JPS62133774A - Photosensor - Google Patents
PhotosensorInfo
- Publication number
- JPS62133774A JPS62133774A JP60273753A JP27375385A JPS62133774A JP S62133774 A JPS62133774 A JP S62133774A JP 60273753 A JP60273753 A JP 60273753A JP 27375385 A JP27375385 A JP 27375385A JP S62133774 A JPS62133774 A JP S62133774A
- Authority
- JP
- Japan
- Prior art keywords
- light
- holder
- lead frame
- photosensor
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Geophysics And Detection Of Objects (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Optical Radar Systems And Details Thereof (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、発光素子と受光素子とを用い、光により物体
を検知するフォトセンサに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a photosensor that uses a light emitting element and a light receiving element to detect an object using light.
光スィッチ等として用いられるフォトセンサは、通常、
透過型と反射型の２種類に大別される。Photo sensors used as optical switches etc. are usually
There are two types: transmissive type and reflective type.
従来の透過型のフォトセンサは、第６図に示すように、
一方のリードフレームｌに設けられた発光素子２を被覆
する発光ホルダ３と、他方のリードフレーム１に設けら
れた受光素子４を被覆する受光ホルダ５とが、上記の発
光素子２と受光素子４とが対向配置となるように設置さ
れている。上記の発光ホルダ３及び受光ホルダ５は、ホ
ルダケース６内に数置され、接着剤部７あるいは裏蓋８
にて固定されている。The conventional transmission type photosensor, as shown in Figure 6,
A light emitting holder 3 covering the light emitting element 2 provided on one lead frame l and a light receiving holder 5 covering the light receiving element 4 provided on the other lead frame 1 are connected to the light emitting element 2 and the light receiving element 4. are installed so that they are facing each other. The above-mentioned light emitting holder 3 and light receiving holder 5 are placed in a holder case 6, and the adhesive part 7 or the back cover 8
It is fixed at .
一方、従来の反射型フォトセンサは、第７図及び第８図
に示すように、発光ホルダ３と受光ホルダ５とが、発光
素子２から発せられた光の反射光が受光素子４にて受光
されるように、非対向配置に設定されている。On the other hand, in the conventional reflective photosensor, as shown in FIGS. 7 and 8, a light emitting holder 3 and a light receiving holder 5 are arranged so that the reflected light emitted from the light emitting element 2 is received by the light receiving element 4. They are set in a non-opposed arrangement so that
ところが、これら従来のフォトセンサは、発光ホルダ３
と受光ホルダ５とは別部材にて個々に形成され、その後
ホルダケース６内に設置し、これを別工程で固定すると
いった長い製造プロセスが要求される。また、上記のよ
うに両ホルダ３・５を位置設定するためのホルダケース
６も必要となる。そのため、コスト高を招くといった問
題を存していた。However, in these conventional photosensors, the light emitting holder 3
A long manufacturing process is required in which the light-receiving holder 5 and the light-receiving holder 5 are individually formed as separate members, and then installed in the holder case 6 and fixed in a separate process. Further, the holder case 6 for positioning both the holders 3 and 5 as described above is also required. Therefore, there was a problem of high cost.
もっとも、第８図（ａ）〜（Ｃ）に示した二重モールド
型のフォトセンサについては、遮光性モールド樹脂９に
て発光ホルダ３及び受光ボルダ５が保持されているため
、前記ホルダケース６は不要である。しかし、１回目の
樹脂成型工程と、この樹脂成型の際に生じる鋳ぼり部１
０を除去するぼり取り工程と、その後の遮光性モールド
樹脂９を外装モールドする２回目の樹脂成型工程とが必
要となる。また、上記のように計２回の＃Ｍ脂成型工程
が必要となるため、高指向性の長距離焦点機能を備える
ためのレンズを、発光素子２及び受光素子４の前方の窓
部に設けることが出来ないという欠点がある。However, in the double-molded photosensor shown in FIGS. 8(a) to 8(C), since the light-emitting holder 3 and the light-receiving boulder 5 are held by the light-shielding molded resin 9, the holder case 6 is not necessary. However, during the first resin molding process and the casting part 1 that occurs during this resin molding,
A scraping step for removing 0 and a subsequent second resin molding step for externally molding the light-shielding mold resin 9 are required. In addition, since a total of two #M resin molding steps are required as described above, a lens for providing a highly directional long-range focusing function is provided in the window in front of the light emitting element 2 and the light receiving element 4. The disadvantage is that it cannot be done.
