KR102291610B1 - Force sensor and method for manufacturing the force sensor - Google Patents

Abstract

The present invention relates to a force sensor and a method for manufacturing the force sensor, the method for manufacturing the force sensor according to the present invention comprises the steps of arranging a first spacer for supporting a substrate part at a position spaced apart from a flat plate module, a ground part In order to form an elastic layer formed between the substrate and the ground portion so that the position of the ground portion changes with respect to the substrate portion by an external force, an elastic liquid is applied on the flat panel module, the insertion module is inserted into the hole, and the substrate portion is the first spacer. It is characterized in that it comprises the steps of seating on the bed, disposing a second spacer between the hole and the insertion module, and curing the elastomeric liquid.

Description

FORCE SENSOR AND METHOD FOR MANUFACTURING THE FORCE SENSOR

The present invention relates to a force sensor and a method of manufacturing the force sensor, and more particularly, a (multi-axis) force sensor capable of accurately measuring an external force using a capacitance value and capable of being manufactured in a compact size and manufacturing the force sensor it's about how

A mechanical device such as an industrial robot is equipped with a sensor for measuring a force or torque applied during operation. At this time, since force and torque are applied to the mechanical device in various directions and affect the operation of the mechanical device, a sensor capable of measuring such force and torque is required for accurate control of the mechanical device.

Korean Patent Registration No. 10-1470160 relates to a flat-panel force/torque sensor capable of measuring force and torque in various directions. When an external force is applied vertically to the sensor cell, the distance between the first electrode and the second electrode As it decreases, the capacitance (capacitance) value increases, and when an external force is applied horizontally to the sensor cell, the opposite area between the first electrode and the second electrode decreases and the capacitance value decreases using the principle of reducing the vertical and horizontal drag. A sensor capable of measuring has been disclosed.

However, in the case of the electrode structure as described above, although the change in the capacitance value according to the change in the distance between the electrodes is large, the change in the capacitance value according to the change in the opposing area is not large, so it is difficult to accurately measure the horizontal drag.

Although various attempts have been made to solve this problem, the capacitance method has high measurement precision, and in particular, multi-axis forces (forces and torques in a Cartesian coordinate system (F _x , F _y , F _z , T _x , T _y , T There has been a problem in that it is difficult to fabricate a multiaxial force sensor that measures _{z )).}

In particular, in the case of the conventional multi-axis force sensor, there is a problem that it is difficult to manufacture in a small size.

Republic of Korea Patent No. 10-1470160

Accordingly, an object of the present invention is to solve such a problem in the prior art, by providing an elastic layer without arranging a separate structure for elastic movement between the substrate part and the ground part, so that the elastic layer is deformed when an external force is applied. An object of the present invention is to provide a method for manufacturing a small force sensor by manufacturing the ground unit to move with respect to the substrate unit.

In addition, it is to provide a force sensor manufactured by the above method.

The problems to be solved by the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

The above object is, according to the present invention, a flat plate module and a ground portion including an insertion module protruding in a cylindrical shape on one side of the flat plate module; A flat-panel substrate, the substrate portion being spaced apart from the flat-panel module and having a circular hole through which the insertion module can be inserted spaced apart; and an electrode formed on the side of the hole and on the edge of the hole on at least one side of the substrate, receiving power to form an electrode part that forms a capacitance together with the ground part, the flat plate disposing a first spacer for supporting the substrate portion at a position spaced apart from the module; In order to form an elastic layer formed between the ground part and the substrate part so that the position of the ground part is changed with respect to the substrate part by an external force, an elastic body liquid is applied on the flat panel module, and the insertion module is inserted into the inserting the substrate into the hole and seating the substrate on the first spacer; disposing a second spacer between the hole and the insertion module; and curing the elastomer liquid.

Here, the first spacer may be inserted into at least one spacer insertion hole formed in the flat panel module to protrude from the flat panel module.

Here, the first spacer may be a bolt inserted into the spacer insertion hole.

Here, the inner circumferential surface of the second spacer may be in close contact with the outer circumferential surface of the insertion module and may be in close contact with the inner circumferential surface of the hole.

Here, the elastic body may be formed of a dielectric material.

