JPS60137100A - Automatic mounting device for electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] Technical Field The present invention relates to a tape (hereinafter referred to as "chip taping") that holds electronic components such as chip capacitors and resistors in multiple series.
”. This invention relates to an automatic electronic component mounting apparatus that automatically picks out electronic components individually from the electronic components and mounts them on a printed circuit board.

BACKGROUND TECHNOLOGY In this type of automatic mounting apparatus, it is normal to use a mounting head to directly pick out individual electronic components and mount them on a printed circuit board. The mounting device is equipped with a vacuum nozzle that sucks the electronic components from the chip taping and a gripper placed on the outer periphery of the nozzle, and the electric current sucked up by the vacuum nozzle is transferred to the gripper and printed. It is configured to be mounted on a board. Also, this mounting head uses a vacuum nozzle to suck up electronic components, and its gripping claws perform chip taping when mounting electronic components.

Because they need to be placed close to each printed circuit board, they are installed in a downward motion, but in addition, from the extraction position where electronic components are sucked from chip taping to the mounting position where electronic components are attached to the printed circuit board. It must be configured to allow reciprocating movement in the horizontal direction. In addition to these driving forces, at least a main driving mechanism that can move the chip taping from an empty part of an electronic component to a holding position for the next electronic component is required. If this is done using a completely separate drive mechanism, not only will the structure become extremely complex, but it will also require moving the chip taping from the empty area where the electronic component was extracted to the next holding position, and returning the mounting head to the next component extraction. Because we have to synchronize the process and the process, special consideration must be given to the coordination between them.

DISCLOSURE OF THE INVENTION In order to save driving force and simplify the mechanism, the present invention is configured so that chip taping can be fed intermittently by applying a mechanism that reciprocates the mounting head. It is an object of the present invention to provide an automatic mounting device for electronic components that is configured so that the next electronic component is always located at the extraction location during a return operation.

Specifically, in the automatic mounting apparatus for electronic components according to the present invention, a feed wheel for feeding and pulling the chip taping is attached to the lower frame on which the chip taping is mounted, and a lever is connected to the spindle of the feed wheel via a one-way clutch. By attaching this lever to the cam disk provided on the reciprocating frame of the mounting head and pressing it against it, the feed wheel is rotated only in the operating direction of the one-way clutch to intermittently feed the chip taping and also perform mounting. The structure is such that the next electronic component is always located at the extraction location when the head returns.

Example The following description will be made with reference to the drawings.

Automatic mounting of electronic components! fA, A... (see Figure 1) is a conveyor B that intermittently transports printed circuit boards horizontally.
A plurality of printed circuit boards are arranged in parallel at regular intervals perpendicular to the loader C, and the printed circuit boards accumulated on the loader C are pushed up by the loader C and taken out one by one onto the conveyor B using a suction cup.
The electronic components held by the chip taping E are automatically picked out while the printed circuit board is being conveyed horizontally by the conveyor B, and are mounted on predetermined locations on the printed circuit board. The printed circuit board is mounted on each automatic mounting device A, A...
・Once the electronic components are attached to the predetermined locations, they are received from the conveyor B and stored in the stonker box F.

In addition, the electronic components mounted on the printed circuit board in the art are chip-shaped such as capacitors and resistors. The electronic components 1 (see FIGS. 2 to 4) are housed in the recesses 3 of the embossed tape 2, and are stored in a plurality of chip tapings by covering the front surface with a cover tape 4. This chip taping is performed by forming a large number of through holes 6 in the holding tape 5 (see FIG. 5), accommodating the electronic components 1 therein, and covering the front and back sides with a force tape 7.8. You can also do it. This taping is provided with feed holes 9 (see Figure 2) at regular intervals in the longitudinal direction of the tape, and the feed holes 9 mesh with protrusions of a feed wheel, which will be described later, to smoothly feed and move the tip taping. enable.