本発明は、上記従来の問題点を考慮してなされたもので
あって、短い製造プロセスにて製造することができ、か
つ透過型と反射型のいずれのタイプにも適用することの
できる低コストのフォトセンサの提供を目的とするもの
である。The present invention has been made in consideration of the above-mentioned conventional problems, and is low cost and can be manufactured in a short manufacturing process and can be applied to both transmission type and reflection type. The purpose of this invention is to provide a photosensor for
本発明のフォトセンサは、主リードフレームとこれから
分岐した分岐リードフレームを有し、上記主リードフレ
ームの両端部に断面凹型の素子設置部を形成して、いず
れか一方の素子設置部に発光素子を、他方の素子設置部
に受光素子をそれぞれ設置するとともに、上記発光素子
と受光素子を各々別の副リードフレームと接続し、この
接続部を含む素子の全周部を、透光性を有する樹脂成形
体にて被覆して、発光ホルダと受光ホルダ七を形成する
ことにより、反射型と透過型のいずれのフォトセンサに
も適用できるように構成したことを特徴とするものであ
る。The photosensor of the present invention has a main lead frame and a branch lead frame branched from the main lead frame, and element installation portions having a concave cross section are formed at both ends of the main lead frame, and a light emitting element is mounted in either of the element installation portions. A light-receiving element is installed in the other element installation part, and the light-emitting element and the light-receiving element are each connected to a separate sub-lead frame, and the entire circumference of the element including this connection part has a light-transmitting property. The light emitting holder and the light receiving holder 7 are formed by coating with a resin molded body, so that it can be applied to either a reflective type or a transmissive type photosensor.
〔実施例１〕
本発明の一実施例を第１図及び第２図に基づいて説明す
れば、以下の通りである。[Example 1] An example of the present invention will be described below based on FIGS. 1 and 2.
本実施例は、反射型のフォトセンサに適用したものであ
る。第１図（ａ）（ｂ）に示すように、反射型のフォト
センサ２１には、横向きの平板状をなす主リードフレー
ム１１と、これに直交する縦向きの平板状をなす分岐リ
ードフレーム１２とが一体に形成され、これによりＴ字
型のリードフレーム１３が形成されている。上記主リー
ドフレーム１１の両端部には、断面凹型の素子設置部１
４・工４がそれぞれ形成されている。このいずれか一方
の素子設置部１４の底部１４ａ上には発光ダイオードチ
ップから成る発光素子１５がグイボンディングにより固
定されている。また、他方の素子設置部１４の底部１４
． ａ上には、受光用フォトトランジスタから成る受光
素子１６がグイボンディングにより固定されている。発
光素子１５と受光素子１６とは、上記の両底部１４ａ・
１４ａ上における設置によって、共に同じ前方向への指
向性が与えられるように位置設定されている。更に、こ
の発光素子１５と受光素子１６は、各々別の副リードフ
レーム１７・１７と、金ｖＡ１８・１ｒＩ＋’１
８にてそれぞれワイヤボンディングにより接続されてい
る。この接続部分を含めて、発光素子１５の全周部は、
透明又は透光性を有する樹脂成形体にて被覆され、これ
によって発光ホルダ１９が形成されている。また、受光
素子１６の全周部についても前記接続部分を含めて、透
明又は透光性を有する樹脂成形体にて被覆され、これに
よって受光ホルダ２０が形成されている。This embodiment is applied to a reflective photosensor. As shown in FIGS. 1(a) and 1(b), the reflective photosensor 21 includes a main lead frame 11 in the form of a horizontally oriented flat plate, and a branch lead frame 12 in the form of a vertically oriented flat plate perpendicular to the main lead frame 11. are integrally formed, thereby forming a T-shaped lead frame 13. At both ends of the main lead frame 11, an element installation portion 1 having a concave cross section is provided.
