JPS6347265B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an IC card equipped with or having an IC chip installed therein.

In recent years, research has been carried out on cards called chip cards, memory cards, microcomputer cards, electronic cards, etc. (hereinafter simply referred to as IC cards) that are equipped with or have built-in IC chips such as microcomputers and memories.

Since such IC cards have a larger storage capacity than conventional magnetic stripe cards, banks are considering storing the history of deposits and savings in place of passbooks, and credit cards are being used to store the history of transactions such as shopping. Such IC cards necessarily have connection electrodes for electrically and mechanically connecting the IC circuit to an external data processing device, etc., and the method for installing these connection electrodes is to place them on the card surface. Two methods are being considered: one method is to provide the card, and the other method is to provide it on the end face of the card. However, in the latter method, it is necessary to form a circuit pattern inside the card base material, which unnecessarily complicates the manufacturing process, and does not provide enough electrode contact area with the connection terminal of an external data processing device, making it unreliable. Therefore, as a method for installing connection terminals in an IC card, it is desirable to provide a connection electrode surface on the card surface.

In this way, even in the case of an IC card in which connection terminals are provided on the card surface, the IC chip is completely buried in the card base material, the IC chip is completely surrounded by the card base material, and the IC chip is completely buried inside the card base material. An IC card is being considered in which an electrode for connection with the outside and an IC chip are connected by processing and forming a conductive pattern for taking out the electrode. However, the heat and pressure of integral molding with the card base material lowers the reliability of the IC chip and the connection between the IC chip and the circuit pattern, and if integral molding is not performed, the delamination strength of the card may decrease. Otherwise, there are problems such as warping of the card, which is not desirable for the manufacture or structure of IC cards.

This invention describes an IC chip that should be installed in an IC card.
The aim is to provide highly reliable IC cards by modularizing all electrical elements, including circuit patterns. In addition, in consideration of applications where the rigidity of only the IC module increases and the flexibility of the card is inhibited, and the card is likely to be damaged if the card is deformed, as well as IC module damage or wire breakage, the card base material is Another purpose is to provide an IC card with increased rigidity.

This invention will be explained below.

This invention relates to an IC card, in which the potting frame is made of hard polyvinyl chloride and the electrode circuit board is
The IC chip is bonded and the inside of the potting frame is integrally molded with epoxy resin, and the IC module is attached to a card base made of hard polyvinyl chloride.

That is, FIG. 1 shows a cross section of the IC module according to the present invention, FIG. 2A is a top perspective view, FIG. 2B is a bottom perspective view, and FIG. It shows. First, a glass epoxy film substrate 1 with a thickness of about 0.1 mm is etched using a printed wiring film laminated with a 35 μm thick copper foil to obtain a desired pattern, and then nickel and gold plating is performed. After forming the electrode pattern 2 for external connection and the circuit pattern 3, punching is performed to a desired size. Connection electrode pattern 2 and circuit pattern 3
It is electrically connected to through holes 4 at necessary locations. Then, the IC chip 5 is die-bonded to a predetermined position on this circuit pattern 3, and the IC chip 5 is
The electrodes 6 on the chip 5 and the circuit pattern 3 are connected by a conductor 7 using a wire bonding method (see FIG. 2B). This part can also be performed using the face bonding method, which does not use wires.
In that case, a thinner IC module can be obtained. After making the necessary connections between the IC chip 5 and the circuit pattern 3, a potting frame 8 made of hard polyvinyl chloride is glued to the glass with an epoxy or acrylic adhesive, etc., to prevent the epoxy resin from flowing when potting it. It is attached to the epoxy film substrate 1, and the epoxy resin 9 is poured in and molded (see Figure 2 C). At this time, the viscosity is relatively high (about 10 ⁵ CPS).
First, hide the through hole 4 with epoxy resin, and after confirming that it is sufficiently cured, use a low viscosity resin (10 ³ CPS).
If you use the method of pouring epoxy resin of
It is possible to prevent the epoxy resin 9 for potting from coming out through the through hole 4 to the side of the connection electrode pattern 2 which is the surface.

Although the IC module 10 for an IC card can be obtained by the method described above, the method for forming the circuit pattern 3 and the connection electrode pattern 2 and
Including the method of bonding IC chip 5,
Each of the methods described herein is compatible with current technology in the relevant industry.

On the other hand, the following method can be used to obtain a desired IC card using this IC module 10. That is, referring to the case where hard polyvinyl chloride is used as the card base material, FIG. 3 is a plan view of the IC card, and FIG. 4 is a sectional view taken along line AA in FIG. 3. The card base material is a center core 11 made of 0.56 mm thick opalescent hard polyvinyl chloride, and after printing the desired pattern 14 on the front and back sides by offset printing or silk screen printing, an oversheet made of 0.1 mm thick transparent hard polyvinyl chloride is used. 12 on the front and back, and sandwiched between two mirror-finished metal plates such as stainless steel, at a temperature of 150℃ and a pressure of 25kg/
A hard polyvinyl chloride laminate (card base material) with a thickness of 0.76 mm can be obtained by heating and pressing under the laminating conditions of cm ² and 20 minutes.

Moreover, in order to obtain a card base material having a magnetic recording body /3, an oversheet with a magnetic recording body 13 is prepared in advance by thermal transfer or stripe coating on either of the oversheets 12 to be laminated on the front and back sides of the center core 11 described above. After alignment with the desired pattern, a magnetic recording body hard polyvinyl chloride laminate is obtained under the same laminating conditions as described above. A card is obtained by punching this laminate using a patterned cutting die having a desired size. After obtaining the card, use an end mill or engraving machine to cut a recess that has the same planar dimensions as the IC module 10 or is slightly larger than the IC module 10, and is about 0.05 mm deep or the same as the IC module thickness, to form an attachment part for the IC module 10. do.

Next, the IC module 10 is fixed to the recess using a two-component coin-type acrylic resin adhesive 15, such as Versalock (manufactured by Sony Chemical), on the lower and side surfaces of the recess. Thus, as shown in Figure 3.
You can create an IC card.

On the other hand, FIG. 5 shows another embodiment of the present invention, in which an adhesive (salt vinyl acetate, etc.) 16 is applied in advance to the sides of the center core 11 on the front and back oversheets 12, and the printed center core 11 is attached to an IC module. 10
Punch holes with dimensions of . Similarly, a hole with the size of the IC module 10 is provided in the front oversheet 12, and the same adhesive 17 as described above is applied to the side surface of the IC module 10 in advance. It has a three-layer structure, and an IC module 10 is attached to the punched hole. In this case, the temperature is 100℃, the pressure is 30Kg/
cm ² and laminated for 20 minutes. Further, after the IC module 10 is installed, only the periphery thereof or the entire IC module 10 except for the IC module 10 may be subjected to ultrasonic welding in advance. Furthermore, without using adhesives 16 and 17, at a temperature of 150℃ and a pressure of 25Kg/
It is also possible to heat-fuse and integrate under lamination conditions of cm ² and 15 minutes. In the case shown in FIG. 5, the IC module 10 may have the same thickness as the sum of one oversheet 12 (for the front) and one core sheet 12.

On the other hand, FIGS. 6A and 6B show an example in which the potting frame 8A is larger than the electrode circuit board 2, and the IC card in this case is manufactured as follows. That is, a hole the same size as the potting frame 8A is made in the center core 11 of the card base material, and a hole the same size as the electrode circuit board 2 is made in the oversheet 12. Then, as in the case of Fig. 5, a three-layer structure is formed, and the IC module 10A is installed, followed by heat-pressure lamination (temperature 150°C, pressure 25 kg/cm ² , time 15 minutes) or ultrasonic welding to form the structure shown in Fig. 7. Configure the IC card as shown. Note that if adhesive is applied to the oversheet 12 in advance, the temperature
The heat conditions may be as low as 100°C, pressure 30Kg/cm ² , and time 20 minutes. According to this IC card, the front oversheet 12 covers a part of the IC module 10 and is integrated, so there is very little fear that the IC module 10 will come off from the card base. A plan view of the IC card in this case has a structure as shown in FIG.

In addition, the IC card shown in Figure 9 is the one shown in Figure 6 above.
It was created using IC module 10A, and potting frame 8A of IC module 10A.
A recess 20 having a depth and size corresponding to the thickness and outer shape of the oversheet is formed to form the first recess, and a second recess 20 having a depth equivalent to the thickness of the oversheet and a size larger than the first recess. A two-stage recess is formed inward. Then, the IC module 10A is installed in this two-stage recess, and a ring-shaped oversheet 12A punched out with the external size of the second recess and the internal size of the electrode circuit board 2 is overlapped, and the front and back surfaces are stacked. It was integrated by ultrasonic welding. A plan view of the IC card in this case has a structure as shown in FIG.

As described above, according to the IC card of this invention,
Since the potting frame and the card base material are made of the same material, processing is particularly good, and the adhesive strength is even greater than in the past. In addition, ultrasonic welding and thermocompression lamination are possible, which has the advantage of improved adhesive strength and easy installation work.

In each of the embodiments described above, the number of IC chips or IC modules embedded in the IC card is one, but the number of embedded IC modules is arbitrary, and the shape of the IC module is also arbitrary. Furthermore, the shape of the IC chip or hole buried for the IC module may be square, circular, or any other shape.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of an IC module used in the present invention, FIGS. 2A to C are an upper perspective view, a lower perspective view, and a lower perspective view after molding, and FIG. 3 is a plan view of an IC card of this invention. 4 is a cross-sectional view taken along line A-A, FIG. 5 is a cross-sectional view of an IC card according to another embodiment of the present invention, and FIGS. 6A and B are other examples of IC modules used in the present invention. 7 is a cross-sectional view of an IC card using this IC module, FIG. 8 is a plan view of the IC card, and FIG. 9 is a diagram of FIGS. 6A and B.
FIG. 10 is a cross-sectional view of an IC card showing another embodiment of the present invention using an IC module, and FIG. 10 is a plan view of the IC card. DESCRIPTION OF SYMBOLS 1...Glass poxy film board, 2...Connection electrode pattern, 3...Circuit pattern, 4...Through hole, 5...IC chip, 6...Electrode, 7...Conductor, 8,
8A...Potting frame, 10,10A...IC module.

Claims (1)

[Claims] 1 The potting frame was made of hard polyvinyl chloride, an IC chip was attached to the electrode circuit board by bonding, and the IC module, which was integrally processed inside the potting frame by epoxy resin molding, was attached to the card base made of hard polyvinyl chloride. An IC card that is characterized by: