KR20080056856A - Exhaust member and method for exhaust chemical of the exhaust member, and appratus for treating substrate with the exhaust member - Google Patents

Abstract

An exhaust member is provided to improve recovery of chemicals by liquefying and recovering the chemicals that are transformed into a vapor state to be exhausted. An inner pipe(112) exhausts gas in a substrate processing apparatus. An outer pipe(114) is installed outside the inner pipe to surround the inner pipe. A supply line(122) supplies cooling fluid to a space between the inner pipe and the outer pipe. A receptacle(130) receives the chemicals solidified by the cooling fluid exhausted along the inner pipe, connected to the inner pipe. A recovery line(124) recovers the chemicals received in the receptacle, connected to the receptacle. An exhaust line exhausts the gas introduced into the receptacle to the outside, connected to the receptacle.

Description

TECHNICAL OF THE EXHAUST MEMBER, AND APPRATUS FOR TREATING SUBSTRATE WITH THE EXHAUST MEMBER}

1 is a configuration diagram of a substrate processing apparatus according to the present invention.

FIG. 2 is an enlarged view of the exhaust member shown in FIG. 1.

3 is a view for explaining the exhaust process of the exhaust member according to the present invention.

* Description of symbols on the main parts of the drawings *

10 substrate processing apparatus 110 exhaust pipe

12 housing 120 cooling fluid circulation line

14 substrate transfer member 130 container

16: injection member

100: exhaust member

The present invention relates to an exhaust member, a method for discharging a chemical liquid of the exhaust member, and a substrate processing apparatus including the exhaust member, and more particularly, an exhaust member for exhausting a chemical liquid in a vapor state discharged from the substrate processing apparatus during the process; A chemical liquid exhaust method of the exhaust member, and an apparatus for treating a substrate provided with the exhaust member.

A general substrate processing apparatus is an apparatus for processing substrates such as a wafer for semiconductor manufacturing and a glass substrate for flat panel display manufacturing. Among them, a wet etching apparatus for manufacturing a flat panel display is an apparatus for etching foreign substances on the surface of a substrate using various kinds of chemical liquids. The wet etching apparatus etches foreign substances remaining on the surface of the substrate by spraying the etching liquid to the processing surface of the substrate that is moved at a constant speed in the housing during the etching process during the process. The etchant used in the process is recovered through a recovery line connected to the lower portion of the housing, and fumes generated from the etchant are exhausted to the outside through an exhaust member provided at the upper portion of the housing.

Some of the etchant used in the process is recovered to the tank for regenerating the etchant through a discharge line provided in the lower portion of the housing, some of the etchant is converted to a vapor state and exhausted to the outside through the exhaust member. However, in general, the etchant used in the wet etching process is used at a high temperature of approximately 70 ℃ or more. Therefore, since a large amount of the high temperature etchant used in the process of processing the substrate is converted into a vapor state and exhausted through the exhaust member, the recovery rate of the etchant is low.

In order to solve the above problems, an object of the present invention is to provide an exhaust member for improving the recovery rate of the chemical liquid used in the process, a chemical liquid drainage method of the exhaust member, and a substrate processing apparatus having the exhaust member.

In addition, the present invention provides an exhaust member for improving the recovery rate of the chemical liquid used in the substrate processing apparatus using a high temperature treatment liquid, a chemical liquid drainage method of the exhaust member, and a substrate processing apparatus including the exhaust member. The purpose.

Exhaust member according to the present invention for achieving the above object is an inner pipe for exhausting the gas in the substrate processing apparatus, an outer pipe installed to surround the inner pipe from the outside of the inner pipe, and the inner pipe and the outside It includes a supply line for supplying a cooling fluid to the space between the pipes.

According to an embodiment of the present invention, the exhaust member is connected to the inner pipe receiving container containing the chemical liquid condensed by the cooling fluid exhausted along the inner pipe, the receiving container is connected to the receiving container, A recovery line for recovering the received chemical liquid, and an exhaust line connected to the accommodation container and for exhausting the gas introduced into the accommodation container to the outside.

Substrate processing apparatus according to the present invention for achieving the above object is a housing that provides a space for performing a process for processing the substrate therein, a substrate transfer member for transferring the substrate in the housing during the process, the substrate transfer during the process An injection member for injecting the chemical liquid to the substrate moved by the member, and an exhaust member for exhausting the gas in the housing to the outside, wherein the exhaust member is an internal pipe through which the chemical liquid in the vapor state is exhausted, the outside of the internal pipe In the outer pipe is installed to surround the inner pipe, and the supply line for supplying a cooling fluid to the space between the inner pipe and the outer pipe.

According to an embodiment of the present invention, the exhaust member is connected to the inner pipe receiving container containing the chemical liquid condensed by the cooling fluid exhausted along the inner pipe, the receiving container is connected to the receiving container, A recovery line for recovering the received chemical liquid, and an exhaust line connected to the accommodation container and for exhausting the gas introduced into the accommodation container to the outside.

The chemical liquid exhaust method according to the present invention for achieving the above object is to discharge the gas in the housing in which the process is performed through a pipe, the liquid chemical in the vapor state of the gas in the pipe to liquefy the chemical liquid in the vapor state To exhaust.

According to an embodiment of the present invention, the chemical liquid cooling in the vapor state is further provided by a pipe surrounding the pipe, it is made by supplying a cooling fluid between the pipes.

According to an embodiment of the present invention, the liquefied chemical liquid is reused.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, one embodiment introduced herein is provided so that the disclosure will be thorough and complete, and will fully convey the spirit of the invention to those skilled in the art. In addition, in the present embodiment, a wet etching apparatus for etching foreign matter on the surface of the glass substrate for manufacturing a flat panel display has been described as an example. However, the present invention may be applied to all substrate processing apparatuses for treating a substrate using a treatment liquid.

(Example)

1 is a block diagram of a substrate processing apparatus according to the present invention, Figure 2 is an enlarged view of the exhaust member shown in FIG. 1 and 2, an apparatus for treating substrate 1 according to the present invention includes a process room 10 and an exhaust member for exhausting gas in the process room 10. exhaust member) (100).

The process chamber 10 includes a housing 12, a substrate transfer member 14, and an injection member 16. The housing 12 provides a space for performing a process of etching foreign matter on the surface of the substrate s using a food solution therein. At least one housing 12 is installed. When a plurality of housings 12 are provided, each housing 12 is disposed adjacent to each other to perform a series of substrate processing processes. The housing 12 is sealed so that the chemical liquid used in the process and the fume generated from the chemical liquid do not leak out of the housing 12. Then, one side of the housing 12 is provided with a substrate inlet 12a through which the substrate s is carried in, and the other side of the housing 12 is provided with a substrate outlet 12b through which the substrate s is carried out. do. In addition, the lower portion of the housing 12 is provided with a drain line 12c for draining the etching liquid used in the process. Here, the etchant drained through the drain line 12c is recovered to an etchant regeneration tank (not shown) that adjusts to satisfy the process conditions (process concentration and process temperature) of the etchant for reuse.

The substrate transfer member 14 transfers the substrate s in the housing 12 and between the housings 12 during the process. The substrate transfer member 14 includes a shaft 14a, a roller 14b, and a motor (not shown). A plurality of shafts 14a are provided. The shafts 14a are installed in a direction perpendicular to the transport direction of the substrate s. The rollers 14b are arranged at equal intervals on each shaft 14a to support the bottom surface of the substrate s during the process. The motor rotates the shaft 14a at a constant speed during the process. The injection member 16 injects the etchant toward the substrate s moved by the substrate transfer member 14 during the process. As the injection member 16, a plurality of nozzles or chemical knives are used. Here, the etchant is a treatment liquid for removing unnecessary photoresist on the surface of the substrate s. The etchant is heated to a high temperature of approximately 70 ° C. or more for more efficient etching.

The exhaust member 100 exhausts a processing liquid (fume) in a vapor state inside the housing 12 during the process. The exhaust member 100 includes an exhaust line 110, a cooling-fluid recycle line 120, and an accept vessel 130. The exhaust pipe 110 includes an inner line 112 and an outer line 114. One end of the inner pipe 112 is connected to the housing 12, and the other end of the inner pipe 112 is connected to the accommodation container 130. The inner pipe 112 moves the etching liquid in the vapor state in the housing 12 to the receiving container 130. The outer pipe 114 is provided to surround the inner pipe 112 at the outside of the inner pipe 112. A space X through which a cooling fluid flows is provided between the inner pipe 112 and the outer pipe 114.

The cooling fluid circulation line 120 includes a supply line 122 and a recovery line 124. Supply line 122 supplies the cooling fluid from the cooling fluid source (not shown) to the space (X) between the inner pipe 112 and the outer pipe 114, and the recovery line 124 from the space (X) Recover the cooling fluid to the cooling fluid source. Here, cooling water is used as the cooling fluid. Alternatively, a cooling gas may be used as the cooling fluid.

The accommodation container 130 accommodates an etchant that condenses while passing through the exhaust pipe 110 during the process. The recovery line 132 is connected to the lower portion of the receiving container 130, the exhaust line 134 is connected to the upper portion of the receiving container 130. The recovery line 132 recovers the liquid etchant contained in the accommodation container 130 to the etching solution regeneration tank, and the exhaust line 134 exhausts the gas moved to the accommodation container 130 through the exhaust pipe 110 to the outside. do.

Hereinafter, the process of the substrate processing apparatus 10 having the above-described configuration will be described in detail. Here, the same reference numerals for the same components as the above-described components are the same, and detailed description of the components is omitted.

When the substrate treating process is started, the substrate s is moved into the housing 12 through the substrate inlet 12a. The substrate s moved into the housing 12 is moved at a constant speed inside the housing 12 by the substrate transfer member 14. Then, the injection member 16 sprays the etching liquid toward the substrate s to be moved. The ejected etchant is recovered to an etchant regeneration tank (not shown) through the drain line 12c after removing unnecessary photoresist on the surface of the substrate s. At this time, since the etchant used in the process is a high temperature of 70 ℃ or more, some of the used etchant is discharged from the housing 12 through the exhaust member 100 after evaporation. The substrate s from which the photosensitive liquid is removed is taken out of the housing 12 through the substrate outlet 12b and then transferred to a facility for processing a subsequent process.

Subsequently, the process of exhausting the etching liquid in the vapor state by the exhaust member 100 will be described in detail. 3 is a view for explaining the exhaust process of the exhaust member according to the present invention. Referring to FIG. 3, when the above-described substrate processing process is performed, the etching liquid b in the vapor state in the housing 12 is moved to the accommodation container 130 through the internal pipe 112 of the exhaust pipe 110. At this time, the etching liquid (b) in the vapor state is cooled by the cooling fluid (a) flowing through the space (X) between the inner pipe 112 and the outer pipe (114). Thus, the etching liquid (b) in the vapor state moving along the inner pipe 112 is liquefied by heat exchange with the cooling fluid (a) flowing along the space (X). The liquefied etchant (c) is moved along the inner pipe 112 is received in the receiving container (130). The etchant (c) accommodated in the container 130 is recovered to an etchant regeneration tank (not shown) through the recovery line 132. The etchant recovered into the etchant regeneration tank is adjusted to a predetermined concentration and temperature and then reused.

As described above, the substrate processing apparatus 10 according to the present invention improves the recovery rate of the etchant by providing an exhaust member 100 which liquefies the etchant exhausted in the vapor state of the etchant used in the process and recovers it for reuse. Let's do it. In particular, the substrate processing apparatus 10 according to the present invention can recover both the liquid treatment liquid and the vapor treatment liquid evaporated from the liquid treatment liquid during the treatment of the process using the high temperature treatment liquid. Improve the recovery rate of the liquid.

In this embodiment, the condensation of the etching liquid in the vapor state using the exhaust pipe 110 having a double pipe structure having an internal pipe 112 and the external pipe 114 as an example, but the structure of the exhaust member 100 Can be variously modified and modified to suit the process environment. For example, in the present embodiment, the exhaust pipe 110 of the exhaust member 110 is described as an example, but in this case, the etching liquid condensed in the exhaust pipe 110 may not effectively flow toward the receiving container 130. have. Therefore, the exhaust pipe 110 may be installed to be inclined downward toward the receiving container 130 so that the liquefied etchant flows down the inclination of the exhaust pipe 110 to be moved to the receiving container 130.

In addition, the present embodiment has been described with one exhaust member 110 as an example, but a plurality of exhaust members 110 may be provided. In the present exemplary embodiment, the etching solution accommodated in the accommodation container 130 is recovered as an etchant regeneration tank (not shown). However, the etching solution in the accommodation container 130 may be drained without being recovered. However, in order to improve the recovery rate of the etchant, it is desirable to liquefy the vapor etchant and recover it again.

The foregoing detailed description illustrates the present invention. In addition, the foregoing description shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications may be made within the scope of the concept of the invention disclosed in this specification, the scope equivalent to the disclosed contents, and / or the skill or knowledge in the art. The above-described embodiments illustrate the best state for implementing the technical idea of the present invention, the use of other inventions such as the present invention in other state known in the art, and the specific fields of application and uses of the invention. Various changes required are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

As described above, the exhaust member according to the present invention, the method of exhausting the chemical liquid of the exhaust member, and the substrate processing apparatus including the exhaust member are liquefied and recovered by converting the chemical liquid which is converted into the vapor state and exhausted from the chemical liquid used in the process Improve the recovery of chemicals.

Claims (7)

In the member which exhausts gas from a substrate processing apparatus, Internal piping for exhausting gas in the substrate processing apparatus; An outer pipe installed to surround the inner pipe at an outside of the inner pipe; And a supply line for supplying a cooling fluid to a space between the inner pipe and the outer pipe. The method of claim 1, The exhaust member, A receiving container connected to the inner pipe and containing a chemical liquid condensed by the cooling fluid exhausted along the inner pipe; A recovery line connected to the container, for recovering the chemical liquid contained in the container, and And an exhaust line connected to the accommodation vessel and configured to exhaust the gas introduced into the accommodation vessel to the outside. In the apparatus for processing a substrate, A housing providing a space therein for performing a process of processing a substrate; A substrate transfer member for transferring a substrate in the housing during a process; An injection member for injecting the chemical liquid to the substrate moved by the substrate transfer member during the process; It includes an exhaust member for exhausting the gas in the housing to the outside, The exhaust member, Internal piping through which the chemical liquid in the vapor state is exhausted, An outer pipe installed to surround the inner pipe at an outside of the inner pipe; And a supply line for supplying a cooling fluid to a space between the inner pipe and the outer pipe. The method of claim 3, wherein The exhaust member, A receiving container connected to the inner pipe and containing a chemical liquid condensed by the cooling fluid exhausted along the inner pipe; A recovery line connected to the container, for recovering the chemical liquid contained in the container, and And an exhaust line connected to the accommodation container and configured to exhaust the gas introduced into the accommodation container to the outside. The gas in the housing in which the process is performed is discharged through a pipe, the chemical liquid exhaust method characterized in that the vaporized chemical liquid in the gas is cooled in the pipe to liquefy the liquid vapor in the vapor state. The method of claim 5, wherein The chemical liquid cooling of the vapor state, Further providing a pipe surrounding the pipe, the chemical liquid exhaust method, characterized in that made by supplying a cooling fluid between the pipes. The method of claim 6, Chemical liquid exhaust method, characterized in that the liquefied chemical liquid is reused.

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