KR102395576B1 - Display device - Google Patents

Abstract

The present invention relates to a display device that improves the heat dissipation performance of the outermost area of a panel by forming a curved inner plate disposed on the inner surface of the back cover, which is a rear support structure of the display device, more specifically, the display device. it's about

Description

display device {DISPLAY DEVICE}

The present invention relates to a display device that improves the heat dissipation performance of the outermost area of a panel by forming a curved inner plate disposed on the inner surface of the back cover, which is a rear support structure of the display device, more specifically, the display device. it's about

With the development of various portable electronic devices such as mobile communication terminals and notebook computers, the demand for a flat panel display device applicable thereto is increasing.

Examples of the flat panel display include a liquid crystal display device, a plasma display panel, a field emission display device, a light emitting diode display device, and an organic light emitting diode. A display device (Organic Light Emitting Diode Display Device) and the like are being studied.

Among such display devices, a liquid crystal display (LCD) includes an array substrate including thin film transistors, an upper substrate including a color filter and/or a black matrix, and a liquid crystal material layer formed therebetween, and a pixel The arrangement state of the liquid crystal layer is adjusted according to the electric field applied between both electrodes of the region, and the transmittance of light is adjusted accordingly to display an image.

The display panel of the liquid crystal display is defined as an active area (AA) that provides an image to a user and a non-active area (NA) that is a peripheral area of the display area (AA). In general, a first substrate as an array substrate on which a thin film transistor is formed and a pixel region is defined, and a second substrate as an upper substrate on which a black matrix and/or a color filter layer are formed are bonded to each other.

The array substrate or the first substrate on which the thin film transistor is formed includes a plurality of gate lines GL extending in a first direction and a plurality of data lines DL extending in a second direction perpendicular to the first direction. and one pixel area (Pixel;P) is defined by each gate line and data line. One or more thin film transistors are formed in one pixel region P, and a gate or source electrode of each thin film transistor may be connected to a gate line and a data line, respectively.

Among these flat panel display devices, a liquid crystal display device does not have a self-luminous element, and thus requires a separate light source. Accordingly, a backlight unit having a light source such as an LED is provided on the rear surface to irradiate light toward the front surface of the liquid crystal panel, and an image that can be identified is realized only through this.

On the other hand, the organic light emitting display device, which has recently been spotlighted as a display device, has advantages in that the response speed is fast and the luminous efficiency, luminance, and viewing angle are large by using an organic light emitting diode (OLED) that emits light by itself.

Since such an organic light emitting display device uses a self-light emitting device, a backlight used in a liquid crystal display device using a non-light emitting device is not required, so that it can be lightweight and thin. In addition, the organic light emitting display device has better viewing angle and contrast ratio than the liquid crystal display device, and is advantageous in terms of power consumption. In addition, the organic light emitting display device can be driven with a low direct current voltage, has a fast response speed, is strong against external shocks because the internal components are solid, has a wide operating temperature range, and has the advantages of being inexpensive in terms of manufacturing cost.

Such an organic light emitting display device displays an image in the form of a top emission method or a bottom emission method according to the structure of an organic light emitting device including a first electrode, a second electrode, and an organic light emitting layer. do. The bottom emission method displays visible light generated from the organic light emitting layer toward the lower side of the substrate on which the transistor is formed, whereas the top emission method displays visible light generated from the organic light emitting layer toward the upper side of the substrate on which the transistor is formed.

In such an organic light emitting display device, sub-pixels including organic light emitting diodes are arranged in a matrix form, and brightness of sub-pixels selected by a scan signal is controlled according to a gray level of data. In addition, the organic light emitting diode display is a self-luminous device, and has low power consumption, high response speed, high luminous efficiency, high luminance, and wide viewing angle.

On the other hand, there is a set device of the concept of a finished product including such a display device, and examples of such a set device may include a TV, a computer monitor, a billboard, and the like.

Such a display device or set device includes a support structure for supporting the liquid crystal or organic light emitting display panel from the rear, and since this support structure forms the exterior of the display device to protect the display panel, rigidity above a certain level must be secured, It should have a function of discharging heat generated from the panel or control circuit to the outside.

On the other hand, in a general organic light emitting display device, a back cover supporting the rear surface of the organic light emitting display panel and an inner plate attached to the inner surface of the back cover to reinforce the rigidity of the back cover and perform a heat dissipation function may be used.

The conventional inner plate maintains a constant distance from the panel, but there is a problem in that heat through the inner plate is insufficient in the outer region of the panel where heat is severe.

Accordingly, the present embodiment intends to propose a method for improving the heat dissipation characteristics of the display device by changing the structure of the inner plate and additional parts.

SUMMARY OF THE INVENTION The present invention is to solve the problems of the prior art, and an object of the present invention is to provide a display device having improved heat dissipation characteristics by changing the structures of a double-sided adhesive member, an inner plate, and a middle cabinet constituting the display device. .

The present invention bends an existing flat inner plate so that the air gap positioned between the panel and the inner plate becomes smaller from the center of the panel toward at least one corner of the panel, thereby improving the heat dissipation characteristics of the corner of the panel. to provide the device.

In one embodiment of the present invention, the cross-section of the double-sided adhesive member becomes thicker from the central portion of the back cover to at least one corner portion by adjusting the thickness and number of the double-sided adhesive members disposed side by side between the back cover and the inner plate. The inner plate positioned on the upper end of the double-sided adhesive member is bent so that the air gap positioned between the panel and the inner plate becomes smaller from the center of the panel to at least one corner of the panel, thereby improving the heat dissipation characteristics of the corner of the panel. To provide a display device.

In another embodiment of the present invention, a protrusion is formed in the outer portion except for the lower end of the inner plate, and a hole is formed in the second horizontal portion except for the lower end of the middle cabinet, so that the protrusion of the inner plate and the hole of the middle cabinet are combined. Accordingly, an object of the present invention is to provide a display device that improves the heat dissipation characteristics of the outer portion of the panel by forming a narrower space between the inner plates at the outer portion of the panel than at the center portion of the panel as the inner plate is bent.

Another object of the present invention is to form a protrusion in the outer portion except for the lower end of the inner plate, and to form a hole in the second horizontal portion except for the lower end of the middle cabinet, thereby fixing the parts by combining the protrusion of the inner plate and the hole of the middle cabinet. It is an object of the present invention to provide a display device that is more robust and has improved rigidity.

In order to achieve the above object, a display device according to an embodiment of the present invention includes a first horizontal portion supporting a rear of a display panel and a vertical extension portion extending vertically from an end of the horizontal portion to cover a side surface of the display panel. It may include a back cover, an inner plate positioned on the first horizontal portion of the back cover, and a plurality of double-sided adhesive members positioned between the inner plate and the back cover.

In addition, in addition to the above configuration, the thickness of the cross-section of the double-sided adhesive member is adjusted, or the thickness of the double-sided adhesive member of the same size is adjusted so that the interval of the air gap positioned between the inner plate and the panel becomes smaller from the center toward at least one corner portion. The number can be adjusted according to the position.

Further, in addition to the above configuration, a hole is positioned in the second horizontal part of the remaining area except for the lower end of the middle cabinet, and a protrusion is positioned on the outer part except for the lower end of the inner plate, so that the hole of the middle cabinet and the protrusion of the inner plate are positioned. can be combined.

On the other hand, the display panel includes a substrate, a plurality of thin film transistors formed on the substrate, a light emitting layer including an organic light emitting device layer that emits light between both electrode layers disposed on one side of the thin film transistor, and a light emitting layer disposed on one side of the light emitting layer The organic light emitting display panel may be an organic light emitting display panel including an encapsulation layer, and in particular, the organic light emitting display panel may be a bottom emission type organic light emitting display panel in which light from an organic light emitting device layer is emitted through a substrate.

At this time, when the light emitting surface of the organic light emitting display panel is defined as the image display surface, the light layer and the encapsulation layer are sequentially stacked under the label surface, and the light emitting layer is the substrate under the image display surface. , a thin film transistor, and an organic light emitting device layer are sequentially disposed, and a polarization layer may be further disposed on the upper portion of the substrate.

In addition, the above organic light emitting device layer is a white organic light emitting device layer that emits white light, and the light emitting layer may further include a color filter layer disposed on the white organic light emitting device layer.

As will be described below, according to the exemplary embodiment of the present invention, the rigidity and heat dissipation characteristics of the display device are improved by changing the structures of the inner plate, the double-sided adhesive member, and the middle cabinet constituting the display device.

More specifically, by adjusting the thickness or number of the cross-sections of the double-sided adhesive member so that the air gap positioned between the inner plate and the panel is formed smaller in at least one corner than the central portion of the panel, the heat dissipation characteristic of the panel corner is improved. It works.

In another configuration, a protrusion is formed in the outer portion except for the lower end of the inner plate, a hole is formed in the second horizontal portion except for the lower end of the middle cabinet, and the gap between the inner plate and the panel outer portion is narrowed by combining them. , there is an effect of improving the heat dissipation characteristics of the outer part of the panel.

In addition, since the protrusion of the outer portion of the inner plate and the hole of the second horizontal portion of the middle cabinet are coupled, coupling between the components of the display device may be strengthened and rigidity may be improved.

1 is a display device according to the prior art.
2 is a horizontal cross-sectional view of a display device according to the related art.
3 illustrates a horizontal cross-section of a display device including a double-sided adhesive member and an inner plate according to an exemplary embodiment of the present invention.
4 illustrates a horizontal cross-section of a display device including a middle cabinet and an inner plate according to an exemplary embodiment of the present invention.
5 is an enlarged view of left and right middle cabinets and inner plates according to an embodiment of the present invention.
6 illustrates a vertical cross-section of a display device including a middle cabinet and an inner plate according to an exemplary embodiment of the present invention.
7 is an enlarged view of upper and lower middle cabinets and inner plates according to an embodiment of the present invention.
8 illustrates various cross-sectional structures of an organic light emitting display panel used in a display device according to an embodiment of the present invention.
9 is a detailed cross-sectional view illustrating a stacked structure of a bottom emission type organic light emitting display panel that can be used in an embodiment of the present invention.

Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. In adding reference numerals to components of each drawing, the same components may have the same reference numerals as much as possible even though they are indicated in different drawings. In addition, in describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description may be omitted.

In addition, in describing the components of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only for distinguishing the elements from other elements, and the essence, order, order, or number of the elements are not limited by the terms. When it is stated that a component is “connected”, “coupled” or “connected” to another component, the component may be directly connected or connected to the other component, but there is another component between each component. It should be understood that elements may be “interposed” or that each component may be “connected”, “coupled” or “connected” through another component.

1 shows an example of a display device according to the prior art, and FIG. 2 shows a horizontal cross-sectional view of the display device according to the related art.

The conventional display device of FIG. 1 includes the display panel 140 and the back cover 100 and the double-sided adhesive member 120 as a support structure for supporting the display panel.

In the embodiment of Figure 1, the back cover 100 may be made of an advanced composite material (Advanced Composite Material; ACM) having a thickness of about 2.5 mm or more so as to secure a certain rigidity.

Advanced Composite Material (ACM) refers to a high-performance composite material that combines carbon fiber, silicon carbide fiber, aramid fiber, boron fiber, and heat-resistant resin such as epoxy resin or polyimide. .

In the case of using the back cover made of such ACM material, since the end cannot be bent due to material characteristics, it is coupled to the back cover 100 to form the appearance of the side surface of the display device while protecting the side surface of the display panel 140 . The middle cabinet 130 should be used more.

That is, the middle cabinet 130 having a T-shaped cross section is coupled to the back cover 100 through the double-sided adhesive member 120 in the end region of the flat back cover 100, and The panel 140 is attached and fixed on the second horizontal part.

In this case, the middle cabinet 130 may be replaced with other expressions such as a guide panel, a plastic chassis, a p-chassis, a main support, a main support, a mold plane, etc., and a rectangular frame having a cross-sectional shape with a plurality of bends It is a shape structure.

The middle cabinet 130 is made of a mold material of a synthetic resin such as polycarbonate or a metal material such as aluminum, and may be manufactured through an injection molding method, but is not limited thereto.

In addition, in the structure of FIG. 1, a double-sided adhesive member 120 or a pad made of a magnetic or non-magnetic material may be used on the inner surface of the back cover 100, and such a double-sided adhesive member 120 or a magnetic pad is the back cover ( It functions to fill the space between 100 ) and the panel 140 .

On the other hand, the back cover 100 can be made of a PCM (Pre-Coated Metal) material composed of a metal such as aluminum, and can be bent due to the nature of the metal material. The first horizontal portion and the end of the first horizontal portion may include a vertical extension formed by bending in the vertical direction.

