KR102162575B1 - Test handler - Google Patents

Abstract

The present invention relates to a test handler.
The test handler according to the present invention forms an inlet through which outside air can be introduced into a wall of one side of the disoak chamber, and includes an opening and closing device capable of opening and closing the inlet.
According to the present invention, since a large amount of room temperature outside air can be supplied into the desoak chamber, the temperature of the semiconductor elements in the desoak chamber can be recovered in a short time during a high temperature test, and it can respond quickly even when the test mode is switched have.

Description

Test handler {TEST HANDLER}

The present invention relates to a test handler that is supported for testing of a manufactured semiconductor device.

A test handler is a device that supports semiconductor devices manufactured through a predetermined manufacturing process to be tested by a tester, and classifies semiconductor devices according to test results and loads them into customer trays.

1 is a conceptual diagram of a conventional test handler 100 viewed from a plane.

The test handler 100 includes a test tray 110, a loading device 120, a soak chamber 130, a SOAK CHAMBER, a test chamber 140, a desoak chamber 150, a DESOAK CHAMBER, and an unloading device ( 160).

The test tray 110 is circulated along a circulation path C leading to the loading position LP through the loading position LP, the test position TP, and the unloading position UP. Semiconductor devices are mounted on the test tray 110.

The loading device 120 loads the untested semiconductor device loaded in the customer tray CT ₁ into the test tray 110 in the loading position LP.

The soak chamber 130 is provided for preheating or precooling prior to testing the semiconductor elements of the test tray 110 that have been transferred. That is, the soak chamber 130 is provided to change the semiconductor devices to the test temperature according to the test environment conditions prior to the test. Accordingly, the soak chamber 130 is disposed between the loading position LP and the test position TP on the circulation path C.

The test chamber 140 is provided to support testing of semiconductor devices of the test tray 110 that have been preheated/precooled in the soak chamber 130 and then transferred to the test position TP.

The disoak chamber 150 is provided to recover the semiconductor device of the test tray 110 transferred from the test chamber 140 to a temperature such that the unloading operation is not difficult. Accordingly, the disoak chamber 150 is disposed between the test position TP and the unloading position UP on the circulation path C.

The unloading device 160 classifies semiconductor devices from the test tray 110 in the unloading position UP by test grade and unloads them into an empty customer tray CT ₂ .

As can be seen from the above configurations, the semiconductor device is loaded on the test tray 110 and sequentially moves the soak chamber 130, the test chamber 130, and the desoak chamber 150 at the loading position LP. After going through, it moves to the unloading position (UP). At this time, the semiconductor devices are preheated/precooled in the soak chamber 130 and recovered close to room temperature in the dissoak chamber 150.

In general, the test handler 100 is provided with a plurality of test trays (110). Accordingly, a plurality of test trays 110 are moved in translation while being accommodated in the soak chamber 130 or the dissoak chamber 150 together. In addition, while the test tray 110 is translated in translation, the semiconductor devices loaded in the test tray 110 are preheated/precooled or restored close to room temperature. Here, the provision of the soak chamber 130 increases the operation rate of the tester (TESTER), and the provision of the dissoak chamber 150 increases the operation rate of the unloading device 160. The present invention relates to a portion of the desoak chamber 150 for increasing the operation rate of an unloading device. Therefore, the disoque chamber 150 will be described in more detail.

In a high-temperature test, if a high-temperature semiconductor device is sent directly to the unloading position, the pad of the unloading device may melt or stick.

In the low-temperature test, if a low-temperature semiconductor device is sent directly to the unloading position, the low-temperature semiconductor device is exposed to room temperature as it is. As a result, moisture may form on the surface of the semiconductor device, causing damage to the semiconductor device. In addition, when the pad of the unloading device grips the semiconductor device, pad marks remain on the surface of the semiconductor device, which may degrade product quality. For this reason, it is necessary to configure the disoak chamber 150 to recover the tested semiconductor device to a temperature close to room temperature.

In order to recover the temperature of the semiconductor device, a heater 151, a circulation fan 152, a directional plate 153, and an exhaust fan 155 are provided in the disoak chamber 150 as shown in FIG. 2.

The heater 151 supplies heat to a low-temperature semiconductor device.

The circulation fan 152 supplies air heated by the heater 151 to the test tray 110 side.

The direction plate 153 guides the flow of air generated by the circulation fan 152 toward the test tray 110.

The exhaust fan 155 discharges the air inside to the outside.

Among the above configurations, the heater 151 and the circulation fan 152 operate during the low temperature test, and the circulation fan 152 and the exhaust fan 155 operate during the high temperature test.

However, with only the above configurations, there is a difficulty in efficiently recovering temperature of all semiconductor devices in the disoak chamber 150. Therefore, it has been proposed for a technology such as Korean Patent Publication No. 10-2013-0105265 (hereinafter referred to as'prior art'). According to the prior art, heat from the heater 151 is evenly supplied to all semiconductor devices in the disoak chamber 150. Therefore, it is possible to evenly recover the temperature of all semiconductor devices during the low temperature test.

In the high temperature test, the temperature of the semiconductor device is lowered only by operating the circulation fan 152 and the exhaust fan 155. In some cases, a small amount of low-temperature gas may be supplied into the disoak chamber 150.

Meanwhile, in recent years, the size of the test tray has been expanded to improve the processing capacity. In addition, as the test time is shortened, it is necessary to shorten the time the test tray stays inside the desoak chamber. In this case, it is sufficient to apply the prior art in the low temperature test, but the efficiency of temperature recovery is inferior in the high temperature test. A more recent test trend is that the mode switching between the low temperature test and the high temperature test is frequent, and the mode change is made instantaneously for a certain period of time. Therefore, it is necessary to have a temperature recovery function capable of responding to the disoak chamber.

An object of the present invention is to provide a technology capable of recovering the temperature of a semiconductor device within a short time required during a high temperature test.

The test handler according to the present invention as described above includes: a test tray circulating along a predetermined circulation path; A loading device for loading a semiconductor device into the test tray; A soak chamber provided to change semiconductor devices of a test tray in which loading of semiconductor devices is completed by the loading device to a test temperature; A test chamber provided to support testing of semiconductor devices in a test tray from the soak chamber; A desoak chamber provided to recover the temperature of semiconductor elements of the test tray coming through the test chamber and having an inlet for introducing outside air into the inner space; And an unloading device for unloading semiconductor elements of the test tray from the disoak chamber. Including, the disoke chamber, a heater for supplying heat; A circulation fan circulating the air heated by the heater; And a switch for opening and closing the inlet. Have.

The dissoak chamber further has an inlet fan for introducing outside air into the inner space through the inlet.

A controller for controlling the heater, the circulation fan, the switch and the inlet fan; Further comprising, the controller. In a high-temperature test, the inlet is opened by the switch and the inlet fan is operated, and the operation of the heater is stopped. In a low-temperature test, the inlet is closed by the switch and the heater and circulation fan are operated, and the inlet Stop fan operation.

The dissoak chamber further has a discharge fan for discharging the air in the internal space to the outside through an outlet formed at a portion spaced apart from the inlet.

According to the present invention as described above, outside air at room temperature may be supplied in a large amount to the interior of the desoak chamber. Therefore, during a high-temperature test, the temperature of the semiconductor devices in the disoak chamber can be recovered within a short time, and a quick response is possible even when the test mode is switched.

In addition, since the inlet formed on the wall of the disoque chamber can be opened and closed, an internal environment optimized for each of a high temperature test or a low temperature test can be implemented. That is, during the low-temperature test, the inlet is closed to prevent the problem of delaying the heating time by flowing the internal air heated by the heater to the outside or the relatively cold outside air to the inside. In addition, during the high-temperature test, the inlet is opened to allow outside air to flow into the interior, so that the high-temperature semiconductor device can be quickly cooled.

1 is a conceptual plan view of a conventional test handler.
FIG. 2 is a schematic configuration diagram of a desoak chamber generally applied to the test handler of FIG. 1.
3 is a conceptual plan view of a test handler according to an embodiment of the present invention.
4 and 5 are schematic configuration diagrams of a disoak chamber applied to the test handler of FIG. 3.
6 is a reference diagram for explaining the present invention during a high temperature test.

Hereinafter, preferred embodiments according to the present invention as described above will be described with reference to the accompanying drawings, but the description mentioned in the background art is omitted or compressed as much as possible for the sake of brevity.

3 is a conceptual plan view of a test handler 300 according to an embodiment of the present invention.

The test handler 300 according to the present embodiment includes a test tray 310, a loading device 320, a soak chamber 330, a test chamber 340, a disoak chamber 350, an unloading device 360, and a controller. Includes 370.

The test tray 310, the loading device 320, the soak chamber 330, the test chamber 340, and the unloading device 360 described above include the test tray 110, loading device 120, and Since the soak chamber 130, the test chamber 140 and the unloading device 160 function in the same manner, a description thereof will be omitted.

The disoak chamber 350 restores the temperature of the heated or cooled semiconductor device to close to room temperature. To this end, the disoak chamber 350 includes a heater 351, a circulation fan 352, a directional plate 353, an inlet fan 354, an exhaust fan 355, and an open/closer 356 as shown in FIG. Include. In addition, an inlet (IH) through which outside air can be introduced is formed in the door (DR) forming the right wall of the disoak chamber 350, and an outlet (OH) through which internal air can be discharged is formed in the rear wall. .

The heater 351 supplies heat to the inner space IS of the disoak chamber 350.

The circulation fan 352 circulates the air heated by the heater 351. Of course, the circulation fan 352 also serves to circulate air so that the outside air coming through the inlet IH is evenly supplied to the semiconductor devices of the test tray 310.

The directional plate 353 guides the flow of air generated by the circulation fan 352 toward the test tray 310.

The inlet fan 354 is installed at the inlet IH and is provided to rapidly introduce a large amount of outside air into the inner space IS.

The discharge fan 355 is installed at the discharge port OH and is provided to rapidly discharge internal air to the outside. For reference, in the drawing according to the present embodiment, the configuration capable of opening and closing the outlet (OH) is omitted, but as in the inlet (IH) side, a switch is also configured on the outlet (OH) side, and the outlet ( OH) can be controlled to open and close. Of course, as in the present embodiment, when the discharge port OH is located on the upper side of the disoak chamber 350, when it is located far upward from the heater 351 provided at the lower side, the heat loss effect due to the discharge port OH Since it is insignificant, it is possible to omit the switch for opening and closing the outlet OH.

The switch 356 opens and closes the inlet IH. This switch 356 includes an opening and closing plate 356a and a moving source 356b.

The opening and closing plate 356a blocks the inlet IH or opens the inlet IH according to the moving position. And for this, the opening and closing plate (356a) is formed with a passage (TH). That is, when the opening/closing plate 356a is raised as shown in FIG. 4, the passage hole TH and the inlet IH coincide so that outside air may flow into the inner space IS, and as shown in FIG. When 356a) descends, the passage port TH and the inlet port IH are shifted, and the inlet port IH is closed.

The moving source 356b lifts and moves the opening/closing plate 356a.

Since the inlet IH can be opened and closed by the switch 356 as described above, an optimized internal environment is implemented in each of the high temperature test or the low temperature test. For example, during a low-temperature test, the inlet is closed to create an environment in which internal air heated by a heater can be prevented from flowing out or relatively cold outside air from flowing into the interior. At this time, when a low-temperature electronic component comes into the interior of the desoak chamber 350, dew condensation may occur on the surface of the electronic component. Since the inflow of relatively humid outdoor air is blocked, the inlet IH is configured. The environment can be optimally created in which dew formation can also be prevented. In addition, during the high-temperature test, the inlet is opened to create an environment in which relatively cold outside air can be introduced into the interior.

The controller 370 controls the heater 351, the circulation fan 352, the inlet fan 354, the discharge fan 355, and the switch 356.

Subsequently, control of the controller 370 for each test mode will be described.

1. Low temperature test mode

In the low-temperature test mode, the semiconductor device is brought to the desoak chamber 350 while being cooled to a low temperature. Accordingly, the controller 370 operates the heater 351 to generate heat, and operates the circulation fan 352 so that the heat can be evenly supplied to the semiconductor devices of the test tray 310. Of course, the controller 370 controls the switch 356 in advance so that the opening/closing plate 356a closes the inlet IH as shown in FIG. 5, and stops the operation of the inlet fan 354 and the discharge fan 355.

2. High temperature test mode

In the high-temperature test mode, the semiconductor device is brought to the desoak chamber 350 while being heated to a high temperature. Accordingly, the controller 370 operates the inlet fan 354 to introduce outside air into the inner space IS, and operates the exhaust fan 355 to discharge the air whose temperature has risen in the inner space IS to the outside. Of course, the controller 370 controls the switch 356 in advance so that the opening and closing plate 356a opens the inlet IH as shown in FIG. 4, and stops the operation of the heater 351. In addition, the controller 370 operates the circulation fan 352 so that the introduced outside air can be evenly supplied to the semiconductor devices of the test tray 310.

In this case, as shown in the conceptual plan view of FIG. 6, after the outside air is introduced through the inlet IH, it is directly blown between the test trays 310. Therefore, the semiconductor devices of the test tray 310 cool down quickly. For this purpose, the inlet (IH) is preferably formed at a position corresponding to the position of the test tray 310, and the outlet (OH) is preferably formed at a higher position than the test tray 310.

As described above, the detailed description of the present invention has been made by the embodiments with reference to the accompanying drawings, but since the above-described embodiments have been only described with reference to preferred examples of the present invention, the present invention is limited to the above embodiments. It should not be construed as being limited, and the scope of the present invention should be understood as the following claims and equivalent concepts.

300: test handler
310: test tray 320: loading device
330: soak chamber 340: test chamber
350: disoque chamber
351: heater 352: circulation fan
354: inlet fan 355: discharge fan
356: switch
IH: inlet OH: outlet
360: unloading device
370: controller

Claims (2)

A test tray circulating along a certain circulation path;
A loading device for loading a semiconductor device into the test tray;
A soak chamber provided to change semiconductor devices of a test tray in which loading of semiconductor devices is completed by the loading device to a test temperature;
A test chamber provided to support testing of semiconductor devices in a test tray from the soak chamber;
A disoque chamber provided to recover the temperature of semiconductor elements of the test tray coming through the test chamber, and having an inlet formed in a door forming a right wall to introduce outside air into the inner space; And
An unloading device for unloading semiconductor elements of the test tray from the disoak chamber; Including,
The disoak chamber,
A heater to supply heat;
A circulation fan circulating the air heated by the heater;
An inlet fan for introducing outside air into the inner space through the inlet; And
A switch for opening and closing the inlet; Has,
After outside air is introduced through the inlet, it is blown directly between the test trays,
A controller for controlling the heater, the circulation fan, the switch and the inlet fan; Including more,
The controller.
In the high temperature test, the inlet is opened by the switch and the inlet fan is operated, and the heater is stopped,
In the low temperature test, the inlet is closed by the switch and the heater and the circulation fan are operated,
Characterized in that the operation of the inlet fan is stopped
Test handler. The method of claim 1,
The disoak chamber further comprises a discharge fan for discharging the air in the inner space to the outside through an outlet formed at a portion spaced apart from the inlet.
Test handler.

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