KR102625679B1 - Loadlock module and substrate processing system having the same - Google Patents

Abstract

The present invention relates to a load lock module and a substrate processing system including the same.
The present invention is a load lock module 200 that transfers substrates between the outside at atmospheric pressure and the process module 100 where substrate processing is performed, forming a sealed internal space (S) and providing at least one pair of substrates for entry and exit. A load lock chamber 210 having a gate (T); a substrate support portion 220 installed in the load lock chamber 210 to support the substrate (G) introduced into the internal space (S); A gas injection unit 230 for injecting an inert gas into the internal space (S); a gas exhaust unit 240 for exhausting gas from the internal space (S); a heat exchange unit 270 for controlling the temperature of the substrate (G) introduced into the internal space (S); Disclosed is a load lock module 200 including a gate valve unit 250 that opens and closes the gate (T).

Description

Loadlock module and substrate processing system including the same {Loadlock module and substrate processing system having the same}

The present invention relates to a load lock module and a substrate processing system including the same.

A semiconductor substrate processing device that performs a semiconductor manufacturing process generally includes a plurality of process chambers that perform a substrate processing process and an environment that allows the substrate to enter the process chamber before the substrate enters the process chamber. A load lock chamber is installed to create a load lock chamber, and a robot arm is installed to connect the process chamber and the load lock chamber and transfer the substrates in the load lock chamber to the corresponding process chamber or the substrates in the process chamber to the load lock chamber. Includes a transfer chamber.

The process chamber generally performs a substrate processing process at high temperature and process pressure close to vacuum. At this time, because it is difficult to enter the substrate at atmospheric pressure into the process chamber at high temperature and process pressure, it is necessary to create the same environment as the process chamber before transferring the substrate to the process chamber. This is the load lock chamber.

That is, the load lock chamber refers to a chamber that accommodates a substrate in a state substantially the same as the environment of the process chamber or the external environment before the substrate is introduced into the process chamber from the outside or before the substrate is taken out from the process chamber.

In the case of conventional substrate processing equipment, efforts are being made to improve productivity by eliminating bottlenecks in the process chamber by increasing the number of process chambers.

If the bottleneck in the process chamber is resolved by any means, the productivity of the load lock chamber becomes the bottleneck of the entire system.

On the other hand, substrate processing in the load lock chamber involves opening the substrate loading gate from the transfer chamber, loading the substrate, closing the substrate loading gate, injecting venting gas, opening the substrate loading gate to atmospheric transfer, substrate loading, etc., which is carried out in a short period of time. It refers to a series of processes leading to the closing of the substrate unloading gate.

For this purpose, a gate valve for opening and closing the gate may be coupled to the substrate loading gate and substrate loading gate of the load lock chamber.

During the transfer of a substrate that has not been sufficiently cooled, members affected by thermal damage become deformed or melted, making it difficult to perform their original function, or leaving traces on the substrate to produce chips. It can act as a contaminant and become a factor that can cause defects in semiconductor products.

In addition, the conventional load lock chamber is configured to open and close the gate by coupling the valve housing of the gate valve to one outer wall of the load lock chamber and the valve plate of the gate valve in close contact with the valve seat provided in the valve housing.

Meanwhile, the load lock chamber repeats pumping to form process pressure and venting to form atmospheric pressure, and the outer wall of the chamber may be deformed due to the pressure difference, and this deformation may become greater as the load lock chamber becomes larger.

When the outer wall of the load lock chamber is deformed, metal contact occurs between the valve housing connected to the substrate loading gate and the substrate unloading gate and the outer wall of the load lock chamber, which causes particle issues inside the load lock chamber. .

The purpose of the present invention is to recognize the above problems and provide a load lock module and a substrate processing system including the same, which can prevent particles from being generated in the internal space of the load lock module by integrating a gate valve into the load lock module. It is provided.

In addition, another object of the present invention is to provide a load lock module and a substrate processing system including the same that can improve productivity by reducing the volume of the load lock module's internal space and improving gas flow in the load lock module's internal space. I'm doing it.

The present invention was created to achieve the object of the present invention as described above, and discloses a load lock module 200 that transfers a substrate between the outside at atmospheric pressure and a process module 100 where substrate processing is performed.

