KR100190980B1 - Sintered body for board manufacture, board, and manufacture thereof - Google Patents

Abstract

[purpose]

Provided are a substrate manufacturing sintered body and a substrate obtained therefrom, which have good positional accuracy of the vier and can mass-produce the substrate.

[Configuration]

A pillar-shaped unbaked body 22 in which a metal wire 10 made of a metal having a melting point higher than the firing temperature of the sintered body is embedded in parallel with its axis is formed, and the unbaked body 22 is insulated from the sintered body. After firing at a temperature higher than the melting point, the pour point, or the melting point of the gas to form a sintered body, the sintered body is cut to a required thickness from a direction perpendicular to the axis to prepare a substrate.

Description

Substrate sintered body, substrate and manufacturing method thereof

1 is an explanatory diagram of a situation of forming an unbaked body.

2 is an explanatory diagram of a fired body.

3 is an explanatory diagram of a cut substrate.

4 is an explanatory diagram showing another embodiment.

5 is an explanatory diagram of a cut substrate of the embodiment of FIG.

6 is an explanatory diagram of a situation of forming an unbaked body.

7 is an explanatory diagram of the cut out substrate of FIG. 6;

8 is an explanatory diagram of a substrate cut out in Example 6. FIG.

This invention relates to the board | substrate which forms a thin film wiring etc., and also relates to the baking body for manufacturing this board | substrate, and the manufacturing method of a board | substrate.

In recent years, with higher integration of electronic devices, finer and higher density wirings on boards are required. In response to this, a method of forming a fine wiring structure by a thin film on a ceramic substrate has recently been adopted. In particular, the through-holes formed in the ceramic substrate through the simultaneous firing are used most often because both sides of the substrate can be efficiently used and higher density wiring can be realized. Or the package is put to practical use.

If the wiring becomes finer, pores in the ceramics drilled on the substrate surface cause disconnection or high resistance, and a slight deflection of the via position causes a poor conduction. Therefore, in order to enable fine and high-density wiring by thin films, the ceramic substrate must be more compact and smaller in pore size, and the via positioning accuracy must be high. In addition, these substrates should be able to be obtained at a lower cost as a demand that is particularly important in recent years.

Conventionally, the following method has been adopted as a method of manufacturing a ceramic substrate having such vias. That is, first, a green sheet of ceramic is formed, and this is drilled into a shape, and then a through hole is formed at a predetermined position. Next, a metal paste is filled in the through hole, and the green sheets thus treated are laminated and integrated. The obtained laminate is subjected to binder removal and then fired to obtain a substrate. At this time, if the substrate is largely bent, correction or selection is performed. It is then transferred to form and polished to completion.

In the above manufacturing process, when the thickness of the substrate is somewhat thin, the sheet may be filled with metal holes by forming a through hole after the green sheet is laminated, but in most cases, the metal paste is not filled in every green sheet. Can't charge enough. The number of board | substrates obtained from per laminated body of a green sheet is about 1-4 pieces. Increasing the size of the laminate of the green sheet in order to increase the amount obtained per process causes not only poor workability but also a problem of lowering the positional accuracy of the vias. As a result, if the quantity of the unit handled through the process is almost the same, the amount obtained per process or per facility is small, so that a sufficient mass production effect is not obtained, and thus the cost cannot be lowered. Defects, such as poor conduction due to the sense or bending of the substrate, further makes it difficult to reduce the cost.

Accordingly, it is an object of the present invention to provide a substrate manufacturing calcined body, a substrate, and a method for manufacturing the via, which have a good positional accuracy of vias and can mass-produce the substrate.

The present invention has the following configuration to achieve the above object.

In other words, in a substrate-fabricated sintered body, it is a moving shaped plastic body having a metal wiring body parallel to its axis, and the metal wiring body has a melting point higher than the melting point, the pour point, or the softening point of the insulating gas of the substrate. It is done.

Moreover, it has a columnar body parallel to the axis line inside with the said metal wiring body, This columnar body is characterized by having melting | fusing point higher than melting | fusing point, a pour point, or a softening point of the insulated gas of the said sintered body. As the columnar body, metal columns, ceramic columns and silicon columns are preferably used.

In the sintered body for manufacturing a substrate, a columnar sintered body has a metal wiring body parallel to its axis and a hollow tube body made of metal or ceramic, and the metal wiring body and the cylindrical body are the sintered body. It has a melting point higher than the melting point, the pour point, or the softening point of the insulated gas, and has a metal wiring body parallel to the axis therein and a through hole formed parallel to the axial direction.

As the metal wiring, a metal containing copper, nickel, iron, silver, gold or any one or more of these as a main component can be used.

As the metal column, copper, nickel, iron, tungsten, molybdenum, or a metal containing at least one of these as a main component can be used.

In addition, the columnar calcined body is characterized by having a columnar shape or a prismatic shape.

Moreover, it is preferable that the said columnar fired body has crystallized glass or amorphous glass as a main component.

In the method of manufacturing a substrate, a pillar-shaped unbaked body in which a metal wire made of a metal having a melting point higher than the firing temperature of the fired body is embedded in parallel with its axis is formed, and the unbaked body is insulated gas of the unbaked material. It is characterized by firing at a temperature higher than the melting point, the pour point or the softening point of to form a fired body, and then cutting the fired body to the required thickness in a direction perpendicular to the axis.

A column in which a metal wire made of a metal having a melting point higher than the firing temperature of the fired body is embedded in parallel with its axis along with a columnar body of a metal column, a ceramic column, or a silicon column having a melting point higher than the firing temperature of the fired body. Shaped unbaked bodies are formed, and the unbaked bodies are fired at a temperature higher than the melting point, the pour point or the softening point of the insulated gas of the unbaked bodies to form a fired body. Characterized in that.

A metal wire rod made of a metal having a melting point higher than the firing temperature of the fired body is embedded with a cylindrical body of a metal or ceramic material having a melting point higher than the firing temperature of the fired body. After molding, the unbaked body is fired at a temperature higher than the melting point, the pour point, or the softening point of the insulated gas of the unbaked body to form a fired body, and then the fired body is cut to the required thickness in a direction perpendicular to the axis. .

Further, a pillar-shaped unbaked body in which a metal wire made of a metal having a melting point higher than the firing temperature of the fired body is buried parallel to the axis along with a columnar body having a melting point higher than the firing temperature of the fired body is formed. The unbaked body is fired at a temperature higher than the melting point, the pour point, or the softening point of the insulated gas of the unbaked body, and then fired. It is characterized by cutting.

In addition, the pillar-shaped unbaked body is molded into a container, and is fired together with the container.

The container may be made of copper, nitel, iron, or any one or more of metals, alumina, mulite, boron nitride, ceramics or graphite.

In addition, the fired body for engine production can be cut to the required thickness in the direction perpendicular to the axis line, and formed into a plate shape in which a metal wiring body is exposed on the surface, thereby obtaining a substrate.

In the present invention, the substrate is obtained by a manufacturing process that is completely different from the conventional method. By using the substrate-fired calcined body, a substrate having vias can be obtained without generating various defects that have adversely affected yields in the past. In addition, the mass production effect is sufficiently obtained, resulting in a significant cost reduction.

That is, in the present invention, first, a columnar calcined body having a metal wiring body parallel to the axis line is obtained, and then the substrate having the via is obtained by cutting the columnar body perpendicularly to the axis line. In order to obtain the columnar calcined body, it is necessary to mold the columnar unbaked body, and a slip injection molding method, an extrusion molding method, or the like can be applied as the method. However, forming a metal wiring parallel to the axis is difficult in the application of the conventional method, and at least after forming or firing the unbaked body, forming the metal wiring is difficult in various ways. According to the conventional method, the through-hole is formed in the unbaked body and the metal paste is filled therein, but first, it is difficult to form long through-holes with good precision in the pillar-shaped unbaked body, even though the through-hole is formed. It is difficult to fill the paste to a sufficient density. This also applies to the fired body.

Therefore, in the present invention, a metal wire is used to simultaneously penetrate into the unbaked body when forming the unbaked body to form a metal wiring body. Next, this is fired to obtain a fired body for producing a substrate.

As the unbaked material, one having a melting point, pour point, or softening point lower than that of the metal wire is used. Therefore, according to the present invention, the insulating gas portion of the unbaked body is fluidized during the firing. Therefore, the unfired body needs to be fired in a container having the same internal structure as the shape after firing. This container can be used as it is usually used for molding the unbaked body. Since it can be molded in a container and baked as it is, it is not necessary to add a binder component and a plasticizer component especially when obtaining an unbaked body. Therefore, drying of the unbaked body becomes easier than before, and the binder removal process becomes unnecessary.

The insulating gas portion of the columnar calcined body is sufficiently fluidized at the firing treatment temperature, and basically any composition may be used, but preferably, crystallized glass or amorphous glass is the main component. Alternatively, various kinds of ceramic powders such as alumina ceramics and mulite ceramics are added to these glasses so as not to prevent the composition from sufficiently fluidizing at the firing temperature. The firing temperature is also related to these compositions, but generally, the columnar calcined body is obtained at a maximum temperature in the range of 500 ° C to 1400 ° C.

As the metal wire, a metal mainly composed of one or more of copper, nitel, iron aluminum, silver, and gold can be used.

By the way, the insulated gas of the unbaked body through which the metal wire penetrated causes shrinkage accompanying densification at the time of firing, while the metal wire is thermally expanded upside down. However, because the insulator gas of the unbaked body fluidizes at a certain temperature, the stress accompanying the volume change is eliminated. In the cooling process after firing, thermal expansion coefficient aberration between the metal wire and the insulated gas causes stress, but if the diameter of the metal wire is somewhat thin and the Young's modulus is small, the problem does not occur. Although it depends on the height of the columnar plastic body, even if there is a difference of about 12 × 10 ⁻⁶ / ° C., the stress does not cause a problem and cracks or disconnection do not occur.

One of the problems that is likely to be a problem due to the stress caused by the thermal expansion coefficient difference is the case where the thermal expansion coefficient difference between the unbaked body and the container used for its firing is large. Secondly, a metal column for heat dissipation is penetrated separately from the metal wire in the unbaked body, and the thermal expansion coefficient of both is large.

As the container used during the firing, a metal container mainly containing one or more of copper, nickel and iron, or a ceramic container or graphite container mainly containing one or more of alumina and mulite boron nitride is used. Of these, when the unbaked body does not adhere to the container after the suit, for example, using a hexagonal boron nitride or graphite container, the fired body is likely to fall out of the container during the cooling process after firing, and in this case, the problem of stress There is no. In the case of using a metal container, destruction can be prevented by making the thickness of the container wall as thin as possible. This effect is obtained well when copper is used for the container. However, if the container is a large metal and has a large wall thickness, the crack of the whole of the pillar-shaped plastic body does not occur depending on the composition of the unbaked body, and only a limited open crack occurs at the bottom and the outer peripheral part of the plastic body. Does not interfere with obtaining the substrate in a later process. On the other hand, when using a container made of alumina ceramics or mulite ceramics, the thermal expansion coefficient difference between the unbaked body and the container needs to be approximately 3 × 10 ⁻⁶ / ° C. or less.

The structure in which the metal pillar penetrates the unbaked body is used to obtain an engine having a heat dissipation unit, but even in this case, there is no problem of stress until the insulating gas portion of the unbaked body solidifies in the cooling process after firing. The thermal expansion coefficient aberration in the subsequent cooling process becomes a problem. As the metal pillar, a metal mainly composed of one or more of copper, nickel, iron tungsten and molybdenum can be used. In addition, it is desirable to minimize thermal stress by complex metallization such as copper-tungsten based in consideration of the coefficient of thermal expansion of the insulated gas of the unbaked body, the height of the columnar plastic body, and the cross-sectional area of the metal pillar.

A substrate having vias is obtained by cutting this columnar plastic body to a predetermined thickness perpendicular to the axis. In other words, the metal wiring in the fired body is cut into vias. According to the kind of process after making it into a board | substrate, if necessary, before cutting a board | substrate, the outer peripheral part is polished by grinding, orientation flat processing, etc. are performed. After cutting, both sides are usually polished.

As described above, many substrates can be obtained from one fired body. For example, 180 or more board | substrates which have about 0.6-0.7 mm thick via and a heat radiating part can be obtained from the columnar plastic body of 20 cm in height. Since these board | substrates are cut out and obtained, there is no curvature similar to the case where it is baked individually, and therefore, almost 100% can be transferred to a double-side polishing process as it is. In addition, since the via conductors are not connected by laminating the green sheets, there is no problem of disconnection or high resistance due to the lamination of the laminations.

In addition, when the unbaked body is formed in a circumferential shape, the shrinkage becomes uniform during firing, so that the size (diameter) of the cut substrate can be made constant. In addition, if the shape is square, the area that can be effectively used on the substrate can be increased. Moreover, the board | substrate cut out from the fired body can be further divided into several plane, and can also be used as an individual board | substrate.

The board | substrate obtained by this invention can be packaged with a ceramic board, a glass board, etc. which formed the wiring pattern which becomes an internal wiring on the surface (composite type package). When the package is a product having a cavity for storing semiconductor elements, a container for injecting an unbaked material is used as a container having a circular or spherical cross section mounted upright in the container, and the metal wire is placed in the axial direction of the container. After arranging in parallel, the unbaked material is injected into the container so as not to penetrate into the cylindrical body, and the unbaked material is fired together with the container to obtain a fired body. The board | substrate is obtained by slicing a sintered compact, and the board | substrate with which the inside which provided the cylindrical body was provided through-hole is obtained. The edge portion of the through hole is supported by the slice portion of the cylindrical body.

As a material of the said cylindrical body, nickel, an alloy containing these, for example, iron-cobalt- nickel alloy, 42 alloy etc. are used as a metal. As the ceramic, alumina, mulite, aluminum nitride and the like are used.

In the case where the edge portion of the through hole is not supported by the slice portion of the cylindrical body and is simply obtained as a substrate having the through hole, a columnar body made of graphite or hexagonal boron nitride is substituted in the container instead of the cylindrical body of the metal or ceramic. The substrate having a through hole is obtained by injecting and firing the unbaked body into the container and then removing the columnar body.

In this case, if the coefficient of thermal expansion of the unbaked material is slightly smaller than that of the columnar body, a gap is generated at the interface between the plastic body and the columnar body, so that the columnar body can be easily taken out.

Moreover, the board | substrate of a composite composition can be obtained by leaving it as it is, and removing the columnar body provided in the container as it was, and leaving it as it was when using the metal group mentioned above. The use of a ceramic column or a silicon column as the columnar body has a merit that there is little mechanical difference between the matrix portion of the substrate mainly composed of glass, and thus the substrate can be efficiently sliced and polished, thereby facilitating processing. In addition, there is an advantage that the substrate of the composite composition with the ceramic or silicon is excellent in heat dissipation and thermal stress resistance.

EXAMPLE

Example 1

Bore silicate glass with a thermal expansion coefficient of about 4.5 × 10 ^-6 / ° C and a softening point of about 640 ° C. A diameter of about 16 μm dispersed in ethanol in a high concentration suspension of about 0.24 mm in diameter. It filled in the steel container 12 of about 14 cm, and it settled and dried, and set it as the unbaked body 22 (FIG. 1). Of this vessel dry N ₂ atmosphere with 12, and then calcined for 1 hour at a maximum temperature of 700 ℃, by cutting the container 12 was taken out a plastic body (24). Many cracks occurred on the outer circumference of the fired body 24, but all of them existed locally at the outer circumference, and none of them occurred inside the fired body 24. This is done after the outer periphery, and cuts the substrate 14 (FIG. 3) having a thickness of about 0.7 mm with a blade slicer of the inner periphery perpendicular to the metal wiring body 26, so that large pores or cracks, in particular, vias 20 It was confirmed that no crack was generated around the perimeter.

