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KR20100003332A - Led package with heat radiating structure - Google Patents

Led package with heat radiating structure Download PDF

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Publication number
KR20100003332A
KR20100003332A KR1020080060903A KR20080060903A KR20100003332A KR 20100003332 A KR20100003332 A KR 20100003332A KR 1020080060903 A KR1020080060903 A KR 1020080060903A KR 20080060903 A KR20080060903 A KR 20080060903A KR 20100003332 A KR20100003332 A KR 20100003332A
Authority
KR
South Korea
Prior art keywords
lead frame
led package
molding member
cup
led chip
Prior art date
Application number
KR1020080060903A
Other languages
Korean (ko)
Other versions
KR101121728B1 (en
Inventor
이재홍
Original Assignee
서울반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 서울반도체 주식회사 filed Critical 서울반도체 주식회사
Priority to KR1020080060903A priority Critical patent/KR101121728B1/en
Publication of KR20100003332A publication Critical patent/KR20100003332A/en
Application granted granted Critical
Publication of KR101121728B1 publication Critical patent/KR101121728B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Led Device Packages (AREA)

Abstract

PURPOSE: An LED package with a heat radiation structure is provided to improve heat radiation by exposing a rear side of a cup unit to the outside through the lower side of a molding unit. CONSTITUTION: A first lead frame(12) with a plate shape includes a concave cup unit(125) for mounting an LED chip(2). A second lead frame(14) with the plate shape is separated from the first lead frame and is connected to the LED chip with the wiring. A transmissive molding unit(20) supports the first lead frame and the second lead frame and covers the LED chip. The cup unit is exposed to the outside on the lower side of the molding unit. The rear of the cup unit and the rear of the end contacts form the same plane. The molding unit is integrated with the lens unit protruded from the upper side.

Description

LED package with heat dissipation structure {LED PACKAGE WITH HEAT RADIATING STRUCTURE}

The present invention relates to a light emitting diode (LED) package in which a light blocking (ie non-transmissive) reflector or a housing is omitted, and more particularly, includes a structure for supporting lead frames with a light transmitting molding member, The present invention relates to an LED package having an improved structure in which a heat dissipation structure is integrally provided on one of the lead frames.

The LED package includes a semiconductor chip in which electrons and holes meet and emit light at a p-n semiconductor junction, that is, an LED chip and a structure encapsulating the same.

A typical LED package includes a housing (or reflector) with a cavity in which the LED chip is housed, an LED chip located in the cavity of the housing, and a leadframe that serves to input power to the LED chip while supported by the housing. Include them. The LED package having such a structure may include a heat sink inserted into and installed in the housing as a means for easily dissipating heat from the LED chip to the outside.

As another type of LED package, a structure in which the LED chip is encapsulated by a translucent molding member formed by transfer molding, for example, is known instead of the housing is omitted. Such an LED package is formed by mounting an LED chip on a conventional printed circuit board (PCB), for example, and forming a transparent molding member that protects the LED chip on the PCB. However, the LED package as described above, due to the low thermal conductivity of the PCB, there is a problem that it is difficult to discharge heat generated from the LED chip. In addition, such a conventional LED package has a problem that the light efficiency is lowered because there is no reflector.

In addition, conventionally, an LED package has been proposed that uses metal leadframes in the form of a plate, such as a PCB, and forms a molding member that is a substantially rectangular parallelepiped without a reflector or a housing thereon. Such a conventional LED package has improved heat dissipation performance compared to a conventional PCB type LED package, but there is still much room for improvement in heat dissipation performance due to the small exposed area of the lead frame to the outside. In addition, due to the omission of the reflector, there was also a problem of light loss caused by the light not being emitted at a desired direction angle. And, due to the difficulty in applying the phosphor due to the omission of the reflector, many limitations have been followed, for example, in application to white LED packages.

Accordingly, the technical problem of the present invention includes a structure for supporting lead frames with a light-transmitting molding member, and an LED having a structure having both a heat sink function and a reflector function in any one of the lead frames. To provide a package.

According to an aspect of the present invention, a plate-shaped first lead frame having a concave cup portion on which an LED chip is mounted, and a plate-shaped second lead frame spaced apart from the first lead frame and connected by wiring to the LED chip. And a translucent molding member supporting the first lead frame and the second lead frame and covering the LED chip as a whole, wherein the cup part is exposed to the outside from the lower surface of the molding member.

Preferably, each of the first lead frame and the second lead frame includes end contact portions formed by a bent structure, and the end contact portions are exposed to the outside from the lower surface of the molding member. Preferably, the back of the cup portion and the back of the distal contact portions are coplanar.

Preferably, the molding member is integrally provided with a lens portion protruding from the top by its molding process, and the lens portion is located directly above the cup portion.

Preferably, the first lead frame has a convex portion extending toward the second lead frame while surrounding a portion of the cup portion, and the second lead frame has a concave portion configured to receive the convex portion. .