Here, the method may further include fixing the base part to the substrate part.

Here, the method may further include applying an elastic body liquid on the substrate part so that an elastic layer is formed between the substrate part and the base part.

Here, removing the second spacer; and fixing a fixing part having a head part protruding outside a radius of the insertion module to an end of the insertion module.

Here, the method may further include inserting a grounding wire into a grounding hole penetrating the base and the grounding part, and inserting and fixing a closing part blocking the grounding hole while the wire is inserted into the grounding hole. have.

The above object is, according to the present invention, a flat plate module and a ground portion including an insertion module protruding in a cylindrical shape on one side of the flat plate module; A flat-panel substrate, the substrate portion being spaced apart from the flat-panel module and having a circular hole through which the insertion module can be inserted spaced apart; an elastic layer disposed between the substrate part and the flat panel module and formed of an elastic body so that the position of the ground part with respect to the substrate part changes; an electrode formed on a side surface of the hole and an edge of the hole on at least one side of the substrate, the electrode unit receiving power to form a capacitance together with the ground unit; and a force measuring unit for obtaining a vertical force or a horizontal force applied to the ground portion by using the capacitance value.

Here, the electrode formed on the side surface of the hole and the hole edge of the upper surface of the substrate part may be integrally formed.

Here, the electrode part may be formed separately along the circumferential direction of the hole.

Here, the electrode part may be divided into two or more equal parts along the circumferential direction of the hole.

Here, three or more holes in which the insertion module and the electrode part are formed are respectively formed, and the multiaxial force and the multiaxial torque applied to the ground part using the vertical force and the horizontal force measured by the force measuring part. It may further include an operator for obtaining .

According to the force sensor and the method of manufacturing the force sensor of the present invention as described above, the elastic layer does not install a separate elastic structure connecting a plurality of points between the ground portion and the base portion so that the ground portion moves when an external force is applied. It has the advantage of being able to manufacture a small multi-axis force sensor with a diameter of 10 mm or less by providing a.

In addition, although the elastic layer is formed using the spacer, the gap between the electrode and the insertion module can be precisely manufactured, so that the measurement accuracy can be improved.

In addition, there is an advantage that a grounding structure can be simply manufactured by allowing a grounding wire to pass through between the grounding portion and the base portion.

In addition, since the electrode formed on the side of the circular hole and the cylindrical ground electrode are arranged spaced apart in the form of a curved surface, the sensing cross-sectional area can be increased compared to the case where the two plates are arranged spaced apart in a plane, thereby improving the sensitivity of the sensor It also has the advantage of being able to do it.

1 is a cross-sectional view showing a basic structure of a force sensor according to the present invention.
FIG. 2 is an enlarged perspective view of an electrode formed in a circular hole of a substrate in FIG. 1 .
FIG. 3 is a cross-sectional view illustrating the movement of the ground portion when a normal force is applied to the force sensor of FIG. 1 .
FIG. 4 is a cross-sectional view illustrating the movement of the ground part when a normal force is applied at a position different from that of FIG. 3 in the force sensor of FIG. 1 .
FIG. 5 is a cross-sectional view illustrating the movement of the ground part when a horizontal shear force is applied in the force sensor of FIG. 1 .
6 is an exploded perspective view showing the basic structure of a force sensor for measuring six-axis force according to the present invention.
7 is a combined perspective view of FIG. 6 .
8 and 9 are exploded perspective views of a force sensor according to an embodiment of the present invention.
10 is a cross-sectional view of the force sensor coupled in FIGS. 8 and 9 ;
11 is a diagram illustrating a method of manufacturing a force sensor according to an embodiment of the present invention.

The specific details of the embodiments are included in the detailed description and drawings.

Advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, and only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the art to which the present invention pertains It is provided to fully inform those who have the scope of the invention, and the present invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

Hereinafter, the present invention will be described with reference to the drawings for explaining a force sensor and a method of manufacturing the force sensor according to embodiments of the present invention.

Before describing the force sensor and the method of manufacturing the force sensor according to the present invention, the structure and principle of the basic force sensor of the present invention will be described with reference to FIGS. 1 to 7 .

1 is a cross-sectional view showing a basic structure of a force sensor according to the present invention, FIG. 2 is an enlarged perspective view showing an electrode formed in a circular hole of the substrate part in FIG. 1, and FIG. 3 is the force sensor of FIG. It is a cross-sectional view showing the movement of the ground portion when a normal force is applied, and FIG. 4 shows the movement of the ground portion when a normal force is applied at a position different from that of FIG. 3 in the force sensor of FIG. Fig. 5 is a cross-sectional view showing the movement of the ground part when a horizontal force is applied in the force sensor of Fig. 1, and Fig. 6 is a force sensor measuring the force of 6 axes according to the present invention. It is an exploded perspective view showing a basic structure, and FIG. 7 is a combined perspective view of FIG. 6 .

As shown in FIG. 1 , the force sensor 100 according to the present invention is a sensor for measuring a vertical force (normal force) and a horizontal force (shear force), and includes a ground unit 110 and a substrate unit. (120), the electrode unit 130, and may be configured to include a force measuring unit (not shown).

The ground unit 110 may be configured such that its position with respect to the substrate unit 120 changes when an external force is received, and its position can be restored when the external force is removed. In this case, the ground unit 110 may move within a predetermined range in a three-dimensional space when an external force is applied.

The ground part 110 is made of a grounded conductor, and capacitance is formed by the electrode part 130 and the dielectric 140 formed between the ground part 110 and the electrode part 130 to be described later.

The ground unit 110 may be composed of a flat plate module 112 in the form of a flat plate and an insertion module 114 protruding from the lower surface of the flat module 112 in a cylindrical shape, as shown in FIG. 1 . In this case, the flat panel module 112 is horizontally disposed to be spaced apart from the substrate part 120 to be described later by a predetermined distance, and the insertion module 114 is inserted so as to be spaced apart from the side of the hole 122 formed in the substrate part 120 . are placed

The substrate unit 120 is a flat-panel substrate, and may be formed of, for example, a printed circuit board (PCB). The substrate unit 120 is disposed in parallel with the flat panel module 112 of the ground unit 110 to be spaced apart from each other by a predetermined distance. When a force is applied in a vertical downward direction from the top surface of the flat panel module 112 , the ground unit 110 may move to change the distance between the flat panel module 112 and the substrate unit 120 . At this time, it is preferable to arrange so that the substrate unit 120 and the flat panel module 112 do not contact each other even when an external force is applied.

In addition, a circular hole 122 is formed in the substrate part 120 , and the insertion module 114 of the above-described ground part 110 is inserted into the hole 122 . At this time, the inner surface of the hole 122 and the outer surface of the insertion module 114 are disposed to be spaced apart from each other, and when a force is applied to the ground portion 110 in the horizontal direction, the ground portion 110 moves and The distance between the inner surface and the insertion module 114 may be varied. At this time, it is preferable to arrange so that the inner surface of the hole 122 and the insertion module 114 do not come into contact even when an external force is applied.

As shown in FIGS. 1 and 2 , the electrode part 130 integrally formed may be formed on the inner surface of the hole 122 and the edge of the hole 122 on the upper surface of the substrate part 120 . That is, the plating through hole for connecting the interlayer between the upper and lower layers without inserting components into the PCB substrate is called a via hole (Via_Hole). have. In the drawing of FIG. 1 , electrodes are also formed on the lower surface of the substrate unit 120 so that the overall cross-section of the electrode unit 130 has a 'C' shape, but an electrode must be formed on the lower surface of the substrate unit 120 . it doesn't have to be

For convenience of explanation, the electrode part 130 formed on the inner surface of the hole 122 is the side electrode part 131 , and the electrode part 130 formed on the edge of the hole 122 on the upper surface of the substrate part 120 is shown. It is referred to as the upper electrode part 132 and will be described later. As described above, the side electrode part 131 and the top electrode part 132 may be integrally formed without being electrically separated. When power is applied to the electrode part 130 , a capacitance is formed between the adjacent side electrode part 131 and the insertion module 114 , and an electrostatic capacity is formed between the top electrode part 132 and the flat panel module 112 . capacity is formed.

At this time, as shown in FIG. 2 , the electrode part 130 may be formed separately into the first electrode part 130a and the second electrode part 130b along the circumferential direction of the hole 122 , preferably can be bisected. In the present embodiment, the description is focused on the separation into two, but the present invention is not limited thereto and may be divided and divided into more numbers.

In this way, the first electrode part 130a and the second electrode part 130b are physically and electrically separated, and capacitance is measured with respect to the first electrode part 130a and the second electrode part 130b, respectively. , a vertical force and a horizontal force applied to the ground part 110 are measured using the capacitance values measured by the first electrode part 130a and the second electrode part 130b.

A dielectric 140 may be formed in the space between the flat panel module 112 and the substrate 120 and the space between the hole 122 and the insertion module 114 . As the dielectric 140 , a polymer, air , water may be formed, and although not necessarily limited thereto, in the present invention, as will be described later, it is formed of a polymer having dielectric properties and elastic properties. In this regard, it will be described later.

The force measuring unit (not shown) is an arithmetic device formed on the substrate unit 120 , and measures the value of the capacitance formed between the electrode unit 130 and the ground unit 110 when an external force is applied to the ground unit 110 . The force in the vertical direction or the force in the horizontal direction applied to the ground unit 110 is obtained by using it. Preferably, the capacitance value applied to the first electrode part 130a and the capacitance value applied to the second electrode part 130b are obtained, respectively, and the force applied to the ground part 110 in the vertical direction or the horizontal direction is obtained therefrom. Calculate the power of

The capacitance value between the two electrodes 110 and 130 with the dielectric 140 interposed therebetween is inversely proportional to the distance between the two electrodes 110 and 130 . As shown in FIG. 3 , when the ground unit 110 is moved downward by the force in the vertical direction, the distance between the upper electrode unit 132 and the flat panel module 112 is decreased to increase the capacitance value. do.

At this time, when a force is applied to the center of the ground part 110 and the flat panel module 112 moves downward while maintaining the horizontal as shown in FIG. 3 , the first electrode part 130a and the second electrode part ( 130b), since the distances d _1N and d _2N from the flat panel module 112 are the same, the measured capacitance values are all the same.

However, as shown in FIG. 4 , when a force in the vertical direction is applied to an eccentric side rather than the center of the ground unit 110 , the upper electrode at the first electrode unit 130a and the second electrode unit 130b . Each of the parts 132 has different distances d _1N and d _2N from the flat panel module 112 so that the capacitance values in the first electrode part 130a and the second electrode part 130b are different, respectively. do. As described above, by using the change in capacitance values in the first electrode part 130a and the second electrode part 130b together, the force measuring unit is located at the position where the force and the force in the vertical direction applied to the ground part 110 are applied. information can be obtained.

In addition, as in FIG. 5 , when a horizontal force is applied to the ground unit 110 to move the ground unit 110 horizontally (from left to right in the drawing), the side electrode unit 131 and the insertion module 114 ) As the distance between them changes, the capacitance value changes. _{In more detail, the distance d 1s} between the side electrode part 131 of the first electrode part 130a and the insertion module 114 increases, so that the capacitance value becomes small, and the second electrode part 130b _{The distance d 2s} between the side electrode part 131 and the insertion module 114 becomes close, so that the capacitance value increases. In this way, the force measuring unit may obtain the horizontal force applied to the ground unit 110 by using the values of the capacitances that change in the first electrode unit 130a and the second electrode unit 130b.

In the force sensor 100 according to the present invention, an insertion module 114 in the form of a cylinder having a size slightly smaller than the size of the circular hole 122 formed in the substrate 120 is inserted, and the side of the hole 122 and the insertion module ( Since a gap is formed between the 114), if the center positions of the hole 122 and the insertion module 114 are aligned, the two electrodes for measuring the force in the horizontal direction can be arranged, so processing is convenient, there is little processing error, and assembly is easy. There are advantages to losing.

Furthermore, since the side electrode part 131 formed on the side of the hole 122 and the cylindrical insertion module 114 are spaced apart in the shape of a curved surface, the sensing cross-sectional area is compared with the case where the two electrodes are disposed in the shape of a plane. can be increased, so that the sensitivity of the sensor can be further improved.

