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JPS645102A - Transmission line mode converter - Google Patents

Transmission line mode converter

Info

Publication number
JPS645102A
JPS645102A JP62159739A JP15973987A JPS645102A JP S645102 A JPS645102 A JP S645102A JP 62159739 A JP62159739 A JP 62159739A JP 15973987 A JP15973987 A JP 15973987A JP S645102 A JPS645102 A JP S645102A
Authority
JP
Japan
Prior art keywords
coplanar
gap
microstrip
conversion
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62159739A
Other languages
Japanese (ja)
Inventor
Masahiro Muraguchi
Kuniki Owada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP62159739A priority Critical patent/JPS645102A/en
Publication of JPS645102A publication Critical patent/JPS645102A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)

Abstract

PURPOSE:To attain excellent coplanar microstrip conversion over a wide band from a low frequency till an ultrahigh frequency by utilizing the change in the electric field distribution depending on a grounded type coplanar line. CONSTITUTION:The width of a center conductor strip 8 of the grounded type coplanar line B and a gap (G) between surface ground conductors 6a, 6b arranged at both sides are being expanded while keeping a single characteristic impedance and the size of the gap G is selected at least the thickness of a dielectric base 2 at a connecting point with a microstrip line A. That is, in applying coplanar microstrip conversion, the gap G is widened gradually from the structure shown in figure (a) to form the electric field distribution shown in figure (c). Thus, the mode conversion from the coplanar line transmission mode into the microstrip line transmission mode is performed easily without any characteristic deterioration.
JP62159739A 1987-06-29 1987-06-29 Transmission line mode converter Pending JPS645102A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62159739A JPS645102A (en) 1987-06-29 1987-06-29 Transmission line mode converter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62159739A JPS645102A (en) 1987-06-29 1987-06-29 Transmission line mode converter

Publications (1)

Publication Number Publication Date
JPS645102A true JPS645102A (en) 1989-01-10

Family

ID=15700211

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62159739A Pending JPS645102A (en) 1987-06-29 1987-06-29 Transmission line mode converter

Country Status (1)

Country Link
JP (1) JPS645102A (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5200719A (en) * 1989-12-07 1993-04-06 Telecommunicacoes Brasileiras S/A Impedance-matching coupler
US5349317A (en) * 1992-04-03 1994-09-20 Mitsubishi Denki Kabushiki Kaisha High frequency signal transmission tape
EP0749175A2 (en) * 1995-06-12 1996-12-18 Endgate Corporation Miniature active conversion between microstrip and coplanar wave guide
JPH0923107A (en) * 1995-07-10 1997-01-21 Nippon Telegr & Teleph Corp <Ntt> Shield type coplaner guide transmission line
US5777528A (en) * 1995-05-26 1998-07-07 Motorola, Inc. Mode suppressing coplanar waveguide transition and method
US5821815A (en) * 1996-09-25 1998-10-13 Endgate Corporation Miniature active conversion between slotline and coplanar waveguide
US5978666A (en) * 1994-09-26 1999-11-02 Endgate Corporation Slotline-mounted flip chip structures
US5983089A (en) * 1994-09-26 1999-11-09 Endgate Corporation Slotline-mounted flip chip
US6094114A (en) * 1994-09-26 2000-07-25 Endgate Corporation Slotline-to-slotline mounted flip chip
JP2001148601A (en) * 1999-11-19 2001-05-29 Fujitsu General Ltd High frequency circuit device
US6265937B1 (en) 1994-09-26 2001-07-24 Endgate Corporation Push-pull amplifier with dual coplanar transmission line
JP2004048617A (en) * 2002-07-16 2004-02-12 Sumitomo Metal Electronics Devices Inc Transmission line substrate for high frequency
WO2004082080A1 (en) * 2003-03-13 2004-09-23 Mitsubishi Denki Kabushiki Kaisha Connection structure for coaxial connector and multilayer substrate
US7688164B2 (en) 2006-09-28 2010-03-30 Denso Corporation High frequency circuit board converting a transmission mode of high frequency signals
JP2018502469A (en) * 2014-10-21 2018-01-25 エイ・ティ・アンド・ティ インテレクチュアル プロパティ アイ，エル．ピー． Waveguide transmission device using diversity and method for use therewith

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5200719A (en) * 1989-12-07 1993-04-06 Telecommunicacoes Brasileiras S/A Impedance-matching coupler
US5349317A (en) * 1992-04-03 1994-09-20 Mitsubishi Denki Kabushiki Kaisha High frequency signal transmission tape
US6265937B1 (en) 1994-09-26 2001-07-24 Endgate Corporation Push-pull amplifier with dual coplanar transmission line
US5978666A (en) * 1994-09-26 1999-11-02 Endgate Corporation Slotline-mounted flip chip structures
US6094114A (en) * 1994-09-26 2000-07-25 Endgate Corporation Slotline-to-slotline mounted flip chip
US5983089A (en) * 1994-09-26 1999-11-09 Endgate Corporation Slotline-mounted flip chip
US5777528A (en) * 1995-05-26 1998-07-07 Motorola, Inc. Mode suppressing coplanar waveguide transition and method
USRE35869E (en) * 1995-06-12 1998-08-11 Endgate Corporation Miniature active conversion between microstrip and coplanar wave guide
EP0749175A3 (en) * 1995-06-12 1997-06-11 Endgate Technology Corp Miniature active conversion between microstrip and coplanar wave guide
EP0749175A2 (en) * 1995-06-12 1996-12-18 Endgate Corporation Miniature active conversion between microstrip and coplanar wave guide
JPH0923107A (en) * 1995-07-10 1997-01-21 Nippon Telegr & Teleph Corp <Ntt> Shield type coplaner guide transmission line
US5821815A (en) * 1996-09-25 1998-10-13 Endgate Corporation Miniature active conversion between slotline and coplanar waveguide
JP2001148601A (en) * 1999-11-19 2001-05-29 Fujitsu General Ltd High frequency circuit device
JP2004048617A (en) * 2002-07-16 2004-02-12 Sumitomo Metal Electronics Devices Inc Transmission line substrate for high frequency
WO2004082080A1 (en) * 2003-03-13 2004-09-23 Mitsubishi Denki Kabushiki Kaisha Connection structure for coaxial connector and multilayer substrate
US7688164B2 (en) 2006-09-28 2010-03-30 Denso Corporation High frequency circuit board converting a transmission mode of high frequency signals
DE102007046351B4 (en) * 2006-09-28 2010-09-02 DENSO CORPORATION, Kariya-shi High-frequency board that converts a transmission mode of high-frequency signals
JP2018502469A (en) * 2014-10-21 2018-01-25 エイ・ティ・アンド・ティ インテレクチュアル プロパティ アイ，エル．ピー． Waveguide transmission device using diversity and method for use therewith

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