Preferably, the molding member is formed by transfer molding.

Preferably, the method further includes a filling resin formed in the cup part before forming the molding member, and the filling resin includes a phosphor or a diffusing agent.

The present invention, in the LED package in which the translucent molding member supports the lead frames without a conventional reflector-type housing, it is easy to design to adjust the orientation angle by the cup portion having a reflective surface, moreover, the lens portion of the molding member In particular, the back surface of the cup portion is exposed to the outside through the lower portion of the molding member, there is an effect that the heat dissipation performance is greatly improved.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided as examples to ensure that the spirit of the present invention can be fully conveyed to those skilled in the art. Accordingly, the present invention is not limited to the embodiments described below and may be embodied in other forms. And, in the drawings, the width, length, thickness, etc. of the components may be exaggerated for convenience. Like numbers refer to like elements throughout.

1 is a perspective view showing an LED package according to an embodiment of the present invention, Figure 2 is a plan view of the LED package shown in Figure 1, Figure 3 is a cross-sectional view taken along the line I-I of FIG.

1 to 3, the LED package 1 according to the embodiment of the present invention includes an LED chip 2, first and second lead frames 12 and 14 spaced apart from each other, and light transmissive. The molding member 20 is included. The LED chip 2 is mounted on the first lead frame 12 and is electrically connected to the second lead frame 14 by bonding wires. The transparent molding member 20 supports the first and second lead frames 12 and 14 and simultaneously covers the LED chip 2. Therefore, the reflector, that is, the reflective housing, which is widely used in the existing LED package, is omitted.

The first and second lead frames 12 and 14 are made of a metal plate having a relatively wide width. The first and second lead frames 12 and 14 may be formed from a wide metal sheet by plastic working including, for example, patterning, punching, bending, and the like.

The first lead frame 12 includes a cup portion 125 recessed concave by a punching process. The inside of the cup part 125 (particularly, the bottom surface) of the LED chip 2 is mounted in an attaching manner. Since the first lead frame 12 is made of a reflective metal, the inner wall surface of the cup portion 125 functions as a reflective surface with respect to a part of the light emitted from the LED chip 2.

The translucent molding member 20 supports the first and second lead frames 12 and 14 and covers the LED chip 2 by, for example, molding using a mold such as transfer molding. It is formed to. The translucent molding member 20 exposes the rear surface of the cup portion 125 formed on the first lead frame 12 to the outside from its lower surface. Therefore, heat generated in the LED chip 2 may be quickly discharged to the outside of the molding member 20 via the cup part 125.

In addition, the light-transmitting molding member 20 exposes the rear surfaces of the terminal contact portions 127 and 147 of the first and second lead frames 12 and 14 from the lower surface thereof to the outside. The externally exposed end contacts 127 and 1247 may be connected to, for example, an SMT process with respect to an electrode formed on a substrate such as a PCB. The end contact portions 127 and 147 are formed by bending at least two ends of the vicinity of the ends of the first and second lead frames 12 and 14. In this embodiment, the back surface of the distal contact portions 127, 147 and the back surface of the cup portion 125 are coplanar with respect to each other and with respect to the bottom surface of the translucent molding member 20.

By the above structure, the light-transmissive molding member 20, only the rear surface of the terminal contact portion 127, 147 of the first and second lead frame 12, 14 and the rear surface of the cup portion 125 to the outside Only the exposed portion may not expose any part of the remaining first and second leadframes 12 and 14 to the outside.

In addition, the light-transmitting molding member 20 is integrally provided with a lens unit 25 for adjusting the directivity angle or pattern of light. The lens portion 25 is a portion formed together by the transfer molding process of the molding member 20, and in this embodiment, has a hemispherical shape protruding to the upper surface of the molding member 20. The hemispherical lens portion 25 is located directly above the LED chip 2 and the cup portion 125 in which the LED chip 2 is accommodated, and directly passes through the light emitted directly from the LED chip 2 and the reflecting surface of the cup portion 125. It serves to collect the emitted light within its intended range.

As shown in FIG. 3, the first and second leadframes 12 and 14 are convex, respectively, formed at opposite ends of the first leadframe 12 and the second leadframe 14, respectively. The part 129 and the recessed part 149 are provided.

The convex portion 129 extends toward the second lead frame while surrounding a portion of the cup portion 125. In addition, the concave portion 149 accommodates the convex portion 129 of the first lead frame 12 while the center of one end of the second lead frame 14 is recessed inwardly.

The convex portion 129 and the concave portion 149 allow the cup portion 125 to be positioned approximately in the center of the LED package 1, while the external load, in particular, the first leadframe 12 and the second It contributes to suppressing the breakage of the molding member 20 against bending or torsional loads applied to the lead frame 14 yarns.

