in any form, such as a transmissive liquid crystal display, a transflective liquid crystal display, a reflective liquid crystal display.

The data driver circuit 720 includes a plurality of source drive ICs. Each of the source drive ICs samples and latches digital video data RGB input from the timing controller 710 and converts the digital video data RGB into data of a parallel data system. Each of the source drive ICs converts the digital video data converted by the parallel data transmission scheme into an analog gamma compensation voltage using the positive / negative gamma reference voltages, so that the positive / negative analog video data voltage to be charged in the liquid crystal cells. Occurs. Each of the source drive ICs supplies the data voltages to the data lines D1 to Dm while inverting the polarity of the positive / negative analog video data voltage according to the polarity control signal POL from the timing controller 710. do.

The gate driving circuit 730 includes a plurality of gate drive ICs. The gate driving circuit 730 includes a shift register that sequentially shifts the gate driving voltage in response to the gate control signals GSP, GSC, and GOE from the timing controller 710, and gate pulses (or scan pulses) on the gate lines. ) Are supplied sequentially.

The timing controller 710 receives RGB digital video data, vertical sync signal (Vsync), and horizontal sync from the system board 740 through an interface receiving circuit such as a low voltage differential signaling (LVDS) interface and a transition minimized differential signaling (TMDS) interface. A timing signal such as a signal Hsync, a data enable signal DE, a dot clock CLK, and the like are received. The timing controller 710 may transmit RGB digital video data to the source drive ICs in a mini LVDS interface. If RGB digital video data are transmitted to the source drive ICs in a mini LVDS interface, the timing controller 710 does not generate a source start pulse (SSP) and a source sampling clock (SSP). The timing controller 710 uses the timing signals Vsync, Hsync, DE, and CLK to control the source control signals SSP, SSC, SOE, and POL, and the gate control to control the gate drive ICs. Generate signals GSP, GSC, GOE. The timing controller 710 is a gate timing control signal so that digital video data input at a frame frequency of 60 Hz can be reproduced in a pixel array of the liquid crystal display panel 700 at a frame frequency of 60 × i (i is a positive integer) Hz. And the frequency of the data timing control signal can be multiplied by a frame frequency reference of 60 x i Hz.

The data control signal includes a source start pulse (Source, Start Pulse, SSP), a source sampling clock (SSC), a source output enable signal (Source Output Enable, SOE), and the like. The source start pulse SSP controls a data sampling start time of the data driving circuit 720. The source sampling clock SSC is a clock signal that controls the sampling operation of data in the data driving circuit 720 based on the rising or falling edge. If the signal transmission system between the timing controller 710 and the data driving circuit 720 is a mini LVDS interface, the source start pulse SSP and the source sampling clock SSC may be omitted as described above. The polarity control signal POL inverts the polarity of the data voltage output from the data driving circuit 720 at a period of N (N is a positive integer) horizontal period. The source output enable signal SOE controls the output timing of the data driver circuit. Each of the source drive ICs has a charge share voltage or a common voltage Vcom in response to a pulse of the source output enable signal SOE when the polarity of the data voltage supplied to the data lines D1 to Dm is changed. ) Is supplied to the data lines D1 to Dm, and a data voltage is supplied to the data lines during the low logic period of the source output enable signal SOE. The charge share voltage is an average voltage of neighboring data lines to which data voltages having opposite polarities are supplied.

The gate control signals GSP, GSC, and GOE include a gate start pulse GSP, a gate shift clock GSC, a gate output enable signal GOE, and the like. The gate start pulse GSP controls the timing of the first gate pulse. The gate shift clock GSC is a clock signal for shifting the gate start pulse GSP. The gate output enable signal GOE controls the output timing of the data driving circuit 730.

The system board 740 includes a vertical sync signal Vsync, a horizontal sync signal Hsync, a data enable signal DE, a dot clock CLK, and the like along with RGB video data input from a broadcast receiving circuit or an external video source. The timing signal is transmitted to the timing controller 710 through the LVDS interface or the TMDS interface transmission circuit. The system board 740 includes a graphics processing circuit such as a scaler that interpolates the resolution of the RGB video data input from the broadcast receiving circuit or an external video source according to the resolution of the liquid crystal display panel and processes the signal interpolation.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

1 is a front view illustrating a state before the first and second LED arrays are coupled.

2 is a front view showing a state in which the first and second LED arrays are defective.

3 is a perspective view of an LED assembly showing a state in which the first and second LED arrays of F are defective;

4 is a side view of the LED array shown in FIG.

