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KR101369211B1 - 레이저 할단 장치 - Google Patents

레이저 할단 장치 Download PDF

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Publication number
KR101369211B1
KR101369211B1 KR1020110084765A KR20110084765A KR101369211B1 KR 101369211 B1 KR101369211 B1 KR 101369211B1 KR 1020110084765 A KR1020110084765 A KR 1020110084765A KR 20110084765 A KR20110084765 A KR 20110084765A KR 101369211 B1 KR101369211 B1 KR 101369211B1
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KR
South Korea
Prior art keywords
substrate
brittle material
material substrate
board
scribe
Prior art date
Application number
KR1020110084765A
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English (en)
Korean (ko)
Other versions
KR20120020065A (ko
Inventor
요이치 이마이즈미
켄지 오토다
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Publication of KR20120020065A publication Critical patent/KR20120020065A/ko
Application granted granted Critical
Publication of KR101369211B1 publication Critical patent/KR101369211B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0012—Brazing heat exchangers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/034—Observing the temperature of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/044—Seam tracking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
KR1020110084765A 2010-08-27 2011-08-24 레이저 할단 장치 KR101369211B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010190704A JP5194076B2 (ja) 2010-08-27 2010-08-27 レーザ割断装置
JPJP-P-2010-190704 2010-08-27

Publications (2)

Publication Number Publication Date
KR20120020065A KR20120020065A (ko) 2012-03-07
KR101369211B1 true KR101369211B1 (ko) 2014-03-04

Family

ID=45820766

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110084765A KR101369211B1 (ko) 2010-08-27 2011-08-24 레이저 할단 장치

Country Status (4)

Country Link
JP (1) JP5194076B2 (ja)
KR (1) KR101369211B1 (ja)
CN (1) CN102380713B (ja)
TW (1) TWI507265B (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5202595B2 (ja) * 2010-09-10 2013-06-05 三星ダイヤモンド工業株式会社 レーザ割断装置
KR101351490B1 (ko) * 2012-03-26 2014-03-12 주식회사 엘티에스 박판 용접장치의 고정지그유닛
JP2014091134A (ja) * 2012-11-01 2014-05-19 Ihi Corp レーザ加工装置
KR20160013841A (ko) * 2013-05-28 2016-02-05 아사히 가라스 가부시키가이샤 유리 기판의 절단 방법 및 유리 기판의 제조 방법
JP6420648B2 (ja) * 2014-12-05 2018-11-07 川崎重工業株式会社 ガラス板の割断装置
KR101862088B1 (ko) * 2016-03-03 2018-05-30 에이피시스템 주식회사 Ela 공정용 레이저 빔 조절 모듈
CN105643819B (zh) * 2016-03-18 2017-10-03 武汉华工激光工程有限责任公司 基于激光划线加工工艺的蓝宝石晶圆裂片装置及方法
CN106977089B (zh) * 2017-05-05 2019-11-08 东旭科技集团有限公司 玻璃压断装置、玻璃压断方法和玻璃切割系统
JP6916718B2 (ja) * 2017-11-15 2021-08-11 東レエンジニアリング株式会社 レーザ加工装置
KR102122427B1 (ko) * 2019-01-09 2020-06-12 한국미쯔보시다이아몬드공업(주) 단재 제거 장치
CN110828615A (zh) * 2019-11-20 2020-02-21 苏州沃特维自动化系统有限公司 叠瓦电池串的制作方法
CN111517630B (zh) * 2020-05-29 2024-09-24 河北南玻玻璃有限公司 一种玻璃清边装置
CN113601023B (zh) * 2021-07-27 2023-07-18 杭州康奋威科技股份有限公司 一种电池片低温无损切割装置及方法
CN115521054A (zh) * 2022-10-25 2022-12-27 深圳市益铂晶科技有限公司 一种化学钢化玻璃的激光裂片方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1071483A (ja) * 1996-08-29 1998-03-17 Hitachi Constr Mach Co Ltd 脆性材料の割断方法
WO2009011246A1 (ja) * 2007-07-13 2009-01-22 Mitsuboshi Diamond Industrial Co., Ltd. 脆性材料基板の加工方法およびこれに用いるクラック形成装置
JP2009078502A (ja) * 2007-09-27 2009-04-16 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の割断装置および割断方法
WO2009057381A1 (ja) * 2007-11-02 2009-05-07 Mitsuboshi Diamond Industrial Co., Ltd. 脆性材料基板の分断方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2700136B2 (ja) * 1994-06-02 1998-01-19 双栄通商株式会社 脆性材料の割断方法
JP2003321233A (ja) * 2002-04-25 2003-11-11 Nec Kagoshima Ltd ガラス基板切断装置および切断方法
JP4598407B2 (ja) * 2004-01-09 2010-12-15 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP2006175847A (ja) * 2004-11-26 2006-07-06 Shibaura Mechatronics Corp 脆性材料の割断加工システム及びその方法
JP2006199553A (ja) * 2005-01-24 2006-08-03 Sharp Corp 基板分断装置及び基板分断方法
JP2007076937A (ja) * 2005-09-13 2007-03-29 Lemi Ltd スクライブしたガラスの割断方法及び装置
JP2007083693A (ja) * 2005-09-26 2007-04-05 Matsushita Electric Works Ltd セラミック基板の分割方法
JP4675786B2 (ja) * 2006-01-20 2011-04-27 株式会社東芝 レーザー割断装置、割断方法
JP2009154516A (ja) * 2007-12-05 2009-07-16 Nippon Emikku:Kk 脆性基板切断補助装置
JP2010229005A (ja) * 2009-03-30 2010-10-14 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の分断方法
JP5627201B2 (ja) * 2009-06-17 2014-11-19 三星ダイヤモンド工業株式会社 脆性材料基板の割断方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1071483A (ja) * 1996-08-29 1998-03-17 Hitachi Constr Mach Co Ltd 脆性材料の割断方法
WO2009011246A1 (ja) * 2007-07-13 2009-01-22 Mitsuboshi Diamond Industrial Co., Ltd. 脆性材料基板の加工方法およびこれに用いるクラック形成装置
JP2009078502A (ja) * 2007-09-27 2009-04-16 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の割断装置および割断方法
WO2009057381A1 (ja) * 2007-11-02 2009-05-07 Mitsuboshi Diamond Industrial Co., Ltd. 脆性材料基板の分断方法

Also Published As

Publication number Publication date
CN102380713B (zh) 2015-02-11
CN102380713A (zh) 2012-03-21
TWI507265B (zh) 2015-11-11
TW201217094A (en) 2012-05-01
JP2012045830A (ja) 2012-03-08
KR20120020065A (ko) 2012-03-07
JP5194076B2 (ja) 2013-05-08

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