Each automatic mounting device that attaches electronic components to a printed circuit board using chip taping E (see Figure 6) can be roughly divided into main parts of the mechanism. A mounting head 10 that can move up and down, an upper frame 20 that supports the mounting head 10 and moves back and forth in the front and rear directions, and a chimp taping E.
The lower frame 3o is equipped with an intermittent feed function.

The mounting head lO (see FIG. 7) is equipped with a vacuum nozzle ll for sucking electronic components from the chip taping E on the end side, and an electronic component gripper 12 arranged around the vacuum nozzle l'l, and an upper frame 2o. Fix the cylinder body with bracket plate 21 and support the rod tip with frame 1.
The drive cylinder 14 is connected to the protruding play 113a of No. 3 to allow downward movement. A sleeve tube 16 (see FIGS. 8 and 9) is rotatably supported on the upper frame 2o via a bearing 15. The sleeve tube 16
A bearing is disposed within the diameter of the slide outer cylinder 111 so that it can slide in the axial direction, and a slide inner cylinder 112 is disposed within the cylinder.
is fitted and arranged so as to be slidably deflectable in the axial direction by a spring +13. A pin 114 is arranged on the lower end side of these six cylinders 111 and 112 so as to be perpendicular to the axis.
14 is penetrated and supported by the slide inner cylinder 112 and is arranged to be inserted into the vertically long slit 115 of the slide outer cylinder l11. Further, the pin 114 is received in a slit 116 formed in the axial direction of the sleeve tube 16, and the sleeve tube 16 is inserted into the sliding outer tube 111. Slide inner cylinder 11
2 and rotate a (a) integrally with
Relative downward movement in the axial direction by 5°11Ei [1
I fully support it. From that pin 114 there is a socket.
The vacuum nozzle 11 fitted and supported by the spring 11
The rotary joint 11 is tension-supported via B and is attached to the upper end side of the slide inner cylinder 112 with respect to this vacuum nozzle 11.
It is configured to be able to apply a vacuum suction force from a vacuum source connected to 8. The gripping claws 12 (see Fig. 10.11) arranged around the vacuum nozzle 11 consist of two pairs of opposing claws 12a, 12b, +2c, +2d, which are engaged with each other by gears 121 and 122 and pulled. It is pulled by a spring 123 so that it can be opened and closed equally on the left and right sides, and is pivotally supported by a holder 124 fixed to the sleeve tube 16. Each of these claws 12a, 12b, 12c, 12d
is a taper 125 formed at the lower end of the slide outer cylinder 111.
is placed so that it hits the shoulder and expands.

Further, by meshing a gear 126 formed on the sleeve tube 16 with a pinion 12B of a pulse motor 127, the sleeve tube 16 is mounted so as to be rotatable by any angle ηf via a bearing 15.

In the mounting head IO configured in this manner, when the support frame 13 starts to move downward due to the stroke extension movement of the drive cylinder 14, the slide outer cylinder 111 integrated with the support frame 13 moves downward. During its descent, pin 114
is located near the lower end of the slide outer cylinder 111 inside the slide 7) 115, so the slide inner cylinder 112 does not immediately descend or move. Taper 12 formed on the side
5 hits the shoulder of the gripping claw 12 and each claw 12a, 12d
As a result, the gripping tabs 12 are expanded to a width wider than the size of the electronic component l. Furthermore, the slide outer cylinder l
11 moves downward and the pin 114 is attached to the upper end side of the slit 115.
When they come into contact with each other, the vacuum nozzle 11 moves downward together with the slide inner cylinder 112, and the tip of the vacuum nozzle 11 comes to be located directly above the electronic component l held by the chip taping E. From that position, the vacuum nozzle ll is slightly deflected downward by the compression of the spring 11B and descends to T2, where it slightly presses the electronic component 1.
By applying vacuum pressure through the rotation joint 11θ, the electronic component 1 can be attracted. Vacuum nozzle 1
When the electronic component l is sucked in step 1, the drive cylinder 14
moves the stroke backward, and with the slide outer cylinder 111° and the slide inner cylinder 112 as well as the vacuum nozzle 11 adsorbing the electronic component 1, the electronic component 1 is extracted from the chip taping E (above)1. On its way up, the slide outer cylinder 111 (
7) The taper 125 is removed from the shoulders of the claws 12a, 12d, and each claw 12a, 12b, 12c, 12d is closed by the spring 123, so that the electronic component 1 can be held in the center position and in the correct direction.

The mounting rack 10 that holds the electronic component l reciprocates a distance S (see FIG. 6) from its extraction position It is supported by the upper frame 20 so as to. The reciprocating motion is performed by a drive cylinder 22 (see Fig. 12.13), whose cylinder body is attached to the lower frame 30 via a bracket plate 31, and whose rod tip is attached to the upper frame 20. It is attached by fixing to the bracket plate 23 with screws. Further, the upper frame 20 is supported by slide bearings 24, 24 (see FIG. 7) arranged between the upper frame 20 and the lower frame 30 so as to be able to reciprocate in the horizontal direction.

Along with this reciprocating movement, the tip taping E is attached so that it can be moved intermittently. The tip taping E is supported by the reel H by a shaft 32 that projects rearward from the lower frame 30 (see FIG. 6). Pull out the chimp taping E from the reel i, and place the lower frame 30 slightly forward of the electronic component extraction position XI mentioned above.
The feed wheel 33 is mounted on the feed wheel 33. This feed wheel 33 protrudes a large number of protrusions 33a on the circumference that engage with the feed holes 9 (see Fig. 2) of the chip taping E (see Fig. 7), and the chip taping E held in engagement with the protrusions 33a is held in the upper frame. The tip taping E can be fed by rotating intermittently along with the horizontal movement of the tip 20.

In addition, the tip taping E is prevented from coming undone except by the intermittent rotation of the feed wheel 33 by supporting the reel R with tension using a stopper (see Fig. 6.14) attached to the shaft 32 via a spring 34. Equipped.

The feed wheel 33 is connected to a support shaft 33 that is pivotally supported on the lower frame 30.
1 is equipped with a one-way clutch 332 (see FIG. 15) so that rotational torque can be transmitted only in the tip taping delivery direction. The support shaft 331 is connected to the lower frame 30 and
It is rotatably supported by bearings 3.7 and 38 connected to the racket 36, and from this support shaft 331, a lever 333 is rotated forward via a one-way clutch 332 (see Fig. 14).
It is attached so as to protrude upward. A roller 334 is pivotally supported on the upper end side of the lever 333, and when a cam disk of the upper frame 20, which will be described later, comes into contact with this roller 334, the support shaft 331 is rotated only in the tip taping feeding direction by a one-way crunch 332. It is also mounted so that it cannot rotate in the opposite direction. The lever 333 is pulled in the non-rotating direction by a spring (not shown), and when the lever 333 is released from contact with the cam disc, it is free so that it returns to its original protruding position without rotating the support shaft 331. has been in a state. Also,
An indexing cam 335 is mounted on the axis of the support shaft 331. This indexing cam 335 has notches 33B on the circumference at intervals corresponding to the protrusions 33a of the feed wheel 33, and the notches 33B and the pole plunger 3 provided on the bracket 36
By engaging 9, the feed wheel 33 can be positioned intermittently.

The cam disk 25 (see FIGS. 6 and 17) that comes into contact with the roller 334 of the lever 333 is provided along the feeding direction of the tip taping E on the lower surface side of the upper frame 20. The cam disk 25 has a cam surface that gradually projects obliquely downward toward the rear in the direction opposite to the feeding direction of the tip taping E. In this cam disk 25, when the upper frame 20 moves forward after the electronic component is extracted from the mounting head 10, it comes into contact with the roller 334 and acts to push down the lever 333. When the lever 333 is pushed down and swung, it rotates the support shaft 331 to a predetermined angle via the one-way clutch 332, thereby rotating the feed wheel 33. This rotation feeds the tip taping E one pitch at a time, and the upper frame 20
In the return stroke, the lever 333 returns to its original state due to the tension of the spring, but the one-way clutch 332 is free and does not apply torque to the support shaft 331, so the feed wheel 33 is not rotated.

Therefore, in this automatic mounting apparatus for electronic components, the mounting head 1
0 moves forward with the upper frame 20 to extract electronic components and mount them on the printed circuit board, the cam disk 25 moves forward with the lever 3.
33 and rotates the feed wheel 33 intermittently, the chip taping E can be sent out one pitch at a time, and at least there is no need to incorporate a unique driving force as the feeding mechanism for the chip taping E. When picking out the next electronic component, the chip taping E is always fed out one pinch at a time, so the empty portion of the electronic component does not remain stagnant when the mounting head 10 returns.

Note that the drive cylinder 22 described above has a constant stroke interval S ranging from the electronic component extraction position xI to the mounting position x2, and when the electronic components are mounted at different positions on a single printed circuit board, the lower frame 30 is xy table 4
The position can be adjusted at 0 (see Fig. 6). That x
The Y table 40 is constructed by stacking the lower frame 30 in two layers: a table that moves in the left-right direction in the drawing, and a table that moves toward the rear 2 in the drawing.

The electronic component automatic mounting apparatus (see FIG. 6) also includes a cover tape winding mechanism 50 for peeling off the cover tape 4.7 of the chip taping E, and a cover tape winding mechanism 50 for peeling off the cover tape 4.7 of the chip taping E. A push-up bottle mechanism 60 that facilitates extraction of the electronic component 1, and a shutter mechanism 70 that positions the electronic component 1 in the recesses 3 and 6 of the chimp taping E are provided. Each of these mechanical parts 50, 60, 70 can also be configured to operate in accordance with the reciprocating movement of the upper frame 20. Winding mechanism 50 for cover tapes 4, 7 (see FIG. 14)
The apparatus has a winding drum 51 for winding the cover tape 4.7 which is inverted and pulled from the vicinity of the feed wheel 33, and the drum 51 is rotatably supported by an arm 52. This arm 52 is pivotally attached to the lower frame 30 at its lower end, and is pulled by a spring 53 that is attached to the lower frame 30 and stretched between the near Φ of the arm and a projection that restricts the positioning of the arm against the spring 53. Stopper (
(not shown) so as to be freely deflectable.

A cam plate 26 (see FIGS. 6 and 17) protruding from the rear end of the upper frame 20 acts on the winding mechanism 50. The cam plate 26 is slidably positioned on the tape winding shaft of the winding drum 51, and as the upper frame 20 moves forward, the cover tapes 4 and 7 are wound onto the winding shaft while rotating the winding drum 51. It is now possible to do so.

When the amount of tape on the winding shaft increases, the winding drum 51 can be pushed down by the cam plate 26 while tensioning the spring 53, so that no problem occurs.

The push-up pin mechanism 60 (see Fig. 14.18.19) has a lever arm 62 supported on the lower frame 30 by a support shaft 61.
The lever arm has a push-up pin 63 supported vertically at one end thereof, and a roller 64 pivotally supported at the other end projecting toward the upper frame 20 side. Lever arm 62
Normally, the tip of the push-up pin 63 is deflected on the support shaft 62 by a torsion coil spring or the like so that it is recessed below the opening 30a formed in the tape feeding surface of the lower frame 30. The push-up pin 63 is a cylindrical tube 6 attached to the end of the arm.
The tube is inserted into the tube 5 by collars 66 and 67 so as not to come off, and is supported by a spring 68 fitted between the collar 66 and the cylindrical tube 65 so as to be able to move up and down. This projection pin mechanism 60 can be configured to operate with a cam disk 27 (see FIG. 6.17.19) formed continuously with a cam surface that acts on the feed wheel 33. The cam disc 27 comes into contact with the roller 64 of the lever arm 62, and moves the push-up pin 63 upwardly about the support shaft 61.
The electronic component 1 can be pushed up via the embossed tape 2 or the cover tape 8. This push-up operation is performed before the vacuum nozzle 11 of the mounting head 10 picks up and extracts the electronic component, and is intended to allow the vacuum nozzle 11 to smoothly pick up the electronic component.

The shutter mechanism 70 connects a shutter 71 bent into a planar shape to a pin 72 on the same tape feeding surface of the lower frame 30.
The torsion coil spring 7 is pivotally supported by the
3 is arranged so as to be suspended between the shutter 71 and the lower frame 30, so that it is always located on the upper surface side of the chip taping E. This shutter 71 is
This is to prevent the electronic component l from jumping out or shifting when the cover tapes 4 and 7 are peeled off. For that Shanter 71, the upper frame 20
An inverted arm 28 (No. 17.2) attached to the front end side of the
0) acts, and when the upper frame 20 returns and the vacuum nozzle 11 is positioned directly above in order to extract the next electronic component l, the feed path of the chimbu chipping E resists the torsion coil spring 73. It is installed so that it can be moved backwards.

In the above-described embodiment, the printed circuit board is conveyed horizontally on the conveyor B, and then the mounting head 10 is vertically moved up and down, and the upper frame 20 is moved horizontally. In connection with this, the mounting head 10. upper frame 20
The moving directions of each are also changed.

Effects of the Invention As described above, according to the automatic mounting apparatus for electronic components according to the present invention, by applying the reciprocating motion of the upper frame, it is possible to perform at least intermittent feeding of chip taping, and the feeding can be improved. Since there is no need to use a separate drive means, it is possible to save driving force and simplify the structure. Also, since the feeding of chip taping and the extraction of electronic components by the mounting head can be linked, it is possible to securely remove electronic components. Implementation can be done.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing the entire related equipment including the automatic mounting apparatus for electronic components according to the present invention, FIG. 2 is a plan view showing the chip taping with the cover tape removed, and FIG.
Fig. 4 is a sectional view showing the same chip taping with a cover tape attached, Fig. 5 is a sectional view showing another chip taping, and Fig. 6 is an overall view of the automatic mounting apparatus for electronic components according to the present invention. 7 is a front view, and FIGS. 8 and 9 are longitudinal cross-sectional views showing the mounting head of the automatic mounting apparatus.
The figure is a cross-sectional view showing the gripping jaw of the head, Figure 11 is a side view showing the grip and grip, Figure 12 is a side view showing the reciprocating mechanism of the upper frame, and Figure 13 is a plan view of the head. , Figure 14 shows the chip taping, cover tape, and push-up pins installed on the lower frame. A side view showing each mechanical part of the shutter, FIG. 15 is a sectional view showing the feed wheel mechanism for chip taping, and FIG. 16 is a partially cutaway side view showing the intermittent operation mechanism incorporated in the feed wheel mechanism. , Fig. 17 is a side view showing the intermittent operation part equipped on the upper frame, Fig. 18 is a plan view of the lower frame side,
FIG. 9 is a side view showing the push-up pin mechanism, and FIG. 20 is a perspective view showing the shutter mechanism. E: Chip taping, l: Electronic component, lo: Mounting head, 20: Upper frame, 30': Lower frame, 33
: Feeding wheel, 331: Support shaft, 332 one-way clutch,
333 Nilever, 25: Cam board. Controversy, closing line σ Fig. 18 71 Fig. 191., 1 Fig. 20

Claims (1)

[Claims] It has a vertically movable mounting head that individually picks electronic components 10 from chip taping holding multiple chip-shaped electronic components and mounts them on a printed circuit board, and moves the mounting head from the electronic component picking position to the mounting position. Equipped with an upper frame that can move back and forth up to 100 degrees, and a lower frame that supports the upper frame so that it can move back and forth is equipped with a feed wheel that feeds and rotates chip taping, and the feed wheel is rotated in only one direction using a one-way clutch. At the same time, a lever is attached to the support shaft so that it can be moved in a direction in which rotational torque is not applied, and the lever is protruded from the upper frame side, and a cam is attached to the upper frame to suppress the lever. An automatic mounting device for electronic components, characterized in that a board is provided so that chip taping can be fed intermittently using a feed wheel as the upper frame moves.