In addition, an inner plate 110 made of a metal material is disposed on the first horizontal portion of the back cover.

This inner plate 110 is attached to the inner surface of the first horizontal part of the back cover 100 through the double-sided adhesive member 120 to increase the bending rigidity of the back cover 100, and to control the panel 140 and the display device. It has a function of a heat sink that absorbs and emits heat emitted from the circuit (C-PCB) and the like.

Therefore, in the prior art, heat generated in the panel could be partially reduced only by the arrangement of the inner plate 110 , but there was a fear that the heat dissipation characteristics at the corners of the panel having a higher amount of heat compared to the center of the panel would be deteriorated.

In particular, as in the structure of FIG. 2 , in the prior art, the inner plate 110 is disposed with a predetermined distance from the panel 140 through the back cover 100 and the double-sided adhesive member 120 , so that the heat dissipation effect of the entire area of the panel is the same, and it was difficult to improve the heat dissipation characteristics at the corners of the panel, where the heat dissipation characteristics were weak compared to the center of the panel.

For example, when the display screen is used as a general TV broadcasting screen, at least one corner of the panel has information that does not move, such as a broadcaster logo in the form of a mark, and must always appear. Since the effect appears due to a higher calorific value, there was a problem that the logo of the broadcaster in the form of a mark remained on the screen even if the screen was changed after a certain period of time.

In addition, in order to secure sufficient rigidity of the display device, the thickness of the inner plate 110 or the back cover 100 must be increased, and when the thickness of the inner plate 110 is thin, it is difficult to secure sufficient rigidity.

In addition, in the structure of FIG. 2 , the thickness of the back cover 100 should be reduced in response to the thinning trend of the display device, but when the thickness of the back cover 100 becomes thinner, the rigidity of the back cover 100 becomes weak, There was a disadvantage in that it was difficult to reduce the thickness of the back cover 100 beyond a certain level.

Accordingly, in one embodiment of the present invention, the height of the double-sided adhesive member is adjusted so that the air gap positioned between the inner plate and the panel becomes smaller from the center of the panel to at least one corner portion of the double-sided adhesive member at the upper end of the double-sided adhesive member. The positioned inner plate can be bent.

3 is a cross-sectional view illustrating a display device including a double-sided adhesive member and an inner plate according to an exemplary embodiment of the present invention.

3 is a structure according to an embodiment of the present invention, and a plurality of double-sided adhesive members 120 having different thicknesses may be disposed on the upper end of the first horizontal part of the back cover 100 .

In more detail, the thickness of the plurality of double-sided adhesive members 120 increases from the central portion of the panel 140 toward at least one corner portion, and thus the inner plate 110 positioned at the top of the double-sided adhesive member 120 naturally forms. will be bent

The inner plate 110 is a plate-shaped member formed of a PCM (Pre-Coated Material) material made of a material such as aluminum or an alloy thereof, and is attached to the inner surface of the back cover 100 by a double-sided adhesive member 120 .

In this case, the method of adjusting the height of the cross-section of the double-sided adhesive member 120 may be used by manufacturing the double-sided adhesive member 120 having a different height, or by stacking a plurality of double-sided adhesive members 120 having the same cross-section height. may be set differently.

In more detail, in the method of manufacturing and using the double-sided adhesive members 120 having different heights, since the height of the double-sided adhesive members 120 can be more precisely adjusted, the bending of the inner plate 110 can be maintained more smoothly.

In addition, a method of stacking a plurality of double-sided adhesive members 120 having the same cross-sectional height to adjust the heights differently can save manufacturing costs because there is no difficulty in using even panels 140 having different sizes.

Therefore, due to the bent inner plate 110, the air gap G positioned between the panel 140 and the inner plate 110 becomes narrower from the central portion toward at least one corner portion, and through this, the heat dissipation effect of the weak panel ( Since the heat generated at the corner of the 140 is moved to the back cover 100 through the inner plate 110 to be discharged, the heat dissipation characteristic of the corner of the display device is improved as compared to the conventional structure shown in FIG. 2 .

Accordingly, in the panel 140 , heat dissipation characteristics of a weak area can be more efficiently improved, and thus overall screen characteristics are improved.

4 illustrates a horizontal cross-section of a display device including a middle cabinet and an inner plate according to another embodiment of the present invention.

The structure according to another embodiment of the present invention may improve the heat dissipation characteristics of the outer portion of the panel 140 while making the coupling between the inner plate 110 and the middle cabinet 130 more robust.

In more detail, compared to the above-described embodiment of the present invention, the inner plate 110 according to another embodiment of the present invention extends to the horizontal portion of the middle cabinet 130 .

The middle cabinet 130 can be replaced with other expressions such as a guide panel, a plastic chassis, a p-chassis, a support main, a main support, and a mold plane. is a structure

The middle cabinet 130 is made of a mold material of a synthetic resin such as polycarbonate or a metal material such as aluminum, and may be manufactured through an injection molding method, but is not limited thereto.

The middle cabinet 130 supports the inner plate 110 and maintains a constant distance between the panel 140 and the back cover 100 , and is connected to the second horizontal part and is connected to the panel 140 . and a vertical portion enclosing the side of the back cover 100 .

The middle cabinet 130 having a T-shaped cross section is coupled to the back cover 100 through the double-sided adhesive member 120 in the end region of the flat back cover 100 , and the second of the middle cabinet 130 . The panel 140 is adhered and fixed on the horizontal part.

The vertical portion of the middle cabinet 130 surrounding the side surfaces of the panel 140 and the back cover 100 may have a T-shaped cross-section, and may be formed in a round shape to soften the outside of the display device to improve aesthetics. there is.

In this case, in the structure according to the embodiment of the present invention, the outer portion of the inner plate 110 extending to the second horizontal portion of the middle cabinet 130 is located between the panel 140 and the second horizontal portion of the middle cabinet 130 . will do

In more detail, on the outer portion of the inner plate 110 extending to the second horizontal portion of the middle cabinet 130, a protrusion protruding downward is located in the remaining area except for the lower portion.

The shape of the protrusion may be a circular shape or a rectangular shape in cross section, but is not limited thereto.

A hole h into which the protrusion of the inner plate 110 can be inserted is located in the second horizontal portion of the middle cabinet 130 supporting the panel 140 and the inner plate 110 in the remaining area except for the lower end.

Through this, the protrusion located on the outer portion of the inner plate 110 and the hole h located on the second horizontal portion of the middle cabinet are coupled to each other.

Therefore, in the structure according to the embodiment of the present invention, bending of the inner plate 110 can occur only by combining the outer portion of the inner plate 110 and the middle cabinet 130 without changing the shape of other parts, so that the panel 140 ), the distance between the inner plate 110 and the panel 140 may be narrowed from the central portion to the outer portion.

Additionally, by disposing a double-sided adhesive member 120 whose cross-section becomes thicker as it goes from the central portion of the panel 140 to the outer portion between the inner plate 110 and the back cover 100, a more robust and precise inner plate ( 110) can be adjusted.

5 is an enlarged view of left and right middle cabinets and inner plates according to an embodiment of the present invention.

In more detail, in the structure according to the embodiment of the present invention, the second horizontal portion of the middle cabinet 130 is positioned at the upper end of the back cover 100 , and the hole positioned in the second horizontal portion of the middle cabinet 130 is the inner plate 110 . ), and the inner plate 110 may be adhered to the panel 140 through the double-sided adhesive member 120 .

At this time, the portion where the hole of the middle cabinet 130 and the protrusion of the inner plate 110 are coupled is arranged as a non-display area of the panel 140 to prevent defects such as dark spots on the display area A/A. can be removed

In addition, the double-sided adhesive member 120 positioned at the upper end of the region where the hole of the middle cabinet 130 and the protrusion of the inner plate 110 are combined not only further improves the bonding force of the panel 140 , but also improves the bonding force of the middle cabinet 130 . ) and the binding force with it can also be improved.

Accordingly, through the structure according to the embodiment of the present invention, it is possible to improve the rigidity of the display device more firmly by improving the coupling force between the components without changing the overall thickness of the display device.

In addition, due to the inner plate 110 bent in the structure according to the embodiment of the present invention, the interval between the panel 140 and the inner plate 110 becomes narrower from the central part to the outer part, and through this, the heat dissipation effect is weak panel ( Since the heat generated in the outer part of the 140) can be moved to the back cover 100 through the inner plate 110 and released, the heat dissipation characteristic of the outer part of the display device can be improved compared to the conventional structure shown in FIG. 2 . there is.

6 illustrates a vertical cross-section of a display device including a middle cabinet and an inner plate according to an exemplary embodiment of the present invention.

The coupling structure of the middle cabinet 130 and the inner plate 110 according to the embodiment of the present invention is located in the upper and both side regions except for the lower end of the display device in which the source PCB is located.

By locating the fastening structure of the middle cabinet 130 and the inner plate 110 in the remaining upper and both side regions except for the lower part of the display device, a circuit component capable of applying a display signal, such as a source PCB equivalent, can be positioned. It is possible to control the bending of the inner plate 110 while securing the inner plate 110, and to improve the bonding force between the parts.

7 is an enlarged view of upper and lower middle cabinets and inner plates according to an embodiment of the present invention.

More specifically, in the structure according to the embodiment of the present invention, the middle cabinet 130 and the inner plate 110 are fastened at the upper end of the display device, and the hole h is not located at the lower end of the display device. (130) is placed.

In this case, the inner plate 110 under the panel 140 is disposed at the same height as the inner plate 110 at the upper portion of the panel 140 using the double-sided adhesive member 120 that becomes thicker from the center portion to the outer portion of the panel 140 . can do it

According to an embodiment of the present invention, in the display device, the second horizontal portion of the middle cabinet 130 in which the hole h is not located at the bottom supports the lower end of the panel 140, and a double-sided adhesive member 120 therebetween. is positioned to fix the middle cabinet 130 and the panel 140 .

Therefore, in the display device according to the embodiment of the present invention, the middle cabinet 130 and the inner plate 110 are coupled to the remaining area except for the lower end of the display device through the hole h and the protrusion to improve the coupling force between the components to display. The overall rigidity of the device is improved, and the distance between the panel 140 and the inner plate 110 becomes narrower from the central portion to the outer portion due to the curved inner plate 110, and through this, the outer edge of the panel 140, which has a weak heat dissipation effect. Since heat generated from the unit may be moved to the back cover 100 through the inner plate 110 to be discharged, heat dissipation characteristics of the outer portion of the display device may be improved.

Furthermore, the display device according to the embodiment of the present invention does not change the structure of the lower end of the display device, so an additional space is not required to secure an area for locating circuit components to which display signals can be applied, such as a source PCB equivalent. Therefore, the heat dissipation characteristic of the outer portion of the panel 140 may be improved while maintaining a slim thickness of the display device.

The back cover 100 in the present specification is not limited to the term, but a plate bottom, a cover bottom, a base frame, a metal frame, and a metal chassis. Chassis), chassis base, m-chassis, etc. can be used in other expressions, and should be understood as a concept including all types of frame or plate-like structures disposed on the rear base of the display device as a support for supporting the display panel. something to do.

In addition, as used herein, the term “display device” refers to a display device in a narrow sense, such as a liquid crystal module (LCM) including a display panel and a driving unit for driving the display panel, and an organic light emitting display module (OLED module). Of course, it is used as a concept including a set electronic device or even a set device such as a laptop computer, a television, a computer monitor, a mobile electronic device such as a smart phone or an electronic pad, which is a finished product including such an LCM and an OLED module.

That is, the display device in the present specification is used in the sense of including not only a narrow display device such as an LCM or an OLED module, but also a set device that is an application product including the same.

On the other hand, the back cover 100 according to this embodiment may be formed of a metal having thermal conductivity and a material containing metal, for example, electrolytic galvanized iron (EGI), hot-dip galvanized steel sheet, galvalume steel sheet, It may be composed of PCM (Pre-Coated Metal) material, which is a color steel sheet material that is coated with polyester resin or attached with a lami film, to steel sheet materials such as aluminum-coated steel sheet and electro-galvanized steel sheet, but limited thereto. it is not going to be

As described above, the panel 140 used in the display device according to the present embodiment is, in principle, a liquid crystal display panel, an organic light emitting diode (OLED) display panel, and a plasma display panel (PDP). All types of display panels such as, etc. may be used, and the structure of the middle cabinet and the inner plate according to the present embodiment is not limited to a specific display panel as long as the structure can be applied.

However, when the display panel is a liquid crystal display panel, a backlight unit including a light source, a light guide plate, an optical sheet, etc. must be provided between the display panel and the back cover or cover bottom, and a support structure for supporting the backlight unit is further provided. It may be necessary, and since the liquid crystal material is more resistant to heat than the organic light emitting material, which will be described below, the room for application of the inner plate of this embodiment may be somewhat low.

On the other hand, in the case of an organic light emitting (OLED) display panel, several layers such as a light emitting panel layer and an encapsulation layer as a glass substrate including an organic light emitting device and a thin film transistor (TFT) are formed into one panel. The structure of the middle cabinet and the inner plate according to the present embodiment is easy to apply because it is a single assembly type that is laminated, and a backlight unit such as a separate light source is not required because the organic light emitting device used is a self-luminous device.

In addition, the organic light emitting device or organic light emitting material used in the organic light emitting display panel is more vulnerable to heat than the liquid crystal material, and heat dissipation of the display device becomes more important, so the need for the inner plate according to the present embodiment is greater.

Accordingly, the panel 140 according to the present exemplary embodiment may be an organic light emitting (OLED) display panel.

8 shows various cross-sectional structures of the organic light emitting display panel used in the display device according to the present embodiment.

As described above, the display panel used in the display device to which this embodiment is applied may include a liquid crystal display panel, an organic light emitting display panel, etc., but it does not require a backlight unit and heat dissipation characteristics are important because the light emitting device is vulnerable to heat. In consideration of this, it may be more advantageous to be applied to a display device having an organic light emitting display panel.

The organic light emitting display panel 140 that can be used in this embodiment includes a light emitting layer including a substrate and a plurality of thin film transistors formed on the substrate, and an organic light emitting element layer that emits light between both electrode layers disposed on one side of the thin film transistor; It may be configured to include an encapsulation layer disposed on one side of the light emitting layer.

Meanwhile, the organic light emitting display panel according to the present embodiment may be classified into a top emission method and a bottom emission method according to a direction in which light from the organic light emitting device layer travels.

Briefly stated, in the top emission method, light generated from the organic light emitting device layer travels in an upper direction opposite to the substrate of the light emitting layer, and one surface in the opposite direction to the substrate becomes an image display surface.

Conversely, in the bottom emission method, the light generated from the organic light emitting device layer travels in the direction of the substrate of the light emitting layer and is emitted through the substrate. In this case, the outer surface of the substrate of the light emitting layer becomes the image display surface.

8A is a cross-sectional view of a top emission type display panel in which light is emitted in a thin film transistor (TFT) direction with respect to a substrate of a light emitting layer in an organic light emitting display panel.

As shown in FIG. 8A , the top emission type organic light emitting display panel 1100 may include a light emitting layer 1180 and an encapsulation layer 1190 disposed on one side of the light emitting layer to protect the light emitting layer. .

The light emitting layer 1180 is an array substrate unit including an organic light emitting device layer that emits light, and includes a glass substrate 1182 , a plurality of thin film transistor layers (TFTs) 1184 formed on the glass substrate 1182 , and a thin film. The organic light emitting device layers 1186 disposed on one side of the transistor layer are sequentially stacked.

Although not shown, a first electrode (anode or cathode electrode) connected to the source or drain electrode of the thin film transistor and a second electrode (cathode or anode) are disposed, and an organic light emitting device layer 1186 is disposed between both electrode layers. .

The organic light emitting diode emits light by self-luminescence according to a potential difference generated between both electrodes by the switching operation of the thin film transistor.

On the other hand, there is no problem in the direction in which the glass substrate is arranged from both sides of the light emitting layer because the glass substrate prevents the inflow of external moisture and foreign substances, but in the opposite direction of the glass substrate, that is, the organic light emitting display layer is formed. Since moisture, foreign substances, etc. can enter from the outside, it is necessary to protect it.

The encapsulation layer 1182 is a protective layer used for this purpose, and is bonded to the upper surface of the organic light emitting device layer of the light emitting layer to prevent damage to the organic light emitting device.

In this specification, the encapsulation layer is not limited to the term, and it should be understood as a concept including all kinds of protective layers disposed to protect the organic light emitting device layer of the light emitting layer constituting the organic light emitting display panel, It may be expressed in other terms, such as a protective layer and a second substrate layer.

On the other hand, as shown in FIG. 8A , in the top emission method, light is emitted in the opposite direction to the glass substrate 1182 of the light emitting layer, and an image display surface is formed in the direction, and the image display surface direction, that is, the organic light emitting device An encapsulation layer 1190 is formed on the immediately outer surface of the layer 1186 .

In addition, as shown in FIG. 8A , in the top emission method, since the encapsulation layer 1190 is disposed on the image display surface side, it must be transparent, and consequently, it must be made of a glass material or the like. In addition, in the top-emission method, since the encapsulation layer 1190 forms an image display surface exposed to an observer, it must have a certain level of rigidity to be strong against external shocks.

Therefore, in the top-emission method, the encapsulation layer 1190 must be formed of a glass layer having a relatively thick first thickness T1, and in a large TV or the like, the first thickness T1 of the encapsulation layer 1190 is at least about It should be more than 1mm.

8B and 8C are cross-sectional views of a bottom emission type organic light emitting display panel. FIG. 8B is a case in which a glass light emitting layer for each color is applied, and FIG. 8C is a white organic light emitting layer (WOLED) and a color filter layer used. case, and will be described below with reference to FIG. 8B.

As shown in FIG. 8B , an organic light emitting display panel 1200 that can be used in a display device according to an embodiment of the present invention includes an encapsulation layer 1290 , a light emitting layer 1280 disposed on the encapsulation layer, and light emission. It may include a polarization ray 1270 disposed on the layer.

The light emitting layer 1280 refers to an array substrate unit including an organic light emitting device layer that emits light, and again includes a glass material substrate 1211 and a plurality of thin film transistor layers (TFTs) 1214 formed on the substrate 1211 . and an organic light emitting device layer 1219 disposed on one side of the thin film transistor layer is sequentially stacked.

As will be described in more detail in FIG. 9 , a first electrode (anode or cathode electrode) connected to the source or drain electrode of the thin film transistor and a second electrode (cathode or anode) are disposed and an organic light emitting device layer is disposed between both electrode layers (1219) is deployed.

The organic light emitting diode emits light by self-luminescence according to a potential difference generated between both electrodes by the switching operation of the thin film transistor.

At this time, one surface of the polarization layer 1270 becomes an image display surface on which an image is displayed, and a polarization layer 1270, a light emitting layer 1280, and an encapsulation layer 1290 are disposed under the image display surface in order, In some cases, the polarization layer 1270 may not be included.

On the other hand, FIG. 8B illustrates a case in which an organic light emitting material for outputting light for each color (R, G, B) is used for the organic light emitting device layer 1219 constituting the light emitting layer 1280 without a separate color filter, , FIG. 8C shows an example in which the organic light emitting device layer is a white organic light emitting device layer 1264 emitting white light, and includes a color filter layer 1248 disposed on the white organic light emitting device layer.

8B and 8C, in the bottom emission type organic light emitting display panel 1200, the light emitting layer 1280 is below the substrate 1211 and the thin film transistor layer 1214 with respect to the image display surface. , the organic light emitting device layer 1219 is sequentially disposed.

In this state, the light emitted from the organic light emitting device layer passes through the thin film transistor layer 1214 and the substrate 1211 . Therefore, assuming that the substrate 1211 is at the lower side (bottom side), it is expressed as a bottom emission method in which light is emitted in the direction of the substrate.

In the bottom emission type organic light emitting display panel 1200 , an encapsulation layer 1290 is disposed adjacent to the organic light emitting diode layer 1219 to protect the organic light emitting diode layer 1219 .

Therefore, the top-emission encapsulation layer ( 1190 in FIG. 8A ) is disposed on the image display surface side, whereas in the bottom-emission method as in FIGS. 8B and 8C , the encapsulation layer 1290 is disposed on the image display surface. Since it is disposed on the opposite side, there is no need for a transparent material, and the degree of rigidity that requires protection from external impact is also not required.

That is, it is sufficient if the encapsulation layer 1290 in the bottom emission method has only a function of preventing the penetration of moisture and foreign substances into the organic light emitting device layer of the light emitting layer 1280 .

Accordingly, the encapsulation layer 1290_ of the organic light emitting display panel according to the present embodiment has a second thickness T2 smaller than the first thickness T1 of the top-emission encapsulation layer 1190. It can be implemented with a metal material thin film or the like.

In fact, the second thickness of the encapsulation layer 1290 of the organic light emitting display panel according to the present exemplary embodiment may be about 0.05 to 0.2 mm.

In addition, the material constituting the encapsulation layer 1290 of the organic light emitting display panel according to the present embodiment is not limited to metal, and can be formed of a thin film capable of protecting the organic light emitting device layer. There are no restrictions.

However, in order to prevent hydrogen, oxygen, etc. from penetrating into the organic light emitting element layer 1219 and oxidizing the organic light emitting element, it is made of an iron-nickel alloy, a so-called Invar metal material, that blocks the permeation of hydrogen/oxygen. It is preferable to form

In addition, the encapsulation layer 1290 is preferably formed of a metal material having a reflective characteristic of a predetermined or higher.

Since the light emitted from the organic light emitting device layer 1219 must be output to the image display surface in the opposite direction to the encapsulation layer 1290, the encapsulation layer 1290 is formed of a metal material having a reflective characteristic of a certain level or higher. This is because, in this case, the encapsulation layer 1290 has a function of a kind of reflector, so that the light efficiency of the display panel can be improved.

As described above, when the bottom emission type organic light emitting display panel is used according to an embodiment of the present invention, the thickness of the encapsulation layer can be reduced compared to the top emission type as shown in FIG. 8A, and the encapsulation layer 1290 ), there is an advantage in that the light efficiency of the display panel can be improved according to the reflection characteristics.

As shown in FIGS. 8B and 8C , the light emitted from the organic light emitting device layer 1219 must be output to the image display surface in the opposite direction to the encapsulation layer 1290 . This is because, when formed of a metal material having characteristics, the encapsulation layer 1290 functions as a kind of reflective plate, thereby improving the light efficiency of the display panel.

On the other hand, unlike FIG. 8B to which glass light-emitting layers for each color are applied, FIG. 8C shows that the organic light-emitting device layer is a white organic light-emitting device layer (WOLED; 1264) emitting white light, and a color filter layer 1248 disposed on the white organic light-emitting device layer. ) is shown as an example.

In general, since the light efficiency of the white organic light emitting diode is superior to that of the other color organic light emitting diodes, the light efficiency of the organic light emitting diode display can be further improved by using the structure shown in FIG. 8C.

9 is a detailed cross-sectional view illustrating a stacked structure of a bottom emission type organic light emitting display panel that can be used in an embodiment of the present invention.

For convenience, the light emission direction or the image display surface in FIG. 9 is shown to face downward in the drawing opposite to FIG. 8 .

As shown in FIG. 9 , a polarization layer 1270 is disposed on the image display surface side, a light emitting layer 1280 is stacked in contact with it, and an encapsulation layer 1290 is disposed on one surface of the light emitting layer 1280 .

A detailed configuration of the light emitting layer 1280 of the bottom emission type organic light emitting display panel used in this embodiment will be described as follows.

On the substrate 1211 of the light emitting layer 1280 , a buffer layer 1220 , a light blocking layer 1222 , a first interlayer insulating film 1224 , a semiconductor layer 1226 , a gate insulating film 1228 , a gate electrode 1230 , and a second Interlayer insulating film 1232 , source electrode 1242 , drain electrode 1244 , third interlayer insulating film 1246 , color filter 1248 , planarization layer 1250 , first electrode 1260 , bank 1262 , An organic light emitting device layer 1264 , a second electrode 1266 , a passivation layer 1270 , and the like may be disposed.

Meanwhile, the substrate 1211 of the light emitting layer 1280 may be a glass substrate, but is not limited thereto, and a plastic including polyethylen terephthalate (PET), polyethylen naphthalate (PEN), polyimide, and the like. It may be a substrate or the like.

The buffer layer 1220 is to block penetration of impurity elements on the substrate 1211 or to improve interfacial properties and flatness, and may be formed of a single layer or multiple layers such as silicon nitride (SiOx), silicon oxide (SiNx), etc. can

The light blocking layer 1222 is for blocking light incident to the channel region of the semiconductor layer 1226 . To this end, the light blocking layer 1222 may be formed of an opaque metal layer to block light. In addition, the light blocking layer 1222 may be electrically connected to the drain electrode 1244 to prevent parasitic capacitance.

The first interlayer insulating film 1224 insulates the light blocking layer 1222 and the semiconductor layer 1226 from each other. The first interlayer insulating layer 1224 may include an insulating material and may be stacked on the buffer layer 1220 and the light blocking layer 1222 .

The semiconductor layer 1226 is disposed on the first interlayer insulating layer 1224 including silicon (Si), and includes an active region constituting a channel, and a source region and a drain region doped with a high concentration of impurities on both sides of the active region. can be

The gate insulating layer 1228 insulates the semiconductor layer 1226 and the gate electrode 1230 from each other. The gate insulating layer 1228 may include an insulating material and may be stacked on the semiconductor layer 1226 .

The gate electrode 1230 is disposed on the gate insulating layer 1228 and receives a gate voltage from a gate line.

The second interlayer insulating layer 1232 protects the gate electrode 1230 and insulates the gate electrode 1230 , the source electrode 1242 , and the drain electrode 1244 from each other. The second interlayer insulating layer 1232 may include an insulating material and may be stacked on the first interlayer insulating layer 1244 , the semiconductor layer 1226 , and the gate electrode 1230 .

Each of the source electrode 1242 and the drain electrode 1244 is disposed on the second interlayer insulating layer 1232 , and contacts the semiconductor layer 1226 through first and second contact holes formed in the second interlayer insulating layer 1232 . can do. Also, the drain electrode 1244 may contact the light blocking layer 1222 through the third contact hole.

Here, the source electrode 1242 and the drain electrode 1244, the semiconductor layer 1226 in contact with these electrodes, and the gate insulating film 1228 and the gate electrode 1230 formed on the semiconductor layer 1226 are thin film transistors. Layer 1214 may be configured.

The third interlayer insulating layer 1246 protects the source electrode 1242 and the drain electrode 1244 .

The color filter 1248 may be disposed on the second interlayer insulating layer 1232 to overlap the organic light emitting device layer 1216 in order to change the color of light emitted toward the substrate 1211 in the bottom emission method.

The planarization layer 1250 may protect the source electrode 1242 and the drain electrode 1244 , and may flatten the surface on which the first electrode 1260 is disposed.

The first electrode 1260 may be disposed on the planarization layer 1250 and may contact the drain electrode 1244 through a fourth contact hole formed in the planarization layer 1250 . In addition, the first electrode 1260 serves as an anode electrode, and may be formed of a transparent conductive material having a relatively large work function value so that light generated from the organic light emitting device layer 1264 is transmitted.

For example, the first electrode 1260 may include a metal oxide such as Indium Tin Oxide (ITO) or Indium Zinc Oxide (IZO), a mixture of a metal and oxide such as ZnO:AI or SnO2:Sb, and a pulley (3-methylti offene), poly[3,4-(ethylene-1,2-dioxy)thiophene (PEDT), polypyrrole, and a conductive polymer such as polyaniline. In addition, the first electrode 1260 may be formed of a carbon nano tube (CNT), graphene, silver nano wire, or the like.

The organic light emitting device layer 1264 is disposed on the first electrode 1260 and is composed of a single layer made of a light emitting material, or a multilayer of a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer. can The organic light emitting device layer 1264 may be a white light organic light emitting device layer that outputs white light, and may be applied to the entire surface without patterning. In the organic light emitting device layer 1264 , the patterning process is omitted, thereby simplifying the process or reducing cost.

The second electrode 1266 is disposed on the organic light emitting device layer 1264 and, as a cathode electrode (cathode), may be made of a conductive material having a relatively small work function value. Here, the second electrode 1266 may be formed of a single layer of a single metal such as Ag or an alloy composed of a certain ratio of Mg or the like or multiple layers thereof according to the bottom emission method.

A first electrode 1260 connected to the thin film transistor, a second electrode 1266 disposed to face the first electrode 1260 , and an organic light emitting diode interposed between the first electrode 1260 and the second electrode 1266 . The device layer 1264 may be collectively expressed as an organic light emitting device.

In the organic light emitting device layer 1264, when a predetermined voltage is applied to the first electrode 1260 and the second electrode 1266, holes injected from the first electrode 1260 and electrons provided from the second electrode 1266 are It is transported to the organic light emitting device layer 1264 to form an exciton, and when the exciton is transitioned from an excited state to a ground state, light is generated and may be emitted in the form of visible light.

The bank is formed on the edge of the first electrode 1260 and may have an opening to expose the first electrode 1260 / The bank may be formed of an inorganic insulating material such as SiOx, SiNx, or SiON.

The passivation layer 1270 serves to protect the organic layer from moisture and oxygen, and may have a multi-layer structure of inorganic materials, organic materials, and mixtures thereof.

Meanwhile, a single low reflection layer 1271 may be provided on each of the light blocking layer 1222 , the gate electrode 1230 , the source electrode 1242 , and the drain electrode 1244 . The low-reflective layer prevents reflection of external light, thereby preventing problems such as a decrease in visibility, a decrease in luminance, and a decrease in the contrast ratio.

The low reflection layer 1271 may be made of a material that absorbs external light introduced through the substrate 1211 , or a light absorber may be applied thereto. Here, the external light may mean unpolarized light that has not passed through a polarizing plate or a polarizing layer.

The material absorbing external light may be made of a light absorbing metal or an alloy thereof, and may have a black-based color. For example, the low reflection layer 1271 may be any one of molybdenum (Mo), chromium (Cr), titanium (Ti), niobium (Nb), manganese (Mn), and tantalum (TA) or an alloy thereof. . However, embodiments are not limited thereto, and may be other metals capable of absorbing light. Accordingly, the low reflection layer 1271 may prevent external light from being reflected back to the outside.

In addition, the low reflection layer 1271 may be made of a metal oxide or an alloy of a metal and metal oxide that absorbs light, and may block light introduced from the outside. The low reflection layer 1271 may be made of, for example, a metal oxide such as Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), and Indium Tin Zinc Oxide (ITZO). The light reflected from the surface of , after passing through the low reflection layer 1271, and the light reflected at the interface between the conductive layer and the low reflection layer 1271 cause destructive interference with each other, so that it cannot go out again.

Meanwhile, the organic light emitting display panel 1200 according to the present embodiment further includes an adjustment film (not shown) and/or a transparent multilayer film (not shown) disposed on one surface of the substrate 211 to absorb light of a visible wavelength. can do.

The transmittance control film has a predetermined transmittance by absorbing light incident on the substrate 1211 from the outside, and functions to greatly reduce the reflectance of the substrate 1211 through absorption of extraneous light.

The transparent multilayer film has a structure in which a plurality of refractive layers having different refractive indices are stacked between adjacent layers, and functions to reduce the reflectance of external light by canceling external light by destructive interference of light reflected from refractive layers having different refractive indices.

The transmittance adjusting film and/or the transparent multilayer film may constitute the aforementioned polarization layer 1270 itself or a part thereof.

As described above, according to the embodiment of the present invention, the thickness of the double-sided adhesive member of the display device is formed to increase from the central portion of the panel to at least one corner portion, so that the inner plate at the upper end of the double-sided adhesive member is bent. Due to this, it is possible to improve the quality of the display device by reducing heat generation of at least one corner portion of the panel, which is vulnerable to heat dissipation.

In addition, a hole is formed in the horizontal portion of the middle cabinet for supporting the panel, and a projection is formed in at least one corner portion of the inner plate that extends to the horizontal portion of the middle cabinet to separate the hole of the middle cabinet and the projection of the inner plate from each other. In combination, the inner plate is naturally bent, thereby reducing heat generation at at least one corner portion of the panel, which is vulnerable to heat dissipation, thereby improving the quality of the display device.

Moreover, the coupling structure of the hole of the middle cabinet and the protrusion of the inner plate not only improves the heat dissipation effect, but also has the effect of improving the rigidity of the display device by making the coupling between components more robust without changing the thickness of the display panel. .

The above description and the accompanying drawings are merely illustrative of the technical spirit of the present invention, and those of ordinary skill in the art to which the present invention pertains can combine configurations within a range that does not depart from the essential characteristics of the present invention. , various modifications and variations such as separation, substitution and alteration will be possible. Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain, and the scope of the technical spirit of the present invention is not limited by these embodiments. The protection scope of the present invention should be construed by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

100: back cover
110: inner plate
120: double-sided adhesive member
130: middle cabinet
140: panel
150: source PCB
A/A : Display area
G, G' : Air gap
1280: light emitting layer
1290 : encapsulation layer
1211: substrate
1214: thin film transistor (layer)
1219, 1264: organic light emitting device layer

Claims (17)

a display panel for displaying an image;
a back cover supporting the rear of the display panel and including a first horizontal part;
an inner plate positioned on the first horizontal portion of the back cover;
a plurality of double-sided adhesive members positioned between the inner plate and the back cover;
an air gap between the inner plate and the display panel;
The plurality of double-sided adhesive members are disposed on top of the first horizontal part of the back cover to be spaced apart from each other,
A height of the cross-sections of the plurality of double-sided adhesive members increases from a central portion of the display panel toward at least one corner portion;
The display device according to claim 1, wherein the air gap decreases from a central portion of the display panel toward at least one corner portion.
The method of claim 1,
Each of the plurality of double-sided adhesive members is made of a single layer,
The thickness of the single layer increases from a central portion of the display panel toward at least one corner portion;
The display device of claim 1, wherein the inner plate is bent by the plurality of double-sided adhesive members.
The method of claim 1,
Each of the plurality of double-sided adhesive members is made of a multi-layer in which a plurality of single layers of the same thickness are stacked,
The number of the plurality of single layers increases from the central portion of the display panel toward at least one corner portion,
The display device of claim 1, wherein the inner plate is bent by the plurality of double-sided adhesive members.
The method of claim 1,
The display device of claim 1, further comprising a middle cabinet supporting the display panel and the inner plate.
5. The method of claim 4,
The middle cabinet includes a second horizontal part supporting the display panel and the inner plate and maintaining a constant distance between the display panel and the back cover, and is connected to the second horizontal part to provide the panel and the back cover. A display device, characterized in that it has a vertical portion that surrounds the side of the .
6. The method of claim 5,
The display device according to claim 1, wherein a hole is located in a second horizontal portion of an area other than a lower end of the middle cabinet, and a protrusion is located in an outer portion of an area other than a lower end of the inner plate.
7. The method of claim 6,
and the hole positioned in the second horizontal portion of the middle cabinet and the protrusion positioned at the outermost portion of the inner plate are coupled to each other.
8. The method of claim 7,
Each of the plurality of double-sided adhesive members is made of a single layer,
The thickness of the single layer increases from a central portion of the display panel toward at least one corner portion of the display panel.
8. The method of claim 7,
Each of the plurality of double-sided adhesive members is made of a multi-layer in which a plurality of single layers of the same thickness are stacked,
The number of the plurality of single layers increases from a central portion of the display panel to at least one corner portion of the display panel.
10. The method according to claim 8 or 9,
A display device, characterized in that the source PCB is located at the lower end of the panel.
10. The method according to any one of claims 2 to 9,
The inner plate radiates heat generated from the panel through the contacted back cover.
10. The method according to any one of claims 2 to 9,
The inner plate is a display device that radiates additional heat generated from the logo of a broadcaster in the form of a mark appearing on a corner of the display panel through the contacted back cover.
The method of claim 1,
The display panel includes a substrate, a thin film transistor formed on the substrate, a light emitting layer including an organic light emitting device layer emitting light between both electrode layers disposed on one side of the thin film transistor, and an encapsulant disposed on one side of the light emitting layer A display device, which is an organic light emitting display panel including a light emitting layer.
13. The method of claim 12,
The organic light emitting display panel is a bottom emission type organic light emitting display panel in which light from the organic light emitting device layer is emitted through the substrate.
14. The method of claim 13,
When the light emitting surface of the organic light emitting display panel is defined as the image display surface, the light emitting layer and the encapsulation layer are sequentially stacked under the image display surface, and the light emitting layer is the image display surface A display device in which the substrate, the thin film transistor, and the organic light emitting device layer are sequentially disposed under the substrate, and a polarization layer is further disposed on the substrate.
15. The method of claim 14,
The organic light emitting device layer is a white organic light emitting device layer that emits white light, and the light emitting layer further includes a color filter layer disposed on the white organic light emitting device layer. 8. The method of claim 7,
The lower end of the display panel is fixed to the middle cabinet through a second double-sided adhesive member,
The display device, characterized in that the remaining area except for the lower end of the display panel is fixed to the inner plate through a third double-sided adhesive member.

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