The load lock module 200 includes a load lock chamber 210 that forms a sealed internal space (S) and has at least one pair of gates (T) for entering and exiting a substrate; a substrate support portion 220 installed in the load lock chamber 210 to support the substrate (G) introduced into the internal space (S); A gas injection unit 230 for injecting an inert gas into the internal space (S); a gas exhaust unit 240 for exhausting gas from the internal space (S); a heat exchange unit 270 for controlling the temperature of the substrate (G) introduced into the internal space (S); It may include a gate valve unit 250 that opens and closes the gate (T).

The load lock chamber 210 may include a chamber body 212 with an open upper surface and an upper lid 214 coupled to the upper surface of the chamber body 212 to form the internal space (S).

The chamber body 212 may be provided with a chamber extension portion 216 extending outward from the gate T along the substrate transfer direction D1.

The gate valve part 250 penetrates the chamber extension part 216 along the direction D2 perpendicular to the substrate transfer direction and is attached to the valve seat 219 forming the edge of the gate T. It may include a valve plate 252 that is movably installed to be in close contact or spaced apart.

The chamber body 212 may include a partition wall 218 that divides the internal space S up and down to form a first internal space S1 and a second internal space S2.

The substrate support part 220 and the heat exchange part 270 may be provided in the first internal space (S1) and the second internal space (S2), respectively.

The chamber body 212 may include two pairs of gates (T) corresponding to the first internal space (S1) and the second internal space (S2), respectively.

A through hole 217 through which the valve plate 252 is installed may be formed in the chamber extension portion 216.

The gate valve unit 250 accommodates a valve rod 254 coupled to the valve plate 252, a valve driver 256 coupled to the valve rod 254, and the valve plate 252. It may include a cover portion 258 that covers the through hole 217.

The gas injection unit 230 includes a valve block 232 having a gas flow path (F) therein, and at least one gas valve installed on the valve block 232 to open and close the gas flow path (F). It may include (234) and a diffuser 236 that communicates with the gas flow path (F), receives inert gas, and sprays the gas into the internal space (S).

The diffuser 236 may be installed in the side wall internal space (IS) formed by penetrating the side wall of the chamber body 212.

The gas injection unit 230 may further include a cover plate 238 for sealing the internal space (S) between the valve block 232 and the side wall of the chamber body 212.

A viewport (V) may be installed on the cover plate 238.

In another aspect, the present invention includes one or more process modules 100 that perform substrate processing on a substrate G under a preset process pressure; a load lock module (200) that transfers the substrate (G) between the process module (100) and the outside at atmospheric pressure; Disclosed is a substrate processing system comprising a transfer module 300 that transfers a substrate G between the process module 100 and the load lock module 200.

The load lock module and the substrate processing system including the same according to the present invention integrate the gate valve into the load lock module, so that even when deformation of the chamber body occurs, it does not come into contact with other structures, preventing deformation of the chamber body. There is an advantage in preventing the formation of particles.

In addition, the load lock module and the substrate processing system including the same according to the present invention can reduce the volume of the internal space of the load lock module by removing structures that may come into contact with the chamber body when the chamber body is deformed, and thus pumping /There is an advantage in improving the productivity of the load lock module by minimizing venting time and reducing gas usage for venting.

In addition, the load lock module and the substrate processing system including the same according to the present invention occupy unnecessary space in the internal space, reduce the volume of the internal space of the load lock module, and improve gas flow in the internal space of the load lock module. By including a guide block, there is an advantage in improving the productivity of the load lock module.

1 is a plan view showing a substrate processing system according to an embodiment of the present invention.
FIG. 2 is a side view of the load lock module of the substrate processing system of FIG. 1.
Figure 3 is a perspective view showing the chamber main body of the load lock module of Figure 2.
Figure 4 is a side view showing the heat exchanger installed in the load lock module of Figure 1.
FIGS. 5A to 5B are bottom views showing the heat exchange unit of FIG. 4.
6A to 6B are cross-sectional views illustrating the gate opening/closing structure and operation of the chamber main body of FIG. 3.
Figure 7 is a perspective view showing a gas injection unit installed in the load lock module of Figure 1.
Figure 8 is a side view showing the chamber main body of the load lock module of Figure 3.
Figure 9 is a diagram showing the installation position of the guide block installed in the load lock module of Figure 1.
Figure 10 is a diagram showing the guide space of the guide block of Figure 9.

