KR100402317B1 - Index apparatus of handler for testing semiconductor - Google Patents

Abstract

The present invention relates to an index device for a semiconductor device test handler, by supplying a cooling fluid to the pickup member of the index device to maintain the temperature of the semiconductor device picked up at a desired temperature state during the low temperature test of the semiconductor device.

The present invention provides a base plate having a base plate mounted on top of a test site so as to be movable up, down, left and right, and a plurality of pickup members fixed to a lower surface of the base plate to pick up semiconductor elements. A cooling fluid supply pipe for supplying a cooling fluid, an induction groove for guiding the cooling fluid supplied from the cooling fluid supply pipe inside the base plate to each pickup member, and an upper portion of each pickup member at each end of the induction groove. An injection hole formed to communicate with the surface, a cooling fin installed at an upper portion of each pickup member, and cooled by a cooling fluid injected through the injection holes, and a semiconductor element picked up from the lower surface of each pickup member to the cooling fin. A heat transfer column made of a thermally conductive material to allow heat transfer, and a cooling fluid injected through the injection hole hit the cooling fins. Including and is then discharged out of the outlet, a cooling fluid control means for controlling said cooling fluid supply and provides an index device of a semiconductor device testing handler, characterized in that configured.

Description

Index apparatus for semiconductor device test handlers

The present invention relates to an index device for transferring and mounting a semiconductor device to a test socket in a handler for testing a semiconductor device. Particularly, a semiconductor device is mounted and tested in a test socket for a semiconductor device test handler performing a high temperature and low temperature test. The present invention relates to an indexing device capable of maintaining a temperature of a semiconductor device mounted on a test socket in a desired temperature state.

In general, semiconductor devices produced in a production line are subjected to a test for determining whether they are good or bad before shipment.

The handler is a device used to test these semiconductor devices. The semiconductor devices contained in the trays are automatically transferred between processes, mounted on the test sockets of the test site, and the desired test is performed. It is a device that executes the test by sequentially repeating the unloading process.

Recently, as the environment in which semiconductor devices are used is diversified, semiconductor devices are required to perform stable functions not only at room temperature but also at a specific temperature environment such as high temperature or low temperature. Recently, handlers have their own specific temperature environment. It is being developed to test the performance of the semiconductor device at a predetermined temperature condition by the composition.

However, in the conventional general handlers, it is difficult to accurately maintain the desired temperature during the test at the test site where the actual test of the semiconductor devices is performed during the low temperature test.

Specifically, in the handler, the semiconductor elements are made at a specific temperature of high temperature or low temperature through a chamber or a so-called soaking plate, and then mounted in a test socket of a test site by an indexing device for a predetermined time. The test is performed, but in the conventional indexer of the handler, a heater is built in the pickup member that picks up the semiconductor element, and thus, the high temperature test can compensate for the heat of the semiconductor element that is picked up by the pickup member, but it can create a low temperature environment. Since a separate temperature composition mechanism is not provided, it is difficult to accurately maintain the temperature of the semiconductor device to be tested at a low temperature test.

Accordingly, the present invention has been made to solve the above problems, by configuring a mechanism that can maintain the temperature of the semiconductor device in a low temperature state in the indexer of the handler, the semiconductor at the test site during the high temperature test as well as the low temperature test It is an object of the present invention to provide an indexing device for a semiconductor device test handler that can maintain a device at a desired temperature.

1 is a configuration diagram schematically showing the configuration of the index apparatus according to the present invention

2 is a perspective view of an index head of the index apparatus according to the present invention;

3 is an exploded perspective view of the index head of FIG.

4 is an exploded perspective view of the pickup member of the index head of FIG.

Explanation of Reference Symbols in Major Parts of Drawings

1: liquid nitrogen storage tank 2: liquid nitrogen supply pipe

3: control unit 4: base plate

41: guide groove 42: injection hole

43: outlet 5 5: pickup member

51: pickup block 52: heating block

53: upper block 55: cooling fin

57: heat transfer column 58: temperature sensor

In order to achieve the above object, the present invention, the base plate is installed so as to be movable up and down and left and right by the drive means on the upper part of the test site in which the test socket in which the semiconductor element is mounted and the test is installed, and the lower part of the base plate. It is fixed to the surface and comprises a plurality of pickup members for picking up the semiconductor element and mounted in the test socket, one end is connected to the external cooling fluid supply source and the other end is connected to one side of the base plate to the base plate A cooling fluid supply pipe for supplying a cooling fluid, an induction groove which is formed in communication with the cooling fluid supply pipe in the base plate to guide the cooling fluid supplied from the cooling fluid supply pipe to each pickup member, and each of the induction grooves. An injection hole formed to communicate with an upper end of each pickup member at an end portion thereof, Cooling fins installed on top of each pickup member and cooled by a cooling fluid injected through the injection hole, and semiconductors installed in the pickup members so as to extend from the lower end portion to the upper end portion of the pickup member and picked up on the lower surface of the pickup member. A heat transfer column made of a thermally conductive material to allow heat transfer from the device to the cooling fins, and between the upper surface of each pickup member and the base plate so that the cooling fluid injected through the injection hole hits the cooling fins and is discharged to the outside. It provides an indexing device of the semiconductor device test handler, characterized in that it comprises a discharge fluid and the cooling fluid control means for controlling the cooling fluid supplied to the guide groove of the base plate through the cooling fluid supply pipe.

According to one aspect of the present invention, the cooling fluid adjusting means includes a valve installed in the cooling fluid supply pipe to control the cooling fluid supply from the cooling fluid supply source, a temperature sensing sensor provided in the pickup member, and the temperature sensing device. It characterized in that it comprises a control unit for controlling the opening and closing of the solenoid valve in accordance with the temperature sensed by the sensor.

Hereinafter, an embodiment of an index device for a semiconductor device test handler according to the present invention will be described in detail with reference to the accompanying drawings.

1 to 4 are diagrams showing the configuration of the index apparatus according to the present invention, wherein the index apparatus is a semiconductor device on a shuttle (not shown) supplied to the test site while repeatedly moving up and down and left and right at the test site of the handler. These devices pick up these devices, load them into a test socket (not shown), perform a test, and unload the tested semiconductor devices to a shuttle waiting at the test site.

As shown in Figures 1 to 4, the index device that performs the above role, the base plate 4 which is installed to be moved up and down and left and right by a separate driving means (not shown) on the upper side of the test site. And a plurality of pickup members 5 fixedly attached to corner portions of the lower surface of the base plate 4 to pick up the semiconductor element 10.

One end of the base plate 4 is connected to an external liquid nitrogen storage tank 1, and an end of the liquid nitrogen supply pipe 2 for transferring liquid nitrogen (LN ₂ ) is connected to the base plate 4. A plurality of guide grooves 41 are formed therein, which are in communication with an end of the liquefied nitrogen supply pipe 2 and branched into a plurality of branches so as to guide the liquefied nitrogen supplied from the liquefied nitrogen supply pipe 2 toward each of the pickup members 5. Each end of the guide groove 41 is formed with injection holes 42 communicating with the upper end of the pickup member (5).

The pickup member 5 includes a pickup block 51 having a suction nozzle (not shown) at the center thereof to suck the semiconductor element 10, and to be connected to an upper portion of the pickup block 51 and to be electrically heated therein. A heating block 52 having a heater 56 to transfer heat to the lower pickup block 51 and an upper portion installed in contact with an upper portion of the heating block 52 and fixed to a lower surface of the base plate 4. And a block 53, and between the heating block 52 and the upper block 53, a degree of freedom for alignment between the semiconductor element 10 picked up by the pickup block 51 and a test socket (not shown) is provided. Position compensation ball plunger 54 is provided to have it. The position compensating ball plunger 54 is irrelevant to the action of cooling the semiconductor element 10 picked up by the pickup member 5, which is the purpose of the present application, and thus its detailed description is omitted.

The upper surface of the upper block 53 of the pickup member 5 is provided with a cooling fin 55 (fin) that is cooled by the liquid nitrogen injected through the injection hole 42 of the base plate 4, the upper block A hollow heat transfer column 57 of a thermally conductive material, which extends to the lower pickup block 51 for heat transfer between the cooling fins 55 and the semiconductor device 10, is installed at the center of the 53.

Then, between the base plate 4 and the upper block 53 of each pickup member 5, the liquid nitrogen injected through the injection hole 42 of the base plate 4 hits the cooling fins 55 and vaporizes. A discharge port 43 is formed to be discharged to the outside.

On the other hand, the indexing apparatus of the present invention is provided with a cooling fluid adjusting means for controlling the supply amount of the liquid nitrogen to the base plate 4, the cooling fluid adjusting means is installed in the liquid nitrogen supply pipe (2) is a liquid nitrogen A temperature installed inside the heating block 52 of the solenoid valve 6 and the pickup member 5 to allow and block the supply of liquefied nitrogen from the storage tank 1 to the base plate 4. The sensor 58 and the control unit 3 for controlling the solenoid valve 6 in accordance with the temperature value detected by the temperature sensor 58.

Here, the controller 3 controls the operation of the heat transfer heater 56 of the heating block 52 according to the temperature value detected by the temperature sensor 58 during the high temperature test of the semiconductor device.

The index device configured as described above operates as follows.

During the low temperature test of the semiconductor element, if the shuttle (not shown) on which the semiconductor elements 10 cooled to a predetermined temperature is seated in the test site is located in the test site, the base plate 4 of the index device is driven. (Not shown), and then a suction nozzle (not shown) mounted on the pickup block 51 of each pickup member 5 sucks and picks up the semiconductor element 10 to be tested. At this time, the adsorbed semiconductor element 10 contacts the lower surface of the pickup block 51.

When the semiconductor element 10 is picked up by the pick-up member 5 of the indexing device, the solenoid valve 6 is opened, and the liquid nitrogen flows from the liquefied nitrogen storage tank 1 to the guide groove 41 of the base plate 4. The liquefied nitrogen introduced and introduced into the guide groove 41 is guided toward each pickup member 5 and injected to the upper surface of each pickup member 5 through the injection hole 42.

The liquefied nitrogen injected through the injection hole 42 hits the cooling fins 55 on the pickup member 5 and vaporizes, thereby cooling the cooling fins 55 and is discharged through the discharge port 43.

As the cooling fins 55 are cooled by the supply of the liquid nitrogen as described above, the cooling fins 55 are generated in the temperature difference between the lower pickup block 51 and the cooling fins 55. Accordingly, the heat transfer column 57 in the center of the pickup member 5 is formed. As the heat exchange is performed through), the temperature of the pickup block 51 is lowered, so that the temperature of the semiconductor element 10 picked up in the pickup block 51 may be maintained without increasing.

As described above, in the state where the temperature of the semiconductor element 10 picked up by the pickup member 5 is maintained at a desired low temperature, the base plate 4 moves toward the test socket (not shown) to stand by at the test standby position. When the test of the semiconductor device, which was being executed first, is completed, the test socket is immediately installed in the test socket.

The liquid nitrogen is continuously supplied to the pickup member 5 while the test is being performed to maintain the temperature of the semiconductor element 10. When the test is finished, the solenoid valve 6 does not need to maintain the temperature. Shut off the supply of liquid nitrogen to (5).

When the liquid nitrogen is excessively supplied to the pickup member 5 while the pickup member 5 is waiting for a test or performing a test as described above, the temperature of the semiconductor element is lowered below a desired temperature. By sensing the temperature of 5) to control the supply of liquefied nitrogen to the pickup member 5 and to maintain the semiconductor element temperature in a desired state.

On the other hand, during the high temperature test of the semiconductor element, while the supply of the liquid nitrogen to the pickup member 5 is blocked, the heat transfer heater 56 inside the heating block 52 is operated in the same manner as the conventional method of the heating block 52. The test is performed by transferring heat to the pickup block 51.

Each block 51, 52, 53 of the pickup member 5 is preferably made of a thermally conductive material in order to improve heat transfer.

As described above, according to the present invention, since the cooling fluid can be supplied to the pickup member of the index device, the temperature of the semiconductor element can be maintained at a desired temperature state in the index device itself during the low temperature test. Testing can be done under these conditions, improving the accuracy and reliability of the test.

Claims (2)

A base plate mounted on the upper side of the test site where the semiconductor device is mounted and the test socket on which the test is performed, and fixedly mounted on the lower surface of the base plate by a driving means, the base plate being fixedly picked up and In the configuration comprising a plurality of pickup members mounted to the test socket, A cooling fluid supply pipe having one end connected to an external cooling fluid supply source and the other end connected to one side of the base plate to supply a cooling fluid to the base plate, and formed to communicate with the cooling fluid supply pipe inside the base plate. An induction groove for guiding the cooling fluid supplied from each of the pickup members, an injection hole formed to communicate with an upper surface of each pickup member at each end of the induction groove, and installed at an upper portion of the pickup members. Cooling fins cooled by a cooling fluid sprayed through the hole and installed in the respective pickup members so as to extend from the lower end portion to the upper end portion of the pickup member so that heat is transferred from the semiconductor element picked up on the lower surface of the pickup member to the cooling fins. A heat transfer column made of a thermally conductive material, and a cooling fluid injected through the injection hole to the cooling fins. A discharge port formed between the upper surface of each pickup member and the base plate so as to be discharged to the outside after being bumped, and cooling fluid adjusting means for controlling the amount of cooling fluid supplied to the guide groove of the base plate through the cooling fluid supply pipe. Indexing device of a semiconductor device test handler, characterized in that configured. 2. The apparatus of claim 1, wherein the cooling fluid adjusting means comprises: a valve installed in the cooling fluid supply pipe to control the supply of the cooling fluid from the cooling fluid supply source, a temperature sensing sensor provided in the pickup member, and the temperature sensing sensor. And a controller configured to control the opening and closing of the solenoid valve according to the temperature detected by the semiconductor device test handler.