KR20050113889A - Wafer packing jar - Google Patents

Abstract

FIELD OF THE INVENTION The present invention relates to a wafer packaging container, comprising: a wafer packaging container comprising a lower container and an upper container, the lower container having a base, a cylindrical sidewall disposed on the base, and outside the cylindrical sidewall; And a coupling member protruding upward on the base, wherein the upper container includes a cap, a container wall formed downwardly around the cap, and a coupling groove into which the coupling member can be inserted. According to this, since the lower container and the upper container are coupled in a latch manner, scratches of the wafer surface are eliminated. In addition, by adopting the inclined cylinder sidewall structure, wafer loading and detachment are easy and the phenomenon of wafer breakage is also eliminated.

Description

Wafer Packaging Containers {WAFER PACKING JAR}

The present invention relates to a wafer packaging container, and more particularly, to a container for packaging a wafer during long distance transportation of the wafer.

When it is necessary to transport the wafer itself, a packaging means is needed to hold the wafer. Especially in the case of a foreigner who has a long distance from where to transport the wafer, the wafer may have many damage factors such as impact, contamination, scratch, temperature and humidity, and environmental change when the wafer is transported through a vehicle such as an aircraft. There is a need for packaging means capable of keeping the product in its initial state.

The packing jar is a commonly used packaging means. Currently used packings use many types of polypropylene boxes, either square or circular, depending on the size of the wafer. However, the packing itself does not have a configuration to protect the wafer against impact, and is used by supplementing polyethylene foam, which is a general shock absorber. In addition, since the packing itself does not prevent external moisture from penetrating even when closed, the wafer is directly contained in a shielding bag. The shield bag is made of a semi-transparent bag that seals the wafer and seals it, and has a layer structure of polyester, metal foil, and polyethylene to prevent shock due to static electricity.

Conventional wafer packaging jars will be described with reference to FIGS.

Referring to FIG. 1, a conventional wafer packaging container is divided into a lower container 10 and an upper container 20. The lower container 10 has a square base 12 and a cylinder side wall 14 fixed to the base 12. The upper container 20 includes a rectangular cap 22 and a container wall 24 extending downward from an edge of the cap 22 so as to correspond to the square base 12. The container wall 24 forms a side wall of the entire rectangular box-shaped container formed in a state where the lower container 10 and the upper container 20 are bound together. The combination of the lower container 10 and the upper container 20 is a method of rotating and covering the upper container (20). In addition, wafer inserts of various materials were used to protect the surface by the friction between the wafer and the wafer when the wafer was loaded.

However, in the conventional wafer packaging container, since the upper container 20 and the lower container 10 are combined in a rotating manner as described above, the wafer and the wafer protection sheet may rotate together. As a result, scratches were generated on the wafer surface, leading to wafer defects. In addition, as shown in FIG. 3, the cylinder sidewall 14 is vertical, which makes it difficult to load and detach the wafer. In some cases, the wafer may be broken.

Accordingly, the present invention has been made to solve the above-described problems in the prior art, an object of the present invention to provide a wafer packaging container capable of safely transporting the wafer.

Wafer packaging container according to the present invention for achieving the above object is characterized in that it is coupled in a latched manner away from the conventional rotation method. In addition, the cylinder sidewall structure is improved to eliminate wafer breakage during wafer loading and removal.

A wafer packaging container according to an aspect of the present invention capable of implementing the above features comprises: a wafer packaging container including a lower container and an upper container, wherein the lower container includes a base, a cylindrical sidewall disposed on the base, And a coupling member protruding upward from the cylindrical sidewall and on the base, wherein the upper container includes a cap, a container wall formed downwardly around the cap, and a coupling groove into which the coupling member can be inserted. Characterized in that it comprises a.

In this embodiment, the coupling member is arranged in plural at equal intervals around the outer circumference of the lower container, the coupling groove is disposed in a position to match the coupling member. The coupling member is disposed at each of the four corners of the lower container, and the coupling groove is disposed at each of the four corners of the upper container, which is a position to be mated with the coupling member. The coupling member has a protrusion facing laterally to be caught in the coupling groove. An inner surface of the cylindrical sidewall is inclined to ensure a margin between the loaded wafer and the inner surface. The cylindrical side wall has a plurality of open areas in the lateral direction. The plurality of open areas are spaced radially at the same angle. The cap has a groove to receive the upper side of the cylinder side. The upper container has a loading guide, and the lower container has a loading groove into which the loading guide is fitted.

The wafer packaging container according to another aspect of the present invention capable of realizing the above characteristics has a base and a plurality of regions disposed on the base and opened radially at equal intervals in the lateral direction, and are inclined such that there is a margin between the loaded wafers. A lower container comprising a cylindrical sidewall in the form and a coupling member outside the inclined cylindrical sidewall and protruding upwards on the base, the upper end having a laterally facing projection; And a cap, a groove formed on the inner surface of the cap to accommodate the upper end of the cylindrical sidewall, a container wall formed downwardly around the cap, and a position where the protrusion of the coupling member is fitted into the coupling member so that the protrusion can be fixedly inserted. Characterized in that it comprises an upper container including a coupling groove in the.

In this embodiment, one coupling member is disposed at each of the four corners of the lower container, and one coupling groove is disposed at each of the four corners of the upper container, which is a position to be engaged with the coupling member. The upper container has a loading guide, and the lower container has a loading groove into which the loading guide is fitted.

According to the present invention, since the lower container and the upper container are coupled in a latch manner, scratches of the wafer surface are eliminated. In addition, the inclined cylinder sidewall structure facilitates wafer loading and desorption and eliminates wafer breakage. As a result, the wafer can be safely stored, even during long distance transportation of the wafer.

Hereinafter, a wafer packaging container according to the present invention will be described in detail with reference to the accompanying drawings.

Advantages over the present invention and prior art will become apparent through the description and claims with reference to the accompanying drawings. In particular, a device for manufacturing a semiconductor device according to the present invention is well pointed out and claimed in the claims. However, the apparatus for manufacturing a semiconductor device according to the present invention can be best understood by referring to the following detailed description with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements throughout the various drawings.

Figure 4 is a plan view showing a lower container of the wafer packaging container according to the present invention, Figure 5 is a cross-sectional view showing a lower container of the wafer packaging container according to the present invention, Figure 6 is an upper portion of the wafer packaging container according to the present invention It is a top view which shows the container. 7 is a cross-sectional view showing a bonded state of the wafer packaging container according to the present invention, Figure 8 is a cross-sectional view showing a loading state of the wafer packaging container according to the present invention.

(Example)

The wafer packaging container according to the present invention is largely divided into a lower container and an upper container. First, the lower container will be described, and then the upper container will be described.

4 and 5, the lower container 100 includes a base 120 made of a synthetic resin material, and a cylinder sidewall 140 integrally formed on the base 120. The inner diameter D of the cylinder formed by the cylinder sidewall 140 has the same diameter of the wafer to be loaded. For example, if the diameter of the wafer to be loaded is 12 inches, the inner diameter D of the cylinder is about 12 inches. The base 120 forms an octagonal plate shape, but may alternatively be a square plate shape or a circular plate shape.

On the other hand, the inner diameter of the inner surface of the cylinder side wall 140 is formed to increase toward the upper, that is, the cylinder side wall 140 is inclined structure. Since the inclined cylinder sidewall 140 has a sufficient margin between the wafer and the cylinder sidewall 140, the wafer can be easily loaded into the cylinder sidewall 140 or the removable wafer can be easily removed. In addition, the cylinder side wall 140 is open at about six places without being connected to one. These open areas are spaced at equal intervals, for example radially 60 degrees apart. It is convenient to use this open area when loading or removing wafers using manual or automated equipment. In addition, since there are several open areas, it is possible to immediately respond to the operation of a device such as a robot. The number of open areas is arbitrary.

The lower container 100 is formed with a pin 160 that protrudes out of the cylinder sidewall 140 and upwards of the base 120. The pins 160 are disposed at equal intervals around the outer circumference of the lower container 100. For example, the pin 160 may be provided at four locations corresponding to the corners of the lower container 100. The pin 160 is a coupling member that is inserted into and fixed to a groove provided in the upper container to be described later, and an upper end fitted into the groove has a form that can be caught by the groove, for example, a side protruding portion 160a. In addition, the pin 160 may be made of a flexible material so as to conveniently couple or release the upper container 200 to the lower container 100.

Referring to FIG. 6, the upper container 200 includes a cap 220 formed in the same shape as the base 120, that is, an octagonal plate shape so as to correspond to the base 120 of the lower container 100, and the cap 220. It consists of a container wall 240 extending downward from the edge. The wall 240 of the container forms a side wall of the entire octagonal box-shaped container formed in a state where the upper container 200 and the lower container 100 are coupled to each other.

The cap 220 is formed with a groove 270 for receiving one end of the cylinder side wall 140 of the lower container 100. The number and location of the grooves 270 corresponds to the number and location of the cylinder sidewalls 140. Therefore, when the lower container 100 and the upper container 200 are coupled, the upper end of the cylinder sidewall 140 is received in the groove 270. The container sidewall 240 is matched with the upper surface of the base 120. In some cases, a tape (not shown) for sealing may be glued over a certain width of the base 120 and a width of the container wall 240.

In addition, a groove 260 is provided as a coupling portion into which the pin 160 of the lower container 100 can be inserted. The position of the coupling groove 260 is where it is matched with the position of the pin 160 provided in the lower container (100). That is, the pins 160 are disposed at four locations corresponding to the corner portions of the upper container 200. Therefore, as shown in FIG. 7, the protrusion 160a of the pin 160 is inserted into the coupling groove 260 so that the upper container 200 is coupled to the lower container 100. Here, although the size of the coupling groove 260 and the protrusion 160a are almost the same, the protrusions 160a may be inserted into the coupling groove 260 as well as the inserted protrusions may escape again. Since the size of the coupling groove 260 should be slightly larger than the size of the protrusion (160a).

On the other hand, as shown in Figure 6, the edge portion of the upper container 200 may be further formed with a protruding guide 280 forming an octagonal shape, such as the rim of the upper container 200. And, as shown in Figure 4, the bottom bottom of the container 100 may be further formed with an recessed groove 180 forming an octagon in which the guide 280 can be fitted. Thus, when stacking several wafer packaging containers, the guide 280 of another wafer packaging container is fitted into the groove 180 of the lower container 100 of one wafer packaging container. As a result, the separation between the wafer packaging containers does not occur when the wafer packaging container is loaded, and as a result, the stacking stability of the wafer packaging container can be achieved.

Wafer loading using the container of the present invention is as follows. When the wafer is loaded into the cylinder wall 140 installed in the lower container 100, first, a disk-shaped buffer material having the same diameter is filled, for example, a sponge or a plurality of amorphous sponges. Then, the wafer is seated and the buffer material is loaded on the wafer again. Next, the upper container 200 is sealed in a latched manner in accordance with the lower container 100 and sealed with a tape. Therefore, breakage due to surface scratches or impact that may occur in the movement of the wafer loaded inside the cylinder sidewall 140 may be effectively prevented.

The foregoing detailed description illustrates the present invention. In addition, the foregoing description merely shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. And, it is possible to change or modify within the scope of the concept of the invention disclosed in this specification, the scope equivalent to the written description, and / or the skill or knowledge in the art. The above-described embodiments are for explaining the best state in carrying out the present invention, the use of other inventions such as the present invention in other state known in the art, and the specific fields of application and uses of the present invention. Various changes are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

As described in detail above, according to the wafer packaging container according to the present invention, since the lower container and the upper container are coupled in a latch manner, the phenomenon of scratching the wafer surface is eliminated. In addition, by adopting the inclined cylinder sidewall structure, wafer loading and detachment are easy and the phenomenon of wafer breakage is also eliminated. As a result, there is an effect that the wafer can be safely stored even during long distance transportation of the wafer.

1 is a plan view showing a lower container of a wafer packaging container according to the prior art;

Figure 2 is a plan view of the upper container of the wafer packaging container according to the prior art.

3 is a cross-sectional view of a lower container of a wafer packaging container according to the prior art.

Figure 4 is a plan view showing the lower container of the wafer packaging container according to the present invention.

5 is a cross-sectional view showing a lower container of a wafer packaging container according to the present invention.

Figure 6 is a plan view of the upper container of the wafer packaging container according to the present invention.

7 is a cross-sectional view showing a bonded state of the wafer packaging container according to the present invention.

8 is a cross-sectional view showing a loaded state of the wafer packaging container according to the present invention.

<Description of Symbols for Major Parts of Drawings>

100; Lower container 120; Base

140; Cylindrical sidewalls 160; Coupling Member (Pin)

160a; Protrusion 180 of the pin; Loading groove

200; Upper container 220; cap

240; Vessel sidewall 260; Combined groove

270; Cylindrical sidewall receiving grooves 280; Loading guide

Claims (12)

A wafer packaging container comprising a lower container and an upper container, The lower container includes a base, a cylindrical sidewall disposed on the base, and a coupling member protruding upwardly on and out of the cylindrical sidewall, And wherein the upper container includes a cap, a container wall formed downwardly around the cap, and a coupling groove into which the coupling member can be inserted. The method of claim 1, And a plurality of coupling members are disposed at equal intervals around the outer circumference of the lower container, and the coupling groove is disposed at a position to be aligned with the coupling member. The method of claim 1, The coupling member is disposed in each one of the four corners of the lower container, the coupling groove is a wafer packaging container, characterized in that arranged in each of the four corners of the upper container which is a position to match the coupling member. The method according to claim 1, wherein Wafer packaging container, characterized in that the coupling member has a projection facing to the side to engage the coupling groove. The method of claim 1, An inner surface of the cylindrical sidewall is inclined so that a clearance between the loaded wafer and the inner surface is secured. The method according to claim 1 or 5, And the cylindrical sidewall has a plurality of open areas in the lateral direction. The method of claim 6, And the plurality of open areas are radially spaced at the same angle. The method of claim 1, And the cap has a groove for receiving the upper side of the cylinder side. The method of claim 1, And the upper container has a loading guide, and the lower container has a loading groove into which the loading guide is fitted. A base having a plurality of regions disposed on the base and spaced radially equally in the lateral direction and spaced apart from the wafer to be loaded thereon; A lower container protruding upward on the base, the upper end including a coupling member having a side facing protrusion; And A cap, a groove formed on the inner surface of the cap and accommodating an upper end of the cylindrical sidewall, a container wall formed downwardly around the cap, and a position in which the protrusion of the coupling member is mated with the coupling member An upper container including a coupling groove therein; Wafer packaging container comprising a. The method of claim 10, The coupling member is disposed in each one of the four corners of the lower container, the coupling groove is a wafer packaging container, characterized in that arranged in each of the four corners of the upper container which is a position to match the coupling member. The method of claim 10, And the upper container has a loading guide, and the lower container has a loading groove into which the loading guide is fitted.