5 is a front view illustrating a state before the first and second LED arrays are coupled.

6 is a front view showing a state in which the first and second LED arrays are defective.

7 is a perspective view of an LED assembly showing a state in which the first and second LED arrays are defective.

Figure 8 is a front view of an LED assembly according to another embodiment of the present invention configured by changing the arrangement of the LED package of the LED assembly.

Figure 9 is a front view of an LED assembly according to another embodiment of the present invention configured by changing the metal core of the LED assembly.

10A is a cross-sectional view showing a state before the LED assembly 100, 200, 300, 400 and the light guide plate 500 are coupled according to an embodiment of the present invention, and FIG. 10B is an LED assembly 100 according to an embodiment of the present invention. , 200, 300, 400 are cross-sectional views showing a state in which the light guide plate 500 is coupled.

11 is a cross-sectional view showing an example in which an edge type backlight unit having an LED assembly according to an embodiment of the present invention is applied to a liquid crystal display device.

12 is a block diagram illustrating a circuit configuration and a backlight unit of a liquid crystal display device to which an edge type backlight unit having an LED assembly according to an exemplary embodiment of the present invention is applied.

Description of the Related Art

100, 200, 300, 400: LED Assembly

121u, 321u, 421u: first metal core

121d, 321d, 421d: second metal core

221m: 3rd metal core

122d, 322d, 422d: first circuit board

122u, 322u, 322u: second circuit board

222m: third circuit board

123u, 223u, 323u, 423u: first LED package

123d, 223d, 323d, 423d: second LED package

223m: 3rd LED Package

600: backlight unit 700: liquid crystal display panel

Claims (9)

A first metal core having a first group of LED packages, a first circuit board on which the first group of LED packages are mounted, and a first extension to which the first circuit board is mounted and extending outside the first circuit board A first LED array comprising a; And A second metal core having a second group of LED packages, a second circuit board on which the second group of LED packages are mounted, and a second extension on which the second circuit board is mounted and extending out of the second circuit board; Light emitting diode assembly comprising a second LED array comprising a. The method of claim 1, The first group of LED packages and the second group of LED packages are alternately arranged; In each of the first and second LED arrays, The spacing between the LED packages is greater than one or more LED packages, Each of the first and second metal cores, Has an "L" shaped cross section having a concave portion on which the circuit boards are mounted, The first and second metal cores, It is assembled symmetrically to surround three sides except for the light emitting portion of the LED package, Each of the first and second groups of LED packages, A light emitting diode assembly comprising a side view type LED package for emitting light through a side surface. The method of claim 2, And a third LED array comprising a third group of LED packages, a third circuit board on which the third group of LED packages are mounted, and a third metal core on which the third circuit board is mounted. Each of the third group of LED packages is disposed between the first group of LED packages and the second group of LED packages, Each of the first metal core, the second metal core and the third metal core has a flat plate structure, The first metal core, the second metal core and the third metal core are assembled in a 'c' shape so as to surround three surfaces of the LED packages except for the light emitting portion. assembly. The method of claim 3, wherein Each of the third group of LED packages, A light emitting diode assembly comprising a top view type LED package for emitting light through the top surface. The method according to any one of claims 1 to 4, A first formed on the inner side of the first and second extension portions of the first and the metal cores extending outside the first and second circuit boards and having a thickness thinner than or equal to the thickness of the first and second circuit boards, respectively; And a second elastic member. The method of claim 5, The first and second elastic members are formed on portions of the first and second extensions of the first and second metal cores and are adjacent to the first and second elastic members. And a first and a second heat insulating member formed on the remaining portions of the first and second extensions of the core. The light emitting diode assembly of any one of claims 1 to 4, A backlight unit including a light guide plate to convert light emitted from the light emitting diode assembly into planar light; And A liquid crystal display panel which displays an image by controlling the transmittance of light from the backlight unit by using liquid crystal molecules controlled by an electrical signal, One end of the light guide plate is accommodated in the first and second extension of the light emitting diode assembly. The method of claim 7, wherein Positioned between the first and second circuit boards and the light guide plate at an inner position of the first and second extension portions of the first and second metal cores extending outside the first and second circuit boards; And a first elastic member and a second elastic member having a thickness thinner than or equal to that of the second circuit board. The method of claim 8, First and second extensions of the first and second metal cores at positions of the remaining portions of the first and second extensions of the first and second metal cores adjacent to the first and second elastic members; And first and second heat insulating members between the upper edge and the lower edge of one end of the light guide plate such that heat generated from the light emitting diode assembly is not transferred to the light guide plate.

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