Hereinafter, the load lock module and the substrate processing system including the same according to the present invention will be described with reference to the attached drawings.

As shown in FIGS. 1 to 10, the substrate processing system according to the present invention includes one or more process modules 100 that perform substrate processing on the substrate G at a preset process pressure, and an external process module 100 at atmospheric pressure. and a load lock module 200 that transfers the substrate (G) between the process modules 100, and a transfer module that transfers the substrate (G) between the process module 100 and the load lock module 200. It may include (300).

As shown in FIG. 1, the substrate processing system includes a process module 100 consisting of a plurality of individual chambers 101 and 102 that perform at least one process, and a process module 100 consisting of a plurality of individual chambers 101 and 102. ) may be configured as a cluster type including a transport module 300 that is commonly connected, but this is only one embodiment and is not limited to this.

A gate valve that is opened and closed under the control of a control unit (not shown) may be installed between the transfer module 300 and each individual chamber 101 and 102.

In addition, the transfer module 300 may be equipped with a substrate transfer robot 310 that withdraws the substrate G from the load lock module 200 and transfers it to a required predetermined location.

The process module 100 is a place where various processes such as an etching process or a deposition process using a plasma reaction or chemical vapor method are performed. Before the process proceeds, the process module 100 is pumped by a vacuum pump (not shown) as a preliminary operation. After being set to have a vacuum state, a pressure control valve may be included to control the vacuum pressure when the actual process is performed.

Specifically, the process module 100 includes a chamber body (not shown) that forms a closed processing space where substrate processing is performed, a substrate supporter (not shown) that supports the substrate (G), and a device that sprays process gas. It may include a process gas injection unit (not shown) and a heating jacket (not shown) that controls the temperature of the process module 100.

Meanwhile, the process module 100 may be provided with a plurality of substrate processing spaces, including a plurality of individual chambers 101 and 102, where substrate processing such as substrate deposition and substrate etching is performed.

The plurality of individual chambers 101 and 102 may be arranged side by side, and a plurality of substrate processing spaces connected to the transfer module 300 may be arranged side by side.

Here, the process module 100 may be composed of a plurality of individual chambers 101 and 102 to implement a plurality of substrate processing spaces, but may have two independent substrate processing spaces within one chamber. In contrast, Of course, one process module 100 may be configured to process one substrate (S).

The transfer module 300 is located between the load lock module 200 and the process module 100 and transports the substrate G to each substrate processing space of the process module 100. Various configurations are possible.

The transfer module 300 is a chamber body that has a plurality of gates through which the substrate G passes and forms a space through which the substrate G is transferred between the load lock module 200 and the process module 100. It can be included.

The transfer module 300 transfers the substrate (G) transferred from the load lock module 200 to the process module 100 for substrate processing, and conversely, the substrate G transferred from the process module 100 after substrate processing is completed. The substrate (G) can be transferred to the load lock module (200).

Specifically, the transfer module 300 pulls out the substrate (G) from the load lock module 200 and transfers it to a required predetermined position, and pulls out the substrate (G) from the process module 100 to load the load lock module ( A substrate transfer robot 310 may be provided to transfer the substrate to 200).

The substrate transfer robot 310 is provided in the transfer module 300, and can be configured in various configurations to transfer the substrate (G) between each process module 100 and the transfer module 300 through a plurality of gates. .

The substrate transfer robot 310 transfers the substrate G transferred from the load lock module 30 to each individual chamber 101 and 102 through the gate, and each individual chamber 101 and 102 of the process module 100 through the gate. ) The substrate (G) transferred from ) is transferred to the load lock module (200).

The transfer module 300 can always maintain a process pressure close to vacuum.

However, when transferring the substrate (G) from the process module 100 to the transfer module 200 or from the transfer module 200 to the process module 100, particles inside the process module 100 are transferred to the transfer module 300. In order to minimize intrusion, the internal pressure of the transfer module 300 may be set to be relatively higher (low vacuum) than the pressure of the process module 100.

The load lock module 200 is configured to allow access to environmental conditions close to those within the transfer module 200 and to block the environmental conditions within the transfer module 200 from being influenced by the outside. Various configurations are possible.

That is, the load lock module 200 can change from a process pressure state close to vacuum to an atmospheric pressure state, or from an atmospheric pressure state to a process pressure state.