Hereinafter, a multi-axis force sensor according to an embodiment of the present invention will be described with reference to FIGS. 6 to 7 .

The force in the vertical direction and the force in the horizontal direction applied to the ground unit 110 can be obtained by using the force sensor 100 described above with reference to FIGS. 1 to 5 . In this case, the multi-axis force sensor 200 according to the present invention may include three or more force sensors 100 , and may be configured by coupling each force sensor 100 to have different azimuth angles. In this case, the plurality of force sensors 100 may be arranged to form various azimuth angles from each other, but the plurality of force sensors 100 are arranged on the same plane and spaced apart from each other at the same distance on the same circumference. It is desirable to distribute the force and torque applied in various directions equally to each sensor.

In this embodiment, the multi-axis force means a plurality of components among _{the forces (F x} , F _y , F _z ) and torques (T _x , T _y , T _z ) acting in the three orthogonal directions in the Cartesian coordinate system. do. In the following description, _{the force sensor 200 of 6 axes (F x} , F _y , F _z , T _x , T _y , T _z ) will be described.

A calculation unit (not shown), which is a calculation device, obtains a multiaxial force using the force in the vertical direction and the force in the horizontal direction measured by the force measuring unit with respect to each force sensor 100 . In this case, the multiaxial force and the multiaxial torque may be obtained by calculating the values measured by each force sensor 100 according to a mathematical expression. Since the principle of measuring multiaxial force by disposing a plurality of force sensors 100 for measuring the force in the vertical direction and the force in the horizontal direction is known, a detailed description thereof will be omitted.

6 and 7 show the basic structure of the multi-axis force sensor 200 using three force sensor structures.

Three circular holes 122 are formed in the substrate part 120 , and the holes 122 are respectively formed on the same circumference at intervals of 120 degrees and corresponding to the positions of the vertices of the equilateral triangle. In each hole 122, as described above, the side electrode part 131 and the top electrode part 132 are integrally formed at the edge of the hole 122 on the upper surface of the substrate part 120 of the hole 122, and further The electrode part 130 is formed in a shape separated by the first electrode part 130a and the second electrode part 130b in the circumferential direction of the hole 122 .

In addition, the ground unit 110 is a grounded conductor whose position is changed by an external force, and the flat plate module 112 in the form of a flat plate and three insertion modules 114 protruding from the lower surface of the flat module 112 in a cylindrical shape. is formed, and each insertion module 114 is inserted into the hole 122 formed in the substrate part 120 to be spaced apart.

As described above, the structure of the force sensor 100 described with reference to FIGS. 1 to 5 may be formed in a form in which three are formed on a single substrate unit 120 .

When an external force is applied to the ground unit 110 , the force measuring unit measures the force in the vertical direction and the force in the horizontal direction using the capacitance value with respect to the structure of each force sensor 100 , and the calculating unit measures the force measuring unit The multiaxial force applied to the center of the ground unit 110 may be obtained using the vertical force and the horizontal force measured in .

As described above, in the present invention, when an external force is applied, the position of the ground unit 110 is changed with respect to the substrate unit 120 on which the electrode unit 130 is disposed, and when the external force is removed, the ground unit 110 must return to its original position. Therefore, a separate elastic structure that allows the ground unit 110 to move and return to its original position should be disposed. Such an elastic structure could be formed in the form of elastically supporting a plurality of points of the conventional ground unit 110 . However, when the size of the force sensor according to the present invention is miniaturized, it is difficult to configure and arrange such an elastic structure in a small size, and even if it is arranged, this becomes a factor in which the size of the force sensor becomes large.

Accordingly, in the present invention, an elastic layer 150 formed of a rubber material such as a polymer is formed between the substrate part 120 and the ground part 130 with respect to the force sensors 100 and 200 having the above-described structure to form the elastic layer ( A force sensor that allows the ground unit 110 to move and elastically return due to the deformation of 150) and a method of manufacturing the force sensor will be described.

8 and 9 are exploded perspective views of a force sensor according to an embodiment of the present invention, FIG. 10 is a diagram illustrating a method of manufacturing a force sensor according to an embodiment of the present invention, and FIG. It is a cross-sectional view of the force sensor fabricated by this method.

