KR101623667B1 - 인쇄 회로용 동박 - Google Patents
인쇄 회로용 동박 Download PDFInfo
- Publication number
- KR101623667B1 KR101623667B1 KR1020147014755A KR20147014755A KR101623667B1 KR 101623667 B1 KR101623667 B1 KR 101623667B1 KR 1020147014755 A KR1020147014755 A KR 1020147014755A KR 20147014755 A KR20147014755 A KR 20147014755A KR 101623667 B1 KR101623667 B1 KR 101623667B1
- Authority
- KR
- South Korea
- Prior art keywords
- copper
- copper foil
- particle layer
- layer
- cobalt
- Prior art date
Links
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2011-242181 | 2011-11-04 | ||
JP2011242181 | 2011-11-04 | ||
PCT/JP2012/078154 WO2013065730A2 (ja) | 2011-11-04 | 2012-10-31 | 印刷回路用銅箔 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20140085586A KR20140085586A (ko) | 2014-07-07 |
KR101623667B1 true KR101623667B1 (ko) | 2016-05-23 |
Family
ID=48192952
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020147014755A KR101623667B1 (ko) | 2011-11-04 | 2012-10-31 | 인쇄 회로용 동박 |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP6205269B2 (ja) |
KR (1) | KR101623667B1 (ja) |
CN (1) | CN103958743B (ja) |
TW (1) | TWI581678B (ja) |
WO (1) | WO2013065730A2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102553808B1 (ko) | 2022-06-03 | 2023-07-10 | 주식회사 수정해양개발 | 인공어초 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104120471B (zh) * | 2013-04-26 | 2018-06-08 | Jx日矿日石金属株式会社 | 高频电路用铜箔、覆铜板、印刷配线板、带载体的铜箔、电子设备及印刷配线板的制造方法 |
JP6166614B2 (ja) * | 2013-07-23 | 2017-07-19 | Jx金属株式会社 | 表面処理銅箔、キャリア付銅箔、基材、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法 |
CN111886367B (zh) * | 2018-03-27 | 2023-05-16 | 三井金属矿业株式会社 | 粗糙化处理铜箔、带载体铜箔、覆铜层叠板及印刷电路板 |
CN109056009B (zh) * | 2018-08-19 | 2019-11-12 | 江西伟创丰电路有限公司 | 一种印刷电路板用铜箔及其制备方法 |
TWM593711U (zh) * | 2019-06-12 | 2020-04-11 | 金居開發股份有限公司 | 進階反轉電解銅箔及其銅箔基板 |
TWI764170B (zh) | 2019-06-19 | 2022-05-11 | 金居開發股份有限公司 | 微粗糙電解銅箔以及銅箔基板 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10341066A (ja) * | 1997-06-10 | 1998-12-22 | Furukawa Electric Co Ltd:The | 印刷回路用銅箔、前記銅箔を用いた印刷回路用樹脂接着剤付銅箔、および前記銅箔を用いた印刷回路用銅張り積層板 |
JPH11135952A (ja) * | 1997-10-27 | 1999-05-21 | Furukawa Electric Co Ltd:The | 印刷回路基板用樹脂付き銅箔、およびそれを用いた印刷回路基板 |
JP5129642B2 (ja) * | 2007-04-19 | 2013-01-30 | 三井金属鉱業株式会社 | 表面処理銅箔及びその表面処理銅箔を用いて得られる銅張積層板並びにその銅張積層板を用いて得られるプリント配線板 |
TWI434965B (zh) * | 2008-05-28 | 2014-04-21 | Mitsui Mining & Smelting Co | A roughening method for copper foil, and a copper foil for a printed wiring board which is obtained by the roughening method |
CN102224281B (zh) * | 2008-11-25 | 2014-03-26 | 吉坤日矿日石金属株式会社 | 印刷电路用铜箔 |
MY161040A (en) * | 2010-05-07 | 2017-04-14 | Jx Nippon Mining & Metals Corp | Copper foil for printed circuit |
JP5654416B2 (ja) * | 2011-06-07 | 2015-01-14 | Jx日鉱日石金属株式会社 | 液晶ポリマー銅張積層板及び当該積層板に用いる銅箔 |
JP5497808B2 (ja) * | 2012-01-18 | 2014-05-21 | Jx日鉱日石金属株式会社 | 表面処理銅箔及びそれを用いた銅張積層板 |
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2012
- 2012-10-31 KR KR1020147014755A patent/KR101623667B1/ko active IP Right Grant
- 2012-10-31 CN CN201280054151.4A patent/CN103958743B/zh active Active
- 2012-10-31 JP JP2013541812A patent/JP6205269B2/ja active Active
- 2012-10-31 WO PCT/JP2012/078154 patent/WO2013065730A2/ja active Application Filing
- 2012-11-02 TW TW101140735A patent/TWI581678B/zh active
-
2016
- 2016-06-22 JP JP2016123718A patent/JP2016188436A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102553808B1 (ko) | 2022-06-03 | 2023-07-10 | 주식회사 수정해양개발 | 인공어초 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2013065730A1 (ja) | 2015-04-02 |
CN103958743A (zh) | 2014-07-30 |
WO2013065730A2 (ja) | 2013-05-10 |
CN103958743B (zh) | 2016-12-28 |
JP2016188436A (ja) | 2016-11-04 |
JP6205269B2 (ja) | 2017-09-27 |
TWI581678B (zh) | 2017-05-01 |
TW201330721A (zh) | 2013-07-16 |
KR20140085586A (ko) | 2014-07-07 |
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E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20190417 Year of fee payment: 4 |