This is possible because the gap between the first lead frame 12 and the second lead frame 14 is curved by the convex portion 129 and the concave portion 149. The curved shape allows the molding member 20 to be reinforced by either the first lead frame 12 or the second lead frame 14 over the entire transverse direction.

4 is a cross-sectional view showing another LED package according to another embodiment of the present invention. In the description of the embodiment illustrated in FIG. 4, the matters already described above are omitted to avoid duplication.

Referring to FIG. 4, the LED package 1 according to the present embodiment further includes a filling resin 21 formed in the cup part 125 of the first lead frame 12 before the molding member 20 is formed. The filling resin 21 is formed by filling a resin suspension containing phosphor particles and / or diffusing agent particles in a cup 125 at a predetermined height and then curing the resin suspension. The filling resin 21 may be formed by providing the cup portion 125 to the first lead frame 12. The filling resin 21 may provide a density of phosphors and / or diffusers around the LED chip 2 by the filling resin 21. It is possible to raise.

1 is a perspective view showing an LED package according to an embodiment of the present invention.

2 is a plan view of the LED package of FIG.

3 is a cross-sectional view taken along the line II of FIG. 2.

4 is a cross-sectional view showing an LED package according to another embodiment of the present invention.

Claims (7)

A plate-shaped first lead frame having a concave cup portion on which an LED chip is mounted; A plate-shaped second lead frame spaced apart from the first lead frame and connected to the LED chip by wiring; A translucent molding member supporting the first lead frame and the second lead frame and covering the LED chip as a whole; The cup unit LED package, characterized in that exposed to the outside from the lower surface of the molding member.  The method of claim 1, wherein each of the first lead frame and the second lead frame, the terminal contact portion formed by the bent structure, the terminal contact portion, characterized in that exposed to the outside from the lower surface of the molding member LED package. The LED package according to claim 2, wherein the back surface of the cup portion and the back surface of the terminal contact portions form the same plane. The LED package according to claim 1, wherein the molding member is integrally provided with a lens portion protruding from an upper portion by a molding process, and the lens portion is located directly above the cup portion. The method of claim 1, wherein the first lead frame has a convex portion extending toward the second lead frame while surrounding a portion of the cup portion, the second lead frame has a concave portion shaped to receive the convex portion LED package, characterized in that. The LED package of claim 1, wherein the molding member is formed by transfer molding. The LED package of claim 1, further comprising a filling resin formed in the cup part before forming the molding member, wherein the filling resin includes a phosphor or a diffusion agent.
KR1020080060903A 2008-06-26 2008-06-26 Led package with heat radiating structure KR101121728B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080060903A KR101121728B1 (en) 2008-06-26 2008-06-26 Led package with heat radiating structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080060903A KR101121728B1 (en) 2008-06-26 2008-06-26 Led package with heat radiating structure

Publications (2)

Publication Number Publication Date
KR20100003332A true KR20100003332A (en) 2010-01-08
KR101121728B1 KR101121728B1 (en) 2012-03-23

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080060903A KR101121728B1 (en) 2008-06-26 2008-06-26 Led package with heat radiating structure

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011249800A (en) * 2010-05-24 2011-12-08 Seoul Semiconductor Co Ltd Led package
WO2013055014A1 (en) * 2011-10-10 2013-04-18 Ju Jae Cheol Method for manufacturing led package
WO2013055013A1 (en) * 2011-10-10 2013-04-18 Ju Jae Cheol Led package

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100271423B1 (en) 1997-05-01 2000-11-15 송기선 Light couple device and method manufacture of the same
KR100629496B1 (en) 2005-08-08 2006-09-28 삼성전자주식회사 Led package structure and manufacturing method for the same
KR100634189B1 (en) * 2005-08-31 2006-10-16 루미마이크로 주식회사 Thin light emitting diode package and method for manufacturing the same
KR100801620B1 (en) * 2006-09-29 2008-02-11 서울반도체 주식회사 Led package having a convex molding lens and method for fabricating the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011249800A (en) * 2010-05-24 2011-12-08 Seoul Semiconductor Co Ltd Led package
US9059386B2 (en) 2010-05-24 2015-06-16 Seoul Semiconductor Co., Ltd. Light emitting diode package
US9224935B2 (en) 2010-05-24 2015-12-29 Seoul Semiconductor Co., Ltd. Light emitting diode package
US9455388B2 (en) 2010-05-24 2016-09-27 Seoul Semiconductor Co., Ltd. Light emitting diode package
US9929330B2 (en) 2010-05-24 2018-03-27 Seoul Semiconductor Co., Ltd. Light emitting diode package
WO2013055014A1 (en) * 2011-10-10 2013-04-18 Ju Jae Cheol Method for manufacturing led package
WO2013055013A1 (en) * 2011-10-10 2013-04-18 Ju Jae Cheol Led package

Also Published As

Publication number Publication date
KR101121728B1 (en) 2012-03-23

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