In FIGS. 8 to 10 , the force sensor 200 in which the structure of the force sensor 100 of FIG. 1 is arranged in the form of an equilateral triangle to measure the force of 6 axes will be described. A force sensor for measuring a force in a vertical direction and a force in a horizontal direction in which only one structure of the force sensor 100 of FIG. 1 is formed will be easily manufactured by those skilled in the art with reference to the following description.

The method of manufacturing the force sensor 200 according to an embodiment of the present invention includes disposing a first spacer 170 for supporting the substrate unit 120 at a position spaced apart from the flat panel module 112 , the ground unit In order to form an elastic layer 150 formed between the 110 and the substrate unit 120 so that the position of the ground unit 110 is changed with respect to the substrate unit 120 by an external force, on the flat panel module 112 . Applying an elastic liquid to the surface, inserting the insertion module 114 into the hole 122, and seating the substrate 120 on the first spacer 170, the inner circumferential surface is in close contact with the outer circumferential surface of the insertion module 114 It may include disposing the second spacer 175 to be used between the hole 122 and the insertion module 114 and curing the elastic liquid.

First, as shown in FIG. 10A , the first spacer 170 is disposed to support the substrate unit 120 at a position spaced apart from the flat panel module 112 of the ground unit 110 . In more detail, at least one spacer insertion hole 115 is formed in the flat panel module 112 , and a bolt that is the first spacer 170 is inserted into the spacer insertion hole 115 so that the end of the body of the bolt is the flat panel module 112 . The first spacers 170 may be disposed to protrude thereon. At this time, as shown, by distributing a plurality of spacer insertion holes 115 at equal positions on the flat panel module 112 , it is possible to stably support the substrate unit 120 . In this embodiment, the spacer insertion hole 115 is disposed at three points in the form of an equilateral triangle.

As will be described later, after the elastic layer 150 is formed by curing the elastic liquid, the first spacer 170 may be easily removed from the ground unit 110 .

Next, an elastic liquid is applied on the flat panel module 112 in which the end of the first spacer 170 is formed to protrude, and the substrate 120 is seated on the first spacer 170 . At this time, the insertion module 114 of the ground unit 110 is inserted into the hole 122 formed in the substrate unit 120 , and the substrate unit 120 is seated on the first spacer 170 . Therefore, it is preferable that the protruding height of the first spacer 170 from the flat panel module 112 is lower than the protruding height of the insertion module 114 . In this way, it is possible to adjust the spacing in the vertical direction so that the substrate unit 120 is located at a position spaced apart from the flat panel module 112 by the first spacer 170 .

At this time, the elastic liquid is cured to form the elastic layer 150 . In the present invention, the elastic layer 150 is formed between the flat panel module 112 of the ground part 110 and the substrate part 120 to form the ground part. When an external force is applied to 110 , the ground unit 110 may move due to elastic deformation of the elastic layer 150 , and when the external force is removed, it may return to its original position according to the restoration of the elastic layer 150 .

The elastic layer 150 of the present invention may also serve as a dielectric interposed between the electrode unit 130 formed in the hole 122 of the substrate unit 120 and the ground unit 110 . Therefore, it is preferable that the elastic liquid applied to the flat plate module 112 be formed of a material having elasticity properties when cured and dielectric properties at the same time.

Next, as shown in (c) of FIG. 10 , the inner circumferential surface is in close contact with the outer circumferential surface of the insertion module 114 and the outer circumferential surface is in close contact with the inner circumferential surface of the hole 122 of the substrate part 120. A second spacer having an insertion groove. 175 is coupled from top to bottom of the insertion module 114 to place the second spacer 175 between the hole 122 and the insertion module 114 . At this time, the second spacer 175 makes the center of the hole 122 formed in the substrate 120 and the center of the insertion module 114 coincide with the center of the insertion module 114 when the elastomer liquid is cured in the horizontal direction of the substrate 120 . It plays a role in positioning.

At this time, the head portion of the upper end of the second spacer 175 has a larger diameter so that it is seated on the substrate 120 , and the elastic liquid flows upward through the gap between the second spacer 175 and the hole 122 . It is preferable to block it.

