JPS61127186A - Inverted-cone type light-emitting element lamp - Google Patents
Inverted-cone type light-emitting element lampInfo
- Publication number
- JPS61127186A JPS61127186A JP59247800A JP24780084A JPS61127186A JP S61127186 A JPS61127186 A JP S61127186A JP 59247800 A JP59247800 A JP 59247800A JP 24780084 A JP24780084 A JP 24780084A JP S61127186 A JPS61127186 A JP S61127186A
- Authority
- JP
- Japan
- Prior art keywords
- lens
- light
- substrate
- light emitting
- lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 229920005989 resin Polymers 0.000 claims abstract description 15
- 239000011347 resin Substances 0.000 claims abstract description 15
- 229920003002 synthetic resin Polymers 0.000 abstract description 17
- 239000000057 synthetic resin Substances 0.000 abstract description 17
- 238000005286 illumination Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 description 4
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、薄型の面発光装置の光源として最適な逆円錐
型発光素子ランプに関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an inverted cone-shaped light emitting element lamp that is optimal as a light source for a thin surface emitting device.
〈従来の技術〉
従来、超小形の発光素子ランプとしては、例えば第5図
に示す如き薄型面発光装置のマスク10の表示部11の
バック照明用に使用される発光ダイオードランプ21が
知られている。この発光ダイオードランプ21は、発光
ダイオードチップ24の正、負極を対向するリード端子
25a、25bに夫々ボンディングし、これらをミニト
ランス7T−成形される合成樹脂23でモールドしてい
る。<Prior Art> Conventionally, as an ultra-small light emitting device lamp, a light emitting diode lamp 21 used for back illumination of a display section 11 of a mask 10 of a thin surface emitting device as shown in FIG. 5, for example, has been known. There is. In this light emitting diode lamp 21, the positive and negative electrodes of a light emitting diode chip 24 are bonded to opposing lead terminals 25a and 25b, respectively, and these are molded with a synthetic resin 23 that is molded into a mini transformer 7T.
この合成樹脂23の前面は半球状のレンズ23aをなし
てダイオードチップ24からの発光を光軸C上に集める
一方、後面は基板22に載置され、合成樹脂23の両側
面から突出する上記リード層子25m、25bは、基板
22を貫通して裏面の配線パターン28m、28bには
んだ付けされている。The front surface of this synthetic resin 23 forms a hemispherical lens 23a to collect light emitted from the diode chip 24 onto the optical axis C, while the rear surface is placed on the substrate 22 and has the above-mentioned leads protruding from both sides of the synthetic resin 23. The layers 25m and 25b penetrate the substrate 22 and are soldered to the wiring patterns 28m and 28b on the back surface.
また、合成樹脂23の周囲の基板22上にレンズ23a
等からの光を反射する反射板26を上記表示部11に合
わせて設け°、この反射板26と上記マスク10間に光
を散乱する散6Lシート27を設けている。Also, a lens 23a is placed on the substrate 22 around the synthetic resin 23.
A reflector plate 26 for reflecting light from the display section 11 is provided along with the display section 11, and a diffuser sheet 27 for scattering light is provided between the reflector plate 26 and the mask 10.
しかし、この形状の発光ダイオードランプ21は、レン
ズ23aの集光によって光軸C上の光度が高く、逆にそ
の周辺の光度が低くなろため、表示部11に輝度むらを
生じ、表示文字が読みにくいという欠点があった。However, in the light emitting diode lamp 21 having this shape, the luminous intensity on the optical axis C is high due to the condensation of the lens 23a, and on the contrary, the luminous intensity in the surrounding area is low, resulting in uneven brightness on the display section 11, making it difficult to read the displayed characters. The drawback was that it was difficult.
最近、この欠点を改善するため第6図に示す上うな発光
ダイオード単体ランプ31が提供されている。この発光
ダイオード単体ランプ31は、発光ダイオードチップ3
4の前面のみを、先端に逆円錐形のくぼみ33mをもつ
円筒形の合成樹脂レンズ33でモールドし、後面から正
、負リード端子35a’、35bを並行して突出させた
いわゆるラノアルタイプのものである。そして、これら
はレンズ33の前部を除いて、基板32上の反射板36
に9設された穴36af)tE、n中心36bに埋込ま
れ、両リード端子35m、3S&は基板32を貫通して
裏面の配線パターン38a、38bにはんだ付けされて
いる。このラゾフルタイプの発光ダイオード単体ランプ
31では、レンズ33先端の逆円錐形のくぼみ33aに
よって、ダイオードチップ34からの発光は、穴36a
内へ略均等に散孔され、穴36a面で反射され、薄型発
光装置のマスク10の表示部11下の散孔ンート27に
略均等に達するため、前述の欠点は解消される。Recently, in order to improve this drawback, a single light emitting diode lamp 31 as shown in FIG. 6 has been provided. This light emitting diode single lamp 31 includes a light emitting diode chip 3
It is a so-called lanoal type lens in which only the front surface of the lens 4 is molded with a cylindrical synthetic resin lens 33 having an inverted conical recess 33 m at the tip, and positive and negative lead terminals 35a' and 35b protrude in parallel from the rear surface. be. And, except for the front part of the lens 33, these are the reflection plate 36 on the substrate 32.
The lead terminals 35m and 3S& penetrate through the substrate 32 and are soldered to the wiring patterns 38a and 38b on the back side. In this Lazoflu type light emitting diode single lamp 31, the light emitted from the diode chip 34 is directed through the hole 36a by the inverted conical recess 33a at the tip of the lens 33.
The holes are dispersed substantially uniformly inward, reflected by the surface of the hole 36a, and reach the hole 27 under the display section 11 of the mask 10 of the thin light emitting device substantially uniformly, so that the above-mentioned drawbacks are eliminated.
〈発明が解決しようとする問題点〉
しかしながら、上記ラノアルタイプの発光ダイオード単
体ランプ31は、正、負リード端子35m、35bが薄
型面発光装置の厚さD゛方向並行して延在する構造のた
め、その分必然的に上記厚さD′が厚くなって装置の薄
型化を図れないという欠点がある。また、上記両リード
端子35a。<Problems to be Solved by the Invention> However, the lanoal type single light emitting diode lamp 31 has a structure in which the positive and negative lead terminals 35m and 35b extend in parallel in the thickness direction D of the thin surface emitting device. , the thickness D' inevitably increases accordingly, resulting in a drawback that the device cannot be made thinner. Also, both lead terminals 35a.
35bが互いに近接しているうえ、反射板36に埋り込
んでいるため、基板32への装着に精度を要し手間がか
かるという欠点がある。さらに、単体であるため広い発
光面が得られないのも欠点である。35b are close to each other and are embedded in the reflecting plate 36, which has the disadvantage that attachment to the substrate 32 requires precision and time. Another drawback is that since it is a single unit, a wide light emitting surface cannot be obtained.
そこで、本発明の目的は、さらに面発光装置の薄型化を
図ることができるとともに、多数の発光源を容易かつ確
実に基板に装着できる構造の逆円錐型発光素子ランプを
提供することである。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an inverted conical light emitting element lamp which allows a surface emitting device to be made thinner and which allows a large number of light emitting sources to be mounted on a substrate easily and reliably.
〈問題点を解決するための手段〉
上記目的をi!!處するため、本発明の構成は、発光素
子を前面に逆円錐形のくぼみを有する樹脂レンズでモー
ルドし、上記樹脂レンズの両側方からリード端子を突出
させ、上記樹脂レンズの後面を21!I板に当接させる
とともに、上記樹脂レンズの周囲の基板上に反射板を設
け、さらに上記反射板の前面に散乱シートを設けたこと
を特徴とfる。<Means to solve the problem> The above purpose is i! ! In order to prevent this, the present invention has a configuration in which the light emitting element is molded with a resin lens having an inverted conical depression on the front surface, lead terminals are made to protrude from both sides of the resin lens, and the rear surface of the resin lens is 21! It is characterized in that a reflecting plate is provided on the substrate around the resin lens in contact with the I plate, and a scattering sheet is further provided in front of the reflecting plate.
〈作 用〉
樹脂レンズ内の発光素子から放出される光は、このレン
ズの1itj面の逆円錐形のくぼみ面では主に全反射さ
れ、主としてレンズの側面で屈折して外部へ出る。そし
て、上記4j(脂レンズの周囲の基板上に設けられた反
射板で反射され、この反射板の前面の散6Lシートへ向
かう、上記レンズの逆円錐形のくぼみおよび反射板の形
状は、上記散乱シート而の光度が略均等になるとともに
反射板のHさ即ち発光素子と故6Lシートの間隔ができ
るだけ小さくなるような形状にしているので、光路が最
短になり発光素子の発光能力を最大限に生かした均一光
度が得られる。<Function> The light emitted from the light emitting element within the resin lens is mainly totally reflected on the inverted conical concave surface of the 1itj surface of this lens, and is mainly refracted on the side surface of the lens and exits to the outside. Then, the shape of the inverted conical recess of the lens and the shape of the reflection plate, which is reflected by the reflection plate provided on the substrate around the fat lens and directed toward the diffuser 6L sheet on the front surface of the reflection plate, are as described above. The light intensity of the scattering sheet is approximately equal, and the height of the reflector, that is, the distance between the light emitting element and the 6L sheet, is shaped to be as small as possible, so the optical path is minimized and the light emitting ability of the light emitting element is maximized. Uniform luminous intensity can be obtained.
〈実施例〉 以下、本発明を図示の実施例により詳細に説明する。<Example> Hereinafter, the present invention will be explained in detail with reference to illustrated embodiments.
第1図において、1は逆円錐型発光素子ランプ、2はこ
のランプ1の基板、3はこの基板2上に取付けた円筒状
の合成軸(脂レンズ、4はこの合成樹脂レンズ3内にモ
ールドされた発光素子としての発光ダイオード、5m
、5bはこの発光ダイオード4の正、・負極に夫々ボン
ディングしたり一1″端子、6は上記レンズ3の周囲の
基板2上に設けた反射板、7はこの反射板6の前面に設
けた故6Lシートである。上記逆円錐型発光素子すなわ
ち発光グイオー−ランプ1は、薄型面発光装置のマスク
10の表示[11の後面に配設され、パック照明として
用いられる。In Fig. 1, 1 is an inverted conical light emitting element lamp, 2 is a substrate of this lamp 1, 3 is a cylindrical synthetic shaft (fat lens) mounted on this substrate 2, and 4 is a molded inside of this synthetic resin lens 3. Light emitting diode as a light emitting element, 5m
, 5b are bonded to the positive and negative terminals of the light emitting diode 4, respectively, and 11" terminals are provided. 6 is a reflecting plate provided on the substrate 2 around the lens 3, and 7 is provided on the front surface of this reflecting plate 6. The inverted conical light emitting element, ie, the light emitting lamp 1, is disposed on the rear surface of the display [11] of the mask 10 of the thin surface emitting device, and is used as pack illumination.
上記合成樹脂レンズ3は、透明合成樹脂をトランスファ
ー成形して作ら゛れ、前面の中心軸Cに逆円錐形のくぼ
み3aを有する一方、平坦な後面を基板2に当接させて
いる。上記発光ダイオード4は1合成樹脂レンズ3内の
中心軸C上に埋込まれ、上記リーl″端子5a 、5b
は、中心輪CI:直文する双方向に伸びてレンズ3の両
側面から突出し、夫々屈曲して基板2を貫通し、裏面の
配線パターン8a 、8bにはんだ付けされている。上
記反射板6には、」上記表示部11に合わせて円錐台状
の貫通穴6aを穿設し、この貫通穴6aの中央に合TI
t樹脂レンズ3が収容されている。なお、反射板6の貫
通穴6aの傾斜部の高さは合r#、樹脂レンズ3の高さ
より高く腰その高さと傾斜角度およびレンズ3のくぼみ
3aの円錐の頂角は、発光グイオー1″4で発し、レン
ズ3中で全反射、屈折して外へ出2貫通穴61面で反射
して故6Lシート7に達する光の光度が略均等になると
同時に、反射板6の厚さDができるだけ薄くなるように
選定している。The synthetic resin lens 3 is made by transfer molding a transparent synthetic resin, and has an inverted conical depression 3a on the central axis C of the front surface, while the flat rear surface is brought into contact with the substrate 2. The light emitting diode 4 is embedded on the central axis C within the synthetic resin lens 3, and the light emitting diode 4 is embedded on the central axis C within the synthetic resin lens 3, and the above-mentioned lead l'' terminals 5a, 5b
The center ring CI: extends in both directions, protrudes from both sides of the lens 3, bends to penetrate the substrate 2, and is soldered to the wiring patterns 8a and 8b on the back side. A truncated cone-shaped through hole 6a is bored in the reflecting plate 6 to match the display section 11, and a TI is formed in the center of the through hole 6a.
A resin lens 3 is housed therein. The height of the slope of the through hole 6a of the reflector plate 6 is R#, which is higher than the height of the resin lens 3, its height and inclination angle, and the apex angle of the cone of the recess 3a of the lens 3 are 1''. 4, is totally reflected in the lens 3, is refracted, goes out, is reflected on the surface of the through hole 61 of 2, and reaches the 6L sheet 7. At the same time, the luminous intensity of the light becomes approximately equal, and at the same time, the thickness D of the reflecting plate 6 is It is selected to be as thin as possible.
@2図は、第1図に示した逆円錐型発光ダイオードラン
プ1を多数用いた薄型面発光装置を示している。基板2
上の反射板6には、上記発光装置のマスク10の表示部
11.11.・・・に合わせて、X、Y方向に一定間隔
に多数の貫通穴6m、 6a。Figure @2 shows a thin surface emitting device using a large number of inverted conical light emitting diode lamps 1 shown in Figure 1. Board 2
On the upper reflecting plate 6 are display portions 11, 11, . ..., a large number of through holes 6m and 6a are provided at regular intervals in the X and Y directions.
・・・を穿設し、これら各貫通穴に光源としての合成樹
脂レンズ3,3.・・・を収容している。. . , and synthetic resin lenses 3, 3 . It houses...
上記構成の逆円錐型発光ダイオードランプにおいて、合
成樹脂レンズ3内の発光ダイオード4h−ら放射状に放
出される光は、第1し1中の矢印で示す如く、逆円錐形
のくぼみ3a面では主に全反射され、主としてレンズ3
の円筒状の側面で屈折して外部へ出る。そして、周囲の
反射板6の貫通穴6a面で反射され、前・方の故6Lシ
ート7へ向がう。In the inverted conical light emitting diode lamp having the above configuration, the light emitted radially from the light emitting diode 4h in the synthetic resin lens 3 is mainly emitted on the surface of the inverted conical depression 3a, as shown by the arrows in the first and second arrows. It is totally reflected by the lens 3.
It refracts at the cylindrical side and exits to the outside. Then, it is reflected by the surface of the through hole 6a of the surrounding reflecting plate 6, and is directed toward the 6L sheet 7 in front.
上記くぽみ3aや貫通穴6&の形状は前述のように選定
されているので、光路が最短になり、散乱シート7面の
光度は略均等でかつ強くなる。そして散乱シート7に達
した光は、さらに散乱されて均一化し、薄型発光装置の
マスク1oの表示部11を均一に照明する。Since the shapes of the recesses 3a and the through holes 6& are selected as described above, the optical path becomes the shortest, and the luminous intensity on the surface of the scattering sheet 7 becomes substantially uniform and strong. The light reaching the scattering sheet 7 is further scattered and made uniform, thereby uniformly illuminating the display section 11 of the mask 1o of the thin light emitting device.
このようにして、上記実施例では、発光ダイオード4の
発光能力を最大限に生かした強い光度でかつ均一に表示
gllを照明できる。また、前述のように反射板6の厚
さDをできるだけ薄くしているので、面発光装置自体の
薄型化を図ることができる。12図に示した装置では、
各レンズ3のリード端子5 &、 5 bが両側面から
突出し、各貫通穴6aが一枚の反射板6に穿設される構
造のため、基板6へのレンズ3の装着等が容易で自動化
に適し、製造が簡11+Lにできるという利点がある一
方、装置としては強い光度の均一な広い発光面が得られ
るという利点がある。In this manner, in the embodiment described above, the display gll can be uniformly illuminated with a strong luminous intensity that takes full advantage of the light emitting ability of the light emitting diode 4. Further, as described above, since the thickness D of the reflection plate 6 is made as thin as possible, it is possible to reduce the thickness of the surface emitting device itself. In the device shown in Figure 12,
Since the lead terminals 5 & 5b of each lens 3 protrude from both sides and each through hole 6a is drilled in one reflective plate 6, mounting of the lens 3 on the board 6 is easy and automated. It has the advantage that it is suitable for use and can be easily manufactured in 11+L, while as a device it has the advantage that a wide light emitting surface with a strong and uniform luminous intensity can be obtained.
第3図、第4図は、合成樹脂レンズの変形例を示す平面
図、断面図である。この合成I封脂レンズ13は、同様
にトランスファー成形で作られ、半球状の前面の中央に
逆円錐形のくぼみ13aを有するとともに、内部の中心
軸C上に発光ダイオード14をモールドし、両側面がら
リード端子15a、15bを突出させている。FIG. 3 and FIG. 4 are a plan view and a sectional view showing a modified example of the synthetic resin lens. This synthetic I-sealed lens 13 is similarly made by transfer molding, has an inverted conical recess 13a in the center of the hemispherical front surface, has a light emitting diode 14 molded on the inner central axis C, and has a light emitting diode 14 molded on both sides. However, the lead terminals 15a and 15b are made to protrude.
なお、上記実施例、変形例では、合成樹脂し/ズ3や反
射板6の貫通穴6aを円筒状1円錐状。In the above embodiments and modifications, the through holes 6a of the synthetic resin cylinder 3 and the reflective plate 6 are cylindrical and conical.
半球状などにしたが、これらを表示部との関係で立方体
、四角錐状等にすることもできる。Although the shapes are hemispherical or the like, they can also be shaped into cubes, square pyramids, etc. depending on the relationship with the display section.
〈発明の効果〉
以上の説明で明らかなように、本発明の逆円錐型発光素
子ランプは、発光素子をモールドした樹脂レンズが前面
に逆円錐形のくぼみを有し、両側面かリリード端子を突
出させ、後面を基板に当接させているうえ、上記ム(脂
レンズの周囲に設けた反射板や上記くぼみの形状1寸法
が適切に選ばれているため、発光装置自体の薄型化を図
ることができ、輝度むらのない均一で明るい発光面を得
ることができる。また、両側面からリード端子が突出し
ているため、多数の樹脂レンズを容易かつ確実に基板に
装着でき、広い発光面を得ることができる。<Effects of the Invention> As is clear from the above description, in the inverted conical light emitting element lamp of the present invention, the resin lens in which the light emitting element is molded has an inverted conical recess on the front surface, and the relead terminal is connected to both sides. In addition to protruding and having its rear surface in contact with the substrate, the dimensions of the reflector provided around the greasy lens and the shape of the recess are appropriately selected, allowing the light emitting device itself to be made thinner. This makes it possible to obtain a uniform and bright light-emitting surface with no uneven brightness.In addition, since the lead terminals protrude from both sides, a large number of resin lenses can be easily and securely attached to the board, and a wide light-emitting surface can be obtained. Obtainable.
第1図は本発明の一実施例を示す断面図、第2図は多数
の光源をもつ本発明によろ薄型発光装置を示す模式図、
第3図は合成樹脂レンズの変形例を示す平面図、第4図
は第3図の断面図、@5図。
第6図は従来の発光素ギランプの断面図である。
1・・・逆円錐型発光ダイオードランプ、 2・・・
基板、 3.13・・・合成樹脂し/ズ、 3a、13
m・・・逆円錐形のくぼみ、 4.14・・発光ダイ
オード、 5a、 Sb、 15a、 15b
−リード端子、6・・・反射板、 7・・散乱シー
ト。FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a schematic diagram showing a thin light emitting device according to the present invention having multiple light sources.
FIG. 3 is a plan view showing a modification of the synthetic resin lens, FIG. 4 is a sectional view of FIG. 3, and FIG. 5. FIG. 6 is a sectional view of a conventional light-emitting element lamp. 1... Inverted conical light emitting diode lamp, 2...
Substrate, 3.13...Synthetic resin/zu, 3a, 13
m...inverted conical depression, 4.14...light emitting diode, 5a, Sb, 15a, 15b
-Lead terminal, 6... Reflector, 7... Scattering sheet.
Claims (1)
レンズでモールドし、上記樹脂レンズの両側方からリー
ド端子を突出させ、上記樹脂レンズの後面を基板に当接
させるとともに、上記樹脂レンズの周囲の基板上に反射
板を設け、さらに上記反射板の前面に散乱シートを設け
たことを特徴とする逆円錐型発光素子ランプ。(1) A light emitting element is molded with a resin lens having an inverted conical depression on the front surface, lead terminals are protruded from both sides of the resin lens, the rear surface of the resin lens is brought into contact with the substrate, and the resin lens An inverted conical light-emitting element lamp, characterized in that a reflector is provided on a substrate around the reflector, and a scattering sheet is further provided in front of the reflector.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59247800A JPS61127186A (en) | 1984-11-22 | 1984-11-22 | Inverted-cone type light-emitting element lamp |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59247800A JPS61127186A (en) | 1984-11-22 | 1984-11-22 | Inverted-cone type light-emitting element lamp |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61127186A true JPS61127186A (en) | 1986-06-14 |
Family
ID=17168838
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59247800A Pending JPS61127186A (en) | 1984-11-22 | 1984-11-22 | Inverted-cone type light-emitting element lamp |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61127186A (en) |
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