KR20070069227A - Display device - Google Patents

Abstract

A display device is provided to improve heat-radiating efficiency and enhance operation efficiency of an assembling process. A display device(1) includes an LCD(Liquid Crystal Display) panel(20), at least one point light source circuit board(51), a plurality of point light sources(60), a receiving container(80), and a plurality of hook members. The point light source circuit board is located on the backside of the LCD panel and has a plurality of through-holes. The point light sources are mounted on the point light source circuit board in a row and irradiate lights to the LCD panel. The receiving container receives the circuit board and has a plurality of combining holes(81) corresponding to the through-holes. The hook members are used to combine the circuit board with the receiving container.

Description

Display {DISPLAY DEVICE}

1 is an exploded perspective view of a display device according to a first embodiment of the present invention;

2 is a cross-sectional view of a display device according to a first embodiment of the present invention;

Figure 3 is a perspective view of the main portion of the hook member according to the second embodiment of the present invention.

Explanation of Signs of Major Parts of Drawings

10: fixed container 20: liquid crystal panel

30: light adjusting member 40: reflecting plate

41: light emitting diode receiving port 51: light emitting diode circuit board

52: through hole 55: hook member

56 support body 57: hook portion

60: light emitting diode 70: heat dissipation sheet

71: through hole 80: storage container

81: fastener

The present invention relates to a display device, and more particularly, to a display device having improved heat dissipation efficiency and workability.

Recently, a flat panel display such as a liquid crystal display (PDP), a plasma display panel (PDP), an organic light emitting diode (OLED), etc. has been developed in place of the conventional CRT.

Among them, the liquid crystal display includes a thin film transistor substrate, a color filter substrate, and a liquid crystal panel in which liquid crystal is injected between both substrates. Since the liquid crystal panel is a non-light emitting device, a backlight unit for supplying light is disposed on the rear surface of the thin film transistor substrate. Light transmitted from the backlight unit is adjusted according to the arrangement of liquid crystals. The liquid crystal panel and the backlight unit are housed in the chassis.

The backlight unit is divided into an edge type and a direct type according to the position of the light source. The edge type is a structure in which a light source is installed on the side of the light guide plate, and is mainly applied to a relatively small liquid crystal display device such as a laptop type and a desktop computer. Such an edge type backlight unit has a good light uniformity, a long service life, and is advantageous for thinning a liquid crystal display device. The direct type is a structure mainly developed as the size of the liquid crystal display device is enlarged. The direct type has a structure in which at least one light source is disposed on the lower surface of the liquid crystal panel to supply light to the liquid crystal panel. Such a direct type backlight unit has an advantage of ensuring a high luminance because a large number of light sources can be used as compared to an edge type backlight unit.

As a light source of a direct type backlight unit, a spot light source such as a light emitting diode is attracting attention rather than a line light source such as a lamp. The point light source is composed of a plurality of point light sources, and the point light sources are mounted in a line on the point light source circuit board.

Recently, in order to obtain high brightness, a light emitting diode having a larger size and excellent performance than a general light emitting diode is used. However, such a high brightness light emitting diode is a heat generation problem is important to heat dissipation efficiently. To this end, a high brightness light emitting diode is mounted on a point light source circuit board coated with a metal layer. In such a structure, the metal layer and the metal member make an ideal contact, and the point light source circuit board is coupled to the storage container by fastening screws to make the structure strong against external impact.

However, as the size of the liquid crystal panel increases, the number of screws to be used also increases, which takes a long time in the assembling process, thereby degrading workability and production efficiency.

An object of the present invention is to provide a display device with improved heat dissipation efficiency and workability.

The above object is, according to the present invention, a liquid crystal panel; At least one point light source circuit board disposed on a rear surface of the liquid crystal panel and having a plurality of through holes formed therein; A plurality of point light sources mounted in a line on the point light source circuit board and irradiating light to the liquid crystal panel; A storage container accommodating a point light source circuit board and having a plurality of fastening holes corresponding to the through holes; A display device comprising a plurality of hook members for coupling a point light source circuit board to a storage container.

Here, the hook member may include a plate-shaped support body and a hook portion protruding from the support body toward the storage container.

The support body is in surface contact with the point light source circuit board, and the hook part may be hooked to the fastening hole through the through hole.

In addition, the through hole is provided along the edge of the point light source circuit board, the point light source may be mounted in the center region of the point light source circuit board.

Here, at least one surface of the point light source circuit board may be coated with a metal layer.

In addition, a heat dissipation sheet for dissipating the point light source is provided between the storage container and the point light source circuit board, and a plurality of through holes corresponding to the fastening holes may be formed in the heat dissipation sheet.

In addition, the heat dissipation sheet may be conductive.

Here, the plurality of hook members may be arranged in a line along the longitudinal direction of the point light source circuit board.

The support body may be provided in a size corresponding to the width in the longitudinal direction of the point light source circuit board.

In addition, the point light source may include a light emitting diode, and the light emitting diode may be 1 Watt or more.

The point light source includes a light emitting diode, and the light emitting diode may be 1 watt or more.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

In the following embodiments, the point light source will be described using the light emitting diode as an example, but the point light source of the present invention is not limited to the light emitting diode.

In various embodiments, like reference numerals refer to like elements, and like reference numerals refer to like elements in the first embodiment and may be omitted in other embodiments.

A liquid crystal display according to a first embodiment of the present invention will be described with reference to FIGS. 1 is an exploded perspective view of a liquid crystal display according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view of the liquid crystal display according to the first embodiment of the present invention.

The liquid crystal display device 1 includes a liquid crystal panel 20, a light adjusting member 30 sequentially positioned on the rear surface of the liquid crystal panel 20, a reflecting plate 40, a light emitting diode circuit board 51, and a light emitting diode circuit. The light emitting diode 60 is mounted on the substrate 51 and positioned at the light emitting diode receiving opening 41 of the reflecting plate 40. Here, the liquid crystal panel 20, the light adjusting member 30, and the light emitting diode circuit board 51 are accommodated in the fixed container 10 and the storage container 80.

The liquid crystal panel 20 bonds a thin film transistor substrate 21 on which a thin film transistor is formed, a color filter substrate 22 facing the thin film transistor substrate 21, and both substrates 21 and 22 to form a cell gap ( a sealant 23 forming a cell gap) and a liquid crystal layer 24 positioned between the substrates 21 and 22 and the sealant 23. In the first embodiment, the liquid crystal panel 20 is provided in a rectangular shape having long sides and short sides. The liquid crystal panel 20 forms a screen by adjusting the arrangement of the liquid crystal layer 24, but since the liquid crystal panel 20 is a non-light emitting device, light must be supplied from the light emitting diode 60 positioned on the rear surface of the liquid crystal panel 20. One side of the thin film transistor substrate 21 is provided with a driver 25 for applying a drive signal. The driver 25 includes a printed circuit board (PCB) connected to the other side of the flexible printed circuit board (FPC) 26, the driving chip 27 mounted on the flexible printed circuit board 26, and the flexible printed circuit board 26. 28). The driver 25 illustrated represents a chip on film (COF) method, and other known methods such as a tape carrier package (TCP) and a chip on glass (COG) may be used. In addition, the driver 25 may be formed on the thin film transistor substrate 21 during the wiring formation process.

The light adjusting member 30 disposed on the rear surface of the liquid crystal panel 20 may include a diffusion plate 31, a prism film 32, and a protective film 33.

The diffusion plate 31 is composed of a coating layer including a base plate and beads of beads formed on the base plate. The diffusion plate 31 diffuses the light supplied from the light emitting diode 60 to make the luminance uniform. The prism film 32 is formed with a triangular prism-shaped prism on the upper surface. The prism film 32 collects light diffused from the diffuser plate 31 in a direction perpendicular to an arrangement plane of the upper liquid crystal panel 20. Two prism films 32 are usually used, and the micro prisms formed on the prism films 32 are at an angle. The light passing through the prism film 32 is almost vertically progressed to provide a uniform luminance distribution. If necessary, a reflective polarizing film may be used together with the prism film 32, and only the reflective polarizing film may be used without the prism film 32. The protection film 33 positioned at the top protects the prism film 32 that is weak to scratches.

The reflecting plate 40 is provided on the light emitting diode circuit board 51 on which the light emitting diode 60 is not mounted. The reflecting plate 40 is provided with a light emitting diode receiving port 41 corresponding to the arrangement of the light emitting diodes 60. The reflector 40 serves to reflect light incident to the lower part and to supply the diffuser 31. The reflector 40 may be made of polyethylene terephthalate (PET) or polycarbonate (PC), and may be coated with silver or aluminum. In addition, the reflective plate 40 may be provided to be thicker so as not to be generated by the strong heat generated from the light emitting diodes 60.

The light emitting diode circuit boards 51 have a bar shape and eight are arranged side by side at equal intervals. The liquid crystal panel 20 has a rectangular shape, and the light emitting diode circuit board 51 has a longitudinal direction parallel to the long side of the liquid crystal panel 20. At least one surface of the light emitting diode circuit board 51 may be coated with a metal layer such as aluminum, or may be made of aluminum having excellent heat transfer rate as a main material. This is to emit heat to the outside by contacting the metal member of the light emitting diode 60 and the metal layer of the light emitting diode circuit board 51 because a lot of heat is generated in the light emitting diode (60). Although not shown, in order to facilitate heat dissipation, the liquid crystal display device 1 may further include a heat pipe, a heat dissipation fin, and a cooling fan. A plurality of through holes 52 are formed in the light emitting diode circuit board 51, and the through holes 52 are arranged in a line along the edge of the light emitting diode circuit board 51. The through hole 52 is used to couple the light emitting diode circuit board 51 to the storage container 80, and heat generated from the light emitting diode 60 is transferred to the storage container 80 through the light emitting diode circuit board 51. Emitted or removed during delivery.

The light emitting diode circuit board 51 is fastened to the storage container 80 by the hook member 55. Conventionally, the light emitting diode circuit board 51 is coupled to the storage container 81 by using a screw. However, the method using the screw takes a long time in the assembling process, thereby degrading workability and production efficiency. In the present invention, the light emitting diode circuit board 51 is hooked to the storage container 80 using the hook member 55 instead of the screw. The hook member 55 according to the present invention includes a plate-shaped support body 56 and a hook portion 57 protruding from the support body 56 toward the storage container 80. A plurality of hook members 55 are arranged in a line corresponding to the through holes 52 along the longitudinal direction of the light emitting diode circuit board 51, and the hooks 57 are pressed to press the hook members 55. Through 52 to be hooked to the fastening hole 81 provided in the storage container (80). As a result, the workability and productivity of the assembling process are improved by coupling the light emitting diode circuit board 51 to the storage container 80 through a snap method. In addition, the plate-shaped support body 56 is in surface contact with the light emitting diode circuit board 51, so that the light emitting diode circuit board 51 comes into close contact with the storage container 80. As a result, the contact area between the light emitting diode circuit board 51 and the storage container 80 is increased, thereby improving heat dissipation efficiency and providing a structure resistant to external impact. Such a hook member 55 may be a structure made of plastic.

The light emitting diodes 60 are mounted on the light emitting diode circuit board 51 and are disposed over the entire rear surface of the liquid crystal panel 20. The light emitting diodes 60 are arranged in a line in the center region of the light emitting diode circuit board 51. The light emitting diode 60 accommodates a chip 63 that emits light, a lead 64 connecting the chip 63 and the light emitting diode circuit board 51, and a lead 64 and surrounds the chip 63. The plastic mold 65 and the silicon 66 and the bulb 67 positioned on the chip 63 are included. The bulb 66 may be made of polymethmethylacrylate (PMMA). According to the shape of the bulb 67, the light emitting diode 60 is divided into a side emitting method for emitting light mainly to the side and a top emmiting method for emitting light mainly to the top. The double side emitting method has excellent color uniformity but low luminance. On the other hand, the top emitting method has high brightness but low color uniformity. In the present invention, since the color uniformity is improved by changing the arrangement of the light emitting diodes 60, it is preferable to increase the luminance using the light emitting diodes 60 of the top emitting method. Although not shown, the light emitting diodes 60 may be mounted on the light emitting diode circuit board 51 while forming a light emitting diode group including three light emitting diodes 60. In this case, the light emitting diode group may include one red light emitting diode, one green light emitting diode, and one blue light emitting diode. In addition, the light emitting diode 60 may use one or more watts for high brightness.

A heat dissipation sheet 70 may be further included between the light emitting diode circuit board 51 and the storage container 80. A plurality of through holes 71 corresponding to the fastening holes 81 are formed in the heat dissipation sheet 70, and may have conductive properties for heat dissipation. The heat dissipation sheet 70 improves heat dissipation efficiency by widening the contact area between the light emitting diode circuit board 51 and the storage container 80 and making heat transfer smooth.

The light adjusting member 30, the reflecting plate 40, the light emitting diode circuit board 51, the light emitting diode 60, and the like are accommodated in the storage container 80. The storage container 80 is provided with a plurality of fastening holes 81 corresponding to the through holes 52. The fastening hole 81 is hooked with the hook part 57, and heat generated from the light emitting diode 60 is transferred to the storage container 80 through the light emitting diode circuit board 51 and the heat dissipation sheet 70 to radiate heat. do.

Hereinafter, a second embodiment of the present invention will be described with reference to FIG. In the second embodiment, only characteristic details distinguished from the first embodiment will be described. For the convenience of description, like reference numerals refer to like elements.

Figure 3 is a view for explaining a second embodiment according to the present invention, a perspective view of the main portion of the hook member. As shown in FIG. 3, the hook member 55 according to the second embodiment is provided with a size corresponding to the width of the light emitting diode circuit board 51 in the longitudinal direction and has a plate-shaped support body 56 extending in one direction. And a plurality of hooks 57 extending from the support body 56 toward the storage container 80 and provided to correspond to the fastening holes 81. As a result, the workability and production efficiency of the assembly process are improved.

On the other hand, although not shown, by providing a hook portion on the back of the light emitting diode circuit board 51 can improve the workability and production efficiency of the assembly process. In this way, by manufacturing the hook portion and the light emitting diode circuit board 51 integrally, it is possible to reduce the effort of separately managing the hook member 55, and workability and production efficiency are improved.

Although some embodiments of the invention have been shown and described, it will be apparent to those skilled in the art that modifications may be made to the embodiment without departing from the spirit or spirit of the invention. . It is intended that the scope of the invention be defined by the claims appended hereto and their equivalents.

As described above, according to the present invention, a display device having improved heat dissipation efficiency and workability is provided.

Claims (11)

A liquid crystal panel; At least one point light source circuit board disposed on a rear surface of the liquid crystal panel and having a plurality of through holes formed therein; A plurality of point light sources mounted on the point light source circuit board in a row to irradiate light to the liquid crystal panel; A storage container accommodating the point light source circuit board and having a plurality of fastening holes corresponding to the through holes; And a plurality of hook members coupling the point light source circuit board to the housing. The method of claim 1, The hook member includes a plate-shaped support body and a hook portion protruding from the support body toward the storage container. The method of claim 2, And the support body is in surface contact with the point light source circuit board, and the hook part passes through the through hole and is hooked to the fastening hole. The method of claim 3, The through hole is provided along an edge of the point light source circuit board, and the point light source is mounted in a center region of the point light source circuit board. The method of claim 4, wherein At least one surface of the point light source circuit board is coated with a metal layer. The method of claim 5, A heat dissipation sheet for dissipating the point light source is provided between the storage container and the point light source circuit board. And a plurality of through holes corresponding to the fastening holes are formed in the heat dissipation sheet. The method of claim 6, And the heat dissipation sheet is conductive. The method according to claim 5 or 7, And a plurality of the hook members are arranged in a line along the longitudinal direction of the point light source circuit board. The method according to claim 5 or 7, And the support body is provided with a size corresponding to a width in the longitudinal direction of the point light source circuit board. The method of claim 8, The point light source includes a light emitting diode, wherein the light emitting diode is one or more watts. The method of claim 9, The point light source includes a light emitting diode, wherein the light emitting diode is one or more watts.

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