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KR101623713B1 - 인쇄 회로용 동박 - Google Patents

인쇄 회로용 동박 Download PDF

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Publication number
KR101623713B1
KR101623713B1 KR1020147014501A KR20147014501A KR101623713B1 KR 101623713 B1 KR101623713 B1 KR 101623713B1 KR 1020147014501 A KR1020147014501 A KR 1020147014501A KR 20147014501 A KR20147014501 A KR 20147014501A KR 101623713 B1 KR101623713 B1 KR 101623713B1
Authority
KR
South Korea
Prior art keywords
copper
copper foil
layer
particle layer
cobalt
Prior art date
Application number
KR1020147014501A
Other languages
English (en)
Korean (ko)
Other versions
KR20140085583A (ko
Inventor
히데타 아라이
아츠시 미키
Original Assignee
제이엑스 킨조쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제이엑스 킨조쿠 가부시키가이샤 filed Critical 제이엑스 킨조쿠 가부시키가이샤
Publication of KR20140085583A publication Critical patent/KR20140085583A/ko
Application granted granted Critical
Publication of KR101623713B1 publication Critical patent/KR101623713B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/38—Chromatising
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
KR1020147014501A 2011-11-02 2012-10-31 인쇄 회로용 동박 KR101623713B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2011-240974 2011-11-02
JP2011240974 2011-11-02
PCT/JP2012/078115 WO2013065713A1 (ja) 2011-11-02 2012-10-31 印刷回路用銅箔

Publications (2)

Publication Number Publication Date
KR20140085583A KR20140085583A (ko) 2014-07-07
KR101623713B1 true KR101623713B1 (ko) 2016-05-25

Family

ID=48192058

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147014501A KR101623713B1 (ko) 2011-11-02 2012-10-31 인쇄 회로용 동박

Country Status (5)

Country Link
JP (1) JP5913355B2 (ja)
KR (1) KR101623713B1 (ja)
CN (1) CN104024488B (ja)
TW (1) TWI520662B (ja)
WO (1) WO2013065713A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101663595B1 (ko) 2013-01-16 2016-10-17 삼성디스플레이 주식회사 액정 표시 장치 및 그 제조 방법
JP6335449B2 (ja) * 2013-07-24 2018-05-30 Ｊｘ金属株式会社 キャリア付銅箔、銅張積層板の製造方法及びプリント配線板の製造方法
JP6867102B2 (ja) * 2014-10-22 2021-04-28 Ｊｘ金属株式会社 銅放熱材、キャリア付銅箔、コネクタ、端子、積層体、シールド材、プリント配線板、金属加工部材、電子機器、及び、プリント配線板の製造方法
EP4084586A1 (en) 2021-04-21 2022-11-02 LG Innotek Co., Ltd. A circuit board, an image sensor module, a lens driving device, and a camera module including the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3295308B2 (ja) 1996-06-28 2002-06-24 株式会社日鉱マテリアルズ 電解銅箔
JP2005161840A (ja) 2003-11-11 2005-06-23 Furukawa Circuit Foil Kk キャリア付き極薄銅箔、およびプリント配線板
JP2008285751A (ja) 2007-04-19 2008-11-27 Mitsui Mining & Smelting Co Ltd 表面処理銅箔及びその表面処理銅箔を用いて得られる銅張積層板並びにその銅張積層板を用いて得られるプリント配線板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11135952A (ja) * 1997-10-27 1999-05-21 Furukawa Electric Co Ltd:The 印刷回路基板用樹脂付き銅箔、およびそれを用いた印刷回路基板
MY161040A (en) * 2010-05-07 2017-04-14 Jx Nippon Mining & Metals Corp Copper foil for printed circuit

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3295308B2 (ja) 1996-06-28 2002-06-24 株式会社日鉱マテリアルズ 電解銅箔
JP2005161840A (ja) 2003-11-11 2005-06-23 Furukawa Circuit Foil Kk キャリア付き極薄銅箔、およびプリント配線板
JP2008285751A (ja) 2007-04-19 2008-11-27 Mitsui Mining & Smelting Co Ltd 表面処理銅箔及びその表面処理銅箔を用いて得られる銅張積層板並びにその銅張積層板を用いて得られるプリント配線板

Also Published As

Publication number Publication date
WO2013065713A1 (ja) 2013-05-10
CN104024488B (zh) 2016-12-14
CN104024488A (zh) 2014-09-03
TW201325337A (zh) 2013-06-16
TWI520662B (zh) 2016-02-01
JPWO2013065713A1 (ja) 2015-04-02
KR20140085583A (ko) 2014-07-07
JP5913355B2 (ja) 2016-04-27

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