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JPS63123465A - Photosensitive resin application and its apparatus - Google Patents

Photosensitive resin application and its apparatus

Info

Publication number
JPS63123465A
JPS63123465A JP26854786A JP26854786A JPS63123465A JP S63123465 A JPS63123465 A JP S63123465A JP 26854786 A JP26854786 A JP 26854786A JP 26854786 A JP26854786 A JP 26854786A JP S63123465 A JPS63123465 A JP S63123465A
Authority
JP
Japan
Prior art keywords
photosensitive resin
wafer
viscosity
frequency
periphery
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26854786A
Other languages
Japanese (ja)
Inventor
Ryuichi Funatsu
隆一 船津
Yukio Kenbo
行雄 見坊
Minoru Ikeda
稔 池田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP26854786A priority Critical patent/JPS63123465A/en
Publication of JPS63123465A publication Critical patent/JPS63123465A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/162Coating on a rotating support, e.g. using a whirler or a spinner

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To make the thickness of a resin coat on a sheet uniform by applying a photosensitive resin to the periphery by means of a centrifugal force generated by the rotation of a sheet and controlling resin viscosity through application of ultrasound. CONSTITUTION:A wafer 1 fixed through suction to the surface of a chuck 2 is permitted to rotate by a drive mechanism 4 as indicated by an arrow, and at the same time different frequencies preset by means of a frequency control circuit 6 are applied to the wafer 1 from three piezos 7a-7c of a high frequency supply mechanism 5. When a resist is permitted to drop the center of the wafer 1 from a nozzle 3 under this state, the resist is applied in a radial direction to the periphery on the plane of the wafer by means of a centrifugal force generated by the rotation of the wafer 1. The viscosity of the resin is in inverse proportion to the frequency level. Therefore, the viscosity of photosensitive resin is increased by lowering the level of a frequency applied to each piezo 7a-7c in such a manner that the lowering rate is increased proportionately to the periphery. Thus the viscosity of photosensitive resin on the periphery is increased and the coat thickness made uniform.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、半導体ウェハなどの薄板体の平面上に感光性
樹脂などの高分子膜を成膜する感光性樹脂塗布装置に係
り、とくに薄板体の平面上全面にレジスト膜厚を均一に
して光ステッパのアライメント検出精度および転写パタ
ーン幅の精度向上に好適な感光性樹脂塗布方法およびそ
の装置に関する。
Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a photosensitive resin coating device for forming a polymer film such as a photosensitive resin on the flat surface of a thin plate body such as a semiconductor wafer, and particularly relates to The present invention relates to a photosensitive resin coating method and apparatus suitable for improving alignment detection accuracy of an optical stepper and transfer pattern width accuracy by uniformizing the resist film thickness over the entire plane surface of the body.

〔従来の技術〕[Conventional technology]

従来の感光性樹脂塗布装置はたとえば特開昭60−13
0830号に記載されている如く1回転可能なスピンナ
ー保持板と、このスピンナー保持板の所定半径の円周の
一部分に回転可能に保持され、各上面に中心部が一致す
るように半導体ウェハを吸着する4複数個のスピンナー
とを設け、前記スピンナー保持板を回転させて各半導体
ウェハ上の中心部にレジスト剤を滴下したのち、複数個
のスピンナ−を回転させながらスピンナー保持板を回転
させてこれらの回転による遠心力によってレジスト剤を
半導体ウェハ上に均一な膜厚にて成膜させるように構成
したものが提案されている。
A conventional photosensitive resin coating device is, for example, disclosed in Japanese Patent Application Laid-open No. 1986-13.
As described in No. 0830, a spinner holding plate that can rotate once is rotatably held on a part of the circumference of the spinner holding plate with a predetermined radius, and a semiconductor wafer is sucked so that the center coincides with each upper surface. 4. A plurality of spinners are provided, and the spinner holding plate is rotated to drop the resist agent onto the center of each semiconductor wafer, and then the spinner holding plate is rotated while the plurality of spinners are rotated. A structure has been proposed in which a resist agent is formed into a uniform film thickness on a semiconductor wafer by centrifugal force caused by the rotation of the resist agent.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

前記の従来技術は回転する半導体のウェハの遠心力が回
転中心からの半径によって異なるという点について配慮
がなされておらないため遠心力の大きなウェハ外周部に
おける感光性樹脂の膜厚が薄くなって均一化できないと
いう問題があった。
The above-mentioned conventional technology does not take into account the fact that the centrifugal force of a rotating semiconductor wafer varies depending on the radius from the center of rotation, so the film thickness of the photosensitive resin becomes thinner and more uniform around the wafer's outer periphery where the centrifugal force is greater. There was a problem that it could not be converted into

本発明の目的は、スピンナーによる感光性樹脂のウェハ
面内の塗布膜厚を均一化可能とする感光性樹脂塗布方法
およびその装置を提供することにある。
SUMMARY OF THE INVENTION An object of the present invention is to provide a photosensitive resin coating method and an apparatus therefor, which make it possible to uniformize the thickness of a photosensitive resin coated on a wafer using a spinner.

〔問題点を解決するための手段〕[Means for solving problems]

前記の目的は、感光性樹脂塗布方法において、回転する
保持機構に固定保持された薄板体の平面上に感光性樹脂
を滴下し、該薄板体の回転による遠心力によって前記感
光性樹脂を該薄板体の平面上の外周部に向って半径方向
に塗布するとともに、該薄板体に超音波を印加して前記
感光性樹脂の粘性を制御することによって達成される。
The above purpose is to apply a photosensitive resin by dropping a photosensitive resin onto the flat surface of a thin plate body fixedly held by a rotating holding mechanism, and applying centrifugal force caused by the rotation of the thin plate body to transfer the photosensitive resin to the thin plate. This is achieved by applying the photosensitive resin in a radial direction toward the outer periphery on a plane of the body and applying ultrasonic waves to the thin plate to control the viscosity of the photosensitive resin.

また感光性樹脂塗布装置において、薄板体を上方に固定
保持する保持機構と、該薄板体の平面上に感光性樹脂を
供給する供給機構と、該薄板体の平面内で前記保持機構
を回転させる駆動機構と、該薄板体に超音波を印加して
前記感光性樹脂の粘性を制御する超音波供給機構とを設
置することによって達成される。
Further, in the photosensitive resin coating device, the holding mechanism fixedly holds the thin plate upward, the supply mechanism supplies the photosensitive resin onto the plane of the thin plate, and the holding mechanism rotates within the plane of the thin plate. This is achieved by installing a drive mechanism and an ultrasonic supply mechanism that applies ultrasonic waves to the thin plate body to control the viscosity of the photosensitive resin.

〔作用〕[Effect]

超音波においては高分子材料である感光性樹脂に印加す
ると、感光性樹脂の粘度が低下するが、その周波数の高
低に反比例、すなわち超音波の周波数が高くなるのに伴
なって感光性樹脂の粘度が低下する現象がある。
When ultrasonic waves are applied to a photosensitive resin, which is a polymeric material, the viscosity of the photosensitive resin decreases, but the viscosity of the photosensitive resin decreases in inverse proportion to the frequency of the ultrasonic wave. There is a phenomenon in which the viscosity decreases.

本発明はこの現象を利用したものである。すなわち、薄
板体の回転による遠心力によって該薄板体の平面上に外
周部に向って感光性樹脂を塗布するさい、該薄板体にそ
の中心部から外周部に行くのに伴なって周波数が低下す
るようにあらかじめ設定した超音波を印加して該薄板体
の平面上の前記感光性樹脂の粘性を該薄板体の中心部よ
り外周部に行くのに伴なって高くなるように制御したの
で、該薄板体の平面上に均一な膜厚にて感光性樹脂を塗
布することができる。
The present invention utilizes this phenomenon. That is, when the photosensitive resin is applied onto the flat surface of the thin plate toward the outer periphery due to the centrifugal force caused by the rotation of the thin plate, the frequency decreases as it goes from the center to the outer periphery of the thin plate. The viscosity of the photosensitive resin on the flat surface of the thin plate body was controlled to increase as the viscosity of the photosensitive resin on the plane of the thin plate body increases from the center to the outer periphery of the thin plate body by applying a preset ultrasonic wave so as to The photosensitive resin can be coated with a uniform thickness on the flat surface of the thin plate.

〔実施例〕〔Example〕

以下1本発明の実施例を示す図面について説明する。 The drawings showing one embodiment of the present invention will be described below.

図面において、2は保持機構であるチャックにして、上
面には、薄板体であるウェハ1を図示しない真空吸着機
構により吸着固定し、下方位置に該チャック2が矢印方
向に回転するように駆動機構4に接続している。3は感
光性樹脂供給機構であるノズルにして前記ウェハ1の平
面上中心部に向って感光性樹脂であるレジスト(図示せ
ず)を滴下する如くしている。5は高周波供給機構にし
て周波数制御回路6と前記ウェハ1の略中心部から半径
方向に向って配置された複数(図では3個)のピエゾ7
a、7b、7cとから形成され1周波数制御回路6から
外方のピエゾ7cにて最も高く内方のピエゾ7aにて最
も低くなるようにあらかじめ設定された異なる周波数の
高周波を前記ウェハ1に供給する如くしている。
In the drawing, reference numeral 2 denotes a chuck which is a holding mechanism, and a thin plate wafer 1 is suctioned and fixed on the upper surface by a vacuum suction mechanism (not shown), and a drive mechanism is installed at the lower position so that the chuck 2 rotates in the direction of the arrow. Connected to 4. Reference numeral 3 denotes a nozzle which is a photosensitive resin supply mechanism and is configured to drop resist (not shown), which is a photosensitive resin, toward the center of the wafer 1 on a plane. Reference numeral 5 denotes a high frequency supply mechanism including a frequency control circuit 6 and a plurality of (three in the figure) piezos 7 arranged radially from the approximate center of the wafer 1.
a, 7b, and 7c, and supplies high frequencies of different frequencies to the wafer 1 from the frequency control circuit 6, which is set in advance so that the outer piezo 7c is the highest and the inner piezo 7a is the lowest. I'm doing it like I'm doing it.

本発明による感光性樹脂装置は前記の如く構成されてい
るから1次にその動作について説明する。
Since the photosensitive resin device according to the present invention is constructed as described above, its operation will be explained first.

チャック2上に吸着固定されたウェハ1を駆動機n4に
より矢印方向に回転し、同時に高周波供給機構5の3個
のピエゾ7a、7b、7cからウェハ1に向ってあらか
じめ周波数制御回路6にて設定された異なる周波数を印
加した状態でノズル3からウェハ1の中心部付近に向っ
てレジストを滴下すると、レジストはウェハ1の回転に
よる遠心力によってウェハ1の平面上を外周部に向って
半径方向に塗布される。また3個のピエゾ8a、 8b
The wafer 1 suctioned and fixed on the chuck 2 is rotated in the direction of the arrow by the driver n4, and at the same time, the three piezos 7a, 7b, 7c of the high frequency supply mechanism 5 are set in advance in the frequency control circuit 6 toward the wafer 1. When the resist is dropped from the nozzle 3 toward the center of the wafer 1 while applying different frequencies, the resist is radially moved on the plane of the wafer 1 toward the outer periphery due to the centrifugal force caused by the rotation of the wafer 1. applied. Also 3 piezos 8a, 8b
.

8cからウェハ1に印加する異なる周波数によりレジス
ト1の粘度が調整される。すなわち、内方のピエゾ8a
からの周波数は最も低いので、レジスト1の粘度の変化
は少いが、外方のピエゾ8cからの周波数は最も高いの
で、ウェハ1の外周部付近に達したレジスト1の粘度は
低下する。
The viscosity of the resist 1 is adjusted by different frequencies applied to the wafer 1 from 8c. That is, the inner piezo 8a
Since the frequency from the outer piezo 8c is the lowest, there is little change in the viscosity of the resist 1, but since the frequency from the outer piezo 8c is the highest, the viscosity of the resist 1 that has reached the vicinity of the outer periphery of the wafer 1 decreases.

したがってウェハ1の平面上の外周部のレジスト1の粘
度を高く設定できるので、ウェハ1の平面上にレジスト
1を均一な膜厚で塗布することができる。
Therefore, the viscosity of the resist 1 at the outer peripheral portion on the plane of the wafer 1 can be set high, so that the resist 1 can be coated on the plane of the wafer 1 with a uniform thickness.

なお、前記実施例においては高周波供給機構に3個のピ
エゾを設定した場合を示しているが、これに限定される
ものでなく、1個のピエゾ素子をウェハの半径方向に移
動させ、かつウェハの半径に応じてピエゾ素子からの高
周波の周波数を変化させることも可能である。
Although the above embodiment shows a case where three piezo elements are set in the high frequency supply mechanism, the present invention is not limited to this, and one piezo element is moved in the radial direction of the wafer, and the wafer It is also possible to change the frequency of the high frequency wave from the piezo element depending on the radius of the piezo element.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、薄板体の回転による遠心力によって該
薄板体の平面上の外周部に向って感光性樹脂を塗布する
とともに該薄板体に超音波を印加して感光性樹脂の粘度
を制御し、これによって該薄板体の平面上に感光性樹脂
を均一な膜厚にて塗布することができるので、光ステッ
パのアライメント検出精度、転写パターン幅の精度を向
上することができる。
According to the present invention, the photosensitive resin is applied toward the outer periphery of the flat surface of the thin plate by centrifugal force due to rotation of the thin plate, and ultrasonic waves are applied to the thin plate to control the viscosity of the photosensitive resin. However, since the photosensitive resin can be coated with a uniform thickness on the flat surface of the thin plate, the alignment detection accuracy of the optical stepper and the accuracy of the transfer pattern width can be improved.

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本発明の実施例を示す感光性樹脂塗布装置の説明
図である。 1・・・ウェハ、2・・・チャック、3・・・ノズル、
4・・・駆動機構、旦・・・高周波供給機構、6・・・
周波数制御回路、7a、7b、7cmピエゾ。 代理人弁理士  秋  本  正  実図面の浄書ぐ内
容に変更なし) 補正図面 ヤ(I’fl 旦 1:ウェハ  2:4−ンック 3:)大ル  4:耳
Fh獄溝旦浦Mメ寄髪剰Uス才λ  6:層ト皮叡第1
1路・ 7:ぴエソ1手続補正書防式) 1、事件の表示 昭和61年特許願第268547号 2、発明の名称 感光性樹脂塗布方法およびその装置 3、補正をする者 事件との関係 特許出願人 住所(居所)  東京都千代田区神田駿河台四丁目6番
地氏名(名称)   (510)株式会社 日立製作所
4、代理人 住所  東京都港区西新橋1丁目6番14号 相馬西新
橋ビル昭和62年1月27日 (1)明細書第5頁第7行「図面」を「第1図」に補正
する。
The drawing is an explanatory diagram of a photosensitive resin coating apparatus showing an embodiment of the present invention. 1... Wafer, 2... Chuck, 3... Nozzle,
4... Drive mechanism, Dan... High frequency supply mechanism, 6...
Frequency control circuit, 7a, 7b, 7cm piezo. Representative Patent Attorney Tadashi Akimoto No changes to the content of the engraving of the actual drawings) Amended drawings (I'fl Dan 1: Wafer 2: 4-Nook 3:) Large Ru 4: Ear Fh Jigokuzo Danura M Me hairy Surplus talent λ 6: layer to skin 1st
1. Road 7: PIESO 1 Procedural Amendment Form) 1. Indication of the case 1985 Patent Application No. 268547 2. Name of the invention Photosensitive resin coating method and apparatus 3. Person making the amendment Relationship with the case Patent applicant address (residence) 4-6 Kanda Surugadai, Chiyoda-ku, Tokyo Name (510) Hitachi, Ltd. 4, Agent address Soma Nishi-Shinbashi Building Showa, 1-6-14 Nishi-Shinbashi, Minato-ku, Tokyo January 27, 1962 (1) "Drawings" on page 5, line 7 of the specification is amended to "Figure 1."

Claims (1)

【特許請求の範囲】 1、回転する板体に感光性樹脂を塗布し、超音波を印加
して前記感光性樹脂の膜厚を均一にすることを特徴とす
る感光性樹脂塗布方法。 2、印加される超音波の周波数を板体の中心部から外周
部に向って低下させることを特徴とする特許請求の範囲
第1項記載の感光性樹脂塗布方法。 3、板体を固定保持する保持機構と、該板体の平面上に
感光性樹脂を供給する供給機構と、該板体の平面内で前
記保持機構を回転させる駆動機構と、該板体に超音波を
印加して超音波印加手段とを有し、該板体の平面上に成
膜される感光性樹脂の膜厚を均一にするように構成した
ことを特徴とする感光性樹脂塗布装置。 4、前記超音波印加手段は、印加する周波数を板体の中
心部から外周部に向って低下させるように構成したこと
を特徴とする特許請求の範囲第3項記載の感光性樹脂塗
布装置。
[Scope of Claims] 1. A photosensitive resin coating method, which comprises coating a rotating plate with a photosensitive resin and applying ultrasonic waves to make the film thickness of the photosensitive resin uniform. 2. The photosensitive resin coating method according to claim 1, wherein the frequency of the applied ultrasonic waves is lowered from the center of the plate toward the outer periphery. 3. A holding mechanism that holds the plate fixedly; a supply mechanism that supplies photosensitive resin onto the plane of the plate; a drive mechanism that rotates the holding mechanism within the plane of the plate; 1. A photosensitive resin coating device, comprising an ultrasonic wave applying means for applying ultrasonic waves, and configured to make the film thickness of the photosensitive resin formed on the flat surface of the plate uniform. . 4. The photosensitive resin coating apparatus according to claim 3, wherein the ultrasonic wave applying means is configured to reduce the applied frequency from the center of the plate toward the outer periphery.
JP26854786A 1986-11-13 1986-11-13 Photosensitive resin application and its apparatus Pending JPS63123465A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26854786A JPS63123465A (en) 1986-11-13 1986-11-13 Photosensitive resin application and its apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26854786A JPS63123465A (en) 1986-11-13 1986-11-13 Photosensitive resin application and its apparatus

Publications (1)

Publication Number Publication Date
JPS63123465A true JPS63123465A (en) 1988-05-27

Family

ID=17460046

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26854786A Pending JPS63123465A (en) 1986-11-13 1986-11-13 Photosensitive resin application and its apparatus

Country Status (1)

Country Link
JP (1) JPS63123465A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002233807A (en) * 2001-02-06 2002-08-20 Tokyo Electron Ltd Coating method and coating apparatus
JP2006256622A (en) * 2005-03-15 2006-09-28 Kao Corp Container with hinged lid
KR100980122B1 (en) * 2002-09-20 2010-09-03 도쿄엘렉트론가부시키가이샤 Substrate processingapparatus, substrate processing method, coating method and coating apparatus
JP2012061403A (en) * 2010-09-15 2012-03-29 Toshiba Corp Film forming apparatus, film forming method, and electronic device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002233807A (en) * 2001-02-06 2002-08-20 Tokyo Electron Ltd Coating method and coating apparatus
JP4508436B2 (en) * 2001-02-06 2010-07-21 東京エレクトロン株式会社 Coating method and coating apparatus
KR100980122B1 (en) * 2002-09-20 2010-09-03 도쿄엘렉트론가부시키가이샤 Substrate processingapparatus, substrate processing method, coating method and coating apparatus
JP2006256622A (en) * 2005-03-15 2006-09-28 Kao Corp Container with hinged lid
JP2012061403A (en) * 2010-09-15 2012-03-29 Toshiba Corp Film forming apparatus, film forming method, and electronic device
US8677933B2 (en) 2010-09-15 2014-03-25 Kabushiki Kaisha Toshiba Film forming apparatus forming a coating film using spiral coating while adjusting sound wave projected onto the coating film

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