4 and 4 are formed respectively. A light emitting element 15 made of a light emitting diode chip is fixed onto the bottom part 14a of one of the element installation parts 14 by means of bonding. In addition, the bottom part 14 of the other element installation part 14
．． A light-receiving element 16 made of a light-receiving phototransistor is fixed on the upper part a by means of bonding. The light emitting element 15 and the light receiving element 16 are located at both bottom portions 14a and 16a.
14a, they are both positioned to provide the same forward directivity. Further, the light emitting element 15 and the light receiving element 16 are connected to separate sub lead frames 17 and 17 by wire bonding using gold vA18 and 1rI+'18, respectively. The entire circumference of the light emitting element 15, including this connection part, is as follows:
The light emitting holder 19 is covered with a transparent or translucent resin molded body. Further, the entire circumference of the light-receiving element 16, including the connection portion, is covered with a transparent or translucent resin molding, thereby forming the light-receiving holder 20.
上記の構成において、発光素子１５から発せられた光は
、フォトセンサ２１の前方の物体に反射し、その反射光
が受光素子１６によって受光される。これにより物体の
有無等が検知される。In the above configuration, the light emitted from the light emitting element 15 is reflected by an object in front of the photosensor 21, and the reflected light is received by the light receiving element 16. This allows the presence or absence of an object to be detected.
尚、前記フォトセンサ２１は、第１図（ｂ）の矢印で示
すように、発光ホルダ１９の側方への光路によりＳ／Ｎ
比の悪化を生じる虞れがある。この場合、第２図（ａ）
（ｂ）に示すように、フォトセンサ２１の全体をホルダ
ケース２２内に取置し、発光素子１５及び受光素子１６
の光の指向方向の光路を除いて、他部を上記ホルダケー
ス２２により遮光するように構成することもでき、これ
によりＳ／Ｎ比の悪化を防止することが可能となる。The photosensor 21 has an S/N ratio due to the optical path to the side of the light emitting holder 19, as shown by the arrow in FIG. 1(b).
There is a risk that the ratio may deteriorate. In this case, Fig. 2(a)
As shown in (b), the entire photosensor 21 is placed inside the holder case 22, and the light emitting element 15 and the light receiving element 16 are placed inside the holder case 22.
It is also possible to configure the holder case 22 to block light from the other parts except for the optical path in the direction of the light direction, thereby making it possible to prevent deterioration of the S/N ratio.
〔実施例２〕
本発明の第２実施例を第３図（ａ）（ｂ）に基づいて説
明する。本実施例は、透過型のフォトセンサに適用した
ものである。[Embodiment 2] A second embodiment of the present invention will be described based on FIGS. 3(a) and (b). This embodiment is applied to a transmission type photosensor.
透過型のフォトセンサ３１には、Ｔ字型リードフレーム
１３を構成する主リードフレーム１１の両端部がそれぞ
れ垂直に上方へ立ち」二かり、これら立ち上がり部に形
成されている素子設置部１４・１４の凹部が互いに対向
配置となるように設定されている。これにより、上記の
画素子設置部１４・１４に設けられる発光素子１５と受
光素子１６とは、光の指向性の方向が対向することにな
る。このような構成によって、発光素子１５から発せら
れた光は、これと対向する受光素子１６により受光され
、この光路が遮断されるか否かによって、発光素子１５
と受光素子１６との間の物体の有無等が検知される。そ
の他の構成については、前記第１実施例と同じであり、
同一の機能を有する部材には同一の符号を付記してその
説明を省略する。尚、このことは、以下の実施例におい
ても同様である。In the transmission type photosensor 31, both ends of the main lead frame 11 constituting the T-shaped lead frame 13 stand vertically upward, and element installation parts 14 and 14 are formed on these rising parts. The recessed portions are arranged to face each other. As a result, the light-emitting element 15 and the light-receiving element 16 provided in the pixel-element installation parts 14 and 14 have opposite directions of light directivity. With such a configuration, the light emitted from the light emitting element 15 is received by the light receiving element 16 facing thereto, and depending on whether this optical path is blocked or not, the light emitted from the light emitting element 15
The presence or absence of an object between the light receiving element 16 and the light receiving element 16 is detected. The other configurations are the same as the first embodiment,
The same reference numerals are added to the members having the same functions, and the explanation thereof will be omitted. Note that this also applies to the following examples.
〔実施例３〕
本発明の第３実施例を第４図（ａ）（ｂ）に基づいて説
明する。本実施例は反射型のフォトセンサに適用したも
のである。[Embodiment 3] A third embodiment of the present invention will be described based on FIGS. 4(a) and (b). This embodiment is applied to a reflective photosensor.
反射型のフォトセンサ４１の主リードフレーム１１の中
央部から分岐リードフレーム１２にかけて、発光ホルダ
１９及び受光ホルダ２０の相対向する側の光路を遮断し
うるように、山型の遮光部１１ａが形成されている。こ
の遮光部１１ａにおける主リードフレーム１１の左右両
側には、切込部１１ｃ・・・によって一体に形成された
平板状のリードフレームＩｌｂ・ｌｌｂが両横に延設さ
れるとともに、上記山型遮光部１１ａの縦方向の延長部
によって分岐リードフレーム１２が形成されている。こ
れにより、発光ホルダ１９と受光ホルダ２０との間の相
対向する側からの光路が遮断され、Ｓ／Ｎ比の悪化を上
記の山型遮光部１１ａによって防止することが可能とな
る。A chevron-shaped light shielding part 11a is formed from the center of the main lead frame 11 of the reflective photosensor 41 to the branch lead frame 12 so as to block the optical path on the opposing sides of the light emitting holder 19 and the light receiving holder 20. has been done. On both left and right sides of the main lead frame 11 in this light-shielding portion 11a, flat lead frames Ilb and llb integrally formed by notches 11c are extended laterally, and the above-mentioned mountain-shaped light-shielding A branch lead frame 12 is formed by the vertical extension of the portion 11a. Thereby, the optical path between the light emitting holder 19 and the light receiving holder 20 from opposing sides is blocked, and it becomes possible to prevent deterioration of the S/N ratio by the chevron-shaped light blocking portion 11a.
〔実施例４〕
本発明の第４実施例を第５図Ｃ２＞ （ｂ）に基づい
て説明する。本実施例は、反射型のフォトセンサに適用
したものである。[Embodiment 4] A fourth embodiment of the present invention will be described based on FIG. 5C2>(b). This embodiment is applied to a reflective photosensor.
反射型のフォトセンサ５１における発光ホルダ１９の前
端面には、発光素子１５の光照射方向にレンズ部５２が
形成され、このレンズ部５２は樹脂成型により一体に形
成されている。一方、受光ホルダ２０の前端面にも同様
に、受光素子１６の受光方向にレンズ部５２が形成され
、樹脂成型により一体に形成されている。A lens portion 52 is formed on the front end surface of the light emitting holder 19 of the reflective photosensor 51 in the direction of light irradiation of the light emitting element 15, and this lens portion 52 is integrally formed by resin molding. On the other hand, a lens portion 52 is similarly formed on the front end surface of the light receiving holder 20 in the light receiving direction of the light receiving element 16, and is integrally formed by resin molding.
このような構成とすることにより、両ホルダ１９・２０
の樹脂成型後に、平板状の主リードフレーム１１を折曲
形成し、発光ホルダ１９と受光ホルダ２０の各前端面の
向き角度を自由に設定することが可能になるとともに、
高指向性の長距離焦点機能を具備させることができる。With such a configuration, both holders 19 and 20
After the resin molding, the flat main lead frame 11 is bent and formed, and the orientation angle of each front end face of the light emitting holder 19 and the light receiving holder 20 can be freely set.
A highly directional long-range focusing function can be provided.
本発明のフォトセンサは、以上のように、発光素子を被
覆する樹脂成形体から成る発光ホルダと、受光素子を被
覆する樹脂成形体から成る受光ホルダとが、主リードフ
レームによって結合された構成となっている。これによ
り、上記のリードフレームを後加工により各実施例に示
したような形状に成形するだけで、透過型と反射型のい
ずれのタイプにも適用することが可能となる。従って、
本発明のフォトセンサを製造する場合は、一種類のモー
ルド用金型だけでよく、その結果、製造コストを著しく
低減させることができる。また、上記のリードフレーム
を成形することにより、たとえ反射型のフォトセンサで
あってもホルダケースを必ずしも設けることを要しない
ので、部品点数を減少させることが可能となる。更に、
ホルダケースへの各ホルダの取置および固定させる工程
が不要となるので、製造工数を削減することが出来、ま
たぼり取り工程等も要しない。そして、発光ホルダと受
光ホルダとを同時に樹脂成型することが可能な構造とな
っているので、製造工程を更に短縮することも可能とな
る。さらに、上記の構成とすることにより、発光ホルダ
及び受光ホルダに、高指向性を有する長距離焦点機能を
有するレンズ部を形成することも容易に可能となる。こ
のように、設備費が低減でき、かつ製造工程の簡素化お
よび部品点数の減少により、大幅なコストダウンを実現
しうる等の効果を奏する。As described above, the photosensor of the present invention has a structure in which a light emitting holder made of a resin molded body covering a light emitting element and a light receiving holder made of a resin molded body covering a light receiving element are connected by a main lead frame. It has become. This makes it possible to apply the lead frame to either a transmissive type or a reflective type simply by post-processing the lead frame into the shape shown in each embodiment. Therefore,
When manufacturing the photosensor of the present invention, only one type of molding die is required, and as a result, manufacturing costs can be significantly reduced. Further, by molding the lead frame described above, it is not necessary to provide a holder case even for a reflective photosensor, so it is possible to reduce the number of parts. Furthermore,
Since the process of placing and fixing each holder in the holder case is not necessary, the number of manufacturing steps can be reduced, and there is no need for a process such as cutting. Further, since the structure allows the light emitting holder and the light receiving holder to be resin-molded at the same time, it is also possible to further shorten the manufacturing process. Furthermore, with the above configuration, it becomes possible to easily form a lens portion having a long-distance focusing function with high directivity on the light emitting holder and the light receiving holder. In this way, equipment costs can be reduced, and the manufacturing process can be simplified and the number of parts can be reduced, resulting in significant cost reductions.
第１図（ａ）は本発明の一実施例を示す斜視図、同図（
ｂ）はその縦断面図、第２図（ａ）は第１図に示すフォ
トセンサの適用例を示す斜視図、同図（ｂ）はその縦断
面図、第３図乃至第５図はそれぞれ他の実施例を示し、
各図（ａ）は斜視図、各図（ｂ）はその縦断面図、第６
図および第７図はそれぞれ従来例の縦断面図、第８図は
他の従来例を示し、同図（ａ）はその斜視図、同図（ｂ
）はその製造段階の説明図、同図（Ｃ）は縦断面図であ
る。
１１は主リードフレーム、１２は分岐フレーム、１４は
素子設置部、１５は発光素子、１６は受光素子、１７は
副リードフレーム、１８は金線、１９は発光ホルダ、２
０は受光ホルダである。
第１図（ｂ）
第２図（ａ）
第２図（ｂ）
第３図（ａ）
第３、図（ｂ）
第４図（ａ）
第４図（ｂ）
第５図（ａ）
０７ワ
第６図
第７図
第８図（ａ）
第８図（ｂ）
第８図（ｃ）
ｌ ４FIG. 1(a) is a perspective view showing one embodiment of the present invention;
b) is a longitudinal sectional view thereof, FIG. 2(a) is a perspective view showing an application example of the photosensor shown in FIG. 1, FIG. 2(b) is a longitudinal sectional view thereof, and FIGS. 3 to 5 are respectively Showing other examples,
Each figure (a) is a perspective view, each figure (b) is a longitudinal sectional view, and
7 and 7 are longitudinal sectional views of the conventional example, and FIG. 8 shows another conventional example, in which figure (a) is a perspective view and figure (b)
) is an explanatory view of the manufacturing stage, and (C) is a longitudinal cross-sectional view. 11 is a main lead frame, 12 is a branch frame, 14 is an element installation part, 15 is a light emitting element, 16 is a light receiving element, 17 is a sub lead frame, 18 is a gold wire, 19 is a light emitting holder, 2
0 is a light receiving holder. Figure 1 (b) Figure 2 (a) Figure 2 (b) Figure 3 (a) Figure 3 (b) Figure 4 (a) Figure 4 (b) Figure 5 (a) 07 Figure 6 Figure 7 Figure 8 (a) Figure 8 (b) Figure 8 (c) l 4
Claims (1)
レームを有し、上記主リードフレームの両端部に断面凹
型の素子設置部を形成して、いずれか一方の素子設置部
に発光素子を、他方の素子設置部に受光素子をそれぞれ
設置するとともに、上記発光素子と受光素子を各々別の
副リードフレームと接続し、この接続部を含む素子の全
周部を、透光性を有する樹脂成形体にて被覆して、発光
ホルダと受光ホルダとを形成したことを特徴とするフォ
トセンサ。1. It has a main lead frame and a branch lead frame branched from the main lead frame, and an element installation part with a concave cross section is formed at both ends of the main lead frame, and a light emitting element is placed in one of the element installation parts, and a light emitting element is placed in the other element installation part. The light-receiving elements are each installed in the installation part, and the light-emitting element and the light-receiving element are each connected to a separate sub-lead frame, and the entire circumference of the element, including this connection part, is covered with a resin molded body having translucent properties. A photosensor characterized in that a light-emitting holder and a light-receiving holder are formed by coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60273753A JPS62133774A (en) | 1985-12-05 | 1985-12-05 | Photosensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60273753A JPS62133774A (en) | 1985-12-05 | 1985-12-05 | Photosensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62133774A true JPS62133774A (en) | 1987-06-16 |
| JPH057874B2 JPH057874B2 (en) | 1993-01-29 |
Family
ID=17532095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60273753A Granted JPS62133774A (en) | 1985-12-05 | 1985-12-05 | Photosensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62133774A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02101556U (en) * | 1989-01-27 | 1990-08-13 | ||
| US5291038A (en) * | 1990-12-19 | 1994-03-01 | Sharp Kabushiki Kaisha | Reflective type photointerrupter |
| JP2009041279A (en) * | 2007-08-09 | 2009-02-26 | Panasonic Electric Works Co Ltd | Opening/closing structure of overflow opening |
| US7764271B2 (en) | 2005-09-13 | 2010-07-27 | Lite-On Technology Corp. | Method of manufacturing an optical module |
| JP2012195502A (en) * | 2011-03-17 | 2012-10-11 | Yazaki Corp | Terminal structure for module |
-
1985
- 1985-12-05 JP JP60273753A patent/JPS62133774A/en active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02101556U (en) * | 1989-01-27 | 1990-08-13 | ||
| US5291038A (en) * | 1990-12-19 | 1994-03-01 | Sharp Kabushiki Kaisha | Reflective type photointerrupter |
| US7764271B2 (en) | 2005-09-13 | 2010-07-27 | Lite-On Technology Corp. | Method of manufacturing an optical module |
| JP2009041279A (en) * | 2007-08-09 | 2009-02-26 | Panasonic Electric Works Co Ltd | Opening/closing structure of overflow opening |
| JP2012195502A (en) * | 2011-03-17 | 2012-10-11 | Yazaki Corp | Terminal structure for module |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH057874B2 (en) | 1993-01-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |