JPS6081801A - Method of producing chip resistor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method of manufacturing a film type or solid type chip resistor.

[Technical background of the invention and its problems]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The case of a film type chip resistor shown in FIGS. 1 to 1F will be described. α: A resistive film (21) is formed on the surface of a ceramic chip piece (1) having a length of n, and C: electrodes (3) are formed by fitting cap electrodes on both ends, or by painting, plating, etc. , d: A groove (4) for adjusting the resistance value is cut in the resistance film (2), -: The exterior film (5) is coated on the part other than the electrode (3), f: The surface of the exterior film (5) is coated with the exterior film (5). The product is made by printing the display part (6) for resistance value, tolerance, etc. in different colors.However,
The chip piece (11) is a small piece with a length of several mm, so it is difficult to handle and has problems such as poor workability.The same is true for the solid type.In this case, the chip piece (1) K is
Since the conductive material is blended with its resistance value adjusted, the process of forming a resistive film and adjusting the resistance value can be omitted.
Other steps were complicated as in the case of the film type.

[Purpose of the invention]

In view of the above-mentioned problems, the present invention provides a chip resistor 1 in the longitudinal direction of the long rod-shaped resistance substrate before cutting it into chips.
A large number of electrode parts are formed through the intervals in which the respective resistance parts are formed, and an exterior part is formed by painting each of the many resistance parts formed between the respective electrode parts, and then each of the exterior parts is painted. In this method, a display part is printed on the product, a long body is formed in which a large number of chip resistors are connected at the electrode part, and the long body is finally cut at the electrode part, thereby making handling easier and improving workability. .

[Summary of the invention]

In the present invention, a large number of electrode parts are formed in the length direction of a long thin rod-shaped resistance base at intervals corresponding to the resistance part of one chip resistor, and then a large number of electrode parts are formed between the electrode parts. Each resistor part is painted to form multiple exterior parts,
Next, each exterior part is formed, each exterior part is printed to form a display part, and then the electrode part is cut to obtain a chip resistor.

[Embodiments of the invention]

Next, a method for manufacturing a film type chip resistor according to an embodiment of the present invention shown in Figures 2a-y5 will be described.

α: Basic molded ceramic material extruded, dried and fired to a diameter of approximately 2m.
, a cylindrical elongated ceramic rod (7) of length FlocIIL is obtained. In some cases, an annular cutting groove (8) for dividing the rod-shaped body (7) into individual resistors may be formed in advance on its surface prior to drying. At this time, as shown in α1, if the cutting edge of the groove cutting blade (9) is made thinner, the broken part will be edge-shaped.
If the cutting edge of the groove cutting blade (9) is thickened as shown in α2, the cut portion will be in a chamfered state.

k; Resistive film formation A resistive film G (1
is formed to obtain a rod-shaped resistance base (7α). Resistance film 0α
is formed by carbon deposition, metal vapor deposition, coating with liquid resistance material, etc.

C; Electrode formation A large number of electrode parts (L
2 is formed. The electrode portion tta is formed by applying a conductive paste or plating. Resistance parts (11) adjacent to each other except for the electrodes (12tL) at both ends of the resistance base (7)
The electrode section (12) in between is twice the length of one electrode (12 cL).

d; Resistance value adjustment Each resistance part αB has a spiral groove fI3 for resistance value adjustment.
) is formed. When forming the spiral groove (131), a cutting blade is applied to one end of each resistance part αB, and the resistance base (7
By spirally rotating α), a large number of resistance parts (1
1). Alternatively, as shown in ctl, spiral grooves (13) are formed on the entire length of the electrode part 2 in a step before forming the electrode part opening 2, and then the spiral grooves (13) are formed at predetermined intervals in the electrode part opening 2. (
1z may be formed.

1; Exterior coating: Apply an epoxy resin paint from the resistor part α9 whose resistance value has been adjusted to a part of the electrode part u'2 and bake it to form an exterior film circle. When painting, a large number of resistance circles are simultaneously coated by placing a coating roller facing each resistance part fil) and rotating the resistance base (7α).

f; Display printing A display section α uniform is printed on the surface of the exterior film (14) to display resistance values, resistance tolerance values, etc. in different colors. During printing, multiple printing rollers are placed facing each color for each exterior film α4.
By rotating the resistance base (7α), two display portions α are simultaneously formed on all the exterior films 04.

1; Dividing The connected body αe formed in a state in which a large number of chip resistance factors are connected in the above manner is cut at the electrode portion α2 to obtain individual chip resistance factors. In addition, a large number of linked bodies (IIl
If you want to disconnect ll at the same time! 11. As shown in 1□, in step 5, a large number of connecting bodies (16) are placed in the container in multiple rows on the left and right and in multiple stages on the top and bottom through spacers so that the electrode parts az are aligned in the same position on the top, bottom, right, left and left. Then, a synthetic resin that is easily soluble in a solvent is poured into the container to solidify the whole, thereby obtaining an aggregate solidified in the resin layer (I7). Next, cut this assembly a8 together with the resin at the position where the electrode parts [2] overlap! A resin piece (with a large number of individually cut chip resistors embedded in the resin as shown in Fig. 15)
Obtain the L value. Next, this resin piece (19) is dissolved in a solvent to obtain individual chip resistors. At this time, use a solvent that does not soak the outer membrane or the display part (1).

Next, a method for manufacturing a solid chip resistor will be explained.

A conductive material and an insulating material are mixed homogeneously to a specified resistance value, a binder and a plasticizer are added, the mixture is extruded, dried, and fired to form a solid resistor in the shape of a long thin rod as shown in Figure 3. A substrate (7 cL) is obtained. Note that this method of forming the annular groove for breaking (8) in advance on the resistance base (7α)K is different from that in the case of the film-type resistor described above, in that a large number of electrode portions α2 are formed at intervals where the resistance portions a9 are formed. , hereinafter referred to as exterior membrane I
The formation of the display portion α, the formation of the display portion α, and the division method are the same as in the case of the film type described above. That is, in the case of the solid type, the process of forming a resistive film and the process of adjusting the resistance value are omitted, and the other steps are the same as in the case of the film type.

〔Effect of the invention〕

According to the present invention, the resistance portions of one one-chip resistor are formed at multiple locations at intervals along the length of the long and thin rod-shaped resistance base! forming a pole part, then painting each of the resistance parts at a number of locations formed between the electrode parts to form an exterior film, and then printing each exterior film to form a display part; Next, since the electrode portion is cut into chips, the electrode portion, the outer covering film, and the display portion are formed on the elongated rod-shaped substrate, compared to the conventional method in which the electrode portion, the outer covering film, and the display portion are individually formed on a chip piece with a length of several n. It is suitable for mass production because it has good workability because it forms parts, and it is possible to manufacture many pieces at the same time by applying the same processing to many places at once.

[Brief explanation of the drawing]

Figure N-1 is an explanatory diagram of the manufacturing process of a conventional chip resistor.
The figure is a manufacturing process explanatory diagram showing one embodiment of the present invention, and the third figure is a manufacturing process explanatory diagram showing another embodiment of the present invention. (Sword: Ceramic rod-shaped body, (7α)... Resistance base, (
8)...Annular groove, surrounding...resistance film, (11)--resistance part, a2...electrode part, grout...cut groove, (l(a)...exterior film, (15)...display part , a7)...Synthetic resin layer.

Claims (10)

[Claims] (1) Chip resistor 1
1. A method for manufacturing a chip resistor, which comprises forming electrode portions at multiple locations at intervals corresponding to resistor portions, and then cutting the electrode portions into chips. (2) Table ff1 in which the elongated rod-shaped resistance base is a ceramic rod-shaped body
2. The method of manufacturing a chip resistor according to claim 1, further comprising forming a K resistance film and forming grooves for adjusting a resistance value in the resistance film. (3) The method for manufacturing a chip resistor according to claim 1, wherein the long and thin rod-like resistance base is made of a solid rod whose resistance value is adjusted by blending an insulating material with a conductive material. (4) The method for manufacturing a chip resistor according to claim 2, wherein annular grooves for breaking are formed in the ceramic rod-shaped body at appropriate intervals. (5) The method for manufacturing a chip resistor according to claim 3, wherein annular grooves for breaking are formed at appropriate intervals in the solid rod-shaped body. (6) A large number of slender rod-shaped resistance substrates are assembled in parallel so that the electrode parts are in the same position and fixed in a synthetic resin layer,
2. The method of manufacturing a chip resistor according to claim 1, wherein the electrode portion is cut together with the synthetic resin layer. (7) Electrode parts are formed at many locations in the length direction of the elongated rod-shaped resistance base at intervals where the resistance part of one chip resistor is formed, and then a large number of electrode parts are formed between the electrode parts. 1. A method for manufacturing a chip resistor, which comprises coating individual resistor parts to form an exterior film at a large number of parts, and then cutting the electrode parts into chips. (8) A chip according to the off-ring of the claim, characterized in that the elongated rod-shaped resistance base is formed by forming a resistance film on the surface of a ceramic rod-shaped body, and forming grooves for adjusting the resistance value in the resistance film. Method of manufacturing resistors. (9) The method for manufacturing a chip resistor according to claim 17, wherein the long and thin rod-shaped resistance base is made of a solid rod-shaped body whose resistance value is adjusted by blending an insulating material with a conductive material. (10) Claims characterized in that the ceramic rod-shaped body is formed with annular grooves for breaking at appropriate intervals, i.
'The method for manufacturing a chip resistor according to item F8. (2) A method for manufacturing a chip resistor according to claim 9, characterized in that annular grooves for cutting are formed in the solid rod-shaped body at appropriate intervals. (1z A patent claim characterized in that a large number of slender rod-shaped resistance substrates are assembled in parallel so that the electrode portions are in the same position and fixed in a synthetic resin layer, and the electrode portions are cut together with the synthetic resin layer. The method for manufacturing a chip resistor according to item 7. Opposite: Forming electrode portions at multiple locations in the length direction of the elongated rod-shaped resistance base at intervals where the resistance portion of one chip resistor is formed. , the resistor parts formed between the electrode parts are each coated at a number of locations to form an exterior film, each exterior film is then printed to form a display part, and then the electrodes are coated. A method for manufacturing a chip resistor, characterized in that the chip resistor is cut into chips from a portion thereof. A resistive film is formed on the surface of a ceramic rod-like resistance base by an elongated rod-like resistance base, and a kerf for adjusting a resistance value is formed in this resistance film. A method for manufacturing a chip resistor according to claim E. A method for manufacturing a chip resistor according to claim 13, characterized in that the chip resistor is manufactured by: The method for manufacturing a chip resistor according to item 14. The method for manufacturing a chip resistor according to item 2115, characterized in that the solid rod-shaped body has annular grooves for breaking at appropriate intervals. Claims characterized in that long thin rod-shaped resistance bases are assembled in parallel at 5 so that the electrode parts are at the same position and fixed in a synthetic resin layer, and the electrode parts are cut together with the synthetic resin layer. A method for manufacturing a chip resistor according to item 16.