Additionally, the load lock module 200 may receive the substrate G from an external loader unit (not shown) connected to a substrate storage container (not shown) under atmospheric pressure.

One side of the load lock module 200 may be coupled to the loader unit 400 and the other side may be coupled to the transfer module 300.

After the substrate (G) is transferred from the substrate storage container (FOUP) in a standby state through the loader unit 400, the inside of the load lock module 200 is subjected to a process pressure close to vacuum, similar to that of the transfer module 300. changes to the state.

In addition, when the substrate (G) processed in the process module 100 is transferred to the load lock module 200 through the transfer module 300, the substrate is transferred to the external substrate storage container (FOUP) through the loader unit 400. In order to transfer (G), the inside of the load lock module 200 changes to atmospheric pressure.

Specifically, the load lock module 200 includes a load lock chamber 210 that forms a sealed internal space (S) and has at least one pair of gates (T) for entering and exiting a substrate, and the load lock chamber ( A substrate support part 220 installed in 210) to support the substrate G introduced into the internal space S, a gas injection part 230 for injecting an inert gas into the internal space S, and A gas exhaust unit 240 for exhausting gas in the internal space (S), a heat exchange unit 270 for controlling the temperature of the substrate (G) introduced into the internal space (S), and the gate (T) It may include a gate valve unit 250 that opens and closes.

The load lock module 200 may be configured as a pair, as shown in FIGS. 1 to 3, and the pair of load lock modules 200 may be arranged side by side on one side of the transfer module 300. You can.

The load lock chamber 210 is a housing that forms a sealed internal space (S) and has at least one pair of gates (T) for entering and exiting a substrate, and can be configured in various ways.

The pair or more gates T may be formed along the substrate transfer direction D1 (substrate transfer direction) of the substrate G.

The substrate transfer direction D1 may be defined as a direction parallel to the movement path along which the substrate G entering and exiting the load lock chamber 210 moves.

The pair or more gates (T) are openings that are opened and closed by the gate valve unit 250, which will be described later, and include a first gate (T1) corresponding to the loader unit 400 side and a first gate (T1) corresponding to the transfer module 300 side. It may include a second gate (T2).

When the load lock chamber 210 is formed in a hexahedral shape, the one or more pairs of gates T may be provided on a pair of opposing side walls of the load lock chamber 210.

Of course, when the load lock chamber 210 is comprised of a plurality of independent substrate processing areas, the pair of gates T may be formed in plurality to correspond to the substrate processing areas.

The load lock chamber 210 shown in FIGS. 1 to 10 shows an embodiment in which two pairs of gates T are formed with upper and lower spacing.

The load lock chamber 210 may have a rectangular (cube-shaped) planar shape, but is not limited thereto.

At this time, the load lock chamber 210 may be configured to form a plurality of independent substrate processing areas corresponding to a plurality of process modules 100 or to process a plurality of substrates G in one substrate processing area. there is.

The load lock chamber 210 may include a chamber body 212 with an open upper surface and an upper lid 214 coupled to the upper surface of the chamber body 212 to form the internal space (S).

The chamber body 212 may be integrally formed as a single member.

When the bottom of the chamber body 212 is open, the load lock chamber 210 may additionally include a lower lid 213 coupled to the bottom of the chamber body 212.

For example, the chamber body 212 may include a partition wall 218 that divides the internal space S up and down to form a first internal space S1 and a second internal space S2.

The first internal space (S1) and the second internal space (S2) may be independent substrate processing areas.

At this time, the chamber body 212 may include two pairs of gates (T) corresponding to the first internal space (S1) and the second internal space (S2), respectively.

The substrate support part 220 is installed in the load lock chamber 210 and supports the substrate G introduced into the internal space S, and can be configured in various ways.

When the load lock chamber 210 is comprised of a plurality of independent substrate processing areas, the substrate support portion 220 may be provided in plural numbers corresponding to the substrate processing areas.

That is, the substrate support part 220 may be provided in the first internal space (S1) and the second internal space (S2), respectively.

In addition, the substrate support 220 may be configured to support a plurality of substrates G stacked vertically and spaced apart in one substrate processing area, as shown in FIG. 2 .

For this purpose, the substrate support unit 220 includes a plurality of substrate support members 222 that are installed at vertical intervals and support the bottom surface of the substrate G, and vertical movement of the plurality of substrate support members is driven. It may include a driving unit 224.

The vertical driving part 224 of the substrate support part 220 installed in the first internal space (S1) is installed on the upper lead 214 side and a rod penetrating the upper lead 214 is coupled to the substrate support member to support the substrate. The support member 222 may be moved up and down.

On the contrary, the vertical driving part 224 of the substrate support part 220 installed in the second internal space S2 located below the first internal space S1 is installed on the lower lead 213 side and lower lead 213 The substrate support member 222 may be moved up and down by coupling the rod penetrating to the substrate support member 222.

The gas injection unit 230 is configured to inject an inert gas into the internal space (S) and can have various configurations.

The gas injection unit 230 is installed in the chamber body 212 by injecting an inert gas into the internal space (S) to change the internal space (S) from a process pressure state to an atmospheric pressure state, and the substrate (G) It can also perform a cooling function to cool the body.

The inert gas is a gas for venting/purging the internal space (S) and may be, for example, N2 gas.

The inert gas is used for the purpose of changing/purging the pressure of the internal space of the load lock chamber 210, but also reduces heat in the members that may be generated when the heated substrate (G) introduced from the process module 100 is discharged as is. It also has the purpose of cooling the substrate G to a preset temperature in order to prevent thermal damage.

For example, the gas injection unit 230 includes a valve block 232 having a gas flow path (F) therein, and at least one valve block 232 installed on the valve block 232 to open and close the gas flow path (F). It may include the above gas valve 234 and a diffuser 236 that communicates with the gas flow path (F), receives inert gas, and injects the gas into the internal space (S).

The valve block 232 is a body portion having a gas flow path (F) therein and can be configured in various ways.

The valve block 232 has one or more gas supply lines (PL) for supplying inert gas (venting gas) from an external gas source (not shown), and one or more gas supply lines for supplying inert gas (purge gas). Lines (SL) may be combined.

For example, the gas supply lines PL and SL may include a first gas supply line communicating with the first internal space S1 and a second gas supply line communicating with the second internal space S2. .

As another example, the gas supply lines PL and SL may be configured as a single line so as to communicate with both the first internal space S1 and the second internal space S2.

The gas flow path (F) is a flow path through which inert gas flows within the valve block 232, and may form a single path or may be a flow path that is branched in various ways.

When the internal space (S) of the load lock chamber 210 is divided into a first internal space (S1) and a second internal space (S2), the gas flow path (F) supplies gas to the first internal space (S1). It may be composed of a gas flow path for injecting gas and a gas flow path for injecting gas into the second internal space (S2).

The gas valve 234 is an open/close valve installed on the valve block 232 to open and close the gas flow path (F), and can have various configurations.

When the internal space (S) of the load lock chamber 210 is divided into a first internal space (S1) and a second internal space (S2), the gas valve 234 is divided into the first internal space (S1) and the second internal space (S2). In order to independently control gas injection into the internal space (S2), a plurality of gases may be provided corresponding to the first internal space (S1) and the second internal space (S2).

That is, by installing one or a plurality of gas valves 234 in the gas flow path for injecting gas into the first internal space (S1), gas injection into the first internal space (S1) can be controlled.

Likewise, gas injection into the first internal space (S1) can be controlled by installing one or a plurality of gas valves 234 in the gas flow path for injecting gas into the second internal space (S2).

The diffuser 236 is configured to inject gas into the internal space (S) and can be configured in various ways. It is in communication with the gas flow path (F) and receives inert gas to inject gas into the internal space (S). You can.

The diffuser 236 has a gas diffusion space formed therein, and the gas diffusion space may be in communication with the gas flow path F of the valve block 232 through the end connector 236a of the diffuser 236.

The diffuser 236 has a long bar shape and may be formed in various shapes such as a rectangular shape or a cylindrical shape. Additionally, a plurality of gas injection holes may be formed on the outer peripheral surface of the diffuser 236 to spray gas from the internal gas diffusion space.

At this time, the diffuser 236 may be installed parallel to the substrate transfer direction D1 on the side of the chamber body 212 where the gate T of the chamber body 212 is not formed.

