KR100698095B1 - Device for forming of polishing pad and method for manufacturing of polishing pad using the same - Google Patents

Abstract

The present invention relates to a molding apparatus for a polishing pad and a method for manufacturing a polishing pad using the same, which can be used to produce a desired shape in a short time by using an etching mold for forming a groove. And a lower stage on which a hot plate is formed and a polymer film to be molded is mounted on the inside of the vacuum chamber, and a hot plate is formed on the inside of the vacuum chamber so that hot pressing is performed on the inside of the vacuum chamber. And an upper stage to which a mold for forming a groove is attached to the polymer film at regular intervals from the stage.

Polishing Pads, CMP, Grooves, Polymer Films

Description

Apparatus for forming of polishing pad and method for manufacturing of polishing pad using the same}

1 is a front view of a typical chemical mechanical polishing apparatus

2 is a block diagram showing a molding apparatus of the polishing pad according to the present invention.

3 is a flowchart illustrating a method of manufacturing a polishing pad according to the present invention.

Explanation of symbols for the main parts of the drawings

200: vacuum chamber 210: lower stage

220: polymer film 230: mold

240: upper stage

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to chemical mechanical polishing equipment, and more particularly, to an apparatus for forming a polishing pad and a method for manufacturing a polishing pad using the same, which enable manufacturing a desired shape while reducing manufacturing time.

In current ultra-scale integrated circuits, mounting density tends to be increased, and various fine processing technologies have been researched and developed. Already, design rules have reached levels below 1/2 micron. One of the technologies being developed to meet the demands of such a strict refinement is CMP (Chemical Mechanical Polishing) technology.

Since this technique can completely flatten the exposed layer in the manufacturing process of the semiconductor device, thereby reducing the burden of the exposure technique and stabilizing the yield, for example, the interlayer insulating film, the BPSG film, the shallow trench, and the like. It is an essential technique when performing separation or the like.

Conventionally, as a polishing method for planarizing an inorganic insulating film layer such as a silicon oxide insulating film formed by a method such as plasma-CVD (chemical vapor deposition) or low pressure-CVD in a semiconductor device manufacturing process, a film to be polished is formed. One substrate is pressed against the polishing pad, and the substrate or the polishing pad is moved while supplying the abrasive between the polishing film and the polishing pad.

1 is a front view of a typical chemical mechanical polishing apparatus.

As shown in FIG. 1, a carrier head 110 is provided on which a wafer 103 is attracted and fixed.

Here, the carrier head 110 is adhesive and has a carrier film (not shown) attached to the center of the bottom of the carrier head, a wafer 103 adhered to and fixed to the bottom of the carrier film, a carrier film and a wafer 103. It is composed of a ring-shaped retaining ring 111 is bonded to the lower surface of the carrier head 110 to be installed around the drive means (not shown).

In addition, the retaining ring 111 prevents the wafer 103 adsorbed and fixed to the carrier film from leaving the carrier head during polishing. In addition, the retaining ring 111 also serves to disperse the vertical pressing force that acts as a central portion of the carrier head 110 to the peripheral portion of the carrier head.

The rotary plate 101 is installed at a position spaced below the carrier head 110, and a polishing pad 102 made of polyurethane is attached to the upper surface of the rotary plate.

In addition, a slurry injection nozzle 130 is installed at a position spaced upwardly from the rotating surface plate 101 to supply slurry during polishing, and a pad conditioner 120 is provided at a predetermined position on the polishing pad 102. It is installed separately from the head.

When the polishing operation of the wafer 103 starts, the rotating table 101 rotates while the polishing pad 102 is attached to the upper surface, and the carrier head 110 contacts the wafer 103 and the polishing pad 102. The wafer 103 is brought into downward contact with the polishing pad 102, and then a self-rotation motion and a horizontal swing motion are simultaneously performed by a driving means (not shown).

At the same time, in the slurry spray nozzle 130, the slurry is sprayed and supplied onto the polishing pad 102, and mechanical polishing of the wafer 103 is performed along with chemical polishing between the slurry and the wafer film.

After the polishing operation of the wafer 103 is finished or during the polishing operation, a pad conditioning operation is performed to increase the polishing degree of the polishing pad 102 having a low polishing degree.

The pad conditioner 120 installed on the upper surface of the rotating surface plate 101 is connected to a driving means provided separately from the carrier head 110 so that the pad conditioner 120 is pressed against the rotating polishing pad 102 while rotating itself. Restores the condition.

Meanwhile, the polishing pad according to the prior art is composed of various structures and materials according to its use, but the most widely used polishing pad is a microcapsule placed in a polymer, and a thermosetting agent is put in an oven to produce the polishing pad. .

The polishing pad manufactured as described above forms grooves having various shapes such as concentric or X-Y shapes by using a cutter to flow slurry on the surface thereof.

However, since the shape is simply made by combining the movement of the cutter in the X-axis direction and the Y-axis direction, grooves can be formed only by the combination of lines, and thus, pad surfaces having various shapes cannot be manufactured, and the manufacturing time is also long.

The present invention has been made in order to solve the above problems, the groove forming (groove) can be produced in a short time by using an etching mold, as well as the forming apparatus of the polishing pad to be able to produce any desired shape and using the same It is an object of the present invention to provide a method for manufacturing a polishing pad.

The apparatus for forming a polishing pad according to the present invention for achieving the above object includes a vacuum chamber, a lower stage on which a hot plate is configured and a polymer film to be formed is mounted to perform hot press processing inside the vacuum chamber, The hot plate is configured inside the vacuum chamber to perform a hot press process, characterized in that it comprises a top stage attached to a mold for forming grooves in the polymer film at a predetermined interval from the lower stage. .

In addition, the manufacturing method of the polishing pad according to the present invention for achieving the above object comprises the steps of preparing a polymer film to be molded, mounting the polymer film on the lower stage of the vacuum chamber, Attaching a mold having a groove defined to an upper stage, applying a constant pressure and heat to the lower stage and the upper stage to form a groove in the polymer film, and cooling the grooved polymer film. It is characterized by including the formation.

Hereinafter, with reference to the accompanying drawings will be described in more detail the apparatus for forming a polishing pad according to the present invention and a manufacturing method of the polishing pad using the same.

2 is a block diagram showing a molding apparatus for a polishing pad according to the present invention.

As shown in FIG. 2, a lower stage 220 in which a vacuum chamber 200 in a vacuum state, a polymer film 210 to be formed and formed in the vacuum chamber 200 is mounted, and the vacuum chamber The upper stage 240 is formed inside the 200 and has a mold 230 for forming a groove on the polymer film 220 at regular intervals from the lower stage 210.

Here, the lower stage 210 and the upper stage 240 has a hot plate (not shown) is formed therein to perform a hot press (hot press) process.

In the present invention, the pad is manufactured using an etching mold, not a cutter, when the groove of the polishing pad is manufactured. Etching techniques are now widely used across glass and metal silicon.

The present invention is a technique of forming a polishing pad by using the etching technique as described above to form a groove in a mold to a desired shape and then using it as a mold.

3 is a flowchart illustrating a method of manufacturing a polishing pad according to the present invention.

As shown in FIG. 3, a polymer film 220 to be molded is manufactured (S110).

Here, the polymer film 220 is made of one or more thermosetting resins selected from the group consisting of epoxy resins, urethane resins, ABS resins and phenol resins.

In addition, the thermosetting resin may be mixed with one or more heat-resistant materials and lubricants and pigments selected from the group consisting of talc, cerium oxide, titanium oxide, copper, cobalt oxide and calcium carbonate.

Subsequently, the polymer film 220 is vacuum-adsorbed and fixed to the lower stage 210 of the vacuum chamber 200 (S120).

Then, the mold 230 having a groove defined is attached to the upper stage 240 of the vacuum chamber 200 (S130).

Here, the mold 230 may use a metal plate or a Teflon resin, and in the case of the metal plate, various molds may be precisely manufactured by using an etching method, and in the case of a resin plate, laser cutting may be performed. Alternatively, the groove can be drilled using water jet cutting.

In addition, the method of attaching the mold 230 to the upper stage 240 may be a method such as adhesive, Velcro tape or double-sided tape, vacuum adsorption.

Subsequently, heat and pressure are applied to the lower stage 210 and the upper stage 240 to form grooves on the surface of the polymer film 220 (S140).

Here, the polymer film 220 mounted on the lower stage 210 from the mold 230 attached to the upper stage 240 while applying a predetermined pressure to the lower stage 210 and the upper stage 240. Form grooves on the surface. At this time, the formation of the grooves is made faster while applying heat.

Subsequently, the process of forming the polishing pad is completed by unloading the polymer film 220 in which the groove is formed in the vacuum chamber 200 and cooling (S150).

Therefore, in the present invention, a polymer film is placed on a lower stage capable of simultaneously applying heat and pressure, and then a mold prepared by using an etching method is attached to the upper stage, and then molding is performed while simultaneously applying heat and pressure in a vacuum state. After the molding is completed, cooling may be performed to obtain a polishing pad.

On the other hand, the present invention described above is not limited to the above-described embodiment and the accompanying drawings, it is possible that various substitutions, modifications and changes within the scope without departing from the technical spirit of the present invention. It will be apparent to those of ordinary skill in Esau.

As described above, the apparatus for forming a polishing pad and a method for manufacturing the polishing pad using the same according to the present invention have the following effects.

That is, in addition to the advantage that can be produced quickly by forming the polishing pad using the molding process, it is possible to freely produce the desired groove in the shape of the surface of the polishing pad. Thus, the polishing pad surface can produce a functional shape, not just for slurry flow.

Claims (8)

With vacuum chamber, A lower stage on which a hot plate is configured and a polymer film to be formed is mounted so that hot pressing is performed inside the vacuum chamber; The hot plate is configured inside the vacuum chamber to perform a hot press process, and comprises a top stage attached to a mold for forming grooves in the polymer film at regular intervals from the bottom stage. Forming apparatus of the polishing pad. delete Preparing a polymer film to be molded; Mounting the polymer film on a lower stage of the vacuum chamber; Attaching a mold having a groove defined to an upper stage of the vacuum chamber; Applying a constant pressure and heat to the lower stage and the upper stage to form grooves in the polymer film; And cooling the grooved polymer film. delete delete The method of manufacturing a polishing pad according to claim 3, wherein the mold is made of metal plate or Teflon resin. The method of manufacturing a polishing pad according to claim 3 or 6, wherein when the mold is a metal plate, various grooves are formed by etching. The method of manufacturing a polishing pad according to claim 3 or 6, wherein when the mold is a resin plate, the groove pattern is perforated using laser cutting or water jet cutting.

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