JPS63141233A - Chip type fuse - Google Patents
Chip type fuseInfo
- Publication number
- JPS63141233A JPS63141233A JP61287081A JP28708186A JPS63141233A JP S63141233 A JPS63141233 A JP S63141233A JP 61287081 A JP61287081 A JP 61287081A JP 28708186 A JP28708186 A JP 28708186A JP S63141233 A JPS63141233 A JP S63141233A
- Authority
- JP
- Japan
- Prior art keywords
- type fuse
- chip
- insulating base
- chip type
- conductive part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 229920002050 silicone resin Polymers 0.000 claims description 10
- 230000001681 protective effect Effects 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 description 13
- 239000000758 substrate Substances 0.000 description 13
- 239000010408 film Substances 0.000 description 11
- 239000010409 thin film Substances 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000009966 trimming Methods 0.000 description 4
- 239000010931 gold Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- IHWJXGQYRBHUIF-UHFFFAOYSA-N [Ag].[Pt] Chemical compound [Ag].[Pt] IHWJXGQYRBHUIF-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/046—Fuses formed as printed circuits
Landscapes
- Fuses (AREA)
- Techniques For Improving Reliability Of Storages (AREA)
Abstract
Description
【発明の詳細な説明】
（イ）産業上の利用分野
この発明は、低価格で印刷回路基板への自動実装に適し
たチップ型ヒユーズに関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application This invention relates to a chip-type fuse that is inexpensive and suitable for automatic mounting on a printed circuit board.
（ロ）従来の技術
一般に、電子回路部品等においては、過電流が流れない
ようにヒユーズを設け、破損等を防止するようにしてい
る。このヒユーズにおいて、近年、プリント基板等に直
接実装するために、チップ型のものが開発されている。(b) Prior Art Generally, electronic circuit components and the like are provided with fuses to prevent overcurrent from flowing to prevent damage. In recent years, chip-type fuses have been developed in order to be directly mounted on printed circuit boards and the like.
従来のチップ型ヒユーズとしては、絶縁基台両端に電極
を形成し、これら電極間を電気的に接続する金属薄膜よ
りなる導電部を、絶縁基台下面に設けられる凹部内に形
成したものが知られている（実公昭６１−１１８８１号
公報）。A conventional chip-type fuse is one in which electrodes are formed on both ends of an insulating base, and a conductive part made of a thin metal film that electrically connects these electrodes is formed in a recess provided on the underside of the insulating base. (Utility Model Publication No. 61-11881).
また、絶縁基台上に１対の電極を形成し、これら電極間
に金（Ａｕ）線をワイヤボンディングし、絶８！基台表
面に樹脂を盛り、この金線を封止してなるものも知られ
ている（実開昭５８−１１３２４７号公報）。In addition, a pair of electrodes is formed on the insulating base, and a gold (Au) wire is wire-bonded between these electrodes. It is also known that the surface of the base is filled with resin and the gold wire is sealed therein (Japanese Utility Model Publication No. 58-113247).
（ハ）発明が解決しようとする問題点
上記従来のチップ型ヒユーズは、絶縁基台下面に凹部を
形成したり、電極間を金線でワイヤボンディングする加
工が必要であり、製造コストが上昇する不都合があった
。また、角形チップ抵抗器に比べて複雑な形状を有して
おり、自動実装に適していないという不都合があった。(c) Problems to be solved by the invention The conventional chip type fuse described above requires processing such as forming a recess on the bottom surface of the insulating base and wire bonding between the electrodes with gold wire, which increases manufacturing costs. There was an inconvenience. Furthermore, it has a more complicated shape than a rectangular chip resistor, making it unsuitable for automatic mounting.
この発明は、上記不都合に鑑みなされたもので、製造コ
ストが低く、かつ自動実装に適したチップ型ヒユーズを
提供することを目的としている。The present invention was made in view of the above-mentioned disadvantages, and an object of the present invention is to provide a chip-type fuse that has low manufacturing cost and is suitable for automatic mounting.
（ニ）問題点を解決するための手段ルび°作用上記問題
点を解決するための手段として、この発明のチップ型ヒ
ユーズは、直方体形状の絶縁基台と、この絶縁基台長手
方向両端部にそれぞれ形成される金属薄膜からなる１対
の電極と、前記絶縁基台上面に形成され、前記電極を電
気的に接続する金属薄膜からなる導電部と、前記絶縁基
台上面に設けられ、前記導電部を被覆する保護外装膜よ
り構成されるものである。(d) Means for Solving the Problems As a means for solving the above problems, the chip type fuse of the present invention includes a rectangular parallelepiped-shaped insulating base, and both ends of the insulating base in the longitudinal direction. a pair of electrodes made of a metal thin film formed on the top surface of the insulating base, a conductive part made of a metal thin film formed on the top surface of the insulating base and electrically connecting the electrodes; It consists of a protective outer film that covers the conductive part.
従って、絶縁基台の加工が容易であり、また、導電部の
形成もめっき又は印刷により容易に行うことができ、製
造コストを低減することができる。Therefore, the insulating base can be easily processed, and the conductive portion can also be easily formed by plating or printing, and manufacturing costs can be reduced.
一方、その形状を直方体とし、チップ抵抗器と同じ大き
さにできるため、自動実装が容易となる。On the other hand, since the shape is a rectangular parallelepiped and the size can be the same as that of a chip resistor, automatic mounting is facilitated.
（１ｒ、）実施例
〈実施例１〉
この発明の第１の実施例を、第１図及び第２図に基づい
て以下に説明する。(1r,) Example (Example 1) A first example of the present invention will be described below based on FIGS. 1 and 2.
第１図は、この発明の実施例に係るチップ型ヒユーズ１
の平面図、第２図は、同チップ型ヒユーズの第１図中■
−■線における断面図である。２は、セラミック基板（
絶縁基台）である。このセラミック基板２は、角形チッ
プ抵抗器等と同一の直方体形状とされ、その横方向長さ
！３．縦方向長さ１ｚは、それぞれ３．２１及び１ 、
６ｍｍとされる。FIG. 1 shows a chip type fuse 1 according to an embodiment of the present invention.
The top view of Figure 2 is the top view of the same chip type fuse in Figure 1.
It is a sectional view taken along the line -■. 2 is a ceramic substrate (
(insulated base). This ceramic substrate 2 has the same rectangular parallelepiped shape as a square chip resistor, etc., and its lateral length is ! 3. The longitudinal length 1z is 3.21 and 1, respectively.
It is said to be 6mm.
セラミック基板２の上面２ａには、導電部３が形成され
る。この導電部３は、上面２ａに形成される金属薄膜で
あり、めっき又は印刷により形成される。この金属薄膜
には、ｉｌｌ（Ａｇ）−パラジウム（Ｐｄ）合金、銀−
白金（Ｐｔ）合金、銀、銅、金等が使用できる。導電部
３の形状は、方形波状に屈曲する帯状であり、その両端
部３ａ、３ａがセラミック基板２の端部２ｂ、２ｂにそ
れぞれ達している。A conductive portion 3 is formed on the upper surface 2 a of the ceramic substrate 2 . This conductive part 3 is a metal thin film formed on the upper surface 2a, and is formed by plating or printing. This metal thin film includes ill (Ag)-palladium (Pd) alloy, silver-
Platinum (Pt) alloy, silver, copper, gold, etc. can be used. The shape of the conductive portion 3 is a band shape bent in a rectangular wave shape, and both ends 3a, 3a of the conductive portion 3 reach end portions 2b, 2b of the ceramic substrate 2, respectively.
セラミック基板両端部２ｂ、２ｂには、金属薄膜よりな
る電極４．４が形成される。この電極４は、めっき等、
周知の手段により形成され、前記導電部端部３ａに接続
される。Electrodes 4.4 made of a metal thin film are formed on both ends 2b, 2b of the ceramic substrate. This electrode 4 is plated, etc.
It is formed by well-known means and connected to the conductive portion end 3a.
セラミック基板上面２ａには、シリコン樹脂膜（保護外
装膜）５が形成される。このシリコン樹脂膜５は、導電
部３を完全に被覆する。A silicone resin film (protective exterior film) 5 is formed on the top surface 2a of the ceramic substrate. This silicone resin film 5 completely covers the conductive part 3.
このチップ型ヒユーズ１は、チップ抵抗器と同じ形状で
あり、その梱包状態をテーピング仕様とすれば、容易に
自動実装を行うことができ、印刷回路基板への実装コス
トが低減できる。This chip type fuse 1 has the same shape as a chip resistor, and if it is packaged with taping specifications, it can be easily and automatically mounted, and the cost of mounting it on a printed circuit board can be reduced.
チップ型ヒユーズ１に過電流が流れた場合には、導電部
３の適所が溶断し、回路が遮断される。この時、導電部
３をシリコン樹脂膜５で被覆しているため、溶断部で発
生する金属蒸気が外部へ飛散する危険がない。また、シ
リコン樹脂には消弧作用が認められ、溶断部で発生する
金属蒸気によるアークの連続が防止され、電子部品の保
護が完全に行える。また、導電部３は、セラミック基板
上面２ａに直接形成されており、放熱効果が大きく、小
型にもかかわらず大電流容量とすることができる。When an overcurrent flows through the chip type fuse 1, a suitable part of the conductive part 3 is fused and the circuit is interrupted. At this time, since the conductive part 3 is covered with the silicone resin film 5, there is no risk of metal vapor generated at the fusing part scattering to the outside. In addition, silicone resin has an arc-extinguishing effect, which prevents continuous arcing due to metal vapor generated at the fusing part, thereby completely protecting electronic components. Moreover, the conductive part 3 is formed directly on the top surface 2a of the ceramic substrate, has a large heat dissipation effect, and can have a large current capacity despite being small.
一方、このチップ型ヒユーズ１は、導電部として金線を
用いる従来のチップ型ヒユーズに比べ、断線のおそれが
なく、取扱いが容易であると共に、発熱による導電部の
熱応力に対しても強いものとすることができる。On the other hand, compared to conventional chip-type fuses that use gold wire as the conductive part, this chip-type fuse 1 has no risk of disconnection, is easy to handle, and is resistant to thermal stress in the conductive part due to heat generation. It can be done.
〈実施例２〉
この発明の第２の実施例を、第３図に基づいて以下に説
明する。<Example 2> A second example of the present invention will be described below based on FIG. 3.
この実施例に係るチップ型ヒユーズ１１のセラミック基
板（絶縁基台）１２は、第１の実施例と同様、３．２ｍ
ｓ＋Ｘ １．６ｍｍの大きさのものであり、長手方向両
端部１２ｂ、１２ｂには、それぞれ上下に延伸するサイ
ドスルーホール１２Ｇ、１２ｃが設けられている。The ceramic substrate (insulating base) 12 of the chip type fuse 11 according to this embodiment has a length of 3.2 m as in the first embodiment.
It has a size of s+X 1.6 mm, and side through holes 12G and 12c extending vertically are provided at both longitudinal ends 12b and 12b, respectively.
セラミック基板１２の上面１２ａには、導電部１３がめ
っき又は印刷により形成される。導電部１３は、先ど同
様、方形形状波に屈曲する帯状である。さらに、この導
電部１３には、信頼性を向上させるため、トリミング部
１３ｂ１・・・、１３ｂが設けられている。このトリミ
ング部１３ｂは、例えばレーザによりトリミングされる
が、その際、導電部１３の抵抗を測定し、適切な抵抗値
が得られるようにトリミング量を調整する。一方、導電
部１３の端部１３ａは、セラミック基板１２の端部１２
ｂに達している。A conductive portion 13 is formed on the upper surface 12a of the ceramic substrate 12 by plating or printing. The conductive portion 13 is in the shape of a band bent into a rectangular wave as before. Further, this conductive portion 13 is provided with trimming portions 13b1, . . . , 13b in order to improve reliability. The trimming portion 13b is trimmed using, for example, a laser. At that time, the resistance of the conductive portion 13 is measured and the amount of trimming is adjusted so that an appropriate resistance value is obtained. On the other hand, the end 13a of the conductive part 13 is connected to the end 12 of the ceramic substrate 12.
It has reached b.
セラミック基板両端部１２ｂ、１２ｂには、第１の実施
例と同様、金属薄膜よりなる電極１４．１４が形成され
る。この電極１４は、前記導電部端部１３ａと導通ずる
。Electrodes 14 and 14 made of metal thin films are formed on both ends 12b of the ceramic substrate, as in the first embodiment. This electrode 14 is electrically connected to the conductive portion end 13a.
セラミック基板上面１２ａには、シリコン樹脂膜（保護
外装膜）１５が形成される。このシリコン樹脂膜１５に
より、導電部１３が被覆される。A silicone resin film (protective exterior film) 15 is formed on the top surface 12a of the ceramic substrate. The conductive portion 13 is covered with this silicone resin film 15 .
このチップ型ヒユーズ１１においては、過電流が流れた
際に、導電部１３のトリミング部１３ｂ、・・・、１３
ｂの何れかにおいて、優先的に溶断が生じる。このため
、過電流を確実に遮断でき、チップ型ヒユーズ１１の信
頼性が向上される。その他の点については、第１の実施
例と同様である。In this chip type fuse 11, when an overcurrent flows, the trimming portions 13b, . . . , 13 of the conductive portion 13
Fusing occurs preferentially in any one of b. Therefore, overcurrent can be cut off reliably, and the reliability of the chip type fuse 11 is improved. Other points are similar to the first embodiment.
なお、上記第１及び第２の実施例においては、導電部の
形状として方形波状に屈曲する帯状のものを示している
が、これに限定され名ものではなく、適宜変更可能であ
る。In the first and second embodiments, the shape of the conductive portion is shown as a band shaped like a rectangular wave, but the shape is not limited to this and can be changed as appropriate.
（へ）発明の詳細
な説明したように、この発明のチップ型ヒユーズは、製
造が容易で、そのコストが低減できる利点を有すると共
に、チップ抵抗器と同じ直方体形状であり、自動実装が
容易に行える利点を有している。(f) As described in detail, the chip type fuse of this invention has the advantage of being easy to manufacture and reducing its cost, and has the same rectangular parallelepiped shape as a chip resistor, making automatic mounting easy. It has the advantage of being able to
また、実施例に示すように、保護外装膜をシリコン樹脂
とすれば、シリコン樹脂の消弧剤としての作用により、
導電部溶断時に発生する、金属蒸気によるアークの連続
が防止され、電子部品を確実に保護できる利点をも有し
ている。In addition, as shown in the example, if the protective exterior film is made of silicone resin, the action of the silicone resin as an arc extinguisher will cause
It also has the advantage of preventing a continuous arc caused by metal vapor that occurs when a conductive part melts, and that electronic components can be reliably protected.
第１図は、この発明の第１の実施例に係るチップ型ヒユ
ーズの平面図、第２図は、同チップ型ヒユーズの第１図
中■−■線における断面図、第３図は、この発明の第２
の実施例に係るチップ型ヒユーズの平面図である。
２・１２：セラミック基板、
３・１３：導電部、
４・４・１４・１４：電極、
５・１５：シリコン樹脂膜。1 is a plan view of a chip-type fuse according to a first embodiment of the present invention, FIG. 2 is a sectional view of the same chip-type fuse taken along the line ■-■ in FIG. 1, and FIG. Second invention
FIG. 3 is a plan view of a chip-type fuse according to an embodiment of the present invention. 2.12: Ceramic substrate, 3.13: Conductive part, 4.4.14.14: Electrode, 5.15: Silicone resin film.
Claims (2)
両端部にそれぞれ形成される金属薄膜からなる１対の電
極と、前記絶縁基台上面に形成され、前記電極を電気的
に接続する金属薄膜からなる導電部と、前記絶縁基台上
面に設けられ、前記導電部を被覆する保護外装膜とより
なるチップ型ヒューズ。(1) A rectangular parallelepiped-shaped insulating base, a pair of electrodes made of a thin metal film formed on both ends of the insulating base in the longitudinal direction, and electrically connecting the electrodes formed on the top surface of the insulating base. A chip type fuse comprising a conductive part made of a thin metal film, and a protective outer film provided on the upper surface of the insulating base and covering the conductive part.
求の範囲第１項記載のチップ型ヒューズ。(2) The chip type fuse according to claim 1, wherein the protective exterior film is a silicone resin film.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61287081A JPH0831303B2 (en) | 1986-12-01 | 1986-12-01 | Chip type fuse |
| AT87117577T ATE89435T1 (en) | 1986-12-01 | 1987-11-27 | CHIP SECURITY. |
| ES198787117577T ES2046194T3 (en) | 1986-12-01 | 1987-11-27 | CHIP TYPE FUSE. |
| EP87117577A EP0270954B1 (en) | 1986-12-01 | 1987-11-27 | Chip-type fuse |
| DE8787117577T DE3785835T2 (en) | 1986-12-01 | 1987-11-27 | CHIP FUSE. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61287081A JPH0831303B2 (en) | 1986-12-01 | 1986-12-01 | Chip type fuse |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63141233A true JPS63141233A (en) | 1988-06-13 |
| JPH0831303B2 JPH0831303B2 (en) | 1996-03-27 |
Family
ID=17712806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61287081A Expired - Lifetime JPH0831303B2 (en) | 1986-12-01 | 1986-12-01 | Chip type fuse |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0270954B1 (en) |
| JP (1) | JPH0831303B2 (en) |
| AT (1) | ATE89435T1 (en) |
| DE (1) | DE3785835T2 (en) |
| ES (1) | ES2046194T3 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0433230A (en) * | 1990-05-29 | 1992-02-04 | Mitsubishi Materials Corp | Chip type fuse |
| JPH0620806A (en) * | 1992-03-21 | 1994-01-28 | Rohm Co Ltd | Solid fuse |
| US5929741A (en) * | 1994-11-30 | 1999-07-27 | Hitachi Chemical Company, Ltd. | Current protector |
| JP2007073624A (en) * | 2005-09-05 | 2007-03-22 | Nec Electronics Corp | Semiconductor device |
| JP2009218275A (en) * | 2008-03-07 | 2009-09-24 | Mitsubishi Electric Corp | Semiconductor device, and inverter system having the semiconductor device |
| JP2012080079A (en) * | 2010-09-06 | 2012-04-19 | Murata Mfg Co Ltd | Electronic component |
| JP2015005774A (en) * | 2010-09-06 | 2015-01-08 | 株式会社村田製作所 | Electronic component |
| KR20150073957A (en) | 2012-09-28 | 2015-07-01 | 가마야 덴끼 가부시끼가이샤 | Chip fuse and manufacturing method therefor |
Families Citing this family (54)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH675034A5 (en) * | 1987-11-03 | 1990-08-15 | Schurter Ag | |
| JPH0541486Y2 (en) * | 1990-05-10 | 1993-10-20 | ||
| GB2255455A (en) * | 1991-04-22 | 1992-11-04 | Electronic Components Ltd | Fuse |
| US5166656A (en) * | 1992-02-28 | 1992-11-24 | Avx Corporation | Thin film surface mount fuses |
| JPH0636672A (en) * | 1992-07-16 | 1994-02-10 | Sumitomo Wiring Syst Ltd | Card type fuse and manufacture thereof |
| DE4223621C1 (en) * | 1992-07-17 | 1993-10-21 | Siemens Ag | HF fuse for HF current circuit e.g. in NMR tomography - has fuse conductor and end terminals of different cross-section provided by printed circuit |
| SE505448C2 (en) * | 1993-05-28 | 1997-09-01 | Ericsson Telefon Ab L M | Procedure for manufacturing a circuit board fuse and circuit board fuse |
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| JPS51147238U (en) * | 1975-05-21 | 1976-11-26 | ||
| JPS60143544A (en) * | 1983-12-29 | 1985-07-29 | 松下電器産業株式会社 | Chip-shaped fuse |
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| FR901549A (en) * | 1943-01-28 | 1945-07-30 | Philips Nv | Cut-out cartridge |
| SE341746B (en) * | 1970-03-10 | 1972-09-18 | Ericsson Telefon Ab L M | |
| US3887893A (en) * | 1973-09-24 | 1975-06-03 | Allen Bradley Co | Fusible resistor |
| US4139832A (en) * | 1976-03-19 | 1979-02-13 | Hitachi, Ltd. | Glass-coated thick film resistor |
| DE2845540C2 (en) * | 1978-10-19 | 1982-01-28 | Draloric Electronic GmbH, 8500 Nürnberg | Non-flammable coating agent and its use |
| US4296398A (en) * | 1978-12-18 | 1981-10-20 | Mcgalliard James D | Printed circuit fuse assembly |
| JPS6011538Y2 (en) * | 1982-12-01 | 1985-04-17 | 三王株式会社 | Chip type fuse |
-
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- 1986-12-01 JP JP61287081A patent/JPH0831303B2/en not_active Expired - Lifetime
-
1987
- 1987-11-27 ES ES198787117577T patent/ES2046194T3/en not_active Expired - Lifetime
- 1987-11-27 DE DE8787117577T patent/DE3785835T2/en not_active Expired - Fee Related
- 1987-11-27 AT AT87117577T patent/ATE89435T1/en not_active IP Right Cessation
- 1987-11-27 EP EP87117577A patent/EP0270954B1/en not_active Expired - Lifetime
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51147238U (en) * | 1975-05-21 | 1976-11-26 | ||
| JPS60143544A (en) * | 1983-12-29 | 1985-07-29 | 松下電器産業株式会社 | Chip-shaped fuse |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0433230A (en) * | 1990-05-29 | 1992-02-04 | Mitsubishi Materials Corp | Chip type fuse |
| JPH0620806A (en) * | 1992-03-21 | 1994-01-28 | Rohm Co Ltd | Solid fuse |
| US5929741A (en) * | 1994-11-30 | 1999-07-27 | Hitachi Chemical Company, Ltd. | Current protector |
| JP2007073624A (en) * | 2005-09-05 | 2007-03-22 | Nec Electronics Corp | Semiconductor device |
| JP2009218275A (en) * | 2008-03-07 | 2009-09-24 | Mitsubishi Electric Corp | Semiconductor device, and inverter system having the semiconductor device |
| JP2012080079A (en) * | 2010-09-06 | 2012-04-19 | Murata Mfg Co Ltd | Electronic component |
| JP2015005774A (en) * | 2010-09-06 | 2015-01-08 | 株式会社村田製作所 | Electronic component |
| KR20150073957A (en) | 2012-09-28 | 2015-07-01 | 가마야 덴끼 가부시끼가이샤 | Chip fuse and manufacturing method therefor |
| US9852868B2 (en) | 2012-09-28 | 2017-12-26 | Kamaya Electric Co., Ltd. | Chip fuse and manufacturing method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0270954A1 (en) | 1988-06-15 |
| JPH0831303B2 (en) | 1996-03-27 |
| DE3785835T2 (en) | 1993-08-19 |
| ATE89435T1 (en) | 1993-05-15 |
| EP0270954B1 (en) | 1993-05-12 |
| DE3785835D1 (en) | 1993-06-17 |
| ES2046194T3 (en) | 1994-02-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |