KR20060125225A - Heat radiating structure of ic in pdp - Google Patents

Abstract

A heat radiating structure of an IC of a PDP is provided to transmit heat from a circuit element through a conductive member to a chassis by using the conductive member coupled with the chassis. A conductive member(100) is installed on a boss(20) of a chassis base(30). A circuit board(10) for installing a drive IC for radiating heat is installed on the boss of the conductive member in order to connect electrically the drive IC to the circuit board and to attach the drive IC on the conductive member. The drive IC is attached on the conductive member by using an adhesive. The drive IC is attached on the conductive member by adding a heat conducting sheet onto the circuit board attached on the conductive member.

Description

Heat radiating structure of IC in PDP

1 and 2 are cross-sectional views showing a cross section of a heat sink generally used.

3 is a plan view generally showing a heat sink attached to a scan IC connected to a circuit board.

4 is a cross-sectional view showing a heat sink attached to an IC generally connected to a circuit board.

5 is a cross-sectional view showing a heat sink attached to a hybrid IC generally connected to a circuit board.

6 is a cross-sectional view for explaining a first embodiment of a heat radiation structure of a circuit element of the plasma display panel according to the present invention.

7 is a cross-sectional view for explaining a second embodiment of the heat radiation structure of the circuit element of the plasma display panel according to the present invention.

8 is a cross-sectional view for explaining a third embodiment of the heat radiation structure of the circuit element of the plasma display panel according to the present invention.

9 is a cross-sectional view for explaining a fourth embodiment of the heat radiation structure of the circuit element of the plasma display panel according to the present invention.

10 is a cross-sectional view for explaining a fifth embodiment of the heat radiation structure of the circuit element of the plasma display panel according to the present invention.

11 is a perspective view illustrating a plasma display panel assembly to which the present invention is applied.

<Description of main parts of drawing>

3, 3 ', 13 ... IC circuitry 4 ... Driver

5.lead wire 10 ... circuit board

13 ... Hybrid IC 15 ... Heat Conductor Sheet

20, 20 '... Boss 30 ... Chassis Base

100 ... conductive support member 120, 120 '... thermally conductive sheet

The present invention relates to a heat dissipation structure of a circuit element of a plasma display panel, and more particularly, by using a conductive member capable of supporting and forming a boss at an assembly position of the circuit board when attaching the circuit elements to the circuit board in the PDP. A heat dissipation structure of a circuit element of a plasma display panel.

Typically, a plasma display panel assembly forms predetermined discharge electrodes on opposite surfaces of a plurality of substrates, and injects a discharge gas into a closed discharge space between the substrates. The flat display device is a flat display device that implements an image by using light emitted by exciting a fluorescent material of a phosphor layer by ultraviolet rays generated in a discharge space by applying power.

The plasma display assembly fabricates a front panel and a rear panel, respectively, and couples them to each other, couples the chassis base to the rear of the panel assembly, and transmits an electrical signal to the panel assembly behind the chassis base (driver IC) ) And attach them to the case.

PDP circuit elements generate a lot of heat, and especially IC types (scan ICs, hybrid ICs, etc.) and FET devices cause malfunctions when heat generated is not properly radiated. Therefore, a heat sink as shown in Figs. 1 and 2 is attached to this element to dissipate heat generated from this element.

As shown in FIG. 3, the heat sink 1 of FIG. 1 is attached to the scan IC 3 ′ on the circuit board 10 with an adhesive to radiate heat generated from the scan IC 3 ′ into the air.

As shown in FIG. 4, the heat sink 2 of FIG. 2 is attached to the various circuit ICs 3 electrically connected to the circuit board 10 by the lead pins 5 and is generated from the ICs 3. Dissipate heat into the air. In FIG. 4, the circuit board 10 is fixed to the boss 20 fixed to the chassis base 30. As a result, as described above, it is difficult to properly hold the chassis switch of the chassis base in a circuit board manufactured differently for each manufacturer.

5 illustrates an example in which the hybrid IC 13 is attached to the circuit board 10. The hybrid IC 13 is an IC which produces wirings, resistors, capacitors, and the like by a thick film technology on a substrate on which a diode, a transistor, etc. are made by semiconductor technology. Thick-film hybrid IC technology was first adopted in the interconnection circuit of the IBM 360 computer in 1963. Since then, it has proved to be excellent in high reliability, high voltage resistance, high power, and environmental resistance. It is establishing itself as an important field. As shown in FIG. 5, the hybrid IC 13 is attached to the circuit board 10, and the heat conductive sheet 15 and the heat dissipation means 16 are attached thereto again to dissipate heat from the hybrid IC 13. have.

At this time, in order to supply modules to different set makers, circuit boards are being developed for each set maker. Since the assembly positions of these circuit boards are different, it is difficult to hold the chassis switch of the chassis base accordingly. Follow. In addition, when attaching a heat sink or the like to the circuit element, it is pointed out that the volume is large, or the work process and reliability are difficult.

It is an object of the present invention to provide a heat dissipation structure of a circuit element of a plasma display panel capable of dissipating heat generated from a circuit element without a separate heat dissipation means.

Another technical problem to be achieved by the present invention is that the heat dissipation means can be made slimmer PDP, and the circuit board itself acts as a soundproofing plate to reduce the driving noise generated in the circuit elements, heat dissipation of the circuit elements of the plasma display panel The purpose is to provide a structure.

Another technical problem to be achieved by the present invention is to develop a circuit board for each set company to supply modules to different set companies, even if the assembly position of the circuit board is different, the boss position on the conductive member It is an object of the present invention to provide a heat dissipation structure of a circuit element of a plasma display panel that is compatible with a set company that applies various circuit boards.

In order to achieve the above technical problem, the present invention provides a conductive member on a boss on a chassis base in a heat dissipation structure of a circuit element of a plasma display panel, and a circuit board for driving IC installation on a boss on the conductive member. A heat dissipation structure of a circuit element of a plasma display panel is provided which not only electrically connects a driving IC which generates heat, but also attaches it to the conductive member.

Preferably, the heat generating driving IC is attached to the conductive member with an adhesive.

Preferably, the heat generating driving IC is attached via the conductive member and the thermal conductive sheet.

Preferably, the heat generating driving IC is attached to the circuit board attached to the conductive member via a heat conductive sheet.

Preferably, the heat generating scan driving IC or hybrid IC is electrically connected under the circuit board and attached to the conductive member.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and operation of a preferred embodiment of the heat radiation structure of the circuit element of the plasma display panel of the present invention.

First, before describing the heat dissipation structure of the plasma display panel of the present invention, the assembly of the plasma display to which the present invention is applied will be described in order to understand the present invention.

11 illustrates a plasma display assembly 200. In FIG. 11, the plasma display assembly 200 includes a panel assembly 210, a chassis base 230 coupled with the panel assembly 210, and a driving circuit board 290 coupled with the chassis base 230. ), A flexible printed cable 250 electrically connecting the panel assembly 210 and the driving circuit board 290, a filter assembly 260 installed in front of the panel assembly 210, A housing 270 is included.

The panel assembly 210 includes a front panel 211 and a back panel 212 coupled with the front panel 211, wherein the front panel 211 is patterned on the front substrate and the front substrate. An X and Y electrode, a dielectric layer filling the X and Y electrodes, and a protective layer coated on the surface of the dielectric layer, wherein the back panel 212 crosses the back substrate and the X and Y electrodes on the back substrate. The address electrode patterned in the direction, a dielectric layer filling the address electrode, a partition wall disposed between the front substrate and a discharge space, and a red, green, and blue phosphor layer coated inside the partition wall; have.

The chassis base 230 is coupled to the rear of the panel assembly 210. The panel assembly 210 and the chassis base 230 includes at least one heat dissipation sheet 221 and a double-sided tape 222 disposed along an edge of the heat dissipation sheet 221. In addition, a heat dissipation means 310 having a heat sink 340 is interposed between the heat dissipation sheet 221 and the double-sided tape 222.

The chassis base 230 is a plate made of a metal having excellent heat dissipation, and a driving circuit board 290 is provided on a rear surface of the chassis base 230. A plurality of electronic components 291 are mounted on the driving circuit board 290.

In addition, the chassis base 230 is provided with a chassis reinforcing member 320 in the form of a strip in order to reinforce its strength, or is disposed to be spaced apart from the chassis base 230 by a predetermined interval to cover the upper and lower ends of the cover plate 240 It may be further provided.

The flexible printed cable 250 is disposed between the chassis base 230 and the cover plate 240. Both ends of the flexible printed cable 250 electrically connect each electrode terminal of the panel assembly 210 and the driving circuit board 290 to each other.

The filter assembly 260 is installed in front of the panel assembly 210. The filter assembly 260 is installed to block reflection of electromagnetic waves generated from the panel assembly 210, infrared rays, neon light emission, or external light.

An anti-reflection film is attached to the filter assembly 260 to prevent visibility deterioration due to reflection of external light on a transparent substrate, and an electromagnetic shielding layer is provided to effectively block electromagnetic waves generated while driving the panel assembly 210. The selective wavelength absorbing film is formed in order to shield unnecessary light emission of near infrared rays by plasma of an inert gas used for neon light emission and screen light emission.

The panel assembly 210, chassis base 230, drive circuit board 290, and filter assembly 260 are housed in a case 270. The case 270 includes a front cabinet 271 installed at the front of the filter assembly 260 and a back cover 272 installed at the rear of the driving circuit board 290. A plurality of vent holes 273 are formed at upper and lower ends of the back cover 272.

On the other hand, the filter holder 280 is provided on the back of the filter assembly 210. The filter holder 280 has a press portion 281 for pressing the filter assembly 260 against the front cabinet 271 and a direction in which the panel assembly 210 is disposed from the press portion 281. It includes a bent fixing portion (282).

In addition, a filter mounting portion 330 is provided at the rear edge of the front cabinet 271. The filter mounting part 330 is positioned to face the fixing part 282 and fixes the filter assembly 280 to the front cabinet 271 by screwing.

As described above, the driving circuit board on the chassis base is provided with a number of circuit elements in a narrow space, there is a problem of heat dissipation and space arrangement.

The heat dissipation structure of the circuit element of the plasma display panel of the present invention is applied in various embodiments as shown in Figs.

6 is a cross-sectional view for explaining a first embodiment of a heat radiation structure of a circuit element of the plasma display panel according to the present invention.

In FIG. 6, in the heat dissipation structure of the circuit element of the plasma display panel according to the first embodiment of the present invention, the conductive member 100 is installed on the chassis base 30 through the boss 20 and the conductive member 100 is provided. The circuit board 10 is installed on the circuit board 10 through the boss 20 ′, and the circuit device 3 is installed on the circuit board 10. In this case, a driving device such as a FET that generates a lot of heat ( 4 is attached to the conductive member 100 using a heat dissipating adhesive, and the connecting pin 5 of the driving element 4 is connected to the circuit board 10. In this way, the IC 4, which generates a lot of heat, is directly attached to the conductive member 100 so that heat dissipation is well performed, and the product becomes slim overall without the need for a separate heat dissipation means such as a heat sink. Is simplified. Here, the adhesive 110 uses a Shin-Etsu silicone adhesive, a thermal grease or the like.

7 is a cross-sectional view for explaining a second embodiment of the heat radiation structure of the circuit element of the plasma display panel according to the present invention.

In FIG. 7, the heat dissipation structure of the circuit element of the plasma display panel according to the second embodiment of the present invention is provided with the conductive member 100 on the chassis base 30 through the boss 20 as in the first embodiment. The circuit board 10 is installed on the conductive member 100 through the boss 20 ', and the circuit device 3 is installed on the circuit board 10. In this case, a lot of heat is generated. The driving device 4, such as a FET, is attached to the conductive member 100 via a thermal conductive sheet 120 between the driving device 4 and the conductive member 100, and the connecting pins of the driving device 4 ( 5) is a structure connected to the circuit board 10. In this way, a large amount of heat generated IC (4) is attached to the conductive member 100 is not only good heat dissipation, but also the product is slim overall without the need for a separate heat dissipation means such as heat sink, simplifying the manufacturing process do.

8 is a cross-sectional view for explaining a third embodiment of the heat radiation structure of the circuit element of the plasma display panel according to the present invention.

In FIG. 8, the heat dissipation structure of the circuit element of the plasma display panel according to the third embodiment of the present invention is the conductive member 100 through the boss 20 on the chassis base 30 as in the first embodiment. The circuit board 10 is installed on the conductive member 100 through the boss 20 ', and the circuit device 3 is installed on the circuit board 10. In this case, heat A driving device 4 such as a FET that is frequently generated attaches the circuit board 10 directly to the conductive member 100 and attaches the driving device 4 to the conductive member 100 via the thermal conductive sheet 120 thereon. The connecting pin 5 of) is connected to the circuit board 10. In this way, the IC 4, which generates a lot of heat, is directly attached to the conductive member 100 so that the heat dissipation is good, and the product becomes slim overall without the need for a separate heat dissipation means such as a heat sink. Is simplified.

9 is a cross-sectional view for explaining a fourth embodiment of the heat radiation structure of the circuit element of the plasma display panel according to the present invention.

In FIG. 9, the heat dissipation structure of the circuit element of the plasma display panel according to the fourth embodiment of the present invention is provided with the conductive member 100 on the chassis base 30 through the boss 20 as in the first embodiment. The circuit board 10 is installed on the conductive member 100 through the boss 20 ', and the circuit device 3' is installed on the circuit board 10. At this time, the scan IC 3 '), The IC (3') attached to the circuit board 10 is directed to the conductive member 100, and then the thermal conductive sheet (H) to have a certain gap to prevent the short circuit (SHORT) of other circuit components 120 ') to dissipate heat. In particular, the driving element 3 'such as a scan IC that generates a lot of heat is directly attached to the circuit board 10 and attached to the conductive member 100 via the thermal conductive sheet 120' thereon. Of course, the product becomes slim overall without the need for a separate heat dissipation means such as a heat sink, and the manufacturing process is simplified.

10 is a cross-sectional view for explaining a fifth embodiment of the heat radiation structure of the circuit element of the plasma display panel according to the present invention.

In FIG. 10, the heat dissipation structure of the circuit element of the plasma display panel according to the fifth embodiment of the present invention is provided with the conductive member 100 on the chassis base 30 through the boss 20 as in the first embodiment. The circuit board 10 is installed on the conductive member 100 through the boss 20 ', and the circuit device 3' is installed on the circuit board 10. At this time, the scan IC 3 '), The IC (3') attached to the circuit board 10 is directed toward the conductive member 100, in the case of the hybrid IC 13, a certain gap to prevent the short circuit (SHORT) of other circuit components The thermal conductive sheet 120 'is inserted into the conductive member 100 to dissipate heat so as to have a heat dissipation. In particular, the driving element 13 such as a hybrid IC, which generates a lot of heat, is directly attached to the circuit board 10 and attached to the conductive member 100 via the thermal conductive sheet 120 'on the opposite side, so that heat is radiated well. Of course, the product becomes slim overall without the need for a separate heat dissipation means such as a heat sink, and the manufacturing process is simplified.

As described above, the heat dissipation structure of the circuit element of the plasma display panel of the present invention is generated in the circuit element through such a conductive member by using a conductive member capable of supporting and supporting a boss at an assembly position of each circuit board. Since heat is transferred, and the conductive member is coupled to the chassis, heat is transferred to the chassis to radiate heat, so that the heat dissipation effect is large and cooling of the driving element that generates heat can be efficiently performed without using a separate heat sink. .

Claims (5)

In the heat radiation structure of the circuit element of the plasma display panel, A conductive member is installed on the boss on the chassis base, and a driver IC mounting circuit board is installed on the boss on the conductive member, so that the heat generating drive IC is not only electrically connected to the circuit board but also attached to the conductive member. The heat radiation structure of the circuit element of the plasma display panel. The heat dissipation structure of a circuit element of a plasma display panel according to claim 1, wherein the heat generating driving IC is attached to the conductive member with an adhesive. The heat dissipation structure of a circuit element of a plasma display panel according to claim 1, wherein the heat generating driving IC is attached via the conductive member and the thermal conductive sheet. The heat dissipation structure of a circuit element of a plasma display panel according to claim 1, wherein the heat generating driving IC is attached to a circuit board attached to the conductive member via a heat conductive sheet. The heat dissipation structure of a circuit element of a plasma display panel according to claim 1, wherein the heat generating scan driving IC or hybrid IC is electrically connected under the circuit board and attached to the conductive member.

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