18 is a lid body with a through hole for penetrating the metal wire 10 in a predetermined pattern. Nickel, iron, silver, and gold may also be used as the metal wire.

Example 2

A high-concentration suspension in which powder of average particle diameter of about 15 μm of CaOBaO-SiO ₂ -based glass having a thermal expansion coefficient of about 6.5 × 10 ^-6 / ° C. and a softening point of about 850 ° C. was dispersed in ethanol was penetrated through a copper wire having a diameter of about 0.24 mm. It was filled into a cylindrical container made of alumina ceramic having a diameter of 9 cm, dried after sedimentation filling to obtain an unbaked body. This was calcined with a container made of alumina ceramic in a dry N ₂ atmosphere at a maximum temperature of 1020 ° C. for 1 hour to obtain a fired body. No crack was observed in both the alumina ceramic container and the fired body. This was cut with a substrate of about 0.7 mm in thickness with a slicer of the inner circumference perpendicular to the metal wiring body with the alumina ceramic container, and it was confirmed that no large pores or cracks occurred inside the bar, especially around the vias. Nickel, iron and gold may also be used as the metal wire.

Example 3

A glass powder suspension similar to Example 2 was about 14 cm in diameter penetrating a metal wire 10 made of copper wire having a diameter of about 0.24 mm and a metal column 16 made of a copper-tungsten composite (20% copper) having a diameter of about 10 mm. Was filled in the iron container 12, and after settling and filling, it was made into the unbaked body 22. (Figure 4). This was calcined in the same manner as in Example 2, and the substrate 14 (FIG. 5) having a thickness of about 1.0 mm was cut out to confirm that no defects such as cracks occurred inside.

Example 4

10 volume% of the alumina powder of average particle diameter about 0.6 micrometer was mixed with the glass powder similar to what was used in Example 2, and it was set as the homogeneous suspension. This was filled into a cylindrical container made of boron nitride ceramic having an inner diameter of about 10 cm penetrating through a metal wire made of copper wire having a diameter of about 0.24 mm, and dried after sedimentation filling to obtain an unbaked body. This was calcined together with the boron nitride container in a dry N ₂ atmosphere at a maximum temperature of 980 ° C. for 2 hours to obtain a fired body. The obtained fired body was taken out of the boron nitride container, and then cut in the same manner as in Example 2 to obtain a substrate. It was confirmed that the substrate had no large pores or cracks inside. Thus, the strength of a board | substrate can be improved by mixing an alumina powder.

Example 5

Metal wire rod of copper wire having a diameter of about 0.3 mm in a high-concentration suspension having a mean particle diameter of about 15 μm of CaOBaO-SiO ₂ -based glass having a coefficient of thermal expansion of about 6.6 × 10 ^-6 / ° C. and a softening point of about 850 ° C. in ethanol (10) And a cylindrical cylindrical body 30 made of alumina ceramic having a thickness of about 0.8 mm and having a thickness of about 17 mm and placed in a cylindrical container 12 made of alumina ceramic having an inner diameter of about 10 cm, and dried after being settled and filled into the unbaked body 22. (FIG. 6). This was fired together with the container 12 in a dry N ₂ atmosphere at a maximum temperature of 960 ° C. for 3 hours to obtain a fired body. It was confirmed that a defect such as a crack was not generated when the substrate 14 having a thickness of about 0.5 mm was cut out with the slicer of the inner circumference perpendicular to the metal wire 10 together with the container 12 made of alumina ceramic. (Figure 7). The through hole 32 of the substrate is supported by the slice portion 30a of the tubular body 30 of alumina ceramic.

Example 6

A cylindrical container made of alumina ceramics in the same manner as in Example 5 except that borosilicate glass having a thermal expansion coefficient of about 4.5 × 10 ⁻⁶ / ° C. and a softening point of about 640 ° C. had a powder having an average particle diameter of about 16 μm and a graphite column having a column shape of about 17 mm. The high concentration suspension was filled in to make an unbaked body. The unbaked body was fired together with the container for 2 hours at a maximum temperature of 700 ° C. in a dry N 2 atmosphere to obtain a fired body. The graphite column body was removed from the fired body and sliced in the same manner as in Example 5 to obtain a substrate 14 having a through hole 32 (FIG. 8). It is confirmed that a defect such as cracking does not occur inside the substrate 14.

Example 7

As a columnar body, a 99% alumina ceramic group having a angle of about 17 mm was used, and a boron nitride container was used as the cylindrical container. In the same manner as in Example 5, a high-concentration suspension was filled in an alumina ceramic cylinder-type container, dried after sedimentation filling, and unbaked body. It was set as. This was calcined with a boron nitride container at a maximum temperature of 960 ° C. in a dry N 2 atmosphere for 3 hours to obtain a fired body. The substrate of about 0.7 mm in thickness was cut out with the slicer of the inner peripheral blade perpendicular to the said copper wire with this container. It was confirmed that no large pores or cracks occurred in the substrate, particularly in the vicinity of the copper via and the alumina ceramic portion.

Example 8

An unbaked body was prepared in the same manner as in Example 6 except that a 97% aluminum nitride ceramic column having a 17 mm angle was used as the columnar body and a boron nitride container as the cylindrical container, which was then dried at a maximum temperature of 700 ° C. in a dry N 2 atmosphere. It baked for 2 hours and obtained the fired body. In the same manner as in Example 6, the fired body was sliced to obtain a substrate. It was confirmed that no crack or the like occurred inside the obtained substrate.

Example 9

Borosilicate glass with a thermal expansion coefficient of about 2.6 × 10 ^-6 / ℃, a softening point of about 830 ℃, and a powder with a maximum particle size of about 60 μm, a mixed powder obtained by adding 10% by volume of alumina powder with an average particle diameter of about 0.6 μm, and a silicon single crystal column of about 17 mm angle. In the same manner as in Example 6 using a graphite cylindrical vessel having an inner diameter of about 10 cm, an unbaked body was obtained, and then fired for 3 hours at a maximum temperature of 980 ° C. in a dry N 2 atmosphere to obtain a fired body. This was sliced in the same manner as in Example 6 to obtain a substrate. It was confirmed that large pores, cracks, or the like did not occur in the substrate.

According to the present invention, a substrate having a high positional accuracy or via and a heat dissipation metal group is obtained in a significantly simpler and shorter manufacturing process than the conventional method. Furthermore, since a large amount of substrates are obtained per process, the manufacturing cost can be greatly reduced. There is a number. In addition, since the vias are not formed by laminating and connecting the green sheets, and are obtained by cutting the metal wiring, there is no problem of poor conduction due to lamination deflection, and the reproducibility such as shape and dimensional accuracy of the obtained substrate is also good. Moreover, since it does not bake every board | substrate, it cuts out after baking and obtains a board | substrate, and there exists no problem of curvature, and a yield is high. In addition, it is possible to easily obtain a substrate having a through hole for interrogating a semiconductor element or the like, or a composite substrate with ceramic or silicon having excellent heat dissipation and heat stress resistance.

Claims (18)

A columnar calcined body for manufacturing a substrate, comprising: a columnar insulating gas having an axis; At least one metal interconnection body disposed in the insulator gas in parallel with the axis; And a columnar body disposed in parallel with the axis inside the insulated gas together with the at least one metal wire, wherein the at least one metal wire has a melting point higher than the melting point, the pour point, or the softening point of the insulated gas. And the columnar body has a melting point higher than the melting point, the pour point, or the softening point of the insulating gas. The said columnar body is a cylindrical body arrange | positioned in parallel with the said axial line inside the said insulated gas with the said metal wiring body, The said cylindrical body is higher than melting | fusing point, a pour point, or a softening point of the said insulated gas. It has melting | fusing point, The board | substrate manufacturing baking body characterized by the above-mentioned. The fired body for manufacturing a substrate according to claim 1, wherein the columnar body is made of metal. The fired body for manufacturing a substrate according to claim 1, wherein the columnar body is made of ceramic or silicon. 2. The fired body for manufacturing a substrate according to claim 1, wherein the insulating base has a through hole extending parallel to the axis. 2. The fired body for manufacturing a substrate according to claim 1, wherein the metal wiring body is made of copper, nickel, iron, silver, gold, or a metal containing at least one of them as a main component. 4. The fired body for manufacturing a substrate according to claim 3, wherein the metal pillar is made of copper, nickel, iron, tungsten, molybdenum, or a metal mainly composed of at least one of them. 2. The fired body for manufacturing a substrate according to claim 1, wherein the pillar-shaped fired body has a cylindrical shape or a prismatic shape. 2. The fired body for manufacturing a substrate according to claim 1, wherein the columnar insulating gas is mainly composed of crystallized glass or amorphous glass. The unbaked body is formed by forming a columnar unbaked body in which a metal wire made of a metal having a melting point higher than the firing temperature of the fired body is embedded in parallel with its axis in an insulated gas mainly composed of crystallized glass or amorphous glass. Is fired at a temperature higher than the melting point, the pour point or the softening point of the insulated gas of the unbaked body, cooled to form a fired body, and then the fired body is cut into the required thickness in a direction perpendicular to the axis. . A metal wire made of a metal having a melting point higher than the firing temperature of the fired body is made of crystallized glass or an amorphous glass together with a metal group, a ceramic group, or a columnar body of silicon pillar having a melting point higher than the firing temperature of the fired body. After forming an insulated gas as a main component and a starting body-like microbubble parallel to the axis line, firing and cooling the unbaked body to a temperature higher than the melting point, pour point or softening point of the insulated gas of the unbaked body, A method for manufacturing a substrate, wherein the fired body is cut to a required thickness in a direction perpendicular to the axis. An insulated gas mainly composed of crystallized glass or amorphous glass, together with a metal wire made of metal having a melting point higher than the firing temperature of the fired body, and a cylindrical body made of metal or ceramic having a melting point higher than the firing temperature of the fired body. After forming the unbaked pillar-shaped body embedded parallel to the axis line, the unbaked body was calcined at a temperature higher than the melting point, the pour point or the softening point of the insulated gas of the unbaked body, and cooled to form a fired body. The manufacturing method of the board | substrate characterized by cutting to required thickness in the direction perpendicular to the axis line. The metal wire made of a metal having a melting point higher than the firing temperature of the fired body is parallel to its axis with an insulated gas mainly composed of crystallized glass or amorphous glass together with a columnar body having a melting point higher than the firing temperature of the fired body. After the pillar-shaped unbaked body was buried, the unbaked body was fired at a temperature higher than the melting point, the pour point or the softening point of the insulated gas of the unbaked body, cooled to form a fired body, and then the columnar body was removed from the fired body. And cutting the fired body to the required thickness in a direction perpendicular to the axis thereof. The method of claim 11, wherein the columnar unbaked body is molded in a container and fired together with the container, wherein the container is made of copper, nickel, iron, or a metal, alumina, or murite having at least one of them as a main component. Or a ceramic or graphite of any one of boron nitride. 12. The method of claim 11, wherein the columnar unbaked body is molded in a container and fired together with the container, wherein the container is made of copper, nickel, iron, or a metal, alumina, or murite having at least one of them as a main component. The method for producing a substrate, characterized in that any one of ceramics or graphite of boron nitride. A substrate according to claim 1, wherein the firing body for substrate production is cut into a required thickness in a direction perpendicular to the axis line and formed into a plate shape in which a metal wiring body is exposed on the surface. 13. The method of claim 12, wherein the pillar-shaped unbaked body is molded in a container and fired together with the container, wherein the container is made of metal, alumina, or murite mainly composed of copper, nickel, iron, or any one or more thereof. Or a ceramic or graphite of any one of boron nitride. The method of claim 13, wherein the pillar-shaped unbaked body is molded in a container and fired together with the container, wherein the container is made of metal, alumina, or murite, mainly composed of copper, nickel, iron, or any one or more thereof. A method for producing a substrate, characterized in that any one of boron nitride is made of ceramic or graphite.