For example, when the chamber body 212 is formed in a hexahedral shape and a pair of gates (T) are provided on a pair of opposing sides of the chamber body 212, the diffuser 236 is connected to the gate (T). It can be installed on the side adjacent to the side provided.

More specifically, the diffuser 236 may be installed in the side wall internal space (IS) formed by penetrating the side wall of the chamber body 212.

To this end, a side wall opening 212a may be formed on the side wall of the chamber body 212 to form a side wall internal space (IS) for installing the diffuser 236.

The side wall opening 212a may be formed in various shapes and sizes depending on the installation direction and shape of the diffuser 236.

At this time, the gas injection unit 230 may further include a cover plate 238 for sealing the internal space (S) between the valve block 232 and the side wall of the chamber body 212. .

The cover plate 238 may be a sealing plate for sealing the side wall opening 212a formed in the side wall of the chamber body 212.

The valve block 232 may be fixedly installed on the cover plate 238.

Additionally, a viewport (V) for monitoring the internal space (S) of the load lock chamber 210 may be installed on the cover plate 238.

It may be possible to check the internal space (S) from the outside of the load lock chamber (210) through the viewport (V) and the side wall opening (212a).

The diffuser 236 is located in the side wall internal space (IS) formed by penetrating the side wall of the chamber body 212, allowing convenient installation and maintenance without interference with other structures installed in the internal space (S). In addition, the inert gas sprayed from the diffuser 236 is more effectively spread in the direction toward the substrate G by the side wall and rear cover plate 238 of the chamber body 212 surrounding the diffuser 236 (improved gas flow). Therefore, there is an advantage in that the substrate cooling effect (cooling speed, cooling time, temperature uniformity) using inert gas can be further improved.

The gas exhaust unit 240 is configured to exhaust gas from the internal space (S) and can be configured in various ways, and exhausts gas into the internal space to change the internal space (S) from atmospheric pressure to process pressure. can do.

The gas exhaust unit 240 may include a gas exhaust line 242 coupled to the load lock chamber 210 and a vacuum pump 244 connected to the gas exhaust line 242.

As shown in FIG. 2, when the substrate processing system includes a pair of load lock modules 200, the gas exhaust unit 240 connects the pair of load lock modules 200 to one vacuum pump 244. ) may include a common exhaust line for exhaust.

The heat exchange unit 270 is configured to control the temperature (cooling or heating) of the substrate (G) introduced into the internal space (S) and can have various configurations.

When the internal space (S) of the load lock chamber 210 is divided into a first internal space (S1) and a second internal space (S2), the heat exchange unit 270, as shown in FIG. 4, It may be provided in the first internal space (S1) and the second internal space (S2), respectively.

For example, referring to FIGS. 5A to 5B, the heat exchange unit 270 includes a heat exchange plate 272 formed in a planar shape corresponding to the substrate G, embedded within the heat exchange plate 272, and connected from the outside. It may include a heat medium passage 274 through which the supplied heat medium flows, and a heat medium port 276 for supplying/discharging heat medium to the heat medium passage 274.

The heat exchange plate 272 may be formed in a planar shape corresponding to the substrate G, and may be, for example, a heat conductive plate formed in a disk shape.

The heat exchange plate 272 may be provided with a seating surface on which the substrate G is seated.

It is fixedly installed in the internal space (S) of the heat exchange plate 272, and the distance between the heat exchange plate 272 and the substrate (G) supported on the substrate support 220 is variable by the up and down movement of the substrate support 220. You can.

The heat medium flow path 274 is a flow path formed inside the heat exchange plate 272, and the heat medium flows along the heat medium flow path 274 to cool or heat the substrate G.

The heat medium port 276 may include an inlet port 276a for supplying heat medium to the heat medium flow path 274 and an outlet port 276b for discharging heat medium flowing out along the heat medium flow path 274.

The inlet port 276a and the outlet port 276b may be arranged adjacent to each other in the outer area of the heat exchange plate 272.

Meanwhile, as shown in FIG. 4, when the heat exchanger 270 is provided in each of the first internal space (S1) and the second internal space (S2), the heat exchanger 270 is installed in the first internal space (S1) The heat exchange unit 270 and the heat medium port 276 of the heat exchange unit 270 installed in the second internal space (S2) may be installed in an area where they do not interfere with each other on a plane.

As an example, the heat exchange unit 270 shown in FIG. 5A is a heat exchange unit 270 installed in the first internal space (S1), and the heat exchange unit 270 shown in FIG. 5B is a heat exchange unit 270 installed in the first internal space (S1). It may be a heat exchange unit 270 installed in the second internal space S2 located on the lower side.

As shown in FIG. 5A, the heat exchanger 270 installed in the first internal space (S1) has a heat medium port 276 installed in the second internal space (S2). ), the heat medium passage 274 may include an extension passage 275 extending further to the outside.

Meanwhile, the chamber body 212 may be provided with a chamber extension portion 216 extending outward from the gate T along the substrate transfer direction D1.

Since the chamber body 212 is a single member formed integrally, the chamber extension 216 should also be understood as a region formed integrally with the chamber body 212.

The chamber extension portion 216 extends outward from the gate T along the substrate transfer direction D1, thereby forming a gate module for opening and closing the gate T along with the gate valve portion 250, which will be described later. You can.

The chamber extension 216 extends along the substrate transfer direction D1 and may form a passage through which the substrate G moves.

The gate valve unit 250 is a valve that opens and closes the gate T, is a component of the load lock module 200, and may be formed integrally with the load lock chamber 210.

Specifically, the gate valve unit 250 penetrates the chamber extension part 216 along a direction (D2) perpendicular to the substrate transfer direction (D1) and forms a perimeter of the edge of the gate (T). It may include a valve plate 252 that is movably installed to be in close contact with or spaced apart from the valve seat 219.

The valve plate 252 is a valve plate that penetrates the chamber extension 216 along a direction D2 perpendicular to the substrate transfer direction D1 and can be configured in various ways.

For this purpose, a through hole 217 through which the valve plate 252 is installed may be formed in the chamber extension 216.

When the chamber body 212 is provided with two pairs of upper and lower gates (T), the gate valve unit 250 may also be installed corresponding to each gate (T), and the through hole 217 may also be shown in FIGS. 6A to 6A. As shown in FIG. 6B, it may be formed on the upper and lower surfaces of the chamber extension portion 216, respectively.

Since the valve seat 219 to which the valve plate 252 installed through the through hole 217 of the chamber extension 216 is in close contact is around the edge of the gate (T), in the present invention, the valve seat 219 is located in the chamber. It may be provided in the main body 212.

That is, in the present invention, the valve plate 252 may be configured to open and close the gate T by directly contacting the chamber body 212 of the load lock chamber 210 rather than a separate valve housing or connector member.

In addition, the gate valve unit 250 includes a valve rod 254 coupled to the valve plate 252, a valve driver 256 coupled to the valve rod 254, and the valve plate 252. It may include a cover portion 258 that accommodates and covers the through hole 217.

The valve driving part 256 is installed outside the chamber body 210 with the cover part 258 as a boundary and is coupled to the valve plate 252 through the driving rod 357 to drive the gate (T) through the valve plate 252. It can transmit driving force for opening and closing.

The cover portion 258 forms a moving space for the valve plate 252 and is a sealing plate that seals the internal space (S) of the chamber body 210 and can be configured in various ways.

In the present invention, the valve seat to which the valve plate 252 is in close contact is formed in the chamber body 212 of the load lock module 200, rather than in a separate valve housing or connector member, thereby eliminating problems caused by a separate valve housing or connector member. There is an advantage in improving (friction between the valve housing (connector member) and the chamber body, particles, deformation, and increase in chamber body internal volume).

Meanwhile, the load lock module 200 occupies the internal space (S) and is a guide space that guides the gas sprayed from the diffuser 236 toward the substrate (G) seated on the substrate support portion 220. It may additionally include a guide block 260 forming (GS).

The guide block 260 may be installed in a position that does not interfere with the movement area where the substrate G is moved on the plane for substrate entry and exit.

Additionally, the guide block 260 may be installed at a location that does not interfere with the vertical movement of the substrate support unit 220 and the structure therefor.

For example, the guide block 260 may be a block member having a length along the side wall of the chamber body 212 where the diffuser 236 is installed, as shown in FIG. 9.

The guide block 260 occupies the internal space S of the load lock chamber 210, thereby reducing the volume of the internal space S, and as a result, the amount of time required for substrate processing in the load lock chamber 210. Productivity can be improved by reducing the pumping/venting time and the amount of inert gas required.

At this time, the guide block 260 may be installed between the substrate support portion 220 and the diffuser 236 and fixedly coupled to the upper surface of the heat exchange plate 272.

The guide block 260 forms a guide space GS that guides the gas injected from the diffuser 236 toward the substrate G seated on the substrate support 220, thereby forming a guide space GS in the internal space S. Gas flow toward the substrate (G) can also be improved.

The guide space GS can be formed in various ways as long as a gas movement path can be formed between the substrate support 220 and the diffuser 236.

For example, the guide space GS is a partial area of the lower portion of the guide block 260 excluding the coupling portion 262 where the guide block 260 is coupled to the heat exchange plate 272, as shown in FIG. 10/. It can be formed by removing and collapsing, but it is clear that this is only an illustration of a possible embodiment and the present invention is not limited thereto.

Since the above is only a description of some of the preferred embodiments that can be implemented by the present invention, as is well known, the scope of the present invention should not be construed as limited to the above embodiments, and the scope of the present invention described above Both the technical idea and the technical idea underlying it will be said to be included in the scope of the present invention.

100: Process module
200: Load lock module
300: Return module

Claims (10)

A load lock module (200) that transfers substrates between the outside at atmospheric pressure and the process module (100) where substrate processing is performed,
A load lock chamber (210) forming a sealed internal space (S) and having at least one pair of gates (T) for entering and exiting a substrate; a substrate support portion 220 installed in the load lock chamber 210 to support the substrate (G) introduced into the internal space (S); A gas injection unit 230 for injecting an inert gas into the internal space (S); a gas exhaust unit 240 for exhausting gas from the internal space (S); a heat exchange unit 270 for controlling the temperature of the substrate (G) introduced into the internal space (S); It includes a gate valve unit 250 that opens and closes the gate (T),
The load lock chamber 210 includes a chamber body 212 with an open upper surface and an upper lid 214 coupled to the upper surface of the chamber body 212 to form the internal space S,
The chamber body 212 is provided with a chamber extension portion 216 extending outward from the gate T along the substrate transfer direction D1,
The gate valve part 250 penetrates the chamber extension part 216 along the direction D2 perpendicular to the substrate transfer direction and is attached to the valve seat 219 forming the edge of the gate T. It includes a valve plate 252 that is movably installed to be in close contact or spaced apart,
The gas injection unit 230 includes a valve block 232 having a gas flow path (F) therein, and at least one gas valve installed on the valve block 232 to open and close the gas flow path (F). (234) and a diffuser (236) that communicates with the gas flow path (F), receives an inert gas, and sprays the gas into the internal space (S),
The diffuser 236 is a load lock module 200, characterized in that installed in the side wall internal space (IS) formed by penetrating the side wall of the chamber body 212. In claim 1,
The chamber body 212 includes a partition wall 218 that divides the internal space S up and down to form a first internal space S1 and a second internal space S2,
The load lock module 200 is characterized in that the substrate support part 220 and the heat exchange part 270 are respectively provided in the first internal space (S1) and the second internal space (S2). In claim 2,
The chamber body 212 is a load lock module 200 characterized in that it includes two pairs of gates (T) corresponding to the first internal space (S1) and the second internal space (S2), respectively. In claim 1,
The load lock module 200 is characterized in that a through hole 217 through which the valve plate 252 is installed is formed in the chamber extension part 216. In claim 4,
The gate valve unit 250 accommodates a valve rod 254 coupled to the valve plate 252, a valve driver 256 coupled to the valve rod 254, and the valve plate 252. A load lock module (200) comprising a cover portion (258) covering the through hole (217). delete delete In claim 1,
The gas injection unit 230 further includes a cover plate 238 for sealing the internal space (S) between the valve block 232 and the side wall of the chamber body 212. Load lock module (200). In claim 8,
A load lock module (200), characterized in that a viewport (V) is installed on the cover plate (238). One or more process modules (100) that perform substrate processing on the substrate (G) under a preset process pressure state; A load lock module (200) according to any one of claims 1 to 5 and 8 to 9, which transfers the substrate (G) between the outside and the process module (100) under atmospheric pressure; A substrate processing system comprising a transfer module (300) that transfers the substrate (G) between the process module (100) and the load lock module (200).

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