Next, the elastic liquid is cured as shown in FIG. 10( d ), and after curing of the elastic liquid is completed, the second spacer 175 is removed.

After the second spacer 175 is removed, the space where the second spacer 175 is located between the hole 122 and the insertion module 114 is emptied. A process of hardening by injecting a small amount of an elastic liquid into the space. may further include.

Next, after removing the second spacer 175 , the fixing part 160 is fixed to the end of the insertion module 114 as shown in FIG. 10E . At this time, since the upper end of the fixing unit 160 has a head 161 protruding outside the radius of the insertion module 114, when the ground unit 110 is pulled by a strong external force, the head of the fixing unit 160 is It serves to prevent the ground part 110 from falling out while touching the substrate part 120 . The ground part 110 is not fixed to a separate structure, but is coupled to be elastically movable with respect to the substrate part 120 by the elastic layer 150. am.

In addition, forming the lower portion of the force sensor 200 and may further include a base portion 180 for fixing the substrate portion 120, as shown in Figure 9, the inner surface of the base portion 180, the substrate A groove 181 in which the end portion of the portion 120 is seated is formed, and the groove 181 and an end of the substrate portion 120 seated in the groove 181 as shown in FIG. It can be fixed by bonding between them with an adhesive.

In addition, an elastic layer may be formed in the inner space between the substrate part 120 and the base part 180 . This seals the space between the substrate part 120 and the base part 180 with an elastic layer, so that contaminants are introduced from the outside through the spaced apart space between the base part 180 and the ground part 110 , and the force sensor 200 . It serves to prevent contamination of the inside. For reference, the elastic layer formed between the substrate part 120 and the base part 18 is not shown in FIGS. 8, 9, and 11 .

Therefore, it is preferable to fix the base unit 180 and the substrate unit 120 with an adhesive after the elastic liquid is applied to the upper surface of the substrate unit 120 as shown in (f) of FIG. 10 . Next, a configuration for grounding between the ground unit 110 and the base unit 180 may be further included.

As shown in (g) of FIG. 10 , the base portion 180 and the ground portion 110 have ground holes 116 and 186 penetrating the base portion 180 and the ground portion 110 when combined, respectively. is formed, and a conductive wire 190 is inserted through the ground holes 116 and 186, and the closing part 192 is inserted and fixed in a state in which the wire 190 is inserted. Accordingly, the wire 190 comes into contact with the ground portion 110 and the base portion 180 by the closing portion 192 , and by grounding the wire portion 190 , the ground portion 110 and the base portion 180 . ) can be grounded.

The force sensors 100 and 200 manufactured in the same manner as described above may have a diameter of 10 mm or less and are mounted between the knuckles of the hand robot to be used as sensors for measuring the force acting at the end of the knuckles.

The force sensors 100 and 200 according to an embodiment of the present invention manufactured in this way include a flat plate module 112 and an insertion module 114 protruding from one side of the flat plate module 112 in a cylindrical shape. ) containing a ground portion 110, a flat substrate, spaced apart from the flat panel module 112, and provided with a circular hole 122 into which the insertion module 114 can be inserted spaced apart from the substrate portion 120. , an elastic layer 150 disposed between the substrate part 120 and the flat panel module 112 and formed of an elastic body so that the position of the ground part 110 with respect to the substrate part 120 changes, the side surface of the hole 122 and As an electrode formed at the edge of the hole 122 on at least one side of the substrate unit 120, the electrode unit 130 that forms a capacitance together with the ground unit 110 when power is applied and the capacitance value is used. It may include a force measuring unit (not shown) for obtaining a vertical force or a horizontal force applied to the ground unit 110 .

In addition, three or more holes 122 in which the electrode part 130 is formed are formed in the substrate part 120 , and the electrodes are inserted into the holes 122 to correspond to each hole 122 in the ground part 110 . A multiaxial force can be obtained by forming a plurality of grounded insertion modules 114 that form a capacitance together with the part 130 .

The scope of the invention is not limited to the above-described embodiments, but may be implemented in various forms of embodiments within the scope of the appended claims. Without departing from the gist of the present invention claimed in the claims, it is considered within the scope of the description of the claims of the present invention to various extents that can be modified by any person skilled in the art to which the invention pertains.

100: force sensor 110: ground unit
112: flat panel module 114: insert module
115: spacer insertion hole 116: ground hole
120: substrate 122: hole
130: electrode part 130a: first electrode part
130b: second electrode part 131: side electrode part
132: upper electrode 140: dielectric
150: elastic layer 160: fixed part
170: first spacer 175: second spacer
180: base 181: groove
186: ground hole 190: wire
192: finish 200: force sensor

Claims (14)

a ground part including a flat plate module in the form of a flat plate and an insertion module protruding in a cylindrical shape from one side of the flat module; A flat-panel substrate, the substrate portion being spaced apart from the flat-panel module and having a circular hole through which the insertion module can be inserted spaced apart; and an electrode formed on the side of the hole and at the edge of the hole on at least one side of the substrate part, to a method of manufacturing a force sensor comprising an electrode part that receives power and forms a capacitance together with the ground part,
disposing a first spacer for supporting the substrate unit at a position spaced apart from the flat panel module;
In order to form an elastic layer formed between the ground part and the substrate part so that the position of the ground part is changed with respect to the substrate part by an external force, an elastic body liquid is applied on the flat panel module, and the insertion module is inserted into the inserting the substrate into the hole and seating the substrate on the first spacer;
disposing a second spacer between the hole and the insertion module; and
and curing the elastomeric liquid. The method of claim 1,
The method of manufacturing a force sensor in which the first spacer is inserted into at least one spacer insertion hole formed in the flat panel module to protrude on the flat panel module. 3. The method of claim 2,
The method of manufacturing a force sensor wherein the first spacer is a bolt inserted into the spacer insertion hole. The method of claim 1,
The second spacer has an inner circumferential surface in close contact with the outer circumferential surface of the insertion module and a method of manufacturing a force sensor in close contact with the inner circumferential surface of the hole The method of claim 1,
The method of manufacturing a force sensor wherein the elastic body is formed of a dielectric material. The method of claim 1,
Method of manufacturing the force sensor further comprising the step of fixing the base portion to the substrate portion. 7. The method of claim 6,
The method of manufacturing a force sensor further comprising the step of applying an elastic body liquid on the substrate part so that an elastic layer is formed between the substrate part and the base part. The method of claim 1,
removing the second spacer; and
The method of manufacturing a force sensor further comprising the step of fixing a fixing portion having a head portion protruding outside the radius of the insertion module to the end of the insertion module. 7. The method of claim 6,
Inserting a wire for grounding into a grounding hole passing through the base and the grounding part, and inserting and fixing a closing part blocking the grounding hole in a state in which the wire is inserted into the grounding hole and fixing the force sensor How to craft. a ground unit including a single flat plate module in the form of a flat plate and an insertion module protruding from one side of the flat module in a cylindrical shape in three or more;
a single substrate in the form of a flat plate, the substrate portion being spaced apart from the flat plate module and having a plurality of circular holes into which the insertion module can be inserted spaced apart;
an elastic layer disposed between the substrate part and the flat panel module and formed of an elastic body so that the position of the ground part with respect to the substrate part changes;
an electrode formed on a side surface of the hole and at an edge of the hole on at least one side of the substrate, integrally formed in the form of a via hole, and receiving power to form an electrostatic capacitance together with the ground portion;
For each of the unit sensor structures formed by a single insertion module and an electrode formed in a hole into which the insertion module is inserted, capacitance according to a change in distance between the flat panel module and the electrode and a change in distance between the insertion module and the electrode a force measuring unit for obtaining a vertical force or a horizontal force acting on the unit sensor structure by using a value; and
and a calculating unit for obtaining a multiaxial force and a multiaxial torque applied to the ground unit using a vertical force or a horizontal force of each of the unit sensor structures measured by the force measuring unit. 11. The method of claim 10,
The electrode formed on the side of the hole and the hole edge of the upper surface of the substrate is integrally formed with the force sensor. 11. The method of claim 10,
The electrode part is a force sensor that is formed separately along the circumferential direction of the hole. 13. The method of claim 12,
The electrode part is a force sensor that is divided into two or more along the circumferential direction of the hole. delete

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